CN215418156U - Microchannel copper-aluminum composite relieving liquid cooling radiator - Google Patents
Microchannel copper-aluminum composite relieving liquid cooling radiator Download PDFInfo
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- CN215418156U CN215418156U CN202121805929.3U CN202121805929U CN215418156U CN 215418156 U CN215418156 U CN 215418156U CN 202121805929 U CN202121805929 U CN 202121805929U CN 215418156 U CN215418156 U CN 215418156U
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- 239000007788 liquid Substances 0.000 title claims abstract description 123
- 238000001816 cooling Methods 0.000 title claims abstract description 74
- 239000002131 composite material Substances 0.000 title claims abstract description 22
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 230000017525 heat dissipation Effects 0.000 claims abstract description 66
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 5
- 239000004411 aluminium Substances 0.000 claims abstract description 4
- 150000001875 compounds Chemical class 0.000 claims abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 238000009792 diffusion process Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 238000005192 partition Methods 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 4
- 229910000755 6061-T6 aluminium alloy Inorganic materials 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 238000005242 forging Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 239000000110 cooling liquid Substances 0.000 abstract description 25
- 239000000758 substrate Substances 0.000 abstract description 20
- 230000009286 beneficial effect Effects 0.000 abstract description 5
- 230000005855 radiation Effects 0.000 abstract description 4
- 238000003754 machining Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002826 coolant Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000010273 cold forging Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
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Abstract
The application provides a compound forming relieved tooth liquid cooling radiator of microchannel copper aluminium, include: the heat dissipation body is provided with a liquid inlet and a liquid outlet, and the heat dissipation body is provided with a liquid cooling tank communicated with the liquid inlet and the liquid outlet; the heat dissipation cover plate comprises a heat dissipation substrate covering the opening of the liquid cooling tank and a heat dissipation fin unit arranged on one side, close to the liquid cooling tank, of the heat dissipation substrate. When the microchannel copper-aluminum composite relieving liquid cooling radiator is used, heat generated during the operation of the IGBT is conducted to the radiating fin units through the radiating substrate, and the radiating fin units are in contact with cooling liquid in the liquid cooling tank and exchange heat with the cooling liquid, so that the purpose of rapid liquid cooling radiation can be achieved, and the constant-temperature long-time normal operation of the power device IGBT can be guaranteed; the arrangement of the radiating fin units is beneficial to increasing the radiating area and improving the radiating efficiency of the radiator in unit area; the radiator can also be used for radiating other electronic components.
Description
Technical Field
The application relates to the technical field of power electronic cooling and heat dissipation, in particular to a micro-channel copper-aluminum composite relieving liquid cooling radiator.
Background
With the continuous development of electronic technology, the power of the equipment is higher and higher, the volume requirement is smaller and smaller in consideration of cost optimization, so that the heat flow density is higher and higher, and the liquid cooling radiator has the characteristics of low flow resistance, high precision and the like while meeting the heat dissipation requirement, so that the difficulty of solving the heat dissipation of the electronic equipment is continuously increased. Therefore, the heat dissipation problem becomes a key problem in the power electronic equipment industry. Liquid cooling is an effective way for solving the problem of heat dissipation at present, the design of a liquid cooling radiator has great influence on the structure, stability, service performance and the like of equipment, and the design of the water cooling radiator with excellent heat dissipation effect is very important for power electronic equipment.
However, when the existing liquid cooling radiator is adopted to radiate the high-power device IGBT, the problem of low radiating efficiency still exists, and the normal operation of the high-power device IGBT can be influenced.
Disclosure of Invention
The utility model aims at above problem, provide a microchannel copper aluminium composite forming relieved tooth liquid cooling radiator.
The application provides a compound forming relieved tooth liquid cooling radiator of microchannel copper aluminium, include:
the heat dissipation body is provided with a liquid inlet and a liquid outlet, and the heat dissipation body is provided with a liquid cooling tank communicated with the liquid inlet and the liquid outlet;
the heat dissipation cover plate comprises a heat dissipation substrate covering the opening of the liquid cooling tank and a heat dissipation fin unit arranged on one side, close to the liquid cooling tank, of the heat dissipation substrate.
According to the technical scheme provided by some embodiments of the application, water collecting grooves are respectively arranged at positions, relatively close to the liquid inlet and the liquid outlet, of the groove bottom of the liquid cooling groove; the water collecting groove comprises a communicating part communicated with the liquid inlet/the liquid outlet and a horn-shaped diffusion part communicated with the communicating part; the small-caliber end of the diffusion part is communicated with the communication part.
According to the technical scheme provided by some embodiments of the present application, a plurality of flow dividing ribs arranged at intervals are arranged in the diffusion portion.
According to the technical scheme provided by some embodiments of the application, the bottom of the liquid cooling tank is provided with a turbulent tank.
According to an aspect provided by some embodiments of the present application, the heat dissipation fin unit includes two heat dissipation fin sub-units; a partition gap is arranged between the two radiating fin subunits; the partition gap corresponds to the position of the turbulent flow groove.
According to the technical scheme provided by some embodiments of the present application, the heat dissipation fin subunit includes a plurality of heat dissipation fins arranged in parallel at equal intervals; the tooth thickness of each radiating fin is 0.4mm, and the center distance between every two adjacent radiating fins is 1 mm.
According to the technical scheme provided by some embodiments of the application, the radiating fins are manufactured by adopting a copper relieved tooth process.
According to the technical scheme provided by some embodiments of the application, the heat dissipation main body is formed by adopting a forging process and is made of 6061-T6 aluminum alloy.
According to the technical scheme provided by some embodiments of the application, the heat dissipation main body and the heat dissipation cover plate are welded through a friction stir process.
According to the technical scheme provided by some embodiments of the application, a plurality of mounting holes are formed in the heat dissipation main body.
Compared with the prior art, the beneficial effect of this application: the microchannel copper-aluminum composite relieving liquid cooling radiator can be used for radiating a power device IGBT, when the radiator is used, the IGBT is fixedly installed on one side of a radiating substrate, which is relatively far away from a radiating fin unit, cooling liquid is continuously conveyed into a liquid cooling tank through an external force water pump, the cooling liquid flows into the liquid cooling tank through a liquid inlet and flows out of the liquid cooling tank through a liquid outlet, wherein heat generated during the operation of the IGBT is conducted to the radiating fin unit through the radiating substrate, the radiating fin unit is contacted with the cooling liquid in the liquid cooling tank and exchanges heat with the cooling liquid, and the heat is exchanged to the cooling liquid, so that the purpose of liquid cooling radiation is achieved, and the constant-temperature long-time normal operation of the power device IGBT is favorably ensured; the radiating fin units are arranged on one side, close to the liquid cooling groove, of the radiating substrate and are in contact with the cooling liquid in the liquid cooling groove, so that the radiating area is increased, and the radiating efficiency of the radiator in unit area is improved; the radiator can also be used for radiating other electronic components.
Drawings
Fig. 1 is a schematic structural view of a micro-channel copper-aluminum composite relieved tooth liquid cooling radiator provided in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a heat dissipation main body of the micro-channel copper-aluminum composite relieving liquid cooling radiator provided in the embodiment of the present application;
fig. 3 is a perspective view of a heat dissipation main body of the micro-channel copper-aluminum composite relieved tooth liquid cooling radiator provided in the embodiment of the present application;
fig. 4 is a schematic structural diagram of a heat dissipation cover plate of the micro-channel copper-aluminum composite relieved liquid cooling radiator provided in the embodiment of the present application;
fig. 5 is a perspective view of a heat dissipation cover plate of the micro-channel copper-aluminum composite relieved liquid cooling radiator provided in the embodiment of the present application.
The text labels in the figures are represented as:
1. a heat dissipating body; 11. a liquid inlet; 12. a liquid outlet; 13. a liquid cooling tank; 14. a water collecting tank; 15. shunting ribs; 16. a turbulence groove; 17. mounting holes;
2. a heat dissipation cover plate; 21. a heat-dissipating substrate; 22. a heat dissipating fin unit; 23. a heat dissipating fin; 24. and (5) separating the gap.
Detailed Description
The following detailed description of the present application is given for the purpose of enabling those skilled in the art to better understand the technical solutions of the present application, and the description in this section is only exemplary and explanatory, and should not be taken as limiting the scope of the present application in any way.
Referring to fig. 1, the present embodiment provides a micro-channel copper-aluminum composite relieved tooth liquid cooling radiator, including: a heat dissipating body 1 and a heat dissipating cover 2.
Referring to fig. 2 and fig. 3, the heat dissipating main body 1 is a flat rectangular body, and a liquid cooling tank 13 is disposed on a top surface thereof; a pair of opposite side walls of the liquid cooling groove 13 are respectively provided with a through liquid inlet 11 and a through liquid outlet 12; the liquid inlet 1 and the liquid outlet 12 both adopt a pipe thread structure, so that the liquid inlet and the liquid outlet are conveniently and effectively connected with a water nozzle; the liquid inlet 1 and the liquid outlet 12 are interchangeable, and the performance of the radiator is not influenced; the liquid cooling groove 13 is communicated with the liquid inlet 11 and the liquid outlet 12; the top surface of the heat dissipation main body 1 is recessed along the edge of the liquid cooling groove 13 to form a circle of placing table.
With further reference to fig. 4 and 5, the heat-dissipating cover 2 includes a heat-dissipating substrate 21 and heat-dissipating fin units 22; the outer contour size of the heat dissipation substrate 21 is matched with the size of the placing table, and the heat dissipation substrate 21 is covered on the placing table at the opening of the liquid cooling tank 13 and is welded and fixed with the heat dissipation main body 1 through a friction stir welding process; the heat dissipation fin unit 22 is disposed on a side of the heat dissipation substrate 21 relatively close to the liquid cooling tank 13, that is, the heat dissipation fin unit 22 is located in the liquid cooling tank 13.
When the radiator is used, the IGBT is fixedly arranged on one side of the radiating substrate 21, which is relatively far away from the radiating fin unit 22, the cooling liquid is continuously conveyed into the liquid cooling tank 13 through the external force water pump, the cooling liquid flows into the liquid cooling tank 13 through the liquid inlet 11 and flows out of the liquid cooling tank 13 through the liquid outlet 12, wherein the heat generated during the operation of the IGBT is transferred to the radiating fin unit 22 through the radiating substrate 21, the radiating fin unit 22 is in contact with the cooling liquid in the liquid cooling tank 13 and exchanges heat with the cooling liquid to exchange the heat with the cooling liquid, so that the purpose of liquid cooling radiation is achieved, and the constant-temperature long-time normal operation of the IGBT of the power device is favorably ensured; the radiator can also be used for radiating other electronic components.
Furthermore, a water collecting groove 14 is respectively arranged at the position of the groove bottom of the liquid cooling groove 13, which is relatively close to the liquid inlet 11 and the liquid outlet 12; the water collection tank 14 includes a communication part and a diffusion part which are communicated with each other; the communicating parts are communicated with the corresponding liquid inlet 11/liquid outlet 12, and when the communicating parts are communicated with the liquid inlet 11, the communicating parts are used for introducing cooling liquid into the corresponding diffusion parts, and when the communicating parts are communicated with the liquid outlet 12, the communicating parts are used for introducing the cooling liquid into the corresponding communicating parts from the diffusion parts; the diffusion part is horn-shaped, and a small-caliber end of the diffusion part is communicated with the communication part; the water collecting groove 14 is arranged to be communicated with the liquid inlet 11 and the liquid outlet 12 at two ends, and particularly the diffusion part is arranged to be beneficial to reducing local resistance, so that system resistance is reduced, load of a water pump is reduced, and maximum water flow is achieved.
Furthermore, a plurality of flow dividing ribs 15 arranged at intervals are arranged in the diffusion part of each water collecting tank 14; the flow dividing ribs 15 are in a thin plate shape and are arranged perpendicular to the bottom of the water collecting groove 14, and when the cooling water collecting groove is used, cooling liquid flows through gaps between the adjacent flow dividing ribs 15; the arrangement of the shunting ribs 15 is favorable for shunting the cooling liquid flowing into the liquid inlet 11, so that the uniform distribution of the cooling liquid in the liquid cooling tank 13 is ensured, and the temperature uniformity of electronic components is favorably ensured.
Further, a turbulent groove 16 is formed at the bottom of the liquid cooling groove 13; the turbulent groove 16 is in a strip shape, and the length direction of the turbulent groove is perpendicular to the connecting line direction of the liquid inlet 11 and the liquid outlet 12; when liquid cooling heat dissipation is performed, the temperature of the upper layer cooling liquid in the liquid cooling tank 13, which is in contact with the heat dissipation fin unit 22, is relatively high, and the temperature of the lower layer is relatively low, that is, the temperature of the cooling liquid in the liquid cooling tank 13 is uneven; by providing the turbulent groove 16, when the coolant flows through the turbulent groove 16, disturbance occurs, which is beneficial to balancing the high and low temperatures of the coolant, and avoiding the laminar flow, thereby optimizing the heat conduction.
Further, the heat dissipation fin unit 22 includes two heat dissipation fin sub-units; a partition gap 24 is arranged between the two radiating fin subunits; the partition gap 24 corresponds to the position of the turbulence groove 16, and the partition gap 24 is used in cooperation with the turbulence groove 16, so that the disturbance of the cooling liquid can be further promoted, and the effect of turbulence is achieved.
The radiating fin subunit comprises a plurality of radiating fins 23 which are arranged in parallel at equal intervals; the length direction of the radiating fin 23 is parallel to the connecting line direction of the liquid inlet 11 and the liquid outlet 12; the tooth thickness of each radiating fin 23 is 0.4mm, and the center distance between every two adjacent radiating fins 23 is 1mm, so that the radiating fins belong to a micro-channel; when the heat dissipation device is used, the heat of the power device is firstly transferred to the heat dissipation substrate 21, and then is dispersedly and uniformly transferred to each heat dissipation fin 23 through the heat dissipation substrate 21, so that the heat dissipation area of the heat dissipation fins 23 can be increased, the heat dissipation efficiency of the heat dissipation device in unit area is improved, and the purpose of optimal heat dissipation is favorably achieved.
Furthermore, the radiating fins 23 are manufactured by adopting a copper forming process, namely a copper plate is formed by processing the radiating fins 23 through numerical control forming equipment, complex pure machining is omitted, the material brand is T2, and the radiating fins have corrosion resistance and high thermal conductivity (398W/m.k).
Furthermore, the heat dissipation main body 1 is formed by adopting a forging process and is integrally formed by adopting a cold forging forming die, the material of the heat dissipation main body is 6061-T6 aluminum alloy, the heat conduction coefficient of aluminum is 167W/m.k, the process reduces the raw material cost, the machining process is simple, the machining cost is reduced, and the welding quality is ensured by matching with the heat dissipation cover plate 2 for size machining. The invention adopts copper material with high heat conductivity coefficient, and the heat dissipation efficiency of the radiator is improved to a greater extent by processing the copper material into the heat dissipation cover plate 2 by utilizing the relieved tooth process and fully contacting with the power device.
Further, the heat dissipation main body 1 is provided with a plurality of mounting holes 17, in this embodiment, eight mounting holes 17 are provided, the mounting holes 17 are M5 threaded holes, four of the eight mounting holes 17 are set as one group and are respectively provided at two sides of the turbulent flow groove 16 in the length direction, and two groups of mounting holes can be used for fixedly mounting two IGBTs.
When the microchannel copper-aluminum composite relieving liquid cooling radiator provided by the embodiment of the application is used, two power device IGBTs are fixed on the radiating main body 1 through the mounting holes 17, heat generated by the power device IGBTs in working is conducted to each radiating fin 23 of the radiating fin unit 22 through the radiating substrate 21, cooling liquid is continuously conveyed into the liquid cooling tank 13 through the external force water pump, the radiating fins 23 exchange heat with the cooling liquid, and the heat is exchanged to the cooling liquid, so that the purpose of liquid cooling radiation is achieved, and the constant-temperature long-time normal operation of the power device IGBTs is favorably ensured; the radiator can also be used for radiating other electronic components; by arranging the radiating fin units 22 on the side of the radiating substrate 21 relatively close to the liquid cooling tank 13, the radiating fin units 22 are in contact with the cooling liquid in the liquid cooling tank 13, which is beneficial to increasing the radiating area and improving the radiating efficiency of the radiator in unit area, and compared with the simple radiating substrate radiating, the radiating efficiency can be improved by 20%.
The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. The foregoing is only a preferred embodiment of the present application, and it should be noted that there are no specific structures which are objectively limitless due to the limited character expressions, and it will be apparent to those skilled in the art that a plurality of modifications, decorations or changes can be made without departing from the principle of the present invention, and the technical features mentioned above can be combined in a suitable manner; such modifications, variations, combinations, or adaptations of the invention in other instances, which may or may not be practiced, are intended to be within the scope of the present application.
Claims (10)
1. The utility model provides a compound forming relieved tooth liquid cooling radiator of microchannel copper aluminium which characterized in that includes:
the heat dissipation device comprises a heat dissipation main body (1) with a liquid inlet (11) and a liquid outlet (12), wherein a liquid cooling tank (13) communicated with the liquid inlet (11) and the liquid outlet (12) is arranged on the heat dissipation main body (1);
the heat dissipation cover plate (2) comprises a heat dissipation base plate (21) and a heat dissipation fin unit (22), wherein the heat dissipation base plate (21) is arranged at an opening of the liquid cooling groove (13) in a covering mode, and the heat dissipation fin unit (22) is arranged on one side, close to the liquid cooling groove (13), of the heat dissipation base plate (21) relatively.
2. The micro-channel copper-aluminum composite relieving liquid cooling radiator as claimed in claim 1, wherein the bottom of the liquid cooling tank (13) is provided with water collecting tanks (14) at positions relatively close to the liquid inlet (11) and the liquid outlet (12); the water collecting groove (14) comprises a communicating part communicated with the liquid inlet (11)/the liquid outlet (12) and a horn-shaped diffusion part communicated with the communicating part; the small-caliber end of the diffusion part is communicated with the communication part.
3. The micro-channel copper-aluminum composite relieving liquid cooling radiator according to claim 2, wherein a plurality of shunting ribs (15) are arranged in the diffusion part at intervals.
4. The micro-channel copper-aluminum composite relieving liquid cooling radiator as claimed in claim 1, wherein the bottom of the liquid cooling tank (13) is provided with a turbulence tank (16).
5. The microchannel copper aluminum composite relieved liquid cooled heat sink according to claim 4, wherein the heat dissipating fin unit (22) comprises two heat dissipating fin sub-units; a partition gap (24) is arranged between the two radiating fin subunits; the shut-off gap (24) corresponds to the position of the turbulence groove (16).
6. The microchannel copper aluminum composite relieved liquid cooled heat sink as recited in claim 5, wherein said heat dissipating fin sub-unit comprises a plurality of equally spaced parallel arranged heat dissipating fins (23); the tooth thickness of the radiating fins (23) is 0.4mm, and the center distance between every two adjacent radiating fins (23) is 1 mm.
7. The micro-channel copper-aluminum composite relieved liquid cooling radiator as claimed in claim 6, wherein the heat dissipating fins (23) are manufactured by a copper relieved process.
8. The micro-channel copper-aluminum composite relieving liquid cooling radiator according to claim 1, wherein the heat radiating main body (1) is formed by forging process and is made of 6061-T6 aluminum alloy.
9. The micro-channel copper-aluminum composite relieving liquid cooling radiator according to claim 1, wherein the heat radiating main body (1) and the heat radiating cover plate (2) are welded by a friction stir process.
10. The micro-channel copper-aluminum composite relieving liquid cooling radiator according to claim 1, wherein the heat radiating main body (1) is provided with a plurality of mounting holes (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121805929.3U CN215418156U (en) | 2021-08-04 | 2021-08-04 | Microchannel copper-aluminum composite relieving liquid cooling radiator |
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| CN202121805929.3U CN215418156U (en) | 2021-08-04 | 2021-08-04 | Microchannel copper-aluminum composite relieving liquid cooling radiator |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114637382A (en) * | 2022-04-06 | 2022-06-17 | 东莞市东一思创电子有限公司 | Aluminum alloy liquid cooling radiator of ultra-high-power GPU server |
| CN115841996A (en) * | 2022-09-30 | 2023-03-24 | 浙江大学杭州国际科创中心 | Thermal buffer power module based on metal framework phase-change material and manufacturing method thereof |
| CN116884930A (en) * | 2023-08-02 | 2023-10-13 | 河北冠泰电子技术有限公司 | Heat dissipation structure and manufacturing method |
-
2021
- 2021-08-04 CN CN202121805929.3U patent/CN215418156U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114637382A (en) * | 2022-04-06 | 2022-06-17 | 东莞市东一思创电子有限公司 | Aluminum alloy liquid cooling radiator of ultra-high-power GPU server |
| CN115841996A (en) * | 2022-09-30 | 2023-03-24 | 浙江大学杭州国际科创中心 | Thermal buffer power module based on metal framework phase-change material and manufacturing method thereof |
| CN115841996B (en) * | 2022-09-30 | 2023-09-15 | 浙江大学杭州国际科创中心 | Thermal buffer power module based on metal framework phase change material and manufacturing method thereof |
| CN116884930A (en) * | 2023-08-02 | 2023-10-13 | 河北冠泰电子技术有限公司 | Heat dissipation structure and manufacturing method |
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