CN112768370B - Transfer method and transfer device for micro-component - Google Patents

Abstract

The application discloses a micro-component transfer method and a micro-component transfer device, wherein the method comprises the steps of aligning a supply substrate with a micro-component with a bearing substrate, wherein one side of the supply substrate with the micro-component faces to the bearing surface of the bearing substrate, and the surface of the micro-component, which is far away from the supply substrate, is provided with an electrode; reducing the distance between the supply substrate and the bearing substrate until the electrode of the micro-component contacts the bearing surface of the bearing substrate, and simultaneously, the surface of the micro-component, which is deviated from the supply substrate, except the area of the electrode is also in mutual direct or indirect contact with the bearing surface of the bearing substrate; removing the supply substrate after the micro-component is adhered to the bearing surface of the bearing substrate; the micro-components on the carrier substrate are transferred by means of a transfer head. Through the mode, the damage of the micro-element in the transfer process can be reduced.

Description

Microcomponent transfer method and transfer device

technical field

The present application relates to the field of semiconductor technology, in particular to a transfer method and a transfer device for micro components.

Background technique

As a kind of miniature electrical components, micro components are widely used in the field of semiconductor technology. For example, Micro-LED chips have the advantages of high brightness, high response speed, low power consumption, and long life. They are research hotspots in the new generation of display technology. The use of micro-components usually involves the transfer process, and the transfer also involves the peeling of the supply substrate. When the supply substrate is peeled off, affected by the external force of the peeling, it is easy to cause problems such as breakage and chipped corners on the micro-components, thus affecting the quality of the transfer. Rate.

Contents of the invention

The technical problem mainly solved by the present application is to provide a transfer method and device for micro components, which can reduce the damage of the micro components during the transfer process.

In order to solve the above technical problems, a technical solution adopted by the present application is to provide a method for transferring micro components, which includes aligning the supply substrate with micro components with the carrier substrate, and the side of the supply substrate with micro components faces The carrying surface of the carrying substrate, the surface of the micro-component facing away from the supply substrate has electrodes; the distance between the supply substrate and the carrying substrate is reduced until the electrodes of the micro-component contact the carrying surface of the carrying substrate, while the surface of the micro-component facing away from the supply substrate except for electrodes There is also direct or indirect contact between the region of the carrier substrate and the carrier surface of the carrier substrate; the supply substrate is removed after the micro-components are adhered to the carrier surface of the carrier substrate; the transfer head is used to transfer the micro-components on the carrier substrate.

Wherein, reducing the distance between the supply substrate and the carrying substrate until the electrodes of the micro-elements contact the carrying surface of the carrying substrate includes: forming a shape and size matching the electrodes of the micro-elements at the positions corresponding to the electrodes of the micro-elements on the carrying surface of the carrying substrate. groove.

Wherein, the direct contact between the area of the surface of the micro-element away from the supply substrate except for the electrodes and the bearing surface of the carrier substrate also includes: the electrode of the micro-element contacts the bottom of the groove, while the surface of the micro-element away from the supply substrate except for the electrodes There is also direct contact between the area and the bearing surface outside the groove.

Wherein, the bearing substrate includes an adhesive layer forming the bearing surface, and the grooves are arranged on the adhesive layer.

Wherein, reducing the distance between the supply substrate and the carrying substrate until the electrode of the micro-element contacts the carrying surface of the carrying substrate includes: forming a planarization layer on the side where the micro-element has the electrode, and the surface of the planarization layer is flush with the surface of the electrode .

Wherein the indirect contact between the surface of the micro-element away from the supply substrate except for the electrodes and the carrying surface of the carrying substrate includes: both the electrodes and the planarization layer of the micro-element are in direct contact with the carrying surface of the carrying substrate.

Wherein, the distance between the supply substrate and the carrying substrate is reduced until the electrodes of the micro-components contact the carrying surface of the carrying substrate, and at the same time, the area of the surface of the micro-component away from the supply substrate except the electrodes and the carrying surface of the carrying substrate are also indirect contact with each other Including: providing a grid plate, the grid plate has a through hole whose shape and size match the electrodes of the micro-element, and the thickness of the grid plate is equal to the height of the electrode; placing the grid plate between the supply substrate and the carrying substrate; bonding The supply substrate, the grid plate and the carrying substrate are such that the electrodes of the micro-components contact the carrying surface of the carrying substrate, and the area of the surface of the micro-element away from the supply substrate except the electrodes is passed between the mesh plate and the carrying surface of the carrying substrate. indirect contact.

Wherein, before using the transfer head to transfer the micro components on the carrier substrate, it includes: disposing the transfer head on the transfer substrate, and a plurality of transfer heads are arranged separately from each other.

Further, disposing the transfer head on the transfer substrate, and arranging the plurality of transfer heads separately from each other includes: forming a transfer head material layer on the transfer substrate; patterning the transfer head material layer to form a plurality of mutually separated transfer heads.

In order to solve the above technical problems, another technical solution adopted by the present application is to provide a transfer device for micro components, the transfer device includes a carrier substrate and a transfer substrate, the carrier substrate includes a carrier surface for carrying micro components; the carrier of the carrier substrate The position corresponding to the electrode of the micro-element is provided with a groove whose shape and size match the electrode of the micro-element; the transfer substrate includes at least one transfer head for absorbing and transferring the micro-element.

Wherein, a plurality of transfer heads are arranged on the transfer substrate, and the plurality of transfer heads are arranged separately from each other.

Wherein, the carrying substrate includes an adhesive layer formed on the carrying surface, and the grooves are arranged on the adhesive layer.

The beneficial effects of the present application are: different from the situation of the prior art, the present application controls the electrodes of the micro-elements to contact the carrying surface of the carrying substrate, and at the same time, the micro-elements are away from the area of the surface of the supply substrate except for the electrodes and the carrying surface of the carrying substrate They are also in direct or indirect contact with each other, which can increase the bonding area between the micro-components and the carrier substrate, improve the stability of the micro-components on the carrier substrate, and help to eliminate the air under the micro-components, thereby reducing the damage of the micro-components risk.

Description of drawings

FIG. 1 is a schematic flow diagram of a micro-element transfer method in an embodiment of the present application;

Fig. 2 is a schematic structural view of a discrete transfer head in an embodiment of the present application;

3 is a schematic flow diagram of a method for preparing a discrete transfer head in an embodiment of the present application;

4 is a schematic structural view of a carrier substrate in an embodiment of the present application;

Fig. 5 is a schematic diagram of micro-components provided by the transfer method of micro-components in another embodiment of the present application;

6 is a schematic diagram of a carrier substrate provided by a transfer method of micro components in another embodiment of the present application;

Fig. 7 is a schematic diagram of a micro-component transfer method for laminating a supply substrate and a carrier substrate in another embodiment of the present application;

Fig. 8 is a schematic diagram of peeling off the supply substrate in the transfer method of micro components in another embodiment of the present application;

FIG. 9 is a schematic diagram of a transfer head provided by a transfer method of micro components in another embodiment of the present application;

Fig. 10 is a schematic diagram of transferring a micro-element by a micro-element transfer method in another embodiment of the present application;

FIG. 11 is a schematic structural diagram of a supply substrate in an embodiment of the present application;

Fig. 12 is a schematic diagram of a transfer method of a micro-component in another embodiment of the present application to attach a supply substrate and a carrier substrate;

Fig. 13 is a schematic cross-sectional structure diagram of a grid plate in an embodiment of the present application;

Fig. 14 is a schematic top view of the grid plate in an embodiment of the present application;

FIG. 15 is a schematic diagram of a micro-element transfer method for attaching a supply substrate, a grid plate, and a carrier substrate in yet another embodiment of the present application.

Detailed ways

In order to make the purpose, technical solution and effect of the present application more clear and definite, the present application will be further described in detail below with reference to the accompanying drawings and examples.

The present application provides a method for transferring micro-elements, which can be used for transferring micro-light-emitting diode devices (Micro-LEDs), but is not limited to this device, and can also be used for transferring other micro-elements. For example, the micro-component can also be a diode array of a photodiode array detector (Photo-diode Array, PDA), a MOS (Metal Oxide Semiconductor, MOS) device, a MEMS device of a micro-electro-mechanical system (Micro-Electro-Mechanical Systems, MEMS), etc. . In the present application, there is no limitation on the type of the micro-element, and it is not limited to the examples listed here. This article will take the transfer of Micro-LED chips as an example.

Please refer to Fig. 1. Fig. 1 is a schematic flow diagram of a micro-element transfer method in an embodiment of the present application. It should be noted that if there are substantially the same results, this embodiment is not limited to the flow sequence shown in Fig. 1 . As shown in Figure 1, in this embodiment, the transfer method includes the following steps:

S110: Align the supply substrate with the micro-components with the carrier substrate.

Wherein, the side of the supply substrate having the micro-elements faces the carrying surface of the carrying substrate, and the surface of the micro-elements facing away from the supply substrate has electrodes.

Micro-components can be Micro-LED chips, such as gallium nitride (GaN)-based Micro-LED chips, and can also be divided into purple-light Micro-LED chips, blue-light Micro-LED chips, green-light Micro-LED chips, etc. At present, it is difficult to grow Micro-LED chips directly on target substrates (such as glass substrates), and it is necessary to rely on transfer technology to transfer Micro-LED chips grown on supply substrates to target substrates.

The supply substrate may be a sapphire substrate, and Micro-LED chips of a predetermined size and a predetermined type may be grown on the sapphire substrate. In other embodiments, the supply substrate may also be a silicon-based substrate or the like.

The bearing substrate is a substrate of hard material to play a role of fixing and bearing. For example, it may be a glass substrate, a polymer (resin) substrate, a sapphire substrate, a ceramic substrate, or the like. Adhesives may also be provided on the carrier substrate, so that the carrier substrate can be bonded and fixed to micro components.

S120: Reduce the distance between the supply substrate and the carrying substrate until the electrodes of the micro-components contact the carrying surface of the carrying substrate, and at the same time, the area of the surface of the micro-component away from the supply substrate except for the electrodes and the carrying surface of the carrying substrate are also directly or mutually indirect contact.

Among them, when transferring the Micro-LED chip grown on the supply substrate to the target substrate, it is first necessary to press the supply substrate with the Micro-LED chip on the carrier substrate, and then peel off the supply substrate to make the Micro-LED chip and the target substrate. Supply substrate detachment.

When pressing the supply substrate with the Micro-LED chip and the temporary carrier substrate, because the electrode of the Micro-LED chip is relatively protruding, the electrode surface of the LED chip will be uneven, or the air bubbles at the bottom of the Micro-LED chip will not be completely discharged. There will be gaps on the bonding surface between the supply substrate and the carrier substrate. The existence of the gap will cause no support at the bottom of the Micro-LED chip when the supply substrate is peeled off, and it is easy to concentrate the force when the force is applied, resulting in the fixing of the carrier substrate to the Micro-LED chip. The resistance is not enough, so it is easy to cause damage to the Micro-LED chip when the supply substrate is peeled off. For example, a laser is generally used to lift off the supply substrate. When the supply substrate is irradiated with laser light, the instantaneous shock wave generated by the laser irradiation will cause problems such as breakage and missing corners of the Micro-LED chip.

In order to solve this technical problem, the application controls the electrodes of the micro-elements to contact the carrying surface of the carrying substrate, and at the same time, the area of the surface of the micro-element away from the supply substrate except for the electrodes and the carrying surface of the carrying substrate are also directly or indirectly connected to each other. touch. It can make there is no gap between the carrier substrate and the supply substrate, thereby increasing the bonding area between the Micro-LED chip and the carrier substrate, improving the stability of the Micro-LED chip on the carrier substrate, and is also conducive to the discharge of micro-LED chips. Air, thereby mitigating the risk of Micro-LED chips breaking during laser lift-off.

S130: removing the supply substrate after the micro components are adhered to the carrying surface of the carrying substrate.

Wherein, laser can be used to peel off the supply substrate, and chemical etching can also be used to peel off the supply substrate. After removal of the donor substrate, the microcomponents remain on the carrier substrate due to adhesive forces.

S140: Using the transfer head to transfer the micro components on the carrier substrate.

Wherein, the transfer head may be one or more of a polydimethylsiloxane transfer head (polydimethylsiloxane, PDMS), an electrostatic transfer head, and a vacuum transfer head, and the nature of the transfer head is not limited here. The transfer head can be selectively attached to some micro components to realize partial transfer. At the same time, the adhesion force of the transfer head to the micro-components should be controlled to be greater than the adhesion force of the carrier substrate to the micro-components, so that the transfer head can smoothly pick up and transfer the micro-components from the carrier substrate.

In the currently commonly used transfer head structure, multiple transfer heads are integrally formed on the transfer head base of the transfer substrate, that is, the multiple transfer heads are connected through the transfer head base. In this way, when the transfer head and the carrier substrate are pressed together, when the surface of the transfer head base is deformed, the surface of the transfer head will be deformed, and the deformation of the transfer head will cause the change of the pitch between the Micro-LED chips after picking up, thus affecting the subsequent The progress of the process.

Please refer to FIG. 2 . FIG. 2 is a schematic structural diagram of a discrete transfer head in an embodiment of the present application. In order to solve this technical problem, the present application proposes a discrete transfer head, in which a plurality of transfer heads 50 are separately arranged on a transfer substrate 501 . The problem of Pitch change between Micro-LED chips during batch transfer can be improved by using a discrete transfer head, and the discrete transfer head can also alleviate the thermal mismatch problem caused by the bonding of Micro-LED chips in the later stage.

Please refer to FIG. 3 . FIG. 3 is a schematic flowchart of a method for manufacturing a discrete transfer head in an embodiment of the present application. In this embodiment, the transfer head 50 may be a photolithographic silicone material, such as UV-curable PDMS, and a discrete transfer head may be prepared by using a photolithography process. Specifically, a layer of UV PDMS glue 502 is spin-coated on the transfer substrate 501 ; the glue is selectively exposed, and the uncured PDMS glue is washed away with a developer, thereby forming a completely discrete PDMS transfer head 50 . The transfer substrate is a substrate of hard material to play a role of fixing and carrying. For example, it may be a glass substrate, a polymer (resin) substrate, a sapphire substrate, a ceramic substrate, or the like. In other embodiments, the discrete transfer head can also be prepared by selective coating, which is not limited here.

In one embodiment, the carrier substrate can be processed so that the electrodes of the micro-components contact the carrier surface of the carrier substrate, and at the same time, there is also a gap between the area of the surface of the micro-element away from the supply substrate except for the electrodes and the carrier surface of the carrier substrate. direct contact with each other.

Please refer to FIG. 4 . FIG. 4 is a schematic structural diagram of a carrier substrate in an embodiment of the present application. In this embodiment, the position of the carrying surface of the carrying substrate 30 corresponding to the electrode 101 of the micro-element 10 can be processed into the groove 301 corresponding to the electrode 101 of the micro-element 10 . In this way, when the supply substrate and the carrier substrate are bonded, the grooves are used to accommodate the electrodes, so as to compensate for the height difference between the electrode surface of the Micro-LED chip and other areas, so that the bonding surface is a flat surface, so as to improve the performance of the Micro-LED chip on the carrier surface. stability on the substrate. In addition, by setting the groove, it is also possible to avoid the phenomenon that the Micro-LED chip is tilted on the carrier substrate, which is conducive to picking up the Micro-LED chip during subsequent batch transfer.

Wherein, the shape of the groove matches the shape of the electrode of the micro-element, and the size of the groove is equal to the size of the electrode of the micro-element, or slightly larger than the size of the electrode of the micro-element, as there can be a 10% margin, to improve Alignment accuracy, reduce the difficulty of alignment, and reduce the probability of electrode damage. According to the location of the electrodes, Micro-LED chips can be divided into vertical structure (shown in Figure 4b) and flip-chip structure (shown in Figure 4a). The cathode and anode of the structural Micro-LED are located on the same side of the chip, and correspondingly, the groove is also designed to correspond to one electrode or to correspond to two electrodes.

In one embodiment, the carrier substrate can be directly processed, and a groove is etched on the carrier substrate, and the groove can be further filled with adhesive to enhance the adhesion to the Micro-LED chip. The size should reserve a space for the adhesive, that is, it should ensure that the size of the space filled with the adhesive is greater than or equal to the size of the electrode. In another embodiment, it is also possible to form an entire adhesive layer on the carrier substrate, and then directly arrange grooves on the adhesive layer, and the arrangement form of the grooves is not limited here.

Please refer to Figure 5-Figure 10 to describe the transfer method of micro components in detail, as follows:

Please refer to FIG. 5 . FIG. 5 is a schematic diagram of micro-components provided by a transfer method of micro-components in another embodiment of the present application. In this embodiment, a plurality of Micro-LED chips 10 are arranged sequentially on the supply substrate 20 . On the surface. In other embodiments, the Micro-LED chip 10 may also be of a vertical structure, and the cathode and anode of the vertical Micro-LED chip are located on the upper and lower sides of the chip.

Please refer to FIG. 6 . FIG. 6 is a schematic diagram of a carrier substrate provided by a transfer method of micro components in another embodiment of the present application. In this embodiment, the carrier substrate 30 is a glass substrate, and an adhesive layer 302 is disposed on the carrier substrate 30, and the adhesive layer may be a nanoimprintable adhesive material layer, such as a silicone material layer. Nanoimprinting or photolithography can be used to process the adhesive layer to form a groove 301 corresponding to the shape of the electrode 101 at the position corresponding to the electrode 101 of the Micro-LED chip. The size of the groove is slightly larger than the size of the electrode 101 . With this setting, the bonding area between the Micro-LED chip and the carrier substrate is increased, the stability of the Micro-LED chip on the carrier substrate is improved, and it is also beneficial to discharge the air under the Micro-LED chip, thereby reducing the risk of micro-LED peeling during laser stripping. -Risk of LED chip chipping.

Please refer to FIG. 7 . FIG. 7 is a schematic diagram of attaching a supply substrate and a carrier substrate by a transfer method of micro components in another embodiment of the present application. In this embodiment, the supply substrate 20 and the carrier substrate 30 are aligned and bonded, so that the electrodes of the Micro-LED chips are sunk into the grooves of the carrier substrate and combined with the carrier surface of the carrier substrate 30. Due to the height difference of other areas, other areas of the Micro-LED chip except for the electrodes are also in direct contact with the bearing surface outside the groove.

Please refer to FIG. 8 . FIG. 8 is a schematic diagram of peeling off a supply substrate in a transfer method of micro components in another embodiment of the present application. The supply substrate 20 is subjected to laser lift-off, and the supply substrate 20 after laser lift-off is removed, so that the Micro-LED chip 10 remains on the carrier substrate 30 . In other embodiments, other peeling methods such as chemical etching may also be used for peeling.

Please refer to FIG. 9 . FIG. 9 is a schematic diagram of a transfer head provided by a transfer method of micro components in another embodiment of the present application. In this embodiment, a transfer head 50 is provided, which is a discrete transfer head, and the transfer head 50 is attached to the Micro-LED chip 10 so that the Micro-LED chip 10 is fixed by the transfer head 50 . The transfer head 50 is moved to pick up the Micro-LED chip 10 .

Please refer to FIG. 10 . FIG. 10 is a schematic diagram of transferring a micro-element by a micro-element transfer method in another embodiment of the present application. In this embodiment, a target substrate 60 is provided, on which a driving circuit and a contact electrode 601 are arranged, the transfer head 50 is aligned and bonded to the target substrate 60, and the cathode and anode of the Micro-LED chip 10 are combined with the contact electrode 601 connect. So far, the transfer of Micro-LED chips is realized.

In this embodiment, when the Micro-LED chip has a flip-chip structure, after the Micro-LED chip is combined with the target substrate, the Micro-LED chip can also be packaged to form a packaging layer on the Micro-LED chip to Protect Micro-LED chips and contact electrodes. The specific packaging material and packaging process can be selected from conventional materials and processes, which are not limited here.

In another embodiment, when the Micro-LED chip has a vertical structure, the cathode and anode are located on the upper and lower sides of the chip, and after the transfer of the chip is completed, electrodes on the other side need to be fabricated. The specific manufacturing method may be a conventional process, which is not limited here.

In another embodiment, the supply substrate can be processed so that the electrodes of the micro-components contact the carrying surface of the carrying substrate, and at the same time, the surface of the micro-component facing away from the surface of the supply substrate except for the electrode is between the carrying surface of the carrying substrate and the carrying surface of the carrying substrate. also indirect contact with each other.

Please refer to FIG. 11 . FIG. 11 is a schematic structural diagram of a supply substrate in an embodiment of the present application. In this embodiment, the planarization layer 70 may be formed on the side of the supply substrate 20 having the micro-device 10 , and the surface of the planarization layer 70 is flush with the surface of the electrode of the micro-device 10 .

In this embodiment, by providing a planarization layer, the height difference between the electrode of the micro-element and other regions of the micro-element can be filled, and the surface of the supply substrate can be flat, which can not only increase the bonding area of the supply substrate and the carrying substrate, but also improve The stability of the micro-components on the carrier substrate also helps to exclude the air under the micro-components, thereby reducing the risk of micro-components fragmentation during laser lift-off. At the same time, the alignment between the supply substrate and the carrying substrate can be avoided, so that the bonding effect is better.

In one embodiment, the planarization layer can be made of materials such as inorganic compounds and organic photoresists, such as silicon dioxide, silicon nitride, SU-8 and other materials. The planarization layer can be formed by spin coating, inkjet printing, vapor deposition, deposition and the like.

Please refer to Figure 5 and Figure 12 together to describe the transfer method of micro components in detail, as follows:

Referring to FIG. 5 , a supply substrate 20 with Micro-LED chips 10 is provided.

Spin-coat a layer of photoresist or vapor-deposit a layer of inorganic oxide on the supply substrate 20 to form a planarization layer, and the height of the planarization layer is equal to the electrode height of the Micro-LED chip. Pattern the planarization layer to expose the electrodes of the Micro-LED chip.

Please refer to FIG. 12 . FIG. 12 is a schematic diagram of attaching a supply substrate and a carrier substrate by a micro-component transfer method in another embodiment of the present application.

A carrier substrate 30 is provided, and a layer of adhesive layer 302 is formed on the carrier substrate 30, and the supply substrate 20 is bonded to the carrier substrate 30, and the electrodes and the planarization layer of the Micro-LED chip are mutually connected with the carrier surface of the carrier substrate. direct contact. In this embodiment, the surface of the carrying substrate is a plane without grooves/protrusions, and correspondingly, the adhesive layer is also a plane.

Steps such as laser lift-off, pick-up and transfer are then carried out, which are the same as those in the above-mentioned embodiment, please refer to the description of the above-mentioned embodiment, and will not be repeated here.

In yet another embodiment, other auxiliary tools can also be used to realize that the electrodes of the micro-elements contact the carrying surface of the carrying substrate, and at the same time, the surface of the micro-element away from the supply substrate is between the area except the electrodes and the carrying surface of the carrying substrate. also indirect contact with each other.

Please refer to FIG. 13 and FIG. 14 in conjunction. FIG. 13 is a schematic cross-sectional structure diagram of a grid plate in an embodiment of the present application, and FIG. 14 is a schematic top view structure diagram of a grid plate in an embodiment of the present application. In this embodiment, a grid plate is provided. The grid plate 80 has through holes 801 whose shape and size match the electrodes of the micro-components. The arrangement of the through holes 801 corresponds to the arrangement of the electrodes of the micro-elements. The thickness of the grid 80 is equal to the height of the electrodes of the microelements.

Please refer to FIG. 15 . FIG. 15 is a schematic diagram of a transfer method for attaching a supply substrate, a grid plate and a carrier substrate in yet another embodiment of the present application. Before bonding the supply substrate and the carrier substrate, the grid plate 80 is placed between the supply substrate 20 and the carrier substrate 30, and the supply substrate 20, the grid plate 80 and the carrier substrate 30 are bonded to fill up with the grid plate The height difference between the micro-component electrode and other areas makes the surface of the supply substrate a flat surface to increase the bonding area between the carrier substrate and the supply substrate, improve the stability of the micro-component, and also help to eliminate the air under the micro-component, thereby reducing the micro-component. Risk of component damage.

The grid plate can be made of organic materials, and the grid plate can also have a certain degree of viscosity, which can play a role in bonding the supply substrate and the carrying substrate. In this case, no adhesive layer may be provided on the carrier substrate.

In this embodiment, by using an independent grid plate, it is no longer necessary to process the supply substrate or the carrier substrate, reducing the transfer process, and can be reused under the condition of the same structure and arrangement of micro components, which is more flexible and convenient.

In the above embodiment, the height difference between the electrode surface of the micro-component and other regions is compensated during the micro-component transfer process, which can increase the bonding area between the supply substrate and the carrier substrate, improve the stability of the micro-component on the carrier substrate, and is also beneficial Exclude the air under the micro-components, thereby reducing the risk of micro-component fragmentation during laser lift-off, and improving the transfer yield.

Please refer to FIG. 2 and FIG. 4 in conjunction. Based on the above micro-component transfer method, the present application also provides a micro-component transfer device. The transfer device includes a carrier substrate 30 and a transfer substrate 501 .

A groove 301 is provided on the carrier substrate 30 , and the groove 301 matches the shape and size of the electrode 101 that supplies the micro element 10 on the substrate. In this way, when the supply substrate and the carrier substrate are bonded, the grooves are used to accommodate the electrodes, so as to compensate for the height difference between the electrode surface of the Micro-LED chip and other areas, so that the bonding surface is a flat surface, so as to improve the performance of the Micro-LED chip on the carrier surface. stability on the substrate. In addition, by setting the groove, it is also possible to avoid the phenomenon that the Micro-LED chip is tilted on the carrier substrate, which is conducive to picking up the Micro-LED chip during subsequent batch transfer. For details, please refer to the description of the foregoing implementation manners, and details are not repeated here.

The transfer substrate 501 includes at least one transfer head 50 for absorbing and transferring micro components. Specifically, a plurality of transfer heads 50 are arranged on the transfer substrate 501 , and the plurality of transfer heads 50 are arranged separately from each other. The problem of Pitch change between Micro-LED chips during batch transfer can be improved by using a discrete transfer head, and the discrete transfer head can also alleviate the thermal mismatch problem caused by the bonding of Micro-LED chips in the later stage. For details, please refer to the description of the foregoing implementation manners, and details are not repeated here.

Please refer to FIG. 11 , based on the transfer method of the above-mentioned micro-components, the present application also provides a supply substrate 20, the side of the supply substrate 30 having the micro-components 10 is provided with a planarization layer 70, and the surface of the planarization layer 70 is in contact with the micro-components. The electrodes are flush with the surface. By providing a planarization layer, the height difference between the electrode of the micro-element and other regions of the micro-element can be filled, and the surface of the supply substrate can be flat, which can not only increase the bonding area between the supply substrate and the carrying substrate, but also improve the micro-element The stability on the carrier substrate also facilitates the exclusion of air under the microcomponents, thereby mitigating the risk of microcomponent fragmentation during laser lift-off. At the same time, the alignment between the supply substrate and the temporary substrate can be avoided, so that the bonding effect is better. For details, please refer to the description of the foregoing implementation manners, and details are not repeated here.

The above is only the implementation of the application, and does not limit the patent scope of the application. Any equivalent structure or equivalent process conversion made by using the specification and drawings of the application, or directly or indirectly used in other related technologies fields, are all included in the scope of patent protection of this application in the same way.

Claims (9)

1. A method for transferring a micro-component, comprising:

aligning a supply substrate with micro-components with a bearing substrate, wherein one side of the supply substrate with the micro-components faces to the bearing surface of the bearing substrate, and the surface of the micro-components, which is far away from the supply substrate, is provided with an electrode;

forming a groove with the shape and the size matched with the electrode of the micro-component at the position, corresponding to the electrode of the micro-component, of the bearing surface of the bearing substrate;

reducing the distance between the supply substrate and the carrier substrate until the electrodes of the microcomponents contact the carrier surface of the carrier substrate, so that the electrodes of the microcomponents contact the bottom of the grooves, and the areas of the surface of the microcomponents facing away from the supply substrate, except for the electrodes, and the carrier surface outside the grooves also contact each other directly or indirectly;

removing the supply substrate after the micro-components are adhered to the carrying surface of the carrying substrate;

and transferring the micro-component on the bearing substrate by using a transfer head.

2. The method of claim 1, wherein the carrier substrate comprises an adhesive layer forming the carrier surface, the recesses being disposed on the adhesive layer.

3. A method for transferring microcomponents in accordance with claim 1, wherein said step of reducing the distance between the donor substrate and the carrier substrate until the electrodes of the microcomponents contact the carrying surface of the carrier substrate comprises:

forming a planarization layer on one side of the micro-component with the electrode, wherein the surface of the planarization layer is flush with the surface of the electrode;

the indirect contact between the areas of the surface of the micro-components facing away from the supply substrate, other than the electrodes, and the carrying surface of the carrying substrate also comprises:

the electrodes and the planarization layer of the micro-component are in direct contact with the bearing surface of the bearing substrate.

4. A method according to claim 1, wherein said reducing the distance between the supply substrate and the carrier substrate until the electrodes of the microcomponents contact the carrying surface of the carrier substrate, while the areas of the surface of the microcomponents facing away from the supply substrate other than the electrodes and the carrying surface of the carrier substrate are also in indirect contact with each other comprises:

providing a grid plate having through holes with shape and size matching with the electrodes of the micro-components, the thickness of the grid plate being equal to the height of the electrodes;

placing the grid plate between the donor substrate and the carrier substrate;

and attaching the supply substrate, the grid plate and the bearing substrate so as to enable the electrode of the micro-component to contact the bearing surface of the bearing substrate, and simultaneously enabling the area of the surface of the micro-component, which is far away from the supply substrate and is except the electrode, to indirectly contact with each other through the grid plate and the bearing surface of the bearing substrate.

5. The method for transferring a micro-component according to claim 1, wherein the transferring the micro-component on the carrier substrate with the transfer head comprises:

the transfer heads are disposed on a transfer substrate, and the plurality of transfer heads are disposed separately from each other.

6. The method of claim 5, wherein the disposing the transfer heads on the transfer substrate and the disposing the transfer heads separately from each other comprises:

forming a layer of transfer head material on the transfer substrate;

and patterning the transfer head material layer to form a plurality of mutually-separated transfer heads.

7. A transfer device for microcomponents, comprising,

the bearing substrate comprises a bearing surface for bearing the micro-element;

a transfer substrate comprising at least one transfer head for adsorbing and transferring said microcomponents;

and a groove with the shape and the size matched with the electrode of the micro-element is arranged at the position, corresponding to the electrode of the micro-element, of the bearing surface.

8. The device for transferring microcomponents as claimed in claim 7, characterized in that a plurality of said transfer heads are arranged on said transfer substrate, said transfer heads being arranged separately from one another.

9. A device for transferring microcomponents as claimed in claim 7 or 8, characterized in that the carrier substrate comprises an adhesive layer formed on the carrier surface, the recesses being provided in the adhesive layer.

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