CN114900995B - Multi-level anti-plating structure, through-hole manufacturing method with multi-layer network and PCB - Google Patents
Multi-level anti-plating structure, through-hole manufacturing method with multi-layer network and PCB Download PDFInfo
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- CN114900995B CN114900995B CN202210743573.8A CN202210743573A CN114900995B CN 114900995 B CN114900995 B CN 114900995B CN 202210743573 A CN202210743573 A CN 202210743573A CN 114900995 B CN114900995 B CN 114900995B
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- 238000007747 plating Methods 0.000 title claims abstract description 115
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 238000005192 partition Methods 0.000 claims abstract description 96
- 238000009713 electroplating Methods 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 239000010949 copper Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 18
- 230000000903 blocking effect Effects 0.000 claims abstract description 9
- 230000003405 preventing effect Effects 0.000 claims description 42
- 230000002265 prevention Effects 0.000 claims description 36
- 230000008021 deposition Effects 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 18
- 239000003814 drug Substances 0.000 claims description 16
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 7
- 238000005553 drilling Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000009826 distribution Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 66
- 238000000151 deposition Methods 0.000 description 21
- 239000011148 porous material Substances 0.000 description 11
- 239000004033 plastic Substances 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
本发明涉及PCB技术领域，公开了一种多级防镀结构、具有多层网络的通孔制作方法及PCB。多级防镀结构包括硬质内管，硬质内管的管壁沿轴向或者径向划分为呈交叉分布的第一管壁分区和第二管壁分区；第一管壁分区与拟金属化孔壁分区一一对应，第一管壁分区上开设有供沉铜/电镀药水流通的镂空结构；第二管壁分区与拟非金属化孔壁分区一一对应，第二管壁分区的外侧壁分别包裹有用于阻挡对应的拟非金属化孔壁分区接触沉铜/电镀药水的防镀层。本发明实施例利用多级防镀结构，使得同一通孔的内壁实现至少三部分相互分离的电镀层，由于每部分电镀层可用于连接不同的信号，因此该通孔实现了多层网络制作，相比于现有技术大大提高了布线密度。
The present invention relates to the field of PCB technology, and discloses a multi-level anti-plating structure, a method for manufacturing a through hole with a multi-layer network, and a PCB. The multi-level anti-plating structure comprises a hard inner tube, and the tube wall of the hard inner tube is divided into a first tube wall partition and a second tube wall partition in a cross-distribution along the axial direction or radial direction; the first tube wall partition corresponds to the quasi-metallized hole wall partition one by one, and a hollow structure for copper plating/electroplating solution to flow is provided on the first tube wall partition; the second tube wall partition corresponds to the quasi-non-metallized hole wall partition one by one, and the outer side walls of the second tube wall partition are respectively wrapped with an anti-plating layer for blocking the corresponding quasi-non-metallized hole wall partition from contacting the copper plating/electroplating solution. The embodiment of the present invention utilizes a multi-level anti-plating structure, so that the inner wall of the same through hole realizes at least three parts of electroplating layers separated from each other. Since each part of the electroplating layer can be used to connect different signals, the through hole realizes multi-layer network production, which greatly improves the wiring density compared with the prior art.
Description
Technical Field
The invention relates to the technical field of PCBs (Printed Circuit Boards ), in particular to a multistage plating-preventing structure, a through hole manufacturing method with a multilayer network and a PCB.
Background
PCB (Printed Circuit Board), chinese name printed circuit board, is an important electronic component as a support for electronic components.
As PCBs move toward dense, thin, and flat, the wiring density on PCBs increases. In PCB design, the inter-layer wiring pattern is wired, i.e., networked, through metallized holes. However, the conventional metallized holes can only realize connection of a single network, and in this case, in order to realize design of different network wirings between layers, a plurality of metallized holes are usually required to be processed, which seriously affects wiring density and processing and preparation efficiency of the PCB.
Disclosure of Invention
The invention aims to provide a multistage plating-preventing structure, a through hole manufacturing method with a multilayer network and a PCB, so as to solve the problem of low wiring density in the prior art.
To achieve the purpose, the invention adopts the following technical scheme:
A multistage plating-preventing structure is used for plugging a through hole to be metallized, the hole wall of the through hole is divided into a partition of the wall of the through hole to be metallized and a partition of the wall of the through hole to be non-metallized which are distributed in a crossed manner along the axial direction or the radial direction of the through hole, the number of the partitions of the wall of the through hole to be metallized is a plurality of,
The multistage plating-preventing structure comprises a hard inner pipe, wherein the pipe wall of the hard inner pipe is axially or radially divided into a first pipe wall partition and a second pipe wall partition which are distributed in a crossed manner;
Each first pipe wall partition corresponds to each to-be-metallized hole wall partition one by one, and each first pipe wall partition is provided with a hollowed-out structure for communicating copper deposition/electroplating liquid medicine;
Each second pipe wall partition corresponds to each non-metallic hole wall partition one by one, and the outer side wall of each second pipe wall partition is wrapped with an anti-plating layer for blocking the corresponding non-metallic hole wall partition from contacting copper deposition/electroplating liquid medicine.
Optionally, the anti-plating layer is made of a material with a thermal expansion coefficient exceeding a preset threshold, the hard inner tube is made of a material with a thermal expansion coefficient lower than the preset threshold, and two axial ends of the outer side wall of each second tube wall partition of the hard inner tube are respectively provided with a blocking structure for preventing the anti-plating layer from expanding axially along the through hole.
Optionally, the anti-plating layer is a dry film layer.
Optionally, the thickness of the dry film layer is 100um-500um.
Optionally, the surfaces of the hard inner tube except the coating layer are coated with nonpolar materials.
A method for manufacturing a through hole with a multilayer network comprises the following steps:
Drilling through holes on a printed circuit board, wherein the hole walls of the through holes are divided into a to-be-metallized hole wall partition and a to-be-non-metallized hole wall partition which are distributed in a crossing manner along the axial direction or the radial direction of the through holes, and the number of the to-be-metallized hole wall partitions is multiple;
The multistage plating-preventing structure is plugged into the through hole, so that the outer side wall of each plating-preventing layer is respectively attached to the corresponding partition of the non-metalized hole wall;
And carrying out copper deposition electroplating on the through holes plugged into the multi-stage plating prevention structure so as to form electroplated layers on the surface of each section of the pseudo-metallized hole wall of the through holes.
Optionally, the anti-plating layer is made of a material with a thermal expansion coefficient exceeding a preset threshold, the hard inner tube is made of a material with a thermal expansion coefficient lower than the preset threshold, and the two axial ends of the outer side wall of each second tube wall partition of the hard inner tube are respectively provided with a blocking structure for preventing the anti-plating layer from expanding axially along the through hole;
The through hole manufacturing method further comprises the step of heating the multi-stage plating prevention structure after the multi-stage plating prevention structure is plugged into the through hole, so that the plating prevention layer radially expands along the through hole to be attached to the corresponding partition of the pseudo non-metalized hole wall.
Optionally, the anti-plating layer is a dry film layer;
the method for manufacturing the through hole further comprises the step of dissolving and removing the dry film layer after the copper deposition electroplating is completed until the multistage plating prevention structure is separated from the through hole and then automatically falls off.
Alternatively, the dry film layer is removed by dissolution with 5% naoh basic solution.
A PCB comprising a via having a multilayer network, the via being made according to the via making method having a multilayer network as described in any one of the above.
Compared with the prior art, the invention has the beneficial effects that:
When the multistage plating prevention structure is plugged into the through hole, the periphery of each first pipe wall partition of the multistage plating prevention structure is not wrapped with the plating prevention layer, the pipe wall is provided with the hollowed-out structure, and the periphery of each second pipe wall partition is wrapped with the plating prevention layer, so that copper deposition/electroplating liquid medicine can pass through each first pipe wall partition to be in contact with each metal-like hole wall partition of the through hole so as to enable the surface of the metal-like hole wall partition to form an electroplated layer, and meanwhile, each non-metal-like hole wall partition of the through hole cannot form an electroplated layer due to shielding of the plating prevention layer. Therefore, by utilizing the multistage plating-preventing structure, at least three mutually separated electroplated layers can be realized on the inner wall of the same through hole, and as each part of electroplated layers can be used for connecting different signals, the through hole realizes multilayer network manufacturing, and compared with the prior art, the wiring density is greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a cross-sectional view of a multi-stage plating prevention structure provided in an embodiment of the present invention, in which a plurality of plating prevention layers are axially distributed along a through hole.
Fig. 2 is a top view of a multi-stage plating prevention structure provided by an embodiment of the present invention, in which a plurality of plating prevention layers are distributed along a radial direction of a through hole.
Fig. 3 is a flowchart of a method for fabricating a via with a multilayer network according to an embodiment of the present invention.
Fig. 4 is a schematic process diagram of a process for manufacturing a via hole with a multilayer network by using the multi-level plating resist structure shown in fig. 1 according to an embodiment of the present invention.
Fig. 5 is a schematic process diagram of manufacturing a via hole with a multilayer network using the multi-level plating resist structure shown in fig. 2 according to an embodiment of the present invention.
The reference numerals indicate a multistage plating-preventing structure 1, a hard inner pipe 11, a plating-preventing layer 12, a hollow-out structure 13, a printed circuit board 2 and a through hole 3.
Detailed Description
In order to make the objects, features and advantages of the present invention more comprehensible, the technical solutions in the embodiments of the present invention are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In order to solve the problem of low wiring density in the prior art, the embodiment of the invention provides a brand-new solution, a novel multistage plating-preventing structure 1 with a partial plating-resisting function is plugged into the through hole 3, and then conventional copper deposition electroplating is carried out on the through hole 3, so that an electroplated layer can be plated on at least three hole walls of the through hole 3 and electroless plating can be carried out on the residual hole walls, thereby realizing a multilayer network of the same through hole 3.
For convenience of description, for the through-hole 3 to be made with a multilayer network, the hole wall of the through-hole 3 is hereinafter divided into a partition of a pseudo-metallized hole wall and a partition of a pseudo-non-metallized hole wall which are alternately distributed in the axial direction or the radial direction thereof, and the number of the partitions of the pseudo-metallized hole wall is plural (i.e., not less than three).
Referring to fig. 1 and 2, an embodiment of the present invention provides a multi-stage plating preventing structure 1 for being plugged into a through hole 3 to be partially metallized, wherein the multi-stage plating preventing structure 1 includes a hard inner tube 11, and a tube wall of the hard inner tube 11 is axially and/or radially divided into a first tube wall partition and a second tube wall partition which are distributed in a crossing manner;
Each first pipe wall partition corresponds to each to-be-metallized hole wall partition of the through hole 3 one by one, and each first pipe wall partition is provided with a hollowed-out structure 13 for circulating copper deposition/electroplating liquid medicine;
the second pipe wall partitions are in one-to-one correspondence with the non-metallic pore wall partitions of the through hole 3, and the outer side wall of each first pipe wall partition is respectively wrapped with a plating preventing layer 12 for preventing the corresponding non-metallic pore wall partition from contacting copper deposition/electroplating liquid medicine.
It should be noted that, in this embodiment, the "one-to-one correspondence" means that the dimensions and positions of the two dimensions and positions are kept substantially matched, so as to ensure that when the multi-stage plating preventing structure 1 is plugged into the through hole 3, the plating preventing layer 12 wrapped around the periphery of each second pipe wall partition can be in a good integral bonding state with the non-metalized hole wall partition of the through hole 3 at the corresponding position respectively.
It can be understood that when the through hole 3 is plugged, the periphery of each first pipe wall partition of the multi-stage plating prevention structure 1 is not wrapped by the plating prevention layer 12, and the pipe wall of each first pipe wall partition is provided with the hollow structure 13, so that the copper deposition/electroplating liquid medicine can pass through each first pipe wall partition and be in partition contact with each pseudo-metalized hole wall of the through hole 3 to form an electroplated layer on the surface of the metal deposition/electroplating liquid medicine. Meanwhile, the periphery of each second pipe wall partition of the multistage plating prevention structure 1 is wrapped with a plating prevention layer 12, and the outer side wall of the plating prevention layer 12 can keep a lamination state with the non-metallic pore wall partition of the through hole 3, so that when the through hole 3 is completely immersed in copper deposition/electroplating liquid medicine, the plating prevention layer 12 can block the copper deposition/electroplating liquid medicine, so that the copper deposition/electroplating liquid medicine is prevented from being in contact with the non-metallic pore wall partition of the through hole 3, and the non-metallic pore wall partition surface of the through hole 3 cannot be plated with an electroplated layer. Therefore, by using the multi-stage plating preventing structure 1, at least three parts of plating layers separated from each other can be realized on the inner wall of the same through hole 3, and as each part of plating layer can be used for connecting different signals, the through hole 3 realizes multi-layer network manufacturing, and compared with the prior art, the wiring density is greatly improved.
In this embodiment, in the multi-stage plating preventing structure 1, the plating preventing layers 12 may be distributed on the outer side wall of the hard inner tube 11 at intervals along the axial direction of the through hole 3 (as shown in fig. 1), may be distributed along the radial direction of the through hole 3 (as shown in fig. 2), and may be distributed along the axial direction and the radial direction of the through hole 3 at intervals respectively. In practical applications, the distribution design of the matched plating resist 12 can be selected according to the network connection requirements of the through holes 3.
In an alternative embodiment, the rigid inner tube 11 is a rigid plastic, referred to as a stiffer plastic. Because the hard inner pipe 11 is hard plastic, the hard plastic has good supporting performance due to the fact that the hardness of the hard plastic is high, and the whole length of the multistage plating-preventing structure 1 can be kept in a stable state in the hole plugging process, the multistage plating-preventing structure 1 can be conveniently and rapidly plugged into the through hole 3, the plating-preventing layer 12 and the non-metal hole wall partition of the through hole 3 can be guaranteed to have high alignment degree, and the hole plugging precision is improved. Illustratively, the rigid plastic is PC (polycarbonate) material or AS (styrene-acrylonitrile copolymer) material.
For the plating resist effect, the plating resist layer 12 may be made of any material such as non-conductive plastic, so long as it cannot penetrate the copper deposition/plating solution to cause the copper deposition/plating solution to contact the inner wall of the through hole 3 at the corresponding position.
To promote conformability, the plating resist 12 is illustratively formed of a material having a coefficient of thermal expansion exceeding a predetermined threshold, and thermal expansion of the plating resist 12 typically occurs at higher temperatures. Based on this, after the multi-stage plating preventing structure 1 is plugged into the through hole 3, the multi-stage plating preventing structure 1 can be heated to cause the plating preventing layer 12 to thermally expand, so that the fit degree of the plating preventing layer 12 and the non-metal-like hole wall partition of the through hole 3 is improved, and the plating preventing effect on the non-metal-like hole wall partition is further improved.
Still further exemplary, the plating resist 12 may be a dry film layer in particular for improved manufacturing efficiency. Based on this, in order to manufacture the multistage plating preventing structure 1 having the plating preventing layer 12 in the outer partial area of the hard inner tube 11, a dry film layer may be coated on the entire outer side wall of the hard inner tube 11 in advance, and then the dry film layer in the partial area may be selectively removed, so that the multistage plating preventing structure 1 having different selective multistage plating preventing functions may be manufactured simply, rapidly and accurately. Of course, in order to ensure good adhesion of the dry film layer to the non-metallized hole wall partition of the through hole 3, the thickness of the dry film layer can be adjusted to adapt to the through hole 3 with the current size, and optionally, the thickness of the dry film layer is 100um-500um.
In order to further improve reusability of the multi-stage plating prevention structure 1, a designated area of the hard inner tube 11 and the plating prevention layer 12 is coated with a nonpolar material, the designated area being a non-contact surface of the multi-stage plating prevention structure 1 which is not in contact with the wall of the through hole 3 in a state of being plugged into the through hole 3. When immersed in the copper deposition/electroplating liquid medicine, the nonpolar material can avoid the corrosion of the surface of the multi-stage plating prevention structure 1 or the formation of an electroplated layer caused by the chemical reaction between the surface of the multi-stage plating prevention structure 1 and the liquid medicine.
Referring to fig. 3 to 5, the embodiment of the invention further provides a method for manufacturing a via hole with a multilayer network, which includes the steps of:
Step 101, drilling a through hole 3 on the printed circuit board 2.
The hole wall of the through hole 3 is divided into a quasi-metallized hole wall partition and a quasi-non-metallized hole wall partition which are distributed in a crossed manner along the axial direction and/or the radial direction, and the number of the quasi-metallized hole wall partitions is multiple.
Specifically, the printed circuit board 2 can be obtained by laminating and laminating according to the conventional procedure, and then the through hole 3 is drilled on the printed circuit board 2.
Step 102, plugging the multi-stage plating-preventing structure 1 into the through hole 3, so that the outer side walls of the plating-preventing layers 12 of all parts are respectively attached to the partition of the non-metal-like hole wall at the corresponding position.
It should be noted that, in this embodiment, the overall length of the hard inner tube 11 of the multi-stage plating preventing structure 1 is equal to the overall depth of the through hole 3, and the partition mode of the hard inner tube 11 is exactly the same as the partition mode of the inner wall of the through hole 3, so that when the through hole 3 is completely plugged in, the plating preventing layer 12 of the multi-stage plating preventing structure 1 and the partition of the non-metallized hole wall of the through hole 3 are completely aligned and attached, so that the partition of the non-metallized hole wall of the through hole 3 is non-metallized.
The multistage plating prevention structure 1 and the through hole 3 are manufactured in a mode of completely matching the sizes, so that the difficulty and the complexity of the control of the hole plugging depth are avoided in the hole plugging operation, and the multistage plating prevention structure 1 is only needed to be plugged into the through hole 3 until the end part is basically leveled.
And 103, carrying out copper deposition electroplating on the through holes 3 plugged into the multi-stage anti-plating structure 1 to form electroplated layers on the surface of each pseudo-metallized hole wall partition of the through holes 3.
After the multi-stage plating-preventing structure 1 is plugged, the partition of the non-metallic pore wall of the through hole 3 is blocked by the plating-preventing layer 12, and the partition of the non-metallic pore wall is not blocked, so that the partition of the non-metallic pore wall of the through hole 3 can not form a plating layer after copper deposition plating, and the partition of the non-metallic pore wall of the through hole 3 forms a plating layer, and meanwhile, the number of the partitions of the non-metallic pore wall is at least three, so that the through hole 3 with a multi-layer network is manufactured.
It should be noted that, because the whole multi-stage plating preventing structure 1 is a hollow structure, in the copper deposition electroplating process, copper deposition/electroplating chemical water can smoothly pass through the middle gap of the multi-stage plating preventing structure 1 to realize good exchange so as to ensure the thickness uniformity and flatness of the electroplating layer on the partition surface of each pseudo-metallized pore wall.
In an alternative embodiment, the plating resist 12 is made of a material with a thermal expansion coefficient exceeding a preset threshold, the hard inner tube 11 is made of a material with a thermal expansion coefficient lower than the preset threshold, and both axial ends of the outer side wall of each second tube wall partition of the hard inner tube 11 are respectively provided with a blocking structure for preventing the plating resist 12 from expanding axially along the through hole 3. At this time, the method for manufacturing the through hole 3 further includes heating the multi-stage plating preventing structure 1 after the multi-stage plating preventing structure 1 is plugged into the through hole 3, wherein the expansion rate of the hard inner tube 11 is within the allowable error range due to the low expansion coefficient, and the plating preventing layer 12 is limited by the blocking structure and cannot expand along the axial direction of the through hole 3 and can only expand along the radial direction of the through hole 3, so that the degree of adhesion between the plating preventing layer 12 and the corresponding partition of the pseudo-non-metalized hole wall is improved.
Step 104, removing the multi-stage plating prevention structure 1.
In practical application, if the multi-stage plating preventing structure 1 does not affect the normal use of the subsequent printed circuit board 2, the multi-stage plating preventing structure 1 in the through hole 3 can be reserved, and no additional removing operation is performed.
Of course, the multi-stage plating preventing structure 1 may be removed selectively, and different removing modes may be adopted according to the specific material of the multi-stage plating preventing structure 1, which is not limited in the embodiment of the present invention. Two general ways of removing the multi-stage plating resist structure 1 are provided, namely, pushing the multi-stage plating resist structure 1 out of the through hole 3 by using an external tool, or manually pulling the multi-stage plating resist structure 1 out of the through hole 3 by hand or by using an external tool.
When the plating preventing layer 12 is a dry film layer, the multi-stage plating preventing structure 1 can be removed by dissolving and removing the dry film layer after copper deposition electroplating is completed until the multi-stage plating preventing structure 1 is separated from the through hole 3 and then automatically falls off. Wherein, the dry film layer can be removed by dissolving with 5% NaOH alkaline liquid medicine. The removing mode of the multistage plating-preventing structure 1 has the advantages of being simple in operation, low in difficulty, high in working efficiency and low in cost, and the multistage plating-preventing structure 1 and the inner wall of the through hole 3 are not damaged because no action occurs between the multistage plating-preventing structure 1 and the inner wall of the through hole 3 in the removing operation process.
In summary, according to the method for manufacturing the through hole 3 with the multilayer network provided by the embodiment of the invention, the multilayer network can be manufactured in the same through hole 3 only by plugging the matched multistage plating prevention structure 1 into the through hole 3 and then carrying out copper deposition electroplating, and compared with the prior art, the wiring density of a PCB (printed circuit board) can be effectively improved.
The embodiment of the invention also provides a PCB, which comprises a through hole 3 with a multilayer network, wherein the through hole 3 is manufactured according to the manufacturing method. The through hole 3 of the PCB is manufactured by the above method, and thus has a high wiring density.
While the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that the foregoing embodiments may be modified or equivalents may be substituted for some of the features thereof, and that the modifications or substitutions do not depart from the spirit and scope of the embodiments of the invention.
Claims (10)
1. A multi-stage plating-preventing structure is used for being plugged into a through hole to be metallized, the hole wall of the through hole is divided into a partition of the wall of the through hole to be metallized and a partition of the wall of the hole to be non-metallized which are distributed in a crossed manner along the axial direction or the radial direction of the through hole, the number of the partitions of the wall of the hole to be metallized is a plurality of,
The multistage plating-preventing structure comprises a hard inner pipe, wherein the pipe wall of the hard inner pipe is axially or radially divided into a first pipe wall partition and a second pipe wall partition which are distributed in a crossed manner;
each first pipe wall partition corresponds to each to-be-metallized hole wall partition one by one, and each first pipe wall partition is provided with a hollowed-out structure for communicating copper deposition liquid medicine or electroplating liquid medicine;
Each second pipe wall partition corresponds to each non-metallic hole wall partition one by one, and the outer side wall of each second pipe wall partition is respectively wrapped with an anti-plating layer for blocking the corresponding non-metallic hole wall partition from contacting copper deposition liquid or electroplating liquid;
By utilizing the multistage plating-preventing structure, at least three mutually separated plating layers are realized on the inner wall of the same through hole, and each part of plating layer can be used for connecting different signals.
2. The multi-stage plating preventing structure according to claim 1, wherein the plating preventing layer is made of a material with a thermal expansion coefficient exceeding a preset threshold, the hard inner tube is made of a material with a thermal expansion coefficient lower than the preset threshold, and both axial ends of the outer side wall of each second tube wall partition of the hard inner tube are respectively provided with a blocking structure for preventing the plating preventing layer from expanding along the axial direction of the through hole.
3. The multi-level plating resist structure of claim 1, wherein the resist layer is a dry film layer.
4. The multi-level plating resist structure of claim 3, wherein the dry film layer has a thickness of 100um to 500um.
5. The multi-stage plating prevention structure according to claim 1, wherein the surfaces of the hard inner tube except for the plating prevention layer are coated with a nonpolar material.
6. A method of fabricating a via having a multi-layered network, comprising the steps of:
Drilling through holes on a printed circuit board, wherein the hole walls of the through holes are divided into a to-be-metallized hole wall partition and a to-be-non-metallized hole wall partition which are distributed in a crossing manner along the axial direction or the radial direction of the through holes, and the number of the to-be-metallized hole wall partitions is multiple;
plugging the multi-stage plating-preventing structure of claim 1 into the through hole so that the outer side wall of each plating-preventing layer is respectively attached to the corresponding partition of the pseudo-non-metallized hole wall;
And carrying out copper deposition electroplating on the through holes plugged into the multi-stage plating prevention structure so as to form electroplated layers on the surface of each section of the pseudo-metallized hole wall of the through holes.
7. The method according to claim 6, wherein the plating resist is made of a material having a thermal expansion coefficient exceeding a preset threshold, the hard inner tube is made of a material having a thermal expansion coefficient lower than the preset threshold, and both axial ends of the outer side wall of each second tube wall partition of the hard inner tube are respectively provided with a blocking structure for preventing the plating resist from expanding axially along the through hole;
The through hole manufacturing method further comprises the step of heating the multi-stage plating prevention structure after the multi-stage plating prevention structure is plugged into the through hole, so that the plating prevention layer radially expands along the through hole to be attached to the corresponding partition of the pseudo non-metalized hole wall.
8. The method of manufacturing a via having a multilayer network according to claim 6, wherein the plating resist layer is a dry film layer;
the method for manufacturing the through hole further comprises the step of dissolving and removing the dry film layer after the copper deposition electroplating is completed until the multistage plating prevention structure is separated from the through hole and then automatically falls off.
9. The method of fabricating a via having a multilayer network according to claim 8, wherein the dry film layer is dissolved and removed using 5% NaOH basic liquid medicine.
10. A PCB comprising a via having a multilayer network, characterized in that the via is manufactured according to the via manufacturing method having a multilayer network as claimed in any one of claims 6 to 9.
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| CN101257772A (en) * | 2007-02-28 | 2008-09-03 | 富士通株式会社 | Manufacturing method of printed circuit board, printed circuit board and electronic device |
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| US9526184B2 (en) * | 2012-06-29 | 2016-12-20 | Viasystems, Inc. | Circuit board multi-functional hole system and method |
| US10820427B2 (en) * | 2013-03-15 | 2020-10-27 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
| JP2015185735A (en) * | 2014-03-25 | 2015-10-22 | 日立化成株式会社 | Multilayer wiring board and manufacturing method therefor |
| CN108323002B (en) * | 2017-01-16 | 2022-10-28 | 中兴通讯股份有限公司 | Printed circuit board and method |
| CN109862719B (en) * | 2019-04-02 | 2022-04-29 | 生益电子股份有限公司 | PCB manufacturing method for realizing one-hole multi-network and PCB |
| CN113709984B (en) * | 2021-08-30 | 2024-08-27 | 德中（天津）技术发展股份有限公司 | Circuit board manufacturing method for plating hole, bonding pad plating resistance and resist pattern by laser processing |
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