CN114574832A - Film forming apparatus and scaffold unit - Google Patents
Film forming apparatus and scaffold unit Download PDFInfo
- Publication number
- CN114574832A CN114574832A CN202111373132.5A CN202111373132A CN114574832A CN 114574832 A CN114574832 A CN 114574832A CN 202111373132 A CN202111373132 A CN 202111373132A CN 114574832 A CN114574832 A CN 114574832A
- Authority
- CN
- China
- Prior art keywords
- unit
- scaffold
- source unit
- film
- film formation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 230000008021 deposition Effects 0.000 claims abstract description 19
- 238000001514 detection method Methods 0.000 claims description 15
- 238000002360 preparation method Methods 0.000 claims description 4
- 238000012423 maintenance Methods 0.000 abstract description 20
- 238000000151 deposition Methods 0.000 abstract description 19
- 238000007740 vapor deposition Methods 0.000 description 140
- 239000010408 film Substances 0.000 description 63
- 238000012545 processing Methods 0.000 description 27
- 239000000463 material Substances 0.000 description 16
- 238000012546 transfer Methods 0.000 description 15
- 238000004891 communication Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 238000003860 storage Methods 0.000 description 8
- 229910019250 POS3 Inorganic materials 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A40/00—Adaptation technologies in agriculture, forestry, livestock or agroalimentary production
- Y02A40/10—Adaptation technologies in agriculture, forestry, livestock or agroalimentary production in agriculture
- Y02A40/25—Greenhouse technology, e.g. cooling systems therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a film forming apparatus and a scaffold unit which improve the work efficiency during maintenance. An inline film deposition apparatus for depositing a film on a substrate while conveying the substrate includes: a conveying unit for conveying the substrate; and a film formation source unit including a film formation source and movable between a first position below the conveyance unit and a second position laterally displaced from the first position. The film forming apparatus includes a scaffold unit that is movable together with the film forming source unit and includes a scaffold for accessing the film forming source unit. The scaffold is displaceable between a stored state in which the film formation source unit is stored and an expanded state in which the scaffold is expanded from the film formation source unit in a state in which the film formation source unit is located at the second position.
Description
Technical Field
The present invention relates to a film forming apparatus and a scaffold unit.
Background
Conventionally, an in-line apparatus for processing a substrate while conveying the substrate is known. Patent document 1 discloses the following: in the inline substrate processing apparatus, a plurality of processing units are arranged in a vertical direction, and the processing units arranged in the vertical direction are pulled out and maintained.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2018-93087
In the above-described conventional technique, a step-on platform or the like needs to be prepared when the processing unit is pulled out and maintenance is performed, and the work efficiency during maintenance may be reduced.
Disclosure of Invention
The invention provides a technique for improving the work efficiency during maintenance.
Means for solving the problems
According to one aspect of the present invention, there is provided a film deposition apparatus of an inline type for depositing a film on a substrate while conveying the substrate,
the film forming apparatus includes:
a conveying unit for conveying the substrate; and
a film formation source unit including a film formation source and movable between a first position below the conveyance unit and a second position laterally displaced from the first position,
it is characterized in that the preparation method is characterized in that,
the film forming apparatus includes a scaffold unit that is movable together with the film forming source unit and includes a scaffold for accessing the film forming source unit,
the scaffold is displaceable between a stored state in which the film formation source unit is stored in the film formation source unit and an expanded state in which the scaffold is expanded from the film formation source unit in a state in which the film formation source unit is located at the second position.
Further, according to another aspect of the present invention, there is provided a stage unit for an inline film deposition apparatus for depositing a film on a substrate while conveying the substrate,
the film forming apparatus includes:
a conveying unit for conveying the substrate; and
a film formation source unit including a film formation source and movable between a first position below the conveyance unit and a second position laterally displaced from the first position,
it is characterized in that the preparation method is characterized in that,
the scaffold unit includes a scaffold for accessing the film formation source unit,
the scaffold is displaceable between a stored state in which the film formation source unit is stored in the film formation source unit and an expanded state in which the scaffold is expanded from the film formation source unit in a state in which the film formation source unit is located at the second position.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, the work efficiency during maintenance can be improved.
Drawings
Fig. 1 is a front view schematically showing a film deposition apparatus according to an embodiment.
Fig. 2 is a side view of the film formation apparatus of fig. 1.
Fig. 3 is a view schematically showing the internal structure of the film formation apparatus of fig. 1.
Fig. 4 is a diagram illustrating a movement operation of the vapor deposition source unit by the moving unit.
Fig. 5 is a schematic perspective view showing the scaffold unit.
Fig. 6 is a schematic perspective view showing the scaffold unit.
Fig. 7 is a plan view schematically showing a positional relationship between the vapor deposition source unit and the scaffold unit.
Fig. 8(a) and (B) are perspective views showing the structure of the scaffold.
Fig. 9 is a diagram showing a configuration example of the operation unit and a detection unit described later.
Fig. 10 is a diagram showing an example of the hardware configuration of the film formation apparatus.
Fig. 11(a) and (B) are flowcharts showing an example of control by the control device.
Fig. 12 is a diagram showing a configuration example of a display screen of the display unit.
Description of reference numerals
1 film forming device, 2 conveying unit, 3 vapor deposition source unit, 5 scaffold unit, 51 scaffold.
Detailed Description
Hereinafter, embodiments will be described in detail with reference to the drawings. The following embodiments do not limit the invention according to the claims, and all combinations of the features described in the embodiments are not limited to the essential contents of the invention. Two or more of the plurality of features described in the embodiments may be combined as desired. The same or similar components are denoted by the same reference numerals, and redundant description thereof is omitted.
In the drawings, the X direction represents a substrate conveyance direction, the Y direction represents a substrate width direction, and the Z direction represents a vertical direction.
[ first embodiment ]
[ outline of film Forming apparatus ]
Fig. 1 is a front view schematically showing a film deposition apparatus 1 according to an embodiment. Fig. 2 is a side view of the film formation apparatus 1 of fig. 1. Fig. 3 is a view schematically showing the internal structure of the film formation apparatus 1 shown in fig. 1.
The film deposition apparatus 1 is an inline film deposition apparatus that performs vapor deposition on a substrate while conveying the substrate. The film forming apparatus 1 is used for manufacturing a display panel of an organic EL display device for a smart phone, for example, and a plurality of the film forming apparatuses can be arranged in a line to constitute a production line thereof.
In the present embodiment, the substrates held on the substrate holding tray 100 are sequentially conveyed to the film deposition apparatus 1, and the film deposition apparatus 1 performs vapor deposition of organic EL on the conveyed substrates. The substrate is held on the substrate holding tray 100 in a state of being overlapped with the mask in, for example, a step of being carried to the upstream of the film formation apparatus 1, and is carried to the film formation apparatus 1. Therefore, in the film forming apparatus 1, a thin film of the vapor deposition material of a predetermined pattern is formed on the substrate using the mask. As a material of the substrate to be vapor-deposited in the film formation device 1, glass, resin, metal, and the like can be appropriately selected, and a material in which a resin layer such as polyimide is formed on glass is preferably used. The vapor deposition material is an organic material, an inorganic material (metal, metal oxide, or the like), or the like. The film formation apparatus 1 is applicable to a manufacturing apparatus for manufacturing electronic devices such as display devices (flat panel displays), thin film solar cells, and organic photoelectric conversion elements (organic thin film imaging elements), optical members, and the like, and particularly applicable to a manufacturing apparatus for manufacturing organic EL panels. In the following description, an example in which the film forming apparatus 1 forms a film on a substrate by vacuum deposition is described, but the form of the film forming method is not limited thereto, and various film forming methods such as sputtering and CVD can be applied.
The film formation apparatus 1 includes a conveyance unit 2, a vapor deposition source unit 3, an adhesion prevention plate 6, a movement unit 7, and a frame portion 101.
The frame portion 101 is provided to support components such as the transport unit 2 of the film formation apparatus 1. In the example of fig. 1, the frame portion 101 includes a column and a beam, and supports the conveying unit 2 and the vacuum pump 102. Further, a crane for work, a passage for maintenance by an operator, and the like may be provided in the frame portion 101.
The transfer unit 2 transfers the substrate. In the present embodiment, the conveyance unit 2 conveys the substrate by conveying the substrate holding tray 100 holding the substrate. The conveyance unit 2 includes a conveyance chamber 21 and a conveyance roller 22.
The transfer chamber 21 is a box-shaped chamber capable of keeping the inside of the chamber vacuum. The internal space 210 of the transfer chamber 21 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen. In the present embodiment, the transfer chamber 21 is connected to a vacuum pump 102. In the present specification, "vacuum" refers to a state filled with a gas having a pressure lower than the atmospheric pressure, in other words, a reduced pressure state.
The transfer chamber 21 is formed with a carry-in opening 211 for carrying in the substrate holding tray 100 and a carry-out opening 212 for carrying out the substrate holding tray 100. Further, a communication opening 213 for communicating the internal space 210 with the internal space 310 of the vapor deposition source chamber 31 is formed in the lower portion of the transfer chamber 21. Note that, gate valves and the like, not shown, may be provided in the carry-in opening 211 and the carry-out opening 212 in order to keep the internal space 210 in a vacuum state.
The conveyance roller 22 conveys the substrate holding tray 100 holding the substrate. The conveying roller 22 is provided in the internal space 210 of the conveying chamber 21. The conveying roller 22 is a cylindrical member formed of a metal material and rotatably supported, for example. The conveying roller 22 is driven by, for example, an electric motor, not shown, provided outside the conveying chamber 21.
In the present embodiment, a reinforcing rib 23 is provided at the lower portion of the conveyance unit 2.
The vapor deposition source unit 3 is a unit (film formation source unit) having a vapor deposition source 32 (film formation source) that discharges a vapor deposition substance onto a substrate. In the present embodiment, 3 vapor deposition source units 3 are arranged in the substrate conveyance direction (X direction) with respect to 1 conveyance unit 2. However, the number of the vapor deposition source units 3 may be set as appropriate, and may be 2 or less or 4 or more. The vapor deposition source unit 3 is positioned below the transfer unit 2 and connected to a lower portion of the transfer unit 2 when performing the vapor deposition process. The evaporation source unit 3 includes an evaporation source chamber 31 and an evaporation source 32.
The vapor deposition source chamber 31 is a box-shaped chamber capable of maintaining the inside of the chamber in a vacuum state. The internal space 310 of the vapor deposition source chamber 31 can communicate with the internal space 210 of the transfer chamber 21 through a communication opening 311 provided in the upper portion of the transfer chamber 21. The internal space 310 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas during operation, as in the internal space 210.
The vapor deposition source 32 emits a vapor deposition material to form a film on the substrate conveyed by the conveying unit 2. For example, the vapor deposition source 32 includes a plurality of nozzles (not shown) arranged in the Y direction, and discharges the vapor deposition material from each nozzle. The vapor deposition source 32 includes, for example, a storage section for storing a vapor deposition material and a heater (both not shown) for heating the vapor deposition material stored in the storage section. The vapor deposition material stored in the storage section is heated by the heater and vaporized, and the vapor deposition material is discharged from the vapor deposition source 32.
The vapor deposition source unit 3 may include a shutter that shields the vapor deposition source 32 when the vapor deposition source 32 is not used, an evaporation rate monitor that monitors the amount of evaporation of the vapor deposition material from the vapor deposition source 32, and the like (both not shown).
In the present embodiment, specifically, as shown in fig. 4, the vapor deposition source 32 is configured to be movable by the moving means 7.
The adhesion preventing plate 6 prevents the vapor deposition material discharged from the vapor deposition source 32 from adhering to the inner wall of the vapor deposition source chamber 31 or the transfer chamber 21. For example, the adhesion preventing plate 6 is supported by the vapor deposition source chamber 31. In the present embodiment, the adhesion preventing plate 6 is located in a range from the internal space 310 to the internal space 210 so as to cover the vapor deposition source 32, and has an opening formed in an upper portion thereof. With this configuration, a part of the vapor deposition material adheres to the substrate through the opening, while the remaining vapor deposition material adheres to the adhesion preventing plate 6. In this way, the adhesion preventing plate 6 allows the deposition material to adhere to the substrate and prevents the deposition material from adhering to the inner wall of the deposition source chamber 31 or the transfer chamber 21.
In the present embodiment, the adhesion preventing plate 6 is provided so as to be movable up and down relative to the vapor deposition source chamber 31. More specifically, the adhesion preventing plate 6 includes an upper portion 61 and a lower portion 62, and the upper portion 61 is provided to be movable relative to the vapor deposition source chamber 31 in the up-down direction. This can reduce the amount of lowering of the vapor deposition source unit 3 required to avoid interference between the transport unit 2 and the adhesion preventing plate 6 when the vapor deposition source unit 3 is moved in the lateral direction by the moving unit 7.
Note that an adhesion preventing plate may be provided in the transfer chamber 21 or the vapor deposition source chamber 31 in addition to the adhesion preventing plate 6. For example, an adhesion preventing plate may be provided on the top surface, the side surface, or the like of the inside of the transfer chamber 21.
The moving unit 7 is a unit that moves the vapor deposition source unit 3 with respect to the conveying unit 2. In the present embodiment, the moving unit 7 is provided below the vapor deposition source unit 3, and supports the vapor deposition source unit 3 to move the vapor deposition source unit 3 in the vertical direction (Z direction) or the lateral direction (Y direction). The moving unit 7 includes a lateral moving portion 71 and an elevating portion 72.
The horizontal movement section 71 moves the vapor deposition source unit 3 in the horizontal direction (Y direction). In the present embodiment, the lateral movement section 71 moves the vapor deposition source unit 3 in the width direction (Y direction) of the substrate, which intersects the substrate conveyance direction (X direction). The horizontal movement section 71 includes a guide section 711 provided on the floor surface and a drive section 712 for moving the vapor deposition source unit 3 along the guide section 711. As the driving unit 712, a known technique can be appropriately used, but for example, a driving wheel that can travel on a track as the guide unit 711 may be rotated by a motor or the like.
The elevating section 72 elevates the vapor deposition source unit 3. In the present embodiment, the elevating section 72 elevates the vapor deposition source unit 3 in the vertical direction (Z direction). The elevating section 72 includes a vapor deposition source unit supporting section 721 that supports the vapor deposition source unit 3, and a driving section 722 that elevates the vapor deposition source unit supporting section 721. As the driving unit 722, a known technique can be used, but the vapor deposition source unit supporting unit 721 may be moved up and down by an electric cylinder or the like, for example.
Fig. 4 is a diagram illustrating a movement operation of the vapor deposition source unit 3 by the movement unit 7.
The state ST1 is a state in which the vapor deposition source unit 3 is located at the connection position POS1 connected to the transport unit 2. That is, the state ST1 is a state when the film deposition apparatus 1 performs vapor deposition on a substrate. In state ST1, the vapor deposition source unit 3 is positioned below the transport unit 2, and the lower portion of the transport unit 2 is connected to the upper portion of the vapor deposition source unit 3.
The state ST2 is a state in which the vapor deposition source unit 3 has moved from the connection position POS1 to the connection release position POS2 therebelow. The vapor deposition source unit 3 can be moved in the-Z direction from the connection position POS1 to the disconnection position POS2 by the elevating unit 72 of the moving unit 7.
The state ST3 is a state in which the vapor deposition source unit 3 has been moved in the lateral direction from the disconnected position POS 2. In the state ST3, the vapor deposition source unit 3 is located at the maintenance position POS3 where maintenance of the transport unit 2 or the vapor deposition source unit 3 is performed. For example, when performing maintenance of the transport unit 2, an operator can access the interior of the transport chamber 21 from a space below the transport unit 2 generated by the vapor deposition source unit 3 moving in the lateral direction. For example, when performing maintenance of the vapor deposition source unit 3, the operator can access the interior of the vapor deposition source chamber 31 from the side surface in the longitudinal direction of the vapor deposition source chamber 31 by moving the target vapor deposition source unit 3 to the maintenance position POS 3.
In the present embodiment, the moving unit 7 is provided for each of the plurality of vapor deposition source units 3. Therefore, the film formation device 1 of the present embodiment can move the plurality of vapor deposition source units 3 independently from each other. Further, the plurality of vapor deposition source units 3 may be moved together in synchronization with the plurality of moving units 7. Further, the number of the moving units 7 may be smaller than that of the vapor deposition source units 3, and the plurality of vapor deposition source units 3 may be moved by 1 moving unit 7.
[ Structure of scaffold Unit ]
(summary)
The film forming apparatus 1 includes a scaffold unit 5. Fig. 5 and 6 are schematic perspective views showing the scaffold unit 5, fig. 5 showing a state where the scaffold 51 is expanded, and fig. 6 showing a state where the scaffold 51 is stored.
The scaffold unit 5 is a unit for accessing the vapor deposition source unit 3. The scaffold unit 5 includes the scaffold 51, and the stored scaffold 51 can be deployed so as not to hinder the movement of the vapor deposition source unit 3 in a state where the vapor deposition source unit 3 is located at the maintenance position POS 3. The scaffold unit 5 can make an operator easily access the inside of the vapor deposition source chamber 31 when the scaffold 51 is expanded to maintain the vapor deposition source unit 3. In the present embodiment, it is necessary to access the inside of the vapor deposition source chamber 31 from the communication opening 311 provided in the upper portion of the vapor deposition source chamber 31. Therefore, it may be difficult for an operator to access the inside of the vapor deposition source chamber 31 while standing on the floor. When an operator stands on the scaffold 51 disposed above the floor, the operator can easily access the inside of the vapor deposition source chamber 31 through the communication opening 311 in the upper portion of the vapor deposition source chamber 31.
The scaffold unit 5 is disposed along both side surfaces in the longitudinal direction of the vapor deposition source unit 3. Further, the scaffold unit 5 is disposed over substantially the entire area of both side surfaces in the longitudinal direction of the vapor deposition source unit 3. By disposing the scaffold unit 5 on the side surface in the longitudinal direction of the vapor deposition source unit 3, the worker can more easily access the central portion inside the vapor deposition source chamber 31. Further, the scaffold unit 5 may be disposed only on one side surface in the longitudinal direction of the vapor deposition source unit 3.
In the present embodiment, the vapor deposition source unit 3 is moved between the disconnection position POS2 and the maintenance position POS3 along the longitudinal direction (Y direction) of the vapor deposition source unit 3. Therefore, the scaffold unit 5 is provided on the side surface of the vapor deposition source unit 3 parallel to the moving direction between the disconnection position POS2 and the maintenance position POS3 so as to be able to unfold and store the scaffold 51.
Fig. 7 is a plan view schematically showing the positional relationship between the vapor deposition source unit 3 and the scaffold unit 5. In the present embodiment, when the vapor deposition source unit 3 is located at the connection position POS1 or the disconnection position POS2 (see the upper and lower vapor deposition source units 3 in fig. 7), the scaffold unit 5 is set in a stored state. Therefore, when the vapor deposition source unit 3 moves, the scaffold unit 5 does not interfere with the adjacent vapor deposition source unit 3. When the vapor deposition source unit 3 is located at the maintenance position POS3 (see the central vapor deposition source unit 3 in fig. 7), the scaffold unit 5 can be expanded. In this case, the scaffold unit 5 is disposed so as to partially overlap the adjacent vapor deposition source unit 3 in the X direction. The scaffold unit 5 is deployed at the maintenance position POS3 to a position partially overlapping the adjacent vapor deposition source unit 3 in the X direction, and thus a large space can be secured for the scaffold 51 in the X direction. From another viewpoint, since the scaffold unit 5 is stored when the vapor deposition source unit 3 moves, etc., the scaffold 51 can be provided along the side surface of the vapor deposition source unit 3 and the vapor deposition source units 3 can be close to each other, and the film formation device 1 does not increase in size in the substrate conveyance direction (X direction).
(scaffolds)
Fig. 8(a) and 8(B) are perspective views showing the structure of the scaffold 51, with fig. 8(a) showing a state in which the scaffold 51 is expanded and fig. 8(B) showing a state in which the scaffold is stored. Fig. 8(a) and 8(B) show a part of the scaffold 51 necessary for explaining the structure of the scaffold 51.
The scaffold 51 includes a deck 511 and a support portion 512 that supports the deck 511 so as to be expandable. In the present embodiment, a plurality of the platens 511 and the corresponding support portions 512 are provided, and a connecting plate 513 is provided between the adjacent 2 platens 511 so as to connect them.
The structure of the support portion 512 will be specifically described. A fixing table 5120 is provided on a side surface of the vapor deposition source unit 3. A fixed-stage-side hinge 5121 is provided on the fixed stage 5120. The fixed stage-side hinge 5121 supports the shaft 5122 to be rotatable. A platen-side hinge 5123 is mounted on the shaft 5122. Deck-side hinge 5123 supports deck 511 from the back of deck 511. In such a structure, when the shaft 5122 rotates, the platen 511 is displaced via the platen-side hinge 5123.
In addition, the support portion 512 includes a movable bracket 5124 and a linear guide 5125. The carriage 5124 supports the platen 511. The carriage 5124 supports the platen 511 from the back surface of the platen 511 at one end, and is guided by a linear guide 5125 at the other end so as to be movable in the up-down direction. In the present embodiment, the scaffold unit 5 includes a plurality of the platforms 511 and the connecting plate 513 connecting them, but a moving space for an operator may be formed by a single platform 511.
(operation section)
The scaffold unit 5 includes an operation portion 52 operable to displace the scaffold 51 between the stored state and the expanded state. Fig. 9 is a diagram showing a configuration example of the operation unit 52 and the detection unit 103 described later. In the present embodiment, the operation unit 52 includes a handle 521 that can be rotated by an operator, and a transmission unit 522 that transmits the rotation of the handle 521 to the shaft 5122. When the worker operates the handle 521, the shaft 5122 rotates via the transmission unit 522, and thereby the table 511 is displaced.
In the present embodiment, the operator manually opens the scaffold 51 by operating the operation unit 52, but the operation unit 52 may be a switch or the like that receives an instruction to open the scaffold 51, for example. Further, as the switch is pressed, the shaft 5122 may be rotated by an electric motor or the like, and the platen 511 may be displaced. The transmission unit 522 may include a speed reducer device for reducing the speed of the rotation input to the handle 521.
[ detection Unit ]
The film deposition apparatus 1 includes a detection unit 103 that detects the state in which the hand frame 51 is unfolded. In the present embodiment, the detection unit 103 is an optical sensor, and is provided to output different detection results when the scaffold 51 is deployed and when it is stored. As an example, the detection unit 103 may be configured such that the light-emitting portion and the light-receiving portion are integrally provided, and when the scaffold 51 is housed, the light from the light-emitting portion is reflected by the scaffold 51 and enters the light-receiving portion. The form of the detection means 103 is not limited, and for example, the detection means 103 may mechanically detect the rotation of the scaffold 51.
[ hardware configuration ]
Fig. 10 is a diagram showing a configuration example of hardware of the film formation apparatus 1. Fig. 10 is a diagram mainly illustrating a structure relating to the features of the present embodiment, and illustrates a part of the structure by omitting it.
The controller 14 controls the entire film deposition apparatus 1. The control device 14 includes a processing unit 141, a storage unit 142, an input/output interface (I/O)143, and a communication unit 144. The processing unit 141 is a processor represented by a CPU, and executes a program stored in the storage unit 142 to control the film deposition apparatus 1. The storage unit 142 is a storage device such as a ROM, a RAM, and an HDD, and stores various control information in addition to programs executed by the processing unit 141. The I/O143 is an interface for transmitting and receiving signals between the processing unit 141 and the respective components of the film formation apparatus 1. The communication unit 144 is a communication device that communicates with a host device (host computer) H or the like via a communication line, and the processing unit 141 receives information from the host device H or transmits information to the host device H via the communication unit 144. All or a part of the control device 14 and the higher-level device H may be configured by a PLC, an ASIC, or an FPGA.
In the present embodiment, the detection unit 103 includes a display unit 104 and an input unit 105. The display unit 104 displays various information. In the present embodiment, the display unit 104 displays a screen for notifying that the movement of the moving means 7 is restricted, based on an instruction from the control device 14. The input unit 105 is, for example, a hard key, a touch panel, a pointing device, or the like, and receives an instruction from an operator to move the vapor deposition source unit 3 by the moving unit 7.
[ control examples ]
Fig. 11(a) and 11(B) are flowcharts showing an example of control by the control device 14. These flows are realized, for example, by the processing unit 141 reading out a program stored in the ROM of the storage unit 142 to the RAM and executing the program.
Fig. 11(a) is a flow for controlling the movement of the vapor deposition source unit 3 by the moving unit 7 according to the state of the scaffold 51. As shown in fig. 7, when the vapor deposition source unit 3 is to be moved from the maintenance position POS3 to the disconnection position POS2 in a state where the scaffold 51 is unfolded, the scaffold 51 may interfere with the adjacent vapor deposition source unit 3. Therefore, in the present embodiment, the following control is performed to limit the movement by the moving means 7 when the scaffold 51 is expanded. This flow is executed when the vapor deposition source unit 3 is located at the maintenance position POS 3.
In step S101 (hereinafter, abbreviated as S101, and the same applies to other steps), the processing unit 141 acquires a sensor value. More specifically, the processing unit 141 acquires the detection result of the detecting unit 103 as a sensor value.
In S102, the processing unit 141 checks whether the scaffold 51 is in the expanded state based on the detection result of the detection unit 103, and proceeds to S103 if the scaffold 51 is in the expanded state (yes), and proceeds to S104 if the scaffold 51 is in the stored state (no).
In S103, the processing section 141 restricts the movement of the vapor deposition source unit 3 by the moving unit 7. For example, even if the input unit 105 receives an instruction to move the vapor deposition source unit 3, the processing section 141 does not execute the movement of the vapor deposition source unit 3 by the movement unit 7. Alternatively, when the vapor deposition source unit 3 is manually movable, a lock mechanism or the like that can physically lock the movement of the vapor deposition source unit 3 may be provided in the film forming apparatus 1, and the processing section 141 may control the lock mechanism to restrict the movement of the vapor deposition source unit 3. Note that this flow is periodically executed, and when the movement of the vapor deposition source unit 3 has been restricted in the control cycle before the last time, the processing section 141 continues the restricted state.
In S104, the processing section 141 releases the restriction on the movement of the vapor deposition source unit 3. For example, when the input unit 105 receives an instruction to move the vapor deposition source unit 3 after the restriction is released, the processing section 141 executes the movement of the vapor deposition source unit 3 by the moving unit 7. Alternatively, when the movement of the vapor deposition source unit 3 is physically restricted by a lock mechanism or the like, the restriction of the movement of the vapor deposition source unit 3 may be released by controlling the lock mechanism. Note that this flow is periodically executed, and when the restriction on the movement of the vapor deposition source unit 3 has been released in the previous control cycle, the processing section 141 continues the released state.
According to this flow, since the movement of the vapor deposition source unit 3 is restricted according to the state of the scaffold 51, the scaffold 51 does not contact with a surrounding object or the like.
Fig. 11(B) is a flow for notifying an operator of the restriction of the movement of the vapor deposition source unit 3. This flow is executed when the vapor deposition source unit 3 is located at the maintenance position POS 3.
In S201, the processing section 141 checks whether the input unit 105 has received an instruction to move the vapor deposition source unit 3, and if it has received the instruction, the flow proceeds to S202, and if it has not received the instruction, the flow ends.
S202 is the same as S101. In S203, the processing unit 141 checks whether or not the scaffold 51 is in the stored state, and proceeds to S204 if the scaffold 51 is in the stored state (yes), or proceeds to S205 if the scaffold 51 is in the expanded state (no).
In S204, the processing section 141 moves the vapor deposition source unit 3. Specifically, the vapor deposition source unit 3 is moved from the maintenance position POS3 to the disconnection position POS2 by the moving unit 7.
In S205, the processing unit 141 notifies the operator. For example, the processing unit 141 notifies the operator of the restriction of the movement of the vapor deposition source unit 3 by causing the display unit 104 to display the fact that the movement of the vapor deposition source unit 3 is restricted. Fig. 12 is a diagram showing a configuration example of the display screen 104a of the display unit 104.
According to this flow, when an operator wants to move the vapor deposition source unit 3 and the movement of the vapor deposition source unit 3 is restricted, the operator is notified that the movement of the vapor deposition source unit 3 is restricted. Therefore, the operator can recognize that the movement of the vapor deposition source unit 3 is restricted. The processing unit 141 may notify the operator of the restriction of the movement of the vapor deposition source unit 3 by sound using a speaker or the like.
The present invention is not limited to the above-described embodiments, and various modifications and changes can be made within the scope of the present invention.
Claims (10)
1. A film forming apparatus of an in-line type for forming a film on a substrate while the substrate is being conveyed,
the film forming apparatus includes:
a conveying unit for conveying the substrate; and
a film formation source unit including a film formation source and movable between a first position below the conveyance unit and a second position laterally displaced from the first position,
it is characterized in that the preparation method is characterized in that,
the film forming apparatus includes a scaffold unit that is movable together with the film forming source unit and includes a scaffold for accessing the film forming source unit,
the scaffold is displaceable between a stored state in which the film formation source unit is stored in the film formation source unit and an expanded state in which the scaffold is expanded from the film formation source unit in a state in which the film formation source unit is located at the second position.
2. The film forming apparatus according to claim 1,
the scaffold unit includes a deck and a support portion that supports the deck so as to be expandable as the scaffold.
3. The film forming apparatus according to claim 1 or 2,
the scaffold unit includes an operation portion operable to displace the scaffold between the stowed state and the deployed state.
4. The film forming apparatus according to claim 1,
the film deposition apparatus further includes a detection unit for detecting that the scaffold is in the deployed state.
5. The film forming apparatus according to claim 4,
the film deposition apparatus further includes a limiting member that limits movement of the film deposition source unit from the second position to the first position when the detection member detects that the scaffold is in the deployed state.
6. The film forming apparatus according to claim 5,
the film forming apparatus further includes a notification member that notifies an operator that the movement of the film forming source unit is restricted by the restriction member.
7. The film forming apparatus according to claim 1 or 2,
the scaffold unit deploys the scaffold on a side of the film formation source unit parallel to a moving direction between the first position and the second position.
8. The film forming apparatus according to claim 7,
a plurality of film formation source units are arranged in a crossing direction crossing a moving direction of the film formation source units,
the scaffold in the deployed state overlaps with the film formation source unit adjacent to the film formation source unit provided with the scaffold in the crossing direction.
9. The film forming apparatus according to claim 1 or 2,
the scaffold unit unfolds the scaffold at a side of the film formation source unit in a longitudinal direction.
10. A scaffold unit for an in-line film forming apparatus for forming a film on a substrate while conveying the substrate,
the film forming apparatus includes:
a conveying unit for conveying the substrate; and
a film formation source unit including a film formation source and movable between a first position below the conveyance unit and a second position laterally displaced from the first position,
it is characterized in that the preparation method is characterized in that,
the scaffold unit includes a scaffold for accessing the film formation source unit,
the scaffold is displaceable between a stored state in which the film formation source unit is stored and an expanded state in which the scaffold is expanded from the film formation source unit in a state in which the film formation source unit is located at the second position.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020198681A JP7177130B2 (en) | 2020-11-30 | 2020-11-30 | Film deposition equipment and scaffolding unit |
| JP2020-198681 | 2020-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114574832A true CN114574832A (en) | 2022-06-03 |
Family
ID=81770334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111373132.5A Pending CN114574832A (en) | 2020-11-30 | 2021-11-19 | Film forming apparatus and scaffold unit |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7177130B2 (en) |
| KR (1) | KR102690286B1 (en) |
| CN (1) | CN114574832A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003081560A (en) * | 2001-09-11 | 2003-03-19 | Toshiba Elevator Co Ltd | Elevator |
| CN201065753Y (en) * | 2007-07-03 | 2008-05-28 | 魏峰 | Folding type pumping machine highrise operation safety platform |
| TW201346050A (en) * | 2012-02-06 | 2013-11-16 | 東京威力科創股份有限公司 | Film forming device and film forming method |
| JP2016014174A (en) * | 2014-07-02 | 2016-01-28 | 株式会社アルバック | Film deposition apparatus, and maintenance method of film deposition apparatus |
| CN108689356A (en) * | 2018-06-14 | 2018-10-23 | 中国空气动力研究与发展中心超高速空气动力研究所 | A kind of multi-link structure with self-locking function |
| CN109217175A (en) * | 2018-10-25 | 2019-01-15 | 河北晋昌电力工程有限公司 | A kind of stage apparatus |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06296433A (en) * | 1993-04-13 | 1994-10-25 | Kubota Corp | Grain storage house equipped with housing type footstool |
| US20030010288A1 (en) | 2001-02-08 | 2003-01-16 | Shunpei Yamazaki | Film formation apparatus and film formation method |
| JP4557710B2 (en) | 2004-12-24 | 2010-10-06 | 株式会社ユーテック | Film forming apparatus and vapor deposition apparatus |
| JP4800149B2 (en) * | 2006-08-17 | 2011-10-26 | 東京エレクトロン株式会社 | Semiconductor manufacturing equipment |
| JP5350692B2 (en) * | 2008-07-03 | 2013-11-27 | 東京エレクトロン株式会社 | Substrate processing apparatus and support frame used therefor |
| JP5449878B2 (en) * | 2009-06-19 | 2014-03-19 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP2011107521A (en) | 2009-11-19 | 2011-06-02 | Miyagi Nikon Precision Co Ltd | Maintenance method of conveyance device |
| JP5281632B2 (en) * | 2010-12-06 | 2013-09-04 | 日本電信電話株式会社 | Multi-view image encoding method, multi-view image decoding method, multi-view image encoding device, multi-view image decoding device, and programs thereof |
| KR20130069037A (en) | 2011-12-16 | 2013-06-26 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus |
| JP2013162068A (en) | 2012-02-08 | 2013-08-19 | Tokyo Electron Ltd | Substrate processing apparatus |
| JP2018093087A (en) | 2016-12-05 | 2018-06-14 | 東京エレクトロン株式会社 | Substrate processing apparatus |
| KR102103545B1 (en) | 2018-11-02 | 2020-04-22 | 세메스 주식회사 | Footing board unit and substrate treatment apparatus including the same |
| JP7259281B2 (en) * | 2018-11-21 | 2023-04-18 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD |
| KR102072928B1 (en) | 2018-12-27 | 2020-02-03 | 캐논 톡키 가부시키가이샤 | Transfer apparatus and film deposition system including the same |
-
2020
- 2020-11-30 JP JP2020198681A patent/JP7177130B2/en active Active
-
2021
- 2021-11-18 KR KR1020210159314A patent/KR102690286B1/en active Active
- 2021-11-19 CN CN202111373132.5A patent/CN114574832A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003081560A (en) * | 2001-09-11 | 2003-03-19 | Toshiba Elevator Co Ltd | Elevator |
| CN201065753Y (en) * | 2007-07-03 | 2008-05-28 | 魏峰 | Folding type pumping machine highrise operation safety platform |
| TW201346050A (en) * | 2012-02-06 | 2013-11-16 | 東京威力科創股份有限公司 | Film forming device and film forming method |
| JP2016014174A (en) * | 2014-07-02 | 2016-01-28 | 株式会社アルバック | Film deposition apparatus, and maintenance method of film deposition apparatus |
| CN108689356A (en) * | 2018-06-14 | 2018-10-23 | 中国空气动力研究与发展中心超高速空气动力研究所 | A kind of multi-link structure with self-locking function |
| CN109217175A (en) * | 2018-10-25 | 2019-01-15 | 河北晋昌电力工程有限公司 | A kind of stage apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102690286B1 (en) | 2024-07-30 |
| KR20220076322A (en) | 2022-06-08 |
| JP7177130B2 (en) | 2022-11-22 |
| JP2022086584A (en) | 2022-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8740205B2 (en) | Conveyor and deposition apparatus, and maintenance method thereof | |
| CN102177003B (en) | Substrate transfer robot and system | |
| KR101090590B1 (en) | Apparatus for manufacturing organic el device, and apparatus for forming film | |
| US20100272550A1 (en) | Substrate holding mechanism, substrate delivering/receiving mechanism, and substrate processing apparatus | |
| US8543235B2 (en) | Method of controlling transfer robot | |
| KR101502130B1 (en) | A transfer apparatus, a transfer chamber in which the transfer apparatus is installed, and a vacuum processing system | |
| JP2006306504A (en) | Cassette storage and processing plate processing equipment | |
| CN114574832A (en) | Film forming apparatus and scaffold unit | |
| JP2009231626A (en) | Substrate treatment device | |
| JP5730322B2 (en) | Vapor deposition apparatus and vapor deposition method | |
| KR101737816B1 (en) | Apparatus for transferring glass | |
| KR20110088367A (en) | Substrate processing apparatus and substrate processing method | |
| KR101105416B1 (en) | Substrate processing apparatus | |
| CN114574815B (en) | Film forming apparatus | |
| KR100660780B1 (en) | Substrate transfer device for flat panel display | |
| KR102066169B1 (en) | Article transport facility | |
| JP2022087015A (en) | Film forming equipment | |
| KR20100001557A (en) | Substrate transfering apparatus | |
| JP3476691B2 (en) | Substrate reversing device and substrate storage device | |
| CN114574816B (en) | Film forming apparatus and scaffold unit | |
| KR101742020B1 (en) | Vertical type glass transferring system | |
| KR101857966B1 (en) | Apparatus for tilting glass | |
| JP2022087014A (en) | Deposition apparatus and scaffolding unit | |
| JP2006267802A (en) | Exposure apparatus and exposure method | |
| KR101863190B1 (en) | Substrate treating apparatus and substrate treating method using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |