[go: up one dir, main page]

CN115066093B - A buried via manufacturing method and PCB - Google Patents

A buried via manufacturing method and PCB Download PDF

Info

Publication number
CN115066093B
CN115066093B CN202210743481.XA CN202210743481A CN115066093B CN 115066093 B CN115066093 B CN 115066093B CN 202210743481 A CN202210743481 A CN 202210743481A CN 115066093 B CN115066093 B CN 115066093B
Authority
CN
China
Prior art keywords
hole
length
wall
inner tube
plugging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202210743481.XA
Other languages
Chinese (zh)
Other versions
CN115066093A (en
Inventor
朱光远
肖璐
林宇超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shengyi Electronics Co Ltd
Original Assignee
Shengyi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shengyi Electronics Co Ltd filed Critical Shengyi Electronics Co Ltd
Priority to CN202210743481.XA priority Critical patent/CN115066093B/en
Publication of CN115066093A publication Critical patent/CN115066093A/en
Application granted granted Critical
Publication of CN115066093B publication Critical patent/CN115066093B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • H05K1/116Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/423Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

本发明涉及PCB技术领域,公开了一种埋孔制作方法及PCB。塞孔结构包括内管和外管;内管为中空结构,且沿其轴向依次划分为上段内管体、中段内管体和下段内管体;上段内管体的长度不小于上部孔壁的长度,中段内管体的长度与中间孔壁的长度相等,下段内管体的长度不小于下部孔壁的长度;上段内管体和下段内管体的外侧壁分别套设有外管,外管用于与上部孔壁和下部孔壁相贴合,中段内管体的管壁开设有镂空结构。本发明实施例针对埋孔设计了能够对两端区域进行阻镀、对中间区域不阻镀的塞孔结构,在钻得通孔后先在该通孔内塞入塞孔结构再沉铜电镀并树脂塞孔,大大简化了流程,缩短了制作周期,降低了加工成本。

The present invention relates to the technical field of PCBs, and discloses a method for making buried vias and a PCB. The plug hole structure comprises an inner tube and an outer tube; the inner tube is a hollow structure, and is divided into an upper inner tube body, a middle inner tube body and a lower inner tube body in sequence along its axial direction; the length of the upper inner tube body is not less than the length of the upper hole wall, the length of the middle inner tube body is equal to the length of the middle hole wall, and the length of the lower inner tube body is not less than the length of the lower hole wall; the outer side walls of the upper inner tube body and the lower inner tube body are respectively sleeved with outer tubes, and the outer tubes are used to fit with the upper hole wall and the lower hole wall, and the tube wall of the middle inner tube body is provided with a hollow structure. The embodiment of the present invention designs a plug hole structure for buried vias, which can resist plating at both end areas but not at the middle area. After drilling a through hole, the plug hole structure is first inserted into the through hole, and then copper is electroplated and the hole is plugged with resin, which greatly simplifies the process, shortens the production cycle, and reduces the processing cost.

Description

Buried hole manufacturing method and PCB
Technical Field
The invention relates to the technical field of PCBs (Printed Circuit Boards ), in particular to a buried hole manufacturing method and a PCB.
Background
With the development of electronic products to high density and high precision, the same requirements are correspondingly put on the printed circuit board. The most effective method for improving the density of the printed circuit board is to reduce the number of through holes and realize the method by precisely arranging blind buried holes. Blind holes are located on the top and bottom surfaces of the printed circuit board and have a depth for connection of the top layer circuitry to the underlying inner layer circuitry, the depth of the holes typically not exceeding a certain ratio (aperture); buried vias refer to vias that connect between inner layers and are not visible on the surface of the finished board. Along with the popularization of the blind buried hole printed circuit board, how to manufacture the blind buried hole board faster and better is always an important direction of research of production and manufacturing units of various printed circuit boards.
The existing buried hole manufacturing process mainly comprises the steps of firstly drilling through holes on an inner layer sub-board, then carrying out metallization and resin hole plugging on the through holes on the inner layer sub-board, and then laminating an upper layer sub-board, an inner layer sub-board and a lower layer sub-board, so that the through holes on the inner layer sub-board are formed into buried holes. The buried hole manufacturing process is complex in flow and long in production period, and influences the manufacturing cost of the product.
Disclosure of Invention
The invention aims to provide a buried hole manufacturing method and a PCB (printed circuit board) so as to solve the problems of complicated flow, long period and high cost in the traditional buried hole manufacturing process.
To achieve the purpose, the invention adopts the following technical scheme:
The utility model provides a hole plugging structure for pack into the through-hole of pseudo-metallization, the pore wall of through-hole divides into along its axial in proper order: an upper pore wall to be non-metallized, a middle pore wall to be metallized, and a lower pore wall to be non-metallized; the plug hole structure comprises an inner pipe and an outer pipe;
the inner tube is of a hollow structure and is divided into an upper inner tube body, a middle inner tube body and a lower inner tube body in sequence along the axial direction of the inner tube;
the length of the upper section inner pipe body is not smaller than the length of the upper hole wall, the length of the middle section inner pipe body is equal to the length of the middle hole wall, and the length of the lower section inner pipe body is not smaller than the length of the lower hole wall;
The outer side walls of the upper section inner pipe body and the lower section inner pipe body are respectively sleeved with the outer pipe, and the outer pipe is used for being attached to the upper hole wall and the lower hole wall so as to prevent copper deposition or electroplating liquid medicine from contacting the upper hole wall and the lower hole wall;
The tube wall of the middle section inner tube body is provided with a hollow structure for circulating the copper deposition or electroplating liquid medicine.
Optionally, the inner tube is made of hard plastic material, and the outer tube is made of flexible rubber material.
Optionally, the thickness of the outer tube is greater than the thickness of the inner tube.
Optionally, designated areas of the inner tube and the outer tube are coated with a nonpolar material, and the designated areas are non-contact surfaces of the hole plugging structure, which are in non-contact with the hole wall of the through hole in a state of being plugged into the through hole.
A buried hole manufacturing method comprises the following steps:
Drilling through holes on the printed circuit board, wherein the through holes are sequentially divided into: an upper pore wall to be non-metallized, a middle pore wall to be metallized, and a lower pore wall to be non-metallized;
the plug hole structure is plugged into the through hole until the middle inner pipe body of the plug hole structure is aligned with the middle hole wall of the through hole;
Carrying out copper deposition electroplating on the through hole plugged into the hole plugging structure so as to form an electroplated layer on the middle hole wall of the through hole;
And removing the hole plugging structure, and plugging the through hole with resin to obtain a buried hole.
Optionally, the length of the upper inner pipe body is equal to the length of the upper hole wall, and the length of the lower inner pipe body is equal to the length of the lower hole wall;
the method for plugging the plug hole structure into the through hole comprises the following steps: and taking the orifice at any end of the through hole as an inlet end, and plugging the plug hole structure into the through hole until the two axial ends of the inner tube are leveled with the two axial ends of the through hole.
Optionally, the length of the upper section inner pipe body of the inner pipe is greater than the length of the upper hole wall, and the outer end of the upper section inner pipe body is provided with a hole plugging depth mark; and/or the length of the lower section inner pipe body of the inner pipe is greater than the length of the lower hole wall, and the outer end of the lower section inner pipe body is provided with a hole plugging depth mark;
the method for plugging the plug hole structure into the through hole comprises the following steps: and plugging the plug hole structure into a preset depth position according to the plug hole depth mark. And cutting off the exposed part of the plug hole structure outside the through hole after the copper deposition electroplating is completed.
Optionally, the method further comprises: and after the copper deposition electroplating is completed, pushing the plug hole structure out of the through hole by using a push rod.
A PCB comprising a buried via, the buried via being made according to any one of the buried via making methods described above.
Compared with the prior art, the invention has the beneficial effects that:
According to the embodiment of the invention, a hole plugging structure capable of carrying out plating resistance on two end areas and not plating resistance on an intermediate area is designed aiming at a buried hole, after a through hole is drilled, the hole plugging structure is plugged into the through hole, copper deposition electroplating is carried out on the through hole, and a resin hole plugging is carried out, so that a blind hole structure with the intermediate metallization and the non-metallization at two ends can be obtained. Compared with the prior art, the process simplifies the secondary lamination operation into the primary lamination operation, greatly simplifies the flow, shortens the manufacturing period and reduces the processing cost.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic cross-sectional structure of a plug hole structure according to an embodiment of the present invention.
Fig. 2 is a flowchart of a method for fabricating a buried via according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a buried via manufacturing process according to an embodiment of the present invention.
Reference numerals illustrate: the plug hole structure 1, the inner tube 11, the outer tube 12, the hollow structure 13, the printed circuit board 2 and the through hole 3.
Detailed Description
In order to make the objects, features and advantages of the present invention more comprehensible, the technical solutions in the embodiments of the present invention are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In order to solve various problems of complicated flow, long period, high cost and the like of the conventional secondary press-fit finding mode, the embodiment of the invention provides a brand-new solving idea, a novel plug hole structure 1 with a partial plating blocking function is plugged into a through hole 3, and then conventional copper deposition electroplating is carried out on the through hole 3, so that an electroplated layer can be plated on the middle hole wall of the through hole 3, and no electroplated layer is plated on the hole walls at two ends to form a buried hole.
For convenience of description, for the through-hole 3 for making the buried hole, the hole wall of the through-hole 3 is divided into: an upper pore wall that is to be non-metallized, a middle pore wall that is to be metallized, and a lower pore wall that is to be non-metallized.
Referring to fig. 1, an embodiment of the present invention provides a plug hole structure 1 for plugging a through hole 3 to be partially metallized, wherein the plug hole structure 1 includes an inner tube 11 and an outer tube 12;
the inner tube 11 is of a hollow structure and is divided into an upper inner tube body, a middle inner tube body and a lower inner tube body in sequence along the axial direction of the inner tube; the length of the inner pipe body in the middle section is equal to the length of the middle hole wall of the through hole 3 to be metallized;
The outer tube 12 is fixedly sleeved on the periphery of the upper inner tube body and the periphery of the lower inner tube body of the inner tube 11, and the outer side wall of the outer tube 12 is attached to the upper hole wall and the lower hole wall of the through hole 3 so as to prevent copper deposition or electroplating liquid from contacting the upper hole wall and the lower hole wall of the through hole 3 and prevent the upper hole wall and the lower hole wall of the through hole 3 from forming an electroplated layer.
Meanwhile, the hollow structure 13 for copper deposition or electroplating liquid circulation is arranged on the pipe wall of the middle inner pipe body, and the hollow structure 13 can realize copper deposition or electroplating liquid exchange in the middle hole wall area of the through hole 3 so as to ensure that the middle hole wall of the through hole 3 can be plated with an electroplated layer successfully.
It can be understood that when the outer tube 12 of the plug hole structure 1 is plugged into the through hole 3, the outer side wall of the outer tube 12 can keep a fit state with the upper hole wall and the lower hole wall of the through hole 3, so that when the through hole 3 is completely immersed in the copper deposition or electroplating solution, the outer tube 12 can block the copper deposition or electroplating solution so as to prevent the copper deposition or electroplating solution from contacting with the upper hole wall and the lower hole wall of the through hole 3; meanwhile, the outer tube 12 is not coated on the outer periphery of the middle inner tube of the inner tube 11, and the hollow structure is arranged on the tube wall of the middle inner tube, so that copper deposition or electroplating chemical water can pass through the hollow structure and contact with the middle hole wall of the through hole 3 to form an electroplated layer on the surface of the inner tube. Thus, by using the plug hole structure 1, buried holes can be formed.
For the plating resist effect, the outer tube 12 may be made of any material such as non-conductive plastic, so long as it cannot penetrate the copper deposition or plating solution to cause the copper deposition or plating solution to contact the inner wall of the through hole 3 at the corresponding position.
In an alternative embodiment, the inner tube 11 is a rigid plastic, referred to as a stiffer plastic. Because the inner tube 11 is hard plastic, the hard plastic has good supporting performance due to the large hardness, and the whole length of the hole plugging structure 1 can be kept in a stable state in the hole plugging process, so that the hole plugging structure 1 can be plugged into the preset depth position of the through hole 3 quickly, and the hole plugging precision is improved. Illustratively, the rigid plastic is PC (polycarbonate) material or AS (styrene-acrylonitrile copolymer) material.
Meanwhile, in order to improve the fitting degree, the outer tube 12 is made of flexible rubber, and the flexible rubber has good elastic deformation performance, so that adaptive deformation can be generated under the limiting action of the wall of the through hole 3 in the hole plugging process, the current through hole 3 is matched with the outer tube 12 to a larger extent, and the fitting degree of the wall of the through hole 3 is improved. In this way, not only the manufacturing tolerance existing between the aperture of the through hole 3 and the outer diameter of the hole plugging structure 1 can be overcome, but also the compatibility of the hole plugging structure 1 to a group of through holes 3 (including a plurality of through holes 3 with theoretical aperture manufacturing differences within a preset range) can be realized.
In order to further improve reusability of the plug hole structure 1, designated areas of the inner tube 11 and the outer tube 12, which are non-contact surfaces of the plug hole structure 1 not in contact with the wall of the through hole 3 in a state of being plugged into the through hole 3, are coated with a non-polar material. The nonpolar material can avoid corrosion or electroplating layer formation on the surface of the plug hole structure 1 caused by chemical reaction between the surface of the plug hole structure 1 and the liquid medicine when immersed in copper deposition or electroplating liquid medicine.
Referring to fig. 2 and 3, the embodiment of the invention further provides a buried hole manufacturing method, which includes the steps of:
Step 101, drilling a through hole 3 on the printed circuit board 2.
Specifically, the printed circuit board 2 can be obtained by laminating and laminating according to the conventional procedure, and then the through hole 3 is drilled on the printed circuit board 2.
Step 102, plugging the hole plugging structure 1 into the through hole 3, so that the middle section inner pipe body of the outer pipe 12 is not covered on the periphery of the inner pipe 11 of the hole plugging structure 1 and the middle hole wall of the through hole 3 are aligned.
In this embodiment, the length of the middle inner tube body of the inner tube 11 is substantially equal to the length of the middle hole wall of the through hole 3, so that the position alignment refers to the whole alignment, so that each position of the middle hole wall of the through hole 3 can be ensured to be plated with an electroplated layer in the subsequent copper deposition electroplating process.
In one possible embodiment, the length of the upper inner tube body of the inner tube 11 is equal to the length of the upper aperture wall of the through-hole 3 to be non-metallized, and the length of the lower inner tube body of the inner tube 11 is equal to the length of the lower aperture wall of the through-hole 3 to be metallized. At this time, the overall length of the hole plugging structure 1 is equal to the overall depth of the through hole 3, and the method for plugging the hole plugging structure 1 into the through hole 3 is as follows: the plug hole structure 1 is completely plugged into the through hole 3 until both ends of the inner tube 11 are leveled with both ends of the through hole 3. The hole plugging method is simple and quick, can realize accurate partial metallization of the through hole 3, and does not have hole plugging depth control difficulty and complexity.
In another possible embodiment, the length of the upper inner pipe body of the inner pipe 11 is greater than the length of the upper aperture wall to be non-metallized of the through-hole 3, and the length of the lower inner pipe body of the inner pipe 11 is equal to the length of the lower aperture wall to be non-metallized of the through-hole 3; or the length of the lower section inner pipe body of the inner pipe 11 is larger than the length of the non-metallic lower hole wall of the through hole 3, and the length of the upper section inner pipe body of the inner pipe 11 is equal to the length of the non-metallic upper hole wall of the through hole 3. At this time, after the hole plugging structure 1 is plugged in place, one end of the inner tube 11 is exposed to the outside, and the other end is leveled with the end of the through hole 3. Thus, in this case, the method of plugging the plug hole structure 1 into the through hole 3 may be: the plug hole structure 1 is plugged directly into the through hole 3 until the quasi-flat end of the inner tube 11 and the corresponding end of the through hole 3 reach an actual substantially flat state. The mode is convenient for accurate plugging in and convenient for subsequent taking out.
In a further possible embodiment, the length of the upper inner tube body of the inner tube 11 is greater than the length of the upper portion wall of the through hole 3 to be non-metallized, and the length of the lower inner tube body of the inner tube 11 is greater than the length of the lower portion wall of the through hole 3 to be non-metallized, and the outer ends of the upper inner tube body and/or the lower inner tube body are provided with plug hole depth marks. At this time, both ends of the inner tube 11 are exposed after the hole plugging structure 1 is plugged in place. Thus, in this case, the method of plugging the plug hole structure 1 into the through hole 3 may be: and plugging the plug hole structure 1 into a preset depth position according to the plug hole depth mark. The plug hole structure 1 in this way has a strong versatility. For a group of through holes 3 with the same aperture, if the lengths of the intermediate hole walls to be metallized are equal and the lengths of the upper hole walls to be non-metallized/the lower hole walls to be non-metallized are different, the group of through holes 3 can be used for manufacturing different buried holes by the same hole plugging structure 1, and only the matched hole plugging structure 1 is required to be manufactured according to the through hole 3 with the largest depth.
It should be noted that, the plug hole depth mark may be any mark type capable of being visualized, such as graduations, characters, graphics, symbols, and the like.
Step 103, performing copper deposition electroplating on the through hole 3 plugged into the plug hole structure 1 to form an electroplated layer on the middle hole wall of the through hole 3.
After the through hole structure 1 is plugged, the upper hole wall and the lower hole wall of the through hole 3 are both blocked by the outer tube 12, and only the middle hole wall is not blocked by the outer tube 12, so that the upper hole wall and the lower hole wall of the through hole 3 cannot form an electroplated layer after copper deposition electroplating, and the middle hole wall of the through hole 3 forms an electroplated layer.
It should be noted that, because the entire plug hole structure 1 is a hollow structure, in the copper deposition electroplating process, copper deposition or electroplating chemical water can smoothly pass through the middle gap of the plug hole structure 1 to realize good exchange in the middle hole wall area, so as to ensure the thickness uniformity and flatness of the electroplated layer.
And 104, removing the hole plugging structure 1, and plugging the through hole 3 with resin to obtain a buried hole.
In practical application, if the hole plugging structure 1 does not affect the normal use of the subsequent printed circuit board 2, the hole plugging structure 1 in the through hole 3 can be reserved, and no additional removal operation is performed. In the case that the overall length of the plug hole structure 1 is greater than the depth of the through hole 3, the exposed portion of the plug hole structure 1 outside the through hole 3 may be cut off after the copper plating is completed.
Of course, the hole plugging structure 1 may be removed alternatively, and in particular, different removing manners may be adopted according to the specific material of the hole plugging structure 1, which is not limited in this embodiment of the present invention. Two general manners of removing the plug hole structure 1 are provided: when the hole plugging structure 1 is completely positioned in the through hole 3, a push rod can be used for pushing the hole plugging structure 1 out of the through hole 3; when the hole-plugging structure 1 is partially exposed outside the through hole 3, the hole-plugging structure 1 can be directly pulled out of the through hole 3 manually or automatically by a machine.
In summary, according to the PCB manufacturing method provided by the embodiment of the present invention, the buried hole can be manufactured by simply plugging the through hole 3 with the adapted hole plugging structure 1 and then copper plating and resin hole plugging.
The embodiment of the invention also provides a PCB with the buried hole, and the buried hole is manufactured according to the buried hole manufacturing method. The buried hole of the PCB is manufactured by adopting the method, so that the PCB has good product quality.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (9)

1. The buried hole manufacturing method is characterized by being realized based on a hole plugging structure, wherein the hole plugging structure comprises an inner pipe and an outer pipe;
the inner tube is of a hollow structure and is divided into an upper inner tube body, a middle inner tube body and a lower inner tube body in sequence along the axial direction of the inner tube;
The tube wall of the middle-section inner tube body is provided with a hollow structure for circulating copper deposition liquid medicine or electroplating liquid medicine;
The buried hole manufacturing method comprises the following steps:
Drilling through holes on the printed circuit board, wherein the through holes are sequentially divided into: an upper pore wall to be non-metallized, a middle pore wall to be metallized, and a lower pore wall to be non-metallized;
the length of the upper section inner pipe body is not smaller than the length of the upper hole wall, the length of the middle section inner pipe body is equal to the length of the middle hole wall, and the length of the lower section inner pipe body is not smaller than the length of the lower hole wall;
the outer side walls of the upper section inner pipe body and the lower section inner pipe body are respectively sleeved with the outer pipe, and the outer pipe is used for being attached to the upper hole wall and the lower hole wall so as to prevent copper precipitation liquid medicine or electroplating liquid medicine from contacting the upper hole wall and the lower hole wall;
Plugging the hole plugging structure into the through hole until the middle inner pipe body of the hole plugging structure is aligned with the middle hole wall of the through hole;
Carrying out copper deposition electroplating on the through hole plugged into the hole plugging structure so as to form an electroplated layer on the middle hole wall of the through hole;
And removing the hole plugging structure, and plugging the through hole with resin to obtain a buried hole.
2. The buried via making method according to claim 1, wherein the length of the upper inner pipe is equal to the length of the upper hole wall, and the length of the lower inner pipe is equal to the length of the lower hole wall;
the method for plugging the plug hole structure into the through hole comprises the following steps: and taking the orifice at any end of the through hole as an inlet end, and plugging the plug hole structure into the through hole until the two axial ends of the inner tube are leveled with the two axial ends of the through hole.
3. The buried hole manufacturing method according to claim 1, wherein the length of the upper section inner pipe body of the inner pipe is greater than the length of the upper hole wall, and the outer end of the upper section inner pipe body is provided with a hole plugging depth mark; and/or the length of the lower section inner pipe body of the inner pipe is greater than the length of the lower hole wall, and the outer end of the lower section inner pipe body is provided with a hole plugging depth mark;
the method for plugging the plug hole structure into the through hole comprises the following steps: and plugging the plug hole structure into a preset depth position according to the plug hole depth mark.
4. The method of claim 3, wherein the exposed portion of the via structure outside the via is removed after the copper deposition plating is completed.
5. The buried via making method according to claim 1, further comprising: and after the copper deposition electroplating is completed, pushing the plug hole structure out of the through hole by using a push rod.
6. The method of claim 1, wherein the inner tube is a hard plastic material and the outer tube is a flexible rubber material.
7. The buried via making method according to claim 1, wherein the thickness of the outer pipe is greater than the thickness of the inner pipe.
8. The buried via making method according to claim 1, wherein a designated area of the inner pipe and the outer pipe, which is a non-contact surface of the via hole structure that is not in contact with a wall of the via hole in a state of being plugged into the via hole, is coated with a non-polar material.
9. A PCB comprising a buried via, wherein the buried via is manufactured according to the buried via manufacturing method of any one of claims 1 to 8.
CN202210743481.XA 2022-06-28 2022-06-28 A buried via manufacturing method and PCB Active CN115066093B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210743481.XA CN115066093B (en) 2022-06-28 2022-06-28 A buried via manufacturing method and PCB

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210743481.XA CN115066093B (en) 2022-06-28 2022-06-28 A buried via manufacturing method and PCB

Publications (2)

Publication Number Publication Date
CN115066093A CN115066093A (en) 2022-09-16
CN115066093B true CN115066093B (en) 2024-11-26

Family

ID=83204756

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210743481.XA Active CN115066093B (en) 2022-06-28 2022-06-28 A buried via manufacturing method and PCB

Country Status (1)

Country Link
CN (1) CN115066093B (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101257772A (en) * 2007-02-28 2008-09-03 富士通株式会社 Manufacturing method of printed circuit board, printed circuit board and electronic device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6784377B2 (en) * 2001-05-10 2004-08-31 International Business Machines Corporation Method and structure for repairing or modifying surface connections on circuit boards
US9635761B2 (en) * 2013-07-15 2017-04-25 Massachusetts Institute Of Technology Sleeved coaxial printed circuit board vias
US10785871B1 (en) * 2018-12-12 2020-09-22 Vlt, Inc. Panel molded electronic assemblies with integral terminals
CN110392482A (en) * 2018-04-18 2019-10-29 北大方正集团有限公司 circuit board
US10952330B2 (en) * 2019-01-24 2021-03-16 International Business Machines Corporation Repairing defective through-holes
CN112672508B (en) * 2020-11-30 2023-06-13 重庆锦瑜电子股份有限公司 Resin hole plugging method for PCB

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101257772A (en) * 2007-02-28 2008-09-03 富士通株式会社 Manufacturing method of printed circuit board, printed circuit board and electronic device

Also Published As

Publication number Publication date
CN115066093A (en) 2022-09-16

Similar Documents

Publication Publication Date Title
CN105887144B (en) Copper electrolyte and its copper plating process is electroplated
US4683036A (en) Method for electroplating non-metallic surfaces
CN103687312B (en) Gold-plated method for manufacturing circuit board
CN102110866B (en) Manufacturing process of waveguide slot
US20130056362A1 (en) Manufacture method of buildup circuit board
WO2013092131A1 (en) Method for combined through-hole plating and via filling
CN105338754A (en) Manufacturing method of partial thick copper PCB
CN103687313A (en) Method for graphically machining bottoms of blind grooves
CN106455343B (en) A kind of minimizing technology of gold finger lead
CN102014589A (en) Method of manufacturing printed wiring board
TWI628989B (en) Method for forming wire and filling via of pcb
CN104470260B (en) Blind hole electroplates filling perforation method and circuit board
CN115066093B (en) A buried via manufacturing method and PCB
CN110493964A (en) A kind of production method in the non-metallic hole without etching ring
CN109587968A (en) One kind preventing consent or the undesirable PCB production method of plated hole
CN104349577B (en) Two-sided crimping backboard and its boring method
CN109152240B (en) Printed circuit board with metalized lock hole structure and hole metallization process thereof
CN114980501B (en) A plug hole structure, a method for manufacturing a double-sided press-fit hole, and a PCB
CN110446349B (en) Method for processing through hole of core plate layer by copper plating and hole filling
CN110167272B (en) Over-etching depth control method
CN104105354A (en) Method of manufacturing high-aperture ratio fine printed circuit board
CN113373484A (en) Manufacturing method for solving problem of uneven inflation of copper groove of vertical plating line
CN114340164A (en) A new type of circuit board electroplating slot hole manufacturing process
CN203554777U (en) Substrate and circuit board
CN113026066A (en) Blind hole filling copper plating solution of non-presoaking system and copper plating process thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant