CN115036717B - Electrical connection unit, manufacturing method and electronic device - Google Patents

Abstract

Embodiments of the present application provide an electrical connection unit, a manufacturing method, and an electronic device. The electrical connection unit includes a first component and a second component. The first component includes a first structural member and an adhesive conductive layer. The first structure The component includes a structural body and a protective layer, the structural body includes a metal part, the surface of the metal part has an electrical connection area, and the electrical connection area is exposed to the outside of the first structural part; the protective layer is located on the peripheral side of the electrical connection area, and is coated on the metal The surface of the component; the adhesive conductive layer covers the electrical connection area and the protective layer around the electrical connection area; the second component includes a second structural member, and the second structural member conducts with the electrical connection area through the adhesive conductive layer. The connection unit has better reliability and can improve the medium and long-term performance of electronic equipment.

Description

Electrical connection unit, manufacturing method and electronic device

technical field

The present application relates to the field of electronic technology, in particular to an electrical connection unit, a manufacturing method and electronic equipment.

Background technique

Electrical connectors such as shrapnel play an important role in electronic equipment as the main components that connect and conduct between two metal parts.

At present, the reed is used as a common way to improve the electrical contact interface on the middle frame of the electronic device. The reed is usually fixed on the electrical contact interface of the middle frame by welding, and other components in the electronic device that need to be electrically connected to the middle frame, such as the circuit board, are abutted on the reed through the spring, so as to realize the conduction between the circuit board and the middle frame . The middle frame is usually made of light metals such as aluminum, aluminum alloy, and magnesium alloy. When such light metal welding reeds are connected to the circuit board through shrapnel, although the way of welding the reeds can improve the electrical contact interface of the middle frame, However, there are higher requirements on the thickness of the middle frame and the area of the reed. In the related art, it is proposed to print silver paste on the electrical contact interface of the middle frame, and replace the reeds with silver paste to improve the electrical contact interface of the middle frame while reducing the thickness of the middle frame and the area requirement of the silver paste.

However, the test found that the middle frame will still have galvanic corrosion at the electrical contact interface, which will easily cause the silver paste to lose its viscosity, which will affect the reliability of the connection between the middle frame and other components in the electronic device, such as the circuit board, and the medium and long-term performance of the electronic device .

Contents of the invention

The present application provides an electrical connection unit, a manufacturing method and an electronic device, so that the electrical connection unit not only has better reliability, but also can improve the medium and long-term performance of the electronic device.

The first aspect of the embodiment of the present application provides an electrical connection unit, the electrical connection unit includes a first component and a second component, the first component includes a first structural member and an adhesive conductive layer, the first structural member includes a structural body and a protective Layer, the structural body includes a metal piece, the surface of the metal piece has an electrical connection area, and the electrical connection area is exposed to the outside of the first structural member; the protective layer is located on the peripheral side of the electrical connection area and covers the surface of the metal piece; the adhesive conductive layer covering the electrical connection area and the protective layer around the electrical connection area;

The second assembly includes a second structural member, which is electrically connected to the electrical connection area through the adhesive conductive layer.

In the embodiment of the present application, through the arrangement of the first component and the second component in the electrical connection unit, the first component includes a first structural member and an adhesive conductive layer. Since the adhesive conductive layer covers the electrical connection area of the first structural member, the second The structural member is electrically connected to the electrical connection area of the first structural member through the adhesive conductive layer, so as to realize the electrical connection between the first structural member and the second structural member, so as to facilitate the transmission of electrical signals between the first structural member and the second structural member, The contact effect on the surface of the electrical connection area can be improved by replacing the reed with a viscous conductive layer. Compared with the method of improving the electrical contact interface of the middle frame with the reed, the embodiment of the present application can reduce the thickness of the first structural member and the viscous conductive layer at the second The area occupied by a structural member. On this basis, by covering the electrical connection area and the protective layer around the electrical connection area with the adhesive conductive layer, it is possible to prevent the electrolyte from entering the electrical connection area through the gap between the adhesive conductive layer and the protective layer, thereby avoiding the first Galvanic corrosion occurs in the structural part in the electrical connection area, so that the viscous conductive layer covers the electrical connection area stably, ensuring the reliability of the connection between the second structural part and the first structural part, improving the medium and long-term performance of electronic equipment, and making electronic equipment It has good benefits in terms of the weight of the whole machine and the thickness of the whole machine.

In an optional embodiment, the area of the adhesive conductive layer is larger than the area of the electrical connection area, and the peripheral edge of the adhesive conductive layer covers the protective layer on the peripheral side of the electrical connection area.

In this way, by limiting the area of the adhesive conductive layer and the position of the peripheral edge relative to the protective layer, the adhesive conductive layer can be connected to the protective layer while completely covering the adhesive conductive layer, so as to block the electrolyte from entering the electrical connection area. path, so as to avoid galvanic corrosion of the first structural member in the electrical connection area.

In an optional embodiment, the structural body further includes a plastic part connected to the metal part, and the adhesive conductive layer is located between the metal part and the plastic part, and covers the electrical connection area, the protective layer around the electrical connection area, and the metal part. The connection between parts and plastic parts.

Since the adhesive conductive layer is located between the metal part and the plastic part, and covers the electrical connection area, the protective layer around the electrical connection area, and the connection between the metal part and the plastic part, the adhesive conductive layer can cover the electrical connection area and the protective layer at the same time. And the plastic parts, so that the path of the electrolyte entering the electrical connection area is completely closed, so as to avoid the occurrence of galvanic corrosion in the electrical connection area.

In an optional embodiment, the structural body has a first plane and a second plane in the direction toward the second structural member, and the first plane and the second plane are two intersecting surfaces on the structural body; the second structure The member has a conduction surface connected to the first structural member, and the first plane is parallel to the conduction surface;

The adhesive conductive layer covers at least the first plane, and the second structural component is located at the corner of the first plane and the second plane, and is connected to the first structural component through the conductive surface and the adhesive conductive layer.

In this way, through the setting of the second structural member at the corner of the first plane and the second plane, the second structural member can be assembled in the first structural member, making the structural form of the electrical connection unit more diverse, and due to the adhesive conduction The setting of the layer covering at least the first plane can facilitate the selection of adhesive conductive layers of different lengths according to the location of the electrical connection area, so that the second structural member can conduct with the first structural member through the conduction surface and the adhesive conductive layer, Therefore, the reliability of the electrical connection between the second structural member and the first structural member is enhanced, and the purpose of improving the medium and long-term performance of the electronic device is achieved.

In an optional embodiment, the first plane has a plastic surface of the plastic part, the plastic surface is opposite to the conduction surface, and the electrical connection area is exposed to the second plane;

The adhesive conductive layer includes a first conductive layer and a second conductive layer, the first conductive layer is respectively located on the first plane and the second plane to cover the electrical connection area; the second conductive layer is located at the corner to connect adjacent first conductive layers , so as to conduct the second structure member with the electrical connection area.

In this way, through the arrangement of the first conductive layer and the second conductive layer, it is not only possible to connect the first conductive layer on the first plane and the second plane through the second conductive layer, so that the adhesive conductive layer continues to the plastic surface, ensuring the second structure While the components are electrically connected to the first structural component, it can also help to realize the separate printing of the adhesive conductive layer at different positions on the structural body, so that according to the different positions of the first conductive layer and the second conductive layer on the structural body , select viscous conductive materials with different materials to form the first conductive layer and the second conductive layer, compared with the method of printing the viscous conductive layer once, it can reduce the manufacturing cost of the electrical connection unit and electronic equipment, reduce the second conductive layer and The structural size of the viscous conductive layer is used to avoid the influence of one-time printing of the viscous conductive layer on the performance of the electronic device.

In an optional embodiment, the connection is located in the middle of the second plane, and the adhesive conductive layer further includes a third conductive layer. The third conductive layer is located at the connection to connect the metal part and the plastic part and the adjacent first conductive layer. layer, wherein the elongation at break of the third conductive layer is greater than the elongation at break of the first conductive layer.

In this way, through the arrangement of the third conductive layer, two adjacent first conductive layers in the first plane are connected so as to realize the electrical connection between the second structural member and the first structural member, because the fracture elongation of the third conductive layer is greater than The elongation at break of the first conductive layer makes the third conductive layer have a certain degree of ductility, and can effectively reduce the problem of functional failure of the viscous conductive layer caused by the separation of metal parts and plastic parts when the structural body is impacted.

In an optional embodiment, the first conductive layer is a pad printing adhesive conductive layer, the corners and joints are glue dispensing areas, and the second conductive layer and the third conductive layer are conductive layers formed in the glue dispensing areas by dispensing. layer.

In this way, through the setting of pad printing viscous conductive layer and dispensing area, while realizing the separate printing of viscous conductive layer at different positions of the structural body, it is also possible to select the appropriate The viscous conductive material prepared is printed at different positions of the structural body to form a viscous conductive layer, on the basis of meeting the performance requirements of the viscous conductive layer at different positions of the structural body, it can also reduce the second conductive layer and the viscous The structural dimensions of the conductive layer.

In an optional implementation manner, the thickness of the first conductive layer on the first plane is greater than the thickness of the first conductive layer on the second plane, or the hardness of the first conductive layer on the first plane is greater than that of the first conductive layer on the second plane. The hardness of a conductive layer.

In this way, by limiting the thickness and hardness of the first conductive layer on the first plane and the second plane, not only can the first conductive layer on the first plane have better wear resistance, but also reduce the formation of the first conductive layer on the second plane. The waste of the viscous conductive material of the conductive layer can be reduced, and the area of the area with higher resistivity in the viscous conductive layer can be reduced, which helps to improve the performance of the electronic device.

In an optional embodiment, the first structural part is the middle frame of the electronic device, and when the metal part of the first structural part is located on the side of the second structural part, the metal part is the antenna radiator of the electronic device, and the second structural part The component is a circuit board of an electronic device.

In this way, the circuit board can form a reliable electrical connection with the antenna radiator to realize signal transmission between the circuit board and the antenna radiator. Due to the setting of the first conductive layer and the second conductive layer, the adhesive conductive layer can be realized on the structure body. Printing at different positions to reduce the structural size of the viscous conductive layer, so as to avoid the influence of one-time printing of the viscous conductive layer on the performance of the antenna radiator, and at the same time, it can make the electronic equipment reduce the weight and thickness of the whole machine Both have good returns.

In an optional embodiment, the second assembly includes an electrical connection piece that is in communication with the second structural component, and the electrical connection piece is located between the second structural component and the adhesive conductive layer, so as to connect the second structural component to the first The structural member is conductive, and the side of the second structural member connected to the electrical connector is the conduction surface.

In this way, through the arrangement of the electrical connector, the second structural component can be connected to the first structural component, so as to realize reliable electrical connection between the first structural component and the second structural component.

In an optional embodiment, the second component further includes an insulating dielectric layer, and the insulating dielectric layer is located between the second structural member and the electrical connector, so that the electrical connector and the second structural member form a coupling feed assembly, The coupling feed assembly is configured to conduct the second structure component with the first structure component through the adhesive conductive layer.

In this way, through the arrangement of the insulating medium layer, a certain distance can be formed between the electrical connector and the second structural member, so as to form a coupling and feeding component, so that the second structural member can transmit electrical signals to the first through coupling and feeding. on structural parts.

In an optional embodiment, the adhesive conductive layer is a silver paste layer.

In this way, through the arrangement of the silver paste layer, while ensuring reliable electrical connection between the second structural member and the first structural member, the silver paste layer can also cover the electrical connection area to improve the contact effect on the surface of the electrical connection area.

The second aspect of the embodiment of the present application provides a manufacturing method of an electrical connection unit, the manufacturing method is applied to any one of the above electrical connection units, and the manufacturing method includes:

Forming the adhesive conductive pattern on the surface of the first structural member, so that the adhesive conductive pattern covers the electrical connection area of the first structural member and the protective layer around the electrical connection area; the first structural member includes a structural body and a protective layer, and the structural The body includes a metal part, and the electrical connection area is arranged on the metal part and exposed to the outside of the first structural part; the protective layer covers the surface of the metal part and is located on the peripheral side of the electrical connection area;

curing the adhesive conductive pattern to form an adhesive conductive layer;

The second component is connected to the adhesive conductive layer, so that the second structure in the second component is connected to the first structure.

Compared with the method of improving the electrical contact interface of the middle frame with the reed, the embodiment of the present application replaces the reed with a viscous conductive layer to improve the contact effect of the electrical connection area, realize the electrical connection between the second structural member and the first structural member, and also The thickness of the first structural member and the area occupied by the adhesive conductive layer on the first structural member can be reduced. In addition, through the setting of the viscous conductive layer, it is also possible to prevent the electrolyte from entering the electrical connection area, thus avoiding the galvanic corrosion of the first structural member in the electrical connection area, so that the viscous conductive layer covers the electrical connection area stably, ensuring The reliability of the connection between the second structural member and the first structural member improves the medium and long-term performance of the electronic equipment.

In an optional embodiment, the first plane of the structural body includes a plastic surface, the plastic surface is opposite to the conduction surface of the second structural member, and the electrical connection area is exposed on the first plane intersecting the first plane of the structural body. In two planes,

Forming the adhesive conductive pattern on the surface of the first structural member, so that the adhesive conductive pattern covers the electrical connection area of the first structural member and the protective layer around the electrical connection area, specifically includes:

Form the first conductive pattern on the first plane and the second plane respectively, so that the first conductive pattern covers the electrical connection area and the protective layer around the electrical connection area, and reserves The first dispensing area;

Dispense glue in the first dispensing area to form a second conductive pattern, so that the second conductive pattern connects two adjacent first conductive patterns. After the first conductive pattern is cured, the first conductive layer is formed. After the second conductive pattern is cured, the second conductive pattern is formed. Two conductive layers, the adhesive conductive layer includes a first conductive layer and a second conductive layer.

In this way, by reserving the setting of the first dispensing area, it is convenient to form the second conductive layer in the first dispensing area by dispensing, so as to realize the separation of the first conductive layer and the second conductive layer at different positions of the structural body. Printing, in order to select viscous conductive materials with different materials to form the first conductive layer and the second conductive layer according to the positions of the first conductive layer and the second conductive layer on the structural body. Compared with the existing silver paste layer printing method, the embodiment of the present application can reduce the manufacturing cost of the electrical connection unit and electronic equipment, reduce the structural size of the second conductive layer and the adhesive conductive layer, so as to avoid the existing silver paste layer. One-time printing of the paste layer has an impact on the performance of electronic devices.

In an optional embodiment, the structural body includes a plastic part connected to the metal part, and when the connection between the metal part and the plastic part is located in the middle of the second plane, an adhesive conductive pattern is formed on the surface of the first structural part so that the adhesive conductive pattern covers the electrical connection area of the first structural member and the protective layer around the electrical connection area, specifically comprising:

Forming a first conductive pattern on the second plane, and reserving a second dispensing area at the connection;

Dispensing glue in the second dispensing area to form a third conductive pattern, so that the third conductive pattern connects two adjacent first conductive patterns, the first dispensing area and the second dispensing area form the dispensing area of the structural body, The adhesive conductive layer further includes a third conductive layer formed by curing the third conductive pattern, and the elongation at break of the third conductive layer is greater than the elongation at break of the first conductive layer.

In this way, by reserving the setting of the second dispensing area, it is convenient to form the third conductive layer at the joint by dispensing, because the elongation at break of the third conductive layer is greater than that of the first conductive layer, so that the second The three conductive layers have a certain degree of ductility, which helps to reduce the problem of functional failure of the viscous conductive layer caused by the separation of metal parts and plastic parts when the structural body is impacted.

A third aspect of the embodiments of the present application provides an electronic device, where the electronic device includes the electrical connection unit according to any one of the above items.

In this way, through the setting of the electrical connection unit, reliable electrical connection between the second structural member and the second structural member in the electronic device can be realized, so as to improve the long-term performance of the electronic device, so that the electronic device has a relatively high weight and thickness of the whole machine. good earnings.

In an optional embodiment, the electronic device includes a middle frame, a display screen, a battery cover and a circuit board, the display screen and the battery cover are located on opposite sides of the middle frame, and the circuit board is located on the side of the middle frame facing the battery cover , the first structural member in the electrical connection unit is the middle frame, and the second structural member in the electrical connection unit is a circuit board and a display screen that can be conducted with the middle frame.

In this way, through the setting of the electrical connection unit, reliable electrical connection between the circuit board and the display screen and the middle frame can be realized, so as to facilitate the transmission of electrical signals between the circuit board, the display screen and the middle frame, and help to improve the performance of the electronic equipment. The long-term performance and the performance of the antenna make the electronic equipment have better benefits in terms of the weight of the whole machine and the thickness of the whole machine.

Description of drawings

FIG. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

FIG. 2 is an exploded view of an electronic device provided in an embodiment of the present application;

Fig. 3a is a structural schematic diagram 1 of a reed provided in the related art;

Fig. 3b is a structural schematic diagram 1 of a reed provided in the related art;

Fig. 4a is a connection schematic diagram 1 of a reed provided in the related art;

Fig. 4b is the connection schematic diagram 2 of the reed provided in the related art;

Fig. 4c is a connection schematic diagram 3 of the reeds provided in the related art;

Figure 5a is a schematic diagram of the connection of the silver paste layer on the middle frame provided in the related art;

Figure 5b is a schematic structural view of the silver paste layer provided in the related art;

Fig. 6 is the second schematic diagram of the connection of the silver paste layer on the middle frame provided in the related art;

FIG. 7 is a first structural schematic diagram of the electrical connection unit provided by the embodiment of the present application;

Fig. 8 is a schematic structural diagram 1 of the first component provided by the embodiment of the present application;

Fig. 9 is a schematic structural diagram II of the first component provided by the embodiment of the present application;

FIG. 10 is a schematic structural view of an electrical connection unit including the first component in FIG. 8;

Fig. 11 is the second structural schematic diagram of the electrical connection unit provided by the embodiment of the present application;

Fig. 12 is a schematic structural diagram III of the electrical connection unit provided by the embodiment of the present application;

Fig. 13 is a schematic view 4 of the structure of the electrical connection unit provided by the embodiment of the present application;

Fig. 14 is a schematic diagram five of the structure of the electrical connection unit provided by the embodiment of the present application;

Fig. 15 is a schematic diagram of the sixth structure of the electrical connection unit provided by the embodiment of the present application;

Fig. 16 is a structural schematic diagram of the silver paste layer at the corner of the middle frame in the related art;

Fig. 17 is a structural schematic diagram VII of the electrical connection unit provided by the embodiment of the present application;

FIG. 18 is a schematic eighth structural diagram of the electrical connection unit provided by the embodiment of the present application;

Figure 19 is a schematic diagram of the position of the adhesive conductive layer on the middle frame provided by the embodiment of the present application;

Fig. 20 is a schematic diagram of the position of the reed in the middle frame in the related art;

FIG. 21 is a test chart 1 of the antenna performance of the electronic device provided by the embodiment of the present application;

Figure 22 is a schematic diagram of the size of the reed on the middle frame in the related art;

Figure 23 is a schematic diagram of the size of the adhesive conductive layer on the middle frame provided by the embodiment of the present application;

Fig. 24 is a test chart 2 of the antenna performance of the electronic device provided by the embodiment of the present application;

FIG. 25 is a third test chart of the antenna performance of the electronic device provided by the embodiment of the present application;

Fig. 26 is a partial schematic diagram of an electronic device in the related art;

FIG. 27 is a test chart 4 of the antenna performance of the electronic device provided by the embodiment of the present application;

FIG. 28 is a fifth test chart of the antenna performance of the electronic device provided by the embodiment of the present application;

Fig. 29 is a fretting test diagram of the convex shrapnel provided by the embodiment of the present application;

Figure 30 is a fretting test diagram of the ball shrapnel provided by the embodiment of the present application;

Fig. 31 is a flow chart 1 of the manufacturing process of the electrical connection unit provided by the embodiment of the present application;

Figure 32 is the second manufacturing process flow diagram of the electrical connection unit provided by the embodiment of the present application;

FIG. 33 is a third flowchart of the manufacturing process of the electrical connection unit provided by the embodiment of the present application.

Explanation of reference signs:

100-electrical connection unit; 1-first assembly; 11-first structural member; 111-structural body; 1111-metal parts; 1112-plastic parts; 1113-electrical connection area; 1114-first plane; Plane; 1116-corner; 1117-connection; 1118-first dispensing area; 112-protective layer;

12-adhesive conductive layer; 121-first conductive layer; 122-second conductive layer; 123-third conductive layer; 124-contact area; 125-non-contact area;

2-Second component; 21-Second structure; 22-Electrical connector; 23-Insulation medium layer; 24-Air layer;

200-mobile phone; 210-display screen; 220-middle frame; 221-middle plate; 222-frame; 223-radium carving surface; 224-clearance area; 225-non-clearance area; 250 - battery;

300-reed; 310-welding area; 320-solder point; 400-silver paste layer; 410-round corner; 500-steel plate; The first conductive pattern; 720—the second conductive pattern.

detailed description

The terms used in the embodiments of the present application are only used to explain specific embodiments of the present application, and are not intended to limit the present application.

Contact impedance: When two conductors are in contact, because the surface cannot be completely smooth, the surfaces of the two conductors are completely in close contact, and the impedance generated in the two conductive electrical connection areas.

Galvanic corrosion: also known as contact corrosion, generally refers to the galvanic corrosion caused by two different metals in contact with each other while in the electrolyte. Since they constitute a spontaneous cell, it is the more active and anode metal that is corroded.

Standard electrode potential: Standard electrode potential refers to the equilibrium potential measured when the temperature is 25°C and the effective concentration of metal ions is 1 mol/L (that is, the activity is 1).

Equilibrium potential: The electrode potential that a metal has when it is immersed in an electrolytic solution containing only the metal salt and reaches equilibrium is called the equilibrium electrode potential of the metal.

n is the beginning of the frequency band number of the NR standard, x is the frequency band number, and nx represents the frequency band corresponding to the NR frequency band number x. The n78 frequency band can be regarded as the frequency band of the 5G standard. The n78 frequency band generally refers to the frequency band of 3400MHz-3600MHz.

Clearance area: mainly refers to the blank area around the antenna radiator of electronic equipment. In order to ensure that the antenna radiator obtains a large bandwidth, it is necessary to reserve enough clearance area for the antenna radiator.

Non-clearance area: mainly refers to the structural parts of the electronic equipment with antenna radiators, such as the area on the middle frame other than the clearance area.

An embodiment of the present application provides an electronic device, which may include but not limited to a mobile phone, a tablet computer (ie pad), a virtual reality (Virtual Reality, VR for short) device, a notebook computer, a personal computer (personal computer, PC), Ultra-mobile personal computer (UMPC), handheld computer, smart wearable device, sales terminal (Point of Sales, POS), etc. have two structural parts inside, and the two structural parts need to be electrically connected by means of shrapnel, etc. Connect electronic equipment.

The structure of the electronic device in the embodiment of the present application will be further described below by taking a mobile phone as an example.

FIG. 1 shows an overall view of the electronic device, and FIG. 2 shows a partial exploded view of the electronic device. Wherein, FIG. 1 and FIG. 2 illustrate the structure of the electronic device by taking a mobile phone as an example.

1 and 2, the electronic device may include a middle frame 220, a display screen 210, a battery cover 230 and a circuit board 240, the display screen 210 and the battery cover 230 are located on opposite sides of the middle frame 220, and the circuit board 240 is located in the middle One side of the frame 220 faces the battery cover 230 , so as to realize the assembly of the circuit board 240 in the electronic device such as the mobile phone 200 . Wherein, the circuit board 240 can be understood as a main board in the mobile phone 200 . The motherboard usually carries electronic components such as processor modules, various controller modules, storage modules, communication modules, radio frequency modules, and power management modules.

The display screen 210 can be arranged on one side of the middle frame 220 by bonding or other means, so as to realize the fixing of the display screen 210 on the middle frame 220, and the side where the display screen 210 is located constitutes the front of the electronic device. It can be seen from FIG. 2 that the electronic device may further include a battery 250 , and the battery 250 and the circuit board 240 are disposed together on a side of the middle frame 220 facing the battery cover 230 . The battery cover 230 can be fixed on the side of the middle frame 220 opposite to the display screen 210 by bonding, clamping or other means, so as to realize the fixing of the battery cover 230 on the middle frame 220 while enabling the battery cover 230 to be The cover is provided on the battery 250 and the circuit board 240 . The side where the battery cover 230 is located constitutes the back side of the electronic device.

Referring to FIG. 2 , the middle frame 220 may include a frame 222 and a middle plate 221 . The frame 222 surrounds the peripheral edge of the middle plate 221 and forms the middle frame 220 together with the middle plate 221 . The frame 222 is a square ring structure composed of a plurality of side frames 222 connected end to end. The middle frame 220 may be a metal middle frame, and part of the structure of the metal middle frame such as the side frame 222 may be used as an antenna radiator to realize the communication function of an electronic device such as the mobile phone 200 .

In some embodiments, the middle frame 220 may further include metal parts 1111 and plastic parts 1112 that are integrally connected. Specifically, the integrated connection of the metal part 1111 and the plastic part 1112 can be realized through injection molding. The metal piece 1111 can be located at the frame 222 of the middle frame 220 as an antenna radiator to realize the communication function of the electronic device such as the mobile phone 200 . The surface of the metal middle frame or the surface of the metal part 1111 can serve as an electrical contact interface for the middle frame 220 to be electrically connected to other components in the electronic device, such as the circuit board 240 and the display screen 210 .

Because the frame 222 of the middle frame 220 is used as the casing of the electronic device, the frame 222 can be used as an antenna. Therefore, in the electronic device, for the frame 222 of the middle frame 220 and the electronic device such as the circuit board 240 and the display screen 210 There is a need for a reliable electrical connection between other devices.

In some embodiments, when the battery cover 230 is a metal battery cover, the antenna radiator can also be formed on the battery cover 230 and electrically connected to the circuit board 240 .

Taking the antenna radiator located on the middle frame 220 as an example below, the structure of the electronic device of the present application will be further described.

The electronic device may also include components such as a camera, a microphone, a speaker, and decorations. For the location of the camera, microphone, and speaker in an electronic device such as a mobile phone 200, reference may be made to the description in the related art. In this embodiment, for the electronic device The structure of is not further limited.

Fig. 3a and Fig. 3b respectively illustrate the reeds with different structures. As shown in Fig. 3a and Fig. 3b, the reed 300 is usually a metal plate made of metal. Since the reed 300 has good wear resistance, it has become a new technology in the art to weld the reed 300 to improve the electrical contact interface of the middle frame. A common way. In order to facilitate the welding of the reed 300 and the middle frame, as shown in FIG. 3 a and FIG. 3 b , the reed 300 generally includes a welding area 310 and a contact area 124 a which are independent of each other.

4a to 4c respectively illustrate schematic diagrams of different welding methods of the reeds on the middle frame. As shown in FIG. 4a, the reed 300 is usually welded on the middle frame 220a by means of spot welding or ultrasonic welding, and covers the electrical contact interface of the middle frame 220a. The welding zone 310 of 300, the welding zone 310 can also be a molten pool zone. Other components in the electronic device, such as the circuit board 240a, etc., can abut against the contact area 124a of the reed 300 through the electrical connector 22a, such as a spring, so that while the circuit board 240a is electrically connected to the middle frame 220a, due to the reed 300 It has good wear resistance, and can improve the medium and long-term wear of the electrical contact interface of the middle frame 220a through the reed 300, and reduce the increase of the contact resistance caused by the medium and long-term wear of the electrical contact interface, thereby reducing the wear of the middle frame. 220a is the loss of electrical signals when the electrical contact interface is electrically connected to the circuit board 240a. It should be noted that mid-to-long-term wear can be understood as the wear of electronic equipment after a period of use (such as half a year or more), and mid-to-long-term wear can be used as a measure of the mechanical reliability of the middle frame 220a.

As shown in Figure 4c, when the circuit board 240a is electrically connected to the middle frame 220a through the electrical connector 22a and the reed 300, the contacts of the electrical connector 22a, such as the shrapnel, can only move within the contact area 124a, and the contacts of the contact area 124a A certain safety distance (such as 0.2 mm or more) is reserved between the outermost edge and the outermost edge of the welding area 310, so as to prevent the shrapnel from affecting the soldering point 320 of the welding area 310, thereby affecting the circuit board 240a and the middle frame The transmission of the electrical signal of 220a.

4a to 4c, in the related art, the reed 300 can be welded to the middle frame 220a by horizontal welding or side welding, so as to realize the fixing of the reed 300 on the middle frame 220a. In the related art, by adjusting the number of solder joints 320 in the soldering area 310, it is possible to provide a guarantee of pull-out force and impedance between the reed 300 and the middle frame 220a, so as to reduce the electrical contact interface between the middle frame 220a and the circuit board 240a. The loss of electrical signals during electrical connections. Therefore, in order to reduce the loss of electrical signals when the middle frame 220a is electrically connected to the circuit board 240a at the electrical contact interface, the reed 300 needs to be welded to the middle frame 220a through a plurality of solder joints 320, but this will make the welding area 310 and the reed 300 The area is very large.

In addition, in order to meet the welding strength between the reed 300 and the middle frame 220a and the structural strength of the middle frame 220a at the weld, there are certain requirements on the thickness of the middle frame 220a in the related art. Specifically, when the reed 300 is fixed on the middle frame 220a by means of spot welding, it is generally required that the thickness of the middle frame 220a at the welding place be greater than or equal to 0.5 mm. When the reed 300 is fixed on the middle frame 220a by ultrasonic welding, it is generally required that the thickness of the middle frame 220a at the welding place be greater than or equal to 0.4 mm.

Since the metal parts in the middle frame 220a are mostly made of lightweight metals such as aluminum, aluminum alloy, and magnesium alloy. However, due to the low potential difference (the difference between the zero potential and the zero potential) of such metals, the middle frame 220 a is very prone to galvanic corrosion at the electrical contact interface. Among them, the standard electrode potential of magnesium is -2.37V, and the standard electrode potential of aluminum is -1.67V. The equilibrium potentials of magnesium and aluminum are very small among metals, about 2V lower than that of iron. Due to the low potential of magnesium and aluminum, in the electrical connection system composed of different metal materials, magnesium or aluminum is used as an anode and is subject to galvanic corrosion. Magnesium suffers from galvanic corrosion more severely than aluminum.

Generally, for the middle frame 220a made of magnesium alloy, elements such as Al, Mn, Cu, Fe, Co, Ni need to be added to the magnesium alloy to increase the toughness and hardness of the middle frame 220a, so as to meet the needs of electronic equipment for the middle frame 220a. At the same time as required, magnesium is easy to form intermetallic compounds such as Mg ₄ Al ₃ , Mg ₂ Ni, FeAl ₃ , MgCu ₂ , etc. The potential difference between such intermetallic compounds and magnesium varies between 0.43-1.39, and the corrosion-prone Environment such as salt spray, high temperature and high humidity or electrolyte environment, even if the content of alloy elements is very low, but because the potential of magnesium is very low, in high temperature and high humidity or salt spray environment, the electrical contact interface of the middle frame 220a will still undergo galvanic corrosion .

Conventional hand sweat and water vapor in the air are generally acidic. In such an environment, conventional magnesium alloy materials and the above-mentioned magnesium alloy materials with added elements cannot pass medium and long-term performance tests (such as salt spray tests for a certain period of time), although the reed 300 covers the electrical contact interface of the middle frame 220a , but the radium engraved surface formed on the electrical contact interface of the middle frame 220a and the solder joints 320 will still undergo galvanic corrosion, making the reed 300 prone to detachment, resulting in failure of the reed 300. Among them, the medium and long-term performance test can be understood as placing metal materials such as magnesium alloy materials in a salt spray environment, and performing a salt spray test for a preset time to reflect the environmental reliability of the metal material.

Therefore, although the above method of welding the reed 300 can improve the mechanical reliability of the electrical contact interface of the middle frame 220a, it cannot guarantee that the active metals used to prepare the middle frame 220a, such as magnesium or seven-series aluminum, will survive medium and long-term performance tests. , the improvement effect on the environmental reliability at the electrical contact interface of the middle frame 220a. At the same time, since the reed 300 can improve the mechanical reliability of the electrical contact interface of the middle frame 220a, but there are certain requirements for the thickness of the middle frame 220a at the welding place, so the reed 300 is used to improve the electrical contact interface of the middle frame 220a The method cannot be realized in some electronic devices with a curved structure, and the contact area 124 a and the welding area 310 result in a relatively large area of the reed 300 .

For this reason, as shown in FIG. 5a, in the related art, it is proposed to cover the electrical contact interface of the middle frame 220a with silver paste such as conductive silver paste by metal melt spraying and other processes, so as to form silver paste at the electrical contact interface of the middle frame 220a. Layer 400, so that the silver paste layer 400 replaces the reed 300 and covers the electrical contact interface of the middle frame 220a to improve the electrical contact interface of the middle frame 220a and meet the mechanical reliability of the middle frame 220a at the electrical contact interface.

At the same time, referring to FIG. 5b and in conjunction with FIG. 3a, it can be seen that since there is no need to set the soldering area 310 on the silver paste layer 400, and there is no need to weld with the middle frame 220a, this can also reduce the metal of the middle frame 220a at the electrical contact interface. thickness and the area of the silver paste layer 400. With the diameter D of the contact area _124a on the reed 300 shown in Fig. 3a being 1.4mm, the structure of the reed 300 is a square, and the side length of the reed 300 is 2.4mm as an example, the silver paste layer shown in Fig. 5b The diameter D1 _of the contact area 124b of the electrical connector 22a arranged on the 400 can be 1.2mm-1.6mm, the structure of the silver paste layer 400 is a square, and the side length of the silver paste layer 400 can be greater than or equal to 1.2mm, and less than or Equal to 2.6mm. It can be seen that, when the areas of the contact area 124 a and the contact area 124 b are close to or the same, the area of the silver paste layer 400 is smaller than that of the reed 300 .

However, the silver paste layer 400 is used to improve the electrical contact interface of the middle frame 220a. After the medium and long-term performance test of the middle frame 220a, galvanic corrosion will still occur on the electrical contact interface of the middle frame 220a, and the silver paste layer 400 will lose its viscosity. , still cannot solve the problem of environmental reliability at the electrical contact interface of the middle frame 220a.

After research, it was found that the conditions for galvanic corrosion generally include the following three points:

1) Potential difference: The positive and negative poles must have a certain potential difference. For example, iron, Ni, etc. with a relatively positive potential are in contact with Mg or Al with a relatively negative potential. The greater the potential difference, the greater the tendency of galvanic corrosion. The potential difference is the driving force for the formation of galvanic corrosion.

2) Electronic channels: Galvanic corrosion needs to be connected by wires or directly contacted to form electronic channels. The electrons lost by the iron in the shrapnel reach the surface of the magnesium aluminum and are absorbed by the corrosive agent.

3) Electrolyte: Galvanic corrosion requires electrolyte coverage or immersion at the contact interface of the two metals. The electrons lost by the iron in the shrapnel form ions, and the electrons on the surface of Mg and Al are taken away by the corrosive agent in the electrolyte (such as oxygen in the air). Electrolytes become ion channels.

，银粉具有优良的导电性和化学稳定性，在空气中氧化缓慢，在胶层中几乎不氧化。基体树脂材料是导电浆料的结构骨架，是导电功能相银粉的载体，其作用是为导电银浆提供浆料基本的流变性、附着力，提供浆料基本的机械性能。基体树脂粘接相通常选用聚氨酯、聚酯、丙烯酸树脂、醇酸树脂、环氧树脂等。Conductive silver paste is composed of silver powder conductive functional phase, matrix resin bonding phase, solvent and other auxiliary additives. The conductive silver paste is printed on the paste carrier such as the middle frame 220a, and solidified under a certain temperature and time, the conductive silver paste can be firmly attached to the carrier, and the formed silver paste layer 400 has excellent conductivity, properties such as hardness, adhesion and bending resistance. Silver has excellent electrical and thermal conductivity at room temperature, and its volume resistivity is

, Silver powder has excellent electrical conductivity and chemical stability, oxidizes slowly in the air, and hardly oxidizes in the adhesive layer. The matrix resin material is the structural skeleton of the conductive paste and the carrier of the conductive functional phase silver powder. Its function is to provide the basic rheology and adhesion of the paste for the conductive silver paste, and provide the basic mechanical properties of the paste. The matrix resin bonding phase is usually made of polyurethane, polyester, acrylic resin, alkyd resin, epoxy resin, etc.

Referring to FIG. 6, in order to enhance the corrosion resistance of the middle frame 220a, the metal surface of the middle frame 220a is usually coated with a protective layer 112a, and the protective layer 112a is generally a film or an anodized layer. Since the protective layer 112a itself is corrosion-resistant, the matrix resin bonding phase in the conductive silver paste can isolate the electrolyte.

Through further analysis, the researchers found that, as shown in Figure 6, in order to enhance the adhesion of the conductive silver paste, the conductive silver paste only prints the electrical contact interface of the middle frame 220a, while the edge of the protective layer 112a and the edge of the silver paste layer 400 There will be gaps that can form entry paths for galvanic corrosion to occur. The electrical contact interface has a radium engraved surface 223 . In this way, when salt spray test and high temperature and high humidity test are carried out, the electrolyte will enter the electrical contact interface through this liquid inlet path, causing the active metals such as Mg and Al forming the electrical contact interface to undergo galvanic corrosion, and even further to the middle frame 220a. The internal reaction causes the silver paste layer 400 on the radium engraved surface 223 to lose viscosity, thereby affecting the reliability of the connection between the middle frame 220a and other components in the electronic device such as the circuit board 240a and the medium and long-term performance of the electronic device.

The medium and long-term performance of an electronic device may include, but is not limited to, the mechanical reliability and environmental reliability of the electronic device. Wherein, taking the middle frame 220 as an example, the mechanical reliability may include but not limited to medium and long-term wear of the middle frame 220 , and the environmental reliability may include but not limited to the environmental reliability of the middle frame 220 at the electrical contact interface.

In view of this, an embodiment of the present application provides an electrical connection unit, through which the reliability of the connection of the electrical connection unit can be ensured, and the medium- and long-term performance of the electronic device can be improved.

The structure of the electrical connection unit of the present application will be further elaborated below with reference to the drawings and embodiments.

Referring to FIG. 7 , the electrical connection unit 100 includes a first component 1 , the first component 1 includes a first structural member 11 and an adhesive conductive layer 12 , and the first structural member 11 includes a structural body 111 and a protective layer 112 . Wherein, the structural body 111 includes a metal piece 1111 . Exemplarily, the metal piece 1111 may include but not limited to aluminum, magnesium, aluminum alloy or magnesium alloy. The surface of the metal part 1111 has an electrical connection area 1113 , and the electrical connection area 1113 is exposed to the outside of the first structural part 11 , so as to meet the electrical connection requirements between the first structural part 11 and other components in the electrical connection unit 100 .

It can be seen from FIG. 7 that the protective layer 112 is located on the peripheral side of the electrical connection area 1113 and covers the surface of the metal piece 1111, so that the protective performance of the metal piece 1111 can be realized through the protective layer 112. At the same time, the electrical connection can be made The region 1113 is exposed to the outside of the first structural member 11 . Wherein, the protective layer 112 may include but not limited to a film, an anti-oxidation layer, an insulating layer or other layered structures capable of protecting the metal part 1111 . Exemplarily, the anti-oxidation layer can be formed by means of anodic oxidation, electrophoresis, spraying and the like. In this embodiment, the structure and formation method of the protective layer 112 are not further limited.

Referring to FIG. 7 , the adhesive conductive layer 12 covers the electrical connection area 1113 and the protective layer 112 around the electrical connection area 1113 . The second component 2 further includes a second structural component 21 , and the second structural component 21 is electrically connected to the electrical connection area 1113 through the adhesive conductive layer 12 . In this way, since the adhesive conductive layer 12 covers the electrical connection area 1113, the second structural member 21 is electrically connected to the electrical connection area 1113 through the adhesive conductive layer 12, thereby realizing the electrical connection between the first structural member 11 and the second structural member 21, so that the second structural member 21 is electrically connected to the second structural member 21. Electric signals are transmitted between the first structural member 11 and the second structural member 21 .

At the same time, since the adhesive conductive layer 12 covers the electrical connection area 1113, the contact effect on the surface of the electrical connection area 1113 can be improved by replacing the reed 300 with the adhesive conductive layer 12, and the contact of the first structural member 11 in the electrical connection area 1113 can be improved. Medium and long-term wear, so that when the electrical connection unit 100 is applied in an electronic device, it can meet the mechanical reliability of the electronic device for the first structural member 11 in the electrical connection area 1113 .

Compared with the method of improving the electrical contact interface of the middle frame 220a with respect to the reed 300, since the viscous conductive layer 12 does not need to separately provide the welding area 310 and weld the first structural member 11 through the welding area 310, the embodiment of the present application conducts electricity through the viscous The arrangement of the layer 12 can not only reduce the thickness of the first structural member 11, so as to select a better position on the first structural member 11 to form the electrical connection area 1113, but also realize the connection with the second structural member 21 through the adhesive conductive layer 12. electrical connection, so that the electronic device has a better return on the thickness of the whole machine, and can also reduce the structural size of the viscous conductive layer 12, thereby reducing the area occupied by the viscous conductive layer 12 on the first structural member 11, It can make the electronic equipment also have a good profit in terms of the weight of the whole machine.

On this basis, the setting of the protective layer 112 covering the electrical connection area 1113 and the surrounding side of the electrical connection area 1113 by the adhesive conductive layer 12 can prevent the electrolyte from entering the electrical connection area through the gap between the adhesive conductive layer 12 and the protective layer 112 1113, to eliminate the conditions for galvanic corrosion, thereby avoiding the galvanic corrosion of the first structural member 11 in the electrical connection area 1113, so that the viscous conductive layer 12 covers the electrical connection area 1113 stably, ensuring that the second structural member 21 and the electrical connection area 1113 are stable. The reliability of the electrical connection of the first structural member 11 improves the environmental reliability of the first structural member 11 in the electrical connection area 1113, so that when the electrical connection unit 100 is applied in an electronic device, the electronic device can meet the requirements for the first structural member 11. Environmental reliability requirements in the electrical connection area 1113.

Therefore, the arrangement of the adhesive conductive layer 12 in the embodiment of the present application not only effectively improves the medium and long-term performance of the first structural member 11 and the electronic device, but also makes the electronic device have better benefits in terms of overall weight and overall thickness.

In order to test the medium and long-term performance of the electrical connection unit 100, the embodiment of the present application conducts environmental tests on the electrical connection unit 100 such as salt spray test and high temperature and high humidity test. The test results show that the first structural member in the electrical connection unit 100 of the present application 11 Except for surface dirt, there is no corrosion. It can thus be explained that the present application can effectively improve the medium and long-term performance of the first structural member 11 through the adhesive conductive layer 12 .

When the electrical connection unit 100 is applied to an electronic device such as a mobile phone 200, as shown in FIG. Other components that need to be electrically connected to the middle frame 220 . Alternatively, when the first structural member 11 is a battery cover 230 of an electronic device such as a metal battery cover, the second structural member 21 is a circuit board 240 or other components in the electronic device that require electrical connection with the middle frame 220 . Alternatively, depending on the structure or type of the electronic device, the first structural member 11 and the second structural member 21 may also be other two structural members in the electronic device that require electrical connection. In this embodiment, the types of the first structural member 11 and the second structural member 21 are not further limited.

It should be noted that the surface of the electrical connection region 1113 is a radium engraved surface or a machined surface. In this way, the oxide layer of the metal part 1111 in the electrical connection area 1113 cannot be removed, so as to realize the electrical connection between the first structure part 11 and the second structure part 21, and a pattern can be formed on the radium engraving surface by means of radium engraving, so as to increase the The adhesion of the adhesive conductive layer 12 on the electrical connection area 1113 enhances the adhesive effect of the adhesive conductive layer 12 on the electrical connection area 1113 and the protective layer 112 . When the first structural member 11 is the middle frame 220 , the surface of the electrical connection area 1113 can also be regarded as the electrical contact interface of the middle frame 220 .

The structure of the electrical connection unit 100 of the present application will be further described below by taking the first structural member 11 as the middle frame 220 and the second structural member 21 as the circuit board 240 as an example.

The adhesive conductive layer 12 may include, but is not limited to, a silver paste layer 400 or other conductive layers with better conductive properties. Exemplarily, the silver paste forming the silver paste layer 400 may include but not limited to conductive silver paste. The adhesive conductive layer 12 of the present application adopts the silver paste layer 400, so as to ensure that the second structural member 21 forms a reliable electrical connection with the first structural member 11, and at the same time cover the electrical connection area 1113 with the silver paste layer 400 to improve The contact effect on the surface of the electrical connection area 1113 .

In this embodiment, the conductive silver paste can be formed on the first structure member 11 by means of pad printing or the like, so as to form the adhesive conductive layer 12 . This can not only realize the fixation of the adhesive conductive layer 12 on the first structural member 11, but also reduce or avoid the gap between the adhesive conductive layer 12 and the surface of the first structural member 11, such as the protective layer 112 and the electrical connection area 1113, and enhance The sticking effect of the adhesive conductive layer 12, the electrical connection area 1113 and the protective layer 112 ensures that the first structural member 11 and the second structural member 21 are connected, and at the same time, it can prevent electrolyte from entering the electrical connection between the adhesive conductive layer 12 and the protective layer 112. It is possible to connect the connection area 1113 and corrode the electrical connection area 1113.

In order to ensure that the adhesive conductive layer 12 can completely cover the gap between the adhesive conductive layer 12 and the protective layer 112, as shown in FIG. The edge covers the protection layer 112 around the electrical connection area 1113 . That is to say, there is a first overlapping area between the peripheral edge of the adhesive conductive layer 12 and the protective layer 112 . In this way, when the viscous conductive layer 12 covers the electrical connection area 1113, not only can the viscous conductive layer 12 completely cover the viscous conductive layer 12, but the medium and long-term wear and mechanical reliability of the first structural member 11 in the electrical connection area 1113 can be improved, and It can ensure that the viscous conductive layer 12 is connected to the protective layer 112, so as to block the path of the electrolyte entering the electrical connection area 1113, thereby avoiding galvanic corrosion of the first structural member 11 in the electrical connection area 1113, and improving the performance of the first structural member 11 in the electrical connection area 1113. Environmental reliability of the connection zone 1113.

It should be noted that the width W of the first overlapping region is larger than the printing tolerance of the adhesive conductive layer 12 , so as to ensure that the peripheral edges of the formed adhesive conductive layer 12 are all covered on the protective layer 112 . Wherein, the larger the width W of the first overlapping region, the better the effect of sealing the gap between the electrical connection region 1113 and the protective layer 112, but in practical applications, the width W of the first overlapping region needs to be limited to avoid Excessively large width W of the first overlapping region will affect the adjacent electrical connection units 100 on the first structural member 11 . In this embodiment, the width W of the first overlapping region is not further limited.

In some embodiments, as shown in FIG. 8 and FIG. 9 , the structural body 111 further includes a plastic part 1112 connected to the metal part 1111, and the adhesive conductive layer 12 is located between the metal part 1111 and the plastic part 1112 and covers the electrical connection area. 1113 , the protective layer 112 around the electrical connection area 1113 and the connection 1117 between the metal part 1111 and the plastic part 1112 . That is to say, the peripheral edge of the adhesive conductive layer 12 also has a second overlapping area with the plastic part 1112 . Regarding the definition of the width of the second overlapping area, reference may be made to the related description of the above-mentioned first overlapping area, and further details are not described herein. In this way, through the arrangement of the plastic parts 1112, the structure of the structural body 111 can be made more diversified, so as to meet the structural requirements of the first structural member 11 at different positions of the electronic device, and at the same time reduce the weight of the first structural member 11 , to reduce the cost of the first structural member 11 .

At the same time, by setting the adhesive conductive layer 12 to cover the joint 1117 between the metal part 1111 and the plastic part 1112, the adhesive conductive layer 12 can be covered on the electrical connection area 1113, the protective layer 112 and the plastic part 1112 at the same time, thereby avoiding electrolyte Enter the electrical connection area 1113 from the connection point 1117, and then completely close the path for the electrolyte to enter the electrical connection area 1113, so as to avoid the occurrence of galvanic corrosion in the electrical connection area 1113, and ensure the electrical connection area of the adhesive conductive layer 12 to the first structural member 11 The mechanical reliability and environmental reliability of 1113 achieve the purpose of improving the medium and long-term performance of the electrical connection unit 100 and electronic equipment.

Referring to FIG. 10 , by covering the plastic part 1112 with the adhesive conductive layer 12, the surface of the plastic part 1112 covered by the adhesive conductive layer 12 can also have a conductive function, so that the second component 2 can face the plastic part relative to the metal part 1111. One side of 1112 is offset, while realizing the electrical connection between the second structural member 21 and the first structural member 11, it can also increase the range where the second component 2 can be set relative to the first component 1, thereby strengthening the second component 2 A variety of positions are provided on the first component 1 .

It should be noted that when the structural body 111 includes metal parts 1111 and plastic parts 1112, in some embodiments, as shown in FIG. The protective layer 112 is formed on the outer surface of the metal part 1111 to form the first structural part 11 . At this time, there is no protective layer 112 on the side of the metal part 1111 adjacent to the plastic part 1112 .

Alternatively, in some other embodiments, as shown in FIG. 9 , the protective layer 112 can be formed on the outer surface of the metal part 1111 first, and then the metal part 1111 and the plastic part 1112 are injected to form the first structural part 11. At this time, the metal A side of the component 1111 adjacent to the plastic component 1112 has a protective layer 112 . When the first structural member 11 is the middle frame 220 , according to the manufacturing process of the middle frame 220 , it is possible to choose whether to inject or make the protective layer 112 first, which can make the manufacturing process of the middle frame 220 more flexible. In this embodiment, there is no further limitation on the forming manner of the first structural member 11 .

Referring to FIG. 10, the second assembly 2 also includes an electrical connector 22 that is connected to the second structural member 21, and the electrical connector 22 is located between the second structural member 21 and the adhesive conductive layer 12, so that the second structural member 21 conducts with the first structural member 11, the second structural member 21 has a conduction surface (not marked in the figure) which conducts with the first structural member 11, and the side of the second structural member 21 connected with the electrical connector 22 is conduction surface. The conducting surface may include but not limited to be a metal surface. The electrical connector 22 can be adhered to the conduction surface. In this way, through the arrangement of the electrical connecting member 22 , the second structural member 21 can be connected to the first structural member 11 , so as to realize reliable electrical connection between the first structural member 11 and the second structural member 21 .

In some embodiments, the electrical connector 22 may be a resilient electrical connector. Elastic electrical connectors may include but are not limited to shrapnel, conductive silicone and foam. Alternatively, in some embodiments, the electrical connector 22 may be a non-resilient electrical connector. Non-resilient electrical connectors may include, but are not limited to, bumps, gaskets, and conductive fabrics.

Specifically, the electrical connection unit 100 of the application can select different electrical connectors 22 according to the selection of the second structural member 21 so as to meet the requirements of the second structural member 21 on the elasticity and pressure of the electrical connector 22 . Alternatively, when the distance between the second structural component 21 and the first structural component 11 is limited, a non-elastic electrical connector can be selected to conduct the second structural component 21 with the first structural component 11 . In this embodiment, the type of the electrical connector 22 is not further limited.

Referring to Fig. 11 and Fig. 12, in some embodiments, the second component 2 may further include an insulating dielectric layer 23, and the insulating dielectric layer 23 is located between the second structural member 21 and the electrical connector 22, so that the electrical connector 22 and the second structural member 21 form a coupling and feeding assembly, and the coupling and feeding assembly is configured to conduct electricity between the second structural member 21 and the first structural member 11 through the adhesive conductive layer 12 . Exemplarily, the insulating dielectric layer 23 may include, but is not limited to, a high-dielectric insulating dielectric film. The high-dielectric insulating dielectric film can be prepared by using high DK (dielectric constant) materials in the related art. Wherein, the high DK material may include but not limited to an insulating dielectric material whose DK value is greater than or equal to 400.

In this way, through the setting of the insulating medium layer 23, a certain distance can be formed between the electrical connector 22 and the second structural member 21, so as to form a coupling and feeding assembly, so that the second structural member 21 can transmit electrical signals through coupling and feeding. For example, when the high frequency is transmitted to the first structural member 11, the effects of passing AC signals and blocking DC signals can be achieved by coupling the feed components, so that when the electrical connection unit 100 is applied to electronic devices such as mobile phones 200, radiation noise can be suppressed. The effect of dispersion (RSE) can help to achieve the purpose of rectifying the electromagnetic compatibility performance of the mobile phone 200, so as to meet the requirements of the mobile phone 200 for electromagnetic compatibility performance.

It should be noted that when the second component 2 includes the insulating dielectric layer 23 , the structural body 111 can also be formed by injection molding first or by forming the protective layer 112 first, which will not be further described here.

Referring to FIG. 13, in some embodiments, the second component 2 can also be provided with an insulating layer between the electrical connector 22 and the second structural member 21, and the insulating layer can be an air layer 24, so that signals such as high-voltage signals When the second structural member 21 is transmitted to the second structural member 21, the signal can break through the air layer 24, and through the form of air discharge, the second structural member 21 and the first structural member 11 are conducted to realize the second While the high-voltage signal on the structural member 21 is transmitted to the first structural member 11 , signal loss to other devices in the electronic device can also be avoided.

Taking the first structural member 11 as the middle frame 220 and the second structural member 21 as the battery cover 230 as an example, when the second structural member 21 is arranged on the first structural member 11, the second structural member 21 is fixed by bonding or the like. When on the first structural member 11 , there will be a certain gap between the first structural member 11 and the air in the gap can be used as the air layer 24 . In the process of transmitting the high-voltage signal from the second structural member 21 to the first structural member 11, the air layer 24 will first be broken down. Due to the setting of the viscous conductive layer 12, the high-voltage signal can be transmitted to the first structural member 11, so that It is avoided that the high-voltage signal reaches the circuit board 240 directly through the gap between the second structural member 21 and the first structural member 11 , thereby damaging the circuit board 240 .

On the basis of the above, as shown in FIG. 14 and FIG. 15 , the structural body 111 has a first plane 1114 and a second plane 1115 in the direction toward the second structural member 21, and the first plane 1114 and the second plane 1115 are structural bodies. 111 on the intersecting two faces. Wherein, the first plane 1114 is parallel to the conduction surface of the second structure component 21 . Wherein, the first plane 1114 can be regarded as a horizontal plane of the structural body 111 , and the second plane 1115 can be regarded as a side elevation perpendicular to the first plane 1114 on the structural body 111 . Both the first plane 1114 and the second plane 1115 are inner surfaces of the structural body 111 .

The adhesive conductive layer 12 covers at least the first plane 1114 (as shown in FIG. 14 and FIG. 15 ), the second structural member 21 is located at the corner 1116 of the first plane 1114 and the second plane 1115, and through the conductive surface and the adhesive The conductive layer 12 is connected to the first structural member 11, so that when the second structural member 21 is assembled in the first structural member 11, the structural form of the electrical connection unit 100 is more diversified. The setting of a plane 1114 or the first plane 1114 and the second plane 1115 can facilitate the selection of different lengths of the adhesive conductive layer 12 according to the location of the electrical connection area 1113, so that the second structural member 21 can pass through the conductive surface and the adhesive conductive layer 12. The conductive layer 12 conducts with the first structural member 11, thereby enhancing the reliability of the electrical connection between the second structural member 21 and the first structural member 11, and achieving the purpose of improving the medium and long-term performance of the electronic device.

It should be noted that, as shown in FIG. 14 , when the first structural member 11 is the middle frame 220, the metal member 1111 on the second plane 1115 can constitute an antenna radiator, and the side of the first plane 1114 close to the antenna radiator There is a clearance zone 224 , and a non-clearance zone 225 is provided on the side of the first plane 1114 away from the antenna radiator.

Wherein, as shown in FIG. 14 and FIG. 15 , when at least one electrical connection area 1113 is exposed on the first plane 1114, and the first plane 1114 also has a plastic surface of at least one plastic part 1112 on the side of the electrical connection area 1113, When the adhesive conductive layer 12 covers the electrical connection area 1113 on the first plane 1114, it can also cover the plastic surface on the side of the electrical connection area 1113 and the protective layer 112 at the same time, so that the plastic covered with the adhesive conductive layer 12 The surface also has a conductive function, so that the second structural member 21 can be electrically connected to the first structural member 11 through the adhesive conductive layer 12 on the plastic surface, and can also improve the medium and long-term performance of the first structural member 11 and electronic equipment.

The first plane 1114 has a plastic surface of the plastic part 1112 , the plastic surface is opposite to the conductive surface, and the electrical connection area 1113 is exposed to the second plane 1115 . At the corner 1116 where the second structural member 21 is located at the first plane 1114 and the second plane 1115, in order to realize conduction between the second structural member 21 and the electrical connection area 1113 of the first structural member 11 through the adhesive conductive layer 12, refer to FIG. 16 As shown, in the related art, the first plane 1114a and the second plane 1115a of the middle frame 220a are generally printed at the same time, so as to form the silver paste layer 400 on the first plane 1114a and the second plane 1115a by one printing. , it is necessary to reserve a rounded corner 410 with a radius of 0.5mm at the corner 1116a, otherwise the silver paste layer 400 will be disconnected.

The one-time printing method of the above-mentioned silver paste layer 400 may have the following effects:

1) Due to the reservation of the round corner 410, the silver paste layer 400 will be lengthened in the length direction (X direction in Figure 16). When the silver paste layer 400 is placed on the middle frame 220a, refer to Figure 16 and As shown in FIG. 14 , since the silver paste layer 400 is elongated in the length direction, the part of the silver paste layer 400 entering the non-clear area 225a on the middle frame 220a will be lengthened, thereby causing the performance of the antenna radiator on the middle frame 220a to deteriorate. , and easily occupy the assembly space of the circuit board 240 on the middle frame 220a.

2) Since the middle frame 220a only needs a thicker thickness in the silver paste area of the horizontal plane to meet the wear-resistant requirements of the middle frame 220a, and the same thickness must be used for printing at the same time, this method will lead to the side elevation of the middle frame 220a Waste of silver paste.

，纯银粉

。从辐射体性能的角度，希望银浆层400中电阻率大的区域面积越小越好，这样通过Ni粉的加入，使得银浆层400中电阻率大的区域变大，从而会影响辐射体性能。3) Simultaneous printing must use the same conductive silver paste material. In order to improve the wear problem, thicker film thickness is generally used, or powder with higher hardness, such as Ni powder, is added to the silver paste. However, after adding powder, the filler ratio of silver will decrease, and the resistivity of Ni powder is greater than that of silver, which will lead to the increase of resistivity of conductive silver paste. Exemplary, the resistivity of Ni powder is in

, pure silver powder

. From the perspective of radiator performance, it is hoped that the smaller the area of the high resistivity area in the silver paste layer 400, the better. In this way, the addition of Ni powder will increase the size of the area with high resistivity in the silver paste layer 400, which will affect the radiator. performance.

4) Since the printing is performed on two different interfaces of the electrical connection area 1113 formed by the metal part 1111 and the plastic surface, it is difficult to require the same conductive silver paste to achieve the same adhesion on the two different interfaces, which will lead to an increase in cost.

5) When the conductive silver paste is printed on the junction 1117 of the metal part 1111 and the plastic part 1112, the conductive silver paste itself does not have strong ductility after being printed and cured by baking. During the impact, the metal part 1111 and the plastic part 1112 will have a relatively strong deformation at the joint 1117, which will cause the metal part 1111 and the plastic part 1112 to separate seriously, and the silver paste layer 400 formed after baking does not have strong Ductility, because the metal part 1111 is separated from the plastic part 1112 and will be completely broken.

For this reason, when the first plane 1114 has the plastic surface of the plastic part 1112 and the electrical connection area 1113 is exposed to the second plane 1115, as shown in FIG. , the first conductive layer 121 is respectively located on the first plane 1114 and the second plane 1115 to cover the electrical connection area 1113 . Wherein, the second conductive layer 122 is located at the corner 1116 to connect the adjacent first conductive layer 121 so as to conduct the second structure component 21 with the electrical connection area 1113 . In this way, through the setting of the first conductive layer 121 and the second conductive layer 122, the first conductive layer 121 on the first plane 1114 and the second plane 1115 can be connected through the second conductive layer 122, and the adhesive conductive layer 12 continues to the first plane 1115. The plastic surface of the plane 1114 makes the plastic surface conductive, so as to ensure the electrical connection between the second structural component 21 and the first structural component 11 .

At the same time, through the arrangement of the first conductive layer 121 and the second conductive layer 122, the adhesive conductive layer 12 can also be printed separately at different positions of the structural body 111, so that according to the first conductive layer 121 and the second conductive layer 122 Depending on the position on the structural body 111, choose viscous conductive materials with different materials to form two first conductive layers 121 and second conductive layers 122 by printing separately, and form thicker conductive layers at the positions that require wear resistance. Conductive layer or choose the conductive silver paste containing Ni powder, in the non-contact area 125 of the viscous conductive layer 12, choose the conductive layer with thinner thickness and the all-silver conductive silver paste with better conductivity. In this way, compared with the one-time printing method of the silver paste layer 400, on the basis of improving the mechanical reliability and environmental reliability of the electrical connection area 1113 of the first structural member 11 through the adhesive conductive layer 12, not only can the conductive silver paste be avoided. Waste, reduce the manufacturing cost of the electrical connection unit 100 and electronic equipment, and do not need to reserve the round corner 410 at the corner 1116, can avoid the length of the non-clear area 225 where the viscous conductive layer 12 enters the middle frame 220 is too long, and reduce the second While the structural size of the second conductive layer 122 and the viscous conductive layer 12 can control the area of the larger resistivity area in the viscous conductive layer 12 within a smaller range, thereby avoiding the impact of one-time printing on the performance of the antenna radiator, To improve the performance of the antenna radiator.

It should be noted that the movable area of the contact of the electrical connector 22 such as the elastic piece on the adhesive conductive layer 12 is the contact area 124 of the adhesive conductive layer 12, and the areas on the adhesive conductive layer 12 except the contact area 124 are all non-contact areas. contact area 125 . Taking Fig. 17 as an example, the area where the first conductive layer 121 is located on the first plane 1114 is the contact area 124 of the viscous conductive layer 12, and the area where the first conductive layer 121 is located on the second conductive layer 122 and the first plane 1114 is viscous. The non-contact area 125 of the conductive layer 12 .

In addition, since this application can realize the printing of the viscous conductive layer 12 at different positions of the structural body 111, it is possible to select different conductive silver pastes of resin materials for different interfaces. 12 The difficulty of printing on different interfaces further reduces the manufacturing cost of the electrical connection unit 100 and the electronic device, and can also improve the adhesion of the silver paste layer 400 formed by simultaneous printing on different interfaces.

17, when the connection 1117 is located in the middle of the second plane 1115, the adhesive conductive layer 12 also includes a third conductive layer 123, and the third conductive layer 123 is located at the connection 1117 to connect the metal part 1111 and the plastic part 1112 and adjacent to the first conductive layer 121 . Wherein, the elongation at break of the third conductive layer 123 is greater than the elongation at break of the first conductive layer 121 . In this way, two adjacent first conductive layers 121 in the first plane 1114 are connected through the third conductive layer 123, so that the first conductive layer 121 on the first plane 1114 passes through the second conductive layer 122, the second conductive layer 122 and the connection 1117 between the first conductive layer 121 and the third conductive layer 123 are connected to the first conductive layer 121 covering the electrical connection area 1113, so that the second structure 21 can be connected to the first structure through the electrical connection 22. The structural components 11 are electrically connected, so that electrical signals can be transmitted between the second structural component 21 and the first structural component 11 .

At the same time, since the fracture elongation of the third conductive layer 123 is greater than that of the first conductive layer 121, the third conductive layer 123 has a certain degree of ductility, and when the structural body 111 is impacted, the third conductive layer 123 The layer 123 can deform along with the deformation of the metal part 1111 and the plastic part 1112 at the joint 1117, so as to avoid the breakage of the viscous conductive layer 12 at the third conductive layer 123, thereby effectively reducing the damage caused by the metal part 1111 and the plastic part. The problem of functional failure of the viscous conductive layer 12 caused by 1112 separation.

It should be noted that the silver paste forming the first conductive layer 121 has no elongation at break, and the elongation at break of the silver paste forming the third conductive layer 123 is 100%-300%, thereby ensuring the elongation at break of the third conductive layer 123 Greater than the fracture elongation of the first conductive layer 121 , the third conductive layer 123 has a certain degree of ductility.

Continuing to refer to FIG. 18 , when the connection 1117 is located at the corner 1116 , the third conductive layer 123 can be replaced by the second conductive layer 122 to connect the metal part 1111 and the plastic part 1112 and the adjacent first conductive layer 121 . At this time, the elongation at break of the second conductive layer 122 is greater than the elongation at break of the first conductive layer 121, so that the second conductive layer 122 has a certain degree of ductility, thereby effectively reducing the viscous conduction caused by the separation of the metal part 1111 and the plastic part 1112. While eliminating the problem of functional failure of the layer 12, the structures of the adhesive conductive layer 12, the first component 1 and the electrical connection unit 100 can also be simplified. Wherein, the elongation at break of the silver paste in the second conductive layer 122 can refer to the related description of the third conductive layer 123 above, and no further details are given here.

As shown in Figure 17, the first conductive layer 121 is a pad printing adhesive conductive layer, the corner 1116 and the joint 1117 are glue dispensing areas, and the second conductive layer 122 and the third conductive layer 123 are formed in the glue dispensing area by dispensing. conductive layer. In this way, the pad printing adhesive conductive layer can be formed by pad printing, and the second conductive layer 122 and the third conductive layer 123 can be formed by dispensing glue in the dispensing area, so that the adhesive conductive layer 12 can be formed at different positions of the structural body 111. At the same time of printing separately, it is also possible to select suitable viscous conductive materials such as silver paste according to the performance requirements of the structural body 111 for the viscous conductive layer 12 at different positions, and to form by printing separately at different positions of the structural body 111 The first conductive layer 121, the second conductive layer 122 and the third conductive layer 123, on the basis of meeting the performance requirements of the adhesive conductive layer 12 at different positions of the structural body 111, the second conductive layer 122 and the third conductive layer 123 are formed in the dispensing area. The third conductive layer 123 does not need to reserve the rounded corners 410 , and can also reduce the structural size of the second conductive layer 122 and the adhesive conductive layer 12 .

It should be noted that, the second conductive layer 122 and the third conductive layer 123 can be formed by dispensing glue in the glue dispensing area through a glue dispensing device such as a glue spraying device with a piezoelectric valve. Since the wire diameter of the conductive layer formed by the dispensing of the existing glue spraying equipment can be as small as 0.8 mm, the second conductive layer is formed by dispensing glue with the glue spraying equipment on the basis of not needing to reserve round corners 410 122, the size requirement of the second conductive layer 122 at the corner 1116 can be further reduced.

It should be noted that, when the structural body 111 has a corner 1116 , the first structural member 11 can be electrically connected to any of the above-mentioned second components 2 through the adhesive conductive layer 12 .

Referring to FIG. 18 , the thickness of the first conductive layer 121 on the first plane 1114 is greater than the thickness of the first conductive layer 121 on the second plane 1115 . At this time, the first conductive layer 121 on the first plane 1114 and the first conductive layer 121 on the second plane 1115 can use silver paste of the same material, so as to satisfy the requirements of the first structure by thickening the first conductive layer 121. While improving the wear resistance of the component 11 on the first plane 1114 , it can also reduce the waste of viscous conductive material such as silver paste forming the first conductive layer 121 on the second plane 1115 , thereby reducing the manufacturing cost of the first component 1 .

Alternatively, in some embodiments, the hardness of the first conductive layer 121 on the first plane 1114 is greater than the hardness of the first conductive layer 121 on the second plane 1115 . Specifically, the wear resistance of the first structural member 11 to the first plane 1114 can be satisfied by adding a powder with higher hardness such as Ni powder in the silver paste, while the addition of Ni powder will cause the first plane 1114 to The resistivity of the first conductive layer 121 increases, because Ni powder is only added in the first conductive layer 121 on the first plane 1114, so compared with the first plane 1114 and the second plane 1115, all adopt the same silver paste printing In this way, the embodiment of the present application can control the region with higher resistivity in the viscous conductive layer 12 within the first plane 1114, so as to reduce the area of the region with higher resistivity in the viscous conductive layer 12, thereby helping to improve electronic equipment. The performance of the antenna radiator.

17 and 18, when the structural body 111 has a corner 1116, the first structural member 11 can be the middle frame 220 of the electronic device, and when the metal member 1111 of the first structural member 11 is located on the side of the second structural member 21 , the metal part 1111 is an antenna radiator of an electronic device such as a mobile phone 200, and the second structural part 21 is a circuit board 240 of the electronic device. In this way, the circuit board 240 can form a reliable electrical connection with the antenna radiator, while realizing signal transmission between the circuit board 240 and the antenna radiator, due to the setting of the first conductive layer 121 and the second conductive layer 122, adhesive conduction The layer 12 is printed separately at different positions of the structural body 111 to reduce the structural size of the viscous conductive layer 12, so as to prevent the performance of the antenna radiator from being affected by the viscous conductive layer 12 once printed, and to enable the electronic device to Both the weight of the whole machine and the thickness of the whole machine have good benefits.

In order to verify the improvement of the performance of the antenna radiator due to the setting of the viscous conductive layer 12, the present application takes the first structural member 11 as the middle frame 220 and the second structural member 21 as the circuit board 240 as an example, and the performance of the antenna radiator A simulation was performed.

Simulation one:

As shown in FIG. 19 , since the setting of the viscous conductive layer 12 has no requirement on the thickness of the metal piece 1111 in the first structural member 11, the optimal metal piece 1111 in the middle frame 220 can be selected on the framework of the middle frame 220. The electrical connection area 1113 is formed in order to improve the performance of the antenna radiator on the middle frame 220 by disposing the adhesive conductive layer 12 on the electrical connection area 1113 so as to electrically connect with the first circuit board 240 through the adhesive conductive layer 12 .

As shown in FIG. 20 , the electrical connector 22 a such as foam in contact with the reed 300 is limited by the spot welding thickness requirement on the middle frame 220 , and can only be arranged on the middle frame 220 a as shown in FIG. 20 . Since the viscous conductive layer 12 of the present application is not limited to the thickness of the middle frame 220 when it is set, therefore, when the middle frame 220 adopts the electrical connection unit 100 of the present application, the viscous conductive layer 12 can be compared with the position in FIG. 20 Move, so that the electrical connection position between the middle frame 220 and the circuit board 240 is also moved up, so that the electrical connection area 1113 is located at the position shown in FIG. 19 . Compared with the reed 300 in FIG. The frame 222 of the antenna radiator is usually arranged on the frame 222, which can make the electrical connection position closer to the antenna radiator, so as to reduce the loss of signal transmission on the antenna radiator.

As shown in Figure 21, curve _S0 is the simulation curve of the antenna radiator performance of reed 300 at the position shown in Figure 19, and curve S1 is the simulation curve _of the antenna radiator performance of viscous conductive layer 12 at the position shown in Figure 20 . It can be seen from Figure 21 that, taking the n78 frequency band as an example, the performance of the n78 frequency band can be improved by 1dB.

Simulation two:

Figure 22 is a schematic diagram of the size of the reed 300 on the middle frame 220a in the related art, and Figure 23 is a schematic diagram of the size of the adhesive conductive layer on the middle frame 220. At least a partial structure of the shrapnel.

Referring to Fig. 22, the reed 300 covers the middle frame 220a, and the side of the spring abuts against the reed 300. Exemplarily, the width a of the reed 300 may be 3.6mm. As shown in FIG. 23 , the viscous conductive layer 12 covers the middle frame 220 , and the side of the elastic piece abuts on the viscous conductive layer 12 . The width b of the adhesive conductive layer 12 may be 2 mm. It can be seen that compared with the scheme of improving the electrical contact interface of the middle frame 220a with the reed 300, the application can reduce the area of the viscous conductive layer 12 and the structural size of the viscous conductive layer 12 through the setting of the viscous conductive layer 12, so that The width of the viscous conductive layer 12 is reduced so that more antenna radiators can be arranged on the middle frame 220, thereby improving the performance of the antenna radiator.

The results of performance tests on multiple frequency bands are as follows:

As shown in Figure 24 and Figure ₂₅ , curve S2 is the simulation curve of the antenna radiator performance of reed ₃₀₀ at the position shown in Figure 22, and curve S3 is the antenna radiator performance of viscous conductive layer 12 at the position shown in Figure 23 simulation curve. Referring to Figure 24, Figure 25 and Table 1, it can be seen that compared with the setting of the reed 300, this application makes the antenna radiator work at 2.4Ghz-2.5Ghz, 3.3Ghz-3.8Ghz through the setting of the viscous conductive layer 12. and 5.1Ghz-5.9Ghz band performance with at least a 0.1dB gain.

Simulation three:

After the electrical connection unit 100 of the present application, the gain in overall thickness of the electronic device such as the mobile phone 200 will reach 0.2mm-0.7mm. In the following, taking the reed 300 as a comparison, the benefits of the present application on the thickness of the whole machine will be described in detail.

FIG. 26 shows a partial schematic diagram of an electronic device in the related art. As shown in FIG. 26 , at the electrical connection position between the middle frame 220 a and the circuit board 240 , the reed 300 is fixed on the middle frame 220 a by riveting. Taking the thickness c of the middle frame 220a as 1mm as an example, the minimum thickness d of the reed 300 covering the middle frame 220a and overlapping with the middle frame 220a is 0.2mm, so the total thickness of the overlapping portion of the reed 300 and the middle frame 220a is 1.2mm. After using the electrical connection unit 100 of the present application, at the electrical connection position between the middle frame 220 and the circuit board 240, the thickness of the middle frame 220 can be reduced to 0.5mm, and the thickness of the adhesive conductive layer 12 can reach 0.04mm. The thickness of the middle frame 220 at the location of the static elimination connection can remain unchanged.

Since the thickness of the middle frame 220 is reduced at the electrical connection position, the distance between the middle frame 220 and the display screen 210 can be increased by 0.66 mm, which is helpful to improve the performance of the antenna radiator. The results of performance tests on multiple frequency bands are as follows:

Table 2 is another income table for multiple frequency bands after setting the viscous conductive layer

Frequency band (Ghz) 2.4-2.5 3.3-3.8 5.1-5.9 Gain (dB) 0.3 0.6 0.3

As shown in Figure ₂₇ and Figure 28, curve S4 is the simulation curve of the antenna radiator performance of reed 300 at the position shown in Figure ₂₆ , and curve S5 is the antenna radiator performance after replacing reed 300 by viscous conductive layer 12 simulation curve. Referring to Figure 27, Figure 28 and Table 1, it can be seen that compared with the setting of the reed 300, the application uses the setting of the viscous conductive layer 12 to make the antenna radiator operate at 2.4Ghz-2.5Ghz, 3.3Ghz-3.8Ghz and 5.1Ghz-5.9Ghz band performance with at least a 0.3dB gain.

It should be noted that after the reed 300 is replaced by the viscous conductive layer 12, the density of the conductive silver paste used to form the first conductive layer 121, the second conductive layer 122 and the third conductive layer 123 in this application is half of the density of the reed 300, When the area of the contact zone 124 of the viscous conductive layer 12 and the contact zone 124 of the reed 300 is the same, the volume of the viscous conductive layer 12 is 1/4 of the volume of the reed 300, therefore, the quality of the viscous conductive layer 12 is 1/4 of the reed 300. One-eighth of the quality of 300. Since electronic devices generally have multiple (eg, 6-40) electrical connection units 100 , replacing the reeds 300 with the viscous conductive layer 12 can greatly benefit the weight and thickness of the electronic device. It should be noted that the above gains have not yet calculated the weight gains due to the thinning of the first structural member 11 .

In order to verify the improvement of the medium and long-term wear resistance of the first component 1 , a wear test was carried out in the embodiment of the present application. Specifically, 14,400 fretting tests were carried out on the first component 1 with a viscous conductive layer 12 having a thickness of 35 um by using convex shrapnel and ball-head shrapnel. In the fretting test, a certain contact force is applied to the convex shrapnel or ball-head shrapnel, and reciprocating motion is performed on the viscous conductive layer 12 under a certain stroke range and preset test speed, and the first structural member can be simulated through the fretting test 11 and the slight drop of the electronic equipment, through multiple fretting tests, can reflect the medium and long-term wear resistance of the first component 1 . Wherein, the silver paste in the viscous conductive layer 12 is all silver paste (that is, no powder such as nickel powder is added).

In the following, the test results of the 3750th fretting test of convex shrapnel and ball-head shrapnel under different contact forces are taken as examples to illustrate.

FIG. 29 schematically shows a fretting test diagram of the convex shrapnel on the first assembly 1 , and FIG. 30 schematically shows a fretting test diagram of the ball shrapnel on the first assembly 1 . Referring to Fig. 29 and Fig. 30, and in combination with Table 3 and Table 4, it can be seen that when the convex-hull shrapnel or the convex-hull shrapnel reciprocate on the viscous conductive layer 12, the impedance on the viscous conductive layer 12 is relatively stable and low, so that Avoid the phenomenon of large impedance when the viscous conductive layer 12 is worn.

After the 3750th fretting test, the first component 1, the convex shrapnel and the ball shrapnel were observed under a microscope. It can be found through microscope observation that the viscous conductive layer 12 is still covering the first structural member 11, and there is no restriction on the exposure of the plastic surface covered by the viscous conductive layer 12 on the first structural member 11. The surface metal has been slightly peeled off, but the performance of the convex shrapnel and the ball shrapnel has not deteriorated. It can be seen that through the provision of the viscous conductive layer 12, the medium and long-term wear resistance of the electrical connection unit 100 and the electronic device can be improved, so that the electrical connection unit 100 and the electronic device have better mechanical reliability. The wear resistance of the viscous conductive layer 12 formed by the silver paste added with nickel powder is better than that of the viscous conductive layer 12 of all silver paste, and the viscous conductive layer 12 can be made thinner.

It should be noted that, if the influence of the reserved rounded corners 410 on the performance of the antenna radiator is ignored, this application can also adopt the design of the reserved rounded corners 410 at the corner 1116, and only reserve glue at the joint 1117 Glue is dispensed in each area to overcome the problem that the viscous conductive layer 12 is broken due to the separation of the metal part 1111 from the plastic part 1112 .

On the basis of the above, the embodiment of the present application also provides a method for manufacturing an electrical connection unit, and the manufacturing method is applied to any one of the electrical connection units 100 above. Referring to Figure 31, the manufacturing method includes:

Step S100: Form an adhesive conductive pattern on the surface of the first structural member, so that the adhesive conductive pattern covers the electrical connection area of the first structural member and the protective layer around the electrical connection area; the first structural member includes a structural body and a protective layer Layer, the structural body includes a metal part, the electrical connection area is arranged on the metal part, and is exposed to the outside of the first structural part; the protective layer is coated on the surface of the metal part and is located on the peripheral side of the electrical connection area;

Step S200: curing the adhesive conductive pattern to form an adhesive conductive layer;

Step S300: Connecting the second component to the adhesive conductive layer, so that the second structural component in the second component is conductive to the first structural component.

It should be noted that, the structure of the first structural member 11 can refer to the above description, and no further details are given here. The adhesive conductive pattern 700 can be covered on the electrical connection area 1113 and the protection layer 112 by pad printing. Compared with the method of improving the electrical contact interface of the middle frame 220 with the reed 300, the embodiment of the present application replaces the reed 300 with the viscous conductive layer 12 to improve the contact effect of the electrical connection area 1113, so as to realize the connection between the second structural member 21 and the first structural member. 11 while being electrically connected, the thickness of the first structural member 11 and the area occupied by the adhesive conductive layer 12 on the first structural member 11 can also be reduced.

In addition, through the setting of the viscous conductive layer 12, it is also possible to prevent the electrolyte from entering the electrical connection area 1113, thereby avoiding galvanic corrosion of the first structural member 11 in the electrical connection area 1113, so that the viscous conductive layer 12 stably covers the electrical connection area 1113. The connection area 1113 ensures the reliability of the connection between the second structural member 21 and the first structural member 11 , and improves the medium and long-term performance of the electrical connection unit 100 and the electronic device.

Before step S100, referring to FIG. 32, the manufacturing method further includes:

First, a groove body 510 is opened on the steel plate 500, the depth of the groove is adapted to the thickness of the adhesive conductive layer 12, the shape of the groove is adapted to the adhesive conductive pattern 700, and then the adhesive conductive pattern 700 is formed on the pad printing head 600 Next, step S100 is performed to form the adhesive conductive pattern 700 on the surface of the first structural member 11, so that the adhesive conductive pattern 700 covers the electrical connection area 1113 of the first structural member 11 and the protective layer 112 around the electrical connection area 1113 After that, step S200 is performed to solidify the adhesive conductive pattern 700 by baking to form the adhesive conductive layer 12, and finally step S300 is performed to conduct the second component 2 with the adhesive conductive layer 12, so that the second structure in the second component 2 The component 21 is connected to the first structural component 11 to form an electrical connection unit 100 .

It should be noted that before performing step S100 to form the adhesive conductive pattern 700 on the surface of the first structural member 11 , it is necessary to perform pretreatment on the first structural member 11 such as the middle frame 220 that meets the design requirements. The pre-processing generally includes performing laser engraving or mechanical processing on the metal surface of the middle frame 220 exposed to the protective layer 112 , followed by surface cleaning such as dust removal, so as to form the electrical connection area 1113 . In this way, the adhesive force of the viscous conductive layer 12 on the middle frame 220 can be improved.

Wherein, the pad printing process, the design requirements of the middle frame 220 and the curing process of the adhesive conductive pattern 700 can refer to the description in the related art, and no further details are given here. When the structural body 111 can also include a plastic part 1112, the electrical connection area 1113 is located on the surface of the metal part 1111 and is on the same plane as the plastic surface of the plastic part 1112, and the adhesive conductive pattern 700 can also be covered on the surface by pad printing. The electrical connection area 1113, the protective layer 112 and the plastic part 1112 on the side of the electrical connection area 1113, so that the adhesive conductive layer 12 formed after the adhesive conductive pattern 700 is cured can simultaneously electrically connect the area 1113, the protective layer 112 and the electrical connection area 1113 The plastic part 1112 on the peripheral side improves the medium and long-term performance of the electrical connection unit 100 and the electronic device.

The first plane 1114 of the structural body 111 includes a plastic surface, the plastic surface is disposed opposite to the conductive surface of the second structural member 21, and the electrical connection area 1113 is exposed to the second plane 1115 of the structural body 111 intersecting the first plane 1114 ,

Referring to FIG. 33 , in the above step S100, the adhesive conductive pattern 700 is formed on the surface of the first structural member 11, so that the adhesive conductive pattern 700 covers the electrical connection area 1113 of the first structural member 11 and the area around the electrical connection area 1113. The protective layer 112 specifically includes:

Step S110: Form a first conductive pattern on the first plane and the second plane respectively, so that the first conductive pattern covers the electrical connection area and the protective layer around the electrical connection area, and at the corner of the first plane and the second plane reserve the first dispensing area;

Step S120: dispensing glue in the first dispensing area to form a second conductive pattern, so that the second conductive pattern connects two adjacent first conductive patterns, the first conductive pattern is cured to form a first conductive layer, and the second conductive pattern is cured After forming the second conductive layer, the adhesive conductive layer includes the first conductive layer and the second conductive layer.

It should be noted that by reserving the setting of the first dispensing area 1118, it is convenient to form the second conductive layer 122 in the first dispensing area 1118 by dispensing, so as to realize the first conductive layer 121 and the second conductive layer. 122 are printed separately at different positions of the structural body 111, so that according to the position of the first conductive layer 121 and the second conductive layer 122 on the structural body 111, adhesive conductive materials with different materials are selected to form the first conductive layer 121 and the second conductive layer 122 . Compared with the method of printing the silver paste layer 400 once, the embodiment of the present application can reduce the manufacturing cost of the electrical connection unit 100 and the electronic device, reduce the structural size of the second conductive layer 122 and the adhesive conductive layer 12, so as to avoid the silver paste layer 400 prints have an impact on the performance of electronic devices.

The first conductive pattern 710 is usually printed on the first plane 1114 and the second plane 1115 by the pad printing head 600, and the pad printing head 600 is generally a soft rubber head, so after the first conductive pattern 710 is formed on the pad printing head 600, the During the pad printing head 600 pad printing the first conductive pattern 710 onto the first plane 1114 and the second plane 1115, since the corner 1116 of the first plane 1114 and the second plane 1115 is set at a right angle, the pad printing head 600 cannot The first conductive pattern 710 is pad printed at the corner 1116, so the first conductive pattern 710 can be broken at the corner 1116 without covering the corner 1116, and the position where the broken line appears at the corner 1116 forms the first dispensing area 1118 , so as to facilitate the subsequent formation of the second conductive layer 122 .

Alternatively, in some embodiments, the corner 1116 can also be covered by a shield, so that after the pad printing head 600 pad-prints the first conductive pattern 710 onto the first plane 1114 and the second plane 1115 , it can be removed. The mask is used to form the first dispensing area 1118 . In this embodiment, the formation method of the first dispensing area 1118 is not further limited.

Among them, in order to meet the different requirements for the first conductive layer 121 on the first plane 1114 and the second plane 1115, the first plane 1114 and the second plane 1115 can be printed in stages by the pad printing head 600, so that the first plane 1114 The thickness of the upper first conductive layer 121 is greater than the thickness of the first conductive layer 121 on the second plane 1115 , so as to meet the wear resistance requirement of the first plane 1114 when the first structural member 11 is used as the middle frame 220 .

Or, in some embodiments, when the pad printing head 600 prints the first plane 1114 and the second plane 1115 in stages, and selects different silver pastes to satisfy the first structural member 11 as the middle frame 220, the middle Box 220 requires the wear resistance of the first plane 1114 . Specifically, when the pad printing head 600 prints on the first plane 1114, it may be selected to add powder such as nickel powder to the silver paste, so that after the pad printing head 600 prints the first conductive pattern 710 on the first plane 1114, it can make The first conductive layer 121 formed on the first plane 1114 has better hardness to meet the requirements of the middle frame 220 on the hardness and wear resistance of the first plane 1114 when the first structural member 11 is used as the middle frame 220 . When the pad printing head 600 prints on the second plane 1115, all silver paste can be selected, so that after the pad printing head 600 prints the first conductive pattern 710 on the second plane 1115, the first conductive pattern 710 formed on the second plane 1115 can be made A conductive layer 121 has a relatively small resistivity, so that when the first structural member 11 is used as the middle frame 220 , the excessively large resistivity area in the viscous conductive layer 12 will affect the performance of the antenna radiator.

It should be noted that, when the first plane 1114 and the second plane 1115 are printed in batches by the pad printing head 600, the structure of the pad printing head 600 can be changed, for example, the structural size of the pad printing head 600 can be reduced, so that the pad printing head 600 When printing is performed on one side of the first plane 1114 and the second plane 1115 , it will not be printed on the other side.

Referring to FIG. 32 , the second conductive pattern 720 can be formed by dispensing glue at the first glue dispensing area 1118 by a glue dispensing device such as a glue spraying device with a piezoelectric valve. Since the wire diameter of the second conductive pattern 720 formed by the dispensing of the existing glue spraying equipment can be at least 0.8 mm, the first conductive pattern on the first plane 1114 and the second plane 1115 connected by the second conductive layer 122 At the same time, since there is no need to reserve rounded corners 410 at the corners 1116, the size of the second conductive layer 122 at the corners 1116 can also be reduced to improve the performance of the antenna radiator.

The structural body 111 includes a plastic part 1112 connected to the metal part 1111, and when the connection 1117 between the metal part 1111 and the plastic part 1112 is located in the middle of the second plane 1115, the adhesive conductive pattern 700 is formed on the surface of the first structural part 11, To make the adhesive conductive pattern 700 cover the electrical connection area 1113 of the first structural member 11 and the protective layer 112 around the electrical connection area 1113 specifically include:

Form the first conductive pattern 710 on the second plane 1115, and reserve a second dispensing area at the connection 1117;

Dispense glue in the second dispensing area to form a third conductive pattern, so that the third conductive pattern connects two adjacent first conductive patterns 710, and the first dispensing area 1118 and the second dispensing area form the points of the structural body 111 In the glue area, the adhesive conductive layer 12 further includes a third conductive layer 123 formed by curing the third conductive pattern, and the elongation at break of the third conductive layer 123 is greater than the elongation at break of the first conductive layer 121 .

It should be noted that, by reserving the setting of the second dispensing area, it is convenient to form the third conductive layer 123 at the joint 1117 by dispensing, because the fracture elongation of the third conductive layer 123 is greater than that of the first conductive layer 121 The elongation at break makes the third conductive layer 123 have a certain degree of ductility, which helps to reduce the problem of functional failure of the viscous conductive layer 12 caused by the separation of the metal part 1111 and the plastic part 1112 when the structural body 111 is impacted.

Wherein, the way of reserving the second dispensing area can adopt the method of covering the first dispensing area 1118 mentioned above to form the first dispensing area 1118 . Alternatively, the structure of the pad printing head 600 can also be changed, such as opening a groove at the position where the pad printing head 600 is opposite to the connection 1117, so that when the pad printing head 600 is printing the second plane 1115, the second dispensing area can be formed . In this embodiment, there is no further limitation on the way of reserving the second dispensing area and the formation of the third conductive pattern.

It should be noted that when the junction 1117 of the metal part 1111 and the plastic part 1112 is located at the corner 1116 , the second conductive layer 122 can be replaced by the third conductive layer 123 to realize the function of the third conductive layer 123 .

After the silver paste is solidified, it is necessary to carry out corresponding inspections on the first component 1, such as appearance inspection, adhesion inspection, resistance inspection, REE monomer test, mechanical reliability and environmental reliability test, etc., in order to ensure that the first assembly 1 can Meet the design requirements.

It should be noted that since the electronic equipment of the present application includes the electrical connection unit 100 as described above, the electrical connection unit 100 can also improve the electrical connection between the two components in the electronic equipment. The long-term performance and the performance of the antenna radiator make the electronic equipment have better benefits in terms of the weight and thickness of the whole machine.

In the description of the embodiments of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a An indirect connection through an intermediary may be an internal communication between two elements or an interaction relationship between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in the embodiments of the present application according to specific situations.

The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of the present application and the above drawings are used to distinguish similar objects, and It is not necessarily used to describe a particular order or sequence.

Claims (15)

1. An electrical connection unit, characterized in that it includes a first assembly and a second assembly, the first assembly includes a first structural member and an adhesive conductive layer, the first structural member includes a structural body and a protective layer, the The structural body includes a metal part, the surface of the metal part has an electrical connection area, and the electrical connection area is exposed to the outside of the first structural part; the protective layer is located on the peripheral side of the electrical connection area and covers Covering the surface of the metal part; the adhesive conductive layer covering the electrical connection area and the protective layer around the electrical connection area; The second component includes a second structural member, and the second structural member conducts with the electrical connection area through the adhesive conductive layer; The structural body also includes a plastic part connected to the metal part, the adhesive conductive layer is located between the metal part and the plastic part, and covers the electrical connection area and the surrounding area of the electrical connection area. The protective layer and the connection between the metal part and the plastic part; The structural body has a first plane and a second plane in the direction towards the second structural member, and the first plane and the second plane are two intersecting surfaces on the structural body; the viscosity The conductive layer includes a first conductive layer and a second conductive layer, and the first conductive layer is respectively located on the first plane and the second plane to cover the electrical connection area; The connection is located in the middle of the second plane; the adhesive conductive layer further includes a third conductive layer, and the third conductive layer is located at the connection to connect the metal part with the plastic part and the corresponding Adjacent to the first conductive layer, the elongation at break of the second conductive layer and the third conductive layer is greater than the elongation at break of the first conductive layer. 2. The electrical connection unit according to claim 1, wherein the area of the adhesive conductive layer is larger than the area of the electrical connection area, and the peripheral edge of the adhesive conductive layer covers the electrical connection area on the protective layer on the peripheral side. 3. The electrical connection unit according to claim 1, wherein the second structural member has a conduction surface that communicates with the first structural member, and the first plane is parallel to the conduction surface ; The adhesive conductive layer covers at least the first plane, the second structural member is located at the corner of the first plane and the second plane, and communicates with the conductive surface and the adhesive conductive layer The first structural component is conductive. 4. The electrical connection unit according to claim 3, wherein the first plane has a plastic surface of the plastic part, the plastic surface is opposite to the conduction surface, and the electrical connection area is exposed in said second plane; The second conductive layer is located at the corner to connect the adjacent first conductive layer, so as to conduct the second structural member with the electrical connection area. 5. The electrical connection unit according to claim 4, characterized in that, the first conductive layer is a pad printing adhesive conductive layer, the corner and the connection are glue dispensing areas, and the second conductive layer and The third conductive layer is a conductive layer formed in the glue dispensing area by dispensing glue. 6. The electrical connection unit according to claim 5, wherein the thickness of the first conductive layer on the first plane is greater than the thickness of the first conductive layer on the second plane, or, the The hardness of the first conductive layer on the first plane is greater than the hardness of the first conductive layer on the second plane. 7. The electrical connection unit according to any one of claims 4-6, wherein the first structural member is a middle frame of an electronic device, and the metal part of the first structural member is located on the When the second structural member is on the side, the metal member is an antenna radiator of the electronic device, and the second structural member is a circuit board of the electronic device. 8. The electrical connection unit according to any one of claims 1-6, characterized in that, the second assembly includes an electrical connection piece that conducts with the second structural member, and the electrical connection piece is located at the Between the second structural member and the adhesive conductive layer, so as to conduct the second structural member with the first structural member, the side of the second structural member connected to the electrical connector is conduction noodle. 9. The electrical connection unit according to claim 8, wherein the second component further comprises an insulating dielectric layer, and the insulating dielectric layer is located between the second structural member and the electrical connecting member, so as to making the electrical connector and the second structural member form a coupling feed assembly configured to connect the second structural member to the first structural member through the adhesive conductive layer . 10. The electrical connection unit according to any one of claims 1-6, characterized in that the adhesive conductive layer is a silver paste layer. 11. A manufacturing method of an electrical connection unit, which is applied to the electrical connection unit according to any one of claims 1-10, the manufacturing method comprising: forming an adhesive conductive pattern on the surface of the first structural member, so that the adhesive conductive pattern covers the electrical connection area of the first structural member and the protective layer around the electrical connection area; the first structural member includes A structural body and the protective layer, the structural body includes a metal part, the electrical connection area is disposed on the metal part and exposed to the outside of the first structural part; the protective layer covers the The surface of the metal part is located on the peripheral side of the electrical connection area; curing the adhesive conductive pattern to form an adhesive conductive layer; Conducting the second component with the adhesive conductive layer, so that the second structural component in the second component is conductive with the first structural component. 12. The manufacturing method according to claim 11, wherein the first plane of the structural body includes a plastic surface, the plastic surface is opposite to the conduction surface of the second structural member, and the electrical when the connection region is exposed to a second plane of the structural body intersecting the first plane, The formation of the adhesive conductive pattern on the surface of the first structural member, so that the adhesive conductive pattern covers the electrical connection area of the first structural member and the protective layer around the electrical connection area, specifically includes: Forming a first conductive pattern on the first plane and the second plane respectively, so that the first conductive pattern covers the electrical connection area and the protective layer around the electrical connection area, and A first dispensing area is reserved at the corner of the first plane and the second plane; Dispensing glue in the first dispensing area to form a second conductive pattern, so that the second conductive pattern connects two adjacent first conductive patterns, and the first conductive pattern is cured to form a first conductive layer, A second conductive layer is formed after the second conductive pattern is cured, and the adhesive conductive layer includes the first conductive layer and the second conductive layer. 13. The manufacturing method according to claim 12, wherein the structural body further includes a plastic part connected to the metal part, and the joint between the metal part and the plastic part is located on the second plane In the middle part, the adhesive conductive pattern is formed on the surface of the first structural member, so that the adhesive conductive pattern covers the electrical connection area of the first structural member and the protective layer around the electrical connection area, specifically include: forming the first conductive pattern on the second plane, and reserving a second dispensing area at the connection; Dispensing in the second dispensing area to form a third conductive pattern, so that the third conductive pattern connects two adjacent first conductive patterns, the first dispensing area and the second point The glue area forms the dispensing area of the structural body, and the adhesive conductive layer also includes a third conductive layer formed by curing the third conductive pattern, and the elongation at break of the third conductive layer is greater than that of the first conductive layer elongation at break. 14. An electronic device, comprising the electrical connection unit according to any one of claims 1-10. 15. The electronic device according to claim 14, characterized in that it comprises a middle frame, a display screen, a battery cover and a circuit board, the display screen and the battery cover are located on opposite sides of the middle frame, and the circuit board Located on the side of the middle frame facing the battery cover, the first structural member in the electrical connection unit is the middle frame, and the second structural member in the electrical connection unit is compatible with the middle frame conduction of the circuit board and the display screen.

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