JP2001118868A - Surface-mounting part and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface-mounting part together with its manufacturing method wherein no gap occurs at the interface between a package and an external lead under the external force of bending, no external force acts on a sealed electronic part chip, while a package cracking as well as occurrence of internal corrosion, etc., which are caused by mechanical stress, heat, and water content that act inside through an external lead and a gap are reduced. SOLUTION: An electronic part chip 17 is mounted to a lead frame 13, which is sealed in a resin package 11, and external leads 21, 22, 23, and 24 of the lead frame are added to the bottom surface of resin package 11, which acts as a substrate mounting surface. Here, the external leads 21, 22, 23, and 24 are U-shape in cross section, with the substrate mounting surface being exposed almost flush with the bottom surface of resin package 11, and molded as one body with the resin package 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a chip of an electronic component on a lead frame, enclosing the chip in a resin package, and attaching external leads of the lead frame to the bottom surface of the resin package. The present invention relates to a surface-mounted component as a mounting surface and a method of manufacturing the same, for example, an optical semiconductor device such as a light emitting diode (hereinafter, referred to as an LED), other semiconductor devices, and electronic components such as a resistor and a capacitor.

[0002]

2. Description of the Related Art As a mounting form of an electronic component, there is, for example, an insertion component 1A shown in FIG. 1A or a surface mounting component 1B shown in FIG. 1B. The chip 3 as a component is mounted, and the chip 3 and one end of the external lead 4 of the lead frame 2 are sealed in a synthetic resin package 6 in a state of being connected via a bonding wire 5. With the external lead 4 bent in an L-shape, the other end is protruded to a position away from the package 6, the end of which is inserted into the through hole 7 and soldered on the back side of the printed circuit board 8. In the latter case, the external lead 4 is bent in a U-shape, and the other end is attached from the side to the bottom of the package 6, and the bottom piece is used as a board mounting surface on the printed circuit board 8. Contact It has a structure that solder joint Te.

[0003] When the two are compared, the latter surface mount component 1
In the case of B, the mounting area is smaller than that of the former insertion part 1A by the amount that the external lead 4 does not protrude, the size and weight can be reduced, and since the external lead 4 is not inserted into the through hole, the mounting is easy. Since the productivity can be improved and the external lead 4 is less likely to receive an external force during handling to form a gap between the external lead 4 and the package 6, the package due to heat or moisture acting inside through the external lead 4 can be obtained. It has the advantage of being able to reduce cracks and internal corrosion, and has been particularly frequently used in recent years. However, in the case of this surface mount component 1B, there still remains a problem that needs to be solved as described below. I was

[0004]

That is, the external lead 4 of the conventional surface mount component 1B is changed from a straight one having one end buried in the package 6 to a U-shape later as shown by a virtual line. Since the bending process is performed, the external lead 4 receives an external force during the bending process to cause a gap between the external lead 4 and the package 6, or the bent portion becomes curved to easily vary in thickness protruding from the package 6. ,
There is a possibility that it may be difficult to perform the soldering with the board mounting surface placed horizontally on the printed board 8.

Therefore, when a gap is formed between the external lead 4 and the package 6, a package crack and internal corrosion occur due to heat and moisture acting inside through the external lead 4 as in the case of the inserted component 1A. There is a fear,
If the electronic component is not mounted horizontally, the bonding strength is reduced, and in the case where the electronic component is an optical semiconductor device such as an LED, there is a possibility that a desired performance cannot be obtained because the electronic component is mounted with the optical axis shifted.

Accordingly, in the present invention, in order to solve the problems of the prior art as described above, a lead frame mounting structure including external leads to a package so as not to be affected by an external force more than a conventional surface mount component. In addition to improving the manufacturing method, the improvement makes it possible to securely mount the package in a horizontal state with respect to the printed circuit board surface, and also makes it possible to make the surface mount component smaller than conventional products, and to manufacture the same. Provide a way.

[0007]

According to the present invention, a chip of an electronic component is mounted on a lead frame and encapsulated in a resin package, and external leads of the lead frame are provided on the bottom surface of the resin package. In a surface mounting component as a mounting surface, an external lead pre-bent to a U-shaped cross section is filled with an injection molded sealing resin material, and the external lead is embedded in the sealing resin material.
A surface mount component in which a lead frame is integrally formed with a resin package and a board mounting surface of an external lead is exposed in a state substantially flush with a bottom surface of the resin package.

[0008] In this surface mount component, the external lead is mounted on the package in a state where the external lead is bent in advance, and it is not necessary to bend later as in the case of the conventional surface mount component. The external force during bending or other handling, which was an issue, caused a gap at the interface between the package and the external lead, and the external force acting on the chip of the encapsulated electronic component was eliminated. The occurrence of package cracks and internal corrosion due to mechanical stress acting on the inside, heat and moisture, etc. can be significantly reduced.

Further, the bottom surface of the external lead, which is the substrate mounting surface, is soldered in a horizontal state with respect to the wiring line on the printed circuit board while maintaining the horizontality, so that the surface mounting is performed with stable bonding strength. In addition, when the electronic component is an optical semiconductor element such as an LED, and the chip of the electronic component is an optical semiconductor chip (claim 2), the optical axis with respect to the chip mounting surface is kept in a state where the substrate mounting surface is flat. Can be arranged at a right angle, the problem that the optical axis is shifted can be solved, and desired performance can be obtained.

Next, in a method of manufacturing a surface mount component according to the present invention, a chip of an electronic component is mounted on a lead frame and sealed in a resin package, and external leads of the lead frame are connected to the bottom surface of the resin package. In a method of manufacturing a surface mount component provided as a substrate mounting surface in
The lead frame is formed by bending an external lead continuous to a chip mounting surface including a pad portion into a U-shaped cross section,
This lead frame is mounted on the lower die while the chip mounting surface is in contact with the mounting surface of the core block provided in the lower die, and the upper die is clamped to the bottom piece of the external lead that is the substrate mounting surface A sealing resin material is injected from a resin injection hole provided at the center of the upper mold, and the injection pressure of the injection frame presses the chip mounting surface of the lead frame against the mounting surface of the core block, and Filling the outer lead with a sealing resin material while pressing the substrate mounting surface against the inner surface of the upper mold,
External leads are buried in the sealing resin material, and the lead frame is integrally formed with the resin package in such a manner that the board mounting surface of the external leads is substantially flush with the bottom surface of the resin package. (Claim 3).

[0011] According to this manufacturing method, the chip mounting surface and the substrate mounting surface of the lead frame pressed against the mounting surface of the core block and the inner surface of the upper die, respectively, generate burrs and films due to the inflow of the sealing resin material. Because it can be a flat metal exposed surface without, it is possible to easily and reliably perform the mounting of the chip and the mounting on the printed circuit board,
In particular, when the mounting component is an optical semiconductor device such as the LED of the present embodiment, when both mounting surfaces are flat, the optical axis can be set correctly in a certain direction.

In particular, in this manufacturing method, the bottom piece of the external lead is bent in an upwardly inclined shape in advance, and this bottom piece is horizontally bent and deformed by pressing the clamped upper mold to form an inner surface of the upper mold. When the press-contact force of the bottom piece against the base material is increased, the inflow of the sealing resin material can be more reliably prevented, so that a flat metal exposed surface free of burrs and coatings can be obtained, and It can be applied to the use of a sealing resin material having a small particle size.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a surface-mounted component and a method of manufacturing the same according to the present invention will be described as an electronic component to be surface-mounted.
Based on the preferred embodiment applied to the ED, FIG.
6 will be described in detail with reference to FIGS. 2 to 6. FIG. 2 is a plan view of an LED to which the present invention is applied, FIG. 3 is a cross-sectional view taken along line III-III of FIG. (A) is a plan view, (b) is a cross-sectional view taken along line IV-IV of (a), and shows a main part of a conductor substrate forming a lead frame;
5 (a) is a longitudinal sectional view of a molding die in a mold open state, (b) is a longitudinal sectional view of a molding die in a mold closed state, and (c) is a plan view. FIGS. 6A and 6B are explanatory views showing the flow state of the resin material, FIG. 6A is a molded resin package, FIG. 6A is a partially cutaway plan view, and FIG. 6B is a cross section taken along line VI-VI of FIG. The figure is shown.

As shown in FIGS. 2 and 3, the LED 10, which is a surface mount component, is particularly red (R), green (G), and blue (B).
Are packaged in a single resin package 11. The package 11 is formed in a rectangular shape having a bottomed frame shape with an opening 12 formed by a circular groove at the upper center side. A part of the lead frame 13 integrally formed with the package 11 is exposed on the bottom surface of the package 12 as a chip mounting surface, and the pads 14, 15, and 16 have light-emitting chips 17 a and 17 b of three colors die-bonded. , 1
7c are mounted respectively, and each light emitting chip 1
One of the electrodes 7a, 17b, and 17c is connected to a common area 19 serving as a ground electrode via a bonding wire 18, and a covering material 20 such as a transparent epoxy resin material covering these is filled in the opening 12; The inner peripheral surface of the opening 12 is tapered and mirror-finished to form a reflective surface 12a.

The lead frame 13 is provided with each pad portion 14,
External leads 21, 22, 23 continuing from 15, 16
And the external leads 21 and 2 continuous with the common area 19.
2, 23, 24, and each external lead is a side piece 21 a, 22 a, 23 a, 24 bent in a U-shaped cross section.
a and bottom pieces 21b, 22b, 23b and 24b, respectively, and the side pieces are integrated with the side face of the package 11 and the bottom piece substantially flush with the bottom face of the package 11 (coplanar or slightly projecting). The bottom piece 21
b, 22b, 23b and 24b are board mounting surfaces to be soldered to wiring lines (not shown) on the printed board 25.

In the above surface mount component (LED 10),
Lead frame 1 previously bent into an L-shaped cross section
3 with the outer leads 21, 22, 23, and 24 being substantially flush with the side and bottom surfaces of the package 11, respectively.
Package 1 does not have to be substantially flush.
1 and the external lead is bent after forming, so that a gap is generated at the interface between the package and the external lead due to external force during bending or other handling, as compared to the surface mount component 1B shown in FIG. Also, since no external force acts on the chip of the enclosed electronic component, the occurrence of package cracks and internal corrosion due to mechanical stress acting on the inside via external leads and gaps, heat and moisture, and the like can be significantly reduced. .

Also, since the bottom surface of the external lead, which is the substrate mounting surface, is soldered in a horizontal state with respect to the wiring line on the printed circuit board while maintaining the levelness, it is surface-mounted with stable bonding strength and In the case where the electronic component is an optical semiconductor element such as an LED, it is possible to solve a problem that the electronic component is mounted in a state where the optical axis is shifted and a desired performance cannot be obtained.

In manufacturing the surface-mounted component (LED 10), first, a copper alloy such as phosphor bronze or another known conductive metal plate is used for punching and bending, and silver or other conductive plating is applied. A conductor board 26 shown in FIG. 4 is manufactured, and the conductor board 26 is a frame plate 2 in which the pattern of the lead frame 13 constituting one unit is square.
7, the lead frame 13 is manufactured in a state in which a number of units are connected in a chain via a frame plate 27, and each of the pads 14, 15, and 15 of the lead frame 13 constituting the chip mounting surface. 16 and common area part 1
Reference numeral 9 is connected to and supported by the frame plate 27 via a connecting piece 28.

A molding die for injection-molding the surface mount component package 11 includes an upper mold 29 and a lower mold 30 which are arranged to face each other as shown in FIG. The core block 31 on which the lead frame 13 is placed is mounted, and the upper part is inserted into the cavities 32 and 33 formed between the upper mold 29 and the lower mold 30 and the core block 31 by clamping as shown in FIG. The sealing resin material M is filled through a resin injection hole 34 provided at the center of the mold 29, and the lead frame 13 including external leads is embedded in the sealing resin material M, as shown in FIG.
The lead frame 13 is integrally formed with the package 11 as shown in FIG.

The upper mold 29 and the lower mold 30 are provided with concave fitting portions 29a and 30b whose width is aligned with the lead frame 13 so that the lead frame 13 including the bent external lead can be fitted. The concave fitting portion 30 of the lower mold 30
b, a core block 31 having a tapered portion 31a formed on the outer peripheral surface is provided, and on the mounting surface 31b of the core block 31, bottom pieces 21b, 22b, 23b, 24b of external leads are provided.
Is directed toward the upper mold 29, and the lead frame 13 is placed with the surfaces of the pads 14, 15, 16 and the common area 19 in contact with each other. The height of the mounting surface 31b of the core block 31 is set lower by the thickness of the lead frame 13 so as to match L.

Accordingly, when the mold is clamped, the chip mounting surface, that is, the lead frame 13 is moved from the surface of each of the pads 14, 15, 16 and the common area 19 to the mounting surface 31 of the core block 31.
b, and the bottom surface piece 21 of the board mounting surface, ie, the external lead.
In a state where the surfaces of b, 22b, 23b and 24b are in contact with the inner surfaces of the corners of the upper mold 29, the lower mold 30 including the core block 31 is provided.
And an upper mold 29, a rectangular cavity 32 is formed on one side of the lead frame 13, and an annular cavity 33 is formed on the other side. They communicate with each other via a gap 35 existing between the common area 16 and the common area 19.

A heat-resistant thermoplastic resin such as liquid crystal polymer (LCP) or polyether nitrile (PEN) is used as the sealing resin material M in the molding die in the clamped state.
When injected under pressure into the cavity through the resin injection hole 34, the injection resin material m dispersed radially from the center of the mold
Is uniformly filled into the cavity, and as shown in FIG. 6, an integrated package 11 in which a lead frame 13 including external leads is embedded is molded. At this time, the injection pressure of the injection resin material m includes the external leads. Since it acts on the inner surface side of the lead frame 13, each pad 1
The front sides (chip mounting surfaces) of the 4, 15 and 16 and the common area 19 are mounted on the mounting surface 31b of the core block 31, and the front surfaces (substrate mounting surfaces) of the bottom pieces 21b, 22b, 23b and 24b of the external leads are mounted. The injection resin material m which is pressed into contact with the inner surface of the corner of the upper mold 29 and tries to penetrate and adhere to each mounting surface.
Block the flow of

When the lead frame 13 is buried in the package 11 in this manner, the chip mounting surface on which the chips of the electronic components, ie, the light emitting chips 17a, 17b, 17c are mounted, and the substrate mounting surface mounted on the printed circuit board 25 That is, since each bottom piece can be a flat metal exposed surface without generation of burrs or films due to the inflow of the sealing resin material, chip mounting and mounting on a printed circuit board can be easily and reliably performed firmly. In addition to the above, especially when the mounting component is an optical semiconductor device such as the LED of the present embodiment, when both mounting surfaces are flat, the optical axis can be set correctly in a certain direction.

When manufacturing the conductor substrate 26 shown in FIG.
As shown in FIG. 5A, each bottom piece 21b of the external lead
If 22b, 23b, and 24b are previously bent upward at an angle of, for example, about 5 to 10 degrees, the bottom piece is horizontally bent and deformed by the upper mold 29 when the mold is clamped. The press-contact force is further enhanced, and is effective in preventing the flow of the injection resin material m that is going to enter the substrate mounting surface.

As shown in FIG. 6, a package 11 integrally formed with a lead frame 13 including external leads bent into a U-shape in cross section has a chip mounting surface corresponding to an electronic component. After mounting and surface coating, the connecting piece 28 is cut and separated from the frame plate 27 supported and connected, and in the case of the present embodiment, the LED 11 as shown in FIGS. 2 and 3 is finished.

[Brief description of the drawings]

FIG. 1 shows a mounting mode of an electronic component according to a conventional technique, wherein (a)
Shows an insertion component by a through hole, and (b) shows a surface mounting component.

FIG. 2 shows a plan view of an LED to which the surface mount component of the present invention is applied.

FIG. 3 is a sectional view taken along line III-III in FIG. 2;

4A and 4B are main parts of a conductor substrate forming a lead frame used for a surface mount component of the present invention, wherein FIG.
FIG. 4A is a cross-sectional view taken along line IV-IV in FIG.

5 (a) is a longitudinal sectional view of a molding die in a mold open state, FIG. 5 (b) is a longitudinal sectional view of the molding die in a mold clamped state, and FIG. The flow state explanatory drawing of the resin material seen from the viewpoint is shown.

6 (a) is a partially cutaway plan view of a molded resin package, and FIG. 6 (b) is a cross-sectional view taken along line VI-VI of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Package 12 Opening 13 Lead frame 14, 15, 16 Pad part 17a, 17b, 17c Light emitting chip 18 Bonding wire 19 Common area part 20 Covering material 21, 22, 23, 24 External lead 21a, 22a, 23a, 24a Side piece 21b, 22b, 23b, 24b Bottom piece 25 Printed circuit board 26 Conductor board 27 Frame plate 28 Connecting piece 29 Upper die 29a Depressed fitting portion 30 Lower die 30a Depressed fitting portion 31 Core block 31a Tapered portion 31b Mounting surface 32, 33 Cavity 34 Resin injection hole 35 Void

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[Procedure amendment]

[Submission date] December 11, 2000 (200.12.
11)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction contents]

[0007]

According to the present invention, a chip of an electronic component is mounted on a lead frame and encapsulated in a resin package, and external leads of the lead frame are provided on the bottom surface of the resin package. In a surface mounting component as a mounting surface, an external lead pre-bent to a U-shaped cross section is filled with an injection molded sealing resin material, and the external lead is embedded in the sealing resin material.
A surface mount component in which a lead frame is integrally formed with a resin package, and bottom and side pieces of external leads are exposed to be substantially flush with the bottom and side faces of the resin package. It is.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction contents]

Further, the bottom surface of the external lead, which is the substrate mounting surface, is soldered in a horizontal state with respect to the wiring line on the printed circuit board while maintaining the horizontality, so that the surface mounting is performed with stable bonding strength. And especially the chip of the electronic component.
A light emitting chip is mounted on the pad of the lead frame.
An optical semiconductor chip to be mounted
When the surface is parallel to the substrate mounting surface formed by the bottom piece (claim 2), the optical axis can be arranged at right angles to the chip mounting surface while the substrate mounting surface is flat. The problem of shaft misalignment is also eliminated, and desired performance can be obtained.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction contents]

Next, in a method of manufacturing a surface mount component according to the present invention, a chip of an electronic component is mounted on a lead frame and sealed in a resin package, and external leads of the lead frame are connected to the bottom surface of the resin package. In a method of manufacturing a surface mount component provided as a substrate mounting surface in
The lead frame is formed by bending an external lead continuous to a chip mounting surface including a pad portion into a U-shaped cross section, and the lead frame abuts a chip mounting surface on a mounting surface of a core block provided in a lower mold. In this state, the lower die is attached to the lower die, and the inner surface of the upper die that has been clamped is brought into contact with the bottom and side pieces of the external leads, which are the substrate mounting surfaces, and sealing is performed from the resin injection hole provided in the center of the upper die. A resin material is injected, and the injection pressure is applied to press the chip mounting surface of the lead frame against the mounting surface of the core block and seal the inside of the external lead while pressing the substrate mounting surface against the inner surface of the upper die. the resin material was filled, the outer leads is embedded in the sealing resin material, the bottom piece and the side pieces of the outer leads of the resin package bottom and side
The lead frame is formed integrally with the resin package in such a manner as to be exposed substantially flush with the surface (claim 3).

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 23/31 H01L 23/50 R 23/50 23/30 B

Claims (3)

[Claims] An electronic component chip is mounted on a lead frame and sealed in a resin package, and external leads of the lead frame are provided on the bottom surface of the resin package to form a board mounting surface. An injection-molded sealing resin material is filled in an external lead that has been bent in advance into a U-shaped cross section, and the lead frame is integrally formed with the resin package in a state in which the external lead is embedded in the sealing resin material. A surface mounting component, wherein the substrate mounting surface of the external lead is exposed substantially flush with the bottom surface of the resin package. 2. The surface mount component according to claim 1, wherein the chip of the electronic component is an optical semiconductor chip. 3. A chip of an electronic component is mounted on a lead frame and sealed in a resin package, and external leads of the lead frame are provided on a bottom surface of the resin package to form a board mounting surface. In the manufacturing method, the lead frame is formed by bending an external lead connected to a chip mounting surface including a pad portion into a U-shaped cross section, and the lead frame is provided with a core block having a chip mounting surface provided in a lower mold. Attached to the lower mold while contacting the surface, the inner surface of the upper mold that has been clamped to the bottom piece of the external lead that is the board mounting surface, and sealed from the resin injection hole provided in the center of the upper mold. Injecting a resin material, pressing the chip mounting surface of the lead frame against the mounting surface of the core block by the injection pressure, and pressing the substrate mounting surface against the inner surface of the upper mold, The external lead is filled with a sealing resin material, the external lead is embedded in the sealing resin material, and the substrate mounting surface of the external lead is exposed in a state substantially flush with the bottom surface of the resin package. A method for manufacturing a surface mount component, wherein a lead frame is integrally formed with a resin package.