The nanoparticle filled high polymer composite material that the purpose of this invention is to provide a kind of high temperature resistant, low density, wear-resistant self-lubricating solves the adaptability problem and relevant friction problem of material under the big PV value of high-speed overload metal to-metal contact working condition and the particular surroundings.
Another object of the present invention provides the preparation technology of above-mentioned heat resistant and wear resistant self-lubricating nano particulate filled high polymer composite material.
Purpose of the present invention realizes by following measure.
Nanoparticle of the present invention is filled the composition (wt%) that strengthens polymer composite:
Polyether-ether-ketone 35~90
Polyether sulphone 0~50
Polysulfones 0~30
Polyimide 0~50
Nano-silicon nitride 2.5~20
Nanometer silicon carbide 0~20
Nano silicon 0~20
The composition that the present invention preferentially selects for use (wt%):
Polyether-ether-ketone 55~80
Polyether sulphone 10~25
Polysulfones 5~20
Nano-silicon nitride 2.5~10
Nanometer silicon carbide 2.5~10
Nano silicon 2.5~10
Above-mentioned nanoparticle is filled enhancing heat resistant and wear resistant self-lubricating polymer composite and is preferably selected nanometer silicon carbide, nano-silicon nitride and the nano silicon of mean particle dia less than 80nm for use.
The viscosity of polyether-ether-ketone is η=0.6~1.1.Preferential choice of powder diameter is less than the former powder of polyether-ether-ketone PEEK of 100 μ m, and its structural formula is as follows:
The viscosity of polyether sulphone is η=0.16~0.90.Preferentially select the modified polyarylether sulfone PES-C of having circle type side group on its main chain for use, its structural formula is as follows:
The viscosity of used polysulfones is preferably η=0.16~0.60.
Polyimide is a soluble polyimide.
Preparation technology of the present invention is as follows:
1. the former powder of commercially available polyether-ether-ketone is sieved with 150 mesh sieve, the diameter of gained polyether-ether-ketone powder is less than 100 μ m.
2. take by weighing each component in following ratio (wt%):
Polyether-ether-ketone 35~90
Polyether sulphone 0~50
Polysulfones 0~30
Polyimide 0~50
Nano-silicon nitride 2.5~20
Nanometer silicon carbide 0~20
Nano silicon 0~20
3. will add an amount of solvent by 2 nano-silicon nitrides that taken by weighing, nanometer silicon carbide and silicon-dioxide, and after ultrasonication is uniformly dispersed, add by 2 polyether-ether-ketones that taken by weighing, polyether sulphone, polysulfones, further ball milling or ultrasonication are uniformly dispersed.The solvent that is added can be ethanol, dimethyl formamide, and in the chlorinated hydrocarbon solvent one or more.
4. will carry out drying by 3 formed mixtures, drying means can adopt in one in the methods such as seasoning, hair dryer dry up, infrared baking, vacuum-drying or be several.
5. high temperature compression moulding, to pack into by 4 dried mixtures and be forced into 3MPa in the mould, heat-up rate with 10 ℃/min heats up then, treat that temperature rises to 200~250 ℃, constant temperature 5 minutes is forced into 5~15MPa then, and continue to be warming up to 300~360 ℃, constant temperature 10~60 minutes cools off under the pressurize condition then, adopts naturally cooling or make die temperature drop to 100 ℃ with the method for icing quick cooling to get final product with bottom knockout.In above-mentioned hot pressing,, should note at any time exitting for preventing that bubble from producing.
It is in order to guarantee that product has excellent intensity and thermotolerance, has also considered the feasibility of technology simultaneously as material of main part that the present invention selects polyether-ether-ketone and heatproof heteroaromatic polyether sulphone for use.The second-order transition temperature of used polyether-ether-ketone is 143 ℃, and fusing point is 334 ℃, and this material has excellent mechanical property and resistance to corrosive chemicals energy.Used polyether sulphone is the polyether sulphone PES-S of subsidiary circle type side group on the main chain, and this material has good Technological adaptability energy, mechanical property and resistance to elevated temperatures, and its second-order transition temperature reaches 260 ℃, and the short-term use temperature can reach 400 ℃.
It is in order to guarantee that product has low frictional coefficient and wear rate simultaneously as filler that the present invention selects nano-silicon nitride, silicon carbide and silicon-dioxide for use, and has the favorable mechanical performance.
Behind the hot pressing constant temperature, the selection of the type of cooling can be controlled the crystalline state of macromolecular material in the product among the present invention, and then influences the performance of product, and is generally speaking good with the product kindliness of stove naturally cooling, then better with the rigidity of the product of icing quick cooling.
The maximum characteristics of product of the present invention are to have excellent wear-resistant self-lubricating characteristic under at a high speed big PV value metal to-metal contact working condition.Simultaneously, characteristic such as that this product also has is high temperature resistant, low density, anti-very low temperature and other particular surroundings, this product has good processability, the small-sized component of suitable for making different shape.
The main performance index of product of the present invention is as follows:
1. density~1.44g/cm
3
2. bending strength>130MPa
3. hardness 32~38HBS (5/62.5/60)
4. frictional coefficient<0.16
5. wear rate<1.3 * 10
-6Mm
3/ (N.m)
6. Applicable temperature scope-200 ℃~+ 250 ℃.
Product of the present invention is applicable to the friction means of making under the at a high speed big PV value metal to-metal contact working condition, can be used for the low-density Aeronautics and Astronautics aircraft of requirement high-temperature resistant, as parts such as bearing, slide block and piston ring; Because its radioprotective, vacuum performance and heat resistance are all better, also be applicable to some component of atomic reactor, vacuum machine; Pollution-free, nuisanceless owing to it in addition, thereby also can be widely used in industries such as microcomputer, machinery, chemical industry, weaving, food, household electrical appliance.
Embodiment 1
Take by weighing nanometer silicon carbide 3g, nano-silicon nitride 2g, add dimethyl formamide 50ml, add polyimide 15g, the polyether-ether-ketone 30g of solubility after 5 minutes with ultrasonication, ball milling 3 hours is removed wherein solvent and steam with this mixture with infrared baking then.Put into mould hot pressing, be forced into 3MPa, heat-up rate with 10 ℃/min heats up, treat that temperature rises to 250 ℃, constant temperature 5 minutes is forced into 12MPa then, and continue to be warming up to 340 ℃, constant temperature 20 minutes, naturally cooling under the pressurize condition gets final product with bottom knockout when die temperature drops to 100 ℃ then.Material property satisfies These parameters.The venting in 5 minutes of every interval once in above-mentioned hot pressing.Embodiment 2
Take by weighing nano-silicon nitride 2g, nanometer silicon carbide 2g, nano silicon 1g, add the 50ml trichloromethane, use ultrasonication 5 minutes.Add polyether-ether-ketone 30g, polyether sulphone 10g, the polysulfones 5g take by weighing, ball milling is after 4 hours, and except that desolvating and steam, it is hot-forming to put into mould with heating and vacuum drying method.Be forced into 3MPa,, treat that temperature rises to 220 ℃ with the heat-up rate intensification of 10 ℃/min, constant temperature 5 minutes is forced into 12MPa then, and continues to be warming up to 335 ℃, constant temperature 25 minutes is used the ice quick cooling then under the pressurize condition, get final product with bottom knockout when die temperature drops to 100 ℃.Material property satisfies These parameters.The venting in 5 minutes of every interval once in above-mentioned hot pressing.Embodiment 3
Take by weighing nano-silicon nitride 4g, nano silicon 2g, add and use ultrasonication 5~10 minutes in the 50ml ethanol, add polyether-ether-ketone 30g, polysulfones 15g then, mixed in 15 minutes with ultrasonication again.With this mixture with the method for vacuum and heating drying remove desolvate and steam after, put into the mould heat pressure moulding.Be forced into 3MPa,, treat that temperature rises to 200 ℃ with the heat-up rate intensification of 10 ℃/min, constant temperature 5 minutes is forced into 5MPa then, and continues to be warming up to 320 ℃, constant temperature 30 minutes, naturally cooling under the pressurize condition is reduced to 100 ℃ when die temperature and is got final product with bottom knockout then.Material property satisfies These parameters.In above-mentioned hot pressing, the venting in 5 minutes of every interval once.Embodiment 4
Take by weighing nano-silicon nitride 2g, nano silicon 1g, add and use ultrasonication 5 minutes in the 50ml ethanol, add polyether-ether-ketone 42g, polyether sulphone 5g then, mixed in 15 minutes with ultrasonication again.With this mixture with the method for vacuum and heating drying remove desolvate and steam after, put into the mould heat pressure moulding.Be forced into 3MPa,, treat that temperature rises to 260 ℃ with the heat-up rate intensification of 10 ℃/min, constant temperature 5 minutes is forced into 15MPa then, and continues to be warming up to 345 ℃, constant temperature 20 minutes, naturally cooling under the pressurize condition is reduced to 100 ℃ when die temperature and is got final product with bottom knockout then.Material property satisfies These parameters.In above-mentioned hot pressing, the venting in 5 minutes of every interval once.Embodiment 5
Take by weighing nano-silicon nitride 1g, nanometer silicon carbide 2g, nano silicon 1g, add the 50ml trichloroethane, use ultrasonication 5 minutes.Add polyether-ether-ketone 17.5g, polyether sulphone 20g, the polysulfones 8.5g take by weighing, ball milling is after 4.5 hours, and except that desolvating and steam, it is hot-forming to put into mould with heating and vacuum drying method.Be forced into 3MPa,, treat that temperature rises to 225 ℃ with the heat-up rate intensification of 10 ℃/min, constant temperature 15 minutes is forced into 10MPa then, and continues to be warming up to 325 ℃, constant temperature 35 minutes is used the ice quick cooling then under the pressurize condition, get final product with bottom knockout when die temperature drops to 100 ℃.Material property satisfies These parameters.The venting in 5 minutes of every interval once in above-mentioned hot pressing.