CN114902233A - contactless communication medium - Google Patents

Abstract

A non-contact communication medium (1, 1A-1K) according to the present disclosure includes an electronic component (10) and a housing. The electronic component (10) performs non-contact communication. The housing (20, 20A-20K) houses the electronic component (10). The housing (20, 20A-20K) has a main body (21, 21A, 21B, 21D, 21E, 21G, 21K), a plug (22, 22C, 22D, 22F, 22G, 22H, 22K), and an adhesive layer (23, 23J, 23K). The main body parts (21, 21A, 21B, 21D, 21E, 21G, 21K) have accommodating holes (25A, 25B, 25D, 25E, 25G) for accommodating the electronic components (10). The plug parts (22, 22C, 22D, 22F, 22G, 22H, 22K) are inserted into the receiving holes. The adhesive layers (23, 23J, 23K) are located between the inner peripheral surfaces of the housing holes (25A, 25B, 25D, 25E, 25G) and the outer peripheral surfaces of the plug sections, and are used for bonding the body sections (21, 21A, 21B, 21D, 21E, 21G, 21K) and the plug sections (22, 22C, 22D, 22F, 22G, 22H, 22K).

Description

contactless communication medium

technical field

The present disclosure relates to contactless communication media.

Background technique

Conventionally, article management using RFID (Radio Frequency Identifier) tags has been performed.

Patent Document 1 discloses a technique in which an RFID tag is sealed with a heat-insulating container in order to use the RFID tag for management of parts processed at high temperature in a factory or the like. The container described in Patent Document 1 includes a container for accommodating an RFID tag, and a lid joined to the container. The container in which the RFID tag is sealed is attached to the component and flows through the manufacturing process together with the component.

prior art literature

Patent Literature

Patent Document 1: Japanese Patent Laid-Open No. 2008-129838

SUMMARY OF THE INVENTION

A non-contact communication medium based on an aspect of the present disclosure includes electronic components and a container. Electronic components for contactless communication. The accommodation body accommodates electronic components. In addition, the container has a main body portion, a plug portion, and an adhesive layer. The main body portion has an accommodation hole for accommodating electronic components. The plug portion is inserted into the receiving hole. The adhesive layer is located between the inner peripheral surface of the accommodating hole and the outer peripheral surface of the plug portion, and is used for joining the main body portion and the plug portion.

Description of drawings

FIG. 1 is a plan view of a non-contact communication medium according to an embodiment.

FIG. 2 is a cross-sectional view taken along the line II-II shown in FIG. 1 .

3 is an enlarged cross-sectional view of a non-contact communication medium according to a first modification.

4 is an enlarged cross-sectional view of a non-contact communication medium according to a second modification.

5 is an enlarged cross-sectional view of a non-contact communication medium according to a third modification.

FIG. 6 is a cross-sectional view taken along the line VI-VI shown in FIG. 5 .

FIG. 7 is another example of a cross-sectional view taken along the line VI-VI shown in FIG. 5 .

8 is an enlarged cross-sectional view of a non-contact communication medium according to a fourth modification.

FIG. 9 is a cross-sectional view taken along the line IX-IX shown in FIG. 8 .

10 is an enlarged cross-sectional view of a non-contact communication medium according to a fifth modification.

FIG. 11 is a cross-sectional view taken along the line XI-XI shown in FIG. 10 .

12 is an enlarged cross-sectional view of a non-contact communication medium according to a sixth modification.

13 is an enlarged cross-sectional view of a non-contact communication medium according to a seventh modification.

14 is an enlarged cross-sectional view of a non-contact communication medium according to an eighth modification.

15 is an enlarged cross-sectional view of a non-contact communication medium of a ninth modification.

16 is an enlarged cross-sectional view of a non-contact communication medium according to a tenth modification example.

17 is a side view of a non-contact communication medium according to an eleventh modification.

18 is a plan view of a non-contact communication medium according to an eleventh modification.

FIG. 19 is a cross-sectional view taken along the line XIX-XIX shown in FIG. 18 .

20 is an enlarged cross-sectional view of a non-contact communication medium according to a twelfth modification.

21 is an enlarged cross-sectional view of a non-contact communication medium according to a thirteenth modification.

22 is an enlarged cross-sectional view of a non-contact communication medium according to a fourteenth modification.

23 is an enlarged cross-sectional view of a non-contact communication medium according to a fifteenth modification.

24 is an enlarged cross-sectional view of a non-contact communication medium according to a sixteenth modification.

25 is an enlarged cross-sectional view of a non-contact communication medium according to a seventeenth modification.

26 is an enlarged cross-sectional view of a non-contact communication medium according to an eighteenth modification.

27 is an enlarged cross-sectional view of a non-contact communication medium according to a nineteenth modification.

FIG. 28 is a cross-sectional view taken along the line XXVIII-XXVIII shown in FIG. 27 .

29 is an enlarged cross-sectional view of a non-contact communication medium according to a twentieth modification.

30 is an enlarged cross-sectional view of a non-contact communication medium according to a twenty-first modification.

Detailed ways

Hereinafter, a form for implementing a non-contact communication medium based on the present disclosure (hereinafter, referred to as an "embodiment") will be described in detail with reference to the accompanying drawings. It should be noted that the non-contact communication medium based on the present disclosure is not limited by the present embodiment. In addition, the respective embodiments can be appropriately combined within a range where the content of processing does not contradict each other. In addition, in each following embodiment, the same code|symbol is attached|subjected to the same part, and the overlapping description is abbreviate|omitted.

In addition, in the embodiments shown below, expressions such as "constant", "orthogonal", "perpendicular", or "parallel" may be used, but these expressions are not strictly required to be "constant", "orthogonal", "Vertical" or "Parallel". That is, each of the above-mentioned expressions allows for variations in manufacturing accuracy, installation accuracy, and the like, for example.

In addition, in each of the drawings referred to below, in order to make the description easier to understand, the X-axis direction, the Y-axis direction, and the Z-axis direction which are orthogonal to each other may be specified, and the positive direction of the Z-axis may be shown as the positive direction of the vertical upward direction. Cross coordinate system.

<Configuration of non-contact communication medium>

1 and 2, the configuration of the non-contact communication medium according to the embodiment will be described. FIG. 1 is a plan view of a non-contact communication medium according to an embodiment. FIG. 2 is a cross-sectional view taken along the line II-II shown in FIG. 1 .

As shown in FIGS. 1 and 2 , the non-contact communication medium 1 of the embodiment includes an electronic component 10 and a housing 20 . The electronic component 10 is, for example, an RFID tag.

The electronic component 10 as an RFID includes an antenna for non-contact communication, an IC chip for non-contact communication via the antenna, and a memory storing identification information on a substrate made of, for example, LTCC (Low Temperature Co-fired Ceramics). . The electronic component 10 as an RFID can transmit identification information stored in a memory to an external device (for example, an RFID reader) through non-contact communication using electromagnetic induction, radio waves, or the like.

The non-contact communication medium 1 of the embodiment may be used, for example, in a high temperature environment exceeding the heat resistance temperature of the electronic component 10 . For example, the non-contact communication medium 1 of the embodiment is attached to a member to be plated, and is plated together with the member. The temperature of the plating solution such as hot dip galvanizing is, for example, 75°C to 500°C. In addition, the non-contact communication medium 1 of the embodiment may be treated with an acidic chemical or an alkaline chemical together with the components. That is, the non-contact communication medium 1 of the embodiment is also used in an acid-base environment exceeding the chemical resistance of the electronic component 10 .

Therefore, in the non-contact communication medium 1 of the embodiment, in order to protect the electronic component 10 from a high temperature environment and an acid-base environment, the electronic component 10 is sealed with the container 20 .

On the other hand, when the container in which the electronic component is accommodated is simply sealed with the cover, for example, there is a possibility that the joint portion between the container and the cover may peel off during the flow in the manufacturing process. In view of this point, the non-contact communication medium 1 of the embodiment has a structure in which peeling of the joint portion of the housing body 20 is unlikely to occur.

The container 20 has an adhesive layer 23 , a main body portion 21 and a plug portion 22 made of ceramics. The main body portion 21 and the plug portion 22 are joined to each other via the adhesive layer 23 .

The main body portion 21 has a cylindrical shape. The main body portion 21 has flat surfaces (upper end surface and lower end surface) that are circular in plan view at both ends, and has a curved surface (outer peripheral surface) connecting these end surfaces.

In the first flat surface 211 of both end surfaces of the main body portion 21 , a receiving hole 25 for receiving the electronic component 10 is opened. The accommodating hole 25 is opened in the center portion of the first flat surface 211 . In addition, the receiving hole 25 extends vertically with respect to the first flat surface 211 . The receiving hole 25 has a circular shape in plan view. The receiving hole 25 is an elongated hole, and the opening diameter of the receiving hole 25 (length in the X-axis direction in FIG. 2 ) is smaller than the depth (length in the Z-axis direction in FIG. 2 ) of the receiving hole 25 .

The plug portion 22 has a cylindrical shape. The plug portion 22 has flat surfaces (upper end surface and lower end surface) that are circular in plan view at both ends, and has a curved surface (outer peripheral surface) connecting these end surfaces. The plan view shape of the plug portion 22 is the same circular shape as the plan view shape of the accommodating hole 25 , and is smaller in diameter than the plan view shape of the accommodating hole 25 .

Such a plug portion 22 is inserted into the receiving hole 25 . In the state of being inserted into the receiving hole 25 , the second flat surface 221 of the two end surfaces of the plug portion 22 is coplanar with the first flat surface 211 of the main body portion 21 . In this way, the plug portion 22 is inserted in a nested shape with respect to the receiving hole 25 .

The adhesive layer 23 is located between the inner peripheral surface 251 of the receiving hole 25 and the outer peripheral surface 222 of the plug portion 22 . The adhesive layer 23 joins the main body portion 21 and the plug portion 22 . Thereby, the accommodating hole 25 is closed by the plug portion 22 and the adhesive layer 23 . Furthermore, the electronic component 10 accommodated in the accommodating hole 25 is sealed. The inside of the receiving hole 25 blocked by the plug portion 22 and the adhesive layer 23 becomes a space. The electronic component 10 is arranged at a position away from the plug portion 22 and the adhesive layer 23 .

In this way, the non-contact communication medium 1 of the embodiment has a structure in which the accommodating hole 25 is closed with the plug portion 22 to seal the electronic component 10 in the accommodating hole 25 . In such a non-contact communication medium 1 , the adhesive layer 23 that joins the main body portion 21 and the plug portion 22 is located between the inner peripheral surface 251 of the receiving hole 25 and the outer peripheral surface 222 of the plug portion 22 , that is, inside the receiving hole 25 . That is, the adhesive layer 23 , which is a joint portion of the housing body 20 , is hardly exposed to the outside. Therefore, according to the non-contact communication medium 1 of the embodiment, the joint portion of the housing body 20 is less likely to be peeled off.

In addition, in the non-contact communication medium 1 of the embodiment, the second flat surfaces 221 exposed to the outside of the both end surfaces of the plug portion 22 are coplanar with the first flat surface 211 of the main body portion 21 . In this way, in the non-contact communication medium 1, since the plug portion 22 does not bulge from the main body portion 21, it is difficult to directly apply an impact to the plug portion 22. Therefore, according to the non-contact communication medium 1, it is possible to make the joint portion of the housing body 20 less likely to peel off.

In addition, in the non-contact communication medium 1 of the embodiment, the inside of the receiving hole 25 closed by the plug portion 22 and the adhesive layer 23 is a space (cavity). Furthermore, the electronic component 10 is arranged at a position away from the adhesive layer 23 . Therefore, heat from the outside is not easily transferred to the electronic component 10 .

As the ceramics constituting the main body portion 21 and the plug portion 22, for example, cordierite can be used. Since the thermal expansion coefficient of cordierite is small, it is excellent in thermal shock resistance. In addition, since the thermal conductivity of cordierite is low, it is difficult to transfer heat to the electronic component 10 . In this way, by using cordierite, the electronic component 10 can be properly protected from a high temperature environment. In addition, the ceramic which comprises the main-body part 21 and the plug part 22 does not necessarily need to be cordierite. This point will be described later.

The adhesive layer 23 is composed of an adhesive. The adhesive only needs to have heat resistance capable of withstanding the use environment of the non-contact communication medium 1 . As such an adhesive agent, an inorganic type adhesive agent can be used, for example. Moreover, as an adhesive agent, the adhesive agent obtained by adding a ceramic powder to an inorganic adhesive agent can also be used.

<Manufacturing method>

Next, an example of a method of manufacturing the non-contact communication medium 1 according to the embodiment will be described.

First, the cordierite powder and the powder of the sintering aid are prepared. The sintering aids are, for example, rare earth oxides (yttrium oxide, cerium oxide, etc.), alkali metal oxides (lithium oxide, sodium oxide, etc.), and alkaline earth metals (calcium oxide). In addition, what mixed magnesia, alumina, and silicon oxide in the composition ratio of desired cordierite may be used instead of the cordierite powder. Next, the prepared powder is put into a vibration mill together with water as a solvent, and pulverized and mixed to obtain a raw material.

Next, organic components such as a binder, a plasticizer, and a mold release agent are added to the pulverized and mixed raw materials. Then, a slurry is produced by stirring these, and the produced slurry is spray-dried using a spray dryer. Thus, ceramic particles were obtained.

Next, powder press molding is performed on the produced ceramic particles to obtain a molded body of the main body portion 21 and the plug portion 22 .

Next, degreasing is performed by subjecting the formed body to heat treatment in an air atmosphere, a vacuum atmosphere, or a nitrogen atmosphere. After that, by firing the formed body, the main body portion 21 and the plug portion 22 are obtained. In addition, in order to obtain a desired shape, you may perform a cutting and grinding process on the molded body of the main body part 21 and the plug part 22 or the main body part 21 and the plug part 22 after firing.

Next, after accommodating the electronic component 10 in the accommodating hole 25 , the plug portion 22 coated with the adhesive on the outer peripheral surface 222 is inserted into the accommodating hole 25 . Thereby, the main-body part 21 and the plug part 22 are joined via the adhesive layer 23, and the electronic component 10 accommodated in the accommodation hole 25 is sealed. The non-contact communication medium 1 of the embodiment is obtained by the above. It should be noted that, here, the adhesive is preliminarily coated on the outer peripheral surface 222 of the plug portion 22 , but the adhesive may be injected between the plug portion 22 and the receiving hole 25 after the plug portion 22 is inserted into the receiving hole 25 . gap between.

<First Modification>

3 is an enlarged cross-sectional view of a non-contact communication medium according to a first modification. As shown in FIG. 3 , the housing 20A included in the non-contact communication medium 1A of the first modification has a main body portion 21A.

The housing hole 25A included in the main body portion 21A has a bottom surface 252A that is curved in a concave shape. In this way, the bottom surface 252A of the housing hole 25A is formed into a curved shape, for example, when the housing body 20A thermally expands or contracts, the housing hole 25A (the main body portion 21A) can be less prone to cracks.

In addition, by making the bottom surface 252A of the housing hole 25A into a curved shape, the contact area between the bottom surface 252A of the housing hole 25A and the electronic component 10 can be reduced. Therefore, heat conduction from the main body portion 21A to the electronic component 10 can be suppressed.

<Second modification example>

4 is an enlarged cross-sectional view of a non-contact communication medium according to a second modification. As shown in FIG. 4 , the housing 20B included in the non-contact communication medium 1B of the second modification has a main body portion 21B.

The housing hole 25B included in the main body portion 21B has, for example, a concavely curved corner portion 253B between the bottom surface 252B, which is a flat surface, and the inner peripheral surface 251B.

By bending the corner 253B between the bottom surface 252B and the inner peripheral surface 251B in this way, for example, when the housing body 20B thermally expands or contracts, the housing hole 25B (main body 21B) can be less prone to cracks.

<Third modification example>

5 is an enlarged cross-sectional view of a non-contact communication medium according to a third modification. In addition, FIG. 6 is a cross-sectional view taken along the line VI-VI shown in FIG. 5 . As shown in FIG. 5 , the housing 20C included in the non-contact communication medium 1C of the third modification has a plug portion 22C.

The plug portion 22C of the third modification has a plurality of first protrusions 223C protruding from the outer peripheral surface 222C. As shown in FIG. 6 , a plurality of (here, three) first protrusions 223C are equally arranged in the circumferential direction with respect to the outer peripheral surface 222C.

In this way, by providing the plurality of first protrusions 223C on the outer peripheral surface 222C of the plug portion 22C, the misalignment (eccentricity) of the plug portion 22C in the housing hole 25 can be suppressed. As a result, the gap between the receiving hole 25 and the plug portion 22C is equalized, and it is difficult to generate a thin portion of the adhesive layer 23 . Therefore, peeling of the joined part of 20 C of accommodating bodies can be made more difficult to generate|occur|produce.

Here, an example is shown in which the first protrusion 223C is in contact with the inner peripheral surface 251 of the housing hole 25 . However, the first protrusion 223C does not necessarily need to be in contact with the inner peripheral surface 251 of the receiving hole 25 . In addition, here, the example of the case where the plug part 22C has three 1st protrusion 223C is shown. Not limited to this, the number of the first protrusions 223C may be at least two or more. For example, when the number of the first protrusions 223C is two, the two first protrusions 223C may be arranged at an interval of 180 degrees with respect to the outer peripheral surface 222C of the plug portion 22C.

In addition, here, the example of the case where the plug part 22C has the several 1st protrusion 223C is shown. Not limited to this, the plug portion 22C may have a flange portion 228C (see FIG. 7 ) extending from the outer peripheral surface 222C over the entire circumference of the outer peripheral surface 222C. In this case as well, it is possible to suppress the deviation of the plug portion 22C in the housing hole 25 . Furthermore, by making it into a flange shape, it can suppress that a plating solution etc. penetrate|invade the back side of the receiving hole 25. It should be noted that the non-contact communication medium 1C may have a gap between the inner peripheral surface 251 of the housing hole 25 and the flange portion 228C.

<Fourth Modification>

8 is an enlarged cross-sectional view of a non-contact communication medium according to a fourth modification. In addition, FIG. 9 is a cross-sectional view taken along the line IX-IX shown in FIG. 8 . As shown in FIG. 8 , the container 20D included in the non-contact communication medium 1D of the fourth modification has a main body portion 21D.

The housing hole 25D included in the main body portion 21D has a plurality of second protrusions 254D protruding from the inner peripheral surface 251D. As shown in FIG. 9 , a plurality of (here, three) second protrusions 254D are equally arranged in the circumferential direction with respect to the inner peripheral surface 251D of the housing hole 25D.

In this way, the plurality of second protrusions 254D are provided on the inner peripheral surface 251D of the housing hole 25D, whereby the misalignment of the plug portion 22 in the housing hole 25D can be suppressed. As a result, the gap between the receiving hole 25 and the plug portion 22C is equalized, and it is difficult to generate a thin portion of the adhesive layer 23 . Therefore, peeling of the joined part of 20 C of accommodating bodies can be made more difficult to generate|occur|produce.

In addition, the plurality of second protrusions 254D protrude to a position overlapping with the plug portion 22 in the cross-sectional view shown in FIG. The electronic component 10 is arranged in a position closer to the inner side of the housing hole 25D than the contact surface of the second protrusion 254D with which the plug portion 22 abuts. Therefore, according to the non-contact communication medium 1D, for example, when the plug portion 22 is inserted into the receiving hole 25D in the manufacturing process of the non-contact communication medium 1D, the tip of the plug portion 22 inadvertently comes into contact with the electronic component 10 and the electronic component 10 is damaged. can be suppressed.

In addition, the some 2nd protrusion 254D may be formed integrally with the main-body part 21D. In addition, the plurality of second protrusions 254D may be retrofitted to the main body portion 21D. In the case of post-installation with respect to the main body portion 21D, the plurality of second protrusions 254D do not necessarily need to be made of ceramics. For example, the plurality of second protrusions 254D may be formed of resin or the like which is more flexible than ceramics.

<Fifth modification example>

10 is an enlarged cross-sectional view of a non-contact communication medium according to a fifth modification. In addition, FIG. 11 is a cross-sectional view taken along the line XI-XI shown in FIG. 10 . As shown in FIGS. 10 and 11 , the housing 20E included in the non-contact communication medium 1E of the fifth modification has a main body portion 21E.

The housing hole 25E included in the main body portion 21E has a stepped surface 255E protruding from the inner peripheral surface 251E. In the fifth modification, the electronic component 10 is arranged at a position farther from the opening of the housing hole 25E than the stepped surface 255E. Specifically, the electronic component 10 is arranged on the bottom surface 252E of the housing hole 25E.

In this way, by providing the stepped surface 255E inside the receiving hole 25E, the distance between the extended surfaces of the receiving hole 25E can be increased. Accordingly, even when a liquid such as a plating solution or a gas such as a corrosive gas intrudes into the interior of the housing hole 25E from the outside, such a liquid or gas does not easily reach the electronic component 10 . Therefore, liquid or gas from the outside can be suppressed from coming into contact with the electronic component 10 .

In addition, the housing body 20E of the fifth modification has the lid portion 27E placed on the stepped surface 255E. The lid portion 27E is made of, for example, ceramics. The cover portion 27E is fixed in the receiving hole 25E by being sandwiched by the stepped surface 255E and the front end surface of the plug portion 22, and blocks the space between the stepped surface 255E and the bottom surface 252E in the receiving hole 25E, that is, a space for accommodating the electronic component 10. space.

In this way, the electronic component 10 can be double-sealed by placing the lid portion 27E on the stepped surface 255E. Accordingly, even if liquid or gas intrudes into the interior of the housing hole 25E from the outside, the electronic component 10 can be protected from the influence of the liquid or gas.

<Sixth modification>

12 is an enlarged cross-sectional view of a non-contact communication medium according to a sixth modification. As shown in FIG. 12 , the housing 20F included in the non-contact communication medium 1F of the sixth modification has a plug portion 22F.

In the housing 20F of the sixth modification, the electronic component 10 is fixed by sandwiching the electronic component 10 between the front end surface 224F of the plug portion 22F and the bottom surface 252 of the housing hole 25 . Thereby, the movement of the electronic component 10 in the accommodation hole 25 can be suppressed.

The inside of the housing hole 25 is a space, and the electronic component 10 is not in contact with members (eg, fillers, etc.) other than the front end surface 224F of the plug portion 22F and the bottom surface 252 of the housing hole 25 . Therefore, compared with the case where the electronic component 10 is fixed with a filler or the like, for example, heat from the outside is less likely to be transferred to the electronic component 10 .

In this way, the electronic component 10 is sandwiched between the front end surface 224F of the plug portion 22F and the bottom surface 252 of the receiving hole 25 , thereby suppressing heat conduction to the electronic component 10 and preventing damage such as chipping of the electronic component 10 .

In addition, the front end surface 224F of the plug portion 22F is bent toward the bottom surface 252 of the housing hole 25 , in other words, toward the electronic component 10 . Thereby, the contact area between the plug portion 22F and the electronic component 10 can be reduced. Therefore, heat conduction from the plug portion 22F to the electronic component 10 can be suppressed.

<Seventh Variation>

13 is an enlarged cross-sectional view of a non-contact communication medium according to a seventh modification. As shown in FIG. 13 , the housing 20G included in the non-contact communication medium 1G of the seventh modification has a main body portion 21G and a plug portion 22G.

The housing hole 25G included in the main body portion 21G of the seventh modification has a plurality of third protrusions 256G protruding from the bottom surface 252G. In addition, the plug portion 22G of the seventh modification has a plurality of fourth protrusions 225G protruding from the front end surface 224G.

In the seventh modification, the electronic component 10 is in a state of being sandwiched between the plurality of third protrusions 256G provided on the bottom surface 252G of the housing hole 25G and the plurality of fourth protrusions 225G provided on the plug portion 22G.

Thereby, the contact area between the electronic component 10 and the main body portion 21G and the contact area between the electronic component 10 and the plug portion 22G can be reduced. Therefore, heat conduction from the main body portion 21G or the plug portion 22D to the electronic component 10 can be suppressed, and the movement of the electronic component 10 can be suppressed. In addition, by accommodating the electronic component 10 between the two third protrusions 256G, positional displacement of the electronic component 10 can be suppressed.

Here, an example is shown in which a plurality of third protrusions 256G are provided on the bottom surface 252G of the accommodation hole 25G. Not limited to this, the main body portion 21G only needs to have at least one third protrusion 256G. In addition, here, the example of the case where the several 4th protrusion 225G is provided in the front-end|tip surface 224G of the plug part 22G is shown. Not limited to this, the plug portion 22G may have at least one fourth protrusion 225G.

In addition, here, the example of the case where protrusions (3rd protrusion 256G and 4th protrusion 225G) are provided in both the accommodating hole 25G and the plug part 22G is shown. Not limited to this, the protrusion may be provided only in one of the receiving hole 25G and the plug portion 22G.

<Eighth Modified Example>

14 is an enlarged cross-sectional view of a non-contact communication medium according to an eighth modification. As shown in FIG. 14 , the housing 20H included in the non-contact communication medium 1H of the eighth modification has a plug portion 22H.

The front end surface of the plug portion 22H of the eighth modification is concave, and the concave surface 226H thereof is, for example, a flat surface.

In the eighth modification, the edge portion 227H located on the outer periphery of the recessed surface 226H is in contact with the bottom surface 252 of the housing hole 25, and the electronic component 10 is in a state of being housed in the recessed portion of the plug portion 22H.

As described above, the plug portion 22H of the eighth modification can reduce the amount of movement of the electronic component 10 in the housing hole 25 by accommodating the electronic component 10 in the recessed portion of the plug portion 22H. Thereby, it is possible to suppress the occurrence of damage such as chipping of the electronic component 10 .

<Ninth Variation>

15 is an enlarged cross-sectional view of a non-contact communication medium of a ninth modification. As shown in FIG. 15 , the container 20J included in the non-contact communication medium 1J of the ninth modification has an adhesive layer 23J.

The adhesive layer 23J of the ninth modification overflows from the receiving hole 25 . The adhesive layer 23J protrudes in a ring shape from the gap between the main body portion 21 and the plug portion 22 . In addition, the adhesive layer 23J may overflow from at least a part of the circumferential direction of the housing body 20J.

In this way, the adhesive layer 23J protrudes from the receiving hole 25 , whereby the main body portion 21 and the plug portion 22 can be joined more firmly.

<Tenth Variation>

16 is an enlarged cross-sectional view of a non-contact communication medium according to a tenth modification example. As shown in FIG. 16 , the container 20K included in the non-contact communication medium 1K of the tenth modification example has a spherical shape. Specifically, the main body portion 21K has a hemispherical shape, and the end surface 221K of the plug portion 22K is curved along the spherical surface of the main body portion 21K. These are joined via the adhesive layer 23K, whereby the spherical container 20K is obtained.

In this way, the housing body 20K is formed into a spherical shape without corners, whereby damage such as chipping or cracking of the housing body 20K can be further suppressed.

<Modifications related to the press-fit structure of electronic components>

Therefore, in the conventional technology, since electronic components such as RFID tags move in the storage space, damages such as chipping of electronic components occur, and there is room for further improvement in suppressing this. Therefore, the non-contact communication medium may also have a press-fit structure of electronic components.

<Eleventh Variation>

First, with reference to FIGS. 17 to 19 , the structure of the non-contact communication medium having the eleventh modification of the above-described push-fit structure will be described. 17 is a side view of a non-contact communication medium according to an eleventh modification. 18 is a plan view of a non-contact communication medium according to an eleventh modification example. In addition, FIG. 19 is a cross-sectional view taken along the line XIX-XIX shown in FIG. 18 .

It should be noted that the press-fit structure of the electronic component 10 shown in the eleventh to twenty-first modifications below is compatible with the non-contact communication medium of the above-described embodiment and the first to tenth modifications Properly assembled.

As shown in FIGS. 17 to 19 , the non-contact communication medium 1L of the eleventh modification includes the electronic component 10 and the housing 200 . The electronic component 10 is, for example, an RFID tag.

The container 200 has an adhesive layer 230 and a first base material 210 and a second base material 220 made of ceramics. The first base material 210 and the second base material 220 are bonded to each other via the adhesive layer 230 . Specifically, the first base material 210 and the second base material 220 have flat surfaces 210a and 220a facing each other and having substantially the same diameter. In the first base material 210 and the second base material 220 , their flat surfaces 210 a and 220 a are joined via the adhesive layer 230 . Hereinafter, the flat surface 210a of the first base material 210 is described as "first flat surface 210a", and the flat surface 220a of the second base material 220 is described as "second flat surface 220a".

The first base material 210 has a accommodating recess 250 in which the electronic component 10 is accommodated. The accommodating recess 250 is opened at the center of the first flat surface 210a. The first flat surface 210a is blocked by the second flat surface 220a of the second substrate 220 . Thereby, the electronic component 10 is sealed inside the housing body 200 .

The adhesive layer 230 is composed of an adhesive. The adhesive only needs to have heat resistance capable of withstanding the use environment of the non-contact communication medium 1L.

Both the first base material 210 and the second base material 220 have a cylindrical shape. Specifically, the first base material 210 and the second base material 220 have flat surfaces (upper and lower end surfaces) circular in plan view at both ends, and have curved surfaces (outer peripheral surfaces) connecting the upper and lower end surfaces. The adhesive layer 230 is located between the first flat surface 210 a which is the upper end surface of the first base material 210 and the second flat surface 220 a which is the lower end surface of the second base material 220 . The first base material 210 and the second base material 220 joined by the adhesive layer 230 have a cylindrical shape (so-called coin shape) as a whole.

The receiving recess 250 is located on the first flat surface 210 a of the first base material 210 . The electronic component 10 is accommodated in such a accommodating recess 250 . The interior of the housing recess 250 is a space, and fillers and the like are not located inside the housing recess 250 .

As shown in FIG. 19 , the second base material 220 has a housing protrusion 260 that protrudes from the second flat surface 220 a and enters the housing recess 250 .

In this way, the housing convex portion 260 is caused to enter the interior of the housing recess 250 , whereby the internal space of the housing recess 250 can be narrowed. Since the internal space of the housing recess 250 is narrowed, even if the electronic component 10 is moved in the internal space of the housing recess 250 , the amount of movement thereof is small. Therefore, according to the non-contact communication medium 1L of the eleventh modification example, it is possible to suppress the occurrence of damage such as chipping of the electronic component 10 due to movement of the electronic component 10 in the housing recess 250 .

Further, in the non-contact communication medium 1L of the eleventh modification, the electronic component 10 is sandwiched between the front end surface 260 a of the housing convex portion 260 and the bottom surface 250 a of the housing recess 250 . Thereby, movement of the electronic component 10 in the housing recessed part 250 can be suppressed. The interior of the housing recess 250 is a space, and the electronic component 10 is not in contact with members other than the front end surface 260a of the housing convex portion 260 and the bottom surface 250a of the housing recess 250 (eg, filler). Therefore, compared with the case where the electronic component 10 is fixed with a filler or the like, for example, heat from the outside is less likely to be transferred to the electronic component 10 .

In this way, the electronic component 10 is sandwiched between the front end surface 260a of the housing protrusion 260 and the bottom surface 250a of the housing recess 250, thereby suppressing heat conduction to the electronic component 10 and preventing damage such as chipping of the electronic component 10.

In addition, the front end surface 260 a of the housing convex portion 260 of the eleventh modification is curved toward the bottom surface 250 a of the housing recess portion 250 , in other words, toward the electronic component 10 . Thereby, the contact area between the housing convex portion 260 and the electronic component 10 can be reduced. Therefore, heat conduction from the second base material 220 to the electronic component 10 can be suppressed.

<12th Variation>

20 is an enlarged cross-sectional view of a non-contact communication medium according to a twelfth modification. As shown in FIG. 20 , the container 200M included in the non-contact communication medium 1M of the twelfth modification has a second base material 220M.

The front end surface of the housing convex portion 260M included in the second base material 220M is recessed in a curved surface shape, and at least a part of the electronic component 10 is housed in the recessed portion. In the twelfth modification example, the electronic component 10 is in point contact with the recessed surface 260M1 of the housing convex portion 260M. The electronic component 10 is in a state of being sandwiched between the recessed surface 260M1 and the bottom surface 250a of the housing recessed portion 250 .

In this way, the front end surface of the housing convex portion 260M may be recessed. Also in this case, the contact area between the electronic component 10 and the housing convex portion 260M can be reduced. Therefore, the thermal conduction from the second base material 220M to the electronic component 10 can be suppressed, and the movement of the electronic component 10 can be suppressed.

<The Thirteenth Variation>

21 is an enlarged cross-sectional view of a non-contact communication medium according to a thirteenth modification. As shown in FIG. 21 , the housing 200N included in the non-contact communication medium 1N of the thirteenth modification has a second base material 220N.

The front end surface of the housing convex portion 260N of the second base material 220N is recessed. The recessed surface 260N1 is, for example, a flat surface. The electronic component 10 is in surface contact with such a recessed surface 260N1 , and is in a state of being sandwiched between such a recessed surface 260N1 and the bottom surface 250 a of the housing recess 250 .

In this way, the electronic component 10 is brought into surface contact with the housing convex portion 260N, whereby the movement of the electronic component 10 can be suppressed more reliably. Moreover, the edge part 260N2 located in the outer periphery of the recessed surface 260N1 protrudes toward the bottom surface 250a of the accommodating recessed part 250 rather than the recessed surface 260N1. Therefore, even if the electronic component 10 moves, the electronic component 10 hits the edge portion 260N2 , so that the amount of movement of the electronic component 10 can be reduced, and damage such as chipping of the electronic component 10 can be suppressed.

<14th Variation>

22 is an enlarged cross-sectional view of a non-contact communication medium according to a fourteenth modification. As shown in FIG. 22 , the container 200P included in the non-contact communication medium 1P of the fourteenth modification has a second base material 220P.

The front end surface of the housing convex portion 260P included in the second base material 220P is recessed. This recessed surface 260P1 becomes a flat surface.

In the fourteenth modification, the edge portion 260P2 located on the outer periphery of the recessed surface 260P1 is in contact with the bottom surface 250a of the housing recessed portion 250, and the electronic component 10 is completely housed in the recessed portion of the housing convex portion 260P.

In this way, the edge portion 260P2 of the accommodating convex portion 260P may be in contact with the bottom surface 250a of the accommodating concave portion 250 . In this case, the housing convex portion 260P also functions as a spacer that defines the interval between the first flat surface 210a and the second flat surface 220a. Therefore, according to the non-contact communication medium 1P of the fourteenth modification example, it is possible to suppress variation in the thickness of the adhesive layer 230 among the plurality of non-contact communication media 1P. In other words, variations in quality among the plurality of non-contact communication media 1P can be suppressed.

<15th Variation>

23 is an enlarged cross-sectional view of a non-contact communication medium according to a fifteenth modification. As shown in FIG. 23 , the container 200Q included in the non-contact communication medium 1Q of the fifteenth modification has a second base material 220Q.

The housing protrusion 260Q included in the second base material 220Q has a plurality of protrusions 260Q1 protruding from the front end surface. In the fifteenth modification, the electronic component 10 is in a state of being sandwiched between the plurality of protrusions 260Q1 and the bottom surface 250a of the housing recess 250 .

Here, an example in which a plurality of protrusions 260Q1 are provided on the front end surface of the housing convex portion 260Q is shown, but the housing convex portion 260Q may have at least one protrusion 260Q1.

In this way, the housing convex portion 260Q may have at least one protrusion 260Q1 protruding from the front end surface. Also in this case, the contact area between the electronic component 10 and the housing convex portion 260Q can be reduced. Therefore, the thermal conduction from the second base material 220Q to the electronic component 10 can be suppressed, and the movement of the electronic component 10 can be suppressed.

In addition, by providing the plurality of protrusions 260Q1, the housing convex portion 260Q is brought into contact with the electronic component 10 at multiple points. Thereby, the contact area between the electronic component 10 and the housing convex portion 260Q can be reduced, and the movement of the electronic component 10 can be suppressed more reliably.

<16th Variation>

24 is an enlarged cross-sectional view of a non-contact communication medium according to a sixteenth modification. As shown in FIG. 24 , the housing 200R included in the non-contact communication medium 1R of the sixteenth modification has, for example, the same second base material 220Q as that of the fifteenth modification.

In addition, the container 200R of the sixteenth modification has the first base material 210R. The first base material 210R has a receiving recess 250R. The housing recess 250R has a plurality of protrusions 250R1 protruding from the bottom surface 250a. In the sixteenth modification, the electronic component 10 is in a state of being sandwiched between the plurality of protrusions 260Q1 provided in the housing convex portion 260Q and the plurality of protrusions 250R1 provided in the housing recess 250R.

Here, an example in which a plurality of projections 250R1 are provided on the bottom surface 250a of the housing recess 250R is shown, but the housing recess 250R may have at least one projection 250R1.

In this way, the housing recess 250R may have at least one protrusion 250R1 protruding from the bottom surface 250a. Also in this case, the contact area between the electronic component 10 and the housing recess 250R can be reduced. Therefore, the thermal conduction from the first base material 210R to the electronic component 10 can be suppressed, and the movement of the electronic component 10 can be suppressed.

In addition, by providing the plurality of protrusions 250R1, the housing recess 250R and the electronic component 10 are in multi-point contact, so that the contact area between the electronic component 10 and the housing recess 250R can be reduced, and movement of the electronic component 10 can be suppressed more reliably.

In addition, the positioning of the electronic component 10 can be facilitated by setting the interval between the two protrusions 250R1 so that the electronic component 10 is accommodated between the two protrusions 250R1.

<Seventeenth Variation>

25 is an enlarged cross-sectional view of a non-contact communication medium according to a seventeenth modification. As shown in FIG. 25 , the housing 200S included in the non-contact communication medium 1S of the seventeenth modification has a buffer material 270S1 on the front end surface 260 a of the housing convex portion 260 . In addition, the housing body 200S also has a buffer material 270S2 on the bottom surface 250a of the housing recess 250 .

The buffer materials 270S1 and 270S2 are formed of a material having higher flexibility than the first base material 210 and the second base material 220 made of ceramics, for example, a resin or the like. As such a resin, for example, silicone, amide-based, imide-based, and amide-imide-based resins can be suitably used. In addition, it is preferable that the buffer materials 270S1 and 270S2 have heat resistance.

In the seventeenth modification, the electronic component 10 is sandwiched between the housing convex portion 260 and the housing recessed portion 250 via the buffer materials 270S1 and 270S2. Therefore, for example, even when the housing body 200S receives an impact, since the shock absorbers 270S1 and 270S2 absorb the impact, it is possible to suppress the impact from being transmitted to the electronic component 10 . Therefore, according to the non-contact communication medium 1S of the seventeenth modification example, damage to the electronic component 10 can be suppressed more reliably.

Here, an example in which the buffer materials 270S1 and 270S2 are provided on both the housing convex portion 260 and the housing recess 250 is shown, but the buffer materials 270S1 and 270S2 are provided on at least one of the housing projection 260 and the housing recess 250 That's it.

<18th Variation>

26 is an enlarged cross-sectional view of a non-contact communication medium according to an eighteenth modification. As shown in FIG. 26 , the container 200T included in the non-contact communication medium 1T of the eighteenth modification has a second base material 220T.

The housing protrusions 260T included in the second base material 220T of the eighteenth modification are made of a buffer material having higher flexibility than the first base material 210 and the second base material 220T.

In this way, the entire housing convex portion 260T may be formed of a buffer material. Thereby, the housing convex part 260T can be replaced according to, for example, the size of the electronic component 10 .

<19th Variation>

27 is an enlarged cross-sectional view of a non-contact communication medium according to a nineteenth modification. In addition, FIG. 28 is a cross-sectional view taken along the line XXVIII-XXVIII shown in FIG. 27 . As shown in FIG. 27 , the container 200U included in the non-contact communication medium 1U of the nineteenth modification has a second base material 220U.

As shown in FIGS. 27 and 28 , the housing protrusion 260U included in the second base material 220U has a protrusion 260U1 protruding in a ring shape from the front end surface. In the nineteenth modification example, the electronic component 10 is in a state of being sandwiched between the ring-shaped protrusion 260U1 and the bottom surface 250 a of the housing recess 250 .

In this way, the housing convex portion 260U may have the protrusion 260U1 protruding in a ring shape from the front end surface. Thereby, the contact area between the electronic component 10 and the housing convex portion 260U can be reduced, and the movement of the electronic component 10 can be suppressed more reliably.

<Twentieth Variation>

29 is an enlarged cross-sectional view of a non-contact communication medium according to a twentieth modification. As shown in FIG. 29 , the container 200V included in the non-contact communication medium 1V of the twentieth modification has an adhesive layer 230V.

The adhesive layer 230V of the twentieth modified example protrudes from between the first base material 210 and the second base material 220 . The adhesive layer 230V overflows the entire circumference of the container 200V. In addition, it is sufficient that the adhesive layer 230V overflows from at least a part of the circumferential direction of the housing body 200V.

In this way, the adhesive layer 230V protrudes from the first base material 210 and the second base material 220 , whereby the first base material 210 and the second base material 220 can be joined more firmly.

<Twenty-first modification>

30 is an enlarged cross-sectional view of a non-contact communication medium according to a twenty-first modification. As shown in FIG. 30 , the container 200W included in the non-contact communication medium 1W of the twenty-first modification has a spherical shape. Specifically, the first base material 210W and the second base material 220W have a hemispherical shape, and they are joined via the adhesive layer 230W to obtain a spherical container 200W.

In this way, by making the container 200W into a spherical shape without corners, it is possible to further suppress damages such as chipping and cracking of the container 200W.

<Other modification examples>

The ceramics constituting the first base material and the second base material are not limited to cordierite. For example, the ceramics constituting the first substrate and the second substrate may be Al ₂ O ₃ (aluminum oxide), Si ₃ N ₄ (silicon nitride), SiC (silicon carbide), and Al ₂ TiO ₅ (aluminum titanate) . In addition, the ceramics constituting the first base material and the second base material may be crystallized glass such as Li ₂ O—Al ₂ O ₃ —SiO ₂ .

The container preferably has a lightness index L* (a value of dimension L indicating lightness in the Lab color space) of 50 or more. Thereby, since the contamination adhering to the container is made conspicuous easily, it is possible to easily judge the replacement time. Moreover, compared with the case where the lightness index L* is less than 50 (that is, the case where a dark color is used), heat is less likely to be accumulated, so that the heat can be less easily transmitted to the electronic component. In addition, the lightness of a container can be adjusted with a pigment, for example (for example, refer to Japanese Patent No. 5762522, Japanese Patent No. 5744045).

In addition, the color of the first base material may be different from the color of the second base material. Thereby, since the visibility of the upper and lower parts is improved, it is possible to facilitate the work of attaching the non-contact communication medium to the component or the like to be monitored. For example, when an operator wants to arrange an electronic component at a position closer to a component or the like to be monitored, the operator can easily identify the first base material in which the electronic component is accommodated among the first base material and the second base material. Thereby, the 1st base material can be arrange|positioned in the vicinity of the member etc. which become a monitoring object.

When the color of the first base material and the color of the second base material are made different, the color of the first base material in which the electronic component is accommodated may be made brighter than the color of the second base material. Thereby, the visibility of the upper and lower parts can be improved, and it is possible to make it difficult to transmit heat to the electronic components. In addition to this, electronic components are preferably kept away from members with a low lightness index. Thereby, heat can be made less easily transmitted to an electronic component.

The electronic component is not limited to the RFID tag, and may be any other electronic component as long as it performs non-contact communication. For example, the electronic component may be a sensor having a non-contact communication function. In addition, the sensor may be, for example, a sensor that measures the processing environment of a component to be monitored, such as a temperature sensor.

The components on which the non-contact communication medium based on the present disclosure is mounted are not limited to the components to be plated.

For example, the non-contact communication medium based on the present disclosure can also be mounted on a component such as a slab manufactured in a foundry of a metal material.

In addition, the non-contact communication medium based on the present disclosure can also be used for article management in a vulcanization process in a manufacturing process of rubber products.

The vulcanization step refers to a step in which, in order to increase the elastic limit of the rubber-based raw material, temperature and time are applied to chemically react sulfur, peroxide, etc. prepared in the raw material, and to cross-link the molecules. In addition, in a vulcanization process, pressure may also be applied. The temperature in the vulcanization step is, for example, 100°C to 200°C. In addition, the pressure in the vulcanization step is, for example, 0.5 MPa to 2 MPa.

As an example, the non-contact communication medium based on the present disclosure may be attached to a used tire regenerated as a retreaded tire. Retreaded tires are obtained by vulcanizing after cutting the surface of a used tire and attaching a new rubber sheet to it.

As a vulcanization process of a retreaded tire, a remould method and a pre-vulcanization method are known. The re-casting method is a method of vulcanizing under high temperature and high pressure using a mold after attaching an unvulcanized rubber sheet to the surface of the tire after use. In addition, the pre-vulcanization method is a method in which a vulcanized rubber sheet is attached to the surface of the used tire and then vulcanized in a vulcanizing furnace at low temperature and low pressure. The non-contact communication medium based on the present disclosure can be applied to any of the recasting method and the pre-vulcanization method. In particular, the pre-vulcanization method is intended for the production of small quantities and many varieties, so there are many inspection processes by hand. On the other hand, by performing the article management by the non-contact communication medium of the present disclosure, labor costs can be reduced, and the production efficiency of retreaded tires can be improved.

The non-contact communication medium based on the present disclosure is preferably attached to a site other than the tread portion to which the rubber sheet is attached. For example, the non-contact communication medium based on the present disclosure may be arranged inside the used tire.

In addition, the non-contact communication medium based on the present disclosure can also be attached to medical instruments (eg, forceps, needle holders, etc.).

In the field of medical care, how to prevent medical devices from being left in the body, rationalize the management of medical devices, and prevent the wrong medical device during surgery have become issues. On the other hand, by attaching the non-contact communication medium according to the present disclosure to a medical instrument, it is possible to manage each medical instrument by an RFID tag, and thus it is possible to contribute to solving the above-mentioned problems.

In addition, the non-contact communication medium based on the present disclosure can also be used in marking for determining a lesion site in the body.

As a conventional labeling method, a biological dyeing method is known. The biological pigment coloring method is a method of coloring the lesions in the body found during the examination with pigments. However, in the biological pigment coloring method, the coloring range is wide, and the pigment spreads with the passage of time, so it is difficult to precisely identify the lesion site. In addition, as another labeling method, a method of indwelling a metal needle or clip in a lesion has been proposed. However, this method requires preparation of a CT scanner at the time of surgery, or there is a possibility that radiation exposure more than necessary may be generated.

When the non-contact communication medium based on the present disclosure is used for marking, first, the non-contact communication medium based on the present disclosure is indwelled at the lesion site before surgery. Then, during the operation, the sensor antenna is used to measure, for example, the distance between the RFID tag and the sensor antenna, thereby estimating the position of the RFID, that is, the position of the lesion.

In this way, when the non-contact communication medium based on the present disclosure is used for marking, the non-contact communication medium based on the present disclosure is indwelled in the body, and therefore it is desired to be as small as possible. In this regard, the ceramic constituting the container of the present disclosure has a higher permittivity than, for example, resin, and is less likely to hinder RFID-based communication. Therefore, the non-contact communication medium of the present disclosure can be miniaturized compared to a non-contact communication medium having, for example, a resin-made housing.

As described above, the non-contact communication medium (for example, non-contact communication medium 1 and 1A to 1K) of the embodiment includes electronic components (for example, electronic component 10 ) and storage bodies (for example, storage bodies 20 and 20A to 20K) . Electronic components for contactless communication. The accommodation body accommodates electronic components. In addition, the container has a main body portion (for example, main body portions 21, 21A, 21B, 21D, 21E, 21G, and 21K), and plug portions (for example, plug portions 22, 22C, 22D, 22F, 22G, 22H, and 22K) and an adhesive layer (as an example, the adhesive layers 23, 23J, and 23K). The main body portion has housing holes (for example, housing holes 25A, 25B, 25D, 25E, and 25G) for housing electronic components. The plug portion is inserted into the receiving hole. The adhesive layer is located between the inner peripheral surface of the accommodating hole and the outer peripheral surface of the plug portion, and is used for joining the main body portion and the plug portion. Thereby, it is possible to provide a non-contact communication medium in which peeling of the joint portion of the housing body is unlikely to occur.

The bottom surface of the receiving hole may be concavely curved. In addition, the receiving hole may have a curved corner portion (for example, the corner portion 253B) between the inner peripheral surface and the bottom surface. Thereby, for example, when the housing body undergoes thermal expansion or thermal contraction, it is possible to make the housing hole less likely to be cracked.

The main body portion may have a first flat surface (as an example, the first flat surface 211 ) in which the receiving hole is opened. The plug portion may have a second flat surface (as an example, the second flat surface 221 ) that is coplanar with the first flat surface. Since the plug portion does not bulge out from the main body portion, it is difficult to directly apply an impact to the plug portion. Therefore, peeling can be made less likely to occur in the joint portion of the container.

The plug portion may have a plurality of protrusions (for example, the first protrusions 223C) protruding from the outer peripheral surface. In addition, the plurality of protrusions included in the plug portion may be equally arranged in the circumferential direction with respect to the outer peripheral surface. In addition, the main body portion may have a plurality of protrusions (as an example, the second protrusions 254D) protruding from the inner peripheral surface. Thereby, the misalignment (eccentricity) of the plug portion in the receiving hole can be suppressed. As a result, the gap between the housing hole and the plug portion is uniform, and the portion where the adhesive layer is thin is less likely to occur, so that the bonding portion of the housing body can be less easily peeled.

The receiving hole may have a stepped surface (as an example, the stepped surface 255E) protruding from the inner peripheral surface. The electronic component may be arranged at a position farther from the opening of the housing hole than the stepped surface. By providing the stepped surface inside the receiving hole, the distance between the extending surface of the receiving hole can be lengthened. As a result, even when a liquid such as a plating solution or a gas such as a corrosive gas intrudes into the interior of the housing hole from the outside, such liquid or gas does not easily reach the electronic components, so that the liquid or gas from the outside can be prevented from interfering with the electronic components. touch.

The container may have a lid portion (as an example, the lid portion 27E) placed on the stepped surface. The electronic component can be double-sealed by placing the cover on the stepped surface. Thereby, even when liquid or gas intrudes into the inside of the housing hole from the outside, the electronic component can be protected from the influence of the liquid or gas.

The electronic component may be arranged at a position away from the adhesive layer. As a result, it is possible to make it difficult to transmit heat from the outside to the electronic components.

The front end surface of the plug portion facing the bottom surface of the housing hole may be bent toward the bottom surface, and the electronic component may be sandwiched between the front end surface and the bottom surface of the housing hole. The front end surface of the plug portion located on the bottom surface side of the accommodation hole may be recessed, and at least a part of the electronic component may be accommodated in the recessed portion. Thereby, the movement of the electronic component in the accommodating hole can be suppressed.

The main body portion may have at least one protrusion (as an example, the third protrusion 256G) protruding from the bottom surface of the receiving hole. Thereby, the contact area between the electronic component and the main body portion and the contact area between the electronic component and the plug portion can be reduced. Therefore, heat conduction from the main body portion or the plug portion to the electronic component can be suppressed, and the movement of the electronic component can be suppressed.

The adhesive layer may also overflow from the receiving hole. Thereby, the main body part and the plug part can be joined more firmly.

Further effects and modifications can be easily derived by those skilled in the art. Therefore, the broader aspects of the present invention are not limited to the specific detailed and representative embodiments shown and described above. Therefore, various modifications can be made without departing from the spirit or scope of the general inventive concept defined by the appended claims and their equivalents.

Description of reference numbers:

1: Non-contact communication medium

10: Electronic components

20: Containment Body

21: Main body

22: Bolt

23: Adhesive layer

25: accommodating hole

27E: Cover

211: First Flat Surface

221: Second Flat Surface

222: Peripheral surface

223C: First protrusion

225G: Fourth protrusion

251: inner surface

252: Underside

254D: Second protrusion

255E: Step Surface

256G: Third protrusion.

Claims (14)

1. A non-contact communication medium in which, among others,

the non-contact communication medium has:

an electronic component that performs non-contact communication; and

a housing body which houses the electronic component,

the accommodating body has:

a body portion having a receiving hole for receiving the electronic component;

a plug portion inserted into the receiving hole; and

and an adhesive layer located between an inner peripheral surface of the housing hole and an outer peripheral surface of the plug portion, for joining the body portion and the plug portion.

2. The contactless communication medium of claim 1, wherein,

the bottom surface of the accommodating hole is concavely curved.

3. The contactless communications medium of claim 1, wherein,

the receiving hole has a curved corner portion between the inner peripheral surface and the bottom surface.

4. The contactless communication medium of any one of claims 1 to 3, wherein,

the main body part is provided with a first flat surface provided with the containing hole,

the peg has a second planar surface coplanar with the first planar surface.

5. The contactless communication medium of any one of claims 1 to 4, wherein,

the plug portion has a plurality of protrusions protruding from the outer peripheral surface.

6. The contactless communications medium of claim 5, wherein,

the plurality of projections of the plug portion are arranged uniformly in the circumferential direction with respect to the outer peripheral surface.

7. The contactless communication medium of any one of claims 1 to 6, wherein,

the housing hole has a plurality of projections projecting from the inner peripheral surface.

8. The contactless communication medium of any one of claims 1 to 6, wherein,

the accommodating hole has a stepped surface extending from the inner peripheral surface,

the electronic component is disposed at a position closer to the opening of the housing hole than the step surface.

9. The contactless communications medium of claim 8, wherein,

the accommodating body has a lid portion placed on the step surface.

10. The contactless communication medium of any one of claims 1 to 9, wherein,

the electronic component is disposed at a position away from the adhesive layer.

11. The contactless communication medium of any one of claims 1 to 10, wherein,

a front end surface of the plug portion facing a bottom surface of the housing hole is bent toward the bottom surface, and the electronic component is sandwiched between the front end surface and the bottom surface of the housing hole.

12. The contactless communication medium of any one of claims 1 to 10, wherein,

the front end surface of the plug portion on the bottom surface side of the housing hole is recessed, and at least a part of the electronic component is housed in the recessed portion.

13. The contactless communication medium of any one of claims 1 to 12, wherein,

the body portion has at least one protrusion protruding from a bottom surface of the receiving hole.

14. The contactless communication medium of any one of claims 1 to 13, wherein,

the adhesive layer overflows from the accommodating hole.

Images