CN114566199A - Read reference circuit, read operation circuit and memory cell - Google Patents
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Abstract
Description
技术领域technical field
本申请涉及半导体技术领域,尤其涉及一种读参考电路、读操作电路及存储单元。The present application relates to the field of semiconductor technology, and in particular, to a read reference circuit, a read operation circuit and a storage unit.
背景技术Background technique
磁性随机存储器(MRAM,Magnetic Random Access Memory)具有高读写速度、高密度、低功耗、长数据保存时间和高寿命等特点,因此有着不可估量的广阔前景。由于MRAM的电阻具有可变性,因此可以通过其不同的电阻状态来存储数据信息。Magnetic random access memory (MRAM, Magnetic Random Access Memory) has the characteristics of high read and write speed, high density, low power consumption, long data retention time and long life, so it has immeasurable broad prospects. Due to the variable resistance of MRAM, data information can be stored through its different resistance states.
MRAM中具有磁性隧道结(MTJ),MTJ数据的改写是通过自旋电子流改变自由层的磁矩方向,因此长时间的小电流也会改写数据,故在进行读操作时容易发生干扰(readdisturb)导致数据改写。There is a magnetic tunnel junction (MTJ) in MRAM. The rewriting of MTJ data is to change the magnetic moment direction of the free layer through the flow of spin electrons. Therefore, a small current for a long time will also rewrite the data, so it is prone to read disturbances during read operations. ) causes data to be overwritten.
发明内容SUMMARY OF THE INVENTION
本申请解决的技术问题是避免MRAM在读操作时受到干扰。The technical problem solved by the present application is to prevent the MRAM from being disturbed during a read operation.
为解决上述技术问题,本申请提供了一种读参考电路,包括:一个或多个并联的参考模块;所述参考模块包括两个串联且写入数据不同的第一参考单元和第二参考单元;所述第一参考单元、所述第二参考单元分别在写操作和读操作时的电流方向相同。In order to solve the above technical problem, the present application provides a read reference circuit, comprising: one or more reference modules connected in parallel; the reference module includes two first reference units and second reference units that are connected in series and have different written data ; The current directions of the first reference unit and the second reference unit are the same during the write operation and the read operation, respectively.
在本申请实施例中,所述读参考电路还包括:第一参考位线,连接所述第一参考单元;第二参考位线,连接所述第二参考单元;参考源线,连接所述第一参考单元和所述第二参考单元;其中,所述第一参考位线和所述第二参考位线中的一个输出参考信号,另一个接低电平,所述参考源线浮空。In the embodiment of the present application, the read reference circuit further includes: a first reference bit line, connected to the first reference cell; a second reference bit line, connected to the second reference cell; and a reference source line, connected to the The first reference unit and the second reference unit; wherein, one of the first reference bit line and the second reference bit line outputs a reference signal, the other is connected to a low level, and the reference source line is floating .
在本申请实施例中,所述第一参考单元写0,所述第二参考单元写1,所述第一参考位线输出参考信号,所述第二参考位线接低电平。In the embodiment of the present application, 0 is written to the first reference unit, 1 is written to the second reference unit, the first reference bit line outputs a reference signal, and the second reference bit line is connected to a low level.
在本申请实施例中,所述第一参考单元包括:第一MTJ单元,连接所述第一参考位线;第一晶体管,所述第一晶体管的第一电极连接所述第一MTJ单元,所述第一晶体管的第二电极连接所述参考源线和所述第二参考单元。In the embodiment of the present application, the first reference unit includes: a first MTJ unit, connected to the first reference bit line; a first transistor, a first electrode of the first transistor is connected to the first MTJ unit, The second electrode of the first transistor is connected to the reference source line and the second reference cell.
在本申请实施例中,所述第二参考单元包括:第二MTJ单元,连接所述第二参考位线;第二晶体管,所述第二晶体管的第一电极连接所述第二MTJ单元,所述第二晶体管的第二电极连接所述参考源线和所述第一晶体管的第二电极。In the embodiment of the present application, the second reference unit includes: a second MTJ unit connected to the second reference bit line; a second transistor, the first electrode of the second transistor is connected to the second MTJ unit, The second electrode of the second transistor is connected to the reference source line and the second electrode of the first transistor.
本申请还提供一种读操作电路,包括:读参考电路,用于提供参考信号,包括一个或多个并联的参考模块,所述参考模块包括两个串联且写入数据不同的第一参考单元和第二参考单元,所述第一参考单元、所述第二参考单元分别在进行写操作和读操作时的电流方向相同;数据通路,提供待读取数据且输出数据信号;放大电路,与所述参考电路和所述数据通路相连,用于比较所述数据信号和所述参考信号,并获得读取结果。The present application also provides a read operation circuit, including: a read reference circuit for providing a reference signal, including one or more reference modules connected in parallel, the reference modules including two first reference units connected in series and with different written data and the second reference unit, the current directions of the first reference unit and the second reference unit are the same when the write operation and the read operation are performed respectively; the data path provides the data to be read and outputs the data signal; the amplifier circuit, and The reference circuit is connected to the data path for comparing the data signal with the reference signal and obtaining a read result.
在本申请实施例中,所述参考电路还包括:第一参考位线,连接所述第一参考单元;第二参考位线,连接所述第二参考单元;参考源线,连接所述第一参考单元和所述第二参考单元;所述第一参考位线和所述第二参考位线中的一个连接所述放大电路,另一个接低电平,所述参考源线浮空。In this embodiment of the present application, the reference circuit further includes: a first reference bit line connected to the first reference cell; a second reference bit line connected to the second reference cell; and a reference source line connected to the first reference cell A reference unit and the second reference unit; one of the first reference bit line and the second reference bit line is connected to the amplifying circuit, the other is connected to a low level, and the reference source line is floating.
在本申请实施例中,所述第一参考单元写0,所述第二参考单元写1,所述第一参考位线连接所述放大电路,所述第二参考位线接低电平。In the embodiment of the present application, 0 is written in the first reference cell, 1 is written in the second reference cell, the first reference bit line is connected to the amplifying circuit, and the second reference bit line is connected to a low level.
在本申请实施例中,所述第一参考单元包括:第一MTJ单元,连接所述第一参考位线;第一晶体管,所述第一晶体管的第一电极连接所述第一MTJ单元,所述第一晶体管的第二电极连接所述参考源线和所述第二参考单元。In the embodiment of the present application, the first reference unit includes: a first MTJ unit, connected to the first reference bit line; a first transistor, a first electrode of the first transistor is connected to the first MTJ unit, The second electrode of the first transistor is connected to the reference source line and the second reference cell.
在本申请实施例中,所述第二参考单元包括:第二MTJ单元,连接所述第二参考位线;第二晶体管,所述第二晶体管的第一电极连接所述第二MTJ单元,所述第二晶体管的第二电极连接所述参考源线和所述第一晶体管的第二电极。In the embodiment of the present application, the second reference unit includes: a second MTJ unit connected to the second reference bit line; a second transistor, the first electrode of the second transistor is connected to the second MTJ unit, The second electrode of the second transistor is connected to the reference source line and the second electrode of the first transistor.
在本申请实施例中,所述数据通路包括数据存储单元,所述数据存储单元的一端连接位线,另一端连接源线,所述源线线连接所述放大电路。In the embodiment of the present application, the data path includes a data storage unit, one end of the data storage unit is connected to a bit line, the other end is connected to a source line, and the source line is connected to the amplifying circuit.
在本申请实施例中,所述数据信号为所述数据通路的输出电流,所述参考信号为所述参考电路的输出电流。In the embodiment of the present application, the data signal is the output current of the data path, and the reference signal is the output current of the reference circuit.
在本申请实施例中,所述放大电路包括灵敏放大器。In the embodiment of the present application, the amplifying circuit includes a sense amplifier.
本申请还提供一种存储单元,包括权利要求上述的读操作电路。The present application also provides a storage unit, including the read operation circuit described in the claims.
本申请技术方案的读参考电路包括一个或多个并联的参考模块,且每个参考模块包括两个串联且写入数据不同的第一参考单元和第二参考单元,并使所述第一参考单元和第二参考单元的读操作电流和写操作电流的方向一致,有效地解决了写″1″的参考单元容易发生read disturb的问题,显著提升了数据的保存性能,同时还能保证改进后的参考电路和整体阵列的一致性,打破了现有的读参考电路中读操作时的参考位线接高电平,参考源线接低电平的常规认知。The read reference circuit of the technical solution of the present application includes one or more reference modules connected in parallel, and each reference module includes two first reference cells and second reference cells that are connected in series and have different written data, and make the first reference The read operation current of the unit and the second reference unit are in the same direction as the write operation current, which effectively solves the problem of read disturb in the reference unit that writes "1", significantly improves the data storage performance, and also ensures that the improved The consistency of the reference circuit and the overall array breaks the conventional cognition that the reference bit line is connected to a high level and the reference source line is connected to a low level during a read operation in the existing read reference circuit.
附图说明Description of drawings
以下附图详细描述了本申请中披露的示例性实施例。其中相同的附图标记在附图的若干视图中表示类似的结构。本领域的一般技术人员将理解这些实施例是非限制性的、示例性的实施例,附图仅用于说明和描述的目的,并不旨在限制本申请的范围,其他方式的实施例也可能同样的完成本申请中的发明意图。应当理解,附图未按比例绘制。其中:The following figures describe in detail exemplary embodiments disclosed in this application. Where like reference numbers refer to similar structures throughout the several views of the drawings. Those of ordinary skill in the art will understand that these embodiments are non-limiting, exemplary embodiments, the accompanying drawings are for illustration and description purposes only, and are not intended to limit the scope of the application, and other embodiments are also possible The same accomplishes the inventive intent in this application. It should be understood that the figures are not drawn to scale. in:
图1为一种参考电路的结构示意图;1 is a schematic structural diagram of a reference circuit;
图2为本申请实施例的读参考电路的结构示意图;2 is a schematic structural diagram of a read reference circuit according to an embodiment of the present application;
图3为本申请实施例的读操作电路的结构示意图。FIG. 3 is a schematic structural diagram of a read operation circuit according to an embodiment of the present application.
具体实施方式Detailed ways
以下描述提供了本申请的特定应用场景和要求,目的是使本领域技术人员能够制造和使用本申请中的内容。对于本领域技术人员来说,对所公开的实施例的各种局部修改是显而易见的,并且在不脱离本申请的精神和范围的情况下,可以将这里定义的一般原理应用于其他实施例和应用。因此,本申请不限于所示的实施例,而是与权利要求一致的最宽范围。The following description provides specific application scenarios and requirements of the present application, and is intended to enable those skilled in the art to make and use the contents of the present application. Various partial modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments and without departing from the spirit and scope of the present application. application. Therefore, the present application is not to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the claims.
参考图1,一种参考电路,包括一个写″0″的参考单元(0cell)和一个写″1″的参考单元(1cell),其中所述写″0″的参考单元包括MTJ0和晶体管M0,所述MTJ0的一端连接参考位线BL_REF<1>,另一端连接所述晶体管M0,所述晶体管M0的一端连接源线SL。所述写″1″的参考单元(1cell)包括MTJ1和晶体管M1,所述MTJl的一端连接参考位线BL_REF<0>,另一端连接所述晶体管M1,所述晶体管M1的一端连接源线SL。Referring to FIG. 1, a reference circuit includes a reference cell (0cell) for writing "0" and a reference cell (1cell) for writing "1", wherein the reference cell for writing "0" includes MTJ0 and transistor M0, One end of the MTJ0 is connected to the reference bit line BL_REF<1>, the other end is connected to the transistor M0, and one end of the transistor M0 is connected to the source line SL. The reference cell (1cell) for writing "1" includes MTJ1 and a transistor M1, one end of the MTJ1 is connected to the reference bit line BL_REF<0>, the other end is connected to the transistor M1, and one end of the transistor M1 is connected to the source line SL .
所述写″0″的参考单元和写″1″的参考单元并联,进行读操作时所述位线BL_REF<1>和所述位线BL_REF<0>接高电平,所述源线SL接地,所述写″0″的参考单元的参考电流IP从FL(自由层)流向PL(固定层),参考电流IP的大小为V0/(RP+r0),V0为写″0″的参考单元两端的电压,RP为MTJ0的电阻,r0为晶体管M0的电阻。同理,所述写″1″的参考单元的参考电流IAP从FL(自由层)流向PL(固定层),参考电流IAP的大小为V1/(RAP+ri),V1为写″0″的参考单元两端的电压,RAP为MTJ1的电阻,r1为晶体管M1的电阻,所述写″0″的参考单元和写″1″的参考单元并联后的参考电流I=0.5(IP+IAP)。The reference cell for writing "0" and the reference cell for writing "1" are connected in parallel. When a read operation is performed, the bit line BL_REF<1> and the bit line BL_REF<0> are connected to a high level, and the source line SL Grounding, the reference current IP of the reference cell that writes "0" flows from FL (free layer) to PL (fixed layer), the magnitude of the reference current IP is V0/(R P + r0), and V0 is written "0""The voltage across the reference cell, R P is the resistance of MTJ0, and r0 is the resistance of transistor M0. In the same way, the reference current I AP of the reference cell that writes "1" flows from FL (free layer) to PL (fixed layer), the magnitude of the reference current I AP is V1/(R AP +ri), and V1 is "write" The voltage across the reference unit of 0", R AP is the resistance of MTJ1, r1 is the resistance of transistor M1, the reference current I=0.5 (I P + I AP ).
通常一组参考电路会供多条位线BL上的器件作参考,假设位线BL为2x条,那么流过参考器件的电荷总量为一般器件的2x倍,这使得参考器件中的电荷总量为一般器件的2x倍,由于写″1″的参考单元写入电流和参考电流IAP的流向不一致,这使得参考器件中的1cell发生读干扰(read disturb)的概率极大的提升,将大大限制整个MRAM的数据保留。Usually, a set of reference circuits will be used as a reference for devices on multiple bit lines BL. Assuming that there are 2x bit lines BL, the total amount of charge flowing through the reference device is 2x times that of the general device, which makes the total charge in the reference device. The amount is 2x times that of the general device. Since the writing current of the reference cell that writes "1" is inconsistent with the flow direction of the reference current I AP , this greatly increases the probability of read disturb in 1 cell in the reference device, and the Greatly limits the data retention of the entire MRAM.
本申请技术方案提供一种读参考电路,突破了读操作时参考位线接高电平,参考源线接低电平的常规认知,通过更改参考电路的实现形式来提高可靠性,其将0cell和1cell串联使用,来实现参考电流流向与MTJ写入数据保持一致,解决了MRAM容易发生readdisturb的问题,有效提高数据的保存性能,同时还能保证改进后的参考电路和整体阵列(array)的一致性。The technical solution of the present application provides a read reference circuit, which breaks through the conventional cognition that the reference bit line is connected to a high level and the reference source line is connected to a low level during a read operation, and the reliability is improved by changing the implementation form of the reference circuit. 0cell and 1cell are used in series to make the reference current flow consistent with the data written in MTJ, which solves the problem that MRAM is prone to readdisturb, effectively improves the data storage performance, and at the same time ensures the improved reference circuit and overall array (array) consistency.
下面结合实施例和附图对本申请技术方案进行详细说明。The technical solutions of the present application will be described in detail below with reference to the embodiments and the accompanying drawings.
参考图2,本申请实施例的读参考电路包括参考模块11,所述参考模块11的数量可以是一个或多个,各参考模块11间采用并联的连接方式。本申请实施例以两个并联的参考模块为例进行说明。Referring to FIG. 2 , the read reference circuit of the embodiment of the present application includes reference modules 11 , the number of the reference modules 11 may be one or more, and the reference modules 11 are connected in parallel. The embodiment of the present application takes two parallel reference modules as an example for description.
所述参考模块11包括串联的第一参考单元111和第二参考单元112,所述第一参考单元111和第二参考单元112的写入数据不同,例如使所述第一参考单元111写“0”,使所述第二参考单元112写“1”,或者所述第一参考单元111写“1”,使所述第二参考单元112写“0”。本申请实施例规定,写“0”时,电流自MTJ单元的自由层流向固定层,写“1”时,电流自MTJ单元的固定层流向自由层。在其他实施例中,也可以规定写“0”时,电流自MTJ单元的固定层流向自由层,写“1”时,电流自MTJ单元的自由层流向固定层,根据实际情况进行编程。The reference module 11 includes a
本申请实施例的第一参考单元111进行写操作和读操作时具有相同的电流流向,所述第二参考单元112进行写操作和读操作时也具有相同的电流流向,由于所述第一参考单元111和所述第二参考单元112串联,所以流经所述第一参考单元111和所述第二参考单元112的电流的流向及大小均相同。所述第一参考单元111、所述第二参考单元112分别在写操作和读操作时的电流方向相同,可以避免参考单元发生read disturb。The
所述读参考电路还包括第一参考位线BL_REF<1>、第二参考位线BL_REF<2>及参考源线SL_REF,所述第一参考位线BL_REF<1>连接所述第一参考单元111,也即所述第一参考位线BL_REF<1>连接所述参考模块11的一端,所述第二参考位线BL_REF<2>连接所述第二参考单元112,也即所述第二参考位线BL_REF<2>连接所述参考模块11的另一端。所述参考源线SL_REF连接各参考模块11的第一参考单元111和第二参考单元112,也即所有的参考单元共用一参考源线SL_REF。The read reference circuit further includes a first reference bit line BL_REF<1>, a second reference bit line BL_REF<2> and a reference source line SL_REF, the first reference bit line BL_REF<1> is connected to the
其中,所述第一参考位线BL_REF<1>和所述第二参考位线BL_REF<2>中的一个用于输出参考信号,另一个连接低电平,所述参考源线SL_REF浮空。本申请实施例使写″0″的参考单元连接的参考位线用于输出参考信号,写″1″的参考单元连接的参考位线接低电平。在本申请实施例中,所述第一参考单元111写″0″,与所述第一参考单元111相连的第一参考位线BL_REF<1>用于输出参考信号,所述第二参考单元111写″1″,与所述第二参考单元112相连的第二参考位线BL_REF<2>连接低电平。在其他实施例中,也可以规定所述第一参考单元111写″1″,与所述第一参考单元111相连的第一参考位线BL_REF<1>连接低电平,所述第二参考单元111写″0″,与所述第二参考单元112相连的第二参考位线BL_REF<2>用于输出参考信号,所述参考源线SL_REF浮空。Wherein, one of the first reference bit line BL_REF<1> and the second reference bit line BL_REF<2> is used to output a reference signal, the other is connected to a low level, and the reference source line SL_REF is floating. In this embodiment of the present application, the reference bit line connected to the reference cell written with "0" is used for outputting a reference signal, and the reference bit line connected to the reference cell written with "1" is connected to a low level. In this embodiment of the present application, the
本申请实施例通过设计第一参考位线BL_REF<1>、第二参考位线BL_REF<2>及参考源线SL_REF的连接方式,以使所述第一参考单元111在写操作和读操作时的电流方向相同,且所述第二参考单元112在写操作和读操作时的电流方向也相同,避免了因写″1″的参考单元的写入电流和参考电流的流向不一致,导致写″1″的参考单元发生read disturb的现象。In this embodiment of the present application, the connection mode of the first reference bit line BL_REF<1>, the second reference bit line BL_REF<2> and the reference source line SL_REF is designed, so that the
继续参照图2,所述第一参考单元111包括第一MTJ单元(0cell)和第一晶体管M1,所述第一MTJ单元(0cell)连接所述第一参考位线BL_REF<1>,且写入电流和参考电流IREF均从FL(自由层)流向PL(固定层)。所述第一晶体管M1的第一电极连接所述第一MTJ单元(0cell),所述第一晶体管M1的第二电极连接所述参考源线SL_REF和所述第二参考单元112。在本申请实施例中,所述第一晶体管M1可以是PMOS管,所述第一晶体管M1的第一电极可以是源极,所述第一晶体管M1的第二电极可以是漏极。Continuing to refer to FIG. 2 , the
所述第二参考单元112包括第二MTJ单元(1cell)和第二晶体管M2,所述第二MTJ单元(1cell)连接所述第二参考位线BL_REF<2>,流经所述第二MTJ单元(1cell)的写入电流和参考电流的方向均自PL至FL。所述第二晶体管M2的第一电极连接所述第二MTJ单元(1cell),所述第二晶体管M2的第二电极连接所述参考源线SL_REF和所述第一晶体管M1的第二电极。在本申请实施例中,所述第二晶体管M2可以是PMOS管,所述第二晶体管M2的第一电极可以是漏极,所述第二晶体管M2的第二电极可以是源极。The
本申请实施例的读参考电路采用共用参考源线SL_REF的连接方式,将两个参考单元串联构成一组参考模块,再将多组参考模块并联组成参考模块。在写入数据时,与所述第一参考位线BL_REF<1>连接的参考单元写入的数据为″0″,与所述第二参考位线BL_REF<2>连接的参考单元写入的数据为″1″;在读操作时,将所述第一参考位线BL_REF<1>连接到放大模块(例如灵敏放大器)中,所述第二参考位线BL_REF<2>接地,所述参考源线SL_REF浮空,当并联组数为2时,得到的参考电流IREF为:The read reference circuit of the embodiment of the present application adopts the connection mode of the shared reference source line SL_REF, two reference units are connected in series to form a set of reference modules, and then multiple sets of reference modules are connected in parallel to form a reference module. When writing data, the data written in the reference cell connected to the first reference bit line BL_REF<1> is "0", and the data written in the reference cell connected with the second reference bit line BL_REF<2> The data is "1"; during the read operation, the first reference bit line BL_REF<1> is connected to an amplification module (such as a sense amplifier), the second reference bit line BL_REF<2> is grounded, and the reference source Line SL_REF is floating, when the number of parallel groups is 2, the obtained reference current I REF is:
IREF=2V/(RP+RAP+2×r);I REF =2V/(R P +R AP +2×r);
其中,V为所述第一参考单元111和所述第二参考单元112的总电压,RP为所述第一MTJ单元(0cell)的阻值,RAP为所述第二MTJ单元(1cell)的阻值,r为所述第一晶体管M1和所述第二晶体管M2的阻值。所述IREF的大小在图1所示的IP和IAP之间。Wherein, V is the total voltage of the
对于所述第一参考位线BL_REF<1>的第一MTJ单元(0cell)而言,电流方向是从FL流向PL,与写入数据″0″的电流方向相同;对于所述第二参考位线BL_REF<2>的第二MTJ单元(1cell)而言,电流方向是从PL流向FL,与写入数据″1″的电流方向相同,这样就避免了参考单元发生read disturb的可能。For the first MTJ cell (0 cell) of the first reference bit line BL_REF<1>, the current direction is from FL to PL, which is the same as the current direction of writing data "0"; for the second reference bit For the second MTJ cell (1cell) of line BL_REF<2>, the current direction is from PL to FL, which is the same as the current direction of writing data "1", thus avoiding the possibility of read disturb in the reference cell.
参考图3,本申请实施例还提供一种读操作电路,包括参考电路1、数据通路2及放大电路3。其中,所述参考电路1用于提供参考信号,所述数据通路2用于提供待读取数据并输出数据信号,所述放大电路3用于比较所述数据信号和所述参考信号,并获得读取结果。Referring to FIG. 3 , an embodiment of the present application further provides a read operation circuit, including a
所述参考电路1包括一个或多个并联的参考模块11,所述参考模块11包括两个串联且写入数据不同的第一参考单元111和第二参考单元112,且所述第一参考单元111、所述第二参考单元112分别在进行写操作和读操作时的电流方向相同,可以避免各参考单元发生read disturb的可能,有效地提高MRAM的数据保存性能。The
所述参考电路1还包括第一参考位线BL_REF<1>、第二参考位线BL_REF<2>及参考源线SL_REF,所述第一参考位线BL_REF<1>连接所述第一参考单元111,所述第二参考位线BL_REF<2>连接所述第二参考单元112,所述参考源线SL_REF连接所述第一参考单元111和所述第二参考单元112。其中,所述第一参考位线BL_REF<1>和所述第二参考位线BL_REF<2>中的一个连接所述放大电路3,另一个连接低电平,而所述参考源线SL_REF浮空。在本申请实施例中,写″0″的参考单元连接的参考位线连接放大电路3,写″1″的参考单元连接的参考位线接低电平,也即所述第一参考位线BL_REF<1>连接所述放大电路3,用于输出参考信号,所述第二参考位线BL_REF<2>连接低电平,提供低电位,加之所述参考源线SL_REF无电流通过,使读参考电路为串联电路,以保证参考电流自所述第一参考单元111流至所述第二参考单元112。The
继续参考图3,所述第一参考单元111包括第一MTJ单元(0cell)和第一晶体管M1,所述第一MTJ单元与所述第一参考位线BL_REF<1>连接,存储数据″0″,所述第一晶体管M1的第一电极连接所述第一MTJ单元(0cell),所述第一晶体管M1的第二电极连接所述参考源线SL_REF和所述第二参考单元112。其中,所述第一晶体管M1可以是PMOS管,所述第一晶体管M1的第一电极可以是源极,所述第一晶体管M1的第二电极可以是漏极。Continuing to refer to FIG. 3 , the
所述第二参考单元112包括第二MTJ单元(1cell)和第二晶体管M2,所述第二MTJ单元(1cell)与所述第二参考位线BL_REF<2>相连,存储数据″1″,所述第二晶体管M2的第二电极连接所述参考源线SL_REF和所述第一晶体管M1的第二电极。其中,所述第二晶体管M2可以是PMOS管,所述第二晶体管M2的第一电极可以是漏极,所述第二晶体管M2的第二电极可以是源极。The
所述数据通路2包括数据存储单元21,所述数据存储单元21的数量可以是多个,用于存储相同或不同的数据,所述数据存储单元21的一端连接位线BL,另一端连接源线SL,所述源线SL连接所述放大电路3。The
所述数据存储单元21包括MTJ单元(cell)和晶体管M0,所述MTJ单元(cell)的自由层(FL)与所述位线BL相连,所述MTJ单元(cell)的固定层(PL)与所述晶体管M0的第一电极相连,所述晶体管M0的第二电极与所述源线SL相连,其中所述晶体管M0可以是PMOS,所述晶体管M0的第一电极可以是源极,所述晶体管M0的第二电极可以是漏极。The data storage unit 21 includes an MTJ cell (cell) and a transistor M0, a free layer (FL) of the MTJ cell (cell) is connected to the bit line BL, and a fixed layer (PL) of the MTJ cell (cell) is connected to the first electrode of the transistor M0, and the second electrode of the transistor M0 is connected to the source line SL, wherein the transistor M0 may be a PMOS, and the first electrode of the transistor M0 may be a source, so The second electrode of the transistor M0 may be a drain electrode.
所述放大电路3与所述参考电路1和所述数据通路2相连,具体地,所述放大电路3连接所述参考电路1的第一参考位线BL_REF<1>和所述数据通路2的位线BL,用于比较所述数据通路2的数据信号和所述参考电路1的参考信号,并获得读取结果。在一些实施例中,所述数据信号为所述数据通路2的输出电流Icell,所述参考信号为所述参考电路1的输出电流IREF,若输出电流Icell大于输出电流IREF,则读取的结果为″1″;若输出电流Icell小于输出电流IREF,则读取的结果为″0″。The amplifying circuit 3 is connected to the
本申请实施例通过将读参考电路中写″0″的参考单元连接的参考位线输出参考信号,而使写″1″的参考单元连接的参考位线接低电平,并使两个参考单元共用的源线浮空,使参考单元间进行串联,同时使各参考单元的写操作电流和读操作电流的方向相同,解决了因写″1″的参考单元的写入电流和参考电流的流向不一致,而导致的read disturb问题,大幅度提升读参考电路的读取性能。In the embodiment of the present application, the reference bit line connected to the reference cell written with "0" in the read reference circuit outputs a reference signal, the reference bit line connected to the reference cell written with "1" is connected to a low level, and the two reference The source line shared by the cells is floating, so that the reference cells are connected in series, and at the same time, the direction of the write operation current and the read operation current of each reference cell is the same, which solves the problem of the write current and the reference current of the reference cell due to writing "1". The read disturb problem caused by the inconsistent flow direction greatly improves the read performance of the read reference circuit.
本申请实施例还提供一种存储单元,包括上述的读操作电路。Embodiments of the present application further provide a storage unit including the above-mentioned read operation circuit.
综上所述,在阅读本申请内容之后,本领域技术人员可以明白,前述申请内容可以仅以示例的方式呈现,并且可以不是限制性的。尽管这里没有明确说明,本领域技术人员可以理解本申请意图囊括对实施例的各种合理改变,改进和修改。这些改变,改进和修改都在本申请的示例性实施例的精神和范围内。In conclusion, after reading the contents of this application, those skilled in the art can understand that the foregoing contents of the application may be presented by way of example only, and may not be limiting. Although not explicitly described herein, it will be understood by those skilled in the art that this application is intended to cover various reasonable changes, improvements and modifications to the embodiments. Such changes, improvements and modifications are within the spirit and scope of the exemplary embodiments of the present application.
应当理解,本实施例使用的术语″和/或″包括相关联的列出项目中的一个或多个的任意或全部组合。应当理解,当一个元件被称作″连接″或″耦接″至另一个元件时,其可以直接地连接或耦接至另一个元件,或者也可以存在中间元件。It should be understood that the term "and/or" as used in this embodiment includes any and all combinations of one or more of the associated listed items. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present.
类似地,应当理解,当诸如层、区域或衬底之类的元件被称作在另一个元件″上″时,其可以直接在另一个元件上,或者也可以存在中间元件。与之相反,术语″直接地″表示没有中间元件。还应当理解,术语″包含″、″包含着″、″包括″或者″包括着″,在本申请文件中使用时,指明存在所记载的特征、整体、步骤、操作、元件和/或组件,但并不排除存在或附加一个或多个其他特征、整体、步骤、操作、元件、组件和/或它们的组。Similarly, it will be understood that when an element such as a layer, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, the term "directly" means without intervening elements. It should also be understood that the terms "comprising", "comprising", "including" or "comprising", when used in this application document, indicate the presence of the recited features, integers, steps, operations, elements and/or components, It does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof.
还应当理解,尽管术语第一、第二、第三等可以在此用于描述各种元件,但是这些元件不应当被这些术语所限制。这些术语仅用于将一个元件与另一个元件区分开。因此,在没有脱离本申请的教导的情况下,在一些实施例中的第一元件在其他实施例中可以被称为第二元件。相同的参考标号或相同的参考标记符在整个说明书中表示相同的元件。It will also be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, a first element in some embodiments could be termed a second element in other embodiments without departing from the teachings of the present application. The same reference numerals or the same reference signs refer to the same elements throughout the specification.
此外,本申请说明书通过参考理想化的示例性截面图和/或平面图和/或立体图来描述示例性实施例。因此,由于例如制造技术和/或容差导致的与图示的形状的不同是可预见的。因此,不应当将示例性实施例解释为限于在此所示出的区域的形状,而是应当包括由例如制造所导致的形状中的偏差。例如,被示出为矩形的蚀刻区域通常会具有圆形的或弯曲的特征。因此,在图中示出的区域实质上是示意性的,其形状不是为了示出器件的区域的实际形状也不是为了限制示例性实施例的范围。Furthermore, this specification describes example embodiments with reference to idealized example cross-sectional and/or plan and/or perspective views. Accordingly, variations from the shapes illustrated are foreseeable due to, for example, manufacturing techniques and/or tolerances. Thus, example embodiments should not be construed as limited to the shapes of regions shown herein, but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched area shown as a rectangle will typically have rounded or curved features. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device nor to limit the scope of example embodiments.
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