CN105305225B - A kind of semiconductor laser cooling heat sink device - Google Patents

Abstract

The invention relates to the technical field of semiconductor laser arrays, and discloses a semiconductor laser cooling heat sink device, comprising: a water inlet side cover, a water inlet layer, a guide layer, a water return layer and a water return side cover arranged in sequence; , the outer surface of the water inlet side cover is provided with a water inlet hole, and the outer surface of the return water side cover is provided with a water outlet hole; between the water inlet side cover, the water inlet layer and the guide layer, there is a slow flow that slows down the flow rate of the heat transfer medium area; the side of the guide layer close to the semiconductor laser is provided with several through holes for the heat-conducting medium to flow into the backwater layer from the slow flow area; The outlet channel through which the heat transfer medium flows out. The semiconductor laser cooling heat sink device provided by the present invention is a 3D printing integrated device, which avoids the thermal stress and thermal resistance introduced by the welding of each layer in the prior art, and also avoids the heat sink being blocked by the gold-plated material on the inner wall of the device. heat transfer efficiency.

Description

A semiconductor laser cooling heat sink device

technical field

The invention relates to the technical field of semiconductor laser arrays, in particular to a semiconductor laser cooling heat sink device.

Background technique

Semiconductor lasers have the characteristics of high electro-optical conversion efficiency, small size, light weight, and long life, which make them widely used. Improving output power and beam quality has always been the main research topic of high-power semiconductor lasers. As the power of semiconductor lasers continues to increase, the power density continues to increase, and the high heat of the laser chip directly affects the life of the semiconductor laser. In view of the above problems, a microchannel cooling heat sink is generally used to reduce the heat of the laser chip.

The monolithic microchannel cooling heat sink in the prior art is composed of five layers of oxygen-free copper sheets with different shapes, and the laser chip is located on the upper surface of the water inlet side cover layer. The heat-conducting medium enters the micro-channel area of the micro-channel layer from the water inlet, enters the micro-channel area again through the slit of the water-conducting layer, and then enters the backwater side cover layer from the water outlet to complete a cycle of cooling for the chip.

However, in the existing cooling heat sink, the heat conduction medium directly flows into the microchannel area to cool the chip after entering the water inlet, and cannot circulate fully and uniformly in the microchannel, resulting in poor local heat dissipation effect, and easily burns out the laser chip. The heat exchange efficiency is low. In addition, the five oxygen-free copper sheets are not integrally formed, but welded to each other. It is easy to generate additional thermal resistance and thermal stress at the soldering place. And the performance of the oxygen-free copper material needs to be plated with gold. After long-term use, the gold layer on the surface is easy to fall off and cause the heat sink to be blocked.

Contents of the invention

The technical problem to be solved by the invention is: how to improve the heat exchange efficiency of the semiconductor laser cooling heat sink device.

In order to achieve the above-mentioned purpose of the invention, the present invention provides a semiconductor laser cooling heat sink device, including: a water inlet side cover, a water inlet layer, a guide layer, a water return layer and a water return side cover arranged in sequence;

in,

The outer surface of the water inlet side cover is provided with a water inlet, and the outer surface of the return water side cover is provided with a water outlet; the water outlet is located on the side of the water inlet away from the rake of the semiconductor laser;

A slow flow zone is formed between the water inlet side cover, the water inlet layer and the guide layer to slow down the flow velocity of the heat transfer medium;

The side of the guide layer close to the semiconductor laser is provided with several through holes for the heat conduction medium to flow into the backwater layer from the slow flow area;

A water outlet channel for the heat transfer medium to flow out is also formed between the guide layer, the return water layer and the return water side cover;

The water inlet hole communicates with the slow flow area, and the slow flow area communicates with the water outlet channel through the several through holes, and the water outlet channel communicates with the water outlet hole;

The heat conduction medium enters from the water inlet hole, flows slowly in the slow flow area of the water inlet layer, flows into the backwater layer through the through hole of the guide layer, and then passes through the water outlet channel of the backwater layer Flow out from the outlet hole.

Wherein preferably, described slow flow area is made of:

formed by hollowed-out areas on the water-intake layer; or,

The depression on the surface of the guide layer close to the water inlet layer is combined with the hollow area on the water inlet layer.

Wherein preferably, described outlet channel is made of:

Formed by the hollow area on the backwater layer;

The depression on the inner surface of the backwater side cover is combined with the hollow area on the backwater layer.

Preferably, the backwater layer is also provided with several micro-channels for evenly dissipating heat from the semiconductor laser, the through holes communicate with the several micro-channels correspondingly, and the several micro-channels are connected with the water outlet channel. connected;

After entering the slow flow area, the heat conduction medium flows into the corresponding microchannel through the through hole to dissipate heat from the semiconductor laser, and then flows out from the water outlet hole through the water outlet channel.

Wherein preferably, described several microchannels are separated by several equidistant dividing ridges, and the lengths that described several microchannels extend toward the direction close to described outlet holes are identical, and the lengths of described several microchannels Same width.

Preferably, the backwater layer further includes a confluence area connected to the microchannel, and the confluence area is also connected to the water outlet channel;

At the end of the confluence area away from the microchannel, there is also a slope for the heat transfer medium to confluence to the water outlet channel.

Wherein preferably, the water outlet channel includes a main water outlet channel and a distribution channel;

The distribution channel is arranged in the extension direction of the main water outlet channel close to the water outlet hole, and the main water outlet channel and the distribution channel are both connected to the water outlet hole;

The water outlet channel communicates with the water inlet layer, the guide layer and the water return layer.

Among them preferably,

The main water outlet channel and the distribution channel are separated from each other by partition bars in the water inlet layer and the guide layer;

The main water outlet channel and the distribution channel are connected in the backwater layer, and a distribution ridge with a thickness smaller than that of the backwater layer is arranged between the main water outlet channel and the distribution channel.

Wherein preferably, the semiconductor laser cooling heat sink device is integrally formed.

Preferably, the semiconductor laser cooling heat sink device is integrally formed by 3D printing.

The invention provides a semiconductor laser cooling heat sink device. After the heat conduction medium enters the device from the water inlet hole, it flows slowly in the cavity of the water inlet layer, flows into the microchannel of the return water layer through the through hole of the guide layer, and finally flows out of the water outlet hole through the water outlet channel of the return water layer , to realize the uniform circulation flow of the heat transfer medium in the device. In addition, the device is integrally formed by 3D printing technology, which avoids the additional thermal stress and thermal resistance introduced by welding between layers in the prior art, and improves the overall heat dissipation capacity of the device. Moreover, nickel-based alloy powder or tungsten-copper alloy powder is used as material for 3D printing, which can well match the thermal expansion coefficient of the heat sink and the rake chip, and the inner wall of the device does not need to be plated with gold, which also avoids the long-term problems in the prior art. Use the problem that the gold layer on the surface of oxygen-free copper falls off to cause the blockage of the heat sink, and improve the heat exchange efficiency.

Description of drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiment. The drawings are only for the purpose of illustrating a preferred embodiment and are not to be considered as limiting the invention. Also throughout the drawings, the same reference numerals are used to designate the same components. In the attached picture:

Fig. 1 is a schematic diagram of the overall structure of the cooling heat sink device provided by the first embodiment of the present invention;

Fig. 2 is a side view longitudinal sectional view of the cooling heat sink device provided by the first embodiment of the present invention;

Fig. 3 is a schematic diagram of the three-dimensional structure of the water inlet side cover provided by the first embodiment of the present invention;

Fig. 4 is a schematic diagram of the three-dimensional structure of the return water side cover provided by the first embodiment of the present invention;

Fig. 5 is a schematic diagram of the three-dimensional structure of the water inlet layer provided by the first embodiment of the present invention;

Fig. 6 is a schematic diagram of the structure of a slow flow area provided by the first embodiment of the present invention;

Fig. 7 is a schematic diagram of the three-dimensional structure of the guiding layer provided by the first embodiment of the present invention;

Fig. 8 is a schematic diagram of the three-dimensional structure of the backwater layer provided by the first embodiment of the present invention;

Fig. 9 is a schematic structural diagram of a water outlet channel provided by the first embodiment of the present invention.

Detailed ways

The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

As shown in Figures 1-7, the present invention provides a semiconductor laser cooling heat sink device. The device includes: a water inlet side cover 19, a water inlet layer 12, a guide layer 13, a water return layer 14 and a water return side cover 20 arranged in sequence; wherein, the outer surface of the water inlet side cover 19 is provided with a water inlet hole 1. The outer surface of the water return side cover 20 is provided with a water outlet hole 3; the water outlet hole 3 is located on the side of the water inlet hole 1 away from the semiconductor laser; it is formed between the water inlet side cover 19, the water inlet layer 12 and the guide layer 13 There is a slow-flow area 4 that slows down the flow velocity of the heat-conducting medium; the side of the guide layer 13 close to the semiconductor laser is provided with several through holes 5 for the heat-conducting medium to flow into the return layer from the slow-flow area 4; in the guide layer 13, the return A water outlet channel is also formed between the water layer 14 and the backwater side cover 20 for the heat transfer medium to flow out; the water inlet hole 1 is connected to the slow flow area 4, and the slow flow area 4 is connected to the water outlet channel through several through holes 5, and the water outlet channel and the water outlet The hole 3 is connected; the heat conduction medium enters from the water inlet hole 1, flows slowly in the slow flow area 4 of the water inlet layer 12, flows into the backwater layer 14 through the through hole 5 of the guide layer 13, and then passes through the water outlet of the backwater layer 14 The channel flows out from the outlet hole 3. The semiconductor laser cooling heat sink device provided by the present invention is integrally formed by 3D printing technology. The semiconductor laser cooling heat sink device provided by the present invention will be described in detail below.

Embodiment one

This embodiment provides a semiconductor laser cooling heat sink device. Wherein, as shown in FIGS. 1 and 2 , the device also includes positioning holes 2 and screw holes 15 . The positioning hole 2 is arranged between the water inlet hole 1 and the water outlet hole 2 . The water inlet hole 1 , the positioning hole 2 and the water outlet hole 3 are all connected to the water inlet side cover 19 , the water inlet layer 12 , the guiding layer 13 , the water return layer 14 and the water return side cover 20 . The screw holes 15 are preferably arranged on two corners on one side of the water outlet hole of the device, and are also connected to the water inlet side cover 19, the water inlet layer 12, the guide layer 13, the return water layer 14 and the return water side cover 20. Both the positioning holes 2 and the screw holes 15 are used to fix the entire heat sink device. As shown in Figure 4 and Figure 5, the structures of the water inlet side cover 19 and the return water side cover 20 of the device are basically the same, the only difference is that the radius of the water inlet hole 1 and the water outlet hole 3 on the water inlet side cover 19 is larger than Radius of the water inlet hole 1 and the water outlet hole 3 on the return water side cover 20 .

FIG. 5 shows a schematic perspective view of the three-dimensional structure of the water inlet layer 12 . Wherein, between the water inlet side cover 19, the water inlet layer 12 and the guide layer 13, a slow flow zone 4 communicating with the water inlet hole 1 is formed, which is used to slow down the water inlet of the heat transfer medium entering from the water inlet hole 1. flow. The slow flow zone 4 is an open space. Wherein preferably, as shown in Figure 5, the slow flow area 4 is formed by the hollow area on the water inlet layer 12; The depression 21 is formed in combination with the hollow area 22 on the water inlet layer 12 (wherein, the direction of the arrow is the direction in which the heat-conducting medium flows). The opening size gradually increases from the water outlet hole 1 to the edge of the water inlet layer 12 and adapts to the shape of the inner wall of the water inlet layer 12 .

FIG. 7 shows a schematic perspective view of the three-dimensional structure of the guiding layer 13 . Among them, several through holes 5 communicating with the slow flow area 4 of the water inlet layer 12 are provided in the guide layer 13 for leading the heat transfer medium in the water inlet layer 12 to the return water layer. Several through holes 5 are preferably arranged at the edge of the guiding layer 13 . FIG. 8 shows a schematic perspective view of the three-dimensional structure of the backwater layer 14 . Wherein, several microchannels 6 corresponding to several through holes 5 in the guide layer 13 are arranged in the return water layer 14 . Several microchannels 6 are separated by several equally spaced partition ridges 7 . The width of each microchannel 6 and each dividing ridge 7 is 300 microns, and the microchannels 6 extend to the same length toward the water outlet hole 3 . Several microchannels 6 and several dividing ridges 7 form a chip heat dissipation structure, which is used for the chip heat dissipation of the semiconductor laser arranged at the end of the whole device close to the microchannel 6 . In the backwater layer 14 there is also a confluence area 8 communicating with the microchannel 6 for converging the heat conduction medium. The confluence area 8 is further provided with a slope at the end away from the microchannel 6 , which is used to further lead the heat-conducting medium out of the microchannel 6 .

In addition, as shown in Figures 5, 7, and 8, a water outlet channel for the heat transfer medium to flow out is formed between the guide layer 13, the return water layer 14, and the return water side cover 20, for guiding the heat transfer medium to the water outlet hole 3 thereby discharged. Wherein preferably, as shown in Figure 8, the water outlet channel is formed by the hollow area 21 on the backwater layer 14; The hollow area 24 on the layer 14 is formed in combination (wherein, the direction of the arrow is the direction in which the heat-conducting medium flows).

Wherein, the water outlet channel includes a main water outlet channel 9 and a distribution channel 10 . Wherein, in the water inlet layer 12, the main water outlet channel 9 is adjacent to but not connected to the slow flow area 4, and the main water outlet channel 9 extends from the position adjacent to the slow flow area 4 to both sides of the water outlet hole 3; 10 is arranged at the extension ends of the main water flow channel 9 on both sides of the water outlet hole 3 , and is separated from the main water flow channel 9 by a partition bar 16 . Both the main water outlet channel 9 and the distribution channel 10 are in communication with the water outlet hole 3 . In the guide layer 13, the main water outlet channel 9 and the distribution channel 10 are arranged at the positions corresponding to the main water outlet channel 9 and the distribution channel 10 in the water inlet layer 12; 17 separated from each other. In the backwater layer 14, the main water outlet channel 9 and the diversion channel 10 are arranged at corresponding positions with the main water outlet channel 9 and the diversion channel 10 in the guide layer 13; one end of the main water outlet channel 9 and the confluence area 8 pass through the confluence area 8 The slope in the middle is connected, and the other end is connected with the distribution channel 10 through the distribution ridge 18; in the backwater layer 14, there is a layer of thickened area on the edge of the outlet hole 3, and the main outlet channel 9 and the distribution channel 10 are in the thickened area. The bottom is communicated with water outlet hole 3.

The heat conduction medium enters the water inlet layer 12 from the water inlet hole 1 of the water inlet side cover 19, and flows slowly in the slow flow area 4; after that, the heat conduction medium is transferred from the slow flow zone 4 by several through holes 5 on the guide layer 13. Area 4 is drained into several microchannels 6 corresponding to the backwater layer 14; the heat conduction medium flows at a constant speed in the microchannels 6 to fully exchange heat for the semiconductor laser; the heat conduction medium that has absorbed heat flows into the confluence along several microchannels 6 Area 8; the slope at the end of the confluence area 8 guides the heat transfer medium to the main water outlet channel 9; since the edge of the water outlet hole 3 is provided with a layer of thickened area, a step appears at the end of the main water outlet channel 9, which greatly hinders the flow of the heat transfer medium. Therefore, a part of the heat transfer medium is diverted to the distribution channel 10 through the distribution ridge 18 , and finally the heat transfer medium in the main water outlet channel 9 and the distribution channel 10 flows out from the water outlet hole 3 together.

Embodiment two

This embodiment provides a semiconductor laser cooling heat sink device. The heat sink device is integrally formed. Wherein preferably, based on 3D printing, it is integrally formed in the vertical direction from one end of the device provided with the laser rake to the other end. And in order to facilitate integral molding, as shown in Figure 5, the angle between the hypotenuse of the slow flow area 4 at the opening of the water inlet hole 1 in the water inlet layer and the edge of the device near the laser rake is preferably greater than 45 degrees. Other features of the heat sink device provided in this embodiment are the same as those in Embodiment 1, and will not be repeated here.

The 3D printing integrated cooling heat sink device provided in this embodiment avoids the additional thermal stress and thermal resistance caused by the welding of various layers in the prior art. In addition, the material of the device is nickel-based alloy powder or tungsten-copper alloy powder with different proportions, which has good corrosion resistance and long life, and its thermal matching coefficient is better than that of oxygen-free copper material, which can reduce the heat loss caused by heat. The thermal expansion coefficient of the sink and the laser chip does not match, resulting in a smile effect (when the high-power semiconductor laser array is working, the temperature gradient from the laser to the heat sink is very large, due to the substrate material (gallium arsenide) of the semiconductor laser array and the heat sink The linear thermal expansion coefficient of the material (oxygen-free copper) does not match, which leads to the generation of thermal stress. Thermal stress causes the displacement of each light-emitting unit in the semiconductor laser array in the direction perpendicular to the P-N junction. In addition, the light-emitting size perpendicular to the direction of the P-N junction is only about 1 micron, so a small displacement has a greater impact on the light emission, so that each light-emitting unit in the array is not in a straight line, resulting in the overall light-emitting bending of the semiconductor laser, this phenomenon is called the smile effect).

At the same time, nickel-based alloy powder or tungsten-copper alloy powder is used as the printing material, and the inner surface of the device does not need to be plated with gold, which avoids the problem of heat sink blockage caused by long-term use of the internal gold layer in the prior art. Preparation of nickel and alloy materials The structure of the heat sink is better than that of traditional copper materials, so the cooling water flow can be larger than that of traditionally prepared heat sinks, and the heat dissipation effect is better.

To sum up, the present invention provides a semiconductor laser cooling heat sink device. After the heat conduction medium enters the device from the water inlet hole, it flows slowly in the cavity of the water inlet layer, flows into the microchannel of the return water layer through the through hole of the guide layer, and finally flows out of the water outlet hole through the water outlet channel of the return water layer , to realize the uniform circulation flow of the heat transfer medium in the device. In addition, the device is integrally formed by 3D printing technology, which avoids the additional thermal stress and thermal resistance introduced by welding between layers in the prior art, and improves the overall heat dissipation capacity of the device. Moreover, nickel-based alloy powder or tungsten-copper alloy powder is used as material for 3D printing, which can well realize the integration of heat sink and rake chip, and the inner wall of the device does not need to be plated with gold, which also avoids the long-term use of oxygen-free copper in the prior art. The problem of heat sink blockage caused by the peeling off of the gold layer on the surface improves the heat exchange efficiency.

The above embodiments are only used to illustrate the present invention, but not to limit the present invention. Those of ordinary skill in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, all Equivalent technical solutions also belong to the category of the present invention, and the scope of patent protection of the present invention should be defined by the claims.

Claims (8)

1. A semiconductor laser cooling heat sink device is characterized in that, comprising: a water inlet side cover, a water inlet layer, a guide layer, a water return layer and a water return side cover arranged in sequence; in, The outer surface of the water inlet side cover is provided with a water inlet, and the outer surface of the return water side cover is provided with a water outlet; the water outlet is located on the side of the water inlet away from the rake of the semiconductor laser; A slow flow zone is formed between the water inlet side cover, the water inlet layer and the guide layer to slow down the flow velocity of the heat transfer medium; The side of the guide layer close to the semiconductor laser is provided with several through holes for the heat conduction medium to flow into the backwater layer from the slow flow area; A water outlet channel for the heat transfer medium to flow out is also formed between the guide layer, the return water layer and the return water side cover; The water inlet hole communicates with the slow flow area, and the slow flow area communicates with the water outlet channel through the several through holes, and the water outlet channel communicates with the water outlet hole; The heat conduction medium enters from the water inlet hole, flows slowly in the slow flow area of the water inlet layer, flows into the backwater layer through the through hole of the guide layer, and then passes through the water outlet channel of the backwater layer flow out from the outlet hole; The water outlet channel includes a main water outlet channel and a distribution channel; The distribution channel is arranged in the extension direction of the main water outlet channel close to the water outlet hole, and the main water outlet channel and the distribution channel are both connected to the water outlet hole; The water outlet channel communicates with the water inlet layer, the guide layer and the return water layer; The main water outlet channel and the distribution channel are separated from each other by partition bars in the water inlet layer and the guide layer; The main water outlet channel and the distribution channel are connected in the backwater layer, and a distribution ridge with a thickness smaller than that of the backwater layer is arranged between the main water outlet channel and the distribution channel. 2. The heat sink device according to claim 1, wherein the slow flow area is composed of: formed by hollowed-out areas on the water-intake layer; or, The depression on the surface of the guide layer close to the water inlet layer is combined with the hollow area on the water inlet layer. 3. The heat sink device according to claim 1, wherein the water outlet channel is composed of: Formed by hollowed-out areas on said backwater layer; or, The depression on the inner surface of the backwater side cover is combined with the hollow area on the backwater layer. 4. heat sink device as claimed in claim 1, is characterized in that, described backwater layer is also provided with and is used for the some micro-channels of uniform heat dissipation for semiconductor laser, and described through hole is correspondingly communicated with described several micro-channels , the several microchannels communicate with the water outlet channel; After the heat conduction medium enters the slow flow area, it flows into the corresponding microchannel through the through hole to dissipate heat from the semiconductor laser rake, and then flows out from the water outlet hole through the water outlet channel. 5. The heat sink device according to claim 4, wherein the plurality of microchannels are separated by several equidistant partition ridges, and the plurality of microchannels approach the direction of the outlet hole. The extended lengths are the same, and the widths of the several microchannels are the same. 6. The heat sink device according to claim 4, wherein the return layer further comprises a confluence area connected to the microchannel, and the confluence area is also connected to the outlet channel; At the end of the confluence area away from the microchannel, there is also a slope for the heat transfer medium to confluence to the water outlet channel. 7. The heat sink device according to claim 1, wherein the semiconductor laser cooling heat sink device is integrally formed. 8. The heat sink device according to claim 7, wherein the semiconductor laser cooling heat sink device is integrally formed by 3D printing.