CN206657307U - Board-like water cooling graphic card radiator - Google Patents
Board-like water cooling graphic card radiator Download PDFInfo
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- CN206657307U CN206657307U CN201621401392.3U CN201621401392U CN206657307U CN 206657307 U CN206657307 U CN 206657307U CN 201621401392 U CN201621401392 U CN 201621401392U CN 206657307 U CN206657307 U CN 206657307U
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Abstract
本实用新型公开了一种板式水冷显卡散热器,包括水冷板、循环水泵、冷水胶管、热水胶管以及换热器,所述水冷板通过固定安装螺柱贴合安装在显卡上,所述水冷板对应显卡主芯片设置有主芯片散热腔,所述主芯片散热腔通过所述水冷板内的循环水通道与设置在所述水冷板一侧的进水口接头和出水口接头分别连通,所述进水口接头和所述出水口接头之间通过一循环水泵分别连接冷水胶管和热水胶管,所述冷水胶管和所述热水胶管另一端分别与所述换热器连接,所述换热器以及外置散热风扇安装在机箱上。该板式水冷显卡散热器的重量轻,与显卡结构紧密结合从而占据空间小,同时能够高效地散热。
The utility model discloses a plate-type water-cooled graphics card radiator, which comprises a water-cooled plate, a circulating water pump, a cold water rubber hose, a hot water rubber hose and a heat exchanger. The main chip of the graphics card corresponding to the board is provided with a cooling chamber for the main chip, and the cooling chamber for the main chip communicates with the water inlet joint and the water outlet joint provided on one side of the water cooling plate through the circulating water channel in the water cooling plate, respectively. The water inlet joint and the water outlet joint are respectively connected with a cold water rubber hose and a hot water rubber hose through a circulating water pump, and the other ends of the cold water rubber hose and the hot water rubber hose are respectively connected with the heat exchanger, and the heat exchanger And an external cooling fan is installed on the chassis. The plate-type water-cooled graphics card radiator is light in weight, closely combined with the structure of the graphics card to occupy a small space, and can dissipate heat efficiently at the same time.
Description
技术领域technical field
本实用新型涉及显卡散热设备技术领域,特别涉及一种板式水冷显卡散热器。The utility model relates to the technical field of graphics card cooling equipment, in particular to a plate-type water-cooled graphics card radiator.
背景技术Background technique
随着芯片技术的发展,芯片集成度越来越高,纳米级也越来越提高,功率越来越大,大功率的芯片层出不穷,相应地芯片的热功率越来越高,人们在享受芯片进步带来生活便利的同时,也面临必须解决大功率芯片散热的困扰,所以如何解决大功率芯片散热的问题也是芯片界十分关注的。With the development of chip technology, the integration of chips is getting higher and higher, the nanoscale is getting higher and higher, the power is getting bigger and bigger, and high-power chips are emerging one after another. Correspondingly, the thermal power of chips is getting higher and higher. While progress brings convenience to life, it also faces the problem of high-power chip heat dissipation. Therefore, how to solve the problem of high-power chip heat dissipation is also of great concern to the chip industry.
作为台式机中的显卡散热问题尤为突出,台式计算机需要面临大数据仿真、高效计算、多任务工作以及作为超频率大型3D游戏平台,显卡芯片处理速度越来越快,能否快速高效的解决显卡散热是急需解决的问题,而现有的显卡散热器由铝散热片和DC风扇的组合无法解决大功率的显卡散热问题,或由于散热器重量过大而造成压迫显卡变形,导致接触不良或长时间工作后显卡开裂;或DC风扇数量过多,造成噪音过大,形成显卡周边高温区,长时间运行后,高转速的风扇积尘导致风扇寿命减少,无法满足显卡性能的需求;或散热器的传导路径过长,这些都是影响人们对大功率显卡性能的感受。因而人们需要一种重量轻,传导快,能高效散热的显卡散热器。As a desktop computer, the heat dissipation problem of the graphics card is particularly prominent. The desktop computer needs to face big data simulation, efficient computing, multi-tasking work, and as an overclocking large-scale 3D game platform. The processing speed of the graphics card chip is getting faster and faster. Can the graphics card be solved quickly and efficiently? Heat dissipation is an urgent problem to be solved, and the existing graphics card radiators are composed of aluminum heat sinks and DC fans, which cannot solve the cooling problem of high-power graphics cards, or cause deformation of the graphics card due to excessive weight of the radiator, resulting in poor contact or long The graphics card cracks after working for a long time; or the number of DC fans is too large, resulting in excessive noise, forming a high-temperature area around the graphics card. After a long time of operation, the high-speed fans accumulate dust and reduce the life of the fan, which cannot meet the performance requirements of the graphics card; or the radiator The conduction path is too long, which affects people's feelings about the performance of high-power graphics cards. Thereby people need a kind of light in weight, conduction is fast, the heat sink of the graphics card that can dissipate heat efficiently.
实用新型内容Utility model content
本实用新型要解决的技术问题是提供一种板式水冷显卡散热器,重量轻,与显卡结构紧密结合从而占据空间小,同时能够高效地散热。The technical problem to be solved by the utility model is to provide a plate-type water-cooled graphics card radiator, which is light in weight, closely combined with the structure of the graphics card to occupy a small space, and can efficiently dissipate heat at the same time.
为了解决上述技术问题,具体地,本实用新型提供了如下技术方案:In order to solve the above technical problems, specifically, the utility model provides the following technical solutions:
一种板式水冷显卡散热器,包括水冷板、循环水泵、冷水胶管、热水胶管以及换热器,所述水冷板通过固定安装螺柱贴合安装在显卡上,所述水冷板对应显卡主芯片设置有主芯片散热腔,所述主芯片散热腔通过所述水冷板内的循环水通道与设置在所述水冷板一侧的进水口接头和出水口接头分别连通,所述进水口接头和所述出水口接头之间通过一循环水泵分别连接冷水胶管和热水胶管,所述冷水胶管和所述热水胶管另一端分别与所述换热器连接,所述换热器以及外置散热风扇安装在机箱上。使用时,水冷媒介经循环水泵的驱动将经换热器降温之后的冷水从水冷板进水口流入,流经水冷板的循环水通道,其中循环水通道中会流径显卡主芯对应的主芯片散热腔,吸收主芯片的热量,从而降低显卡主控芯片的温度,流回换热器形成闭路水冷循环。A plate-type water-cooled graphics card radiator, including a water-cooled plate, a circulating water pump, a cold water rubber hose, a hot water rubber hose, and a heat exchanger. The water-cooled plate is mounted on the graphics card through fixed mounting studs, and the water-cooled plate corresponds to the main chip of the graphics card. A main chip heat dissipation chamber is provided, and the main chip heat dissipation chamber communicates with the water inlet joint and the water outlet joint provided on one side of the water cooling plate through the circulating water channel in the water cooling plate. The water outlet joints are respectively connected to the cold water rubber hose and the hot water rubber hose through a circulating water pump, and the other ends of the cold water rubber hose and the hot water rubber hose are respectively connected to the heat exchanger, and the heat exchanger and the external cooling fan installed on the chassis. When in use, the water-cooling medium is driven by the circulating water pump, and the cold water cooled by the heat exchanger flows in from the water inlet of the water-cooling plate, and flows through the circulating water channel of the water-cooling plate, in which the circulating water channel flows through the main chip corresponding to the main core of the graphics card The heat dissipation cavity absorbs the heat of the main chip, thereby reducing the temperature of the main control chip of the graphics card, and flows back to the heat exchanger to form a closed-circuit water cooling cycle.
进一步的,所述水冷板包括水冷板上盖和水冷板下盖,所述水冷板上盖和所述水冷板下盖通过钎焊贴合固定在一起;所述水冷板上盖和所述水冷板下盖分别设置有冲压凹槽和接触凸台,所述水冷板上盖和所述水冷板下盖的冲压凹槽对应贴合,形成循环水通道;所述接触凸台对应显卡主芯片位置形成主芯片散热腔,所述主芯片散热腔的外壁有显卡主芯片贴合。Further, the water-cooled plate includes a water-cooled plate cover and a water-cooled plate lower cover, and the water-cooled plate cover and the water-cooled plate lower cover are fixed together by brazing; the water-cooled plate cover and the water-cooled plate The lower cover of the board is respectively provided with stamping grooves and contact bosses, and the stamping grooves of the water-cooling board cover and the lower cover of the water-cooling board are correspondingly fitted to form a circulating water channel; the contact bosses correspond to the position of the main chip of the graphics card A heat dissipation chamber for the main chip is formed, and the outer wall of the heat dissipation chamber for the main chip is bonded to the main chip of the graphics card.
进一步的,所述水冷板对应显卡的多个显存芯片设置有多个副芯片散热腔,多个所述副芯片散热腔的外壁与显存芯片贴合,所述循环水通道连通多个所述副芯片散热腔。Further, the water-cooled plate is provided with a plurality of sub-chip heat dissipation cavities corresponding to the plurality of video memory chips of the graphics card, the outer walls of the plurality of sub-chip heat dissipation cavities are attached to the video memory chips, and the circulating water channel communicates with a plurality of the sub-chips. Chip cooling cavity.
进一步的,所述主芯片散热腔内设置有微通道铲片以及分流片,所述微通道铲片的接触面与显卡主芯片贴合,所述微通道铲片的鳍片阵列设置在所述主芯片散热腔内,所述分流片设置在所述鳍片阵列与所述主芯片散热腔的内壁之间。微通道铲片与分流片有效保证让水冷媒介充分流经微通道铲片的鳍片,最大效的带走热量。Further, a microchannel spatula and a shunt are arranged in the heat dissipation chamber of the main chip, the contact surface of the microchannel spade is bonded to the main chip of the graphics card, and the fin array of the microchannel spade is arranged on the In the cooling cavity of the main chip, the splitter is arranged between the fin array and the inner wall of the cooling cavity of the main chip. The micro-channel shovel and the shunt effectively ensure that the water-cooling medium can fully flow through the fins of the micro-channel shovel to remove heat most efficiently.
进一步的,每一个所述副芯片散热腔分别设置有折叠翅片;折叠翅片起增加水冷媒介流体的雷诺数,起湍流作用。Further, each sub-chip cooling cavity is respectively provided with folded fins; the folded fins increase the Reynolds number of the water-cooling medium fluid and act as turbulent flow.
进一步的,所述水冷板的固定支撑螺柱与显卡主芯片的安装固定螺柱共同铆接成一体。Further, the fixed support studs of the water cooling plate and the installation and fixation studs of the main chip of the graphics card are jointly riveted into one body.
进一步的,所述水冷板的进水口接头和出水口接头设置在显卡与机箱的安装固定端一侧。Further, the water inlet joint and the water outlet joint of the water cooling plate are arranged on the side of the fixed end of the graphics card and the chassis.
进一步的,所述循环水泵是双通道90度冷热水分离水泵,所述循环水泵安装在显卡与机箱的安装固定端一侧,可减轻显卡金手指区域的载重;90度通道可降低显卡散热器安装后高度,适用于更多的机箱选择;双通道90度冷热水分离水泵,转子经冷水媒介流过,保证转子,定子处理低温端,而高温通道远离转子,定子区域。Further, the circulating water pump is a dual-channel 90-degree cold and hot water separation pump. The circulating water pump is installed on the side of the fixed end of the graphics card and the chassis, which can reduce the load on the gold finger area of the graphics card; the 90-degree channel can reduce the heat dissipation of the graphics card. The height after installation is suitable for more chassis options; dual-channel 90-degree cold and hot water separation pump, the rotor flows through the cold water medium, ensuring that the rotor and stator handle the low-temperature end, while the high-temperature channel is far away from the rotor and stator areas.
采用上述技术方案,通过水冷板、换热器构成循环散热管道,其水冷板能兼顾显卡主要芯片散热,能快速有效的带走经显卡主控芯片传导的热量;其水冷板与显卡安装后,显卡整体重量轻,其中换热器安装于机箱上,不会造成显卡负重;水冷媒介经显卡主控芯片传导出热量后,经循环水泵驱动,流经换热器经风扇将热量与空气交换,保证了显卡的工作温度,提高了显卡散热性能,延长了显卡的使用寿命。Using the above technical solution, the water cooling plate and the heat exchanger form a circulating heat dissipation pipeline, and the water cooling plate can take into account the heat dissipation of the main chip of the graphics card, and can quickly and effectively take away the heat conducted by the main control chip of the graphics card; after the water cooling plate and the graphics card are installed, The overall weight of the graphics card is light, and the heat exchanger is installed on the chassis, which will not cause a load on the graphics card; after the water-cooling medium conducts heat through the main control chip of the graphics card, it is driven by a circulating water pump and flows through the heat exchanger and the fan to exchange heat with air. The working temperature of the graphics card is guaranteed, the cooling performance of the graphics card is improved, and the service life of the graphics card is extended.
附图说明Description of drawings
图1为本实用新型的板式水冷显卡散热器安装结构图;Fig. 1 is the installation structural diagram of plate-type water-cooled graphics card radiator of the present invention;
图2为本实用新型的水冷板安装示意图;Fig. 2 is the schematic diagram of installation of the water-cooled plate of the present utility model;
图3为本实用新型的水冷板三维结构图;Fig. 3 is the three-dimensional structural diagram of the water-cooled plate of the present invention;
图4为本实用新型的水冷板另一视角三维结构图;Fig. 4 is a three-dimensional structural diagram of the water-cooled plate of the present invention from another perspective;
图5为本实用新型的水冷板三维分解结构图;Fig. 5 is a three-dimensional exploded structure diagram of the water-cooled plate of the present invention;
图6为本实用新型的水冷板剖视结构图;Fig. 6 is a cross-sectional structure diagram of the water-cooled plate of the present invention;
图7为本实用新型的水泵进出水流向示意图;Fig. 7 is a schematic diagram of water flow in and out of the water pump of the utility model;
图8为本实用新型的微通道铲片三维结构图;Fig. 8 is a three-dimensional structural diagram of the microchannel blade of the present invention;
图9为本实用新型的微通道铲片另一视角三维结构图;Fig. 9 is a three-dimensional structure diagram of another viewing angle of the microchannel shovel of the present invention;
图10为本实用新型的折叠翅片三维结构图。Fig. 10 is a three-dimensional structure diagram of the folded fin of the present invention.
图中,20-显卡,11-水冷板,12-循环水泵,13-冷水胶管,14-热水胶管,15-换热器,111-水冷板上盖,112-水冷板下盖,113-出水口接头,114-进水口接头,115-安装固定螺柱,116-微通道铲片,117-主芯片散热腔,118-副芯片散热腔,119-折叠翅片,1110-分流片。In the figure, 20-graphics card, 11-water cooling plate, 12-circulating water pump, 13-cold water rubber hose, 14-hot water rubber hose, 15-heat exchanger, 111-water cooling plate cover, 112-water cooling plate lower cover, 113- Water outlet connector, 114-water inlet connector, 115-installation fixing stud, 116-micro-channel shovel, 117-main chip heat dissipation chamber, 118-sub-chip heat dissipation chamber, 119-folded fins, 1110-splitter.
具体实施方式detailed description
下面结合附图对本实用新型的具体实施方式作进一步说明。在此需要说明的是,对于这些实施方式的说明用于帮助理解本实用新型,但并不构成对本实用新型的限定。此外,下面所描述的本实用新型各个实施方式中所涉及的技术特征只要彼此之间未构成冲突就可以相互组合。Below in conjunction with accompanying drawing, the specific embodiment of the present utility model will be further described. It should be noted here that the descriptions of these implementations are used to help understand the utility model, but are not intended to limit the utility model. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute conflicts with each other.
如图1-6所示,一种板式水冷显卡散热器,包括水冷板11、循环水泵12、冷水胶管13、热水胶管14以及换热器15,所述水冷板11通过固定安装螺柱115贴合安装在显卡20上,所述水冷板11对应显卡主芯片设置有主芯片散热腔117,所述主芯片散热腔117通过所述水冷板11内的循环水通道与设置在所述水冷板11一侧的进水口接头114和出水口接头113分别连通,所述进水口接头114和所述出水口接头113之间通过一循环水泵12分别连接冷水胶管13和热水胶管14,所述冷水胶管13和所述热水胶管14另一端分别与所述换热器15连接,所述换热器15以及外置散热风扇安装在机箱上。使用时,水冷媒介经循环水泵12的驱动将经换热器15降温之后的冷水从水冷板11进水口流入,流经水冷板11的循环水通道,其中循环水通道中会流径显卡主芯对应的主芯片散热腔117,吸收主芯片的热量,从而降低显卡主控芯片的温度,流回换热器15形成闭路水冷循环。As shown in Figures 1-6, a plate-type water-cooled graphics card radiator includes a water-cooled plate 11, a circulating water pump 12, a cold water hose 13, a hot water hose 14, and a heat exchanger 15, and the water-cooled plate 11 is fixed by a stud 115 Fitted and installed on the graphics card 20, the water cooling plate 11 is provided with a main chip cooling chamber 117 corresponding to the graphics card main chip, and the main chip cooling cavity 117 passes through the circulating water channel in the water cooling plate 11 and is arranged on the The water inlet joint 114 on one side of 11 is communicated with the water outlet joint 113 respectively, and the cold water rubber hose 13 and the hot water rubber hose 14 are respectively connected between the water inlet joint 114 and the water outlet joint 113 through a circulating water pump 12, and the cold water hose 13 and the hot water hose 14 are respectively connected. The other ends of the rubber hose 13 and the hot water hose 14 are respectively connected to the heat exchanger 15, and the heat exchanger 15 and the external cooling fan are installed on the chassis. When in use, the water cooling medium is driven by the circulating water pump 12, and the cold water cooled by the heat exchanger 15 flows in from the water inlet of the water cooling plate 11, and flows through the circulating water channel of the water cooling plate 11, wherein the circulating water channel flows through the main core of the graphics card The corresponding heat dissipation cavity 117 of the main chip absorbs the heat of the main chip, thereby reducing the temperature of the main control chip of the graphics card, and flows back to the heat exchanger 15 to form a closed-circuit water cooling cycle.
其中,所述水冷板11包括水冷板上盖111和水冷板下盖112,所述水冷板上盖111和所述水冷板下盖112通过钎焊贴合固定在一起;所述水冷板上盖111和所述水冷板下盖112分别设置有冲压凹槽和接触凸台,所述水冷板上盖111和所述水冷板下盖112的冲压凹槽对应贴合,形成循环水通道;所述接触凸台对应显卡主芯片位置形成主芯片散热腔117,所述主芯片散热腔117的外壁有显卡主芯片贴合。Wherein, the water-cooled plate 11 includes a water-cooled plate cover 111 and a water-cooled plate lower cover 112, and the water-cooled plate cover 111 and the water-cooled plate lower cover 112 are fixed together by brazing; 111 and the water-cooled plate lower cover 112 are respectively provided with stamping grooves and contact bosses, and the stamping grooves of the water-cooled plate cover 111 and the water-cooled plate lower cover 112 are correspondingly fitted to form a circulating water channel; The contact boss corresponds to the position of the main chip of the graphics card to form a cooling cavity 117 for the main chip, and the outer wall of the cooling cavity 117 for the main chip is bonded to the main chip of the graphics card.
其中,所述水冷板11对应显卡20的多个显存芯片设置有多个副芯片散热腔118,多个所述副芯片散热腔118的外壁与显存芯片贴合,所述循环水通道连通多个所述副芯片散热腔118。Wherein, the water-cooled plate 11 is provided with a plurality of sub-chip cooling chambers 118 corresponding to the plurality of video memory chips of the graphics card 20, the outer walls of the plurality of sub-chip cooling chambers 118 are attached to the video memory chips, and the circulating water channel communicates with a plurality of sub-chip cooling chambers. The sub-chip cooling chamber 118 .
其中,水冷板11经显卡主芯片固定弹簧螺丝、水冷板固定螺丝锁紧之后,保证水冷板下盖112每一个凸台与显卡各个芯片相接触,保证热量的传导路径。Wherein, after the water-cooling plate 11 is locked by the fixing spring screws of the main chip of the graphics card and the fixing screws of the water-cooling plate, each boss of the lower cover of the water-cooling plate 112 is guaranteed to be in contact with each chip of the graphics card to ensure the heat conduction path.
优选地,冷水胶管13和热水胶管14具有一定的硬度、柔性可弯曲、低水蒸发率、内壁光滑的特征;可冷插入循环水泵12和换热器15的倒刺结构,插入后具有难脱落,低泄露率的特征。Preferably, the cold water hose 13 and the hot water hose 14 have the characteristics of certain hardness, flexibility and bendability, low water evaporation rate, and smooth inner wall; they can be coldly inserted into the barb structure of the circulating water pump 12 and the heat exchanger 15, and are difficult to insert after insertion. Shedding, low leak rate characteristics.
优选地,换热器15上具有倒刺的进出水口,其与冷水胶管13、热水胶管14冷插入连接;两侧安装板上具有风扇安螺纹孔,可经机箱安装一至两个风扇,换热器的功率可由显卡散热功率改变,可增加或减小扁管数和波浪带的数量来适应不同的显卡散热功率,安装在换热器15上的风扇可调速来适应显卡热功率的瞬时变化。Preferably, the heat exchanger 15 has a barbed water inlet and outlet, which is cold-inserted and connected with the cold water hose 13 and the hot water hose 14; there are fan screw holes on the mounting plates on both sides, and one or two fans can be installed through the chassis. The power of the radiator can be changed by the cooling power of the graphics card, and the number of flat tubes and wave bands can be increased or decreased to adapt to different cooling powers of the graphics card. The speed of the fan installed on the heat exchanger 15 can be adjusted to adapt to the instantaneous thermal power of the graphics card Variety.
如图8、9所示,所述主芯片散热腔117内设置有微通道铲片116以及分流片1110,所述微通道铲片116的接触面与显卡主芯片贴合,所述微通道铲片116的鳍片阵列设置在所述主芯片散热腔117内,所述分流片1110设置在所述鳍片阵列与所述主芯片散热腔117的内壁之间。微通道铲片116与分流片1119有效保证让水冷媒介充分流经微通道铲片的鳍片,最大效的带走热量。As shown in Figures 8 and 9, a microchannel shovel 116 and a shunt 1110 are arranged in the heat dissipation cavity 117 of the main chip. The fin array of the sheet 116 is disposed in the heat dissipation chamber 117 of the main chip, and the splitter 1110 is disposed between the fin array and the inner wall of the heat dissipation chamber 117 of the main chip. The micro-channel shovel 116 and the splitter 1119 effectively ensure that the water-cooling medium can fully flow through the fins of the micro-channel shovel, and take away heat most effectively.
其中,微通道铲片116具有铲片密度大的特征,易于水冷媒介充分流经铲片表面,完成换热过程;其背面有一棱形凸台,棱形凸台与水冷板下盖间隙配合,为了保证微通道铲片116的定位精度,此间隙可控制在小于0.1mm;棱形凸台直接与显卡主控芯片接触,接触面之间可涂导热脂,以减少接触热阻,棱形凸台高度大于水冷板下盖厚度,其可防止水冷板与显卡安装后微通道铲片与显卡主控芯片悬空,造成空气热阻;棱形凸台下面上一大平面,其平面与水冷板下盖内腔接触,经分流片、水冷板上盖层压之后,适合平面钎焊;铲片两侧有倒角,经分流片盖压之后,倒角处形成分流区域,可有效让水冷媒介流经各铲片表面。Among them, the microchannel shovel 116 has the characteristics of high shovel density, and it is easy for the water-cooling medium to fully flow through the surface of the shovel to complete the heat exchange process; there is a prismatic boss on the back, and the prismatic boss is matched with the lower cover of the water-cooled plate. In order to ensure the positioning accuracy of the micro-channel shovel 116, the gap can be controlled to be less than 0.1mm; the prismatic convex platform directly contacts the main control chip of the graphics card, and thermal grease can be applied between the contact surfaces to reduce contact thermal resistance. The height of the platform is greater than the thickness of the lower cover of the water-cooled plate, which can prevent the micro-channel blade and the main control chip of the graphics card from being suspended in the air after the water-cooled plate and the graphics card are installed, causing air thermal resistance; The inner cavity of the cover is in contact, and after the shunt plate and the water-cooled plate are laminated, it is suitable for plane brazing; there are chamfers on both sides of the shovel, and after the shunt cover is pressed, the chamfers form a diversion area, which can effectively allow the water-cooling medium to flow through the surface of each shovel.
如图10所示,每一个所述副芯片散热腔118分别设置有折叠翅片119;折叠翅片119起增加水冷媒介流体的雷诺数,起湍流作用。As shown in FIG. 10 , each of the sub-chip cooling chambers 118 is respectively provided with folded fins 119 ; the folded fins 119 increase the Reynolds number of the water-cooling medium fluid and act as turbulence.
优选地,水冷板上盖111和水冷板下盖112由合金薄片冲压制而成,具有进水口接头槽口、出水口槽口、方形循环水通道、显存接触凸台、显卡主控芯片接触凸台以及铆接螺柱通孔;其铆接螺柱通孔与螺柱为冲压制而成,形成过盈配合;水冷板上盖111与水冷板下盖112接触平面为钎焊面,钎焊后方形循环水通道、显存接触凸台、显卡主控芯片接触凸台起水冷板加强筋作用;水冷板上盖111、水冷板下盖112、进水口接头114、出水口接头113钎焊后相邻通道之间不可串液,相邻接头之不可串液及泄露;显卡主控芯片接触凸台与分流片相接触,层压后分流片与水冷板上盖111平面焊接,防止水冷媒介直接越过微通道铲片而减少散热能效。Preferably, the water-cooled plate cover 111 and the water-cooled plate lower cover 112 are punched and pressed from an alloy sheet, and have a water inlet joint notch, a water outlet notch, a square circulating water channel, a video memory contact boss, and a graphics card main control chip contact boss. The through hole of the riveting stud and the riveting stud; the through hole of the riveting stud and the stud are punched to form an interference fit; the contact plane of the water cooling plate cover 111 and the water cooling plate lower cover 112 is the brazing surface, and the square shape after brazing Circulating water channel, video memory contact boss, graphics card main control chip contact boss function as water-cooled plate reinforcement ribs; water-cooled plate cover 111, water-cooled plate lower cover 112, water inlet joint 114, water outlet joint 113 adjacent channels after brazing There should be no leakage of liquid between adjacent joints; the contact boss of the main control chip of the graphics card is in contact with the shunt, and after lamination, the shunt is welded to the surface of the water-cooling plate cover 111 to prevent the water-cooling medium from directly crossing the microchannel The shovel reduces the heat dissipation energy efficiency.
优选地,进水口接头114和出水口接头113由机加工设备加工而成,可保证焊接尺寸,经水冷板上盖111、水冷板下盖112压制钎焊后密封,接头内壁上具有与水泵接头的密封面,外壁上具有横穿接头的弹簧销孔,此孔可防止水泵接头脱落;在组装进水口接头在水冷板上下盖时用点压式组装,防止在进炉钎焊前保证水冷板上下盖不松动。Preferably, the water inlet joint 114 and the water outlet joint 113 are processed by machining equipment, which can ensure the welding size, and are sealed after being pressed and brazed by the water-cooled plate cover 111 and the water-cooled plate lower cover 112. The inner wall of the joint has a water pump joint There is a spring pin hole crossing the joint on the outer wall, which can prevent the water pump joint from falling off; when assembling the water inlet joint on the water cooling plate, use point pressure assembly to prevent the water cooling plate from being guaranteed before entering the furnace for brazing. The upper and lower covers are not loose.
其中,所述水冷板11的固定支撑螺柱与显卡主芯片的安装固定螺柱共同铆接成一体。Wherein, the fixed support studs of the water cooling plate 11 and the installation and fixation studs of the main chip of the graphics card are jointly riveted into one body.
优选地,水冷板11的安装固定螺柱具有易于铆压的齿状,与水冷板上盖111、水冷板下盖112过盈配合,在进炉钎焊前保证水冷板上下盖不松动,钎焊后可后加工保证螺柱高度及端面与显卡PCB板之间的平行度;具有加强水冷板强度,支撑加强水冷板的作用。Preferably, the installation and fixing studs of the water-cooled plate 11 have tooth shapes that are easy to be riveted, and are interference fit with the water-cooled plate cover 111 and the water-cooled plate lower cover 112, so as to ensure that the upper and lower covers of the water-cooled plate are not loose before brazing in the furnace. After welding, it can be post-processed to ensure the height of the stud and the parallelism between the end face and the PCB board of the graphics card; it can strengthen the strength of the water-cooled plate and support and strengthen the role of the water-cooled plate.
优选地,显卡主控芯片的安装固定螺柱具有易于铆压的齿状,与卡水冷板上盖111、水冷板下盖112过盈配合,在进炉钎焊前保证水冷板上下盖不松动,钎焊后可后加工保证螺柱高度及端面与显卡PCB板之间的平行度;具有加强水冷板强度,支撑加强水冷板的作用。Preferably, the installation and fixing studs of the main control chip of the graphics card have a tooth shape that is easy to be riveted, and are interference-fitted with the upper cover 111 of the water-cooled plate and the lower cover 112 of the water-cooled plate, so as to ensure that the upper and lower covers of the water-cooled plate are not loose before brazing in the furnace , After brazing, it can be post-processed to ensure the height of the stud and the parallelism between the end face and the PCB board of the graphics card; it has the function of strengthening the strength of the water-cooled plate and supporting and strengthening the water-cooled plate.
其中,所述水冷板11的进水口接头114和出水口接头113设置在显卡与机箱的安装固定端一侧。Wherein, the water inlet connector 114 and the water outlet connector 113 of the water cooling plate 11 are arranged on the side of the fixed end of the graphics card and the chassis.
如图7所示,所述循环水泵12是双通道90度冷热水分离水泵,所述循环水泵12安装在显卡与机箱的安装固定端一侧,可减轻显卡金手指区域的载重;90度通道可降低显卡散热器安装后高度,适用于更多的机箱选择;双通道90度冷热水分离水泵,转子经冷水媒介流过,保证转子,定子处理低温端,而高温通道远离转子,定子区域。As shown in Figure 7, the circulating water pump 12 is a dual-channel 90-degree hot and cold water separation pump, and the circulating water pump 12 is installed on the side of the fixed end of the graphics card and the chassis, which can reduce the load on the gold finger area of the graphics card; 90 degrees The channel can reduce the height of the graphics card radiator after installation, which is suitable for more chassis options; the dual-channel 90-degree cold and hot water separates the water pump, and the rotor flows through the cold water medium to ensure that the rotor and stator handle the low-temperature end, while the high-temperature channel is far away from the rotor and stator area.
其中,双通道90度冷热水分离水泵具有两进水口两出水口的特征;其一组水路流经叶轮转子,为冷水水路,另一组水路独立于热水水路,不与冷水水路交叉,且与冷水水路之间相隔有定子组装后的空气间隙,防有效有防止热水水路的热量传递到转子及定子的电磁区域,延长水泵寿命;冷水水路一端具有放置密封圈的密封槽,与水冷板进水口接头相连;冷水水路放置密封圈的密封槽的上方具有放置弹簧销的安装槽,与水冷板进水口接头相连;冷水水路的另一端具有倒刺特征,其与冷水胶管过盈配合,冷插入组装方式,具有泄露率低的特征;热水水路一端具有放置密封圈的密封槽,与水冷板的出水口接头相连;热水水路放置密封圈的密封槽的上方具有放置弹簧销的安装槽,与水冷板的出水口接头相连;热水水路的另一端具有倒刺特征,其与冷水胶管过盈配合,冷插入组装方式,具有泄露率低的特征。Among them, the dual-channel 90-degree cold and hot water separation pump has the characteristics of two water inlets and two water outlets; one set of waterways flows through the impeller rotor, which is the cold waterway, and the other set of waterways is independent of the hot waterway and does not intersect with the cold waterway. And there is an air gap between the cold water channel and the assembled stator, which effectively prevents the heat of the hot water channel from being transferred to the electromagnetic area of the rotor and stator, and prolongs the life of the water pump; one end of the cold water channel has a sealing groove for placing a sealing ring, which is compatible with the water cooling The water inlet joint of the cold water channel is connected to the water inlet joint; there is an installation groove for placing the spring pin above the sealing groove of the cold water channel, which is connected to the water inlet joint of the water cooling plate; the other end of the cold water channel has a barb feature, which is interference fit with the cold water hose The cold insert assembly method has the characteristics of low leakage rate; one end of the hot water channel has a sealing groove for placing a sealing ring, which is connected to the water outlet joint of the water cooling plate; The groove is connected to the water outlet joint of the water cooling plate; the other end of the hot water channel has a barb feature, which is an interference fit with the cold water hose, and the cold insertion assembly method has the characteristics of low leakage rate.
以上结合附图对本实用新型的实施方式作了详细说明,但本实用新型不限于所描述的实施方式。对于本领域的技术人员而言,在不脱离本实用新型原理和精神的情况下,对这些实施方式进行多种变化、修改、替换和变型,仍落入本实用新型的保护范围内。The embodiments of the utility model have been described in detail above in conjunction with the accompanying drawings, but the utility model is not limited to the described embodiments. For those skilled in the art, without departing from the principle and spirit of the utility model, various changes, modifications, replacements and modifications to these embodiments still fall within the protection scope of the utility model.
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109634394A (en) * | 2019-01-23 | 2019-04-16 | 东莞市建鑫电子科技有限公司 | A kind of integrated radiator of integrated PCB and water pump |
DE102021123697A1 (en) | 2021-06-09 | 2022-12-15 | Kuan Ding Industrial Co., Ltd. | water cooling system |
WO2024046439A1 (en) * | 2022-08-31 | 2024-03-07 | 锐捷网络股份有限公司 | Heat dissipation architecture of photoelectric module and electronic device |
CN118352880A (en) * | 2024-06-17 | 2024-07-16 | 度亘核芯光电技术(苏州)有限公司 | Heat sink and laser |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109634394A (en) * | 2019-01-23 | 2019-04-16 | 东莞市建鑫电子科技有限公司 | A kind of integrated radiator of integrated PCB and water pump |
CN109634394B (en) * | 2019-01-23 | 2024-03-19 | 东莞市建鑫电子科技有限公司 | Integrated PCB and water pump integrated radiator |
DE102021123697A1 (en) | 2021-06-09 | 2022-12-15 | Kuan Ding Industrial Co., Ltd. | water cooling system |
WO2024046439A1 (en) * | 2022-08-31 | 2024-03-07 | 锐捷网络股份有限公司 | Heat dissipation architecture of photoelectric module and electronic device |
US12242121B2 (en) | 2022-08-31 | 2025-03-04 | Ruijie Networks Co., Ltd. | Heat dissipation structure for optoelectronic module and electronic device |
CN118352880A (en) * | 2024-06-17 | 2024-07-16 | 度亘核芯光电技术(苏州)有限公司 | Heat sink and laser |
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