JP5877883B1 - Wireless IC tag unit case - Google Patents

Abstract

Provided is a wireless IC tag unit case having heat resistance that can be used even when hot dip galvanizing treatment is applied, and having high workability and high durability that can be applied to the site of ship construction. A wireless IC tag unit case includes a lid and a hollow case that are filled with a material that covers the wireless IC tag and that allows the material to be replaced. [Selection] Figure 2

Description

  The present invention relates to a wireless IC tag unit case that can use a wireless IC tag in a high-temperature environment such as plating.

As a heat-resistant IC tag, for example, the one disclosed in Japanese Laid-Open Patent Publication No. 2012-032696 (WO2012 / 032696) is known.
The disclosure of Table No. 2012-032696 relates to the invention name “heat-resistant IC tag”, and “in the manufacturing process of the product to which the IC tag is attached, the IC tag is required to have high chemical resistance, high heat resistance and impact resistance. Also in the case of providing the heat-resistant IC tag applicable to such a use ”(see paragraph number 0007 of the publication),“ Non-contact IC tag and the non-contact IC tag ” A first container that is hermetically sealed and a second container that houses the first container. The first container is a group of glass, glass ceramics, and ceramics. The first gap is provided between the non-contact IC tag and the first container, and the first gap is depressurized from atmospheric pressure.
The second container is made of a heat-resistant resin, and a second gap is provided between the first container and the second container. ” 1), “When the product is immersed in a liquid tank such as a chemical cleaning tank or a plating tank in the manufacturing process of the product to which the IC tag is attached, liquid can be prevented from entering the IC tag. The space between the first container and the first container is evacuated, or at least a part thereof is filled with a heat insulating material having open cells, thereby providing heat insulation and the inside of the first container or heat insulating material. It is possible to prevent damage to the IC tag due to the expansion of the remaining gas, and after filling a heat insulating material having open cells in the vicinity of at least the non-contact tag, the inside of the first container is evacuated and decompressed, Inside vacuum In addition, since the second container made of a heat-resistant resin material protects the first container, the heat-resistant IC tag is rapidly cooled from a high temperature. Even in such a use situation, the first container is not subjected to a large thermal shock, and the second container protects the first container against an impact caused by an external force. Has high impact resistance. ”(See Table No. 0015 in the specification of Table No. 2012-032696).

  FIG. 6 is an explanatory view showing one structural example of the heat-resistant IC tag of the invention disclosed in the above-mentioned Japanese Patent Laid-Open No. 2012-032696 as FIG. In FIG. 6, reference numeral 101 denotes a heat-resistant IC tag, 102 denotes an IC chip portion of the non-contact IC tag, 103 denotes an antenna portion of the non-contact IC tag, 104 denotes a first container, and 105 denotes a first heat insulation. The material, 106 is a second container, and 107 is a second heat insulating material (in addition, in order to clarify that the reference is prior art, the applicant of the present application has changed to three digits and explained. did.).

  However, if such a heat-resistant IC tag is used for ship construction, especially for hot dip galvanizing treatment (or coating treatment) (hereinafter referred to as “plating treatment”) for the purpose of corrosion prevention of ship structural parts such as various pipes. Since the plating process is performed by immersing the material to be plated (such as a pipe) in a 450 ° C. zinc dissolution plating vessel for about 10 minutes, one material selected from the group of glass, glass ceramics and ceramics In the heat-resistant IC tag 101 using the first container made of the above, the heat-resistant IC tag 101 may be damaged as it is because the glass breaks without being able to withstand an external impact in the environment during the plating process. Therefore, there is a problem that the IC tag 101 attached after the plating process cannot be read.

  That is, ship construction parts such as various pipes are used for ship construction, and there are about 6000 to 10,000 pipes used in one ship, and about half of them are plated for the purpose of corrosion protection. Is given. For pipes that require plating treatment, pipe parts are marked with characters or barcodes at predetermined locations before plating treatment, and then plated, and then the plating treatment is applied to the pipe. Using the marked characters and barcode as a clue, the operator will check the marking by hand against the drawing from the characters and barcode, but the character information and barcode marked on the pipe by the plating process The information disappears, making it impossible to distinguish the markings, and it is necessary for the workers on site to sort the drawings manually by matching the dimensions etc. with the clues. There was a problem of hanging. In addition, there is a problem that a verification error occurs. Such collation work is complicated, and it is necessary to secure a wide working place for sorting, which may cause human error, which hinders the efficiency of ship building work.

  Therefore, in recent years, wireless communication type identification tags (IC tags) in which ID information is embedded have been developed and used in familiar fields. Especially in the manufacturing industry, it is used for the management of parts and products and the distribution management in factories in the field of manufacturing automobiles and electrical appliances. IC tags are read by a non-contact type reader, and unlike bar codes, they are resistant to environments with a lot of pride and dirt, and do not require accurate positioning, so reading work efficiency is high and usage is rapidly increasing. It is in the situation.

  However, as described above, since the heat-resistant IC doug 101 uses glass or the like as the surface material container, the product to be processed during the hot dip galvanizing (zinc melting 450 ° C.) treatment as described above. There is a problem that they cannot be used as they are due to contact with each other.

No. 2012-032696

  An object of the present invention is to provide a wireless IC tag unit case that can be used for hot dip galvanizing treatment in ship construction and has high workability and durability that can be applied at the site of ship construction.

In order to solve the above problems, the invention according to the claims 1, in the wireless IC tag unit case, inside is filled with a material that covers the wireless IC tag, the bottom to prevent the electromagnetic wave shielding of from the wireless IC tag on the bottom An opening and a hollow metal case having an opening in the upper portion for accommodating the wireless IC tag covered with the inner material, and after the wireless IC tag covered with the inner material is accommodated, the upper opening is a metal lid. It is characterized by being covered with.
The invention according to claim 2 of the present application is the wireless IC tag unit case according to claim 1 , wherein the hollow metal case has a bottomed hollow shape that can be filled and fixed with a material that covers the wireless IC tag. It is characterized by a hollow cylindrical shape.
Furthermore, in the invention according to claim 3 of the present application, in the wireless IC tag unit case according to claim 2 , the opening at the bottom portion for preventing the electromagnetic wave from the wireless IC tag is larger than the body diameter of the wireless IC tag. It is an opening.
The invention according to the claims 4, in the wireless IC tag unit case according to claim 1, wherein the aperture is a circular aperture, and the material covering the wireless IC tag in a disc shape, closing the opening It is characterized by that.
The invention according to claim 5 of the present application is characterized in that in the wireless IC tag unit case according to claim 1 , a gap is provided between the metal lid and the hollow metal case.
The invention according to claim 6 of the present application is the wireless IC tag unit case according to claim 1 , wherein the material covering the wireless IC tag is made of polyparaphenylene benzobisoxazole (trade name “Zylon (registered trademark)”). It is characterized by being.
The invention according to claim 7 of the present application is the wireless IC tag unit case according to claim 1 , wherein the material covering the wireless IC tag is made of amorphous silica that forms a glassy film that is melted with a silica solution at room temperature. It is characterized by being solidified with liquid glass used as a coating material.

Since this invention is comprised as mentioned above, there exists the following effect.
(1) It is possible to provide a wireless IC tag unit case that can withstand external impacts that occur in a plating processing environment under a high temperature environment.
(2) The ultra-high heat-resistant IC tag is made of glass, and the glass breaks without being able to withstand external impacts in the environment during the plating process. Therefore, protecting the metal case prevents the glass from being broken. It became possible.
(3) In addition, there is a rapid temperature change during the plating process, and if the metal case and the glass are in contact with each other, cracking of the glass occurs due to thermal shock. Therefore, poly (paraphenylenebenzobisoxazole) is used as a buffer material inside the metal case. ) Is solidified with liquid glass, and thus has an effect of preventing the occurrence of glass breakage.
(4) Furthermore, electromagnetic waves used for communication are normally attenuated by metal, but the attenuation is suppressed to a small extent by making the opening of the metal case larger than the ultra-high heat resistant IC tag inside the metal case. Has the effect of being possible.
(5) In addition, by providing a gap between the metal case main body and the metal case lid, it is possible to prevent an explosion of water vapor inside the metal case due to a temperature rise during the plating process. .

FIG. 1 is a schematic external view of a wireless IC tag unit case 1 according to a first embodiment. FIG. 2 is an exploded schematic view of the wireless IC tag unit case 1 according to the first embodiment. FIG. 3 is a sectional view of the same, FIG. 4 is a schematic diagram illustrating an engagement state between the metal case 2 and the lid 7 of the wireless IC tag unit case 1 according to the first embodiment. FIG. 5 is a schematic diagram illustrating a state in which the wireless IC tag unit case 1 according to the first embodiment is attached to a material to be plated. FIG. 6 is an explanatory view showing one structural example of the heat-resistant IC tag of the invention disclosed in Japanese Patent Laid-Open No. 2012-032696 as FIG.

  An embodiment which is one mode for carrying out a wireless IC tag unit case according to the present invention will be described in detail with reference to the drawings.

  1 to 3 are diagrams showing a first embodiment of a wireless IC tag unit case which is an embodiment for carrying out a wireless IC tag unit case according to the present invention. Of these, FIG. 1 shows the first embodiment. FIG. 2 is an exploded schematic view of the wireless IC tag unit case 1 according to the first embodiment, and FIG. 3 is a sectional view thereof.

  As is apparent from FIGS. 1 to 3, the wireless IC tag unit case 1 according to the first embodiment has a cylindrical shape in the bottom portion as a whole, and a metal case 2 having a bottom opening 2 a at the bottom, A wireless IC tag 3 enclosed inside, a closed disk 4 made of polyparaphenylene benzobisoxazole (trade name “Zylon (registered trademark))” made of a heat insulating material closing the opening of the metal case 2, the wireless IC A first heat insulating material 5, a second heat insulating material 6 made of polyparaphenylene benzobisoxazole (trade name “Zylon (registered trademark)”) disposed around the tag 3, and a cover that covers the upper opening of the metal case 2 7 and a screw 8 for engaging the lid 7. A reference numeral 10 shown in FIGS. 1 to 3 is a groove gap opened in the upper and lower intermediate areas of the lid 7, the screw 8 is inserted into the groove gap 10, and the lid 7 is connected to the metal case 2. Stop.

  Although omitted in FIGS. 1 to 3, the wireless IC tag unit case 1 according to the first embodiment has a gap between the metal case 2 and the lid 7 as shown in FIG. 4. A gap is provided so as to allow the internal water vapor to escape during the plating process. FIG. 4 is a schematic diagram illustrating an engagement state of the metal case 2 and the lid 7 of the wireless IC tag unit case 1 according to the first embodiment. In FIG. 4, 2 is the metal case, The lid 10 is the groove gap, and 11 is a gap provided between the metal case 2 and the lid 7.

  As shown in FIGS. 1 to 4, the metal case 2 used in the wireless IC tag unit case 1 according to the first embodiment is hollow as a whole with a diameter of 31.8 mm and a height of about 50.0 mm. It has a cylindrical shape, and an opening 2a of about 21 mm is provided at the bottom.

  As shown in FIGS. 3 and 4, the lid 7 of the wireless IC tag unit case 1 according to the first embodiment has a disc shape, and the screw 8 is inserted into the middle of the upper and lower sides of the entire circumference to lock the lid 7. The groove gap 10 is provided, and the gap 11 is provided between the disc-shaped lid 7 and the metal case 2 so that internal water vapor generated by heat during the plating process can be discharged to the outside. And That is, as shown in FIG. 4, the diameter of the lid 7 is smaller than the diameter of the metal case 2, and has a gap 11 for allowing internal water vapor to escape to the outside when the lid 7 is engaged. Formed.

Next, the wireless IC tag 3 used in the wireless IC tag unit case 1 according to the first embodiment will be described.
The wireless IC tag 3 used in the wireless IC tag unit case 1 according to the first embodiment uses a commercially available super heat resistant tag manufactured by Toppan Printing Co., Ltd., and generates an electromotive force by supplying electromagnetic waves from the outside. This is a so-called passive type wireless IC tag of electromagnetic induction electromotive force, and has a vacuum tube structure using heat-resistant glass or the like as a jacket member.

  As shown in FIGS. 2 and 3, the wireless IC tag 3 used in the wireless IC tag unit case 1 according to the first embodiment includes a cylindrical body 3a and a pointed central upper tip 3b. Thus, the wireless IC tag 3 having a diameter of about 16 mm, a height of 22 mm, and a height of about 30 mm even when combined with the center upper end 3 b is used.

The wireless IC tag 3 stores information including a specific identification symbol / number in a storage area, and wirelessly transmits and receives the electromotive force and transmits / receives the stored information to / from an external device (not shown). Because it is performed in a non-contact manner, the radio wave used must be easily propagated. Therefore, the wireless IC tag unit case 1 according to the first embodiment is made of a metal case, but the bottom opening 2a is provided at the bottom so as not to interfere with radio wave propagation. That is, the opening diameter of the bottom opening 2a is a shape that opens larger than the diameter of the body 3a of the wireless IC tag 3 described later.
In the wireless IC tag unit case 1 in the first embodiment, since the wireless IC tag 3 to be used has a cylindrical shape, the case 2 has a hollow cylindrical shape, but this is limited to the hollow cylindrical shape. Absent. As long as electromagnetic induction electromotive force can be applied to the wireless IC tag 3 and the ID information and the like can be transmitted by electromagnetic waves, the shape and the opening are not essential, and any shape and opening are possible. Etc.

  Further, the closed disk 4, the first heat insulating material 5, and the second heat insulating material 6 used in the wireless IC tag unit case 1 according to the first embodiment are made of polyparaphenylene benzobisoxazole (trade name “Zylon (registered trademark)”. ) ") The material (formally" poly (p-phenylenebenzobisoxazole) ") is a shape woven with chemical fibers made of poly (p-phenylenebenzobisoxazole), excellent in strength, high elastic modulus, 650 It has a high decomposition temperature of ° C. and flame retardancy, and has the following structural formula (the unit structure is paraphenylene benzobisoxazole).

  That is, it is made of a felt-like fiber material that has heat resistance, low specific gravity, high dimensional accuracy, low water absorption (hydrolysis resistance), and flame resistance (all grades, non-halo flame retardant). In the wireless IC tag unit case 1 according to Example 1, a commercially available product (Zylon (PBO fiber) manufactured by Toyobo Co., Ltd.) was used.

In the wireless IC tag unit case 1 according to the first embodiment, the closing disk 4 is formed in a disk shape and closes the opening 2a.
Further, the first heat insulating material 5 is wound around the body 3a of the wireless IC tag 3 as a wound and stacked structure, and the second heat insulating material 6 is wound around the central upper end 3b as a wound and stacked structure. It has a structure in which glass (glass coat (GC-600) manufactured by VANTEC CO., LTD.) Is poured and hardened.

  The liquid glass (Glass Coat (GC-600) manufactured by Vantec Co., Ltd.) used in the wireless IC tag unit case 1 according to the first embodiment forms a transparent glassy film that is melted with a silica solution at room temperature. This liquid glass (Vantech Co., Ltd. Glass Coat (GC-600)) is an easy-to-use one-pack type that is used as a coating material for amorphous silica. It has excellent properties, non-flammability, abrasion resistance, chemical resistance, and contamination resistance, and excellent material protection. Creates a hard coating film at room temperature, protects the material from dirt, water, oil, etc., and the generated coating film is inorganic glassy, stable, resistant to deterioration, and resistant to oil and dirt, It is used for insulation / waterproofing of electronic parts and protection of various products.

  Predetermined information is stored in the wireless IC tag unit case 1 according to the first embodiment configured as described above, and this is attached to the plating target material before plating. FIG. 5 is a schematic diagram illustrating a state in which the wireless IC tag unit case 1 according to the first embodiment is attached to the material to be plated. In FIG. 5, reference numeral 20 is a hot dip galvanized material, 1 is a wireless IC tag unit case according to the first embodiment, 2 a is a bottom opening provided at the bottom of the metal case 2, and 8 is The screw 9 is a wire clip that is engaged with the screw 8 and is locked at an appropriate position (for example, a bolt hole) of the workpiece 20.

  As shown in FIG. 5, the wireless IC tag unit case 1 according to the first embodiment is attached to the material to be processed (pipe) 20 before the zinc galvanizing treatment, information is written, and after the plating treatment, the first embodiment is applied. Information is read from the wireless IC tag unit case 1 and collated with the drawing and the material to be processed (pipe).

  According to the wireless IC tag unit case 1 according to the first embodiment, the wireless heat-resistant IC doug 3 having a heat resistance specification of about 450 ° C. made of glass as a surface material has a vacuum heat insulating structure inside, but the glass surface If plating in the hot dip galvanizing tank adheres to the surface, it will be damaged. Therefore, in the wireless IC tag unit case 1 according to the first embodiment, in the use of the above-described gyron having a number of turns, the direct adhesion of the plating to the glass surface is avoided and the hot dip galvanized iron (zinc melting temperature 450 ° C.) is used. By repeating the plating process for about 10 minutes, it was possible to obtain a wireless IC tag unit case that could withstand several uses.

  In the wireless IC tag unit case 1 according to the first embodiment, the closed disc 4, the first heat insulating material 5, and the second heat insulating material 6 are made of polyparaphenylene benzobisoxazole (trade name “ Polyparaphenylene benzobisoxazole (trade name “Zylon (registered trademark)”) made of Zyron (registered trademark) ”and disposed around the wireless IC tag 3 was used. The material is not limited to bisoxazole (trade name “Zylon (registered trademark)”). If it is made of a material that is heat resistant and has low thermal conductivity, and is immersed in a hot-dip galvanized iron at 450 ° C. for about 10 minutes and has the property that the internal wireless IC tag 3 is not destroyed, polyparaphenylene Benzobisoxazole (may be easily changed from the trade name “Zylon (registered trademark)”. In several uses, the closed disk 4, the first heat insulating material 5 and the second heat insulating material 6 themselves If damage or loss such as cracks or wrinkles occurs, these can be replaced with new ones and used.

  In addition, the liquid glass (glass coat (GC-600) manufactured by Vantec Co., Ltd.) used for the wireless IC tag unit case 1 according to the first embodiment is also fixed to the xylon and has a predetermined heat resistance and heat conduction characteristic. If there is, it can be easily changed.

In ship construction, the processing of processed products is not limited to galvanization. Therefore, the wireless IC tag unit case 1 according to the first embodiment is not limited to the one that is put into the hot dip galvanizing tank, but can also be used for painting processing / management of painted parts.
Therefore, the metal case 2 is not limited to a metal material when not used at a high temperature such as a galvanizing tank. In other words, when not used at high temperatures, the case 21 may be made of a material having a certain rigidity. That is, the closed disk 4, the first heat insulating material 5, the second heat insulating material 6, and the like, which are internal protective materials, can be wrapped around the wireless IC tag so as to be replaceable, and damage due to external contact or the like can be avoided. If it is a thing, it is not restricted to a metal material.
Further, in the material through which radio waves are transmitted, it is not necessary to provide the bottom opening 2a at the bottom with a bottom-bottomed cylindrical shape.

  The present invention is used for zinc hot dip plating and the like frequently used in shipyards and the like.

DESCRIPTION OF SYMBOLS 1 Radio | wireless IC tag unit case 2 Metal case 2a Bottom part opening 3 Radio | wireless IC tag 3a Body 3b Center top tip 4 Closed disk 5 First heat insulating material 6 Second heat insulating material 7 Lid 8 Screw 10 Groove gap 11 Gap 20 Processed material 101 Heat resistance IC tag 102 IC chip portion 103 of non-contact IC tag 103 antenna portion 104 of non-contact IC tag First container 105 First heat insulating material 106 Second container 107 Second heat insulating material

Claims (7)

A hollow metal that is filled with a material covering the wireless IC tag and has a bottom opening that prevents electromagnetic waves from the wireless IC tag from being blocked at the bottom , and an opening at the top for storing the wireless IC tag covered with the internal material. consists case, after receiving the wireless IC tag is covered by the inner material is, the wireless IC tag unit case, characterized in that opening of the upper is covered with a metal lid. 2. The wireless IC tag unit case according to claim 1 , wherein the hollow metal case has a hollowed hollow cylindrical shape that can be filled and fixed with a material covering the wireless IC tag. 3. The wireless IC tag unit case according to claim 2 , wherein the opening in the bottom portion that prevents the electromagnetic wave from the wireless IC tag from being blocked is an opening larger than a body diameter of the wireless IC tag. 2. The wireless IC tag unit case according to claim 1 , wherein the opening is a circular opening, and a material covering the wireless IC tag is formed in a disc shape to close the opening. 3. The wireless IC tag unit case according to claim 1 , wherein a gap is provided between the metal lid and the hollow metal case. The wireless IC tag unit case according to claim 1 , wherein a material covering the wireless IC tag is a polyparaphenylene benzobisoxazole (trade name "Zylon (registered trademark)") material. According to claim 1, characterized in that the material covering the wireless IC tag is solidified in the liquid glass to be used as a coating material for the amorphous silica to form a glassy coating is melted by silica solution at room temperature Wireless IC tag unit case.

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