CN115362762A - Mounting substrate manufacturing apparatus and mounting substrate manufacturing method - Google Patents

Abstract

The disclosed manufacturing method includes the steps of forming a solder precoat (2) on a pad (1b), holding the substrate (1) with a first substrate holding part and taking the height from the upper surface of the solder precoat (2) The process of position-related height position information PH1 and height position information SH1 related to the height position of the upper surface of the substrate (1) is to use the second substrate holding part to hold the substrate (1) and obtain the upper surface of the substrate (1). The process of height position information SH2 related to the height position, the process of mounting the electronic component (4) on the solder precoat layer (2) of the substrate (1) held by the second substrate holding part, and the process of using the height position information PH1 , height position information SH1, and height position information SH2 to calculate a target height position used when mounting the electronic component (4) on the solder precoat layer (2).

Description

Mounted substrate manufacturing device and mounted substrate manufacturing method

technical field

The present invention relates to a mounting substrate manufacturing device and a mounting substrate manufacturing method.

Background technique

There is known an electronic component mounting method for manufacturing an electronic component mounted substrate by mounting electronic components on the substrate by soldering (for example, Patent Document 1). The method of Patent Document 1 includes a step of printing a solder paste, and a step of mounting an electronic component on the solder paste and performing reflow soldering. However, such a method may not be able to cope with high-density mounting. Therefore, in recent years, a method (solder precoating method) of forming a solder film in advance on pads of a substrate on which electronic components are placed has attracted attention again (for example, Patent Document 2). The resulting solder film is sometimes referred to as a "solder precoat".

prior art literature

patent documents

Patent Document 1: Japanese Patent Laid-Open No. 2013-243222

Patent Document 2: Japanese Patent Laid-Open No. 2018-167297

Contents of the invention

The problem to be solved by the invention

When a person who manufactures electronic component mounted boards intends to manufacture electronic component mounted boards by the solder precoat method, it is necessary to obtain a board on which a solder precoat has been formed in advance. As for this acquisition method, there are two methods of preparing a board on which a solder precoat is formed externally or preparing one by oneself. However, if it is prepared externally, the manufacturing cost of the electronic component mounting board|substrate will become high. In addition, it is difficult to promptly respond to design changes of electronic component mounting substrates.

On the other hand, in the case of self-preparation, it is not impossible to divert the mounting line for manufacturing electronic component mounting substrates to the formation of solder precoat. However, in this case, it is necessary to change the setting of the mounting line when forming the solder pre-coat layer and when manufacturing the electronic component mounting board, so the operation is complicated and unrealistic.

In addition, when mounting electronic components on a substrate, it is desired to accurately mount electronic components on a substrate with good yield. On the other hand, due to miniaturization of electronic components, etc., it is difficult to accurately mount electronic components on a substrate with good yield.

Under such circumstances, one object of the present invention is to provide an electronic component that can be continuously performed from the formation of the solder precoat layer to the soldering of the electronic component to the substrate, and that can accurately mount the electronic component with a good yield. A mounting substrate manufacturing device on a substrate and a mounting substrate manufacturing method.

Solution to the problem

One aspect of the present invention relates to a mounting substrate manufacturing apparatus. The manufacturing device is a mounted substrate manufacturing device for manufacturing a mounted substrate including a substrate having pads and electronic components soldered to the pads, wherein the mounted substrate manufacturing device includes: a substrate transfer line, which conveys the substrate having the pad; a solder precoat forming part which forms a solder precoat on the pad; a first substrate holding part which holds the solder from the substrate conveying line; the substrate conveyed by the precoat forming part; the height position information PH1 related to the height position of the upper surface of the layer and the height position information SH1 related to the height position of the upper surface of the substrate; The substrate held by the substrate holding unit holds the substrate; the second height position measuring unit obtains the height position of the upper surface of the substrate held by the second substrate holding unit through the second height position measurement. related height position information SH2; an electronic component mounting section that mounts the electronic component on the solder precoat of the substrate held by the second substrate holding section using a component holding tool; and a calculation section, Using the height position information PH1 , the height position information SH1 , and the height position information SH2 , the component holding tool that holds the electronic component is calculated to mount the electronic component on the solder precoat layer. And toward the target height position when the substrate is lowered, the electronic component mounting part controls the lifting operation of the component holding tool based on the target height position to mount the electronic component on the solder precoat layer.

Another aspect of the present invention relates to a mounting substrate manufacturing apparatus. The manufacturing device is a mounted substrate manufacturing device for manufacturing a mounted substrate including a substrate having pads and electronic components soldered to the pads, wherein the mounted substrate manufacturing device includes: a substrate transfer line, which conveys the substrate having the pad; a solder precoat forming part which forms a solder precoat on the pad; a substrate holding part which holds the solder precoat by the substrate conveying line the substrate conveyed by the layer forming unit; and the height position measuring unit that obtains a height position correlation with respect to the upper surface of the solder precoat layer by measuring the height position of the substrate held by the substrate holding unit. height position information PH2; an electronic component mounting section that mounts the electronic component on the solder precoat layer of the substrate held by the substrate holding section using a component holding tool; and a calculating section that uses the The height position information PH2 calculates a target height position when the component holding tool holding the electronic component is lowered toward the substrate in order to mount the electronic component on the solder precoat layer. The electronic component is mounted on the solder pre-coat layer by controlling the lifting operation of the component holding tool based on the target height position.

Another aspect of the present invention relates to a mounting substrate manufacturing method. The manufacturing method is a mounting substrate manufacturing method for manufacturing a mounting substrate including a substrate having pads and electronic components soldered to the pads, wherein the mounting substrate manufacturing method sequentially includes: solder pre-coating a layer forming step, in which a solder precoat layer is formed on the pad; a first height position measurement step, in which the first substrate is formed The holding unit holds the substrate on which the solder pre-coat layer is formed, and acquires height position information PH1 related to the height position of the upper surface of the solder pre-coat layer and information related to the height position by the first height position measurement. The height position information SH1 related to the height position of the upper surface of the substrate; the second height position measurement process, in which the second height position measurement process is carried out by the second substrate holding part after passing through the first height position In the state of the substrate in the measuring step, obtaining height position information SH2 related to the height position of the upper surface of the substrate by second height position measurement; and an electronic component mounting step in which the electronic component mounting step wherein, using a component holding tool, the electronic component is mounted on the solder precoat layer of the substrate held by the second substrate holding portion, and the electronic component is mounted in the second height position measurement step. The steps further include a calculation step of calculating the component holding tool holding the electronic component using the height position information PH1, the height position information SH1, and the height position information SH2. In the electronic component mounting step, based on the target height position calculated in the calculation step, The electronic component is mounted on the solder precoat layer by controlling the lifting operation of the component holding tool.

Another aspect of the present invention relates to a mounting substrate manufacturing method. The manufacturing method is a mounting substrate manufacturing method for manufacturing a mounting substrate including a substrate having pads and electronic components soldered to the pads, wherein the mounting substrate manufacturing method sequentially includes: solder pre-coating layer forming step, in which solder precoat layer is formed on the pad; Obtaining height position information PH2 related to the height position of the upper surface of the solder precoat layer by height position measurement in the state of the substrate of the solder precoat layer; In the mounting step, the electronic component is mounted on the solder precoat layer of the substrate held by the substrate holding portion using a component holding tool, and the height position measurement step and the electronic component mounting step Furthermore, a calculating step is included in which the orientation of the component holding tool holding the electronic component to mount the electronic component on the solder precoat layer is calculated using the height position information PH2. The target height position when the substrate is lowered. In the electronic component mounting step, the electronic component is mounted on the solder precoat layer by controlling the lifting operation of the component holding tool based on the target height position. .

Invention effect

According to the mounting board manufacturing apparatus and mounting board manufacturing method of the present invention, the steps from formation of the solder pre-coat layer to soldering of electronic components to the board can be continuously performed.

The novel features of the present invention are described in the appended technical claims, and both the structure and contents of the present invention, together with other objects and features of the present invention, can be further fully understood from the following detailed description with reference to the accompanying drawings.

Description of drawings

FIG. 1 is a diagram schematically showing the configuration of a mounting substrate manufacturing apparatus according to Embodiment 1. As shown in FIG.

FIG. 2 is a diagram schematically showing an example of a control system of the mounted substrate manufacturing apparatus shown in FIG. 1 .

FIG. 3 is a diagram schematically showing the structure of an example of a solder precoat layer forming part included in the device shown in FIG. 1 .

FIG. 4 is a diagram schematically showing a part of a solder precoat layer formation portion shown in FIG. 3 .

FIG. 5 is a diagram schematically showing one step of a method of applying solder paste to a substrate using the apparatus of this embodiment.

6A is a cross-sectional view schematically showing one step in the process of forming an example of a solder precoat layer using the apparatus of Embodiment 1. FIG.

FIG. 6B is a cross-sectional view schematically showing a step performed subsequent to the step shown in FIG. 6A .

FIG. 6C is a cross-sectional view schematically showing a step performed subsequent to the step shown in FIG. 6B .

FIG. 6D is a cross-sectional view schematically showing a step performed subsequent to the step shown in FIG. 6C .

FIG. 7 is a diagram schematically showing an example of a solder precoat inspection device included in the device shown in FIG. 1 .

FIG. 8 is a flowchart showing an example of steps in the solder precoat inspection device.

9A is a diagram schematically showing one step of an example of a method of holding a substrate in the solder precoat inspection device.

FIG. 9B is a diagram schematically showing a step performed following the step shown in FIG. 9A .

FIG. 10 is a plan view schematically showing measurement positions and the like in the solder precoat inspection device.

FIG. 11 is a schematic diagram for explaining height position measurement in the solder precoat inspection device.

FIG. 12 is a diagram schematically showing an example of an electronic component mounting device included in the device shown in FIG. 1 .

FIG. 13 is a flowchart showing an example of a process in the electronic component mounting apparatus shown in FIG. 12 .

FIG. 14 is a diagram schematically showing an example of a process of mounting electronic components in the electronic component mounting apparatus shown in FIG. 12 .

15A is a cross-sectional view schematically showing one step of an example of the process of manufacturing a mounting substrate in the manufacturing apparatus according to Embodiment 1. FIG.

FIG. 15B is a cross-sectional view schematically showing a step performed subsequent to the step shown in FIG. 15A .

Fig. 15C is a cross-sectional view schematically showing a step performed subsequent to the step shown in Fig. 15B.

Fig. 15D is a cross-sectional view schematically showing a step performed subsequent to the step shown in Fig. 15C.

Fig. 15E is a cross-sectional view schematically showing a step performed subsequent to the step shown in Fig. 15D.

16 is a flowchart showing an example of a process in the electronic component mounting device included in the manufacturing device according to the second embodiment.

17 is a schematic diagram for explaining height position measurement in the electronic component mounting device included in the manufacturing apparatus according to the second embodiment.

18 is a schematic diagram for explaining an example of a process of mounting electronic components on the electronic component mounting device included in the manufacturing apparatus according to Embodiment 2. FIG.

Detailed ways

Hereinafter, embodiments of the present invention will be described with examples. In addition, this invention is not limited to the example demonstrated below. In this specification, a "height position" means the coordinate position when a vertical direction is made into a coordinate axis. The "height position" may also be represented by a relative height with respect to a reference height position.

(Installation substrate manufacturing equipment)

The manufacturing apparatus of this embodiment is an apparatus for manufacturing a mounting board on which a plurality of electronic components are mounted. The mounting substrate is a substrate on which electronic components are mounted. That is, the manufacturing apparatus of this embodiment is an electronic component mounted substrate manufacturing apparatus. Hereinafter, two examples of the manufacturing apparatus of the present embodiment will be described. These two examples may be referred to as "manufacturing device (D1)" and "manufacturing device (D2)".

(Manufacturing device (D1))

A manufacturing device (D1) is a manufacturing device for manufacturing a mounting substrate including a substrate having pads and electronic components soldered to the pads. The manufacturing device (D1) includes: a substrate conveying line, which conveys a substrate having a pad; a solder precoat forming part, which forms a solder precoat on the pad; a first substrate holding part, which is supported by the substrate conveying line The substrate conveyed by the solder precoat layer forming part is held; the first height position measuring part obtains the distance between the upper surface of the solder precoat layer and the upper surface of the solder precoat layer through the first height position measurement of the substrate held by the first substrate holding part. The height position information PH1 related to the height position and the height position information SH1 related to the height position of the upper surface of the substrate; the second substrate holding part, which holds the substrate conveyed from the first substrate holding part by the substrate conveying line; 2. The height position measurement unit, which acquires height position information SH2 related to the height position of the upper surface of the substrate held by the second substrate holding unit through the second height position measurement; and the electronic component mounting unit, which uses the component holding tool The electronic component is mounted on the solder precoat of the substrate held by the second substrate holding unit; and the calculation unit calculates the component holding tool holding the electronic component by using the height position information PH1, the height position information SH1 and the height position information SH2 The target height position when descending toward the substrate to mount electronic components on the solder precoat. The electronic component mounting unit controls the lifting operation of the component holding jig based on the target height position, and mounts the electronic component on the solder precoat.

The manufacturing device ( D1 ) can continuously perform the steps from the formation of the solder precoat layer to the mounting of the electronic component on the substrate, and can accurately mount the electronic component on the substrate with good yield.

Hereinafter, the terms "upstream side" and "downstream side" may be used depending on the direction in which the substrate is conveyed. The board|substrate is conveyed from an upstream side toward a downstream side, and in this process, formation of a solder pre-coat layer and mounting of an electronic component are performed. A solder paste supply part, a heating part, a solder flux application part, an electronic component mounting part, and a reflow soldering part are arrange|positioned in this order from an upstream side toward a downstream side. The first substrate holding unit and the first height position measuring unit may be arranged between the heating unit and the solder flux application unit (described later), or may be included in other structural units. For example, the first substrate holding unit and the first height position measuring unit may be incorporated in a solder precoat inspection device (described later), or may be incorporated in a solder flux application unit.

The substrate is a substrate on which electronic components are mounted. The substrate has a wiring portion to which electronic components are soldered. For example, a substrate may have portions called pads to which electronic components are soldered. The substrate is not particularly limited, and a known substrate on which electronic components are mounted may be used.

The first substrate holding part and the second substrate holding part preferably have the same structure. By setting them in the same configuration, the height position information measured by the first substrate holding unit can be accurately used as the height position information of the substrate held by the second substrate holding unit.

The manufacturing device ( D1 ) may further include a height position measurement information storage unit that stores height position information PH1 and height position information SH1 obtained by the first height position measurement unit. In this case, the calculation unit may read altitude position information PH1 and altitude position information SH1 from the altitude position measurement information storage unit. According to this configuration, the height position information obtained by the measurement by the first height position measurement unit can be reliably transmitted to the calculation unit.

Alternatively, identification information for individually identifying the substrate may be marked on the substrate. In addition, the first altitude position measurement unit may store the altitude position information PH1 and altitude position information SH1 obtained by the first altitude position measurement together with the identification information in the altitude position measurement information storage unit. Moreover, the calculation part may read identification information, height position information PH1, and height position information SH1 from the height position measurement information storage part. According to this configuration, appropriate height position information PH1 and height position information SH1 can be reliably transmitted to the calculation unit.

The solder precoat layer forming unit may include: a solder paste supply unit that supplies solder paste onto the pad; and a heating unit that heats the solder paste to form the solder precoat layer on the pad. According to this configuration, since the solder pre-coat layer is formed using solder paste, the manufacturing cost of the mounting substrate can be reduced.

In a typical example, the solder precoat has residues of solder paste on the surface. In this case, the first height position measurement unit may measure the height of the upper surface of the residue. In this structure, the solder precoat layer covered with the residue is measured by the 1st height position measuring part. As a result, equipment for removing residues from the surface of the solder precoat layer can be omitted, and the mounting board manufacturing apparatus and the mounting board manufacturing process can be simplified.

The flux residue is obtained by modifying and hardening the flux in the solder paste by heating. Unlike the flux before hardening, the light transmission of the residue is small. Therefore, compared with the flux before hardening, the height position of the surface of the residue can be optically and accurately measured.

In normal mounting of electronic components, it is preferable to remove flux residues by cleaning or the like. However, in this case, a cleaning step by a cleaning device is required, and a drying step by a drying device is sometimes required. Therefore, in the case of cleaning the residue of the flux, the mounting system for mounting the electronic components becomes long and complicated. In addition, the time required for mounting electronic components becomes longer. In the manufacturing apparatus of this embodiment and the manufacturing method (M) of this embodiment mentioned later, an electronic component can be mounted without removing the flux residue. Therefore, it is possible to omit the equipment and steps necessary for the removal of flux residues.

The manufacturing apparatus (D1) may further include a solder flux application unit arranged between the first substrate holding unit and the second substrate holding unit. The solder flux coating unit coats the solder flux on the solder pre-coat layer of the substrate. The second height position measurement unit may acquire the height position information SH2 by performing the second height position measurement on a portion of the substrate that is not covered with the solder flux. According to this configuration, since the surface of the substrate not covered with the solder flux is measured, accurate measurement can be performed.

(Manufacturing device (D2))

The manufacturing device (D2) is a device for manufacturing a mounting substrate including a substrate having pads and electronic components soldered to the pads. The manufacturing device (D2) includes: a substrate conveying line that conveys a substrate having a pad; a solder precoat forming section that forms a solder precoat on the pad; a substrate holding section that holds the solder precoat formed by the substrate conveying line The substrate conveyed by the coating forming part; the height position measuring part, which obtains the height position information PH2 related to the height position of the upper surface of the solder precoat layer by measuring the height position of the substrate held by the substrate holding part; A component mounting section that mounts the electronic component on the solder precoat of the substrate held by the substrate holding section using a component holding tool; and a calculation section that calculates the component holding tool that holds the electronic component using the height position information PH2 The target height position when the component is mounted on the solder precoat and lowered toward the substrate. The electronic component mounting unit mounts the electronic component on the solder pre-coat layer by controlling the lifting operation of the component holding jig based on the target height position.

Since the manufacturing device ( D2 ) can be realized using a part or all of the configuration of the manufacturing device ( D1 ), overlapping descriptions may be omitted. According to the manufacturing device (D2), the same effect as that of the manufacturing device (D1) can be obtained.

The manufacturing device ( D2 ) may further include a solder flux application unit arranged between the solder precoat layer forming unit and the substrate holding unit. The solder flux coating unit may coat the solder flux on the solder pre-coat layer of the substrate. The height position measurement unit measures the height position of the solder pre-coat layer covered with the solder flux, thereby acquiring height position information PH2. In this case, the height position measurement unit may perform height position measurement using laser light.

(Mounting board manufacturing method)

The manufacturing method of this embodiment is a method for manufacturing a mounting board on which a plurality of electronic components are mounted. Two examples of the manufacturing method of this embodiment will be described below. These two examples are sometimes referred to as "manufacturing method (M1)" and "manufacturing method (M2)". The manufacturing method (M1) and the manufacturing method (M2) are methods corresponding to the manufacturing device (D1) and the manufacturing device (D2), respectively, and therefore overlapping descriptions may be omitted. According to the manufacturing method (M1) and the manufacturing method (M2), the same effects as those of the manufacturing device (D1) and the manufacturing device (D2) can be obtained.

(Manufacturing method (M1))

The manufacturing method (M1) is a mounting substrate manufacturing method for manufacturing a mounting substrate including a substrate having lands and electronic components soldered to the lands. The manufacturing method (M1) sequentially includes: a solder precoat forming step of forming a solder precoat on the pad; a first height position measuring step of measuring In the measurement step, height position information PH1 related to the height position of the upper surface of the solder precoat layer is obtained by the first height position measurement while the substrate on which the solder precoat layer is formed is held by the first substrate holding portion. And the height position information SH1 related to the height position of the upper surface of the substrate; the second height position measurement process, in the second height position measurement process, after the first height position gauge is held by the second substrate holding part In the state of the substrate in the measuring process, the height position information SH2 related to the height position of the upper surface of the substrate is obtained by the second height position measurement; and the electronic component mounting process, in which the component holding tool is used The electronic component is mounted on the solder precoat of the substrate held by the second substrate holding unit. Between the second height position measurement step and the electronic component mounting step, a calculation step is further included. In this calculation step, the component holder holding the electronic component is calculated using the height position information PH1, the height position information SH1, and the height position information SH2. The target height position when the tool is lowered toward the substrate in order to mount the electronic component on the solder precoat layer, in the electronic component mounting process, the electronic component holding tool is controlled to move up and down based on the target height position calculated in the calculation process. Components are mounted on a solder precoat.

It is also possible that the manufacturing method (M1) further includes a height position information storage step in which the height position information PH1 and the height position information SH1 obtained in the first height position measurement step are stored in the height position meter. Measuring Information Storage Department. In this case, in the calculation step, height position information PH1 and height position information SH1 may be read from the height position measurement information storage unit.

In the manufacturing method (M1), identification information for individually identifying the substrate may be attached to the substrate. In this case, the height position information PH1 and the height position information SH1 obtained by the first height position measurement step in the first height position measurement step may be stored in the height position measurement information storage unit together with the identification information. . In this case, in the calculation step, the identification information, height position information PH1 , and height position information SH1 may be read from the height position measurement information storage unit.

In the manufacturing method (M1), the solder precoat layer forming step may include: a solder paste supplying step of supplying the solder paste onto the pad; and a heating step of , forming a solder precoat on the pad by heating the solder paste.

In a typical example, the solder precoat has residues of solder paste on the surface. In the manufacturing method (M1), in the first height position measuring step, the height of the upper surface of the residue may be measured.

The manufacturing method (M1) may further include a solder flux coating step between the first height position measurement step and the second height position measurement step. The solder flux coating step is a step of coating a solder flux on the solder pre-coat layer of the substrate. In the second height position measurement step, the height position information SH2 may be acquired by performing the second height position measurement on a portion of the substrate that is not covered with the solder flux.

(Manufacturing method (M2))

The manufacturing method (M2) is a manufacturing method for manufacturing a mounting substrate including a substrate having pads and electronic components soldered to the pads. The manufacturing method (M2) sequentially includes: a solder precoat forming step of forming a solder precoat on the pad; a height position measuring step of, in the height position measuring step, In the state where the substrate on which the solder precoat is formed is held by the substrate holding part, the height position information PH2 related to the height position of the upper surface of the solder precoat is acquired by height position measurement; and the electronic component mounting process, in In this electronic component mounting step, the electronic component is mounted on the solder precoat of the substrate held by the substrate holding unit using the component holding jig. The manufacturing method (M2) further includes a calculation step between the height position measurement step and the electronic component mounting step. In this calculation step, the component holding tool holding the electronic component is calculated using the height position information PH2. The target height position when the precoat is lowered towards the substrate. And, in the electronic component mounting step, the electronic component is mounted on the solder precoat layer by controlling the lifting operation of the component holding jig based on the target height position.

The manufacturing method (M2) may further include a solder flux coating step between the solder precoat layer forming step and the electronic component mounting step. The solder flux coating step is a step of coating a solder flux on the solder pre-coat layer of the substrate. In the height position measurement step, the height position information PH2 may be acquired by measuring the height position of the solder pre-coat layer covered with the solder flux.

In the manufacturing method (M2), the height position measurement may be performed using laser light in the height position measurement step.

Hereinafter, examples of the manufacturing apparatus and manufacturing method of the present invention will be specifically described with reference to the drawings. The above-mentioned constituent elements and steps can be applied to the constituent elements of the manufacturing apparatus and the steps of the manufacturing method described below. In addition, the components of the manufacturing apparatus and the steps of the manufacturing method described below can be changed based on the above description. In addition, matters described below can also be applied to the above-mentioned embodiment. In addition, in the embodiments described below, components and steps that are not essential to the manufacturing apparatus and manufacturing method of the present invention may be omitted. In addition, in the following drawings, illustration of some members and some reference numerals may be omitted for easy understanding.

(Embodiment 1)

In Embodiment 1, an example of a manufacturing apparatus (D1) and an example of a manufacturing method (M1) are demonstrated. FIG. 1 schematically shows the configuration of a mounting substrate manufacturing apparatus 10 according to Embodiment 1. As shown in FIG. The manufacturing apparatus 10 is an example of the above-mentioned manufacturing apparatus (D1). The manufacturing device 10 includes a board transfer line 11, an information processing device 20, a loader 50, a solder precoat forming part 90, a solder precoat inspection device 300, a flux applying device (flux applying part) 400, an electronic component Mounting devices (electronic component mounting units) 501 and 502 , a mounting state inspection device 600 , a reflow soldering device 700 , a substrate inspection device 800 , and an unloader 900 . These are arranged in the order described above from the upstream side to the downstream side. Known structures can also be applied to structures other than those peculiar to the present invention. Hereinafter, electronic component mounting devices 501 and 502 may be collectively referred to as "electronic component mounting device 500".

The substrate conveyance line 11 conveys the substrate 1 (described later) within a range from the solder pre-coat layer forming part 90 to the substrate inspection device 800 . The board|substrate conveyance line 11 does not need to be a continuous line, and may consist of several conveyance lines. As the substrate conveyance line 11, a known substrate conveyance line can be used.

In the manufacturing apparatus 10, FIG. 2 schematically shows a structure for performing operations of each part (each device) and processing of information. The information processing device 20 is connected to each part (each device). The information processing device 20 includes an arithmetic processing device 20a and a storage device 20b. The solder precoat inspection device 300 includes an arithmetic processing device 302a and a storage device 302b constituting a control unit. The electronic component mounting device 501 includes an arithmetic processing device 501a and a storage device 501b constituting a control unit. The arithmetic processing unit 20a, the storage unit 20b, the arithmetic processing unit 302a, the storage unit 302b, the arithmetic processing unit 501a, and the storage unit 501b include or function as the units shown in FIG. 2 . In addition, the electronic component mounting device 502 also includes an arithmetic processing device and a storage device similarly to the electronic component mounting device 501 .

The arithmetic processing unit described above is constituted by a CPU (Central Processing Unit) and the like. The storage device described above is composed of one or more RAMs (Random Access Memory), a hard disk, and the like. These may be constituted by individual circuits, LSI (Large Scale Integration), or integrally constituted. The information processing device 20 and other devices included in the mounting substrate manufacturing device 10 (including the solder precoat forming part 90, the solder precoat inspection device 300, the flux coating device 400, the electronic component mounting device 500, and the reflow soldering device 700 ) are connected in such a manner as to enable communication via a wired or wireless local area network 20N. The information processing device 20 performs data exchange among these devices. Thus, the information processing device 20 manages the steps performed by the mounted substrate manufacturing device 10 .

In the storage device of the information processing device 20 , programs necessary for installing each device of the substrate manufacturing apparatus 10 and data required for each device are stored. For example, data necessary for the electronic component mounting devices 501 and 502 include an assembly program, control parameters, workpiece information, and the like. The mounting program is a program including coordinates of mounting points of substrate 1 (mounting coordinates of electronic components 4 ), information of electronic components 4 mounted at mounting points, supply positions of electronic components 4 , mounting order for mounting on substrate 1 , and the like. The control parameters are information (for example, speed, acceleration, etc.) necessary for operation control of the electronic component mounting devices 501 and 502 . The workpiece data includes at least component information and substrate information. The information on electronic components includes data related to the shape and size (width, length, thickness) of the electronic components. In addition, the information on the substrate includes the coordinates of the reference mark and the like in addition to the data related to the size and thickness of the substrate. The data required by the solder precoat inspection device 300 includes a measurement program including the coordinates of the measurement site on the substrate 1 . As data required for the mounted state inspection device 600 , inspection data including coordinates of an inspection object (electronic component) on the substrate 1 , criteria used for inspection, image processing parameters, and the like are suitable. Data required for the reflow soldering apparatus 700 include data such as a set temperature of a heating device for heating a substrate, a conveyance speed of the substrate 1 , and the like. The information processing device 20 transmits (downloads) these programs and data to each device constituting the mounted substrate manufacturing device 10 before starting the operation. Each device downloads programs and data from the information processing device 20 and stores them in a control unit included in each device. It should be noted that the control unit of each device is equipped with an arithmetic processing device composed of a CPU and a storage device composed of one or more RAMs (Random Access Memory), a hard disk, etc., and executes in each device based on downloaded programs and data. Prescribed processing and work.

The loader 50 supplies the board|substrate accommodated in the stage (not shown) to the solder pre-coat layer forming part 90. As shown in FIG. The unloader 900 recovers the completed mounting substrate to the stand. Each of the devices from the solder pre-coat layer forming unit 90 to the board inspection device 800 includes a conveyor (board transfer line 11 ) for transferring the board. Each conveyor is configured to be able to receive a substrate from an upstream device (loader 50 side) and transfer the substrate to a downstream device (unloader 900 side).

Next, the solder precoat forming unit 90 , the solder precoat inspection device 300 , and the electronic component mounting device 500 among the respective units (each device) constituting the mounted substrate manufacturing apparatus 10 will be described below.

(Solder precoat forming part)

The structure of the solder pre-coat layer formation part 90 of Embodiment 1 is shown schematically in FIG. In this specification, the direction along the direction in which the substrate 1 is conveyed is referred to as the X axis, the vertical direction is referred to as the Z axis, and the direction perpendicular to the X and Z axes is referred to as the Y axis. In addition, let the direction along each axis be an X direction, a Y direction, and a Z direction.

The solder precoat forming part 90 is a device for forming a solder precoat part on the substrate 1 . As shown in FIG. 3 , the solder precoat layer forming unit 90 includes a control unit 95 , a solder paste supply unit 100 , a heating unit 210 , and a cooling unit 220 . These are arranged in a row along the X-axis direction on the base 101 . Inside these, a substrate conveyance unit 230 for conveying a substrate along the X-axis direction is disposed. The transfer unit 230 constitutes a part of the substrate transfer line 11 .

The solder paste supply unit 100 supplies solder paste to the substrate 1 . The heating unit 210 heats the solder paste supplied to the substrate 1 to melt the solder particles contained in the solder paste. The cooling unit 220 cools and solidifies melted solder particles (hereinafter, sometimes referred to as “molten solder”). The substrate conveyance unit 230 conveys the substrate 1 in the order of the solder paste supply unit 100 , the heating unit 210 , and the cooling unit 220 . A control unit 95 for controlling the solder precoat layer forming unit 90 is disposed inside the base 101 . The control unit 95 controls the solder paste supply unit 100 , the heating unit 210 , the cooling unit 220 , and the substrate conveying unit 230 to cause the solder precoat layer forming unit 90 to execute the operation of forming the solder precoat layer on the substrate 1 . In this way, the solder precoat layer forming part 90 of the present invention is provided integrally with the solder paste supply part 100 and the heating part 210 necessary for solder precoat layer formation.

(solder paste supply part)

The solder paste supply part 100 shown in Embodiment 1 supplies solder paste on the board|substrate 1 by screen printing. Solder paste includes particles of solder (solder alloy) and flux. In addition, solder paste may be supplied by methods other than screen printing. For easy understanding, in FIG. 3 , an example in which the substrate 1 is arranged in the solder paste supply unit 100 , the heating unit 210 , and the cooling unit 220 is shown.

The solder paste supply unit 100 includes a moving table 102, an elevating mechanism 103, a printing table 104, a printing head 113, a camera unit 115, a reticle (mask) 116, a printing table conveyor (first substrate conveying unit) 231, and a substrate carrying unit. Conveyor 234 , Substrate Relay Conveyor (Second Substrate Transfer Unit) 232 .

FIG. 4 and FIG. 5 show schematic diagrams when the peripheral parts of the printing table 104 and the printing head 113 are viewed from the substrate carrying-in conveyor 234 side.

A pair of support frames 91 are erected at intervals along the X direction on the base 101 . A movable table 102 is disposed on a base 101 sandwiched between support frames 91 . An elevating mechanism 103 for elevating and elevating the printing table 104 is disposed on the movable table 102 . The moving table 102 moves the elevating mechanism 103 in the horizontal direction (the direction along the X-axis and the Y-axis and the rotation direction in the horizontal plane with the Z-axis as the rotation axis, hereinafter the same), so that the printing table 104 moves in the horizontal direction. move. The lift mechanism 103 moves the printing table 104 along the Z axis, that is, lifts it up and down.

The printing table 104 includes a base 104 a combined with the lifting mechanism 103 . A pillar 104b is provided on the upper surface of the base 104a. A substrate guide 104c extending along the X-axis is coupled to an upper end portion of the support 104b. Inside the substrate guide 104c, a printing table conveyor 231 including a belt for conveying the substrate 1 is disposed.

The printing table conveyor 231 can transfer the substrate 1 between the substrate carry-in conveyor 234 and the substrate relay conveyor 232. The conveyor 232 is arranged to pass through the opening of the other support frame 91 . The substrate 1 carried in by the substrate carrying conveyor 234 is transferred to the printing table conveyor 231 , conveyed to the solder paste supply area PA, and held by the printing table 104 . The board|substrate 1 to which the solder paste was supplied in the printing table 104 is carried out from the solder paste supply area PA of the printing table conveyor 231, and is handed over to the board relay conveyor 232.

A back support lifting mechanism 104e is arranged on the upper surface of the base 104a. The backing lift mechanism 104e lifts and lowers the backing portion 104f that supports the substrate 1 from below. The lower surface of the substrate 1 is supported by the backing portion 104 f by raising the backing portion 104 f in a state where the substrate 1 is carried into the solder paste supply area PA of the printing table conveyor 231 .

Side grippers 104d extending along the X-axis are respectively provided on the upper surfaces of the pair of substrate guides 104c. The side clamp 104d is opened and closed by a drive mechanism (not shown). The back support 104f raises the substrate 1 to a height at which the upper surface of the substrate 1 is aligned with the upper surface of the side clamp 104d while supporting the lower surface of the substrate 1 . When the side clamps 104d are closed in a state where the heights of the substrate 1 and the side clamps 104d are aligned, both side surfaces of the substrate 1 are clamped by the side clamps 104d, and the substrate 1 is fixed. In this way, the printing table 104 holds the substrate 1 .

On the upper ends of the pair of support frames 91, a support beam 113a that supports the print head 113 is arranged so as to be movable in the Y direction via a linear motion guide mechanism 11a. One end of the support beam 113a is configured to be combined with a known print head moving mechanism 91b composed of a feed screw, a motor that rotates the feed screw, and the like. Driven by the print head moving mechanism 91b, the print head 113 is reciprocated in the Y direction which is the squeegee coating direction.

As shown in FIG. 4 , the print head 113 includes a rear squeegee 113 b and a front squeegee 113 c extending downward from the support beam 113 a. Either one of the rear scraper 113b and the front scraper 113c is lowered according to the scraping direction by driving the scraper driving part 113d provided on the upper surface of the support beam 113a.

A mask plate 116 is arranged horizontally below the print head 113 . An opening 116 a penetrating in the thickness direction is formed in the mask plate 116 (see FIG. 6 ). The solder paste supply unit 100 moves the solder paste P (described later) supplied to the upper surface of the mask plate 116 by using either the rear squeegee 113b or the front squeegee 113c, thereby carrying out printing of the solder paste P in a predetermined printing pattern. Supply to the screen printing on the substrate 1. Solder paste P includes a solder alloy and a flux.

A camera unit 115 is arranged below the mask plate 116 (see FIG. 3 ). The camera unit 115 is movable in the X direction and the Y direction by a known camera moving mechanism (not shown) fixed to the support frame 91 . The camera unit 115 incorporates a camera for imaging the substrate 1 and the mask plate 116 held on the printing table 104 . A substrate reference mark (not shown) for identifying the position of the substrate 1 is formed on the surface of the substrate 1 . On the other hand, mask reference marks or holes for the same purpose are also formed in the mask plate 116 . The control unit 95 uses the camera unit 115 to capture images of the substrate fiducial marks and the mask fiducial marks, performs image recognition on the acquired images, and calculates a relative positional shift between the substrate 1 and the mask plate 116 . Then, the moving table 102 is driven to adjust the position of the printing table 104 so that the positional deviation between the two becomes zero or the minimum, so that the substrate 1 and the mask plate 116 are aligned.

(heating part)

Next, the structure of the heating unit 210 will be described. The heating section 210 includes: a casing 213 covering the downstream side of the substrate relay conveyor 232 extending from the solder paste supply section 100; internal. Vent holes 215 are formed in the housing 213 to discharge volatile components derived from the solder paste generated by heating.

The local heating device 212 is arranged above the substrate intermediate conveyor 232 and can move in the horizontal direction by the moving mechanism 216 arranged in the casing 213 . The local heating device 212 may be any device that locally heats the substrate 1 or locally heats the solder paste P by microwave heating, induction heating, or the like. A heating area HA is provided on the substrate intermediate conveyor 232 , and the local heating device 212 locally heats a part of the solder paste P on the substrate 1 located in the heating area HA to melt the solder contained in the part of the solder paste P. The substrate heating device 211 is disposed below the substrate intermediate conveyor 232 and heats the entire substrate 1 located in the heating area HA from below. The heating by the substrate heating device 211 assists in heating the substrate 1 in order to facilitate melting of the solder by the local heating device 212 . It should be noted that, when the solder in the solder paste P can be melted without the substrate heating device 211 , the substrate heating device 211 may be omitted.

The board|substrate 1 supplied with the solder paste P by the solder paste supply part 100 is received by the board|substrate relay conveyor 232, and it conveys to the heating area HA. Then, when the melting of the solder by the local heating device 212 is completed, the substrate 1 is carried out from the heating area HA and sent to the cooling unit 220 described later. In the present embodiment, the substrate intermediate conveyor 232 is a second substrate conveying unit that conveys the substrate 1 in the heating area HA heated by the heating device. The substrate intermediate conveyor 232 extends from the solder paste supply unit 100 to the heating unit 210 and is shared by both. Thereby, the conveyance of the board|substrate 1 from the solder paste supply part 100 to the heating part 210 can be performed smoothly, and the simplification and miniaturization of a solder precoat manufacturing apparatus can be achieved. It should be noted that the substrate intermediate conveyor 232 may be composed of a plurality of substrate transport conveyors divided into a section passing through the heating area HA and other sections.

(cooling section)

Next, the configuration of cooling unit 220 will be described. The cooling unit 220 includes a casing 224 covering the substrate unloading conveyor 233 , and a cooling fan (cooling device) 221 disposed inside the casing 224 . Ventilation holes 220 a and 220 b for introducing and discharging air for cooling are formed in the casing 224 . The substrate 1 on the substrate carry-out conveyor 233 is cooled by operating the cooling fan 221 . Thereby, the solder melted by the heating unit 210 is cooled and solidified. In the present embodiment, the substrate carry-out conveyor 233 constitutes a part of the substrate conveyance unit 230 .

The formation process of the solder pre-coat layer will be described with reference to FIG. 6 . As shown in FIG. 6 , the substrate 1 includes a plate portion 1 a and a plurality of pads 1 b formed on the plate portion 1 a. The pad 1b is a part of the wiring pattern, and is a part where a solder precoat is formed.

In forming the solder precoat layer, first, as shown in FIG. 6A , a mask plate 116 is placed on the substrate 1 . As shown in FIG. 6A , a plurality of openings 116 a are formed in the mask plate 116 . The position of the opening 116a corresponds to the position of the pad 1b. However, in the example shown in Embodiment 1, the opening 116a is larger than the corresponding pad 1b. That is, the area of the opening 116a is larger than the area of the corresponding pad 1b. Therefore, if the substrate 1 is perfectly aligned with the mask plate 116 in an ideal state, the pad 1 b is located inside the opening 116 a.

When the size of the pad 1b is small, if the opening 116a having the same shape (that is, the same area) as the pad 1b is used, there may be insufficient solder particles filled in the opening 116a by screen printing. . In order to avoid this, it is conceivable to use a solder paste in which the particle size of the solder particles is very small, but in this case, it is necessary to use an expensive solder paste. Therefore, by employing the opening 116 a larger in area than the corresponding pad 1 b as in the present embodiment, the problem of insufficient solder and the problem of cost can be solved. In addition, the size of the opening part 116a may be made smaller than the size of the pad 1b.

Next, the solder paste P on the upper surface of the mask sheet 116 is moved on the mask sheet 116 using the rear squeegee 113b or the front squeegee 113c. Thereby, as shown in FIG. 6B , the portion of the solder paste P that has passed through the opening 116 a is filled in the opening 116 a.

Next, the substrate 1 is separated from the mask plate 116 by driving the elevating mechanism 103 . FIG. 6C shows the substrate 1 after the mask plate 116 is separated. Solder paste P is arranged on the pad 1b.

Thereafter, the substrate 1 is conveyed to the heating area HA in the heating unit 210 . The substrate 1 conveyed to the heating area HA is heated by the substrate heating device 211 . The heating by the substrate heating device 211 is auxiliary heating for facilitating melting of the solder by the local heating device 212 . The control part 95 heats the solder paste P of the board|substrate 1 located in the heating area HA by the local heating device 212, and melts the solder contained in the solder paste P. When the heating by the substrate heating device 211 has elapsed for a predetermined time, the control unit 95 operates the moving mechanism 216 so that the local heating device 212 is sequentially opposed to the solder paste P supplied to the substrate 1 . Thereby, the solder in the solder paste P is melted and wetted and diffused on the surface of the pad 1b. It should be noted that, even in the state where the solder paste P is connected between adjacent lands 1b, since the solder on the lands 1b is first melted by the local heating device 212, the solder between the lands 1b is also It is drawn to molten solder. Therefore, a so-called solder bridge in which melted solder connects between the pads 1 b does not occur.

When the solder melting operation by the local heating device 212 is completed, the control unit 95 operates the substrate relay conveyor 232 and the substrate carry-out conveyor 233 to convey the substrate 1 to the cooling unit 220 . The cooling unit 220 operates the cooling fan 221 to blow the air taken in from the air holes 220 a and/or the air holes 220 b to the substrate 1 to cool the substrate 1 . It should be noted that, when it is not necessary to cool the substrate 1 in particular, the cooling by the cooling unit 220 may be omitted.

The cooled substrate 1 is discharged from the cooling unit 220 by driving the substrate carry-out conveyor 233 . Thus, a solder precoat 2 is formed on the pad 1b on the substrate 1 (FIG. 6D). The board|substrate 1 on which the solder precoat layer 2 was formed is conveyed to the solder precoat inspection apparatus 300 by the board|substrate conveyance line 11.

(Solder precoat inspection device)

The structure of the solder precoat inspection device 300 is schematically shown in FIG. 7 . The inspection device 300 is a device for inspecting whether the solder pre-coat layer 2 is properly formed. The inspection apparatus 300 includes an inspection head 310 , a first substrate holding unit 320 , and a substrate transport conveyor 330 . The inspection head 310 includes a measuring device (first height position measurement unit) for measuring a height position, and a camera unit. The inspection head 310 can move in the horizontal direction by a known XY moving device (not shown). The first height position measuring unit includes a distance sensor and a displacement sensor, and measures the height position in a non-contact manner.

The substrate transfer conveyor 330 is provided on a pair of substrate guides 331 extending parallel to the X direction. The substrate conveyance conveyor 330 constitutes a part of the substrate conveyance line 11 .

The first substrate holding unit 320 includes an elevating table 321 , a plurality of back pins 322 vertically extending upward from the elevating table 321 , and an upper surface pressing member 323 . The lift table 321 is lifted up and down by the lift mechanism 324 .

It should be noted that, as long as the first substrate holding unit 320 can hold the substrate 1 , it may have a structure other than the illustrated structure, and may include other structures in addition to the illustrated structure.

The processing of the substrate 1 in the solder precoat inspection apparatus 300 will be described with reference to FIGS. 8 to 10 . First, the substrate 1 is carried into and held in the inspection apparatus 300 (step S301). The substrate 1 is conveyed by the substrate conveyance conveyor 330 to the working area W1 (first working position) inside the apparatus, and held by the first substrate holding unit 320 there. FIG. 9A shows the state before the substrate 1 is fixed, and FIG. 9B shows the state where the substrate 1 is fixed. As shown in FIG. 9B , when fixing the substrate 1 , the backing pin 322 is raised. The raised backing pins 322 abut against the lower surface of the substrate 1 to raise the substrate 1 . The upper surface presser 323 presses the upper surface of the substrate 1 raised by the back pin 322 . By raising the back pin 322 , the substrate 1 is fixed between the back pin 322 and the upper surface presser 323 .

It should be noted that the data required for processing the substrate 1 (substrate information related to the substrate 1, etc.) may be pre-stored in the storage device 302b of the inspection device 300, or may be downloaded from the storage device 20b of the information processing device 20 and stored therein. stored in the storage device 302b.

Next, the reference mark 1r of the substrate 1 is recognized under the control of the arithmetic processing unit 302a (step S302). Specifically, the substrate 1 is photographed by the camera unit, and the photographed image is subjected to recognition processing to recognize the reference mark 1r. A plan view of an example of the substrate 1 is shown in FIG. 10 . A plurality of reference marks 1r are formed on the substrate 1 . Information on the horizontal position of the substrate 1 held in the first substrate holding unit 320 , that is, the position of the measurement site set on the substrate 1 is obtained from the positions of the plurality of reference marks 1 r obtained by the recognition process. The inspection head 310 measures the height position of a measurement site set at a predetermined horizontal position, and at this time, the horizontal position of the inspection head 310 is adjusted based on information on the horizontal position of the substrate 1 .

Next, the height position measurement processing part of the arithmetic processing device 302a controls the first height position measurement part (inspection head 310) of the solder precoat inspection device 300, and the substrate 1 held by the first substrate holding part passes through the first height position. The position measurement obtains height position information PH1 related to the height position of the upper surface of the solder precoat layer 2 and height position information SH1 related to the height position of the upper surface of the substrate 1 (step S303 ). The obtained height position information PH1 and height position information SH1 are stored in the storage device 302b. At this time, the height position information PH1 and the height position information SH1 are stored together with identification information for individually identifying the substrate 1 .

In FIG. 10 , the measurement site ph1 of the height position information PH1 related to the height position of the upper surface of the solder precoat layer 2 is indicated by a black dot. The position of the measurement site ph1 is selected from, for example, a position near the center (for example, the center) of the solder precoat layer 2 . The height position information PH1 is a collection of height positions Hp of a plurality of measurement points ph1 obtained by the first height position measurement. In addition, in FIG. 10 , the measurement site sh1 of the height position information SH1 related to the height position of the upper surface of the substrate 1 is indicated by a "x" mark. The position of the measurement site sh1 is, for example, a position away from the pad 1b on which the solder precoat layer 2 is formed, and a plurality of positions are set. The height position information SH1 is a collection of height positions H1 of a plurality of measurement locations sh1 obtained by the first height position measurement. In FIG. 10 , the center of the mounting position of the electronic component is indicated by a "+" mark. In addition, although the solder resist is formed on the board|substrate 1, illustration of a solder resist is abbreviate|omitted in FIG.

An example of the inspection head 310 includes a light emitting element and a light receiving element. The light-emitting element is, for example, a laser element, and the light-receiving element is, for example, an image sensor or a photodiode (position detection element). Light emitted from the light emitting element and reflected by the object to be measured (for example, laser light) is received by the light receiving element. The light receiving element outputs a signal corresponding to the light receiving position of the light. Based on the output signal of the light receiving element, the height position of the measured part is obtained. In order to obtain an accurate height position, a reference height position as a reference for height measurement is set in the solder precoat inspection device 300, and the output signal of the corresponding light receiving element is associated with the reference height position in advance, so that accurate height position. As the height reference position, the surface of a member disposed on the inspection apparatus 300 such as the upper surface of the substrate guide 331 can be used. In addition, the height position of the measurement site may be a relative height based on a reference height position. The above-mentioned structure is known, and a known technique can be applied. In addition, it is not limited to the inspection head 310 described here, and any height measuring device can be used as long as the measurement necessary for the present invention can be performed.

Next, the pass/fail determination unit of the arithmetic processing unit 302a calculates the thickness of the solder precoat layer from the measured value (step S304). Acquisition of height position information PH1 and height position information SH1 and calculation of the thickness of the solder precoat layer will be described with reference to FIG. 11 .

In the inspection device 300, the height position Hp from the reference height H0 to the upper surface of the solder precoat layer 2 is obtained by the first height position measurement. Since the residue 2a exists on the surface of the solder pre-coat layer 2, each height position Hp may become a value which shows the height position of the upper surface of the residue 2a. However, since the residue 2a on the upper surface of the solder precoat layer 2 is a very thin film of about several microns, and light may pass through depending on the material, and may not be detected as a height position, the height position Hp is represented as The value of the height position of the solder precoat 2 is also treated without any problem.

Moreover, the height position H1 from the reference height H0 to the upper surface of the solder resist 1s on the board|substrate 1 is also acquired by 1st height position measurement. Identification information for individually identifying the substrate 1 is marked on the substrate 1 . The height position measurement information storage unit of the storage device 302b of the inspection device 300 stores a plurality of height positions Hp (height position information PH1 ) and a plurality of height positions Hs (height position information SH1 ) obtained by the first height position measurement unit, and the identification information of the substrate 1 (height position information storage process). It should be noted that as long as the height position of the upper surface of the substrate 1 can be measured, it is also possible to measure the height position of the upper surface of the substrate 1 where the solder resist 1s is not formed, instead of the height of the upper surface of the solder resist 1s. position (the same applies to the measurement of the height position of the electronic component mounting device 501).

The height position H1 is the height position of the upper surface of the board|substrate 1, and is measured in order to estimate the height position of the part where the solder pre-coat layer 2 was formed. Therefore, the measurement site sh1 is preferably selected from the vicinity of the solder precoat layer 2 . In addition, when estimating the shape of the upper surface of the substrate 1 from the measurement results, the number and positions of the measurement sites sh1 are selected so that the shape can be estimated appropriately.

The calculation unit of the arithmetic processing unit 302a of the inspection device 300 reads the height position information PH1 and the height position information SH1 from the height position measurement information storage unit. Moreover, the calculation part of the arithmetic processing device 302a calculates the thickness TP of the solder precoat layer 2 using the read value. Specifically, the thickness TP of the solder precoat layer is obtained by the following formula (1).

TP=Hp(ph1)-Hs(ph1)-HL...(1)

Here, the height position Hp(ph1) is the height from the reference height H0 to the upper surface of the solder precoat layer 2 (the upper surface of the residue 2a) at the measurement point ph1. The height position Hs(ph1) is the height from the reference height H0 to the upper surface of the substrate 1 at the measurement point ph1. In addition, HL is the thickness of the pad 1b. The thickness of the pad 1b and the thickness Ds of the solder resist 1s are acquired in advance as information on the substrate 1 .

Since the solder precoat layer 2 exists at the measurement site ph1 , it is impossible to directly measure the height position Hs(ph1) of the measurement site ph1 by the inspection head 310 . However, the height position Hs(ph1) can be approximated by the height position Hs(sh1) of the upper surface of the substrate 1 at one measurement position sh1 in the vicinity of the measurement position ph1. When the solder resist 1s is present at the measurement site sh1, the thickness TP of the solder precoat layer is obtained according to the formula (2).

TP=Hp(ph1)-[H1(sh1)-Ds]-HL···(2)

Here, H1(sh1) is the height position of the upper surface of the substrate at the measurement point sh1, and therefore Hs(sh1) can be obtained by subtracting the thickness Ds of the solder resist 1s from H1(sh1). That is, if Hs(sh1) can be regarded as Hs(ph1), it can be obtained from the height position information SH1 obtained by the first height position measurement, the height position information PH1, and the information of the substrate 1 (thickness HL of the pad 1b and Thickness Ds of solder resist 1s) Find the thickness TP of the solder precoat. Alternatively, Hs(ph1) may be approximated by an average value of height positions Hs(sh1) of the upper surface of the substrate 1 at a plurality of measurement locations sh1 in the vicinity of the measurement location ph1. In the calculation formula in this case, "H1(sh1)" in the formula (2) may be replaced by the average value of the height positions of a plurality of measurement sites sh1. Alternatively, the shape of the upper surface of the substrate 1 may be estimated from Hs(sh1) at a plurality of measurement locations sh1, and Hs(ph1) may be calculated based on the estimated shape (virtual plane). Estimation of such a virtual plane can be performed by a known method. In the calculation formula in this case, what is necessary is just to replace "Hs(ph1)" of formula (1) with Hs(ph1) estimated based on the virtual plane.

Next, the pass/fail judgment unit of the arithmetic processing device 302a judges the pass/fail of the solder precoat layer 2 based on the calculated thickness TP of the solder precoat layer 2 (step S305). When the thickness TP of the solder pre-coat layer 2 is within a predetermined appropriate range, it is judged as passing, otherwise it is judged as unacceptable. In order to correct the unqualified solder precoat 2, the substrate 1 judged to be unqualified solder precoat 2 is taken out from the manufacturing device (D1), put into the solder precoat inspection device 300 again after the correction is completed, and send to the remaining substrate 1. Process delivery. Substrates 1 judged to be acceptable for solder precoat 2 are subjected to subsequent processes.

Next, the arithmetic processing unit 302a calculates the information including the height position information PH1 and SH1, the pass/fail judgment result of the solder precoat layer 2, the calculated thickness TP of the solder precoat layer 2, and the identification information of the substrate 1 that has been inspected. The inspection result information is uploaded to the storage device 20b of the information processing device 20 (step S306). After the inspection of the solder precoat layer 2 is completed, the holding of the substrate 1 is released and the substrate 1 is carried out (step S307).

(Flux coating device)

The substrate 1 inspected by the inspection device 300 is carried into the flux coating device 400 by the substrate transfer line 11 . In the flux coating device 400 , a flux used for soldering by reflow is coated on the solder pre-coat layer 2 . The method of applying the flux is not particularly limited, and it may be applied by a known method (for example, a screen printing method). The substrate 1 coated with flux is conveyed to the electronic component mounting device 501 by the substrate conveyance line 11 .

(Electronic component mounting device)

The configuration of the electronic component mounting device 501 is schematically shown in FIG. 12 . In addition, since the electronic component mounting apparatus 502 has the same structure and the same function as the electronic component mounting apparatus 501, repeated description is abbreviate|omitted.

The electronic component mounting apparatus 501 mounts the electronic component 4 on the solder precoat 2 covered with a flux (not shown). The electronic component mounting apparatus 501 includes a substrate conveyance conveyor 521 for conveying the substrate 1 , a plurality of component supply units 580 disposed on the side of the substrate conveyance conveyor 521 , a mounting head 542 , and a second substrate holder 550 . The substrate transfer conveyor 521 is provided on a pair of substrate guides 520 extending parallel to the X direction. The substrate conveyance conveyor 521 constitutes a part of the substrate conveyance line 11 .

The substrate conveyance conveyor 521 supports both ends of the substrate 1 in the Y direction from below, and is driven by a drive source not shown to convey the substrate 1 in the X direction. The middle part in the X direction of the board|substrate conveyance conveyor 521 becomes the work area W2 (2nd work position) where the electronic component 4 is mounted on the board|substrate 1. As shown in FIG. A member (a part of the substrate holding unit 550 ) that supports the substrate 1 from below is disposed below the work area W2 .

The substrate holding portion 550 includes: a plurality of back support pins 552 that support the lower surface of the substrate 1; an elevating table 551 on which the back supporting pins 552 are disposed; an elevating portion 553 that elevates the elevating table 551; and an upper surface pressing member 554. . When the substrate 1 is carried into the work area W2 by the substrate transport conveyor 521, when the back support pin lifting part 553 is driven, the back support pin 552 pushes up the substrate 1 and lifts the upper surfaces of both ends in the Y direction. Press on the pressing part 554 on the upper surface. Thereby, the board|substrate 1 is temporarily fixed to the work area W2 in the state sandwiched from the upper and lower sides by the several back support pin 552 and a pair of upper-surface presser 554. As shown in FIG. The board conveyance conveyor 521 of the electronic component mounting apparatus 501 carries the board|substrate 1 received from upstream into the work area W2 in an apparatus, and carries out the board|substrate 1 which mounted the electronic component 4 to the downstream apparatus.

The electronic component mounting apparatus 501 includes a mounting head 542 , a moving mechanism (not shown) for moving the mounting head 542 in the X direction and the Y direction, a height position measuring unit 543 , and a known substrate camera (not shown). The height position measurement unit 543 and the substrate camera are attached to the mounting head 542 and moved in the X direction and the Y direction by a moving mechanism that moves the mounting head 542 . The mounting head 542 incorporates a plurality of suction nozzles 541 for sucking and holding the electronic components 4 , and a suction nozzle drive mechanism (not shown) for moving the suction nozzles 541 up and down and rotating around the Z-axis. The mounting head 542 holds the electronic component 4 supplied from the component supply unit 580 by the suction nozzle 541 and mounts the electronic component 4 on the solder pre-coat layer 2 coated with flux. The height position measurement unit 543 (second height position measurement unit) acquires the height related to the height position of the upper surface of the substrate 1 held by the second substrate holding unit (substrate holding unit 550 ) by the second height position measurement. The location information SH2. The height position measuring unit 543 can apply the configuration described as the first height position measurement unit.

The operation of the electronic component mounting device 501 will be described with reference to FIG. 13 . FIG. 13 shows the flow of work for mounting electronic components on one substrate 1 . First, the arithmetic processing device 501a of the electronic component mounting device 501 downloads necessary data from the storage device 20b of the information processing device 20, and updates the storage unit of the storage device 501b (step S501). The data to be downloaded may include at least data necessary for calculation of the target height position described later. In this embodiment, the inspection result information is downloaded.

Next, the substrate 1 is carried into the electronic component mounting apparatus 501 under the control of the arithmetic processing unit 501a and the like, and the substrate 1 is held by the second substrate holding unit (substrate holding unit 550) (step S502).

Next, the arithmetic processing unit 501a controls the camera of the mounting head 542 to recognize the reference mark 1r of the substrate 1 (step S503). Thus, the horizontal position of the substrate 1 held by the substrate holding unit 550 is obtained. Based on the horizontal position of the substrate 1, the height position measurement of a predetermined location and the arrangement of the electronic component 4 are performed.

Next, the substrate height position measurement processing unit of the arithmetic processing unit 501a acquires the height position related to the height position of the upper surface of the substrate 1 held by the second substrate holding unit (substrate holding unit 550 ) by the second height position measurement. Information SH2 (step S504). Acquisition of the altitude position information SH2 will be described with reference to FIG. 14 .

In the electronic component mounting apparatus 501, the height of the upper surface of the solder resist 1s at the predetermined measurement point sh2 is measured. Specifically, the height (height position H2 (sh2)) from the reference height H0 to the upper surface of the solder resist 1s is measured by the height position measuring unit 543 (second height position measurement). The height position information SH2 obtained by the second height position measurement includes height positions H2 (sh2) of a plurality of measurement points sh2.

When ensuring consistency of measurement results between the solder precoat inspection device 300 and the electronic component mounting device 500 , it is preferable that the measurement site sh2 is set at the same site as the measurement site sh1 . In addition, in order to avoid erroneous detection due to the solder flux 3 , it is preferable to set the measurement site sh2 to a site where the solder flux 3 is not applied. That is, the second height position measurement unit may perform the second height position measurement on a portion of the substrate 1 not covered with the solder flux 3 to obtain the height position information SH2. More accurate measurement can be performed by performing measurement on a portion where the solder flux 3 is not applied. The measurement site sh2 may be a position where the solder resist 1s is not formed.

Next, the calculating part of the arithmetic processing device 501a calculates the target height position NH when the suction nozzle 541 (component holding tool) descends toward the board|substrate 1 (step S505). Specifically, the arithmetic processing unit 501a calculates that the suction nozzle 541 holding the electronic component 4 mounts the electronic component 4 on the solder precoat 2 (more specifically, on the solder precoat 2 coated with the solder flux 3 ). , the target height position NH of the lowermost end of the suction nozzle 541.

The target height position NH at the mounting point including the measurement position ph1 is based on the thickness TP of the solder precoat layer 2 acquired by the solder precoat inspection device 300, and the height position Hs(ph1) of the upper surface of the substrate 1 at the measurement position ph1 , the thickness HL of the land 1b, and the thickness TE of the electronic component 4 are obtained according to the following formula (3). It should be noted that, in the case where there are multiple pads 1b at one mounting point and multiple height positions Hs(ph1) can be used, the highest height position Hs(ph1) is used and the adopted height position Hs(ph1) is measured. The thickness TP of the solder precoat layer 2 at the measurement point ph1 of ph1) is used for the calculation of the target height position NH.

NH＝Hs(ph1)+HL+TP+TE...(3)

Here, the height position Hs(ph1) of the upper surface of the substrate 1 at the measurement point ph1 can be approximated by the height position of one measurement point sh2 located near the mounting point including the measurement point ph1. The target height position NH in this case is calculated|required according to Formula (4).

NH＝[H2(sh2)--Ds]+HL+TP+TE...(4)

Here, H2(sh2) is the height position at the measurement point sh2, and Hs(sh2) can be obtained by subtracting the thickness Ds of the solder resist 1s from H2(sh2). Therefore, according to the formula (4), the electronic component mounting apparatus 500 can obtain the height position information SH2 obtained by the second height position measurement, the workpiece information (the thickness HL of the pad 1b, the thickness Ds of the solder resist 1s, the thickness of the electronic component 4 Thickness TE) and the thickness TP of the solder pre-coat layer 2 included in the inspection result information downloaded in S501 to obtain the target height position NH. It should be noted that the thickness TP of the solder precoat layer 2 is calculated using the height position information PH1 related to the height position of the upper surface of the solder precoat layer 2 and the height position information SH1 related to the height position of the upper surface of the substrate 1 . That is, if equation (2) is applied to equation (4), equation (5) can be derived.

NH＝H2(sh2)--H1(sh1)+Hp(ph1)+TE···(5)

According to the formula (5), the electronic component mounting apparatus 500 can use the height position information PH1 and the height position information SH1 obtained by the first height position measurement, the height position information SH2 obtained by the second height position measurement, and the electronic component 4 NH is calculated from the size (thickness).

It should be noted that the above formulas (3) and (4) may also include items other than height position information and workpiece information, for example, may also include addition and subtraction of any margin, and addition and subtraction are used to make the suction nozzle 541 toward the substrate 1 The term of the parameter of the elastic body deformation of the lateral press (the same applies to the other embodiments).

It should be noted that "H2(sh2)" in the formulas (4) and (5) may also be the height position Hs of the upper surface of the substrate 1 at a plurality of measurement positions sh2 in the vicinity of the mounting point of the measurement position ph1. (sh2) to approximate the average value. Alternatively, Hs(ph1) may be calculated based on a virtual plane estimated from the height positions Hs(sh2) at a plurality of measurement locations sh2, and may be applied to the formula (3). Estimation of such a virtual plane can be performed by a known method. In addition, the inspection result information used in Formula (3) - Formula (5) uses the inspection result information containing the identification information of the board|substrate 1 held in the 2nd board|substrate holding part (substrate holding|maintenance part 550).

Next, the electronic component mounting processing section of the arithmetic processing device 501a controls the lifting operation of the suction nozzle 541 (component holding tool) based on the calculated target height position, and mounts the electronic component 4 on the solder precoat layer 2 (more specifically: on the solder pre-coat layer 2 coated with the solder flux 3) (step S506). Specifically, the electronic component mounting processing unit of the arithmetic processing device 501a drives the nozzle driving mechanism based on the target height position NH, thereby performing an operation of lowering the suction nozzle 541 holding the electronic component 4 toward the mounting point of the substrate 1 . By controlling the operation of the suction nozzle 541 in this way, the electronic component 4 can be discharged at an appropriate height position. As a result, mounting defects of electronic components 4 can be reduced.

Solder flux 3 is applied to solder precoat layer 2 of substrate 1 carried into electronic component mounting apparatus 501 . Sometimes it is difficult to accurately measure the height position of the upper surface of the solder pre-coat layer 2 coated with the solder flux 3 . In Embodiment 1, since the height position of the upper surface of solder precoat layer 2 is measured in the state before solder flux 3 is applied, the thickness of solder precoat layer 2 can be calculated more accurately. Therefore, according to the manufacturing apparatus and manufacturing method of Embodiment 1, the electronic component 4 can be mounted on the solder pre-coat layer 2 with good yield and precision.

After the mounting of the electronic component 4 in the electronic component mounting apparatus 501 is completed, the holding of the substrate 1 is released, and the substrate 1 is carried out from the electronic component mounting apparatus 501 (step S507 ). In this way, the processing of the substrate 1 in the electronic component mounting apparatus 501 ends. In the following electronic component mounting apparatus 502, the electronic component 4 is mounted similarly.

The substrate 1 on which all electronic components 4 have been mounted is conveyed to the mounted state inspection device 600 by the substrate conveyance line 11 . The mounting state inspection device 600 inspects the mounting state of the electronic component 4 on the substrate 1 . The inspection items include misalignment, poor posture, and presence or absence of the electronic component 4 . The mounting state inspection device 600 recognizes the mounting state of the electronic component 4 such as the mounting position, posture, and presence or absence using an optical measuring device such as a camera or a three-dimensional measuring machine, and judges whether or not a predetermined criterion is satisfied. When the board|substrate 1 in which the electronic component 4 which was not mounted suitably exists is found, this board|substrate 1 may be excluded from a subsequent process. Alternatively, after the mounting defect of the electronic component 4 is corrected, the subsequent processing may be continued.

The inspected substrate 1 is conveyed to the reflow apparatus 700 by the substrate conveyance line 11 . The reflow apparatus 700 heats the board|substrate 1 mounted with the electronic component 4, melts the solder pre-coat layer 2, and solders the electronic component 4 to the pad 1b. In this way, the mounting substrate 1x on which the electronic components 4 are mounted is manufactured.

The mounted substrate 1 x that has been processed in the reflow soldering apparatus 700 is conveyed to the substrate inspection apparatus 800 by the substrate conveyance line 11 and inspected. The mounted substrate 1 x that has been inspected by the substrate inspection apparatus 800 is conveyed to the unloader 900 by the substrate conveyance line 11 . The unloader 900 recovers the completed mounting substrate 1x to the stand.

The overall manufacturing process of the mounting substrate 1 x will be described with reference to FIGS. 15A to 15E . First, the substrate 1 shown in FIG. 15A is prepared. The substrate 1 includes pads 1b. Solder resist 1 s is formed on the surface of substrate 1 .

Next, as shown in FIG. 15B, a solder precoat layer 2 is formed on the pad 1b. The solder precoat 2 includes residues 2a on the surface. It should be noted that the substrate 1 held by the substrate holding portion may be warped or otherwise deformed. Therefore, in order to accurately mount the electronic component 4 on the electronic component mounting apparatus 501 , it is preferable to calculate the target height position in consideration of the warpage of the substrate 1 . According to the manufacturing apparatus and manufacturing method of the present invention, the target height position can be calculated in consideration of the warpage of the substrate 1 .

Next, as shown in FIG. 15C , solder flux 3 is applied on solder precoat layer 2 . Next, as shown in FIG. 15D , the electronic component 4 is mounted on the solder precoat layer 2 coated with the solder flux 3 . Next, as shown in FIG. 15E , the solder precoat layer 2 is melted and then solidified to solder the land 1 b and the terminal portion of the electronic component 4 via the solder 2 x . In this way, the mounting substrate 1x on which the electronic components 4 are mounted is manufactured.

(Embodiment 2)

In Embodiment 2, an example of a manufacturing apparatus (D2) and an example of a manufacturing method (M2) are demonstrated. The mounting substrate manufacturing apparatus and mounting substrate manufacturing method of Embodiment 2 differ from the apparatus and method of Embodiment 1 only in the method of obtaining the target height position in the electronic component mounting portion, and thus redundant descriptions are omitted. The structure of the mounted substrate manufacturing apparatus of the second embodiment can also be applied with the same structure as that of the mounted substrate manufacturing apparatus 10 of the first embodiment.

The manufacturing apparatus according to Embodiment 2 includes a height position measurement unit that acquires height position information PH2 related to the height position of the upper surface of the solder precoat layer by height position measurement on the substrate held by the substrate holding unit. As the substrate holding unit and the height position measuring unit, the board holding unit (second substrate holding unit 550 ) and the height position measuring unit (height position measuring unit 543 ) of the electronic component mounting apparatus 501 according to Embodiment 1 can be used. That is, the electronic component mounting part (electronic component mounting apparatus 500 ) of the manufacturing device 10 of Embodiment 1 can be applied to the electronic component mounting part in the manufacturing apparatus of Embodiment 2.

The operation (electronic component mounting process) in the electronic component mounting apparatus 501 will be described with reference to FIG. 16 . In addition, the operation|movement in the electronic component mounting apparatus 502 may also be made the same.

First, the arithmetic processing device 501a of the electronic component mounting device 501 downloads necessary data and updates the storage unit of the storage device 501b (step S1501). The downloaded data includes solder precoat inspection results, ie pass/fail judgment results. However, in Embodiment 2, unlike Embodiment 1, the value related to the thickness of the solder precoat layer and the data related to the height position obtained by the first height position measurement are unnecessary for the calculation of the target height position. . Therefore, these values may not be downloaded.

Next, the substrate 1 is carried into the electronic component mounting apparatus 501 under the control of the arithmetic processing unit 501a, and the substrate 1 is held by the second substrate holding unit (substrate holding unit 550) (step S1502). Next, the arithmetic processing device 501a controls the camera of the mounting head 542 to recognize the reference mark 1r of the substrate 1 (step S1503). Step S1502 and step S1503 are the same steps as step S502 and step S503.

Next, the substrate height position measurement processing unit of the arithmetic processing unit 501a acquires height position information PH2 ( Step S1504). Acquisition of the altitude position information PH2 will be described with reference to FIG. 17 .

In Embodiment 2, the height position Hp (ph1) of the upper surface (the upper surface of the residue 2a) of the solder precoat layer 2 coated with the solder flux 3 is obtained by the height position measuring unit 543 at the measurement point ph1. . The height position Hp(ph1) is a height based on the reference height H0. The height position Hp(ph1) is height position information PH2. The position of the measurement site ph1 is selected, for example, from positions near the center (for example, the center) of the solder precoat layer 2 . As described above, the height position measurement unit 543 may perform measurement using laser light.

Next, the calculating part of the arithmetic processing device 501a calculates the target height position NH when the suction nozzle 541 (component holding tool) descends toward the board|substrate 1 (step S1505). For example, the arithmetic processing unit 501a may calculate that the suction nozzle 541 holding the electronic component 4 moves the electronic component 4 onto the solder precoat layer 2 (more specifically, the solder precoat layer coated with the solder flux 3 ). 2) and release the electronic component 4, the target height position NH of the lowermost end of the suction nozzle 541.

The target height position NH at the measurement point ph1 is obtained by the following formula (6) from the measured height position Hp(ph1) and the thickness TE of the electronic component 4 .

NH=Hp(ph1)+TE...(6)

In the manufacturing apparatus and manufacturing method of Embodiment 2, it is not necessary to measure the height position of the upper surface of the substrate 1 in the electronic component mounting apparatus 501 . Therefore, the time required for mounting the electronic component can be shortened.

Next, as shown in FIG. 18 , the electronic component mounting processing unit of the arithmetic processing device 501 a controls the lifting operation of the suction nozzle 541 (component holding tool) based on the calculated target height position NH, and mounts the electronic component 4 on the solder precoat layer 2 . (more specifically, on the solder pre-coat layer 2 coated with the solder flux 3) (step S1506). Step S1506 is the same as step S506.

After the electronic component 4 is mounted on the electronic component mounting apparatus 501, the holding of the substrate 1 is released, and the substrate 1 is carried out from the electronic component mounting apparatus 501 (step S1507). Step S1507 is the same as step S507. In this way, the mounting of the electronic component 4 in the electronic component mounting apparatus 501 is implemented.

The substrate 1 on which the electronic component 4 is mounted is processed in the same manner as in the first embodiment. In this way, also in Embodiment 2, the mounting board 1x on which the electronic component 4 is mounted is manufactured.

Thus, in the manufacturing apparatus ( D2 ) of Embodiment 2, the height position Hp of the upper surface of the solder precoat layer 2 covered with the solder flux 3 is obtained by the height position measuring unit 543 . Therefore, the solder flux 3 that can be used in the manufacturing device ( D2 ) is limited to the solder flux that easily transmits light for height position measurement. This point is disadvantageous for the manufacturing device ( D1 ) of Embodiment 1, but it is advantageous for the manufacturing device ( D1 ) in terms of productivity because the height position of the solder precoat layer 2 is measured by the electronic component mounting device 500 .

Industrial Applicability

This embodiment can be utilized in a mounting substrate manufacturing apparatus and a mounting substrate manufacturing method.

The present invention has been described with respect to preferred embodiments at the current point in time, but this disclosure should not be construed limitedly. For those skilled in the art pertaining to the technical field of the present invention, various modifications and changes will definitely become clear from reading the above disclosure. Therefore, without departing from the essence and scope of the present invention, it should be interpreted that the additional technical solutions include all modifications and changes.

Explanation of reference signs

1: Substrate

1b: Pad

1x: mounting substrate

2: Solder precoat

2a: Residue

2x: Solder

3: Solder Flux

4: Electronic components

10: Installation of substrate manufacturing equipment

11: Substrate handling line

90: Solder precoat formation part

100: Solder paste supply part

210: heating department

320: first substrate holding part

500, 501, 502: electronic component mounting device (electronic component mounting part)

550: the second substrate holding part.

Claims (18)

1. A mounting substrate manufacturing apparatus for manufacturing a mounting substrate comprising a substrate having pads and electronic components soldered to the pads, wherein, The mounting substrate manufacturing device includes: a substrate transfer line that transfers the substrate having the pads; a solder precoat forming part that forms a solder precoat on the pad; a first substrate holding section holding the substrate conveyed from the solder pre-coat layer forming section by the substrate conveying line; A first height position measurement unit for obtaining height position information related to a height position of an upper surface of the solder precoat layer by first height position measurement of the substrate held by the first substrate holding unit. PH1 and height position information SH1 related to the height position of the upper surface of the substrate; a second substrate holding section holding the substrate conveyed from the first substrate holding section by the substrate conveying line; a second height position measurement unit that acquires height position information SH2 related to the height position of the upper surface of the substrate held by the second substrate holding unit by second height position measurement; an electronic component mounting section that mounts the electronic component on the solder precoat of the substrate held by the second substrate holding section using a component holding tool; and A calculation unit that calculates the component holding tool that holds the electronic component by using the height position information PH1 , the height position information SH1 , and the height position information SH2 to mount the electronic component on the solder preparation unit. Coating is positioned on the target height while descending towards the substrate, The electronic component mounting unit mounts the electronic component on the solder pre-coat layer by controlling the lifting operation of the component holding tool based on the target height position. 2. The mounting substrate manufacturing apparatus according to claim 1, wherein: The mounting substrate manufacturing apparatus further includes a height position measurement information storage unit storing the height position information PH1 and the height position information SH1 obtained by the first height position measurement unit, The calculation unit reads the height position information PH1 and the height position information SH1 from the height position measurement information storage unit. 3. The mounting board manufacturing apparatus according to claim 2, wherein: Identification information for individually identifying the substrate is marked on the substrate, The first altitude position measurement unit stores the altitude position information PH1 and the altitude position information SH1 obtained by the first altitude position measurement together with the identification information in the altitude position measurement information storage. department, The calculation unit reads the identification information, the height position information PH1 , and the height position information SH1 from the height position measurement information storage unit. 4. The mounted substrate manufacturing apparatus according to claim 1, wherein: The solder precoat forming part includes: a solder paste supply unit that supplies solder paste onto the pad; and and a heating section that heats the solder paste, thereby forming the solder precoat layer on the pad. 5. The mounting substrate manufacturing apparatus according to claim 4, wherein: the solder precoat has residues of the solder paste on the surface, The first height position measuring unit measures the height of the upper surface of the residue. 6. The mounting board manufacturing apparatus according to any one of claims 1 to 5, wherein: The mounting substrate manufacturing apparatus further includes a solder flux application unit disposed between the first substrate holding unit and the second substrate holding unit, the solder flux coating section coats a solder flux on the solder pre-coat layer of the substrate, The second height position measurement unit acquires the height position information SH2 by performing the second height position measurement on a portion of the substrate not covered with the solder flux. 7. A mounting substrate manufacturing apparatus for manufacturing a mounting substrate including a substrate having pads and electronic components soldered to the pads, wherein, The mounting substrate manufacturing device includes: a substrate transfer line that transfers the substrate having the pads; a solder precoat forming part that forms a solder precoat on the pad; a substrate holding section holding the substrate conveyed from the solder precoat forming section by the substrate conveying line; a height position measurement unit that acquires height position information PH2 related to the height position of the upper surface of the solder precoat layer by measuring the height position of the substrate held by the substrate holding unit; an electronic component mounting section that mounts the electronic component on the solder precoat of the substrate held by the substrate holding section using a component holding tool; and A calculation unit that calculates a target height position when the component holding tool holding the electronic component is lowered toward the substrate in order to mount the electronic component on the solder pre-coat layer using the height position information PH2 , The electronic component mounting unit mounts the electronic component on the solder pre-coat layer by controlling the lifting operation of the component holding tool based on the target height position. 8. The mounting substrate manufacturing apparatus according to claim 7, wherein: The mounting board manufacturing apparatus further includes a solder flux applying unit disposed between the solder precoat forming unit and the board holding unit, the solder flux coating section coats a solder flux on the solder pre-coat layer of the substrate, The height position measuring unit acquires the height position information PH2 by measuring the height position of the solder pre-coat layer covered with the solder flux. 9. The mounting substrate manufacturing apparatus according to claim 8, wherein: The height position measurement unit performs the height position measurement using laser light. 10. A mounting substrate manufacturing method for manufacturing a mounting substrate including a substrate having pads and electronic components soldered to the pads, wherein, The manufacturing method of the mounting substrate sequentially includes: A solder precoat layer forming step of forming a solder precoat layer on the pad; In the first height position measuring step, in the first height position measurement step, the substrate on which the solder pre-coat layer is formed is held by the first substrate holding part, by the first height position measurement. Obtaining height position information PH1 related to the height position of the upper surface of the solder precoat layer and height position information SH1 related to the height position of the upper surface of the substrate; In the second height position measurement step, in the second height position measurement step, the substrate passing through the first height position measurement step is held by the second substrate holding part, and the substrate is passed through the second height position. Obtaining height position information SH2 related to the height position of the upper surface of the substrate by position measurement; and an electronic component mounting step in which the electronic component is mounted on the solder precoat of the substrate held by the second substrate holding portion using a component holding tool, A calculation step is further included between the second height position measurement step and the electronic component mounting step. In the calculation step, the height position information PH1, the height position information SH1, and the height position information information SH2 to calculate a target height position when the component holding tool holding the electronic component is lowered toward the substrate in order to mount the electronic component on the solder precoat layer, In the electronic component mounting step, the electronic component is mounted on the solder precoat layer by controlling the lifting motion of the component holding tool based on the target height position calculated in the calculating step. 11. The mounting substrate manufacturing method according to claim 10, wherein, The mounting substrate manufacturing method further includes a height position information storage step of storing the height position information PH1 and the height position information SH1 obtained in the first height position measurement step in a Altitude position measurement information storage unit, In the calculation step, the height position information PH1 and the height position information SH1 are read from the height position measurement information storage unit. 12. The mounting substrate manufacturing method according to claim 11, wherein, Identification information for individually identifying the substrate is marked on the substrate, The height position information PH1 and the height position information SH1 obtained by the first height position measurement in the first height position measurement step are stored in the height position measurement together with the identification information. Information Storage Department, In the calculation step, the identification information, the height position information PH1 , and the height position information SH1 are read from the height position measurement information storage unit. 13. The mounting substrate manufacturing method according to any one of claims 10 to 12, wherein: Described solder precoat formation process comprises: a solder paste supplying step of supplying solder paste onto the pad; and and a heating step of forming the solder pre-coat layer on the pad by heating the solder paste. 14. The mounting substrate manufacturing method according to claim 13, wherein, the solder precoat has residues of the solder paste on the surface, In the first height position measuring step, the height of the upper surface of the residue is measured. 15. The mounting substrate manufacturing method according to any one of claims 10 to 14, wherein: A solder flux coating step is further included between the first height position measurement step and the second height position measurement step, The solder flux coating step is a step of coating a solder flux on the solder pre-coat layer of the substrate, In the second height position measurement step, the height position information SH2 is obtained by performing the second height position measurement on a portion of the substrate not covered with the solder flux. 16. A mounting substrate manufacturing method for manufacturing a mounting substrate including a substrate having pads and electronic components soldered to the pads, wherein, The manufacturing method of the mounting substrate sequentially includes: A solder precoat layer forming step of forming a solder precoat layer on the pad; A height position measuring step in which the height of the solder precoat layer is obtained by measuring the height position while the substrate on which the solder precoat layer is formed is held by a substrate holder. height position information PH2 related to the height position of the upper surface of the layer; and an electronic component mounting step of mounting the electronic component on the solder precoat of the substrate held by the substrate holding portion using a component holding tool, Between the height position measurement step and the electronic component mounting step, a calculation step is further included in which the component holding tool holding the electronic component is calculated using the height position information PH2 so as to a target height position when the electronic component is mounted on the solder pre-coat layer and descends toward the substrate, In the electronic component mounting step, the electronic component is mounted on the solder pre-coat layer by controlling the lifting operation of the component holding tool based on the target height position. 17. The mounting substrate manufacturing method according to claim 16, wherein, A solder flux coating step is further included between the solder precoat layer forming step and the electronic component mounting step, The solder flux coating step is a step of coating a solder flux on the solder pre-coat layer of the substrate, In the height position measuring step, the height position information PH2 is acquired by performing the height position measurement on the solder pre-coat layer covered with the solder flux. 18. The mounting substrate manufacturing method according to claim 17, wherein, In the height position measurement step, the height position measurement is performed using laser light.

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