CN114778545B - Detection system and detection method - Google Patents

Abstract

The application discloses a detection system and a detection method, and belongs to the technical field of intelligent monitoring. Comprising the following steps: the electronic device controls the thermal excitation source to perform thermal excitation for a first duration. The thermal excitation source projects a thermal excitation onto the infrared mirror. The infrared mirror reflects the thermal excitation onto the target detection portion on the non-view side of the object to be detected to thermally excite the target detection portion. And the electronic equipment controls the infrared thermal imaging equipment to acquire thermal response information of the target detection part reflected by the infrared reflecting mirror in the cooling process after the first time, and the thermal response information is used for determining the damage condition of the target detection part. According to the application, the infrared reflector is used for indirectly carrying out thermal excitation on the target detection part of the object to be detected, and then the infrared thermal imaging equipment is used for collecting thermal response information of the target detection part reflected by the infrared reflector in the cooling process, so that the aim of detecting the target detection part is fulfilled.

Description

A detection system and a detection method

Technical Field

The present application relates to the field of intelligent monitoring technology, and in particular to a detection system and a detection method.

Background Art

In daily life, there is often a need to detect internal defects of some large and immovable objects. For example, in the field of electricity, in order to avoid safety accidents, insulators are generally installed on the outer layer of power equipment. During the life cycle of the insulator, due to the inherent defects in the manufacturing process and the influence of environmental factors, internal damage is prone to occur, which may cause insulation failure and easily lead to safety accidents. Therefore, it is necessary to detect the damage inside the insulator, and active infrared thermal imaging is a new method to deal with this situation.

However, in some scenarios, since the detection space for the object to be detected is severely insufficient, it may be impossible to detect the non-viewing side of the object to be detected, making it impossible to determine the defect information of the part, which makes the detection result incomplete.

Summary of the invention

The embodiments of the present application provide a detection system and a detection method, which can solve the problem in the related art that the defect information of the part of the non-viewing area side of the object to be detected cannot be determined. The technical solution is as follows:

In a first aspect, a detection system is provided, the detection system comprising an electronic device, a thermal excitation source, an infrared reflector and an infrared thermal imaging device, wherein the infrared reflector is located on a non-viewing side of an object to be detected and the mirror surface faces the object to be detected;

The electronic device is used to control the thermal excitation source to continue thermal excitation within a first time period;

The thermal excitation source is used to incident the thermal excitation onto the infrared reflector;

The infrared reflector is used to reflect the thermal excitation to the target detection part of the object to be detected, so as to thermally excite the target detection part, and the target detection part is the detection part on the non-viewing area side of the object to be detected;

The electronic device is also used to control the infrared thermal imaging device to collect thermal response information of the target detection part reflected back by the infrared reflector during the cooling process after the first time period, and the thermal response information is used to determine the damage status of the target detection part.

As an example of the present application, the width of the infrared reflector is N times the width of the object to be detected, and the height of the infrared reflector is K times the height of the object to be detected, where N is greater than or equal to 5, and K is greater than or equal to 1.2.

As an example of the present application, the distance between the infrared reflector and the object to be detected is twice the width of the object to be detected, the line between the infrared thermal imaging device and the virtual image of the object to be detected forms an angle of 45 degrees with the mirror surface, and the lens of the infrared thermal imaging device is facing the position of the virtual image.

As an example of the present application, the thermal excitation source is used to incident the thermal excitation onto the infrared reflector, including:

The thermal excitation source is used to perform thermal excitation on the virtual image position of the object to be detected, and the thermal excitation is incident on the infrared reflector. The virtual image position refers to the position of the virtual image of the object to be detected in the infrared reflector.

As an example of the present application, the number of the thermal excitation sources is two, and the two thermal excitation sources are respectively located on both sides of the infrared thermal imaging device and do not block the field of view of the infrared thermal imaging device.

As an example of the present application, the electronic device is further used to control the infrared thermal imaging device to collect thermal response information of the target detection part reflected back by the infrared reflector during the cooling process after the first time period, including:

The electronic device is also used to control the infrared thermal imaging device to start collecting thermal response information of the target detection part reflected back by the infrared reflector during the cooling process after the first time period and then after a second time period.

As an example of the present application, the electronic device is also used for:

Acquire a plurality of infrared images, each of the plurality of infrared images being generated by an infrared thermal imaging device based on the thermal response information;

Based on the multiple infrared images, determining a target feature map by a principal component analysis (PCA) algorithm;

According to the target feature map, the damage condition of the target detection part is determined.

In a second aspect, a detection method is provided, which is applied to a detection system, wherein the detection system includes an electronic device, a thermal excitation source, an infrared reflector, and an infrared thermal imaging device, wherein the infrared reflector is located on a non-viewing side of an object to be detected and the mirror surface faces the object to be detected; the method includes:

The electronic device controls the thermal excitation source to continue thermal excitation within a first time period;

The thermal excitation source incidents the thermal excitation onto the infrared reflector;

The infrared reflector reflects the thermal excitation to a target detection portion of the object to be detected, so as to thermally excite the target detection portion, wherein the target detection portion is a detection portion on the non-viewing area side of the object to be detected;

After the first time period, the electronic device controls the infrared thermal imaging device to collect thermal response information of the target detection part reflected back by the infrared reflector during the cooling process, and the thermal response information is used to determine the damage condition of the target detection part.

As an example of the present application, the width of the infrared reflector is N times the width of the object to be detected, and the height of the infrared reflector is K times the height of the object to be detected, where N is greater than or equal to 5, and K is greater than or equal to 1.2.

As an example of the present application, the thermal excitation source incidents the thermal excitation onto the infrared reflector, including:

The thermal excitation source performs thermal excitation on the virtual image position of the object to be detected, and the thermal excitation is incident on the infrared reflector. The virtual image position refers to the position of the virtual image of the object to be detected in the infrared reflector.

As an example of the present application, the thermal excitation source incidents the thermal excitation onto the infrared reflector, including:

The thermal excitation source performs thermal excitation on the virtual image position of the object to be detected, and the thermal excitation is incident on the infrared reflector. The virtual image position refers to the position of the virtual image of the object to be detected in the infrared reflector.

As an example of the present application, the number of the thermal excitation sources is two, and the two thermal excitation sources are respectively located on both sides of the infrared thermal imaging device and do not block the field of view of the infrared thermal imaging device.

As an example of the present application, the electronic device controls the infrared thermal imaging device to collect thermal response information of the target detection part reflected back by the infrared reflector during the cooling process after the first time period, including:

After the first time period and then after a second time period, the electronic device controls the infrared thermal imaging device to start collecting thermal response information of the target detection part reflected back by the infrared reflector during the cooling process.

As an example of the present application, the method further includes:

The electronic device acquires a plurality of infrared images, each of the plurality of infrared images being generated by an infrared thermal imaging device based on the thermal response information;

The electronic device determines a target feature map based on the multiple infrared images by using a principal component analysis (PCA) algorithm;

The electronic device determines the damage condition of the target detection part according to the target feature map.

The beneficial effects of the technical solution provided by the embodiment of the present application are:

The electronic device controls the thermal excitation source to continue thermal excitation within a first time period. The thermal excitation source incidents the thermal excitation onto the infrared reflector, and the infrared reflector reflects the thermal excitation onto the target detection part on the non-viewing side of the object to be detected, so as to thermally excite the target detection part. After the first time period, the electronic device controls the thermal excitation source to stop thermal excitation, and controls the infrared thermal imaging device to collect the thermal response information of the target detection part reflected back by the infrared reflector during the cooling process, so that the damage condition of the target detection part can be determined based on the thermal response information. In this way, the target detection part of the object to be detected is indirectly thermally excited by using the infrared reflector, so as to generate a temperature difference between the defective part and the normal part of the object to be detected, so that the temperature difference is obvious enough to be detected by the infrared thermal imaging device, thereby achieving the purpose of detecting the target detection part.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

FIG1 is a schematic diagram of a detection system according to an exemplary embodiment;

FIG2 is a schematic flow chart of a detection method according to an exemplary embodiment;

Fig. 3 is a schematic structural diagram of an electronic device according to an exemplary embodiment.

DETAILED DESCRIPTION

In order to make the objectives, technical solutions and advantages of the present application more clear, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

It should be understood that the "multiple" mentioned in this application refers to two or more. In the description of this application, unless otherwise specified, "/" means or, for example, A/B can mean A or B; "and/or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and/or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in order to facilitate the clear description of the technical solution of this application, the words "first" and "second" are used to distinguish between the same items or similar items with basically the same functions and effects. Those skilled in the art can understand that the words "first" and "second" do not limit the quantity and execution order, and the words "first" and "second" do not limit them to be different.

References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

At present, there is usually a demand for defect detection of some large and immovable objects (hereinafter referred to as: objects to be detected), such as metal corrosion detection, composite material interface defect detection, non-contact detection of solar cells, building exterior wall damage detection, as well as electricity, medical treatment, cultural relics protection and other fields. In some scenarios, there are more complex detection environments, such as detection of the live area side of power equipment in substations, detection of pipes against walls, etc. In the above detection environment, if the space where the object to be detected is located is not large enough, due to the large size of the object to be detected and cannot be moved, it is easy to cause the detection work to be carried out only on the front of the object to be detected, and cannot be carried out on the back of the object to be detected (that is, the non-viewing side), so that the defect information on the back cannot be obtained.

To this end, the embodiments of the present application provide a detection system and a detection method, which can use a thermal excitation source for thermal excitation, and reflect the thermal excitation with the help of an infrared reflector, so that the thermal excitation can be indirectly loaded on the back side of the object to be inspected, and the thermal response information reflected back by the infrared reflector during the cooling process of the back side is collected by an infrared thermal imaging device, thereby realizing defect detection on the back side of the object to be inspected. Its specific implementation can be found in the following embodiments.

Please refer to Figure 1, which is a schematic diagram of a detection system according to an exemplary embodiment. The detection system mainly includes an electronic device 1, a thermal excitation source 2, an infrared reflector 3 and an infrared thermal imaging device 4, wherein the infrared reflector 3 is located on the non-viewing side of the object to be detected 5 and the mirror surface faces the object to be detected 5.

The electronic device 1 is connected to the thermal excitation source 2, and the electronic device 1 is connected to the infrared thermal imaging device 4. The electronic device 1 is used to control the opening of the thermal excitation source 2 and the working time of the thermal excitation source 2. In addition, the electronic device 1 is also used to control the operation of the infrared thermal imaging device 4. As an example but not a limitation, the electronic device 1 can be a terminal device such as a tablet computer, a laptop computer, a desktop computer, etc., and the embodiments of the present application are not limited to this.

The thermal excitation source 2 is used to perform thermal excitation on the object to be detected 5. As an example of the present application, when the target detection part on the non-viewing side of the object to be detected 5 is detected, as shown in FIG1 , the thermal excitation source 2 performs thermal excitation from the side of the object to be detected 5, facing the position of the mirror image of the object to be detected 5 in the infrared reflector 3, and the thermal excitation is incident on the infrared reflector 3. The infrared reflector 3 is used to reflect the incident thermal excitation to the target detection part of the object to be detected 5, so as to perform thermal excitation on the target detection part. Among them, the target detection part may refer to a part on the non-viewing side of the object to be detected 5, such as a partial area on the back of the object to be detected 5.

In one example, the thermal activation source may be a device such as an infrared halogen lamp.

The number of thermal excitation sources 2 can be one or more. Please refer to FIG. 1 , as an example of the present application, the number of thermal excitation sources 2 can be two, and the two thermal excitation sources 2 are respectively located on both sides of the infrared thermal imaging device 4, and do not block the field of view of the infrared thermal imaging device 4. In this way, the use of two thermal excitation sources 2 can make the target 5 to be detected evenly heated.

In one example, the width of the infrared reflector 3 is N times the width of the object to be detected 5, and the height of the infrared reflector 3 is K times the height of the object to be detected 5, N is greater than or equal to 5, and K is greater than or equal to 1.2. In this way, the infrared thermal imaging device 4 can observe the virtual image of the object to be detected 5 in the infrared reflector 3 from both sides (left and right) of the object to be detected 5.

In some examples, the infrared reflector 3 can be made of a material with a high infrared reflectivity. For example, an aluminum-plated reflector or a copper-plated reflector can be selected. The polished surface roughness of the material is required to be Ra<0.2 microns, and the power ratio between the reflected light and the incident light is greater than 90%, so as to maximize the reflectivity of the thermal excitation incident on the infrared reflector 3.

The infrared thermal imaging device 4 is used to collect the thermal response information reflected by the infrared reflector 3 during the cooling process of the target detection part, and the thermal response information is used to generate an infrared image, so that the electronic device 1 can analyze the damage of the corresponding target detection part based on the generated infrared image. In one example, the infrared thermal imaging device 4 can be an infrared thermal imager.

As an example of the present application, the distance between the infrared reflector 3 and the object to be detected 5 is one time the width of the object to be detected 5, and the line between the infrared thermal imaging device 4 and the virtual image of the object to be detected 5 forms a 45 degree angle with the mirror surface of the infrared reflector 3, and the lens of the infrared thermal imaging device 5 faces the position of the virtual image. In this way, the infrared thermal imaging device 4 can collect as much thermal response information reflected back by the infrared reflector 3 as possible.

Based on the detection system provided in the embodiment of FIG1 , detection can be performed on any side of the object 5 to be detected according to the following detection method. Please refer to FIG2 , which is a flow chart of a detection method according to an exemplary embodiment, and the method may include the following steps:

Step 201: the electronic device 1 controls the thermal excitation source 2 to continuously perform thermal excitation within a first time period.

The first duration can be set according to actual needs, and the embodiment of the present application does not make any specific limitation on this.

In one example, when it is necessary to perform defect detection on the target detection part of the object to be detected, the detection personnel can arrange the detection system according to the layout shown in Figure 1, and then the electronic device 1 controls the thermal excitation source 2 to start working, and sends the first time length to the thermal excitation source 2, so that the thermal excitation source 2 can determine how long it needs to run. The target detection part is the detection part on the non-viewing side of the object 5 to be detected.

It should be noted that when laying out the detection system, the position and focal length of the infrared thermal imaging device 4 can be adjusted so that the object to be detected 5 occupies as many pixels as possible and obtains a clear imaging effect. The thermal excitation source 2 (such as an infrared halogen lamp) is placed at the side and rear of the detection object and facing the virtual image position of the object to be detected 5. The position of the thermal excitation source 2 cannot block the viewing angle of the infrared thermal imaging device 4.

Step 202 : The thermal excitation source 2 emits thermal excitation onto the infrared reflector 3 .

The thermal excitation source 2 starts thermal excitation under the control of the electronic device 1. As an example of the present application, the thermal excitation source 2 performs thermal excitation on the virtual image position of the object to be detected 5, and the thermal excitation is incident on the infrared reflector 3 and lasts for a first time period. It is not difficult to understand that the virtual image position refers to the position of the virtual image of the object to be detected 5 in the infrared reflector, for example, please refer to Figure 1, and the virtual image refers to 6 in Figure 1.

As an example of the present application, if the electronic device 1, when controlling the thermal excitation source 2 to start working, also indicates the length of time that the thermal excitation source 2 needs to continue working, for example, the length of time is the first length of time, then the thermal excitation source 2 will incident thermal excitation onto the infrared reflector 3, and will stop after continuing the thermal excitation for the first length of time.

Step 203: The infrared reflector 3 reflects the thermal excitation to the target detection part of the object to be detected 5, so as to perform thermal excitation on the target detection part.

According to the detection system shown in Figure 1, the infrared reflector 3 is located on the non-viewing side of the object to be detected 5 with the mirror surface facing the object to be detected 5, and the thermal excitation source 2 performs thermal excitation on the virtual image position of the object to be detected 5. In this way, the thermal excitation incident on the infrared reflector 3 can be reflected to the target detection part of the object to be detected 5 through the action of the infrared reflector 3.

Step 204: after the first time period, the electronic device 1 controls the infrared thermal imaging device 4 to collect thermal response information of the target detection part reflected back by the infrared reflector 3 during the cooling process, and the thermal response information is used to determine the damage condition of the target detection part.

As an example of the present application, the specific implementation of the electronic device 1 controlling the infrared thermal imaging device 4 to collect the thermal response information of the target detection part reflected back by the infrared reflector 3 during the cooling process after the first time period may include: the electronic device 1 controls the infrared thermal imaging device 4 to collect the thermal response information of the target detection part reflected back by the infrared reflector 3 during the cooling process after the first time period and then after a second time period.

The second duration can be set according to actual needs, and the embodiment of the present application does not make any specific limitation on this.

Since there is still a certain amount of residual heat in the thermal excitation source 2 within a period of time just after the heating ends (for example, within a period of about 3 seconds), the thermal response information collected by the infrared thermal imager may be inaccurate during this period due to the influence of the residual heat of the thermal excitation source 2, that is, the thermal response information collected during this period fails to accurately reflect the actual temperature of the target detection part. Therefore, the thermal response information during this period can be filtered out. For this reason, after the thermal excitation source 2 stops working, after a second period of time, the electronic device 1 controls the infrared thermal imaging device 4 to start collecting thermal response information, so that the subsequent detection accuracy can be improved.

Furthermore, after collecting the thermal response information, the infrared thermal imaging device 4 generates a corresponding infrared image according to the collected thermal response information. It is not difficult to understand that as the collection time goes by, multiple infrared images can be obtained.

In another embodiment, the electronic device 1 may also control the infrared thermal imaging device 4 to start collecting thermal response information after the first period of time. In this case, in order to avoid interference caused by the residual heat of the thermal excitation source 2, after the infrared image is generated, the first K frames can be filtered out and the infrared images after K frames can be retained, so as to facilitate the subsequent use of the retained infrared images to analyze whether the target detection part is damaged, where k is an integer greater than 1.

Step 205: The electronic device 1 acquires a plurality of infrared images.

Each of the multiple infrared images is generated by the infrared thermal imaging device 4 based on thermal response information.

Step 206: The electronic device 1 determines a target feature map by using a PCA algorithm based on the multiple infrared images.

Taking the number of multiple infrared images as P, each of which includes M*N pixels as an example, the specific implementation of determining the target feature map based on multiple infrared images through the PCA (Principal Component Analysis) algorithm is described, which specifically includes:

Each infrared image among the multiple infrared images is vectorized to obtain P pixel vectors, and the length of each pixel vector is Q, Q=M*N. A Q*P two-dimensional matrix is generated based on the P pixel vectors. The two-dimensional matrix is normalized. After that, principal component analysis is performed on the normalized two-dimensional matrix. Specifically, the corresponding covariance matrix is determined based on the normalized two-dimensional matrix, and the eigenvalues and eigenvectors of the covariance matrix are calculated to obtain P eigenvalues and P eigenvectors, and each eigenvalue corresponds to an eigenvector. In the order of eigenvalues from large to small, the eigenvectors corresponding to the top three eigenvalues are selected from the P eigenvectors to obtain 3 principal components, that is, the P features of the pixel point are reduced to 3 features. Then, the target feature map is determined based on the 3 principal components.

In one example, the specific implementation of determining the target feature map according to the three principal components may include: selecting a first principal component from the three principal components, where the first principal component refers to an eigenvector corresponding to the maximum eigenvalue among the three principal components, and reconstructing the target feature map of M*N pixels according to the first principal component.

Since the larger the eigenvalue, the more representative the corresponding eigenvector is, the eigenvector corresponding to the maximum eigenvalue can be selected to reconstruct the target feature map.

In another example, a specific implementation of determining the target feature map based on three principal components may include: randomly selecting a principal component from the three principal components, and reconstructing the target feature map of M*N pixels based on the selected principal component.

It should be noted that the above-mentioned extraction of three principal components after obtaining P eigenvalues and P eigenvectors, and then determining the target feature map based on the three principal components is only exemplary. In another embodiment, after obtaining P eigenvalues and P eigenvectors, the eigenvector corresponding to the maximum eigenvalue can be directly determined from the P eigenvectors, and then the target feature map of M*N pixels can be reconstructed based on the eigenvector corresponding to the maximum eigenvalue.

It is worth mentioning that by determining the target feature map through the PCA algorithm, the target feature map can have sufficient resolution and signal-to-noise ratio, thereby improving the accuracy of detection.

Step 207: The electronic device 1 determines the damage condition of the target detection part according to the target feature map.

In one example, the target feature map can be input into a pre-trained network recognition model to determine whether the target detection part is damaged through the network recognition model. Exemplarily, the target recognition model outputs a target value after recognizing the target feature map. If the target value is a first value, it is determined that the target detection part is damaged. Otherwise, if the target value is a second value, it is determined that the target detection part is not damaged. That is, the first value is used to indicate damage, and the second value is used to indicate non-damage.

Both the first value and the second value can be set as required. For example, the first value is 1 and the second value is 0, which is not limited in the embodiment of the present application.

In addition, the network recognition model can be obtained by pre-training the neural network model based on a large number of feature map samples.

It should be noted that the above steps 205 to 207 are optional operations. In another embodiment, the electronic device 1 can obtain multiple infrared images from the infrared thermal imaging device 4, and then determine the target feature map through the PCA algorithm based on the multiple infrared images, and then manually determine the damage of the target detection part through human eye recognition based on the display differences in the target feature map. For example, if the brightness of the area where the target detection part is located in the target feature map is higher than the brightness of the surrounding area, it means that the area where the target detection part is located is an abnormally heated area, and at this time it can be determined that the target detection part is a severely damaged part.

When it is determined that the target detection part is damaged, the actual position of the target detection part can be determined based on the position of the target detection part in the target feature map through the reflection law, so as to mark it.

It should be noted that if the imaging result of the target detection part of the object to be detected 5 is not clear, and it is determined through judgment that the target detection part may have defects (for example, through human eye recognition), the detection can be repeated according to the above process.

It should also be noted that the above is a detection from one side (such as the left or right side) of the object to be detected 5. In practice, in order to be able to perform an all-round detection of the object to be detected 5, after detecting one side in the above manner, the same method can be used to continue to detect from another side of the object to be detected 5, so as to detect whether the entire back side of the object to be detected 5 is damaged.

In the embodiment of the present application, the electronic device 1 controls the thermal excitation source 2 to continuously perform thermal excitation within a first time period. The thermal excitation source 2 incidents the thermal excitation onto the infrared reflector 3, and the infrared reflector 3 reflects the thermal excitation to the target detection part on the non-viewing side of the object to be detected 5, so as to thermally excite the target detection part. After the first time period, the electronic device 1 controls the thermal excitation source 2 to stop the thermal excitation, and controls the infrared thermal imaging device 4 to collect the thermal response information of the target detection part reflected back by the infrared reflector 3 during the cooling process, so that the damage condition of the target detection part can be determined based on the thermal response information. In this way, the infrared reflector 3 is used to indirectly perform thermal excitation on the target detection part of the object to be detected 5, so as to generate a temperature difference between the damaged part and the normal part of the object to be detected 5, so that the temperature difference is obvious enough to be detected by the infrared thermal imaging device 4, thereby achieving the purpose of detecting the target detection part.

In addition, this method has the advantage of long-distance and large-area detection, and overcomes the shortcomings of traditional passive infrared detection, such as limited application objects and low resolution.

In addition, the above detection system can be used to detect the front of the object to be detected 5. It is not difficult to understand that since the front of the object to be detected 5 is in the visual field, the infrared reflector 3 may not be needed when the above detection system is used for detection. In implementation, the infrared thermal imaging device 4 can be placed directly on the front of the object to be detected 5, and the position and focal length can be adjusted to make the object to be detected 5 occupy more pixels as much as possible, and obtain a clear imaging effect at the same time. The two thermal excitation sources 2 are placed on the side and rear of the object to be detected 5 and directly on the object to be detected 5, and the positions of the two excitation sources do not block the viewing angle of the infrared thermal imaging device 4. During detection, the electronic device 1 controls the thermal excitation source 2 to continuously perform thermal excitation on the front of the object to be detected 5, and the duration can be a first duration, after which the thermal excitation source 2 stops performing thermal excitation. After the second duration, the infrared thermal imaging device 4 collects the thermal response information released by the detection part of the front of the object to be detected 5 during the cooling process, and generates a corresponding infrared image based on the collected thermal response information. The electronic device 1 obtains the generated multiple infrared images, and then determines whether the detection part of the front side of the object to be detected 5 is damaged based on the multiple infrared images. For details, please refer to the above steps 205 to 207, which will not be repeated here. In this way, the full range of detection of the object to be detected 5 can be completed. According to the method provided in the embodiment of the present application, the detection of each side of the object to be detected 5 can be completed with a relatively small number of detection times.

It should be understood that the serial numbers of the steps in the above embodiments do not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

FIG3 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. As shown in FIG3, the electronic device 1 of this embodiment includes: at least one processor 10 (only one is shown in FIG3), a memory 11, and a computer program 12 stored in the memory 11 and executable on the at least one processor 10, and when the processor 10 executes the computer program 12, the steps in any of the above-mentioned method embodiments are implemented.

The electronic device 1 may be a computing device such as a desktop computer, a notebook, a PDA, and a cloud server. The electronic device may include, but is not limited to, a processor 10 and a memory 11. Those skilled in the art may understand that FIG3 is only an example of the electronic device 1 and does not constitute a limitation on the electronic device 1. The electronic device 1 may include more or fewer components than shown in the figure, or may combine certain components, or different components, for example, may also include input and output devices, network access devices, etc.

The processor 10 may be a CPU (Central Processing Unit), or other general-purpose processors, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or the processor may be any conventional processor, etc.

In some embodiments, the memory 11 may be an internal storage unit of the electronic device 1, such as a hard disk or memory of the electronic device 1. In other embodiments, the memory 11 may also be an external storage device of the electronic device 1, such as a plug-in hard disk, SMC (Smart Media Card), SD (Secure Digital) card, Flash Card, etc. equipped on the electronic device 1. Further, the memory 11 may also include both an internal storage unit and an external storage device of the electronic device 1. The memory 11 is used to store an operating system, an application program, a boot loader, data, and other programs, such as the program code of the computer program. The memory 11 may also be used to temporarily store data that has been output or is to be output.

It should be noted that the information interaction, execution process, etc. between the above-mentioned devices/units are based on the same concept as the method embodiment of the present application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims (7)

1. The detection system is characterized by comprising electronic equipment, thermal excitation sources, an infrared reflecting mirror and infrared thermal imaging equipment, wherein the infrared reflecting mirror is positioned on the non-visual side of an object to be detected, the mirror surface of the infrared reflecting mirror faces the object to be detected, the distance between the infrared reflecting mirror and the object to be detected is one time of the width of the object to be detected, an angle of 45 degrees is formed between a connecting line between the infrared thermal imaging equipment and a virtual image of the object to be detected and the mirror surface, lenses of the infrared thermal imaging equipment face the position of the virtual image, the number of the thermal excitation sources is 2, the two thermal excitation sources are positioned on two sides of the infrared thermal imaging equipment respectively, and the view field of the infrared thermal imaging equipment is not blocked;

the electronic equipment is used for controlling the thermal excitation source to continuously perform thermal excitation in a first duration;

The thermal excitation source is used for thermally exciting a virtual image position of the object to be detected, the thermal excitation is incident on the infrared reflecting mirror, and the virtual image position refers to the position of a virtual image of the object to be detected in the infrared reflecting mirror;

the infrared reflecting mirror is used for reflecting the thermal excitation to a target detection part of the object to be detected so as to thermally excite the target detection part, wherein the target detection part is a detection part of the object to be detected on the non-visual side;

The electronic equipment is further used for controlling the infrared thermal imaging equipment to acquire thermal response information of the target detection part reflected by the infrared reflecting mirror in the cooling process after the first time, and the thermal response information is used for determining damage condition of the target detection part.

2. The inspection system of claim 1 wherein the infrared mirror has a width N times the width of the object to be inspected and a height K times the height of the object to be inspected, the N being greater than or equal to 5 and the K being greater than or equal to 1.2.

3. The inspection system of claim 1, wherein the electronic device further configured to control the infrared thermal imaging device to collect thermal response information of the target inspection site reflected back via the infrared mirror during cooling after the first period of time comprises:

The electronic equipment is further used for controlling the infrared thermal imaging equipment to start to collect thermal response information of the target detection part reflected by the infrared reflecting mirror in the cooling process after the first time length and the second time length.

4. The detection system of claim 1, wherein the electronic device is further configured to:

Acquiring a plurality of infrared images, each of the plurality of infrared images being generated by an infrared thermal imaging device based on the thermal response information;

determining a target feature map through a Principal Component Analysis (PCA) algorithm based on the plurality of infrared images;

and determining the damage condition of the target detection part according to the target feature map.

5. A detection method, characterized in that it is applied to the detection system of claim 1, the detection system comprises an electronic device, a thermal excitation source, an infrared reflecting mirror and an infrared thermal imaging device, the infrared reflecting mirror is positioned on the non-visual side of an object to be detected, and the mirror surface is oriented to the object to be detected; the method comprises the following steps:

The electronic equipment controls the thermal excitation source to continuously perform thermal excitation in a first duration;

The thermal excitation source is used for making the thermal excitation incident on the infrared reflecting mirror;

The infrared reflecting mirror reflects the thermal excitation to a target detection part of the object to be detected so as to thermally excite the target detection part, wherein the target detection part is a detection part of the object to be detected on the non-visual side;

And the electronic equipment controls the infrared thermal imaging equipment to acquire thermal response information of the target detection part reflected by the infrared reflecting mirror in the cooling process after the first time, and the thermal response information is used for determining the damage condition of the target detection part.

6. The method of claim 5, wherein the infrared mirror has a width N times the width of the object to be detected and a height K times the height of the object to be detected, the N being greater than or equal to 5, the K being greater than or equal to 1.2.

7. The method of claim 5 or 6, wherein the thermally stimulated source impinging the thermal stimulus on the infrared mirror comprises:

the thermal excitation source carries out thermal excitation on a virtual image position of the object to be detected, the thermal excitation is incident on the infrared reflecting mirror, and the virtual image position refers to a position of a virtual image of the object to be detected in the infrared reflecting mirror.