CN103283316B - Substrate production line and inspection machine data creation method - Google Patents

Abstract

The present invention provides a substrate production line and an inspection machine data generation method capable of automatically generating top surface shape data of electronic components. The substrate production line (9) is equipped with: an electronic component mounting machine (1), which mounts electronic components (80, 81) on the substrate (Bf, Br) based on the mounting machine data; and a substrate appearance inspection machine (7), which is arranged on the electronic component The downstream side of the mounting machine 1 inspects the appearance of the boards (Bf, Br) on which the electronic components (80, 81) are mounted based on the inspection machine data. The substrate production line (9) above is characterized in that the mounting machine data includes bottom surface shape data of the electronic component (80, 81), and the inspection machine data includes the upper surface of the electronic component (80, 81) automatically generated based on the bottom surface shape data. shape data.

Description

Substrate production line and inspection machine data generation method

technical field

The present invention relates to a substrate production line including an electronic component mounting machine and a substrate appearance inspection machine, and a method for generating inspection machine data of the substrate appearance inspection machine.

Background technique

A plurality of electronic component mounting machines and board visual inspection machines are arranged in a row on the board production line. In a plurality of electronic component mounting machines, electronic components are mounted in stages on boards being conveyed. Substrates mounted with electronic components are inspected by a substrate visual inspection machine.

The mounting machine data of the electronic component mounting machine and the inspection machine data of the board appearance inspection machine are generated separately. Therefore, the work of generating this data is complicated. Furthermore, when the type of the electronic component is changed or the mounting coordinates of the electronic component on the substrate are changed, the mounter data and the inspection machine data are updated independently, respectively. The update operation of this data is also complicated.

Patent Document 1 discloses a substrate production line that generates inspection machine data of a substrate appearance inspection machine using mounting machine data of an electronic component mounting machine. As the mounting machine data of the electronic component mounting machine, mounted component data and mounting position data are exemplified. As the inspection machine data of the substrate appearance inspection machine, inspection component data, mounting position data, and position tolerance data are exemplified. The inspection machine data is stored in the database of the substrate visual inspection machine.

The generation of inspection machine data is carried out in the following steps. First, when the board production line starts up, the board visual inspection machine accesses the electronic component mounting machine. Furthermore, data required for inspection (mounted component data, mounting position data) is acquired. Next, based on the acquired data, the inspection machine data corresponding to the data is fetched from the database (that is, the mounting machine data cannot be directly used as the inspection machine data) to generate inspection machine data. Based on the inspection machine data, the board appearance inspection machine inspects the mounting state of components mounted on the board.

Patent Document 1: Japanese Patent Laid-Open No. 2006-339260

Contents of the invention

According to the substrate production line described in Patent Document 1, inspection machine data (inspection component data, mounting position data) of a substrate appearance inspection machine can be generated using mounting machine data of an electronic component mounting machine. Therefore, the work of generating and updating data is simple.

In addition, in the visual inspection of the board, the shape of the electronic component viewed from above is inspected. Therefore, the top surface shape data of the electronic component is included in the inspection machine data. On the other hand, in an electronic component mounting machine, when mounting an electronic component on a board, the electronic component is sucked from above by a suction nozzle. Furthermore, the adsorption state of the electronic component seen from below was photographed. In this way, as an electronic component mounting machine, the shape data of the upper surface of the electronic component is not originally required. Therefore, the top surface shape data of electronic components are not included in the mounting machine data. Therefore, the top surface shape data necessary for the visual inspection of the board cannot be obtained from the mounter data. In addition, in Patent Document 1, although there are examples related to inspection component data and mounting position data, there is no description related to top surface shape data.

The substrate production line and inspection machine data generation method of the present invention are made in view of the above-mentioned problems. An object of the present invention is to provide a substrate production line and an inspection machine data generation method capable of automatically generating top surface shape data of electronic components.

(1) In order to solve the above-mentioned problems, the substrate production line of the present invention includes: an electronic component mounting machine that mounts electronic components on the substrate based on mounting machine data; and a substrate appearance inspection machine that is arranged on the downstream side of the electronic component mounting machine, and The appearance of the substrate on which the electronic component is mounted is inspected based on inspection machine data, wherein the substrate production line is characterized in that the mounting machine data includes bottom surface shape data of the electronic component, and the inspection machine data includes bottom surface shape data based on the bottom surface shape data. Automatically generated top surface shape data of the electronic component.

As described above, in the electronic component mounting machine, when the electronic component is mounted on the board, the electronic component is sucked from above by the suction nozzle. In order to check the suction state from below, the electronic component mounting machine data includes the bottom surface shape data of the electronic component.

According to the substrate production line of the present invention, the upper surface shape data necessary for the visual inspection of the substrate is automatically generated from the lower surface shape data. Therefore, the operator does not need to generate the upper surface shape data and the lower surface shape data separately. Therefore, the work of generating data is simple. Furthermore, when the type of electronic component is changed, it is not necessary to update the bottom surface shape data and the top surface shape data independently. Therefore, the data update operation is simple.

(2) Preferably, based on the configuration of (1) above, it is configured as follows: the above-mentioned upper surface shape data refers to the above-mentioned bottom surface shape data except those related to the parts that are horizontally inward from the outer edge of the main body of the electronic component. The data related to the outer edge of the main body and the parts on the outer side in the horizontal direction than the outer edge are generated. Here, "main body" refers to an element body of an electronic component.

Components such as leads, electrode pads, and solder balls are arranged on the lower surface of the main body of the electronic component. Therefore, data related to these components is included in the lower surface shape data. On the other hand, these components are not arranged on the upper surface of the main body of the electronic component. Furthermore, among these components, only the outer edge of the main body and the components protruding outward in the horizontal direction from the outer edge of the main body can be recognized when the electronic component is viewed from above. That is, only the outer edge of the main body and the data related to the components horizontally outside the outer edge of the main body are required to generate the top surface shape data. In this regard, according to this configuration, only data related to the outer edge of the main body and the components on the outer side in the horizontal direction than the outer edge of the main body can be extracted to generate the top surface shape data.

(3) Preferably, based on the configuration of (1) or (2) above, the mounting machine data includes component type data related to the type of the electronic component, and the inspection machine data includes component type data based on the component type data. And automatically generated data on the lighting conditions of the inspection machine when the electronic component is photographed from above.

Electronic components are photographed from above during visual inspection of substrates. At this time, light is irradiated to the electronic component. According to this configuration, the inspection machine lighting condition data is generated based on the component type data. Therefore, it is possible to automatically change the lighting conditions of the inspection machine at the time of the visual inspection of the board according to the type of the electronic component. That is, it is possible to automatically apply the optimum lighting conditions of the inspection machine to the electronic components to be inspected.

(4) Preferably, based on any one of the configurations (1) to (3) above, when the installation machine data is updated, the updated content is automatically reflected in the inspection machine data. According to this configuration, when the type of electronic component is changed, it is not necessary to update the mounter data and the inspection machine data independently. Therefore, the data update operation is simple.

(5) In order to solve the above problems, the inspection machine data generation method of the present invention is an inspection machine data generation method for a substrate production line including: an electronic component mounting machine for mounting electronic components on a substrate based on the mounting machine data; and a substrate An appearance inspection machine arranged downstream of the electronic component mounting machine, and inspects the appearance of the substrate on which the electronic component is mounted based on inspection machine data, wherein the inspection machine data generation method is characterized in that based on the automatically generate the upper surface shape data of the electronic component included in the inspection machine data.

According to the inspection machine data generation method of the present invention, the upper surface shape data necessary for the visual inspection of the substrate is automatically generated from the lower surface shape data. Therefore, the operator does not need to generate the upper surface shape data and the lower surface shape data separately. Therefore, the work of generating data is simple.

Invention effect

According to the present invention, it is possible to provide a substrate production line and an inspection machine data generation method capable of automatically generating top surface shape data of electronic components.

Description of drawings

FIG. 1 is a schematic diagram of a substrate production line which is an embodiment of the present invention.

FIG. 2 is a perspective view of an electronic component mounting machine disposed on the substrate production line.

Fig. 3 is a plan view of the electronic component mounting machine.

Fig. 4 is a plan view of a substrate visual inspection machine disposed on the substrate production line.

Fig. 5(a) is a bottom view of an electronic component with solder balls. FIG. 5( b ) is a top view of the electronic component.

Fig. 6(a) is a bottom view of an electronic component with leads. FIG. 6( b ) is a top view of the electronic component.

Explanation of reference signs

1: Electronic component mounting machine

2: base

3: Module

4: Belt feeder

5: Device Tray

7: Substrate visual inspection machine

9: Substrate production line

30: Substrate handling device

31: XY manipulator

32: Mounting head

33: Mark Camera

34: Part Camera

35: Substrate lifting device

40: Tape

41: Tape

42: With reel bracket

60: Install machine-side control device

61: Installing the machine-side image processing device

70: Check machine side control device

71: Check the machine-side image processing device

72: base

73: Substrate handling device

74: XY Manipulator

75: Check Head

80: Electronic components

81: Electronic components

90: screen printing machine

91: Printing inspection machine

92: Reflow oven

93: Integrated control device

303f: Transportation Department

303r: Transportation Department

310: Y direction slider

311: Slider in X direction

312: Y direction guide rail

313: X direction guide rail

320: Nozzle

350f: lifting part

350r: lifting part

730f: conveyor belt

740: Y direction slider

741: X direction slider

742: Y direction guide rail

743f: X direction guide rail

743r: X direction guide rail

744: Ball screw unit for movement in the X direction

745: Ball screw unit for movement in the Y direction

800: subject

801: Solder ball (component)

810: subject

811: Leads (components)

811a: Front part

811b: Basic part

900: Press Side Controls

910: Check machine side controls

920: furnace side control device

B1: Part supply location

Bf: Substrate

Br: Substrate

F: floor

Detailed ways

Hereinafter, an embodiment of the substrate production line and inspection machine data generation method of the present invention will be described.

＜Structure of substrate production line＞

First, the configuration of the substrate production line of the present embodiment will be described. FIG. 1 shows a schematic diagram of a substrate production line in this embodiment. As shown in FIG. 1 , the board production line 9 includes a screen printing machine 90 , a printing inspection machine 91 , twelve electronic component mounting machines 1 , a board appearance inspection machine 7 , and a reflow furnace 92 . The substrate is conveyed from the left side (upstream side) to the right side (downstream side) on the substrate line 9 .

The substrate production line 9 is controlled by an integrated control device 93 . The integrated control device 93 communicates with the printing machine side control device 900 of the screen printing machine 90, the inspection machine side control device 910 of the printing inspection machine 91, and the mounting machine side control devices 60 of the twelve electronic component mounting machines 1 via communication lines. The inspection machine-side control device 70 of the substrate appearance inspection machine 7 and the furnace-side control device 920 of the reflow furnace 92 are electrically connected.

<Structure of Electronic Component Mounting Machine 1>

Next, the configuration of the electronic component mounting machine 1 will be described. FIG. 2 shows a perspective view of an electronic component mounting machine disposed on the substrate production line of the present embodiment. FIG. 3 shows a plan view of the electronic component mounting machine. In FIG. 2 this is shown through the housing of the module 3 . In FIG. 3 , the case of the module 3 is omitted for illustration. Furthermore, the Y-direction slider 310, the Y-direction rail 312, and the X-direction rail 313 are indicated by single-dot chain lines, and the suction nozzle 320 and the marking camera 33 are indicated by dotted lines. Moreover, hatching is attached|subjected to board|substrate Bf, Br, and component supply position B1. As shown in Fig. 2 and Fig. 3, the electronic component mounting machine 1 includes a base 2, a module 3, a plurality of tape feeders 4, an equipment tray 5, a mounting machine side control device 60 (see Fig. 1 ), and a mounting machine side image processing device 61 (see FIG. 1 ).

(base 2, module 3)

The base 2 is placed on the floor F of the factory. The module 3 is detachably arranged on the upper surface of the base 2 . The module 3 includes a substrate transfer device 30 , an XY robot 31 , a mounting head 32 , a marking camera 33 , a component camera 34 , and a substrate elevating device 35 .

The board|substrate conveyance apparatus 30 is provided with a pair of front-back conveyance part 303f, 303r. The conveyance parts 303f and 303r each have a pair of conveyor belts. The front board Bf and the rear board Br are independently transported from left to right, wherein the front board Bf is transported by the transport unit 303f and the rear board Br is transported by the transport unit 303r. The front-back direction width of conveyance part 303f, 303r can be changed. The conveyor belt has a function as a substrate carrier for transferring the substrate.

The substrate elevating device 35 includes a pair of front and rear elevating parts 350f and 350r. The front and rear pair of lift parts 350f and 350r are respectively movable in the up and down direction. The front board Bf and the rear board Br are raised and lowered independently, wherein the front board Bf is raised and lowered by the raising and lowering unit 350f, and the rear board Br is raised and lowered by the raising and lowering unit 350r.

The X direction corresponds to the left-right direction, the Y direction corresponds to the front-rear direction, and the Z direction corresponds to the up-down direction. The XY manipulator 31 includes a Y direction slider 310 , an X direction slider 311 , a pair of left and right Y direction guide rails 312 , and a pair of up and down X direction guide rails 313 .

A pair of left and right Y-direction guide rails 312 is arranged on the upper surface of the housing inner space of the module 3 . The Y-direction slider 310 is attached to a pair of left and right Y-direction rails 312 so as to be slidable in the front-rear direction. A pair of upper and lower X direction guide rails 313 is disposed on the front surface of the Y direction slider 310 . The X-direction slider 311 is attached to a pair of upper and lower X-direction rails 313 so as to be slidable in the left-right direction.

The installation head 32 is installed on the X-direction slider 311 . Therefore, the mounting head 32 can be moved in the front, rear, left, and right directions by the XY robot 31 . A suction nozzle 320 is replaceably attached below the attachment head 32 . The suction nozzle 320 can move downward relative to the mounting head 32 . Therefore, the suction nozzle 320 can be moved in front, rear, left, right, up and down directions by the XY manipulator 31 and the mounting head 32 .

The marker camera 33 is mounted on the X-direction slider 311 together with the mounting head 32 . The marker camera 33 can be moved in front, rear, left, and right directions by the XY robot 31 . The mark camera 33 has a function as an imaging device for imaging the boards Bf, Br, and marks for positioning electronic components.

The parts camera 34 is arrange|positioned ahead of the conveyance part 303f. The suction nozzle 320 (that is, the mounting head 32 ) on which the electronic component is adsorbed passes above the component camera 34 . At this time, the electronic components of the suction nozzle 320 are photographed by the component camera 34 . That is, the component camera 34 has a function as an imaging device which images the electronic component of the suction nozzle 320 .

The equipment tray 5 is mounted on the front opening of the module 3 . The plurality of tape feeders 4 are each detachably attached to a groove portion (not shown) of the equipment tray 5 . The tape feeder 4 includes a tape 40 , a reel 41 , and a reel holder 42 . The material tape 40 is wound on the reel 41 . On the tape 40 , electronic components are sealed at predetermined intervals in the longitudinal direction. However, when reaching the component supply position B1 mentioned later, an electronic component is exposed so that it can be taken out from above. The reel 41 is accommodated in the reel holder 42 .

The mounter-side control device 60 shown in FIG. 1 can comprehensively control the above-mentioned substrate transfer device 30, XY manipulator 31, mounting head 32, marking camera 33, part camera 34, substrate elevating device 35, and tape feeder 4. .

A total of twelve storage units of the mounting machine side control device 60 store substrate data (substrate dimension data, substrate configuration data, etc.), component data (bottom surface shape data, component type data, mounting machine lighting condition data, etc.) ), mark data, installation coordinate data, etc. as the installation machine data.

A total of twelve mounting machine-side image processing devices 61 shown in FIG. 1 process images of markings for positioning captured by the marking camera 33 . Furthermore, a total of twelve mounting-machine-side image processing devices 61 each process the image of the electronic component captured by the component camera 34 .

<Structure of Substrate Appearance Inspection Machine 7>

Next, the configuration of the substrate appearance inspection machine 7 will be described. FIG. 4 shows a plan view of a substrate appearance inspection machine disposed on the substrate production line of the present embodiment. In addition, hatching is attached to the substrate Bf. The substrate appearance inspection machine 7 includes a base 72 , a substrate transfer device 73 , an XY robot 74 , an inspection head 75 , an inspection machine-side control device 70 , and an inspection machine-side image processing device 71 .

The base 72 is arranged on the floor F of the factory. The substrate transfer device 73 is disposed on the upper surface of the chassis 72 . The substrate transfer device 73 includes a pair of front and rear conveyor belts 730f and 730r. The front-back position and front-back width of the board transfer device 73 can be changed according to the front-back position and front-back width of the transfer units 303f and 303r of the electronic component mounting machine 1 shown in FIG. 3 . The board|substrate Bf (or board|substrate Br) is conveyed from left side to right side by conveyor belt 730f, 730r. The conveyor belts 730f and 730r function as substrate transport bodies for substrates.

The XY manipulator 74 includes: a Y-direction slider 740, an X-direction slider 741, a pair of upper and lower Y-direction rails 742, a pair of front and rear X-direction rails 743f, 743r, a ball screw part 744 for X-direction movement, and a ball for Y-direction movement. Screw part 745.

The pair of front and rear X-direction rails 743f and 743r are arranged on the upper surface of the chassis 72 so as to sandwich the substrate transfer device 73 from the front and rear directions. The X-direction slider 741 is attached to the front and rear pair of X-direction rails 743f and 743r so as to be slidable in the left-right direction. The X-direction slider 741 is driven by a ball screw unit 744 for X-direction movement attached to the base 72 . The Y-direction slider 740 is attached to a pair of upper and lower Y-direction rails 742 so as to be slidable in the front-rear direction. The Y-direction slider 740 is driven by a ball screw unit 745 for Y-direction movement attached to the X-direction slider 741 .

The inspection head 75 is installed on the Y direction slider 740 . Therefore, the inspection head 75 can be moved in the front, rear, left, and right directions by the XY robot 74 . An inspection camera and a light source are arranged on the inspection head 75 . The inspection camera functions as an imaging device for imaging the board Bf and the electronic components on the board Bf. The light source functions as an illuminating device that illuminates an imaging area of the inspection camera during imaging.

The inspection machine side control device 70 shown in FIG. 1 can comprehensively control the above-described substrate transfer device 73 , XY robot 74 , and inspection head 75 . The storage unit of the inspection machine side control device 70 stores board data (board dimension data, board configuration data, etc.), component data (upper surface shape data, inspection machine lighting condition data, etc.), marking data, mounting coordinate data, etc. And as the inspection machine data. The inspection machine-side image processing device 71 shown in FIG. 1 processes images of the substrate Bf and electronic components captured by the inspection camera. The board|substrate Bf and electronic components are photographed from above by an inspection camera.

＜Operation of substrate production line＞

Next, operations during substrate production in the substrate production line 9 of the present embodiment will be described. As shown in FIG. 1 , first, the substrate passes through a screen printer 90 . At this time, cream solder is applied to the pads of the substrate. Next, the substrate coated with solder passes through the printing inspection machine 91 . In addition, the configuration of the printing inspection machine 91 is the same as that of the substrate appearance inspection machine 7 shown in FIG. 4 . When passing through the printing inspection machine 91, the printed state of the solder on the board is inspected.

Next, the inspected substrates pass through twelve electronic component mounting machines 1 in sequence. Electronic components to be mounted on boards are allocated to twelve electronic component mounting machines 1 one by one. Therefore, electronic components are mounted on the board in stages while passing through twelve electronic component mounting machines 1 .

In any one of the electronic component mounting machines 1 , as shown in FIGS. 2 and 3 , electronic components are mounted on the substrates Bf and Br in the following steps. First, the electronic components of the tape 40 are fed to the component supply position B1 by the tape feeder 4 . Next, the electronic component at the component supply position B1 is sucked by the suction nozzle 320 . Thereafter, by moving the mounting head 32 , the electronic component sucked by the suction nozzle 320 is arranged above the component camera 34 (that is, the imaging area of the component camera 34 ). Next, the electronic component is imaged from below by the component camera 34 . Thereafter, the image of the component camera 34 is processed by the mounting machine side image processing device 61 shown in FIG. 1 . When processing the image, the bottom surface shape data and component type data of each electronic component are required. Furthermore, in order to make the image of the electronic component clear at the time of imaging, data on the lighting condition of the mounting machine for each electronic component is required.

Afterwards, as shown in FIG. 1 , the board on which the electronic components have been mounted passes through the board appearance inspection machine 7 . At this time, the mounting state of the electronic components with respect to the substrate is checked. Specifically, electronic components are inspected for misalignment, misalignment, defective products, and the like. First, as shown in FIG. 4 , the inspection camera is arranged above the electronic components mounted on the board Bf by moving the inspection head 75 . Next, put the electronic components into the shooting area of the inspection camera. Next, the light source is turned on to irradiate the imaging area with light. Next, the electronic components are photographed from above with an inspection camera. After that, the image of the inspection camera is processed by the inspection machine side image processing device 71 shown in FIG. 1 . When processing the image, the shape data of the upper surface of each electronic component is required. Furthermore, in order to make an image of an electronic component clear at the time of imaging, inspection machine lighting condition data for each electronic component is required.

Finally, as shown in Figure 1, the inspected substrate passes through a reflow oven. At this time, the substrate is heated to bring the solder into a molten state. Thereafter, the solder is solidified by cooling the substrate. Then, the electronic components are soldered to the substrate by this solder. In this way, substrate production can be performed on the substrate production line 9 .

＜Inspection machine data creation method＞

Next, the inspection machine data generation method according to this embodiment will be described. The mounting machine data is already input to the storage unit of the mounting machine side control device 60 when the electronic component mounting machine 1 is manufactured. The inspection machine data is generated based on the mounter data at the time of board inspection by the board appearance inspection machine 7 .

That is, the mounter data includes board data (board dimension data, board configuration data, etc.), component data (bottom surface shape data, component type data, mounter lighting condition data, etc.), marking data, and mounting coordinate data. On the other hand, data required as inspection machine data are board data (board dimension data, board configuration data, etc.), component data (upper surface shape data, inspection machine lighting condition data, etc.), marking data, mounting coordinate data, and the like.

When comparing mounting machine data and inspection machine data, board data (board size data, board configuration data, etc.), component data (of which, except for lower surface shape data, component type data, upper surface shape data, mounting machine lighting condition data, Data other than the inspection machine lighting condition data), mark data, and installation coordinate data are included in the installation machine data and inspection machine data. Therefore, these common data are generated based on the mounter data at the time of board inspection by the board visual inspection machine 7 .

On the other hand, the lower surface shape data, component type data, and mounting machine lighting condition data are specific to mounting machine data. Furthermore, the upper surface shape data and the inspection machine illumination condition data are dedicated to the inspection machine data. Therefore, the lower surface shape data, component type data, and mounting machine lighting condition data of the mounting machine data cannot be directly transferred to the inspection machine data.

Here, the mounting machine lighting condition data and the inspection machine lighting condition data are the same in that both are lighting conditions for electronic components at the time of imaging. Therefore, it seems at first glance that the mounting machine lighting condition data can be diverted to the inspection machine lighting condition data.

However, electronic components are imaged from below in the electronic component mounting machine 1 . Therefore, it is necessary to irradiate the electronic components with illumination light from below. On the other hand, electronic components are imaged from above in the board appearance inspection machine 7 . Therefore, it is necessary to irradiate the electronic components with illumination light from above. In this way, various settings including the irradiation direction of the illumination light are different between the mounting machine lighting condition data and the inspection machine lighting condition data. Therefore, the mounting machine lighting condition data cannot be diverted to the inspection machine lighting condition data.

Therefore, in the case of the inspection machine data generation method of this embodiment, the upper surface shape data of the inspection machine data is generated based on the lower surface shape data of the mounting machine data. Furthermore, the inspection machine lighting condition data of the inspection machine data is generated based on the component type data of the mounting machine data.

First, a method of generating top surface shape data will be described. Figure 5(a) shows a bottom view of an electronic component with solder balls. FIG. 5( b ) shows a plan view of the electronic component. As shown in FIG. 5( a ), sixteen solder balls 801 are arranged on the lower surface of the main body 800 of the electronic component 80 . The solder ball 801 is included in the concept of "component" in the present invention. All sixteen solder balls 801 are arranged horizontally inward from the outer edge of the main body 800 . Therefore, as shown in FIG. 5( b ), even when the electronic component 80 is viewed from above, the solder ball 801 cannot be seen.

Fig. 6(a) shows a bottom view of an electronic component with leads. FIG. 6( b ) shows a plan view of the electronic component. As shown in FIG. 6( a ), six lead wires 811 are arranged on the lower surface of the main body 810 of the electronic component 81 . The lead wire 811 is included in the concept of "component" in the present invention. Front end portions 811 a of the six lead wires 811 are exposed outward in the horizontal direction from the outer edge of the main body 810 . Therefore, as shown in FIG. 6( b ), when the electronic component 81 is viewed from above, the front end portions 811 a of the six lead wires 811 can be seen.

In this way, among the lower surface shapes of the electronic components 80 and 81 in FIG. 5(a) and FIG. 6(a) and the upper surface shapes of the electronic components 80 and 81 in FIG. 5(b) and FIG. 6(b), It is different as to whether or not there is a component horizontally inside the outer edge of the main body 800,810.

Focusing on this, in the inspection machine data generation method of the present embodiment, components (solder balls 801, leads 811) that are horizontally inward from the outer edges of the main bodies 800 and 810 are removed from the bottom surface shape data of the mounting machine data. Basic part 811b) related data. Next, top surface shape data is generated by referring to the outer edge of the main body 800 , 810 and the member (tip portion 811 a of the lead 811 ) on the outer side in the horizontal direction than the outer edge of the main body 800 , 810 .

Next, a method of generating inspection machine lighting condition data will be described. The component type data of the mounting machine data is data related to the types of the electronic components 80 , 81 . The inspection machine illumination conditions at which the images of the electronic components 80 and 81 become the clearest in the substrate appearance inspection machine 7 differ according to the types of the electronic components 80 and 81 .

Focusing on this, in the inspection machine data generating method of this embodiment, the inspection machine lighting condition data of the inspection machine data is generated for the type of electronic components 80 and 81 based on the component type data of the mounting machine data.

As described above, in the inspection machine data generation method of the present embodiment, when board inspection is performed by the board appearance inspection machine 7, the board data (board dimension data, board configuration data, etc. ), component data (data other than bottom surface shape data and component type data), marking data, and mounting coordinate data are input into the storage unit of the inspection machine side control device 70 as inspection machine data.

Furthermore, when the substrate appearance inspection machine 7 performs substrate inspection, the upper surface shape data of the inspection machine data is automatically generated from the lower surface shape data of the mounting machine data. And the inspection machine lighting condition data of the inspection machine data is automatically generated according to the component type data of the installation machine data.

＜Data update method＞

Next, the data updating method of this embodiment will be described. As shown in FIG. 1 , for example, when changing the type of electronic component, it is necessary to update the mounter data and the inspection machine data. At this time, the operator updates only the installed machine data. Update information of the installation machine data is automatically transmitted from the installation machine side control device 60 to the inspection machine side control device 70 via the integrated control device 93 . Based on this update information, the inspection machine data and the mounting machine data in the storage unit of the inspection machine side control device 70 are automatically updated in association with each other.

As shown in FIG. 1 , the board appearance inspection machine 7 is arranged on the downstream side with respect to the electronic component mounting machine 1 . Therefore, if the mounter data and the inspection machine data are updated at the same time, the board on which the electronic component after the change has been mounted may not have reached the board appearance inspection machine 7 at the time of the update. Therefore, the inspection camera of the inspection head 75 of the substrate appearance inspection machine 7 shown in FIG. 4 images the marks (model, identifier, symbol, etc.) of the substrate, and performs an update after confirming that the type of electronic component has changed.

＜Effects＞

Next, operations and effects of the substrate production line 9 and the inspection machine data generation method of the present embodiment will be described. According to the substrate production line 9 and the inspection machine data generation method of this embodiment, the upper surface shape data necessary for the visual inspection of the substrates Bf and Br is automatically generated from the lower surface shape data which is the mounter data. Therefore, the operator does not need to generate the upper surface shape data and the lower surface shape data separately.

Furthermore, the installation machine data and the inspection machine data are unified. Therefore, the work of generating data is simple. Furthermore, compared to the case where the mounter data and the inspection machine data are respectively input to the mounter-side control device 60 and the inspection-machine-side control device 70, originally consistent data (for example, board size data) in the mounter data and the inspection machine data , substrate configuration data, marking data, mounting coordinate data, etc.) are less likely to become inconsistent. That is, there are fewer data input errors.

Furthermore, as shown in FIG. 1 , update information of the mounting machine data is transmitted from the mounting machine side control device 60 to the inspection machine side control device 70 via the integrated control device 93 . Then, the inspection machine data is automatically updated based on the update information. Therefore, when changing the type, shape, etc. of the electronic component, it is not necessary to update the mounting machine data and the inspection machine data independently. Therefore, the data update operation is simple.

Furthermore, as shown in FIG. 5( a ) and FIG. 6( a ), components such as leads 811 , solder balls 801 , and electrode pads are arranged on the lower surfaces of the main bodies 800 and 810 of the electronic components 80 and 81 . Therefore, data related to these components are included in the lower surface shape data. On the other hand, as shown in FIG. 5( b ) and FIG. 6( b ), these components are not disposed on the upper surfaces of the main bodies 800 and 810 of the electronic components 80 and 81 . Furthermore, among these components, only the outer edges of the main bodies 800, 810 and components projecting outward in the horizontal direction from the outer edges of the main bodies 800, 810 can be recognized when the electronic components 80, 81 are viewed from above. In other words, only the outer edges of the main bodies 800 and 810 and the data related to the components horizontally outside the outer edges of the main bodies 800 and 810 are required to generate the top surface shape data. In this regard, according to the substrate production line 9 and the inspection machine data generation method of this embodiment, only the data related to the outer edge of the main body 800, 810 and the components on the outer side in the horizontal direction than the outer edge of the main body 800, 810 can be extracted and Generate upper surface shape data.

And as shown in FIG. 4, in the visual inspection of the board|substrate Bf, the electronic component is photographed from above. At this time, light is irradiated to the electronic component. According to the substrate production line 9 and the inspection machine data generation method of this embodiment, the inspection machine lighting condition data is generated based on the component type data. Therefore, the inspection machine illumination conditions at the time of visual inspection of the board|substrate Bf can be changed automatically according to the kind of electronic component. That is, it is possible to automatically apply the optimum lighting conditions of the inspection machine to the electronic components to be inspected.

＜Other＞

As mentioned above, the embodiment of the board|substrate manufacturing line and inspection machine data generation method of this invention was demonstrated. However, the embodiments are not particularly limited to the above-mentioned forms. It can also be implemented in various modifications and improvements that can be made by those skilled in the art.

In the above embodiment, as shown in FIG. 1 , the mounting machine data is stored in the mounting machine side control device 60 , and the inspection machine data is stored in the inspection machine side control device 70 . However, the storage location of the installation machine data and the inspection machine data is not particularly limited. The installer data and the inspection machine data may be aggregated and stored in the installer side control device 60 , the inspection machine side control device 70 , or the integrated control device 93 . Furthermore, the mounting machine data may be stored in the inspection machine side control device 70 and the inspection machine data may be stored in the mounting machine side control device 60 . That is, what is necessary is just to unify the installation machine data and the inspection machine data. In addition, it is sufficient as long as the inspection machine data can be automatically generated.

In the above embodiment, when updating the mounter data and the inspection machine data, update information of the mounter data is transmitted from the mounter side control device 60 to the inspection machine side control device 70 via the integrated control device 93 . However, the transfer route of the update information of the installer data is not particularly limited. For example, update information may be directly transmitted from the installation machine side control device 60 to the inspection machine side control device 70 . In the above-described embodiment, the mounter data and the inspection machine data are updated when the type of electronic component is changed, but the timing of data update is not particularly limited. For example, the mounter data and the inspection machine data may be updated when the types of the boards Bf and Br are changed and the mounting coordinates of the electronic components on the boards Bf and Br are changed. At this time, the inspection camera of the inspection head 75 of the substrate appearance inspection machine 7 shown in FIG. .

The type of electronic component in the component type data is not particularly limited. For example, square chip, IC (Integrated Circuit: integrated circuit), SOP (Small Outline Package: small outline package), SOJ (SmallOutline J-leaded: J-shaped lead small outline package), CFP (Ceramic Flat Package: ceramic flat package), SOT ( SmallOutlineTransistor: Small Outline Transistor), QFP (QuadFlatPackage: Quad Flat Package), PLCC (Plasticleadedchipcarrier: Plastic Chip Carrier with Leads), BGA (Ballgridarray: Ball Grid Array Package), LGA (Landgridarray: Grid Array Package), LLCC ( Leadlesschipcarrier: leadless chip carrier), TCP (Tapecarrierpackage: tape carrier package), LLP (LeadlessLeadframePackage: leadless frame package), DFN (DualFlatpackNo-leaded: leadless double-sided flat package), etc. are set as the types of electronic components.

In the above-described embodiment, the mounting machine data is input to the mounting machine side control device 60 when the electronic component mounting machine 1 is manufactured. Furthermore, the inspection machine data is input to the inspection machine side control device 70 at the time of board inspection by the board appearance inspection machine 7 . However, the timing of data input is not particularly limited. For example, the operator of the substrate production line 9 may input the mounter data and automatically generate the inspection machine data based on the mounter data.

In addition, the mounter data may be generated based on the CAD data at the time of designing the boards Bf and Br. Furthermore, the mounting machine data may be generated based on the printing machine data of the screen printing machine 90 and the inspection machine data of the printing inspection machine 91 shown in FIG. 1 . In this way, data can be further generalized. Therefore, data input can be easily performed. In addition, in the above-mentioned embodiment, as shown in FIG. 1 , the substrate visual inspection machine 7 is arranged on the upstream side of the reflow furnace 92 , but may be arranged on the downstream side of the reflow furnace 92 . Furthermore, the board appearance inspection machine 7 may be arranged between any two adjacent electronic component mounting machines 1 .

Claims (5)

1. a substrate production line, possesses: electronic part mounting, is installed on substrate based on fitting machine data by electronic component; And substrate appearance inspection machine, be configured at the downstream of described electronic part mounting, and check the outward appearance of the described substrate being provided with described electronic component based on inspection machine data, the feature of described substrate production line is,

Described fitting machine packet contains the underside shape data of described electronic component,

Described inspection machine packet contains the upper surface shape data of the described electronic component automatically generated based on described underside shape data,

Described upper surface shape data with reference in described underside shape data except with than described electronic component main body outer rim by except the relevant data of the parts inside horizontal direction, generate by the data that the parts outside horizontal direction are relevant with described main body outer rim and than described outer rim.

2. substrate production line according to claim 1, wherein,

Described fitting machine packet contains the element type data relevant with the kind of described electronic component,

Described inspection machine packet containing automatically generate based on described element type data from top, described electronic component is taken time inspection machine lighting condition data.

3. substrate production line according to claim 1, wherein,

Described fitting machine packet contains the element type data relevant with the kind of described electronic component,

Described inspection machine packet containing automatically generate based on described element type data from top, described electronic component is taken time inspection machine lighting condition data.

4. substrate production line according to claim 1, wherein,

When have updated described fitting machine data, update content is reflected in described inspection machine data automatically.

5. an inspection machine data creation method, be the inspection machine data creation method of substrate production line, described substrate production line possesses: electronic part mounting, is installed on substrate based on fitting machine data by electronic component; And substrate appearance inspection machine, be configured at the downstream of described electronic part mounting, and check the outward appearance of the described substrate being provided with described electronic component based on inspection machine data, the feature of described inspection machine data creation method is,

Based on the described electronic component be contained in described fitting machine data underside shape data and automatically generate the upper surface shape data of the described electronic component be contained in described inspection machine data,

Described upper surface shape data with reference in described underside shape data except with than described electronic component main body outer rim by except the relevant data of the parts inside horizontal direction, generate by the data that the parts outside horizontal direction are relevant with described main body outer rim and than described outer rim.