CN115084997B - Laser cooling heat sink device and semiconductor laser thereof - Google Patents

Abstract

The invention discloses a laser cooling heat sink device and a semiconductor laser thereof, wherein the heat sink device is provided with a water inlet hole, a water inlet layer flow channel, a first guide channel, a water return layer flow channel, a second guide channel and a water outlet hole which are communicated in sequence; the water inlet layer flow channel and the backwater layer flow channel are positioned in different layers; the water inlet layer flow channel and the backwater layer flow channel are provided with slow flow sections, and the side wall surfaces of the slow flow sections conform to a sinusoidal curve along the length direction; the wavy channels are added to increase the heat exchange area, so that the mixing of cold and hot fluid is optimized, and the heat exchange efficiency is enhanced.

Description

Laser cooling heat sink device and semiconductor laser thereof

Technical Field

The invention relates to a heat sink device, in particular to a laser cooling heat sink device and a semiconductor laser thereof.

Background Art

The current demands for semiconductor lasers are small size, high photoelectric conversion efficiency, high power, good stability and long life. As the demands become more and more numerous and higher, the requirements for heat dissipation are also getting higher and higher.

Nowadays, semiconductor lasers are usually composed of the most basic single light-emitting tubes, which form multiple Bars, and then multiple Bars form a certain stacked array. The laser chip is small in size, high in power, and has a very high heat flux density. In order to make the laser obtain high power, high reliability, and high photoelectric conversion efficiency, high temperature will affect the performance of the laser and reduce the life of the laser. Therefore, a laser cooling heat sink device that can dissipate heat efficiently is very important for semiconductor lasers.

Summary of the invention

The purpose of the present invention is to solve at least one of the technical problems existing in the prior art and to provide a laser cooling heat sink device and a semiconductor laser thereof.

The technical solution adopted by the present invention to solve the problem is:

The first aspect of the present invention is a laser cooling heat sink device, which is provided with a water inlet hole, a water inlet layer flow channel, a first guide channel, a return water layer flow channel, a second guide channel, and a water outlet hole which are connected in sequence; the water inlet layer flow channel and the return water layer flow channel are located in different planes; the water inlet layer flow channel and the return water layer flow channel are provided with a slow flow section, and the side wall surface of the slow flow section conforms to a sine curve along the length direction.

According to the first aspect of the present invention, the side walls on the opposite sides of the slow flow section conform to a sine curve, wherein the crest of the side wall on one side corresponds to the crest of the side wall on the other side, and the trough of the side wall on one side corresponds to the trough of the side wall on the other side.

According to the first aspect of the present invention, the equation corresponding to the sine curve is: y=Asin(2πx/λ), wherein A is the amplitude and λ is the wavelength.

According to the first aspect of the present invention, the amplitude ranges from 1 micron to 90 microns, and the wavelength ranges from 250 microns to 1000 microns.

According to the first aspect of the present invention, the water inlet layer flow channel is provided with a plurality of slow flow sections, and a first confluence channel is connected between the water inlet hole and the plurality of slow flow sections of the water inlet layer flow channel.

According to the first aspect of the present invention, the return layer flow channel is provided with a plurality of slow flow sections, and the return layer flow channel further comprises a second confluence channel, and the plurality of slow flow sections of the return layer flow channel are connected to the second confluence channel.

According to the first aspect of the present invention, the plurality of slow flow sections of the water inlet layer flow channel are connected to the plurality of slow flow sections of the water return layer flow channel in a one-to-one correspondence.

According to the first aspect of the present invention, the device includes a first layer block, a second layer block, a third layer block, a fourth layer block and a fifth layer block stacked in sequence, the water inlet hole and the water outlet hole are both located on the fifth layer block; the water inlet layer flow channel is located on the fourth layer block, and the return water layer flow channel is located on the second layer block; the first guide channel is located on the third layer block, and the second guide channel is located on the third layer block and the fourth layer block.

According to the first aspect of the present invention, the first layer block, the second layer block, the third layer block, the fourth layer block and the fifth layer block are all formed by 3D printing.

A second aspect of the present invention is a semiconductor laser, comprising the laser cooling heat sink device according to the first aspect of the present invention.

The above scheme has at least the following beneficial effects: the side wall surface of the slow flow section is a curved surface, which conforms to a sine curve along the length direction, thereby increasing the heat exchange area and thus increasing the surface heat transfer coefficient; the slow flow section is provided in both the water inlet layer flow channel and the return layer flow channel of the heat sink device, which can make the hot fluid in the water inlet layer flow channel and the cold fluid in the return layer flow channel mix more fully, thereby strengthening the forced convection of the fluid under micro-scale conditions. On the one hand, the change in the cross-sectional area of the slow flow section can interrupt the development of the thermal boundary layer, so that the heat exchange is always in an underdeveloped stage, thereby strengthening the heat transfer performance; on the other hand, the side wall surface of the wave cavity of the slow flow section conforming to the sine curve can enhance the internal disturbance of the fluid, thereby having an important influence on the flow and heat transfer characteristics, so that the enhancement of the heat transfer performance is far greater than the pressure loss.

Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are used to provide a further understanding of the technical solution of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the technical solution of the present invention and do not constitute a limitation on the technical solution of the present invention.

FIG1 is a structural diagram of a laser cooling heat sink device according to an embodiment of the present invention;

FIG2 is a structural exploded view of a laser cooling heat sink device according to an embodiment of the present invention;

FIG3 is a structural diagram of a second layer block, a third layer block, a fourth layer block and a fifth layer block;

FIG4 is a structural diagram of a third layer block, a fourth layer block and a fifth layer block;

FIG5 is a structural diagram of a fourth layer block and a fifth layer block;

FIG6 is a schematic diagram of the structure of the slow flow section;

FIG. 7 is a curve diagram of a sine curve.

DETAILED DESCRIPTION

This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

1 and 2 , an embodiment of a first aspect of the present invention provides a laser cooling heat sink device.

The laser cooling heat sink device is provided with a water inlet hole 210, a water inlet layer flow channel 310, a first guide channel 410, a return water layer flow channel 320, a second guide channel 420, and a water outlet hole 220 which are connected in sequence; the water inlet layer flow channel 310 and the return water layer flow channel 320 are located in different levels; the water inlet layer flow channel 310 and the return water layer flow channel 320 are provided with a slow flow section 500, and the side wall surface of the slow flow section 500 conforms to a sine curve along the length direction.

It should be noted that the slow flow section 500 includes a plurality of slow flow sections 311 of the water inlet layer flow channel 310 and a plurality of slow flow sections 321 of the water return layer flow channel 320 .

In this embodiment, the side wall surface of the slow flow section 500 is a curved surface, which conforms to a sine curve along the length direction, thereby increasing the heat exchange area and thus increasing the surface heat transfer coefficient; the slow flow section 500 is provided in both the water inlet layer flow channel 310 and the return layer flow channel 320 of the heat sink device, so that the hot fluid in the water inlet layer flow channel 310 and the cold fluid in the return layer flow channel 320 can be mixed more fully, thereby strengthening the forced convection of the fluid under micro-scale conditions. On the one hand, the change in the cross-sectional area of the slow flow section 500 can interrupt the development of the thermal boundary layer, so that the heat exchange is always in an underdeveloped stage, thereby strengthening the heat transfer performance; on the other hand, the wave concave side wall surface of the slow flow section 500 conforming to a sine curve can enhance the internal disturbance of the fluid, thereby having an important influence on the flow and heat transfer characteristics, so that the enhancement of the heat transfer performance is far greater than the pressure loss.

6 , in certain embodiments of the first aspect of the present invention, the side walls on opposite sides of the slow flow section 500 conform to a sine curve, wherein the crest of the side wall on one side corresponds to the crest of the side wall on the other side, and the trough of the side wall on one side corresponds to the trough of the side wall on the other side.

In this embodiment, when the fluid flows through the slow flow section 500, due to the centrifugal force, the maximum velocity at the center of the flow channel will be offset toward the wave crest when the fluid flows through the wave crest. The fluid boundary layer becomes thinner, the velocity gradient becomes larger, and the local Nusselt number increases; and Dean vortices are generated near the wave crest, which promotes the mixing of cold and hot fluids and enhances the heat dissipation effect.

Referring to FIG7 , in some embodiments of the first aspect of the present invention, the equation corresponding to the sine curve is: y=Asin(2πx/λ), where A is the amplitude and λ is the wavelength. Studies have found that within a certain range, the smaller the wavelength, the better the heat dissipation effect; as the amplitude increases, the heat dissipation effect is enhanced, but at a larger amplitude, the heated fluid cannot flow out at the wave crest.

In some embodiments of the first aspect of the present invention, the amplitude ranges from 1 micron to 90 microns, and the wavelength ranges from 250 microns to 1000 microns, wherein the amplitude is 50 microns and the wavelength is 500 microns for the best effect.

3 to 5 , in some embodiments of the first aspect of the present invention, the water inlet layer flow channel 310 is provided with a plurality of slow flow sections 311 , and a first confluence channel 312 is connected between the water inlet hole 210 and the plurality of slow flow sections 311 of the water inlet layer flow channel 310 . That is, the water inlet layer flow channel 310 also includes the first confluence channel 312 .

In addition, the return water layer flow channel 320 is provided with a plurality of slow flow sections 321 , and the return water layer flow channel 320 further includes a second confluence channel 322 , and the plurality of slow flow sections 321 of the return water layer flow channel 320 are in communication with the second confluence channel 322 .

Furthermore, the multiple slow flow sections 311 of the water inlet channel 310 are connected to the multiple slow flow sections 321 of the water return channel 320 in a one-to-one correspondence. That is, the slow flow section 311 of each water inlet channel 310 is connected to the slow flow section 321 of each water return channel 320 through a first guide channel 410 .

In this embodiment, the fluid enters from the water inlet hole 210, flows to the first confluence channel 312 of the water inlet layer flow channel 310, and then is divided from the first confluence channel 312 to multiple slow flow sections 311 of the water inlet layer flow channel 310. The side wall surfaces on both sides of the slow flow section 311 of the water inlet layer flow channel 310 can slow down the flow rate of the fluid and facilitate the heat dissipation of the fluid. At the same time, the flowing fluid generates Dean vortices during flow, which promotes the mixing of cold and hot fluids; the maximum velocity at the center of the fluid is shifted toward the crest, the fluid boundary layer and the thermal boundary layer become thinner, the temperature gradient and the velocity gradient increase, the convective heat transfer coefficient is increased, and the heat transfer effect is enhanced.

Then, the fluid in the slow flow section 311 of each water inlet layer flow channel 310 enters the water return layer flow channel 320 through the first guide channel 410 .

The side walls on both sides of the slow flow section 321 of the return layer flow channel 320 can slow down the fluid flow rate and facilitate the heat dissipation of the fluid. At the same time, the flowing fluid generates Dean vortices during flow, which promotes the mixing of cold and hot fluids; the maximum velocity at the center of the fluid is shifted toward the wave crest, the fluid boundary layer and the thermal boundary layer become thinner, the temperature gradient and the velocity gradient increase, the convective heat transfer coefficient increases, and the heat exchange effect is enhanced.

The fluids in the plurality of slow flow sections 321 of the return water layer flow channel 320 merge into the second confluence channel 322 , and then leave the water outlet 220 from the second guide channel 420 through the second confluence channel 322 .

3 to 5 , in certain embodiments of the first aspect of the present invention, the device includes a first layer block 110, a second layer block 120, a third layer block 130, a fourth layer block 140 and a fifth layer block 150 stacked in sequence, the water inlet hole 210 and the water outlet hole 220 are both located on the fifth layer block 150; the water inlet layer flow channel 310 is located on the fourth layer block 140, and the return water layer flow channel 320 is located on the second layer block 120; the first guide channel 410 is located on the third layer block 130, and the second guide channel 420 is located on the third layer block 130 and the fourth layer block 140.

In this embodiment, the fluid enters from the water inlet hole 210 of the fifth layer block 150 , flows to the first confluence channel 312 of the water inlet layer flow channel 310 of the fourth layer block 140 , and then is divided from the first confluence channel 312 into multiple slow flow sections 311 of the water inlet layer flow channel 310 of the fourth layer block 140 .

Then, the fluid in the slow flow section 311 of each water inlet layer flow channel 310 of the fourth layer block 140 enters the water return layer flow channel 320 of the second layer block 120 through the first guide channel 410 of the third layer block 130 .

Then, the fluid in the multiple slow flow sections 321 of the return layer flow channel 320 of the second layer block 120 converges into the second confluence channel 322 of the second layer block 120, and passes through the second guide channel 420 of the third layer block 130 and the fourth layer block 140 and leaves from the water outlet 220 of the fifth layer block 150.

It should be noted that the second layer block 120 is provided with two second confluence channels 322, and the two second confluence channels 322 are respectively located on the left and right sides of the second layer block 120. In addition, two second guide channels 420 are respectively provided on both sides of the water outlet 220. The fluid in each second confluence channel 322 will enter the two second guide channels 420 respectively, and then converge to the water outlet 220 through the two second guide channels 420 to leave the heat sink device.

In certain embodiments of the first aspect of the present invention, the heat sink device is composed of 5 layers of hollow metal sheets, and the hollow structures are stacked into microchannels for fluid to pass through. The first layer block 110, the second layer block 120, the third layer block 130, the fourth layer block 140 and the fifth layer block 150 are all 3D printed. The 3D printed layer blocks avoid the thermal stress and thermal resistance introduced by the welding of each layer, and also avoid the clogging of the heat sink caused by the falling of the gold-plated material on the inner wall, thereby improving the heat exchange efficiency.

An embodiment of the second aspect of the present invention provides a semiconductor laser; the semiconductor laser comprises the laser cooling heat sink device as described in the embodiment of the first aspect of the present invention.

For the semiconductor laser, by utilizing the above-mentioned laser cooling heat sink device, the heat exchange area is increased by adding a wavy channel, the mixing of cold and hot fluids is optimized, and the heat exchange efficiency is enhanced.

The above is only a preferred embodiment of the present invention. The present invention is not limited to the above implementation mode. As long as the technical effect of the present invention is achieved by the same means, it should belong to the protection scope of the present invention.

Claims (6)

1. The device is characterized in that the device is provided with a water inlet hole, a water inlet layer flow channel, a first guide channel, a water return layer flow channel, a second guide channel and a water outlet hole which are communicated in sequence; the water inlet layer flow channel and the backwater layer flow channel are positioned in different layers; the water inlet layer flow channel and the backwater layer flow channel are provided with slow flow sections, and the side wall surfaces of the slow flow sections conform to a sinusoidal curve along the length direction; the water inlet layer flow channel is provided with a plurality of slow flow sections, and a first combined flow channel is communicated between the water inlet hole and the plurality of slow flow sections of the water inlet layer flow channel; the return water laminar flow channel is provided with a plurality of slow flow sections, the return water laminar flow channel also comprises a second merging flow channel, and the slow flow sections of the return water laminar flow channel are communicated with the second merging flow channel; the plurality of slow flow sections of the water inlet layer flow channel are communicated with the plurality of slow flow sections of the backwater layer flow channel in a one-to-one correspondence manner; the device comprises a first layer block, a second layer block, a third layer block, a fourth layer block and a fifth layer block which are sequentially stacked, wherein the water inlet hole and the water outlet hole are both positioned on the fifth layer block; the water inlet layer flow channel is positioned on the fourth layer block, and the backwater layer flow channel is positioned on the second layer block; the first guide track is located on the third layer block, and the second guide track is located on the third layer block and the fourth layer block.

2. The laser cooling heat sink device of claim 1, wherein the side wall surfaces on opposite sides of the slow flow section each conform to a sinusoidal curve, wherein the peak of the side wall surface on one side corresponds to the peak position of the side wall surface on the other side, and wherein the trough of the side wall surface on one side corresponds to the trough position of the side wall surface on the other side.

3. The laser cooling heat sink device of claim 1, wherein the sinusoidal curve corresponds to the equation: y=asin (2πx/λ), where a is the amplitude and λ is the wavelength.

4. A laser cooling heat sink device as claimed in claim 3 wherein the amplitude is in the range 1 micron to 90 microns and the wavelength is in the range 250 microns to 1000 microns.

5. The laser cooling heat sink device of claim 1, wherein the first layer block, the second layer block, the third layer block, the fourth layer block, and the fifth layer block are each 3D printed.

6. A semiconductor laser comprising a laser cooling heat sink device as claimed in any one of claims 1 to 5.