CN114566580A - LED support, manufacturing method of LED support and LED light-emitting device - Google Patents

Abstract

The invention is suitable for the technical field of LED production, and provides an LED bracket, a manufacturing method of the LED bracket and an LED light-emitting device. The LED support comprises a metal substrate and a packaging body, wherein the metal substrate is at least partially embedded in the packaging body and comprises a plate body and a footing arranged on the periphery of the plate body, the back surface of the footing is provided with an exposed area and a fillet area and is provided with a notch, the notch is at least arranged in the fillet area, the packaging body comprises a main body part and a fillet part, the main body part is formed on the front surface of the metal substrate and covers the edge of the plate body, and the fillet part is formed in the fillet area and is integrally connected with the main body part; the base foot is exposed on the packaging body corresponding to the exposed area, and the base foot is provided with a strip embedding part corresponding to the strip embedding area. The LED support, the manufacturing method of the LED support and the LED light-emitting device increase the air tightness of the support, have good use effect, reduce the stress transmitted to plastic in the cutting process, reduce the fracture risk, improve the production yield and facilitate the reduction of the cost.

Description

An LED bracket, a manufacturing method of an LED bracket, and an LED light-emitting device

technical field

The invention belongs to the technical field of LED production, and in particular relates to an LED bracket, a manufacturing method of the LED bracket and an LED lighting device.

Background technique

The current LED light-emitting device includes an LED bracket, and the bracket includes a package body and a metal substrate combined with the package body. The structure of the cut LED bracket used is that there are plastics on all sides of the bracket (that is, one of the materials forming the package body). ) wrapping, the metal materials of the metal substrate leaking from the four sides are all covered with plastic, this structure makes the usage of plastic bead high and increases the production cost, and the heat dissipation point is limited to the bottom pad, and the heat dissipation path is limited. In addition, when the bracket is cut, at least a part of the metal substrate and the package body will be cut by the cutter at the same time, so that the part of the metal substrate exposed on the cutting surface is coplanar with the outer side surface of the package body. The force feedback of the cutting tool is inconsistent. The stress generated by the metal substrate under the action of the tool during cutting may be transmitted to the plastic, which may cause the bracket to crack or affect the air tightness of the metal substrate and the package body, and the use effect is not good.

SUMMARY OF THE INVENTION

The purpose of the present invention is to overcome the above-mentioned deficiencies of the prior art, and to provide an LED bracket, a manufacturing method of the LED bracket, and an LED light-emitting device, which have good use effect and low production cost.

The technical scheme of the present invention is as follows: an LED bracket includes a metal substrate and a package body, the metal substrate is at least partially embedded in the package body, and the metal substrate includes a plate body and a footing arranged on the periphery of the plate body, The backside of the base has a bare area and a fillet area and is provided with a notch, the notch is at least set in the fillet area, the package body includes a main body part and a fillet part, and the main body part is formed on the The front surface of the metal substrate is covered to the edge of the board body, the fillet portion is formed in the fillet area and is integrally connected to the main body portion; the footing is exposed to the exposed area corresponding to the exposed area. In the package body, the base has the fillet portion corresponding to the fillet area.

Specifically, both ends of the molding portion are integrally formed with the main body portion at both sides of the base.

Specifically, the projection of the metal substrate toward the bottom surface includes a central area and a footing area, the footing area includes a bare area corresponding to the bare area and a filling area corresponding to the filling area, and the The projection of the molding portion toward the bottom surface is a molding region, and the central region and the exposed region are separated by the molding region.

Specifically, the notch is provided in the exposed area and the fillet area at the same time, and the exposed area and the fillet area are flush or stepped, or the notch is only provided on the fillet area. strip area, and the exposed area is flush with the bottom surface of the metal substrate.

Specifically, the outer peripheral plane shape of the package body is a rectangular shape with notches at four corners, the exposed areas of the base feet are exposed at the notches, and the center of the package body is provided with a light-emitting body mounting hole; the metal substrate It includes two sub-substrates that are relatively separated from each other, each sub-substrate is provided with two said base feet, and each base is set on the side of the two sub-substrates away from each other; The projection on the direction, the outer surface of the base and the outer surface of the package body do not have overlapping parts.

The present invention also provides a method for manufacturing an LED bracket, which is used to manufacture the above-mentioned LED bracket, comprising the following steps:

A substrate frame of the metal substrate with footings and a plate body is prepared on a whole metal plate by a stamping process or an etching process, and the substrate frame includes an outer frame and a plurality of said metal substrates arranged in an array inside the outer frame. A metal substrate, wherein the adjacent footings between the metal substrates are integrally formed and connected, and the plurality of metal substrates arranged in the array are connected to the outer frame through the footings, except for the metal substrate and the outer frame. The area outside the area of the outer frame is the hollow part;

The package body is molded on the substrate frame by an injection molding or molding process to form a bracket material including a plurality of LED brackets arranged in an array, and the main body portion of the package body is formed corresponding to the board body and the base At the front side of the filling strip area, the filling strip part of the package body is formed on the footing corresponding to the filling strip area and is integrally connected to the main body part, and the hollow part is at least partially covered by the filling strip area. The package body covers and the package body covers to the edge of the board body.

Specifically, when the package body is formed by the injection molding or molding process of the substrate frame, the exposed area of the footing is clamped by the mold, and the fillet area is located outside the clamping position.

Specifically, in the step of molding the package body on the substrate frame by an injection molding or molding process to form a bracket blank including a plurality of LED brackets arranged in an array, the hollow parts near the outer frame are not completely packaged The body is filled, but there are still some hollows left.

The present invention also provides an LED lighting device, including the above-mentioned LED bracket.

Further, the LED lighting device further includes a circuit board, the circuit board is provided with a prefabricated circuit and a first pad electrically connected to the prefabricated circuit, and the back of the board body is welded to the pad; the The circuit board is further provided with a heat sink and a second pad electrically connected to the heat sink, and the second pad is welded with the base.

The present invention provides an LED bracket, a manufacturing method of the LED bracket, and an LED light-emitting device. The molding part and the main body part are provided on both sides of the metal substrate and are integrally formed; the footing is partially exposed outside the package body; The back of the metal substrate forms a closed enclosure, so that the four sides of the metal substrate plate are covered by the package body, which increases the air tightness of the bracket. At the same time, the hollow part of the four corners of the plastic leaks out the footing separately, which reduces the material used for the package body and reduces the production cost. At the same time, the foot can be used as a lamp bead welding point to connect the heat dissipation component to increase the heat dissipation path. The use effect is good, and the exposed area of the foot is not covered by the package body. When cutting, the cutting tool will not cut the metal substrate and the package body at the same time. The stress transmitted to the plastic during the cutting process reduces the risk of cracking the LED bracket, improves the production yield, and helps reduce costs.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings that need to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

FIG. 1 is a three-dimensional schematic diagram of an LED bracket provided by an embodiment of the present invention;

FIG. 2 is another three-dimensional schematic diagram of an LED bracket provided by an embodiment of the present invention;

3 is a top view of an LED bracket provided by an embodiment of the present invention;

4 is a bottom view of an LED bracket provided by an embodiment of the present invention;

5 is a schematic perspective view of a package body in an LED bracket provided by an embodiment of the present invention;

6 is another perspective schematic diagram of a package body in an LED bracket provided by an embodiment of the present invention;

FIG. 7 is a three-dimensional schematic diagram of a metal substrate in an LED bracket provided by an embodiment of the present invention;

8 is another three-dimensional schematic diagram of a metal substrate in an LED bracket provided by an embodiment of the present invention;

9 is a schematic top plan view of a metal substrate in an LED bracket provided by an embodiment of the present invention;

FIG. 10 is a schematic front plan view of a substrate frame formed by a plurality of metal substrate arrays arranged in one body according to an embodiment of the present invention;

11 is a schematic diagram of a rear plan view of a substrate frame formed by an array of multiple metal substrates provided in an integrated manner according to an embodiment of the present invention;

12a is a partial schematic diagram of a cross-section of a mold in a mold-opening state (corresponding to the cross-section at A-A of the entire page in FIG. 10 ) in a method for producing an LED bracket provided by an embodiment of the present invention;

12b is a partial schematic diagram of a cross-section of a mold in a mold-closed state (corresponding to the cross-section at A-A of the entire page in FIG. 10 ) in a method for producing an LED bracket provided by an embodiment of the present invention;

13 is a partial schematic diagram of a cross-section of a mold in a mold-closed state (corresponding to the cross-section at B-B of the entire page in FIG. 11 ) in a method for producing an LED bracket provided by an embodiment of the present invention;

14 is a schematic diagram of cutting a LED bracket material (front) formed by the arrangement of a plurality of LED bracket arrays provided in an embodiment of the present invention;

15 is a schematic diagram of cutting a LED bracket material (back side) formed by a plurality of LED bracket arrays arranged in one body according to an embodiment of the present invention;

16 is a schematic perspective view of another form of metal substrate in an LED bracket provided by an embodiment of the present invention;

17 is a schematic perspective view of an LED bracket assembled to form an LED light-emitting device according to an embodiment of the present invention;

18 is a schematic perspective view of an LED lighting device connected to a circuit board according to an embodiment of the present invention.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

It should be noted that when an element is referred to as being "fixed to" or "disposed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

In addition, if there are "vertical", "horizontal", "length", "width", "thickness", "top", "bottom", "front", "rear", "left", " "Right", "vertical", "horizontal", "top", "bottom", "inside", "outside" etc. indicate the terms of orientation or positional relationship, which are based on the orientation or positional relationship shown in the drawings or conventional The placement state or the use state is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the structure, feature, device or element referred to must have a specific orientation or positional relationship, nor must it be constructed in a specific orientation and operation, and therefore should not be construed as limiting the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

Each specific technical feature and each embodiment described in the detailed description can be combined in any suitable manner if there is no contradiction, for example, different specific technical features/embodiments can be combined to form different implementations In order to avoid unnecessary repetition, various possible combinations of specific technical features/embodiments in the present invention will not be described separately.

As shown in FIG. 1 to FIG. 5 , an LED bracket provided by an embodiment of the present invention includes a metal substrate 10 and a package body 20 , and the package body 20 may be polyester resin (plastic) or the like. The metal substrate 10 is at least partially embedded in the package body 20 , and the metal substrate 10 includes a board body 11 and a base 12 , and the base 12 may be at least partially exposed to the package body 20 to facilitate soldering. The backside of the footing 12 has a bare area 121 and a fillet area 122 (refer to FIG. 8 ) and is provided with a notch 120 (refer to FIG. 8 and FIG. 9 ), and the notch 120 is disposed at least in the fillet area 122 , in this embodiment, the groove 120 includes the exposed area 121 and the fillet area 122, the package body 20 includes a main body part 211 and a fillet part 212, and the main body part 211 is formed on the front surface of the metal substrate 10 and covers to The edge of the board body 11, in this embodiment, the front side refers to the installation surface of the LED chip in the LED bracket, and the back (bottom) refers to the soldering surface of the LED bracket used for electrical connection with the external circuit (the back side of the board body 11 can be used as a connection surface with the external circuit). welding area). The LED chip can be disposed on the front surface of the metal substrate 10 , the fillet portion 212 is formed on the fillet region 122 and integrally connected to the main body portion 211 ; the base 12 corresponds to the exposed region 121 (refer to FIG. 2 and FIG. 4 ) is exposed to the package body 20 , the base 12 is provided with the fillet portion 212 corresponding to the fillet area 122 (refer to FIG. 9 ), that is, the fillet portion 212 and the main body portion 211 is disposed on both sides of the metal substrate 10 and is integrally formed, the base 12 is partially exposed outside the package body 20, and both sides of the junction of the base 12 and the board body 11 (ie the fillet area 122) have the package body 20, the package body 20 can form a closed enclosure on the back of the metal substrate 10 (refer to the area shown on the periphery of the shaded surface in FIG. 4 ), so that the four sides of the main body of the metal substrate 10 are surrounded by the package body 20 (which can be plastic) to increase the air tightness of the bracket and the bonding strength between the metal substrate 10 and the package body 20, and at the same time the exposed area 121 of the foot 12 is leaked out, which can be used as a connection between multiple brackets before cutting during the production process of the bracket, and can also be used as a welding point. It is welded with external metal parts to increase the contact heat conduction area, and the use effect is good, and the exposed area does not need to cover the package body, and the production cost is low. In addition, the fillet area 122 and the fillet part 212 are arranged at the narrowest point where the base 12 is connected to the board body 11 , so that the bonding surface between the exposed metal substrate and the package body in the exposed area 121 is as small as possible, which can reduce the intrusion of water vapor into the bracket path of.

Specifically, both ends of the molding portion 212 are integrally formed on the main body portion 211 at both sides of the base 12 (refer to the area shown by the hatched surface in FIG. 4 ), that is, when viewed from the back of the LED bracket , the strip portion 212 separates the exposed area 121 of the base 12 from the board body 11 on a plane, such a structure can make the package body 20 tightly combined with the metal substrate 10 and at the same time keep the backside of the substrate body with greater heat dissipation and heat dissipation. welding area.

In this embodiment, the projection of the metal substrate 10 toward the bottom surface includes a central area (the area of the board body 11 ) and a footing area, and the footing area includes a bare area corresponding to the bare area 121 (see FIG. 4 ). The area indicated by 121 in the middle corresponds to the area indicated by 121 ) and the area corresponding to the area 122 (corresponding to the area indicated by 122 in FIG. 4 ), the projection of the area 212 toward the bottom surface is the area area, and the area corresponding to the area 122 in FIG. The central area and the exposed area are separated by the fillet area, so that a closed-shaped package body 20 is formed on the back of the LED bracket, the base 12 (exposed area 121 ) is located outside the closed shape, and the board 11 is located in the closed shape . In FIG. 4 , the hatched area is the area of the package body 20 , and the non-hatched area is the area of the metal substrate 10 (the LED bracket is viewed from the bottom).

Specifically, the bottom surface of the fillet portion 212 is flush with the bottom surface of the metal substrate 10, so that the packaging body and the metal substrate have good bonding strength and air tightness, which can simplify the production mold structure, facilitate manufacturing, and does not affect the heat dissipation.

Specifically, as shown in FIGS. 1 to 9 , the outer peripheral plan shape of the package body 20 is a rectangular shape with notches 201 at four corners (refer to FIGS. 5 and 6 ), and the exposed area 121 of the base 12 is exposed to the At the notch 201, the usage amount of the package body 20 is reduced, and the production cost is low. The center of the package body 20 is provided with a light-emitting body mounting hole 203 (refer to FIG. 1 ), and the light-emitting body (LED chip) can be arranged in the light-emitting body mounting hole 203 and connected to the board body 11 (refer to FIG. 17 ); the metal The substrate 10 includes two sub-substrates arranged separately (refer to FIG. 7 , FIG. 8 , and FIG. 9 ), and each sub-substrate 10 is provided with two of the base feet 12 , and each of the base feet is disposed at a distance between the two sub-substrates. In this embodiment, the two sub-substrates are arranged symmetrically. In this embodiment, the plate body 11 is in the shape of a rectangle, and the two adjacent corners on the outside thereof are set as chamfers. The base 12 is integrally formed to extend outward from the chamfer. The grooves 120 may be formed on the backside of the base 12 through an etching process. The groove 120 of the base 12 and the back surface of the board body 11 form a stepped structure, and the molding portion 212 is formed at the step and close to the board body 11 . On the outer side of the LED bracket (refer to FIG. 1 , FIG. 2 , FIG. 3 , and FIG. 4 ), the outer side of the base 12 is flush with the outer side of the package body 20 ; The outer side of the foot 12 is adjacent to the outer side of the package body 20; the outer side of the LED bracket faces the projection on the height direction of the package body 20 (that is, the direction perpendicular to the front of the LED bracket), the outer side of the foot 12 and the package body 20. There is no overlapping part on the outer side surface (that is, the upper and lower sides of the base 12 are not covered by the package body 20 ). Such a structural design enables the LED to be cut (described below) during the manufacturing process, and the cutting tool will only cut the package body 20 or the base 12 separately, but will not cut the base 12 and the package body 20 at the same time. Due to the different material properties of the metal substrate and the package body, the force feedback to the cutting tool is inconsistent, which may cause the bracket to crack or affect the airtightness of the metal substrate 10 and the package body 20 combined.

An embodiment of the present invention also provides a method for manufacturing an LED bracket, which is used to manufacture the above-mentioned LED bracket, including the following steps:

Referring to FIGS. 10 and 11 , a substrate frame 130 having a metal substrate 10 is prepared through a stamping process or an etching process on a whole metal plate. The substrate frame 130 includes an outer frame 133 and an array arranged in the outer frame 133 . A plurality of metal substrates 10 are arranged, wherein the adjacent footings between the metal substrates 10 are integrally formed and connected, and the plurality of metal substrates 10 arranged in an array are connected to the outer frame 133 through the footings 12, except for the metal substrates 10. The area outside the area of the substrate 10 and the outer frame 133 is the hollow part (ie the blank area in the figure);

The groove 120 on the backside of the footing 12 is also formed by etching or stamping in the above steps, and the groove 120 is at least disposed in the fillet area 122. In this embodiment, the groove includes a bare area and a fillet area;

(Refer to FIGS. 12 a to 15 , and refer to FIGS. 1 , 2 , and 4 in combination) The package body 20 is molded on the metal substrate 10 by an injection molding or molding process to form a plurality of LED support sheets arranged in an array. 140. The main body portion 211 of the package body 20 is formed on the front side of the board body 11 and the front side of the base 12 corresponding to the fillet area 122 (ie, opposite to the fillet area 122, the fillet area 122). The strip area 122 is located on the back of the base 12 ), and the package body 20 covers the edge of the board body 11 but does not cover the base 12 , and the molding portion 212 of the package 20 is formed corresponding to the base 12 At the fillet area 122 and integrally connected to the main body portion 211 , that is, the fillet portion 212 and the main body portion 211 are located on two sides of the metal substrate 10 and are integrally formed, and the package body 20 can form a seal on the backside of the metal substrate 10 . Enclosing the edges, so that the four sides of the main body of the metal substrate 10 are surrounded by plastic, which increases the air tightness of the bracket, and at the same time leaks the footing 12 (exposed area 121 ), which can be used as the connection between the brackets before cutting, and can also be used as a welding point It is connected with external metal parts to increase the contact heat conduction area, and the use effect is good.

If the metal notch (ie the groove 120 ) is not specially treated during injection molding, the plastic may all enter the metal notch. In order to form the metal notch, in this embodiment, when the package body 20 is injection molded, the position of the metal notch is changed. The mold is clamped, and the plastic does not enter the metal gap, which can reduce the amount of plastic used. The fillet region 212 is not clamped by the mold and may be filled with plastic to form the fillet portion 212 .

In a specific application, as shown in FIG. 10 is a schematic front plan view of the substrate frame 130 , each of the base feet 12 protrudes from the side surface of the metal substrate 10 in the outer peripheral direction; the grid line part is a metal entity, and the metal entity includes many The metal substrates 10 (4 rows and 4 columns) are integrally connected, and the part without grid lines is a hollow structure. FIG. 11 is a schematic plan view of the back of the substrate frame 130 , and the part without grid lines and shadow lines is a hollow structure. The hatched part of the outer frame and the plane corresponding to the internal hatched line are of equal height, the larger grid line area corresponding to the footing 12 is the first etching area (corresponding to the part of the missing groove 120 in this embodiment), and the small grid line is the second In the etching area, the planes corresponding to the first etching area and the second etching area are all lower than the planes corresponding to the hatched part of the outer frame and the inner hatched area. The substrate frame 130 is set in the injection mold to form the package. As shown in FIG. 12a , the mold and the substrate frame 130 correspond to the schematic cross-sectional view of the substrate frame 130 at A-A in FIG. 10 (the mold opening state). Upper mold 31, lower mold 32. The upper mold 31 and the lower mold 32 can be combined to clamp the substrate frame 130 to form the package body 20 by injection molding. As shown in FIG. 12b, the mold and the substrate frame 130 correspond to the schematic cross-sectional view of the substrate frame 130 in FIG. 10 at A-A (clamped state). As shown in FIG. 13, the mold and the substrate frame 130 correspond to the substrate frame 130 in FIG. 11. Schematic cross-section at B-B (clamped state). In the figure, a part of the groove 120 is not clamped by the upper mold 31 and the lower mold 32, and a molding portion 212 will be formed during glue injection.

As shown in FIG. 14 and FIG. 15 , a plurality of metal substrates 10 can be integrally formed with the LED package body 20 to form an LED bracket blank 140 . , which will not be described in detail in this application), and then can be cut to form a single LED lamp bead (refer to FIG. 17 ). The area between the adjacent LED brackets on the bracket material 140 and between the outer frame 133 and the LED brackets is a cutting lane area, and the cutting lane area includes criss-crossing cutting lanes 131 and 132. The feet 12 and the package body 20 do not overlap in thickness, which prevents the cutter from cutting the base feet 12 and the package body 20 at the same time during cutting. As shown in FIG. 14 , in the step that the substrate frame 130 molds the package body through the injection molding or molding process to form the bracket blank 140 including a plurality of LED brackets arranged in an array, not all the hollow parts near the outer frame 133 are encapsulated by the package body Filled, there are still some hollows (areas covered by grid lines in the figure), and the remaining hollows can reduce the amount of packaging to reduce production costs and facilitate cutting tool resistance.

After cutting, the base 12 and the side of the package body 20 are coplanar, and the cutting lines 131 and 132 are along the cutting direction. Cut to the package body 20, or only cut to the base feet 12, that is, the base feet 12 and the package body 20 do not overlap on the cutting lines 131 and 132, so as to avoid cutting the base feet 12 and the package body 20 at the same time, and reduce the transmission to the plastic during the cutting process. The stress reduces the risk of cracking, improves the production yield, and helps reduce costs.

In addition, in this embodiment, the provision of the groove 120 can effectively prevent the bottom surface of the final manufactured LED lamp bead from being uneven due to the base foot 12 being bent downward during cutting and protruding from the bottom surface of the substrate, which causes the LED lamp bead to be uneven. When the board body 11 of the substrate is soldered on the PCB board, there is a situation of poor soldering. When the substrate frame 130 is cut, the footing 12 tends to warp slightly downward due to the action of the cutting stress. With the arrangement of the groove 120, even if the footing 12 warps downward, it will not exceed the bottom surface of the board body 11. Avoid the bad contact of the LED bracket during soldering, and the reliability is higher.

In a specific application, the notch 120 is disposed in the exposed area 121 and the filling area 122 at the same time, and the exposed area 121 and the filling area 122 may be flush (equal height) or step-shaped (not different from each other). However, when viewed from the backside of the metal substrate (the side with the groove 120 is the backside), it is all lower than the plate body 11 . As another optional embodiment, as shown in FIGS. 16 and 17 , the notch is only provided in the fillet area 122 . Viewed from the back of the metal substrate (the side with the notch 120 is the back), the The exposed area 121 is flush with the bottom surface of the metal substrate (board body 11 ). For this structure, the substrate frame should be turned over (the bottom of the metal substrate should be placed up) and placed for cutting to prevent the footing from warping and protruding. Bottom surface of substrate.

As shown in FIG. 17 , an embodiment of the present invention further provides an LED light-emitting device. The light-emitting device provided in this embodiment is an LED lamp bead 100 , which includes the above-mentioned LED bracket and also includes an illuminator mounted on the front of the bracket. The LED light-emitting chip 30 in the hole 203 is welded on the front surface of the plate body 11 of the metal substrate 10 . The four sides of the main body of the metal substrate 10 of the LED light-emitting device are surrounded by plastic (package body 20 ), which increases the air tightness of the bracket and leaks out the base 12 (bare area 121 ). Referring to the description of the above embodiment, the base 12 can be In the substrate frame 130, the connection between the brackets before cutting can also reduce the stress transmitted to the plastic during the cutting process and reduce the risk of cracking.

Referring to FIG. 18 , the light-emitting device provided in this embodiment further includes a circuit board 40 . The circuit board 40 is provided with a prefabricated circuit (printed or embedded in the circuit board, not shown) and a first pad 41 electrically connected to the prefabricated circuit. , the back of the board body 11 of the LED lamp bead 100 is welded with the pads 41. In this embodiment, there are two first pads 41, which are respectively connected with the two boards 11 on the back of the LED lamp bead (refer to FIG. 2 and FIG. 8) Soldering; the circuit board 40 is also provided with a heat sink (printed or embedded in the circuit board, not shown) and a second pad 42 electrically connected to the heat sink, and the second pad 42 is welded to the base 12. This embodiment In the example, there are four second pads 42, which are respectively welded to the exposed areas of the bases 12. It can be seen that the bases 12 can also be used as soldering points to connect with external heat dissipation components to increase the contact heat conduction area, and can increase the number of LED lamp beads 100. The stability of welding with the circuit board is good. In this embodiment, the heat sink may be a copper layer disposed on the surface of the circuit board, and the heat sink has no circuit function. In addition, in some applications, the base pin 12 can also be connected to the circuit on the circuit board, so as to supply power to the LED lamp bead.

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements or improvements made within the spirit and principles of the present invention shall be included in the protection of the present invention. within the range.

Claims (10)

1. An LED support is characterized by comprising a metal substrate and a packaging body, wherein the metal substrate is at least partially embedded in the packaging body and comprises a plate body and a footing arranged on the periphery of the plate body, the back surface of the footing is provided with an exposed area and a fillet area and is provided with a notch, the notch is at least arranged in the fillet area, the packaging body comprises a main body part and a fillet part, the main body part is formed on the front surface of the metal substrate and covers the edge of the plate body, and the fillet part is formed in the fillet area and is integrally connected to the main body part; the footing is exposed out of the packaging body corresponding to the exposed area, and the footing is provided with the embedded bar part corresponding to the embedded bar area.

2. The LED cradle of claim 1, wherein both ends of the inlay portion are integrally formed with the main body portion at both sides of the footing.

3. The LED holder according to claim 1, wherein the projection of the metal substrate in the direction of the bottom surface includes a central area and a footing area, the footing area includes an exposed area corresponding to the exposed area and a fillet area corresponding to the fillet area, the projection of the fillet portion in the direction of the bottom surface is the fillet area, and the central area and the exposed area are separated by the fillet area.

4. The LED bracket as claimed in any one of claims 1 to 3, wherein the slot is disposed in both the exposed area and the fillet area, the exposed area and the fillet area are flush or stepped, or the slot is disposed only in the fillet area, and the exposed area is flush with the bottom surface of the metal substrate.

5. The LED support according to any one of claims 1 to 3, wherein the planar shape of the outer periphery of the package is a rectangular shape with notches at four corners, the exposed region of the footing is exposed at the notches, and a light-emitting body mounting hole is formed in the center of the package; the metal substrate comprises two sub-substrates which are oppositely arranged in a separated mode, each sub-substrate is provided with two base feet, each base foot is arranged on one side, away from each other, of each sub-substrate, the projection of the outer side face of the LED support towards the height direction of the packaging body is formed on the outer side face of the LED support, and the outer side face of each base foot and the outer side face of the packaging body are not overlapped.

6. A method for manufacturing an LED support according to any one of claims 1 to 5, comprising the steps of:

preparing a substrate frame of the metal substrate with a base and a plate body on a whole metal plate through a stamping process or an etching process, wherein the substrate frame comprises an outer frame and a plurality of metal substrates arranged in the outer frame in an array manner, adjacent base among the metal substrates are integrally formed and connected, the plurality of metal substrates arranged in the array manner are connected with the outer frame through the base, and the area except the areas of the metal substrates and the outer frame is a hollow part;

the packaging body is formed on the substrate frame through injection molding or die pressing to form a support tablet containing a plurality of LED supports arranged in an array, the main body portion of the packaging body is formed on the front face of the board body and the front face of the base foot corresponding to the embedded strip area, the embedded strip portion of the packaging body is formed on the base foot corresponding to the embedded strip area and integrally connected to the main body portion, the hollow portion is at least partially covered by the packaging body, and the packaging body covers the edge of the board body.

7. The method of claim 6, wherein the exposed region of the footing is clamped by a mold while the substrate frame is used to form the package body by injection molding or compression molding, and the fillet region is located outside the clamping position.

8. The method according to claim 6, wherein in the step of forming the package body by injection molding or mold pressing to form the support material sheet containing the plurality of LED supports arranged in an array, the hollow portion near the outer frame is not completely filled with the package body, and a part of the hollow portion is left.

9. An LED lighting device, comprising the LED holder according to any one of claims 1 to 5.

10. The LED lighting device according to claim 9, further comprising a circuit board, wherein the circuit board has a prefabricated circuit and a first pad electrically connected to the prefabricated circuit, and the back surface of the board body is soldered to the pad; the circuit board is further provided with a radiator and a second bonding pad electrically connected with the radiator, and the second bonding pad is welded with the base pin.

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