CN114447184A - Transfer device, transfer method of light emitting diode and display panel - Google Patents

Abstract

The application discloses a transfer device, a transfer method of a light emitting diode and a display panel. The transfer device is used for transferring the light emitting diode and comprises a rigid substrate, a flexible transfer head and an adhesive layer; a flexible transfer head disposed on one side of the rigid substrate; an adhesive layer is bonded between the rigid substrate and the flexible transfer head. The application can realize the huge transfer of the Micro LED by adopting a primary transfer mode.

Description

Transfer device, transfer method of light emitting diode, and display panel

technical field

The present application relates to the field of display technology, and in particular, to a transfer device, a method for transferring light-emitting diodes, and a display panel.

Background technique

Micro light-emitting diode (Micro Light-Emitting Diode, MicroLED) is a traditional light-emitting diode (Light Emitting Diode, LED) structure is miniaturized and matrixed, and the integrated circuit process is used to make the substrate to be transferred, and the MicroLED is transferred through mass transfer technology. It is transferred to the substrate to be transferred to realize the display technology of addressing control and individual driving of each pixel. Because MicroLED display products are superior to liquid crystal display products and organic light emitting diode display products in performance indicators such as brightness, life, contrast, response time, energy consumption, viewing angle, and resolution, plus they have self-illumination, simple structure, The advantages of small size and energy saving are regarded as the next generation display technology and have received extensive attention.

In MicroLED display technology, how to transfer a large number of MicroLED chips to the substrate to be transferred has become a major challenge of Micro LED mass transfer technology. In the existing method for mass transfer of Micro LEDs, it usually requires two transfers to successfully transfer a large number of Micro LEDs to the substrate to be transferred. However, the above transfer method increases the manufacturing process of the display panel and greatly reduces the Production efficiency of display panels.

SUMMARY OF THE INVENTION

Embodiments of the present application provide a transfer device, a transfer method for light-emitting diodes, and a display panel, which can realize mass transfer of Micro LEDs by one-time transfer.

An embodiment of the present application provides a transfer device for transferring light-emitting diodes, and the transfer device includes:

rigid base;

a flexible transfer head disposed on one side of the rigid substrate; and

an adhesive layer, adhered between the rigid substrate and the flexible transfer head.

Optionally, in some embodiments of the present application, the material of the adhesive layer is pyrolytic adhesive or photolytic adhesive.

Optionally, in some embodiments of the present application, the flexible transfer head includes a flexible base and a flexible protrusion disposed on the flexible base, and the flexible protrusion is located on the flexible base away from the rigid base. side.

Optionally, in some embodiments of the present application, the elastic modulus of the flexible protrusion is smaller than the elastic modulus of the flexible substrate.

Optionally, in some embodiments of the present application, the flexible base and the flexible protrusion are integrally formed.

Optionally, in some embodiments of the present application, the transfer device further includes an adhesive layer, and the adhesive layer is disposed on a surface of the flexible transfer head away from the rigid substrate.

The embodiments of the present application also provide a transfer method for transferring light-emitting diodes by using a transfer device, the transfer device includes a rigid substrate, a flexible transfer head, and an adhesive layer bonded between the rigid substrate and the flexible transfer head, and the transfer method Include the following steps:

providing a growth substrate, the growth substrate comprising a growth substrate and a light emitting diode disposed on one side of the growth substrate;

Picking up the light emitting diode with the flexible transfer head;

removing the rigid substrate; and

A target substrate is provided and the light emitting diodes on the flexible transfer head are placed on the target substrate.

Optionally, in some embodiments of the present application, the material of the adhesive layer is ultraviolet photolysis adhesive, and the step of removing the rigid substrate includes: irradiating the adhesive layer with ultraviolet light .

Optionally, in some embodiments of the present application, the step of placing the light-emitting diode on the flexible transfer head on the target substrate includes:

facing the target substrate on the side of the flexible transfer head with the light emitting diode;

The flexible transfer head is deformed according to the shape of the target substrate, so that the light emitting diodes on the flexible transfer head are attached to the target substrate.

An embodiment of the present application further provides a display panel, the display panel includes a driving substrate and a light emitting diode disposed on one side of the driving substrate, and the light emitting diode is transferred by the transfer method of the light emitting diode described in any of the foregoing embodiments get.

Compared with the transfer device for transferring light-emitting diodes in the prior art, the transfer device provided by the present application includes a rigid substrate, a flexible transfer head, and an adhesive layer bonded between the rigid substrate and the flexible transfer head. The substrate is used as a carrying substrate for the flexible transfer head, which is used to pick up and place light-emitting diodes, and the flexible transfer head can deform due to its flexibility. When the above-mentioned transfer device is used to transfer the light-emitting diodes, even if the target substrate is a curved substrate, since the flexible transfer head can deform accordingly with the shape of the target substrate, the light-emitting diodes can be transferred to the target substrate with only one transfer. Therefore, the manufacturing process of the display panel is saved, and the production efficiency of the display panel is increased.

Description of drawings

In order to explain the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the accompanying drawings that are used in the description of the embodiments. As far as technical personnel are concerned, other drawings can also be obtained based on these drawings without any creative effort.

FIG. 1 is a schematic structural diagram of a transfer device provided by a first embodiment of the present application.

FIG. 2 is a schematic structural diagram of a transfer device provided by a second embodiment of the present application.

FIG. 3 is a schematic structural diagram of a transfer device provided by a third embodiment of the present application.

FIG. 4 is a schematic structural diagram of a transfer device provided by a fourth embodiment of the present application.

FIG. 5 is a schematic structural diagram of a transfer device provided by a fifth embodiment of the present application.

FIG. 6 is a schematic flowchart of a method for transferring a light emitting diode provided by the present application.

7A to 7H are schematic structural diagrams obtained in sequence in each step in the transfer method of the light emitting diode shown in FIG. 6 .

FIG. 8 is a schematic structural diagram of a display panel provided by the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application. In addition, it should be understood that the specific embodiments described herein are only used to illustrate and explain the present application, but not to limit the present application. In this application, unless otherwise stated, the directional words used such as "upper" and "lower" generally refer to the upper and lower sides of the device in actual use or working state, specifically the drawing direction in the accompanying drawings ; while "inside" and "outside" refer to the outline of the device.

The present application provides a transfer device, a transfer method for light emitting diodes, and a display panel. Each of them will be described in detail below.

It should be noted that the light-emitting diodes in the present application may be MicroLEDs or mini light-emitting diodes (Mini Light-Emitting Diodes, Mini LEDs), and the present application does not specifically limit the types of light-emitting diodes.

The present application provides a transfer device for transferring light emitting diodes. The transfer device includes a rigid substrate, a flexible transfer head, and an adhesive layer. The flexible transfer head is arranged on one side of the rigid substrate. The adhesive layer is bonded between the rigid substrate and the flexible transfer head.

Therefore, in the transfer device provided by the present application, the rigid substrate is used as the carrying substrate of the flexible transfer head, the flexible transfer head is used to pick up and place the light-emitting diodes, and the flexible transfer head can deform due to its flexibility. When the above-mentioned transfer device is used to transfer the light-emitting diodes, even if the target substrate is a curved substrate, since the flexible transfer head can deform accordingly with the shape of the target substrate, the light-emitting diodes can be transferred to the target substrate with only one transfer. Therefore, the manufacturing process of the display panel is saved, and the production efficiency of the display panel is increased.

The transfer device provided by the present application will be described in detail below through specific embodiments. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.

Referring to FIG. 1 , a first embodiment of the present application provides a transfer device 10 . The transfer device 10 is used for transferring the light emitting diodes, and specifically for transferring the light emitting diodes to be transferred on the growth substrate to the target substrate 30 . The transfer device 10 includes a rigid substrate 11 , a flexible transfer head 12 and an adhesive layer 13 .

The material of the rigid substrate 11 can be glass, metal or ceramics, which has high strength and is used to carry the flexible transfer head 12 . Among them, the rigid substrate 11 has a high flatness, so as to facilitate the combination with the flexible transfer head 12 .

The flexible transfer head 12 is provided on one side of the rigid substrate 11 . The flexible transfer head 12 is used to pick and place light emitting diodes. The flexible transfer head 12 has good flexibility and can be deformed under the action of external force.

The flexible transfer head 12 may be a flexible photoresist layer, a flexible adhesive film or other flexible material layers. In this embodiment, the flexible transfer head 12 has adhesiveness, and specifically, it can be a flexible adhesive film. The entire surface of the flexible adhesive film is adhered to the side of the adhesive layer 13 away from the rigid substrate 11 . Since the flexible adhesive film is viscous, during the transfer process of the light-emitting diode, the light-emitting diode is adhered by the adsorption force of the flexible adhesive film itself, so as to realize the pick-up and placement of the light-emitting diode.

Specifically, the material of the flexible transfer head 12 may include Polyimide (PI), Polymethyl Methacrylate (PMMA) or Polyethyleneterephthalate (PET) and other organic polymer materials.

The adhesive layer 13 is adhered between the rigid substrate 11 and the flexible transfer head 12 for fixing the rigid substrate 11 and the flexible transfer head 12 . In this embodiment, the adhesive layer 13 needs to be removed during the transfer process of the light emitting diodes to separate the rigid substrate 11 and the flexible transfer head 12 .

Wherein, the material of the adhesive layer 13 may be pyrolytic adhesive or photolytic adhesive. Specifically, when the material of the adhesive layer 13 is a pyrolytic adhesive, the adhesive layer 13 can be debonded by heating, and the pyrolytic adhesive may include phenolic resin, urea-formaldehyde resin, melamine resin, unsaturated polyester resin, cyclic resin One or more of oxygen resin, silicone resin and polyurethane; when the material of the adhesive layer 13 is photolysis adhesive, the adhesive layer 13 is debonded by performing light treatment on the adhesive layer 13, for example, when When the photolysis glue is ultraviolet photolysis glue, the adhesive layer 13 is debonded by irradiating the adhesive layer 13 with ultraviolet light, so that the rigid substrate 11 and the flexible transfer head 12 can be separated.

Referring to FIG. 2 , a second embodiment of the present application provides a transfer device 10 . The difference between the transfer device 10 provided in the second embodiment of the present application and the first embodiment is that the flexible transfer head 12 does not have adhesiveness, and the transfer device 10 further includes an adhesive layer 14 , and the adhesive layer 14 is disposed on the flexible transfer head 12 is remote from the surface of the rigid base 11 .

The flexible transfer head 12 may be a flexible photoresist layer. The adhesive layer 14 is attached to the side of the flexible transfer head 12 away from the adhesive layer 13 . The adhesive layer 14 may be a flexible adhesive film. Since the flexible adhesive film is viscous, during the transfer process of the light-emitting diode, the light-emitting diode is adhered by the adsorption force of the flexible adhesive film itself, so as to realize the pick-up and placement of the light-emitting diode.

Referring to FIG. 3 , a third embodiment of the present application provides a transfer device 10 . The transfer device 10 is used for transferring the light emitting diodes, and specifically for transferring the light emitting diodes to be transferred on the growth substrate to the target substrate 30 . The transfer device 10 includes a rigid substrate 11 , a flexible transfer head 12 and an adhesive layer 13 .

The material of the rigid substrate 11 can be glass, metal or ceramics, which has high strength and is used to carry the flexible transfer head 12 . Among them, the rigid substrate 11 has a high flatness, so as to facilitate the combination with the flexible transfer head 12 .

The flexible transfer head 12 is provided on one side of the rigid substrate 11 . The flexible transfer head 12 is used to pick and place light emitting diodes. The flexible transfer head 12 has good flexibility and can be deformed under the action of external force.

In this embodiment, the flexible transfer head 12 includes a flexible base 121 and a flexible protrusion 122 disposed on the flexible base 121 , and the flexible protrusion 122 is located on the side of the flexible base 121 away from the rigid base 11 .

The flexible substrate 121 does not have adhesion, and the flexible substrate 121 may be a flexible photoresist layer or other flexible material layers. The entire surface of the flexible substrate 121 is adhered to the side of the adhesive layer 13 away from the rigid substrate 11 . Specifically, the material of the flexible substrate 121 may include organic polymer materials such as PI, PMMA, or PET.

The side of the flexible protrusion 122 away from the flexible substrate 121 matches the surface of the light emitting diode to be transferred, so that when the flexible protrusion 122 picks up the light emitting diode, the connection stability between the two can be ensured.

In this embodiment, the elastic modulus of the flexible protrusion 122 is smaller than the elastic modulus of the flexible base 121 . Under the above setting, when the external force applied to the flexible transfer head 12 is constant, the degree of elastic deformation of the flexible protrusions 122 is greater than that of the flexible base 121. Therefore, when the rigidity of the flexible base 121 remains unchanged, the The deformability of the flexible transfer head 12 is improved by increasing the flexibility of the flexible protrusions 122 .

In this embodiment, the flexible protrusion 122 has adhesiveness. The material of the flexible protrusion 122 may be flexible glue. Since the flexible glue is viscous, during the transfer process of the light-emitting diode, the light-emitting diode is adhered by the adsorption force of the flexible glue itself, so as to realize the pick-up and placement of the light-emitting diode.

Specifically, the material of the flexible protrusion 122 may include organic polymer materials such as PI, PMMA, or PET.

The adhesive layer 13 is adhered between the rigid substrate 11 and the flexible transfer head 12 for fixing the rigid substrate 11 and the flexible transfer head 12 . In this embodiment, the adhesive layer 13 needs to be removed during the transfer process of the light emitting diodes to separate the rigid substrate 11 and the flexible transfer head 12 .

Wherein, the material of the adhesive layer 13 may be pyrolytic adhesive or photolytic adhesive. Specifically, when the material of the adhesive layer 13 is a pyrolytic adhesive, the adhesive layer 13 can be debonded by heating, and the pyrolytic adhesive may include phenolic resin, urea-formaldehyde resin, melamine resin, unsaturated polyester resin, cyclic resin One or more of oxygen resin, silicone resin and polyurethane; when the material of the adhesive layer 13 is photolysis adhesive, the adhesive layer 13 is debonded by performing light treatment on the adhesive layer 13, for example, when When the photolysis glue is ultraviolet photolysis glue, the adhesive layer 13 is debonded by irradiating the adhesive layer 13 with ultraviolet light, so that the rigid substrate 11 and the flexible transfer head 12 can be separated.

Referring to FIG. 4 , a fourth embodiment of the present application provides a transfer device 10 . The difference between the transfer device 10 provided in the fourth embodiment of the present application and the third embodiment is that the flexible substrate 121 has adhesion, the material of the flexible substrate 121 and the material of the flexible protrusion 122 are the same, and the flexible substrate 121 and the flexible protrusion From 122 integral molding.

Specifically, the flexible substrate 121 and the flexible protrusion 122 are prepared by the same process. For example, when the flexible transfer head 12 is a flexible adhesive film, the flexible adhesive film can be obtained by sequentially pouring adhesive, curing and patterning in a mold, wherein, after patterning, a flexible protrusion can be formed. 122 flexible film. Under the above arrangement, the present embodiment can simplify the preparation process of the transfer device 10, which is beneficial to save the process cost.

Referring to FIG. 5 , a fifth embodiment of the present application provides a transfer device 10 . The difference between the transfer device 10 provided in the fifth embodiment of the present application and the fourth embodiment is that the flexible transfer head 12 does not have adhesiveness, and the transfer device 10 further includes an adhesive layer 14, and the adhesive layer 14 is disposed on the flexible transfer head 12 is remote from the surface of the rigid base 11 .

The flexible transfer head 12 may be a flexible photoresist layer. The adhesive layer 14 is attached to the side of the flexible protrusion 122 away from the adhesive layer 13 . The adhesive layer 14 may be a flexible adhesive film. Since the flexible adhesive film is viscous, during the transfer process of the light-emitting diode, the light-emitting diode is adhered by the adsorption force of the flexible adhesive film itself, so as to realize the pick-up and placement of the light-emitting diode.

Referring to FIG. 6 , the present application also provides a method for transferring light-emitting diodes, which includes the following steps:

S1: Provide a transfer device and a growth substrate, the transfer device includes a rigid substrate, a flexible transfer head, and an adhesive layer bonded between the rigid substrate and the flexible transfer head, and the growth substrate includes a growth substrate and a growth substrate disposed on one side of the growth substrate led;

S2: Use the flexible transfer head to pick up the light-emitting diode;

S3: remove rigid base;

S4: Provide a target substrate, and place the light emitting diodes on the flexible transfer head on the target substrate.

Therefore, in the light-emitting diode transfer method provided by the present application, since the rigid substrate and the flexible transfer head are bonded by the adhesive layer, after the light-emitting diode is picked up by the flexible transfer head, the rigid substrate can be removed by removing the rigid substrate. It is separated from the flexible transfer head, and then the light-emitting diodes on the flexible transfer head are transferred to the target substrate. Since the flexible transfer head can deform according to the shape of the target substrate, the light emitting diodes can be transferred to the target substrate only after one transfer, thus saving the production process of the display panel and increasing the production of the display panel. efficiency.

Please refer to FIG. 6 and FIG. 7A to FIG. 7H together, and the transfer method of the light emitting diode 22 provided by the present application will be described in detail below through specific embodiments.

Step S1: provide a transfer device 10 and a growth substrate 20, the transfer device 10 includes a rigid substrate 11, a flexible transfer head 12, and an adhesive layer 13 adhered to the rigid substrate 11 and the flexible transfer head 12, and the growth substrate 20 includes a growth substrate 21 and a light emitting diode 22 disposed on one side of the growth substrate 21, as shown in FIG. 7A.

Wherein, the material of the rigid substrate 11 may be glass, metal, or ceramics, which have high strength and are used to carry the flexible transfer head 12 . Among them, the rigid substrate 11 has a high flatness, so as to facilitate the combination with the flexible transfer head 12 .

The flexible transfer head 12 is provided on one side of the rigid substrate 11 . The flexible transfer head 12 is used to pick and place the light emitting diodes 22 . The flexible transfer head 12 has good flexibility and can be deformed under the action of external force.

In this embodiment, the flexible transfer head 12 has adhesiveness. The material of the flexible transfer head 12 is flexible glue. The surface of the flexible transfer head 12 is provided with flexible protrusions 122 . During the transfer process of the light emitting diodes 22 , the light emitting diodes 22 are adhered by the adsorption force of the flexible protrusions 122 , so as to realize the picking and placing of the light emitting diodes 22 .

The adhesive layer 13 is bonded between the rigid substrate 11 and the flexible transfer head 12 . In this embodiment, the material of the adhesive layer 13 is photolysis glue, such as ultraviolet photolysis glue. The adhesive layer 13 is debonded by irradiating the adhesive layer 13 with ultraviolet light, so that the rigid substrate 11 and the flexible transfer head 12 can be separated in the subsequent transfer process.

The growth substrate 21 may be a sapphire substrate or a gallium arsenide substrate. The light-emitting diode 22 is fabricated on the growth substrate 21 .

Step S2 : using the flexible transfer head 12 to pick up the light emitting diodes 22 .

Specifically, step S2 includes:

Step S21 : Align the transfer device 10 with the growth substrate 20 so that the side of the transfer device 10 with the flexible transfer head 12 faces the side of the growth substrate 20 with the light emitting diodes 22 , as shown in FIG. 7B .

Step S22 : the flexible transfer head 12 adheres the light emitting diodes 22 , as shown in FIG. 7C .

Specifically, the transfer device 10 is moved down to contact with the light emitting diodes 22 , so that the flexible transfer head 12 adheres to the light emitting diodes 22 .

Step S23 : moving the transfer device 10 , under the action of the adsorption force of the flexible transfer head 12 , the light emitting diodes 22 are detached from the growth substrate 21 , as shown in FIG. 7D .

Step S3: Remove the rigid base 11 .

Specifically, step S3 includes:

The steps of removing the rigid base 11 include:

Step S31 : performing light treatment on the adhesive layer 13 , as shown in FIG. 7E .

Wherein, the adhesive layer 13 is irradiated with ultraviolet light to make the adhesive layer 13 fail.

Step S32 : separating the rigid substrate 11 from the flexible transfer head 12 , as shown in FIG. 7F .

Since the adhesive layer 13 will be debonded due to failure under ultraviolet light irradiation, the adhesive layer 13 will be separated from the rigid substrate 11 and the flexible transfer head 12 respectively, that is, the separation of the flexible transfer head 12 and the rigid substrate 11 can be realized. .

Step S4: Provide the target substrate 30, and place the light emitting diodes 22 on the flexible transfer head 12 on the target substrate 30, as shown in FIG. 7G .

Specifically, the side of the flexible transfer head 12 on which the light-emitting diodes 22 are attached faces the target substrate 30; then, the flexible transfer head 12 is deformed according to the shape of the target substrate 30, so that the light on the flexible transfer head 12 emits light The diode 22 is attached to the target substrate 30 .

The target substrate 30 is a curved substrate. The target substrate 30 may be a driving substrate. Specifically, the target substrate 30 includes a thin film transistor for driving the light emitting diode 22 to emit light and a pad (not shown in the figure) for bonding with the light emitting diode 22 . The related technologies are all existing technologies, and are not repeated here. .

After step S4 , the method further includes: removing the flexible transfer head 12 to complete the transfer of the light emitting diodes 22 , as shown in FIG. 7H .

It should be noted that this application only takes the transfer method for transferring the light-emitting diode 22 provided by the transfer device 10 provided in the fourth embodiment as an example. For the transfer method for transferring the light-emitting diode 22 by the transfer device 10, reference may be made to the transfer method in this embodiment, and details are not described herein again.

Referring to FIG. 8 , the present application further provides a display panel 100 . The display panel 100 includes a driving substrate 40 and a light emitting diode 22 disposed on one side of the driving substrate 40 .

Wherein, the driving substrate 40 may include a thin film transistor for driving the light emitting diode 22 to emit light and a pad (not shown in the figure) for bonding with the light emitting diode 22, and the related technologies are all the prior art, which will not be repeated here. . The light-emitting diodes 22 can be obtained by transferring the light-emitting diodes 22 by the transfer method of the light-emitting diodes 22 described in the foregoing embodiments, and the transfer methods of the light-emitting diodes 22 can be referred to the descriptions of the foregoing embodiments, which will not be repeated here.

Further, the display panel 100 further includes an encapsulation layer 50 covering the light emitting diodes 22 . Wherein, the encapsulation layer 50 may be encapsulation glue.

A transfer device, a transfer method for light emitting diodes, and a display panel provided by the embodiments of the present application have been described above in detail. The principles and implementations of the present application are described with specific examples in this article. The descriptions of the above embodiments are only It is used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there will be changes in the specific embodiments and application scope. In summary, this specification The content should not be construed as a limitation on this application.

Claims (10)

1. A transfer device for transferring light-emitting diodes, wherein the transfer device comprises: rigid base; a flexible transfer head disposed on one side of the rigid substrate; and an adhesive layer, adhered between the rigid substrate and the flexible transfer head. 2 . The transfer device according to claim 1 , wherein the material of the adhesive layer is pyrolysis glue or photolysis glue. 3 . 3. The transfer device according to claim 1, wherein the flexible transfer head comprises a flexible substrate and a flexible protrusion disposed on the flexible substrate, the flexible protrusion is located far from the flexible substrate. one side of the rigid substrate. 4. The transfer device according to claim 3, wherein the elastic modulus of the flexible protrusion is smaller than the elastic modulus of the flexible substrate. 5. The transfer device according to claim 3, wherein the flexible base and the flexible protrusion are integrally formed. 6 . The transfer device according to claim 1 , wherein the transfer device further comprises an adhesive layer, and the adhesive layer is disposed on the surface of the flexible transfer head away from the rigid substrate. 7 . 7. A transfer method for transferring light-emitting diodes using the transfer device as claimed in claim 1, characterized in that it comprises the following steps: providing a growth substrate, the growth substrate comprising a growth substrate and a light emitting diode disposed on one side of the growth substrate; Picking up the light emitting diode with the flexible transfer head; removing the rigid substrate; and A target substrate is provided and the light emitting diodes on the flexible transfer head are placed on the target substrate. 8 . The transfer method according to claim 7 , wherein the material of the adhesive layer is UV photolysis adhesive, and the step of removing the rigid substrate comprises: applying UV light to the adhesive layer. 9 . Light irradiation treatment. 9 . The transfer method according to claim 7 , wherein the step of placing the light emitting diodes on the flexible transfer head on the target substrate comprises: 10 . facing the target substrate on the side of the flexible transfer head with the light emitting diode; The flexible transfer head is deformed according to the shape of the target substrate, so that the light emitting diodes on the flexible transfer head are attached to the target substrate. 10. A display panel, characterized in that, the display panel comprises a driving substrate and a light-emitting diode arranged on one side of the driving substrate, the light-emitting diode is composed of the light-emitting diode of any one of claims 7 to 9. transfer method transfer obtained.

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