CN114778545A - Detection system and detection method - Google Patents

Abstract

The application discloses a detection system and a detection method, which belong to the technical field of intelligent monitoring. Including: the electronic device controls the thermal excitation source to continuously perform thermal excitation within the first time period. The thermal excitation source impinges the thermal excitation onto the infrared mirror. The infrared reflector reflects the thermal excitation to the target detection part on the non-viewing area side of the object to be detected, so as to perform thermal excitation on the target detection part. After the first time period, the electronic device controls the infrared thermal imaging device to collect the thermal response information of the target detection part reflected by the infrared mirror during the cooling process, and the thermal response information is used to determine the damage of the target detection part. In the present application, the target detection part of the object to be detected is indirectly thermally excited through the infrared reflector, and then the thermal response information of the target detection part reflected by the infrared reflector during the cooling process is collected by the infrared thermal imaging device, so as to achieve the target detection effect. The purpose of detection at the detection site.

Description

A detection system and detection method

technical field

The present application relates to the technical field of intelligent monitoring, and in particular, to a detection system and a detection method.

Background technique

In daily life, there is usually a need for internal defect detection of some large and immovable objects. For example, in the field of electric power, in order to avoid the occurrence of safety accidents, insulators are generally installed on the outer layer of power equipment. During the life cycle of the insulators, due to the inherent defects in the manufacturing process and the influence of environmental factors, internal damage is prone to occur. phenomenon, which may cause the insulation failure, which may easily lead to safety accidents. Therefore, it is necessary to detect the damage inside the insulator, and active infrared thermal imaging is a new method to deal with this situation.

In some scenarios, because the detection space where the object to be detected is located is seriously insufficient, it may lead to the failure to detect the part of the object to be detected on the non-view field side, so that the defect information of the part cannot be determined, and the detection result is insufficient. comprehensive.

SUMMARY OF THE INVENTION

The embodiments of the present application provide a detection system and a detection method, which can solve the problem in the related art that the defect information of the part on the non-viewing area side of the object to be detected cannot be determined. The technical solution is as follows:

In a first aspect, a detection system is provided, the detection system includes an electronic device, a thermal excitation source, an infrared reflector, and an infrared thermal imaging device, the infrared reflector is located on the non-visual field side of the object to be detected, and the mirror surface faces the Describe the object to be detected;

the electronic device for controlling the thermal excitation source to continuously perform thermal excitation within a first period of time;

the thermal excitation source, used to inject the thermal excitation onto the infrared mirror;

The infrared reflector is used to reflect the thermal excitation to the target detection part of the object to be detected, so as to perform thermal excitation on the target detection part, and the target detection part is a non-contact part of the object to be detected. The detection part on the field of view side;

The electronic device is further configured to control the infrared thermal imaging device to collect the thermal response information reflected back by the infrared mirror during the cooling process of the target detection part after the first time period, the thermal response information used to determine the damage condition of the target detection part.

As an example of the present application, the width of the infrared reflector is N times the width of the object to be detected, and the height of the infrared reflector is K times the height of the object to be detected, and N is greater than or equal to 5, the K is greater than or equal to 1.2.

As an example of the present application, the distance between the infrared mirror and the object to be detected is twice the width of the object to be detected, and the distance between the infrared thermal imaging device and the virtual image of the object to be detected is The connecting line between the two forms an included angle of 45 degrees with the mirror surface, and the lens of the infrared thermal imaging device is facing the position of the virtual image.

As an example of the present application, the thermal excitation source, used to inject the thermal excitation onto the infrared mirror, includes:

The thermal excitation source is used for thermal excitation to the virtual image position of the object to be detected, the thermal excitation is incident on the infrared mirror, and the virtual image position refers to the object to be detected in the The position of the virtual image in the IR mirror.

As an example of the present application, the number of the thermal excitation sources is two, and the two thermal excitation sources are located on two sides of the infrared thermal imaging device respectively, and do not block the field of view of the infrared thermal imaging device.

As an example of the present application, the electronic device is further configured to control the infrared thermal imaging device to collect the thermal response of the target detection part reflected by the infrared mirror during the cooling process after the first time period information, including:

The electronic device is further configured to control the infrared thermal imaging device to start collecting the target detection part after the first time period and a second time period, and the target detection part is reflected back by the infrared reflector during the cooling process. thermal response information.

As an example of this application, the electronic device is also used for:

acquiring multiple infrared images, each infrared image in the multiple infrared images is generated by an infrared thermal imaging device based on the thermal response information;

Based on the plurality of infrared images, a target feature map is determined through a principal component analysis PCA algorithm;

According to the target feature map, the damage condition of the target detection part is determined.

In a second aspect, a detection method is provided, which is applied to a detection system. The detection system includes an electronic device, a thermal excitation source, an infrared reflector, and an infrared thermal imaging device. The infrared reflector is located in a non-view field of an object to be detected. side and the mirror surface faces the object to be detected; the method includes:

The electronic device controls the thermal excitation source to continuously perform thermal excitation within a first period of time;

the thermal excitation source injects the thermal excitation onto the infrared mirror;

The infrared reflector reflects the thermal excitation to the target detection part of the object to be detected, so as to perform thermal excitation on the target detection part, and the target detection part is the non-visual field side of the object to be detected the detection site;

The electronic device controls the infrared thermal imaging device to collect the thermal response information reflected by the infrared mirror during the cooling process of the target detection part after the first time period, and the thermal response information is used to determine the thermal response information. Describe the damage to the target detection site.

As an example of the present application, the width of the infrared reflector is N times the width of the object to be detected, and the height of the infrared reflector is K times the height of the object to be detected, and N is greater than or equal to 5, the K is greater than or equal to 1.2.

As an example of the present application, the thermal excitation source injects the thermal excitation onto the infrared reflector, including:

The thermal excitation source performs thermal excitation to the virtual image position of the object to be detected, and the thermal excitation is incident on the infrared mirror, and the virtual image position refers to the position of the object to be detected at the infrared mirror. The position of the virtual image in .

As an example of the present application, the thermal excitation source injects the thermal excitation onto the infrared reflector, including:

The thermal excitation source performs thermal excitation to the virtual image position of the object to be detected, and the thermal excitation is incident on the infrared mirror, and the virtual image position refers to the position of the object to be detected at the infrared mirror. The position of the virtual image in .

As an example of the present application, the number of the thermal excitation sources is two, and the two thermal excitation sources are located on two sides of the infrared thermal imaging device respectively, and do not block the field of view of the infrared thermal imaging device.

As an example of the present application, the electronic device controls the infrared thermal imaging device to collect the thermal response information reflected by the infrared mirror during the cooling process of the target detection part after the first time period, including:

After the first time period, the electronic device controls the infrared thermal imaging device to start collecting the thermal response information reflected by the infrared mirror during the cooling process of the target detection part after the second time period. .

As an example of the present application, the method further includes:

The electronic device acquires a plurality of infrared images, and each infrared image in the plurality of infrared images is generated by an infrared thermal imaging device based on the thermal response information;

The electronic device determines a target feature map through a principal component analysis PCA algorithm based on the plurality of infrared images;

The electronic device determines the damage condition of the target detection part according to the target feature map.

The beneficial effects brought by the technical solutions provided in the embodiments of the present application are:

The electronic device controls the thermal excitation source to continuously perform thermal excitation within the first period of time. The thermal excitation source injects thermal excitation onto the infrared reflector, and the infrared reflector reflects the thermal excitation to the target detection part on the non-visual field side of the object to be detected, so as to thermally stimulate the target detection part. The electronic device controls the thermal excitation source to stop the thermal excitation after the first time period, and controls the infrared thermal imaging device to collect the thermal response information reflected by the infrared mirror of the target detection part during the cooling process. In this way, the target detection can be determined based on the thermal response information. damage to the part. In this way, the infrared reflector is used to indirectly thermally excite the target detection part of the object to be detected, and the temperature difference between the defective part and the normal part of the object to be detected is generated, so that the temperature difference is obvious enough to be detected by the infrared thermal imaging device. So as to achieve the purpose of detecting the target detection part.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.

1 is a schematic diagram of a detection system according to an exemplary embodiment;

2 is a schematic flowchart of a detection method according to an exemplary embodiment;

FIG. 3 is a schematic structural diagram of an electronic device according to an exemplary embodiment.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

It should be understood that the "plurality" mentioned in this application refers to two or more. In the description of this application, unless otherwise specified, "/" means or means, for example, A/B can mean A or B; "and/or" in this text is only a relationship to describe the related objects, Indicates that three relationships can exist, for example, A and/or B, can represent: A alone exists, A and B exist at the same time, and B exists alone. In addition, in order to facilitate the clear description of the technical solutions of the present application, words such as "first" and "second" are used to distinguish the same items or similar items with basically the same function and effect. Those skilled in the art can understand that the words "first", "second" and the like do not limit the quantity and execution order, and the words "first", "second" and the like are not necessarily different.

References in this specification to "one embodiment" or "some embodiments" and the like mean that a particular feature, structure or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in other embodiments," etc. in various places in this specification are not necessarily All refer to the same embodiment, but mean "one or more but not all embodiments" unless specifically emphasized otherwise. The terms "including", "including", "having" and their variants mean "including but not limited to" unless specifically emphasized otherwise.

At present, there is usually a demand for defect detection of some objects that are relatively large and immovable (hereinafter referred to as: objects to be tested), such as metal corrosion detection, composite interface defect detection, solar cell non-contact detection, construction Exterior wall damage detection, as well as power, medical, cultural relics protection and other fields. In some scenarios, there is a relatively complex detection environment, such as the detection of the live area side of the power equipment in the substation, the detection of the pipeline against the wall, etc. In the above detection environment, if the space where the object to be detected is located is insufficient, the object to be detected is too large to move, so the detection work can only be performed on the front of the object to be detected, and cannot be performed on the back of the object to be detected (also That is, the non-viewing area side) is expanded, so that the defect information on the back cannot be obtained.

To this end, the embodiments of the present application provide a detection system and detection method, which can use a thermal excitation source for thermal excitation, and use an infrared mirror to reflect the thermal excitation, so that the thermal excitation can be indirectly loaded on the back of the object to be detected , and the thermal response information reflected by the infrared mirror on the back during the cooling process is collected by the infrared thermal imaging device, so as to realize the defect detection on the back of the object to be detected. The specific implementation can refer to the following embodiments.

Please refer to FIG. 1 , which is a schematic diagram of a detection system according to an exemplary embodiment. The detection system mainly includes an electronic device 1 , a thermal excitation source 2 , an infrared mirror 3 and an infrared thermal imaging device 4 .

The electronic device 1 is connected to the thermal excitation source 2 , and the electronic device 1 is connected to the infrared thermal imaging device 4 . The electronic device 1 is used to control the activation of the thermal excitation source 2 and the working time of the thermal excitation source 2 . In addition, the electronic device 1 is also used to control the operation of the infrared thermal imaging device 4 . As an example but not a limitation, the electronic device 1 may be a terminal device such as a tablet computer, a notebook computer, and a desktop computer, which is not limited in this embodiment of the present application.

The thermal excitation source 2 is used for thermal excitation of the object 5 to be detected. As an example of the present application, when the target detection part on the non-visual field side of the object to be detected 5 is detected, as shown in FIG. 1 , the thermal excitation source 2 faces the object to be detected 5 from the side of the object to be detected The position of the mirror image in the infrared reflector 3 is a thermal excitation source, and the thermal excitation is incident on the infrared reflector 3 . The infrared reflector 3 is used to reflect the incident thermal excitation to the target detection part of the object to be detected 5, so as to perform thermal excitation on the target detection part. The target detection part may refer to a certain part on the non-viewing area side of the object to be detected 5 , for example, a partial area of the back of the object to be detected 5 .

In one example, the thermal excitation source may be a device such as an infrared halogen lamp.

The number of thermal excitation sources 2 may be one or more. Please refer to FIG. 1 , as an example of the present application, the number of thermal excitation sources 2 may be 2, and the two thermal excitation sources 2 are located on both sides of the infrared thermal imaging device 4 respectively, and have a field of view of the infrared thermal imaging device 4 . Does not constitute occlusion. In this way, the use of two thermal excitation sources 2 can make the object 5 to be detected uniformly heated.

In one example, the width of the infrared mirror 3 is N times the width of the object 5 to be detected, and the height of the infrared mirror 3 is K times the height of the object 5 to be detected, N is greater than or equal to 5, and K is greater than or equal to 1.2. In this way, the infrared thermal imaging device 4 can observe the virtual image of the object to be detected 5 in the infrared reflector 3 from both sides (left and right sides) of the object to be detected 5 .

In some examples, the infrared reflector 3 can be made of a material with a higher infrared reflectivity. For example, an aluminum-coated reflector or a copper-coated reflector can be selected. The power ratio between the light and the incident light is greater than 90% in order to improve the reflectivity of the thermal excitation incident on the infrared mirror 3 as much as possible.

The infrared thermal imaging device 4 is used to collect the thermal response information reflected back by the infrared mirror 3 during the cooling process of the target detection part, and the thermal response information is used to generate an infrared image, so that the electronic device 1 can analyze the corresponding infrared image based on the generated infrared image. Damage to the target detection site. In one example, the infrared thermal imaging device 4 may be an infrared thermal imaging camera.

As an example of this application, the distance between the infrared mirror 3 and the object to be detected 5 is twice the width of the object to be detected 5 , and the connection line between the infrared thermal imaging device 4 and the virtual image of the object to be detected 5 It forms an angle of 45 degrees with the mirror surface of the infrared reflector 3, and the lens of the infrared thermal imaging device 5 is facing the position of the virtual image. In this way, the infrared thermal imaging device 4 can collect as much thermal response information reflected by the infrared mirror 3 as possible.

Based on the detection system provided in the embodiment of FIG. 1 , the detection can be performed on any side of the object 5 to be detected according to the following detection method. Please refer to FIG. 2. FIG. 2 is a flowchart of a detection method according to an exemplary embodiment. The method may include the following steps:

Step 201 : The electronic device 1 controls the thermal excitation source 2 to continuously perform thermal excitation for a first period of time.

The first duration may be set according to actual needs, which is not specifically limited in this embodiment of the present application.

In one example, when it is necessary to perform defect inspection on the target inspection part of the target to be inspected, the inspection personnel can arrange the inspection system according to the layout shown in FIG. 1 , and then the electronic device 1 controls the thermal excitation source 2 to start working, and The first duration is sent to the thermal excitation source 2 so that the thermal excitation source 2 can determine how long it needs to run. The target detection part is the detection part on the non-viewing area side of the object 5 to be detected.

It should be noted that, when arranging the detection system, the position and focal length of the infrared thermal imaging device 4 can be adjusted so that the object 5 to be detected occupies as many pixels as possible, while obtaining a clear imaging effect. The thermal excitation source 2 (such as an infrared halogen lamp) is placed behind the detection object and faces the virtual image position of the object 5 to be detected. The position of the thermal excitation source 2 cannot block the viewing angle of the infrared thermal imaging device 4 .

Step 202 : the thermal excitation source 2 injects thermal excitation onto the infrared reflector 3 .

The thermal excitation source 2 starts thermal excitation under the control of the electronic device 1 . As an example of the present application, the thermal excitation source 2 performs thermal excitation on the virtual image position of the object 5 to be detected, and the thermal excitation is incident on the infrared mirror 3 and lasts for a first period of time. It is not difficult to understand that the virtual image position refers to the position of the virtual image of the object to be detected 5 in the infrared emitting mirror. For example, please refer to FIG. 1 , the virtual image refers to 6 in FIG. 1 .

As an example of this application, when the electronic device 1 controls the thermal excitation source 2 to start working, if the electronic device 1 also indicates the duration that the thermal excitation source 2 needs to work continuously, for example, the duration is the first duration, the thermal excitation source 2 will thermally excite the Incident on the infrared mirror 3, and continue to thermally excite for a first period of time and then stop.

Step 203: The infrared mirror 3 reflects the thermal excitation to the target detection part of the object to be detected 5, so as to perform thermal excitation on the target detection part.

According to the detection system shown in FIG. 1 , the infrared reflector 3 is located on the non-visual field side of the object to be detected 5 and the mirror surface faces the object to be detected 5 , and the thermal excitation source 2 performs thermal excitation on the virtual image position of the object to be detected 5 , In this way, the thermal excitation incident into the infrared reflector 3 can be reflected to the target detection part of the object to be detected 5 through the action of the infrared reflector 3 .

Step 204: The electronic device 1 controls the infrared thermal imaging device 4 to collect the thermal response information reflected by the infrared mirror 3 during the cooling process of the target detection part after the first time period, and the thermal response information is used to determine the damage of the target detection part .

As an example of this application, the specific implementation of the electronic device 1 controlling the infrared thermal imaging device 4 to collect the thermal response information reflected by the infrared mirror 3 during the cooling process of the target detection part after the first time period may include: After the first time period, the infrared thermal imaging device 4 is controlled to collect the thermal response information reflected by the infrared reflector 3 during the cooling process of the target detection part after the second time period.

The second duration may be set according to actual needs, which is not specifically limited in this embodiment of the present application.

Since there is still a certain amount of residual heat in the thermal excitation source 2 at one end of the heating period (for example, within a period of about 3 seconds), the infrared heat may be affected by the residual heat of the thermal excitation source 2 during this period. The thermal response information collected by the camera is inaccurate, that is, the thermal response information collected during this period cannot accurately reflect the actual temperature of the target detection site. Therefore, the thermal response information during this period can be filtered out. For this reason, after the thermal excitation source 2 stops working, after a second period of time, the electronic device 1 controls the infrared thermal imaging device 4 to start collecting thermal response information, so that the subsequent detection accuracy can be improved.

Further, after collecting the thermal response information, the infrared thermal imaging device 4 generates a corresponding infrared image according to the collected thermal response information. It is not difficult to understand that over time of acquisition, multiple infrared images can be obtained.

In another embodiment, the electronic device 1 may also control the infrared thermal imaging device 4 to start collecting thermal response information after the first time period. In this case, in order to avoid interference caused by the residual heat of the thermal excitation source 2, the After the infrared image is generated, the first K frames can be filtered out, and the infrared image after the K frame can be retained, so as to use the retained infrared image to analyze whether the target detection part is damaged, where k is an integer greater than 1.

Step 205: The electronic device 1 acquires multiple infrared images.

Wherein, each infrared image in the plurality of infrared images is generated by the infrared thermal imaging device 4 based on thermal response information.

Step 206 : The electronic device 1 determines the target feature map through the PCA algorithm based on the plurality of infrared images.

Taking the number of multiple infrared images as P, and each infrared image includes M*N pixels as an example, the specific method of determining the target feature map through the PCA (Principal Component Analysis, principal component analysis) algorithm based on multiple infrared images is used as an example. The implementation is described, including:

Each infrared image in the plurality of infrared images is vectorized to obtain P pixel vectors, the length of each pixel vector is Q, and Q=M*N. Generate a Q*P 2D matrix based on P pixel vectors. Normalize a two-dimensional matrix. After that, perform principal component analysis on the normalized two-dimensional matrix, specifically, determine the corresponding covariance matrix based on the normalized two-dimensional matrix, calculate the eigenvalues and eigenvectors of the covariance matrix, and obtain P features value and P eigenvectors, each eigenvalue corresponds to an eigenvector. According to the order of eigenvalues from large to small, the eigenvectors corresponding to the top three eigenvalues are selected from the P eigenvectors, and 3 principal components are obtained, that is, the P features of the pixel are reduced to 3 features. Then, the target feature map is determined according to the 3 principal components.

In an example, the specific implementation of determining the target feature map according to the three principal components may include: selecting a first principal component from the three principal components, where the first principal component refers to a feature vector corresponding to the largest eigenvalue among the three principal components . The target feature map of M*N pixels is reconstructed from the first principal component.

Since the larger the eigenvalue is, the more representative the corresponding eigenvector is, so the eigenvector corresponding to the largest eigenvalue can be selected to reconstruct the target feature map.

In another example, the specific implementation of determining the target feature map according to the three principal components may include: randomly selecting one principal component from the three principal components, and reconstructing the target feature map of M*N pixels according to the selected principal component.

It should be noted that, after obtaining P eigenvalues and P eigenvectors, extracting 3 principal components, and then determining the target feature map according to the 3 principal components is only exemplary. In another embodiment, after the P eigenvalues and P eigenvectors are obtained, the eigenvector corresponding to the largest eigenvalue may be directly determined from the P eigenvectors, and then, according to the eigenvector corresponding to the largest eigenvalue, the Construct the target feature map of M*N pixels.

It is worth mentioning that by determining the target feature map through the PCA algorithm, the target feature map can have sufficient resolution and signal-to-noise ratio, thereby improving the detection accuracy.

Step 207 : The electronic device 1 determines the damage condition of the target detection part according to the target feature map.

In one example, the target feature map can be input into a pre-trained network recognition model to determine whether the target detection part is damaged through the network recognition model. Exemplarily, the target recognition model outputs the target value after identifying the target feature map. If the target value is the first value, it is determined that the target detection part is damaged; otherwise, if the target value is the second value, it is determined that the target detection part is not damaged. damaged. That is, the first value is used to indicate damage, and the second value is used to indicate no damage.

Both the first numerical value and the second numerical value can be set according to requirements. For example, the first numerical value is 1, and the second numerical value is 0, which is not limited in this embodiment of the present application.

In addition, the network identification model may be obtained by pre-training the neural network model based on a large number of feature map samples.

It should be noted that the above steps 205 to 207 are optional operations. In another embodiment, after the electronic device 1 acquires multiple infrared images from the infrared thermal imaging device 4, according to the multiple infrared images, the The PCA algorithm determines the target feature map, and then manually determines the damage of the target detection part through human eye recognition according to the display differences in the target feature map. For example, if the brightness of the area where the target detection part is located in the target feature map is higher than the brightness of the surrounding area, it means that the area where the target detection part is located is an abnormally heated area. At this time, it can be determined that the target detection part is a severely damaged part.

In the case where it is determined that the target detection part is damaged, the actual position of the target detection part can be determined based on the position of the target detection part in the target feature map and converted by the law of reflection, so as to mark it.

It should be noted that, if the imaging result of the target detection part of the object to be detected 5 is not clear, but it is determined by judgment that the target detection part may be defective (for example, through human eye recognition judgment), the detection can be repeated according to the above process.

It should also be noted that the above detection is performed from one side (such as the left or right side) of the object 5 to be detected. In implementation, in order to be able to perform all-round detection of the object to be detected 5, one side can be detected according to the above method. Then, continue to use the same method to detect from the other side of the object 5 to be inspected, so as to detect whether the entire back of the object to be inspected 5 is damaged.

In the embodiment of the present application, the electronic device 1 controls the thermal excitation source 2 to continuously perform thermal excitation within the first time period. The thermal excitation source 2 injects thermal excitation onto the infrared mirror 3, and the infrared mirror 3 reflects the thermal excitation to the target detection part on the non-viewing area side of the object to be detected 5, so as to thermally excite the target detection part. The electronic device 1 controls the thermal excitation source 2 to stop the thermal excitation after the first time period, and controls the infrared thermal imaging device 4 to collect the thermal response information reflected by the infrared mirror 3 of the target detection part during the cooling process. The information determines the damage to the target detection site. In this way, the infrared reflector 3 is used to indirectly thermally excite the target detection part of the object to be detected 5, resulting in a temperature difference between the damaged part and the normal part of the object to be detected 5, so that the temperature difference is obvious enough to be imaged by infrared thermal imaging. The device 4 detects, so as to achieve the purpose of detecting the target detection part.

In addition, this method has the advantage of long-distance and large-area detection, and overcomes the shortcomings of limited application objects and low resolution of traditional passive infrared detection.

In addition, you can continue to use the above detection system to detect the front of the object 5 to be detected. It is not difficult to understand that since the front of the object to be detected 5 is a visible area, when using the above detection system for detection, it is not necessary to use infrared rays. Mirror 3. In implementation, the infrared thermal imaging device 4 can be directly facing the front of the object 5 to be detected, and the position and focal length can be adjusted to make the object 5 to be detected occupy as many pixels as possible, and at the same time obtain a clear imaging effect. The two thermal excitation sources 2 are placed behind the object to be detected 5 and are in front of the object to be detected 5 , and the positions of the two excitation sources do not block the viewing angle of the infrared thermal imaging device 4 . During detection, the electronic device 1 controls the thermal excitation source 2 to continuously perform thermal excitation on the front surface of the object 5 to be detected, and the duration may be the first duration, after which the thermal excitation source 2 stops thermal excitation. After the second period of time, the infrared thermal imaging device 4 collects the thermal response information released by the detection part on the front of the object to be detected 5 during the cooling process, and generates a corresponding infrared image according to the collected thermal response information. The electronic device 1 acquires the generated multiple infrared images, and then determines whether the detection part on the front of the object to be detected 5 is damaged based on the multiple infrared images. For details, refer to the above steps 205 to 207 , which will not be repeated here. In this way, all-round detection of the object 5 to be detected can be completed. According to the method provided by the embodiment of the present application, the detection of each surface of the object 5 to be detected can be completed with fewer detection times.

It should be understood that the sequence numbers of the steps in the above embodiments do not mean the execution sequence, and the execution sequence of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

FIG. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present application. As shown in FIG. 3 , the electronic device 1 of this embodiment includes: at least one processor 10 (only one is shown in FIG. 3 ), a memory 11 , and a memory 11 stored in the memory 11 and available at the at least one processor 10 The computer program 12 running on the processor 10 implements the steps in any of the above method embodiments when the processor 10 executes the computer program 12 .

The electronic device 1 may be a computing device such as a desktop computer, a notebook, a palmtop computer, and a cloud server. The electronic device may include, but is not limited to, a processor 10 and a memory 11 . Those skilled in the art can understand that FIG. 3 is only an example of the electronic device 1, and does not constitute a limitation to the electronic device 1, and may include more or less components than the one shown, or combine some components, or different components , for example, may also include input and output devices, network access devices, and the like.

The so-called processor 10 may be a CPU (Central Processing Unit, central processing unit), and the processor 10 may also be other general-purpose processors, DSP (Digital Signal Processor, digital signal processor), ASIC (Application Specific Integrated Circuit, dedicated integrated circuit), FPGA (Field-Programmable Gate Array, off-the-shelf programmable gate array) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.

In some embodiments, the memory 11 may be an internal storage unit of the electronic device 1 , such as a hard disk or a memory of the electronic device 1 . In other embodiments, the memory 11 may also be an external storage device of the electronic device 1, such as a plug-in hard disk equipped on the electronic device 1, an SMC (Smart Media Card, smart memory card), an SD ( Secure Digital, secure digital) card, flash memory card (Flash Card) and so on. Further, the memory 11 may also include both an internal storage unit of the electronic device 1 and an external storage device. The memory 11 is used to store an operating system, an application program, a boot loader (Boot Loader), data, and other programs, such as program codes of the computer program. The memory 11 can also be used to temporarily store data that has been output or is to be output.

It should be noted that the information exchange, execution process and other contents between the above-mentioned devices/units are based on the same concept as the method embodiments of the present application. For specific functions and technical effects, please refer to the method embodiments section. It is not repeated here.

Those skilled in the art can clearly understand that, for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned functions can be allocated to different functional units, Module completion, that is, dividing the internal structure of the device into different functional units or modules to complete all or part of the functions described above. Each functional unit and module in the embodiment may be integrated in one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit, and the above-mentioned integrated units may adopt hardware. It can also be realized in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing from each other, and are not used to limit the protection scope of the present application. For the specific working process of the units and modules in the above-mentioned system, reference may be made to the corresponding process in the foregoing method embodiments, which will not be repeated here.

The above-mentioned embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the above-mentioned embodiments, those of ordinary skill in the art should understand that: it can still be used for the above-mentioned implementations. The technical solutions described in the examples are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions in the embodiments of the application, and should be included in the within the scope of protection of this application.

Claims (10)

1. A detection system comprising an electronic device, a thermal excitation source, an infrared mirror and an infrared thermal imaging device, the infrared mirror being located on a non-viewing side of an object to be detected with a mirror surface facing the object to be detected;

the electronic equipment is used for controlling the thermal excitation source to continuously perform thermal excitation within a first time period;

the thermal excitation source for impinging the thermal excitation onto the infrared mirror;

the infrared reflector is used for reflecting the thermal excitation to a target detection part of the object to be detected so as to thermally excite the target detection part, wherein the target detection part is a detection part on the non-visual field side of the object to be detected;

the electronic device is further configured to control the infrared thermal imaging device to acquire thermal response information reflected by the infrared mirror back from the target detection portion in a cooling process after the first duration, where the thermal response information is used to determine a damage condition of the target detection portion.

2. The detection system of claim 1, wherein the infrared mirror has a width N times the width of the object to be detected and a height K times the height of the object to be detected, wherein N is greater than or equal to 5 and K is greater than or equal to 1.2.

3. The detection system according to claim 2, wherein a distance between the infrared reflecting mirror and the object to be detected is twice as large as a width of the object to be detected, a connecting line between the infrared thermal imaging device and a virtual image of the object to be detected forms an included angle of 45 degrees with the mirror surface, and a lens of the infrared thermal imaging device faces a position of the virtual image.

4. The detection system of any of claims 1-3, wherein the thermal excitation source for impinging the thermal excitation on the infrared mirror comprises:

the thermal excitation source is used for thermally exciting the position of a virtual image of the object to be detected, the thermal excitation is incident on the infrared reflecting mirror, and the position of the virtual image refers to the position of the virtual image of the object to be detected in the infrared reflecting mirror.

5. The detection system according to any one of claims 1 to 3, wherein the number of thermal excitation sources is 2, two thermal excitation sources are respectively located on two sides of the infrared thermal imaging device, and do not obstruct the field of view of the infrared thermal imaging device.

6. The inspection system of claim 1, wherein said electronics further configured to control said infrared thermal imaging device to collect thermal response information reflected back from said target inspection site via said infrared mirror during cooling after said first duration, comprises:

and the electronic equipment is further used for controlling the infrared thermal imaging equipment to start collecting thermal response information of the target detection part reflected by the infrared reflector in the cooling process after the first time length and a second time length.

7. The detection system of claim 1, wherein the electronic device is further configured to:

acquiring a plurality of infrared images, each of the plurality of infrared images being generated by an infrared thermal imaging device based on the thermal response information;

determining a target characteristic diagram through a Principal Component Analysis (PCA) algorithm based on the plurality of infrared images;

and determining the damage condition of the target detection part according to the target characteristic diagram.

8. The detection method is characterized by being applied to a detection system, wherein the detection system comprises an electronic device, a thermal excitation source, an infrared reflector and an infrared thermal imaging device, the infrared reflector is positioned on the non-visual field side of an object to be detected, and the mirror surface of the infrared reflector faces the object to be detected; the method comprises the following steps:

the electronic equipment controls the thermal excitation source to continuously perform thermal excitation within a first time period;

the thermal excitation source is configured to inject the thermal excitation onto the infrared mirror;

the infrared reflector reflects the thermal excitation to a target detection part of the object to be detected so as to thermally excite the target detection part, wherein the target detection part is a detection part on the non-visual field side of the object to be detected;

and after the first time, the electronic equipment controls the infrared thermal imaging equipment to acquire thermal response information reflected by the infrared reflector of the target detection part in the cooling process, wherein the thermal response information is used for determining the damage condition of the target detection part.

9. The method of claim 8, wherein the width of the infrared mirror is N times the width of the object to be sensed and the height of the infrared mirror is K times the height of the object to be sensed, wherein N is greater than or equal to 5 and K is greater than or equal to 1.2.

10. The method of claim 8 or 9, wherein the thermal excitation source is to impinge the thermal excitation on the infrared mirror, comprising:

the thermal excitation source thermally excites a virtual image position of the object to be detected, the thermal excitation is incident on the infrared reflecting mirror, and the virtual image position refers to the position of the virtual image of the object to be detected in the infrared reflecting mirror.

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