CN114980501B - A plug hole structure, a method for manufacturing a double-sided press-fit hole, and a PCB - Google Patents
A plug hole structure, a method for manufacturing a double-sided press-fit hole, and a PCB Download PDFInfo
- Publication number
- CN114980501B CN114980501B CN202210741776.3A CN202210741776A CN114980501B CN 114980501 B CN114980501 B CN 114980501B CN 202210741776 A CN202210741776 A CN 202210741776A CN 114980501 B CN114980501 B CN 114980501B
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000002788 crimping Methods 0.000 claims abstract description 31
- 238000009713 electroplating Methods 0.000 claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 3
- 230000002093 peripheral effect Effects 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 12
- 239000004033 plastic Substances 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 8
- 238000005553 drilling Methods 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 abstract description 7
- 238000003825 pressing Methods 0.000 abstract description 6
- 239000003292 glue Substances 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 description 24
- 239000003814 drug Substances 0.000 description 20
- 238000000151 deposition Methods 0.000 description 17
- 230000008021 deposition Effects 0.000 description 16
- 239000011148 porous material Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
本发明涉及PCB技术领域，公开了一种塞孔结构、双面压接孔的制作方法及PCB。塞孔结构，包括内管和外管；内管为中空结构，且沿其轴向依次划分为上段内管体、中段内管体和下段内管体；中段内管体的长度与中间孔壁的长度相等，上段内管体的长度不小于上部孔壁的长度；下段内管体的长度不小于下部孔壁的长度；外管固定套设于中段内管体的外周区域，外管的外侧壁与通孔的中间孔壁对准贴合，以阻止通孔的中间孔壁形成电镀层。本发明实施例只需要在通孔中塞入适配的塞孔结构后沉铜电镀，即可制得双面压接孔，简化了流程，降低了加工成本；由于不涉及二次压合操作，因而杜绝了流胶堵孔的风险和上下两个压接孔的对准度差的问题。
The present invention relates to the field of PCB technology, and discloses a plug hole structure, a method for manufacturing a double-sided crimping hole, and a PCB. The plug hole structure comprises an inner tube and an outer tube; the inner tube is a hollow structure, and is divided into an upper inner tube body, a middle inner tube body, and a lower inner tube body in sequence along its axial direction; the length of the middle inner tube body is equal to the length of the middle hole wall, and the length of the upper inner tube body is not less than the length of the upper hole wall; the length of the lower inner tube body is not less than the length of the lower hole wall; the outer tube is fixedly sleeved on the outer peripheral area of the middle inner tube body, and the outer side wall of the outer tube is aligned and fitted with the middle hole wall of the through hole to prevent the formation of an electroplating layer on the middle hole wall of the through hole. The embodiment of the present invention only needs to insert an adapted plug hole structure into the through hole and then perform copper electroplating to obtain a double-sided crimping hole, which simplifies the process and reduces the processing cost; since it does not involve a secondary pressing operation, the risk of glue flow blocking the hole and the problem of poor alignment of the upper and lower crimping holes are eliminated.
Description
Technical Field
The invention relates to the technical field of PCBs (Printed Circuit Boards ), in particular to a plug hole structure, a manufacturing method of a double-sided crimping hole and a PCB.
Background
With the continuous increase of signal transmission rate, the wiring and crimp density of PCBs needs to be increased, and the double-sided crimping technique has been improved from single-sided crimping.
At present, the basic manufacturing process of the double-sided crimping backboard comprises the following steps: firstly, two symmetrical sub-boards are manufactured through primary pressing, then single-sided pressing holes are respectively manufactured on the two sub-boards, and then the two sub-boards are subjected to secondary pressing to form the motherboard. The manufacturing process adopting the twice-pressing mode has the following defects:
two pressing operations are needed, the flow is long, and the cost is high;
In the secondary lamination, the gumming hole quantity is difficult to control, a prepreg with low fluidity is required to be used, and the reliability of the prepreg with low gumming is low, and the gumming hole blocking risk still exists;
the alignment of the upper and lower crimping holes is poor.
Disclosure of Invention
The invention aims to provide a plug hole structure, a manufacturing method of a double-sided crimping hole and a PCB, so as to solve the problems.
To achieve the purpose, the invention adopts the following technical scheme:
The utility model provides a hole plugging structure for plug into the through-hole of fitting partial metallization, the pore wall of through-hole divides into along its axial in proper order: an upper pore wall to be metallized, a middle pore wall to be non-metallized, and a lower pore wall to be metallized; the plug hole structure comprises an inner pipe and an outer pipe;
The inner tube is of a hollow structure and is divided into an upper inner tube body, a middle inner tube body and a lower inner tube body in sequence along the axial direction of the inner tube; the length of the middle section inner pipe body is equal to that of the middle hole wall, and the length of the upper section inner pipe body is not smaller than that of the upper hole wall; the length of the lower inner pipe body is not less than the length of the lower hole wall;
The outer tube is fixedly sleeved in the peripheral area of the middle section inner tube body, the outer side wall of the outer tube is aligned and attached with the middle hole wall of the through hole, and is used for preventing copper precipitation liquid medicine or electroplating liquid medicine from contacting the middle hole wall of the through hole, so that the middle hole wall of the through hole is prevented from forming an electroplated layer.
Optionally, the hollow structure for the circulation of the copper deposition liquid medicine or the electroplating liquid medicine is arranged on the pipe walls of the upper section inner pipe body and the lower section inner pipe body.
Optionally, the inner tube is made of hard plastic material, and the outer tube is made of flexible rubber material.
Optionally, the thickness of the outer tube is greater than the thickness of the inner tube.
Optionally, designated areas of the inner tube and the outer tube are coated with a nonpolar material, and the designated areas are non-contact surfaces of the hole plugging structure, which are not contacted with the hole wall of the through hole in a state of being plugged into the through hole.
A manufacturing method of a double-sided crimping hole comprises the following steps:
Drilling through holes on the printed circuit board, wherein the through holes are sequentially divided into: an upper pore wall to be metallized, a middle pore wall to be non-metallized, and a lower pore wall to be metallized;
plugging the plug hole structure into the through hole, so that the outer side wall of the outer tube is attached to the intermediate hole wall of the through hole, which is to be non-metallized;
And carrying out copper deposition electroplating on the through hole plugged into the hole plugging structure to form an electroplated layer on the upper hole wall and the lower hole wall of the through hole, so as to obtain the double-sided crimping hole.
Optionally, the length of the inner pipe body in the upper section of the inner pipe is equal to the length of the upper hole wall to be metallized of the through hole, and the length of the inner pipe body in the lower section of the inner pipe is equal to the length of the lower hole wall to be metallized of the through hole;
the method for plugging the plug hole structure into the through hole comprises the following steps: and completely plugging the hole plugging structure into the through hole until the two ends of the inner tube are leveled with the two ends of the through hole.
Optionally, the length of the upper inner pipe body of the inner pipe is greater than the length of the upper hole wall to be metallized of the through hole, the length of the lower inner pipe body of the inner pipe is greater than the length of the lower hole wall to be metallized of the through hole, and the outer ends of the upper inner pipe body and/or the lower inner pipe body are provided with hole plugging depth marks;
The method for plugging the plug hole structure into the through hole comprises the following steps: and plugging the plug hole structure into a preset depth position according to the plug hole depth mark.
Optionally, the method further comprises: after the copper deposition electroplating is completed, the plug hole structure is pushed out or pulled out from the through hole by using a push-pull rod.
A PCB comprising a double sided crimp hole made according to the method of making a double sided crimp hole as described in any of the above.
Compared with the prior art, the invention has the beneficial effects that:
According to the embodiment of the invention, the double-sided crimping hole can be prepared by plugging the through hole with the matched plug hole structure capable of selectively resisting plating and then depositing copper and electroplating, and compared with the prior art, the secondary crimping operation is simplified into one-time crimping operation, so that the flow is simplified, and the processing cost is reduced; the secondary press-fit operation is not involved, so that the problems of the risk of glue flowing and hole blocking and the poor alignment degree of the upper press-fit hole and the lower press-fit hole are solved.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view of a plug hole structure according to an embodiment of the present invention.
Fig. 2 is a schematic cross-sectional structure of a plug hole structure according to an embodiment of the present invention.
Fig. 3 is a flowchart of a method for manufacturing a double-sided pressure welding hole according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of a manufacturing process of a double-sided pressure welding hole according to an embodiment of the present invention.
Fig. 5 and 6 are schematic diagrams of different plugging states of a double-sided crimp hole according to an embodiment of the present invention.
Reference numerals illustrate: the plug hole structure 1, the inner tube 11, the outer tube 12, the hollow structure 13, the printed circuit board 2 and the through hole 3.
Detailed Description
In order to make the objects, features and advantages of the present invention more comprehensible, the technical solutions in the embodiments of the present invention are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In order to solve various problems of long manufacturing flow, easy glue flowing and hole blocking, poor alignment and the like of the existing secondary press fit finding mode, the embodiment of the invention provides a brand-new solving idea, a novel hole blocking structure 1 with a part of plating blocking function is plugged into a through hole 3, and then conventional copper deposition electroplating is carried out on the through hole 3, so that electroplated layers and electroless layers on the hole walls at the two ends and the hole wall in the middle of the through hole 3 can be plated to form a double-sided press fit hole.
For convenience of description, for the through-hole 3 for making the double-sided crimp hole, the hole wall of the through-hole 3 is divided into: an upper pore wall to be metallized, a middle pore wall to be non-metallized, and a lower pore wall to be metallized.
Referring to fig. 1 and 2, an embodiment of the present invention provides a hole plugging structure 1 for plugging a through hole 3 to be partially metallized, wherein the hole plugging structure 1 comprises an inner tube 11 and an outer tube 12;
The inner tube 11 is of a hollow structure and is divided into an upper inner tube body, a middle inner tube body and a lower inner tube body in sequence along the axial direction of the inner tube; the length of the inner pipe body in the middle section is equal to the length of the intermediate hole wall of the through hole 3 to be non-metallized;
The outer tube 12 is fixedly sleeved on the periphery of the middle inner tube body of the inner tube 11, and the outer side wall of the outer tube 12 is attached to the middle hole wall of the through hole 3 so as to prevent copper precipitation liquid medicine or electroplating liquid medicine from contacting the middle hole wall of the through hole 3 and prevent the middle hole wall of the through hole 3 from forming an electroplated layer.
It can be understood that when the outer tube 12 of the plug hole structure 1 is plugged into the through hole 3, the outer side wall of the outer tube 12 can keep a fit state with the middle hole wall of the through hole 3, so that when the through hole 3 is completely immersed into copper deposition liquid medicine or electroplating liquid medicine, the plug hole structure 1 can block the copper deposition liquid medicine or electroplating liquid medicine so as to prevent the copper deposition liquid medicine or electroplating liquid medicine from contacting with the middle hole wall of the through hole 3; meanwhile, as flowing spaces are formed between the upper section inner pipe body of the inner pipe 11 and the upper hole wall of the through hole 3 and between the lower section inner pipe body of the inner pipe 11 and the lower hole wall of the through hole 3, copper precipitation liquid medicine or electroplating liquid medicine can be contacted with the upper hole wall and the lower hole wall of the through hole 3 to form an electroplated layer on the surface of the inner pipe. Therefore, the hole plugging structure 1 can realize the production of a double-sided pressure-bonding hole.
In order to improve the electroplating effect of the upper hole wall and the lower hole wall of the through hole 3, the hollow structures 13 for the circulation of copper deposition liquid medicine or electroplating liquid medicine are respectively arranged on the pipe walls of the upper inner pipe body and the lower inner pipe body of the inner pipe 11, and the hollow structures 13 can increase the exchange effect of the copper deposition liquid medicine or the electroplating liquid medicine in the corresponding areas and ensure the uniformity and the flatness of the electroplated layer.
For the plating resist effect, the outer tube 12 may be made of any material such as non-conductive plastic, so long as it cannot penetrate the copper deposition liquid or the plating liquid to cause the copper deposition liquid or the plating liquid to contact the inner wall of the through hole 3 at the corresponding position.
In an alternative embodiment, the inner tube 11 is a rigid plastic, referred to as a stiffer plastic. Because the inner tube 11 is hard plastic, the hard plastic has good supporting performance due to the large hardness, and the whole length of the hole plugging structure 1 can be kept in a stable state in the hole plugging process, so that the hole plugging structure 1 can be plugged into the preset depth position of the through hole 3 quickly, and the hole plugging precision is improved. Illustratively, the rigid plastic is PC (polycarbonate) material or AS (styrene-acrylonitrile copolymer) material.
Meanwhile, in order to improve the fitting degree, the outer tube 12 is made of flexible rubber, and the flexible rubber has good elastic deformation performance, so that adaptive deformation can be generated under the limiting action of the wall of the through hole 3 in the hole plugging process, the current through hole 3 is matched with the outer tube 12 to a larger extent, and the fitting degree of the wall of the through hole 3 is improved. In this way, not only the manufacturing tolerance existing between the aperture of the through hole 3 and the outer diameter of the hole plugging structure 1 can be overcome, but also the compatibility of the hole plugging structure 1 to a group of through holes 3 (including a plurality of through holes 3 with theoretical aperture manufacturing differences within a preset range) can be realized.
In order to further improve reusability of the plug hole structure 1, designated areas of the inner tube 11 and the outer tube 12, which are non-contact surfaces of the plug hole structure 1 not in contact with the wall of the through hole 3 in a state of being plugged into the through hole 3, are coated with a non-polar material. When immersed in the copper plating solution or the electroplating solution, the nonpolar material can avoid corrosion or electroplating layer formation on the surface of the plug hole structure 1 caused by chemical reaction between the surface of the plug hole structure 1 and the solution.
Referring to fig. 3 and 4, the embodiment of the invention further provides a method for manufacturing a double-sided crimping hole, which includes the steps of:
step 101, drilling a through hole 3 on the printed circuit board 2.
Specifically, the printed circuit board 2 can be obtained by laminating and laminating according to the conventional procedure, and then the through hole 3 is drilled on the printed circuit board 2.
Step 102, plugging the hole plugging structure 1 into the through hole 3, so that the outer side wall of the outer tube 12 of the hole plugging structure 1 is aligned and attached with the middle hole wall of the through hole 3.
It should be noted that, the length of the outer tube 12 of the hole plugging structure 1 is equal to the length of the middle hole wall of the through hole 3, so that the outer tube 12 and the middle hole wall of the through hole 3 can be completely attached to each other, so that the middle hole wall of the through hole 3 is completely non-metallized.
In one possible embodiment, as shown in fig. 4, the length of the upper inner tube body of the inner tube 11 is equal to the length of the upper hole wall to be metallized of the through hole 3, and the length of the lower inner tube body of the inner tube 11 is equal to the length of the lower hole wall to be metallized of the through hole 3. At this time, the overall length of the hole plugging structure 1 is equal to the depth of the through hole 3, and the method for plugging the hole plugging structure 1 into the through hole 3 is as follows: the plug hole structure 1 is completely plugged into the through hole 3 until both ends of the inner tube 11 are leveled with both ends of the through hole 3. The hole plugging method is simple and quick, can realize accurate partial metallization of the through hole 3, and does not have hole plugging depth control difficulty and complexity.
In another possible embodiment, as shown in fig. 5, the length of the upper inner tube body of the inner tube 11 is greater than the length of the upper hole wall to be metallized of the through hole 3, and the length of the lower inner tube body of the inner tube 11 is equal to the length of the lower hole wall to be metallized of the through hole 3; or the length of the lower section inner pipe body of the inner pipe 11 is larger than the length of the lower hole wall to be metallized of the through hole 3, and the length of the upper section inner pipe body of the inner pipe 11 is equal to the length of the upper hole wall to be metallized of the through hole 3. At this time, after the hole plugging structure 1 is plugged in place, one end of the inner tube 11 is exposed to the outside, and the other end is leveled with the end of the through hole 3. Thus, in this case, the method of plugging the plug hole structure 1 into the through hole 3 may be: the plug hole structure 1 is plugged directly into the through hole 3 until the quasi-flat end of the inner tube 11 and the corresponding end of the through hole 3 reach an actual substantially flat state. The mode is convenient for accurate plugging in and convenient for subsequent taking out.
In yet another possible embodiment, as shown in fig. 6, the length of the upper inner tube body of the inner tube 11 is greater than the length of the upper hole wall to be metallized of the through hole 3, and the length of the lower inner tube body of the inner tube 11 is greater than the length of the lower hole wall to be metallized of the through hole 3, and the outer ends of the upper inner tube body and/or the lower inner tube body are provided with the plug hole depth marks. At this time, both ends of the inner tube 11 are exposed after the hole plugging structure 1 is plugged in place. Thus, in this case, the method of plugging the plug hole structure 1 into the through hole 3 may be: and plugging the plug hole structure 1 into a preset depth position according to the plug hole depth mark. The plug hole structure 1 in this way has a strong versatility. For a group of through holes 3 with the same aperture, if the lengths of the intermediate hole walls which are to be non-metallized are equal, and the lengths of the upper hole wall and the lower hole wall which are to be metallized are different, the group of through holes 3 can be used for manufacturing different double-sided crimping holes by using the same hole plugging structure 1, and only the matched hole plugging structure 1 is required to be manufactured according to the through hole 3 with the largest depth.
It should be noted that, the plug hole depth mark may be any mark type capable of being visualized, such as graduations, characters, graphics, symbols, and the like.
And 103, carrying out copper deposition electroplating on the through hole 3 plugged into the plug hole structure 1 to form electroplated layers on the upper hole wall and the lower hole wall of the through hole 3, so as to obtain the double-sided crimping hole.
After the through hole is plugged into the hole plugging structure 1, the middle hole wall of the through hole 3 is blocked by the hole plugging structure 1, and the upper hole wall and the lower hole wall are not blocked, so that an electroplated layer cannot be formed on the middle hole wall of the through hole 3 after copper deposition electroplating, and the electroplated layer is formed on the upper hole wall and the lower hole wall of the through hole 3, thereby realizing the manufacture of the double-sided crimping hole.
It should be noted that, because the entire plug hole structure 1 is a hollow structure, in the copper deposition electroplating process, the copper deposition liquid medicine or electroplating liquid medicine can smoothly pass through the middle gap of the plug hole structure 1 to realize good exchange so as to ensure the thickness uniformity and flatness of the electroplated layer.
Step 104, removing the plug hole structure 1.
In practical application, if the hole plugging structure 1 does not affect the normal use of the subsequent printed circuit board 2, the hole plugging structure 1 in the through hole 3 can be reserved, and no additional removal operation is performed.
Of course, the hole plugging structure 1 may be removed alternatively, and in particular, different removing manners may be adopted according to the specific material of the hole plugging structure 1, which is not limited in this embodiment of the present invention. Two general manners of removing the plug hole structure 1 are provided: when the hole plugging structure 1 is completely positioned in the through hole 3, the hole plugging structure 1 can be pushed out or pulled out from the through hole 3 by a push-pull rod; when the hole-plugging structure 1 is partially exposed outside the through hole 3, the hole-plugging structure 1 can be directly pulled out of the through hole 3 manually or automatically by a machine.
In summary, according to the PCB manufacturing method provided by the embodiment of the invention, the double-sided crimping hole can be manufactured by plugging the matched plug hole structure 1 into the through hole 3 and then carrying out copper deposition electroplating; the secondary press-fit operation is not involved, so that the problems of the risk of glue flowing and hole blocking and the poor alignment degree of the upper press-fit hole and the lower press-fit hole are solved.
The embodiment of the invention also provides a PCB which is provided with the double-sided crimping holes, and the double-sided crimping holes are manufactured according to the manufacturing method of the double-sided crimping holes. The double-sided crimping hole of the PCB is manufactured by adopting the method, so that the PCB has good product quality.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210741776.3A CN114980501B (en) | 2022-06-28 | 2022-06-28 | A plug hole structure, a method for manufacturing a double-sided press-fit hole, and a PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210741776.3A CN114980501B (en) | 2022-06-28 | 2022-06-28 | A plug hole structure, a method for manufacturing a double-sided press-fit hole, and a PCB |
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| Publication Number | Publication Date |
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| CN114980501A CN114980501A (en) | 2022-08-30 |
| CN114980501B true CN114980501B (en) | 2024-11-19 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101257772A (en) * | 2007-02-28 | 2008-09-03 | 富士通株式会社 | Manufacturing method of printed circuit board, printed circuit board and electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101861057A (en) * | 2009-04-07 | 2010-10-13 | 英业达股份有限公司 | How to make a printed circuit board |
| US9872399B1 (en) * | 2016-07-22 | 2018-01-16 | International Business Machines Corporation | Implementing backdrilling elimination utilizing anti-electroplate coating |
| CN109890149B (en) * | 2019-04-02 | 2022-04-29 | 生益电子股份有限公司 | A manufacturing method of double-sided crimping PCB and PCB |
| CN112752399B (en) * | 2020-11-26 | 2022-06-14 | 苏州浪潮智能科技有限公司 | Printed circuit board and method for processing through hole thereof |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101257772A (en) * | 2007-02-28 | 2008-09-03 | 富士通株式会社 | Manufacturing method of printed circuit board, printed circuit board and electronic device |
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