CN220043757U - Circuit board assembly and electronic equipment - Google Patents

Abstract

This application relates to a circuit board assembly and electronic equipment. The circuit board assembly includes a main body and a connecting part. The connecting part is a metal piece for installing electrical connectors. The main body is provided with a protective film and a connecting end, and the protective film covers Part of the connection end, the connection part is electrically connected to the connection end not covered by the protective film. This design can protect the connection end and help improve the stability of the electrical connection between the circuit board and the connection end.

Description

A circuit board assembly and electronic equipment

Technical field

The present application relates to the technical field of electronic products, and in particular, to a circuit board assembly and electronic equipment.

Background technique

Circuit boards are commonly used components in electronic equipment. The base of the circuit board is provided with exposed copper for electrical connection with electronic devices. Since exposed copper is prone to corrosion, the surface of the circuit board usually needs to be treated and the exposed copper is gold-plated. However, this method is costly.

Utility model content

This application provides a circuit board assembly and electronic equipment for protecting the circuit board and reducing costs.

This application provides a circuit board assembly, which includes:

A main body part, the surface of which is provided with a connecting end;

A connection part, the connection part is installed on the main body part and is used for electrical connection with an electrical connector;

Wherein, the main body part is provided with a protective film, the protective film covers part of the connection end, the connection part is a metal piece, the connection part and the part of the connection end not covered by the protective film are electrically connect.

By setting a protective film, the connection end can be protected and the possibility of rusting at the connection end can be reduced, which will help improve the stability of the circuit board assembly and extend its service life. Connecting the connector to the connection end that is not covered by the protective film can reduce the impact of the protective film on the stability of the electrical connection between the connector and the connector. Moreover, the connector can also increase the connection area between the electrical connector and the circuit board. This will help improve the stability of the electrical connection. At the same time, compared with gold plating on the surface of the connection end, the cost of using a protective film is lower and more in line with actual usage needs.

In a possible implementation, the connecting portion is electrically connected to the connecting terminal through surface assembly technology.

Through such a design, the connecting piece and the connecting end can be welded. Compared with bonding, the electrical connection performance of welding is better, more stable, and has a longer service life, which can help further improve the stability of the electrical connection. Moreover, the SMT process has the advantages of higher assembly density, better reliability, and lower cost. It is also convenient for automated production, which is conducive to improving production efficiency and is more in line with actual use needs.

In a possible implementation, in projection along the thickness direction of the circuit board, the projected area of the connecting portion is larger than the projected area of the electrical connector.

Such a design can reduce the relative position accuracy requirements between the connecting part and the electrical connector, thereby reducing assembly difficulty and improving processing efficiency.

In a possible implementation, in the projection along the thickness direction of the circuit board assembly, the projected area of the connection part is m, and 12 square millimeters ≤ m ≤ 30 square millimeters.

In this way, the connecting portion can have a relatively sufficient connecting area for connecting to the electrical connector.

In a possible implementation, the connection part includes a body part and a support part connected to each other, the body part is used to electrically connect with the electrical connector, and the support part is electrically connected to the connection end. Connection: There is a distance between the main body part and the main body part along the thickness direction of the circuit board assembly.

Through such a design, the space occupied by the connecting part on the circuit board can be reduced. By designing the main body part in an overhead position, the position between the main body part and the main body part can be used for setting electronic devices and/or wiring, which is beneficial to saving money. The space for circuit board components is more in line with actual usage needs.

In a possible implementation, along the thickness direction of the circuit board assembly, the distance between the main body part and the main body part is n, and 0.5 mm ≤ n ≤ 1.5 mm.

Through such a design, there can be enough space between the main body and the main body for wiring and/or electronic devices, thereby improving the space utilization of the main body and more in line with actual usage requirements.

In a possible implementation, the connecting part includes a plurality of supporting parts, and each of the supporting parts is arranged at intervals along the circumferential direction of the body part.

Through such a design, the stability of the connection between the connecting part and the main body part can be improved, thereby reducing the possibility of the connecting part tilting or falling off from the main body part, which is more in line with actual use requirements.

In a possible implementation, the protective film is an organic soldering film.

An organic film is chemically formed on the surface of copper, which has hot spots such as anti-oxidation, thermal shock resistance, and corrosion resistance. It can be used to protect copper and reduce the possibility of the copper surface rusting in normal environments. Moreover, in the subsequent welding process, the organic film can be removed by the flux, thereby exposing the copper surface to reduce the impact of the protective film on the soldering of the connection end and the connection part, so that the copper surface of the connection end can be connected with the connection part in a short time. The molten solder combines to form a stronger solder joint, so that the connection part and the connection end have higher connection stability.

This application also provides an electronic device, which includes the circuit board assembly described in any one of the above.

In a possible implementation, the electronic device includes a screen assembly and an electrical connector, and the screen assembly is electrically connected to the connection portion of the circuit board assembly through the electrical connector.

Through such a design, the stability of the electrical connection between the screen component and the circuit board component can be improved.

In a possible implementation, the electrical connector is conductive foam.

The screen assembly can be electrically connected to the connecting portion through conductive foam, and then electrically connected to the connecting end of the circuit board. Conductive foam can play a role in shock absorption, buffering, and pressure reduction, which can reduce the possibility of damage to screen components and circuit board components, thereby helping to extend the service life of both. Moreover, conductive foam is elastic, and the restoring force generated when it deforms can act on the circuit board and screen assembly, thereby improving the stability of the connection between the two and more in line with actual use needs.

The present application provides a circuit board assembly and electronic equipment. The circuit board assembly includes a main body and a connecting part. The connecting part is a metal piece for installing electrical connectors. The main body is provided with a protective film and a connecting end. The protective film Part of the connection terminal is covered, and the connection part is electrically connected to the connection terminal not covered by the protective film. This design can protect the connection end and help improve the stability of the electrical connection between the circuit board and the connection end.

It should be understood that the above general description and the following detailed description are only exemplary and do not limit the present application.

Description of the drawings

Figure 1 is a schematic diagram of a first embodiment of a circuit board assembly provided by this application;

Figure 2 is a schematic diagram of a second embodiment of a circuit board assembly provided by this application;

FIG. 3 is a schematic diagram of a third embodiment of a circuit board assembly provided by this application.

Reference signs:

1-Main part, 11-Wiring, 12-Connection end; 2-Connection part, 21-Body part, 22-Support part; 3-Electrical connector; 4-Electronic device.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.

Detailed ways

In order to better understand the technical solution of the present application, the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

With the development of technology, electronic devices such as mobile phones, tablets, and laptops are increasingly used. Circuit boards are an important part of electronic devices. Circuit boards include substrates and exposed copper for electrical connection with electronic devices. , each electronic device can be integrated into the circuit board to achieve electrical connection, grounding and other operations. In order to protect the exposed copper, the electroless nickel/immersion gold (ENIG) process can be used to process the circuit board and wrap a layer of nickel alloy on the surface of the copper to reduce the risk of rust on the exposed copper during use. situation possible. The processing steps of the nickel-gold process include immersion plating electrolyte, which will dissolve nickel during the immersion process. If the dissolution reaction is not controlled, the performance of the circuit board surface treatment will be affected. Therefore, this method is not only complex in process and difficult to process, but also costly. In the related technology, conductive silica gel can also be installed on the surface of the circuit board to realize the electrical connection function through the conductive silica gel. The surface layer of conductive silica gel includes metal materials such as gold, nickel, and copper, which serve as a medium to achieve conductive functions. The silica gel body with high temperature resistance serves as an elastic material. Conductive silicone can be bonded to the exposed copper of the circuit board through adhesives such as silicone glue. The silicone body can be used to provide resilience when the circuit board and antenna are waiting to be connected to the connection object. Conductive silicone can be deformed through compression or other methods, and the resilience generated by the deformation can act on the circuit board and the object to be connected, thereby improving the stability of the connection between the two. The conductive material utilizes the elasticity of the conductive silica gel to provide resilience so that the conductive silica gel can electrically connect the objects waiting to be connected to the antenna. When in use, it is used as an electromagnetic interference (EMI) shielding ground. When electronic devices such as mobile phones, tablets, and laptops with this circuit board receive an impact, the conductive silica gel can also play a buffering role and reduce the risk of the circuit board. and the possibility of damage to electronic devices due to external impacts. However, conductive silica gel will have problems such as relaxation and aging when it is compressed for a long time. Moreover, electronic devices will generate heat when working, causing the ambient temperature of the conductive silica gel to rise, which will easily aggravate the aging of the conductive silica gel and cause stress relaxation, etc. Phenomenon, and then prone to poor contact, etc., which will affect the stability of the connection and affect the performance of the electronic devices connected to the circuit board. Moreover, conductive silica gel is installed on the circuit board through bonding. When the adhesive ages, it will also affect the stability of the connection between the object to be connected and the circuit board, which will affect the antenna's ability to transmit and receive signals and electromagnetic compatibility. It affects performance such as electromagnetic compatibility (EMC) and electromagnetic interference.

In view of this, embodiments of the present application provide a circuit board assembly and electronic equipment for protecting the circuit board assembly and improving the reliability of electrical connections.

As shown in Figure 1, an embodiment of the present application provides a circuit board assembly, in which the circuit board assembly includes a main body part 1 and a connecting part 2. The main body part 1 may be a printed circuit board (PCB). The main body part 1 can have a base, and the base is provided with a connecting end 12. The connecting section 2 is installed on the main body 1 for electrical connection with the electrical connector 3. The electrical connector 3 can be an electrical connection auxiliary material such as conductive foam, and the connecting end 12 can It is the exposed copper of the circuit board assembly. The main body 1 is provided with a protective film (not shown in the figure), part of the connection terminals 12 is covered by the protective film, and part of the connection terminals 12 is not covered by the protective film. The connecting part 2 is a metal piece, and the connecting part 2 is electrically connected to the connecting end 12 that is not covered by the protective film.

By providing a protective film, the connection end 12 can be protected and the possibility of rusting of the connection end 12 can be reduced, thereby improving the stability of the circuit board assembly and prolonging its service life. At the same time, due to the poor impedance of the protective film, when the electrical connector 3 is installed on the main body 1 through bonding or other methods, the protective film will affect the stability of the electrical connection between the electrical connector 3 and the connection end 12 . Therefore, in the solution provided by the embodiment of the present application, the connecting part 2 is connected to the connecting end 12 that is not covered by the protective film, which can reduce the impact of the protective film on the stability of the electrical connection between the connecting part 2 and the connecting end 12, thereby reducing the The protective film affects the stability of the electrical connection between the electrical connector 3 and the circuit board assembly. Moreover, the connecting portion 2 can also increase the connection area between the electrical connector 3 and the circuit board, thereby helping to improve the stability of the electrical connection. At the same time, compared with gold plating on the surface of the connection terminal 12, the cost of using a protective film is lower and is more in line with actual usage requirements.

In a possible implementation, the connecting part 2 is electrically connected to the connecting end 12 through surface mounted technology (SMT).

Through such a design, the connector and the connecting end 12 can be welded. Compared with bonding, welding has better electrical connection performance, is more stable, and has a longer service life, which can help further improve the stability of the electrical connection. Moreover, the SMT process has the advantages of higher assembly density, better reliability, and lower cost. It is also convenient for automated production, which is conducive to improving production efficiency and is more in line with actual use needs.

As shown in FIG. 1 , in one possible implementation, in projection along the thickness direction of the circuit board, the projected area of the connecting portion 2 is larger than the projected area of the electrical connector 3 .

Through such a design, the relative position accuracy requirements between the connecting part 2 and the electrical connector 3 can be reduced, and the connecting part 2 has sufficient area for connection with the electrical connector 3, which is beneficial to reducing the difficulty of assembly and improving processing efficiency. .

In a possible implementation, in the projection along the thickness direction of the circuit board, the projected area of the connecting portion 2 is m, and 12 square millimeters ≤ m ≤ 30 square millimeters.

The projected area of the connecting part 2 can be 12 square millimeters, 16 square millimeters, 22 square millimeters, 26 square millimeters, 30 square millimeters, etc. This way, the connecting portion 2 can have a relatively sufficient connection area for connecting with the electrical connector 3 .

In a possible implementation, the connecting portion 2 can be a rectangular sheet structure with a length of 3 mm and a width of 4 mm, or a rectangular sheet structure with a length of 5 mm and a width of 5 mm, or a length of 6 mm. , a rectangular sheet structure with a width of 5 mm and other dimensions. The actual size and actual structure of the connecting part 2 can be set according to actual needs.

As shown in Figures 2 and 3, in a possible implementation, the connection part 2 includes a body part 21 and a support part 22 connected to each other, where the body part 21 is used to electrically connect with the electrical connector 3, and the support part 22 is used to electrically connect with the connecting end 12, and there is a gap between the main body part 21 and the main body part 1 along the thickness direction of the circuit board assembly.

Through such a design, the space occupied by the connecting part 2 on the circuit board can be reduced. By designing the main body part 21 in an overhead position, the position between the main body part 21 and the main body part 1 can be used for placing electronic devices 4 and/or wiring. 11, which helps save the space of circuit board components and is more in line with actual usage needs.

In a possible implementation, the distance between the main body 21 and the main body 1 along the thickness direction of the circuit board assembly is n, and n satisfies: 0.5 mm ≤ n ≤ 1.5 mm.

The distance between the main body part 21 and the main body part 1 may be 0.5 mm, 0.7 mm, 0.9 mm, 1.1 mm, 1.3 mm, 1.5 mm, etc. Through such a design, there can be enough space between the main body 1 and the main body 21 for wiring 11 and/or for installing electronic devices 4, thereby improving the space utilization of the main body 1 and more meeting actual usage requirements.

As shown in FIG. 3 , in one possible implementation, the connecting part 2 includes a plurality of supporting parts 22 , and each supporting part 22 is spaced apart along the circumferential direction of the body part 21 .

Through such a design, the stability of the connection between the connecting part 2 and the main body part 1 can be improved, thereby reducing the possibility of the connecting part 2 tilting or falling off from the main body part 1, which is more in line with actual use requirements.

In a possible implementation, the protective film is an organic soldering film.

The surface of the circuit board can be treated through the organic solderability preservatives (OSP) process. An organic film is chemically formed on the surface of the copper. It has hot spots such as anti-oxidation, thermal shock resistance, and corrosion resistance. It can be used for Protect copper to reduce the possibility of rust on the copper surface in normal environments. Moreover, in the subsequent welding process, the organic film can be removed by the flux, thereby exposing the copper surface, so as to reduce the impact of the protective film on the welding of the connection end 12 and the connection part 2, so that the copper surface of the connection end 12 can be soldered in a short time. It combines with the molten solder within a certain period of time to form a relatively strong solder joint, so that the connecting part 2 and the connecting end 12 have higher connection stability.

During processing, a protective film can be generated on the surface of the main body 1 first. During the installation through the SMT process, during the welding process, the protective film located at the connection position between the connecting end 12 and the connecting part 2 can be melted, so that the connecting part 2 can Directly contacting and welding the connection end 12 not only helps to reduce the impact of the protective film on the stability of the electrical connection between the connection part 2 and the connection end 12, but also when setting the protective film, the entire connection end 12 can be covered first, and then Melting the protective film in the corresponding area during the welding process can reduce the possibility of exposure of the connecting end 12 at other positions, thereby improving the protective effect of the protective film on the connecting end 12 and more in line with actual usage requirements.

Based on the circuit board assembly provided by the above embodiments, embodiments of the present application also provide an electronic device, wherein the electronic device includes the circuit board assembly involved in any of the above embodiments, because the circuit board assembly has the above technical effects , therefore, the electronic equipment including the circuit board assembly also has corresponding technical effects, which will not be described again here.

In a possible implementation, the electronic device may be a mobile phone, a tablet computer, a laptop computer, etc. The electronic device includes a screen assembly and an electrical connector 3 . The screen assembly is electrically connected to the connecting portion 2 of the circuit board assembly through the electrical connector 3 .

Such a design can improve the stability of the electrical connection between the screen component and the circuit board component, and is more in line with actual usage needs.

In a possible implementation, the electrical connector 3 may be conductive foam.

The screen assembly can be electrically connected to the connecting portion 2 through conductive foam, and then electrically connected to the connecting end 12 of the circuit board. Conductive foam can play a role in shock absorption, buffering, and pressure reduction, which can reduce the possibility of damage to screen components and circuit board components, thereby helping to extend the service life of both. Moreover, conductive foam is elastic, and the restoring force generated when it deforms can act on the circuit board and screen assembly, thereby improving the stability of the connection between the two and more in line with actual use needs.

Embodiments of the present application provide a circuit board assembly and electronic equipment, wherein the circuit board assembly includes a main body part 1 and a connecting part 2. The connecting part 2 is a metal piece used to install an electrical connector 3, and the main body part 1 is provided with a protective film and the connection end 12, the protective film covers part of the connection end 12, and the connection part 2 is electrically connected to the connection end 12 that is not covered by the protective film. Such a design can protect the connection terminal 12 and help improve the stability of the electrical connection between the circuit board and the connection terminal 12 .

The above are only specific implementation modes of the embodiments of the present application, but the protection scope of the embodiments of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of the present application shall be covered by this application. within the protection scope of the application embodiment. Therefore, the protection scope of the embodiments of the present application should be subject to the protection scope of the claims.

Claims (11)

1. A circuit board assembly, the circuit board assembly comprising:

a main body part (1), wherein a connecting end (12) is arranged on the surface of the main body part (1);

the connecting part (2), the said connecting part (2) is installed in the said body part (1), is used for electrically connecting with electric connector (3);

the connecting device comprises a main body part (1), a connecting end (12) and a connecting part (2), wherein the main body part (1) is provided with a protective film, the protective film covers part of the connecting end (12), the connecting part (2) is a metal piece, and the connecting part (2) is electrically connected with the part, which is not covered by the protective film, of the connecting end (12).

2. Circuit board assembly according to claim 1, wherein the connection portion (2) is electrically connected to the connection terminal (12) by means of surface assembly technology.

3. Circuit board assembly according to claim 1, characterized in that the projected area of the connection part (2) in the projection in the thickness direction of the circuit board is larger than the projected area of the electrical connection (3).

4. The circuit board assembly according to claim 1, characterized in that the projected area of the connection portion (2) in the projection in the thickness direction of the circuit board assembly is m, and 12 square millimeters is ∈m.ltoreq.30 square millimeters.

5. Circuit board assembly according to any of claims 1 to 4, wherein the connection part (2) comprises a body part (21) and a support part (22) connected to each other, the body part (21) being adapted to be electrically connected to the electrical connector (3), the support part (22) being electrically connected to the connection end (12), the body part (21) being spaced apart from the body part (1) in the thickness direction of the circuit board assembly.

6. The circuit board assembly according to claim 5, wherein a distance between the body portion (21) and the main body portion (1) in a thickness direction of the circuit board assembly is n, and n is 0.5 mm.ltoreq.n.ltoreq.1.5 mm.

7. The circuit board assembly according to claim 5, wherein the connection portion (2) includes a plurality of the support portions (22), each of the support portions (22) being disposed at intervals along a circumferential direction of the body portion (21).

8. The circuit board assembly according to any one of claims 1 to 4, wherein the protective film is an organic solder mask.

9. An electronic device comprising the circuit board assembly of any one of claims 1 to 8.

10. The electronic device according to claim 9, characterized in that the electronic device comprises a screen assembly and an electrical connection (3), the screen assembly being electrically connected to the connection (2) of the circuit board assembly by means of the electrical connection (3).

11. The electronic device according to claim 9, characterized in that the electrical connection (3) is a conductive foam.