CN114397785A - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
- Publication number
- CN114397785A CN114397785A CN202111581483.5A CN202111581483A CN114397785A CN 114397785 A CN114397785 A CN 114397785A CN 202111581483 A CN202111581483 A CN 202111581483A CN 114397785 A CN114397785 A CN 114397785A
- Authority
- CN
- China
- Prior art keywords
- display panel
- substrate
- test
- exposed
- display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000012360 testing method Methods 0.000 claims abstract description 105
- 239000000758 substrate Substances 0.000 claims abstract description 83
- 238000005520 cutting process Methods 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims description 33
- 230000001070 adhesive effect Effects 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 238000000576 coating method Methods 0.000 claims description 9
- 238000000227 grinding Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 5
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 1
- 239000002390 adhesive tape Substances 0.000 description 9
- 238000005498 polishing Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000007711 solidification Methods 0.000 description 6
- 230000008023 solidification Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000007688 edging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136254—Checking; Testing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application discloses display panel and display mother board, display panel includes: a first substrate and a second substrate arranged opposite to the first substrate; the first base plate comprises a substrate and at least one test wire arranged on the substrate, one end of the test wire extends towards the surface of the first base plate to be connected with a driving circuit, and the other end of the test wire extends towards the cutting end of the first base plate and is exposed to the cutting end of the first base plate to form an exposed end; the exposed end is positioned on the terminal side of the first substrate; a chamfered portion is provided on the terminal side of the first substrate; the exposed end is positioned on the inclined plane of the chamfer part; the display panel further comprises curing glue, and the curing glue at least covers the exposed end. This application is through above-mentioned scheme to the problem of short circuit takes place for naked test line is solved.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device.
Background
Flat panel displays are the mainstream displays, and among them, liquid crystal displays are widely used in electronic products such as computer screens, flat panel televisions, mobile phones, etc. because of their advantages of being light and thin, and saving power. The liquid crystal display comprises a liquid crystal display panel, a backlight module, an optical film, a rubber frame and a conductive adhesive tape arranged on the side edge of the display panel.
Generally, the lcd panel includes a display area and a non-display area around the display area, the non-display area is provided with a plurality of test traces, and in order to test the circuit conduction condition of each lcd panel on the large display mother board, the test pads of all the lcd panels on the large display mother board are generally connected together through the test traces for testing. However, after the large display mother board is cut, the end of the test trace is exposed to the air from the side of the liquid crystal display panel, which causes short circuit due to contact with the attached conductive tape in the subsequent process, resulting in poor display.
Disclosure of Invention
The application aims to provide a display panel, a manufacturing method thereof and a display device, so as to solve the problem that a short circuit occurs to an exposed test wire.
The application discloses display panel includes: a first substrate and a second substrate arranged opposite to the first substrate; the first base plate comprises a substrate and at least one test wire arranged on the substrate, one end of the test wire extends towards the surface of the first base plate to be connected with a driving circuit, and the other end of the test wire extends towards the cutting end of the first base plate and is exposed to the cutting end of the first base plate to form an exposed end; the exposed end is positioned on the terminal side of the first substrate; a chamfered portion is provided on the terminal side of the first substrate; the exposed end is positioned on the inclined plane of the chamfer part; the display panel further comprises curing glue, and the curing glue at least covers the exposed end.
Optionally, the chamfer angle of the chamfer is 45 degrees.
Alternatively, the width of the chamfered portion is smaller than the width of the display panel in a direction along the side of the terminal side.
Optionally, the first substrate includes a first metal layer, a first insulating layer, and a second insulating layer; the first insulating layer is arranged to cover the first metal layer, and the second insulating layer is arranged on the first insulating layer; the test trace is formed by patterning the first metal layer; the test routing wire is directly contacted with the curing adhesive at the exposed position.
Optionally, the first substrate further includes a plurality of test terminals, and the test terminals are arranged in one-to-one correspondence to the test traces and connected to the test traces; dividing the testing wiring into a first wiring section and a second wiring section by using the testing terminal; the testing terminal comprises a metal gasket, a first insulating layer and a transparent conducting layer, wherein the first insulating layer is provided with a plurality of through holes, and the transparent conducting layer is connected with the metal gasket through the through holes; the first routing section is connected with the transparent conductive layer, the second routing section is connected with the metal gasket, the first routing section is formed by indium tin oxide, and the second routing section is formed by metal materials; the first wiring section is arranged on the first insulating layer, and the first wiring section is exposed from the terminal side of the display panel.
Optionally, the line width of the test trace at the exposed position is smaller than the line width of the test trace at the non-exposed position.
Alternatively, the chamfered portion is provided only on the substrate.
Optionally, the test trace includes a main line segment and a branch line segment, the branch line segment is exposed from a side surface of the display panel, the branch line segment includes a first branch and a second branch, the first branch and the second branch are respectively connected to the main line segment, a sum of line widths of the first branch and the second branch is smaller than a line width of the main line segment, and a hollow portion is disposed between the first branch and the second branch.
The application also discloses a manufacturing method of the display panel, which comprises the following steps:
forming at least one test wire on the display motherboard, wherein the test wire is communicated with all uncut display panels on the display motherboard;
cutting the display mother board along a cutting line to form at least two display panels, wherein the test wiring is exposed from at least the terminal side of the display panels;
grinding the terminal side of the display panel to form a chamfered part;
and coating curing glue, wherein the curing glue at least covers the chamfered part.
The application also discloses a display device which comprises a conductive adhesive tape, a circuit board and the display panel, wherein the conductive adhesive tape is arranged corresponding to the terminal side of the display panel and is abutted by the curing adhesive at the position of the chamfer part; the circuit board is bound on the display panel.
This application sets up chamfer portion through the first base plate that the exposed position of walking the line in the test corresponds, and its chamfer portion can be so that solidification is glued when the coating, and partly solidification is glued along the slope landing of chamfer portion to the adhesion is on the inclined plane of chamfer portion, and its chamfer portion makes when attaching conductive adhesive tape, and solidification is glued between conductive adhesive tape and test line, separates it, consequently, test on the first base plate is walked the line and can not be with conductive adhesive tape short circuit. From another perspective, in the coating process of the curing adhesive, the bonding area of the first substrate needs to be covered by the curing adhesive in a common display panel, and the problem of short circuit between the test wiring at the exposed position and the conductive adhesive tape can be solved by the curing adhesive only by arranging a chamfered part on the first substrate.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
FIG. 1 is a schematic top view of a display motherboard according to a first embodiment of the present application;
FIG. 2 is a schematic top view of a first substrate according to a first embodiment of the present application;
fig. 3 is a schematic cross-sectional view of a display panel of the first embodiment of the present application;
fig. 4 is a schematic step diagram of a method for manufacturing a display panel according to a first embodiment of the present application;
FIG. 5 is a schematic cross-sectional view of a first substrate of the first embodiment of the present application;
FIG. 6 is a schematic cross-sectional view of another first substrate of the first embodiment of the present application;
FIG. 7 is an etching schematic view of a third first substrate according to the first embodiment of the present application;
FIG. 8 is a schematic view of a display motherboard of a second embodiment of the present application;
FIG. 9 is a schematic view of a first substrate of a second embodiment of the present application;
fig. 10 is a schematic view of a display device of a third embodiment of the present application.
Wherein, 1, a display mother board; 2. cutting a line; 3. testing a common line; 10. a display panel; 11. a terminal side; 100. a first substrate; 100a, a substrate; 101. a binding region; 110. testing the wiring; 111. a first route segment; 112. a second route segment; 113. a main line segment; 114. dividing a line segment; 115. a first branch; 116. a second branch; 120. chamfering the corner; 121. an inclined surface; 131. a first metal layer; 132. a first insulating layer; 133. a second insulating layer; 140. a test terminal; 141. a metal gasket; 142. a transparent conductive layer; 190. a drive circuit; 200. a second substrate; 300. curing glue; 400. a display device; 401. an electrically conductive tape.
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein. In the description of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implying any number of indicated technical features. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The present application is described in detail below with reference to the figures and alternative embodiments.
The first embodiment is as follows:
as shown in fig. 1, as a first embodiment of the present application, a schematic top view of a display mother board is disclosed, a display mother board 1 includes a plurality of uncut display panels 10, the display mother board 1 is provided with a plurality of cutting lines 2 along edges of the uncut display panels 10, and only two cutting lines 2 are illustrated in this figure. The display mother board 1 is further provided with a plurality of test common lines 3, each display panel 10 is respectively provided with a plurality of test lines 110, the corresponding test lines 110 are respectively connected to the test common lines 3 in a one-to-one correspondence manner, and a test end of the display mother board is displayed through the test common lines 3. The display mother board 1 is further provided with a plurality of cutting lines 2, the display panel 10 can be cut from the display mother board 1 by cutting along the plurality of cutting lines 2, and the test trace 110 is exposed on the side edge of the display panel 10 at the position of the corresponding cutting line 2. It should be noted that the test common line in the motherboard can be omitted, and the test traces of two adjacent display panels are directly connected at the cutting line.
As shown in fig. 2 to 3, fig. 2 is a schematic top view of a first substrate according to a first embodiment of the present application, fig. 3 is a schematic cross-sectional view of a display panel according to the first embodiment of the present application, and the display panel 10 includes: a first substrate 100 and a second substrate 200 provided in a cassette with the first substrate 100; the first base plate 100 comprises a substrate 100a and at least one test wire 110, the test wire 110 is arranged on the substrate 100a, one end of the test wire 110 extends into the surface of the first base plate 100 to be connected with the driving circuit 190, and the other end extends to the cut end of the first base plate and is exposed to the cut end of the first base plate to form an exposed end; one side of the first substrate 100 bound with the circuit board is a terminal side; the exposed end is positioned on the terminal side of the first substrate; a chamfered portion 120 is provided on the terminal side of the first substrate 100; the exposed end is located on the slope of the chamfered portion 120; the display panel further comprises a curing adhesive 300, wherein the curing adhesive 300 at least covers the exposed end. It should be noted that: the region of the terminal side of the first substrate 100 beyond the second substrate 200 is generally a bonding region 101; the curing glue 300 is disposed to cover the bonding area 101, and the curing glue 300 is disposed to cover the chamfered portion 120.
This application sets up chamfer portion 120 through the first base plate 100 that the exposed position that walks line 110 corresponds at the test, its chamfer portion 120 can be so that solidification glue 300 when the coating, the inclined plane 121 landing of some solidification glue 300 along chamfer portion 120 to the adhesion is on the inclined plane 121 of chamfer portion 120, its chamfer portion 120 makes when attaching to conductive tape, solidification glue 300 is between conductive tape and test are walked line 110, separate it, consequently, test on the first base plate 100 is walked line 110 and can not be short circuit with conductive tape. From another perspective, in the coating process of the curing adhesive 300, the curing adhesive 300 is needed to cover the bonding area of the first substrate 100 in a general display panel, and the curing adhesive 300 can be used to improve the short circuit problem between the test trace 110 and the conductive tape at the exposed position only by arranging the chamfered portion 120 on the first substrate 100 in the present application.
As shown in fig. 4, in response to the above solution, the present application further discloses a manufacturing method of a display panel, including the steps of:
s1: forming at least one test wire on the display motherboard, wherein the test wire 110 is communicated with all uncut display panels on the display motherboard;
s2: cutting the display mother board along a cutting line to form at least two display panels, wherein the test wire 110 is exposed from at least the terminal side of the display panels;
s3: grinding the terminal side of the display panel to form a chamfered part;
s4: coating curing glue, wherein the curing glue at least covers the chamfer part
Generally speaking, a curing adhesive is applied to the terminal side of the display panel and covers the bonding area, and in the embodiment, the curing adhesive is only required to cover the chamfer portion.
Specifically, the chamfering section 120 may be implemented by a grinding process, and may be implemented using a grinding apparatus. The grinding device is commonly used for edging the side surface of the display panel after cutting after the display mother board is cut, so that the side surface of the display panel has no structure such as burr and chamfer. The polishing apparatus is also a conventional apparatus in the display panel manufacturing process, and the present application can perform an edge grinding process on the terminal side of the first substrate 100 by using the polishing apparatus, thereby forming a chamfered portion 120. Specifically, the first substrate 100 may be positioned on a polishing platform, and polishing wheels are symmetrically disposed on two sides of a moving path of the polishing platform, so that an angle of the polishing wheels can be adjusted to perform an oblique edge polishing, thereby forming a chamfered portion 120.
In another embodiment, the chamfered portion 120 is provided only on the substrate 100 a. The substrate 100a of the first substrate 100 is generally a glass substrate 100a, and the chamfered portion 120 can also be implemented in a production stage of the glass substrate 100a, that is, a process is adopted to form a chamfered portion 120 on one side of the glass substrate, and an inclined surface 121 formed by the chamfered portion 120 has a certain bearing capacity and can bear the curing adhesive 300 during the coating process of the curing adhesive 300, so that the curing adhesive 300 can be disposed between the test trace 110 and the conductive adhesive tape. The chamfered portion 120 may be provided in the same manner as the chamfered portion 120. Of course, this scheme is not suitable for the scheme of cutting the display mother board into display panels, and is only suitable for large-sized display panels and the like.
Specifically, the width of the chamfered portion 120 is smaller than the width of the display panel in the direction along the side of the terminal side. The width of the chamfer portion 120 is to cover all the test traces 110, and the chamfer portion 120 may be disposed at the exposed position of the side of the display panel corresponding to all the test traces 110. The length of the right angle side of the chamfer part 120 can be equal to the thickness of the glass substrate, so that the side surface and the bottom surface of the glass substrate are not right angles any more, and correspondingly form an acute angle, generally 45 degrees can be selected, because the chamfer part 120 with 45 degrees forms a straight chamfer.
Specifically, the chamfered portion 120 is related to the substrate 100a and the film layer on the pad, as shown in fig. 5, which shows a schematic view of a specific first substrate 100, a first metal layer 131, a first insulating layer 132 and a second insulating layer 133 are sequentially disposed on the substrate 100a, and the test trace 110 is formed by the first metal layer 131; a first chamfer is arranged on the substrate 100a corresponding to the position of the chamfer part 120; a second chamfer is arranged at the position, corresponding to the first chamfer, of the first metal layer 131; the first insulating layer 132 is provided with a third chamfer corresponding to the position of the chamfer 120; the second insulating layer 133 is provided with a fourth chamfer corresponding to the position of the chamfer 120; the first chamfer, the second chamfer, the third chamfer and the fourth chamfer sequentially form an inclined surface 121 on the substrate 100a, the first metal layer 131, the first insulating layer 132 and the second insulating layer 133, and the inclined surface 121 of the substrate 100a, the inclined surface 121 of the first metal layer 131, the inclined surface 121 of the first insulating layer 132 and the inclined surface 121 of the second insulating layer 133 are all located on the same plane; the same plane is the chamfer inclined surface 121. When the curing adhesive 300 is applied to the side surface of the display panel where the chamfered portion 120 is not provided, the curing adhesive 300 cannot cover the side surface of the display panel because the curing adhesive is applied to the light exit surface of the display panel. However, after the chamfered portion 120 is disposed on the side surface of the display panel, the side surface of the display panel is not a surface perpendicular to the light exit surface of the display panel, but a chamfered inclined surface 121 is formed, which has a certain inclination angle, so that the fixing adhesive at the position can be supported during the coating process of the curing adhesive 300, and the curing adhesive 300 covers the chamfered inclined surface 121, so that the exposed test trace 110 is covered by the curing adhesive 300, and the short circuit between the test trace 110 and the conductive adhesive tape is avoided. In addition to the first metal layer 131, the first insulating layer 132, and the second insulating layer 133, the film layers of other display panels are disposed on the substrate 100a, for example: the buffer layer, the transparent conductive layer 142, the second metal layer, the alignment layer, etc. may be selectively edged according to actual conditions. The key point of the present application is the chamfered portion 120 formed by edging, and the chamfered portion 120 has an inclined surface capable of bearing the curing adhesive 300, so that the exposed test trace 110 can be separated from the conductive tape.
Besides the chamfer part 120 disposed on the first substrate 100, the position of the test trace 110 can be set to match the curing adhesive 300 on the chamfer part 120, so as to achieve a better insulation effect.
As shown in fig. 6, which illustrates a schematic view of another first substrate 100 according to the first embodiment, the first substrate 100 further includes a plurality of test terminals 140, the test terminals 140 are disposed in one-to-one correspondence with the test traces 110, the test traces 110 include a first trace segment 111 and a second trace segment 112, and the test terminals 140 are connected between the first trace segment 111 and the second trace segment 112; the test terminal 140 includes a metal pad 141, a first insulating layer 132, and a transparent conductive layer 142, wherein the first insulating layer 132 is provided with a plurality of via holes, and the transparent conductive layer 142 is connected to the metal pad 141 through the via holes; the first routing segment 111 and the second routing segment 112 are the same test routing 110, the first routing segment 111 and the second routing segment 112 are connected through a test terminal 140, the first routing segment 111 is connected with the transparent conductive layer 142, the second routing segment 112 is connected with the metal pad 141, the first routing segment 111 is formed by indium tin oxide, and the second routing segment 112 is formed by a metal material; the first wire segment 111 is disposed on the first insulating layer 132, and the first wire segment 111 is exposed from a terminal side of the display panel.
In this embodiment, the test trace 110 corresponding to the exposed position is the transparent conductive layer 142 disposed above the first insulating layer 132, and when the edge is ground to form the chamfered portion 120, the length of the ground trace of the test trace 110 located at the uppermost layer is longer and farther from the edge of the display panel, so that the short circuit between the test trace 110 and the conductive tape is avoided to the greatest extent.
As shown in fig. 7, in order to further consider the width problem of the corresponding exposed position of the test trace 110, the test trace 110 may be arranged in segments according to this embodiment, specifically: the testing wire 110 includes a main line segment 113 and a branch line segment 114, the branch line segment 114 is exposed from the side of the display panel, the branch line segment 114 includes a first branch 115 and a second branch 116, the first branch 115 and the second branch 116 are respectively connected to the main line segment 113, the sum of the line widths of the first branch 115 and the second branch 116 is smaller than the line width of the main line segment 113, and a hollow portion is disposed between the first branch 115 and the second branch 116. The line width of the test trace 110 corresponding to the exposed position is reduced, so that less metal debris is generated in the edge grinding process, and electrical interference is avoided.
Example two:
as shown in fig. 8, as a schematic diagram of a display motherboard according to a second embodiment of the present application, a display motherboard is disclosed, other structures are the same as those in the first embodiment, but the test traces 110 are not directly connected at the positions of the cutting lines of the display motherboard, so that the test traces 110 are still exposed after being cut, but do not protrude from the film layer, and are retracted by a length. A chamfered portion 120 may also be provided, specifically, the display panel 10 includes: a first substrate 100 and a second substrate 200 provided in a cassette with the first substrate 100; the first base plate 100 comprises a substrate 100a and at least one test trace 110, wherein one side of the first base plate 100 bound with a circuit board is a terminal side; the test trace 110 is disposed on the substrate 100a, and the test trace 110 is exposed from the terminal side of the first substrate 100; a chamfered portion 120 is provided on the terminal side of the first substrate 100; the chamfered portion 120 is disposed corresponding to an exposed position of the test trace 110; the display panel further comprises a curing adhesive 300, and a region of the terminal side of the first substrate 100 beyond the second substrate 200 is a bonding region 101; the curing glue 300 is disposed to cover the bonding area 101, and the curing glue 300 is disposed to cover the chamfered portion 120.
As shown in fig. 9, in the embodiment, even if the chamfered portion 120 is formed on the side surface of the first substrate 100 and the inclined surface 121 is formed on the side surface of the first substrate 100, the test trace 110 still does not protrude from the inclined surface 121, so that when the curing adhesive 300 is coated, the curing adhesive 300 has a certain fluidity and can fill the space formed under the inclined surface 121 and the test trace 110, thereby preventing the test trace 110 and the conductive tape from being short-circuited.
For this embodiment, the laser may be further used to remove the film layer at the edge of the substrate 100a, but the substrate 100a at the position is remained, so that the position has a supporting function to bear the curing adhesive 300 when the curing adhesive 300 is coated. After the curing adhesive 300 is cured, the test trace 110 and the conductive tape can be separated from each other to prevent short circuit.
Example three:
as shown in fig. 10, a schematic diagram of a display device according to a third embodiment of the present application is disclosed, and the display device 400 includes a conductive tape 401, a circuit board, and the display panel 10 according to any of the above embodiments, wherein the conductive tape 401 is disposed corresponding to a terminal side of the display panel and is in contact with a curing adhesive at a position of a chamfered portion; the circuit board is bound on the display panel. The display Panel may be various types of display panels, such as a TN (Twisted Nematic) display Panel, an IPS (In-plane Switching) display Panel, a VA (Vertical Alignment) display Panel, an MVA (Multi-Domain Vertical Alignment) display Panel, and of course, other types of display panels, such as an OLED (Organic Light-Emitting Diode) display Panel, which can be applied to the above embodiments.
It should be noted that the inventive concept of the present application can form many embodiments, but the application documents have a limited space and cannot be listed one by one, so that on the premise of no conflict, the above-described embodiments or technical features can be arbitrarily combined to form a new embodiment, and after the embodiments or technical features are combined, the original technical effect will be enhanced. The foregoing is a further detailed description of the present application in connection with specific alternative embodiments, and it is not intended that the present application be limited to these specific details. For those skilled in the art to which the present application pertains, several simple deductions or substitutions can be made without departing from the concept of the present application, and all should be considered as belonging to the protection scope of the present application.
Claims (10)
1. A display panel, comprising: a first substrate and a second substrate arranged opposite to the first substrate; it is characterized in that the preparation method is characterized in that,
the first base plate comprises a substrate and at least one test wire arranged on the substrate, one end of the test wire extends towards the surface of the first base plate to be connected with a driving circuit, and the other end of the test wire extends towards the cutting end of the first base plate and is exposed to the cutting end of the first base plate to form an exposed end; the exposed end is positioned on the terminal side of the first substrate;
a chamfered portion is provided on the terminal side of the first substrate; the exposed end is positioned on the inclined plane of the chamfer part;
the display panel further comprises curing glue, and the curing glue at least covers the exposed end.
2. The display panel according to claim 1, wherein a chamfer angle of the chamfer is 45 degrees.
3. The display panel according to claim 1, wherein a width of the chamfered portion is smaller than a width of the display panel in a direction along a side of the terminal side.
4. The display panel according to claim 1, wherein the first substrate comprises a first metal layer, a first insulating layer, and a second insulating layer; the first insulating layer is arranged to cover the first metal layer, and the second insulating layer is arranged on the first insulating layer; the test wire is formed by patterning the first metal layer; the test routing wire is directly contacted with the curing adhesive at the exposed position.
5. The display panel according to claim 1, wherein the first substrate further comprises a plurality of test terminals, the test terminals are arranged in a one-to-one correspondence with the test traces, the test traces comprise a first trace section and a second trace section, and the test terminals are connected between the first trace section and the second trace section;
the testing terminal comprises a metal gasket, a first insulating layer and a transparent conducting layer, wherein the first insulating layer is provided with a plurality of through holes, and the transparent conducting layer is connected with the metal gasket through the through holes; the first routing section is connected with the transparent conductive layer, the second routing section is connected with the metal gasket, the first routing section is formed by indium tin oxide, and the second routing section is formed by metal materials; the first wiring section is arranged on the first insulating layer, and the first wiring section is exposed from the terminal side of the display panel.
6. The display panel of claim 1, wherein the line width of the test trace at the exposed position is smaller than the line width of the test trace at the non-exposed position.
7. The display panel according to claim 4, wherein the chamfered portion is provided only on the substrate.
8. The display panel of claim 1, wherein the test trace comprises a main line segment and a branch line segment, the branch line segment is exposed from a side surface of the display panel, the branch line segment comprises a first branch and a second branch, the first branch and the second branch are respectively connected to the main line segment, a sum of line widths of the first branch and the second branch is smaller than a line width of the main line segment, and a hollow portion is disposed between the first branch and the second branch.
9. A manufacturing method of a display panel is characterized by comprising the following steps:
forming at least one test wire on the display mother board, wherein the test wire is communicated with all uncut display panels on the display mother board;
cutting the display mother board along a cutting line to form at least two display panels, wherein the test wiring is exposed from at least the terminal side of the display panels;
grinding the terminal side of the display panel to form a chamfered part;
and coating curing glue, wherein the curing glue at least covers the chamfered part.
10. A display device comprising a conductive tape, a circuit board, and the display panel according to any one of claims 1 to 8, wherein the conductive tape is provided corresponding to a terminal side of the display panel and is in contact with a curing adhesive at a position of a chamfered portion; the circuit board is bound on the display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111581483.5A CN114397785B (en) | 2021-12-22 | 2021-12-22 | Display panel, manufacturing method thereof and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111581483.5A CN114397785B (en) | 2021-12-22 | 2021-12-22 | Display panel, manufacturing method thereof and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114397785A true CN114397785A (en) | 2022-04-26 |
| CN114397785B CN114397785B (en) | 2024-03-19 |
Family
ID=81227198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111581483.5A Active CN114397785B (en) | 2021-12-22 | 2021-12-22 | Display panel, manufacturing method thereof and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114397785B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116381998A (en) * | 2023-03-31 | 2023-07-04 | 惠科股份有限公司 | Display panel, display device, display mother board and manufacturing method of display mother board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109521584A (en) * | 2018-11-16 | 2019-03-26 | 合肥京东方显示技术有限公司 | A kind of display master blank, array substrate and preparation method thereof and display panel |
| CN112068338A (en) * | 2020-09-01 | 2020-12-11 | 深圳市华星光电半导体显示技术有限公司 | Display panel |
| US20210210482A1 (en) * | 2017-05-10 | 2021-07-08 | Boe Technology Group Co., Ltd. | Mother Substrate and Display Panel |
| CN213876254U (en) * | 2020-11-18 | 2021-08-03 | 合肥京东方光电科技有限公司 | Array substrate and display device thereof |
| CN113641019A (en) * | 2021-10-14 | 2021-11-12 | 惠科股份有限公司 | Display panel, display device and display mother board |
| CN113759580A (en) * | 2021-11-10 | 2021-12-07 | 惠科股份有限公司 | Display panel, manufacturing method thereof and display device |
-
2021
- 2021-12-22 CN CN202111581483.5A patent/CN114397785B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210210482A1 (en) * | 2017-05-10 | 2021-07-08 | Boe Technology Group Co., Ltd. | Mother Substrate and Display Panel |
| CN109521584A (en) * | 2018-11-16 | 2019-03-26 | 合肥京东方显示技术有限公司 | A kind of display master blank, array substrate and preparation method thereof and display panel |
| CN112068338A (en) * | 2020-09-01 | 2020-12-11 | 深圳市华星光电半导体显示技术有限公司 | Display panel |
| CN213876254U (en) * | 2020-11-18 | 2021-08-03 | 合肥京东方光电科技有限公司 | Array substrate and display device thereof |
| CN113641019A (en) * | 2021-10-14 | 2021-11-12 | 惠科股份有限公司 | Display panel, display device and display mother board |
| CN113759580A (en) * | 2021-11-10 | 2021-12-07 | 惠科股份有限公司 | Display panel, manufacturing method thereof and display device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116381998A (en) * | 2023-03-31 | 2023-07-04 | 惠科股份有限公司 | Display panel, display device, display mother board and manufacturing method of display mother board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114397785B (en) | 2024-03-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101490485B1 (en) | Liquid crystal display and method of manufacturing the same | |
| KR100397004B1 (en) | Display panel | |
| KR101107174B1 (en) | Display panel and manufacturing method thereof | |
| US20210294137A1 (en) | Display device comprising a flip chip film connected to a connecting surface of a plurality of bonding pins and manufacturing method thereof | |
| CN113946077B (en) | A display panel and display device | |
| US11829028B2 (en) | Backlight source and manufacturing method thereof | |
| US10459265B2 (en) | Display device | |
| JP2009086077A (en) | Liquid crystal display device equipped with touch panel and manufacturing method thereof | |
| KR100516656B1 (en) | Liquid crystal panel and method of manufacture thereof | |
| US8062461B2 (en) | Method of manufacturing an electro-optical device | |
| CN110109297B (en) | Display panel and method for manufacturing the same | |
| US8707544B2 (en) | Method of manufacturing in-plane switching mode liquid crystal display | |
| KR20070084945A (en) | Motherboard for liquid crystal panel, cutting method thereof and liquid crystal panel formed by the method | |
| CN104090405A (en) | Tiled display panel and display device | |
| KR102753641B1 (en) | Array substrates, liquid crystal display panels and liquid crystal display devices | |
| CN110928078B (en) | Display panel, preparation method thereof and display device | |
| US20230170356A1 (en) | Array substrate and display device | |
| EP2472497B1 (en) | Display panel, display device, and method for manufacturing same | |
| WO2020258457A1 (en) | Flexible display apparatus | |
| KR102339969B1 (en) | Chip-On-Film Circuit and Flexible Display Device having the same | |
| CN114397785A (en) | Display panel, manufacturing method thereof and display device | |
| US11429159B2 (en) | Tape structure and the display panel and display device utilizing the tape structure | |
| JP4275937B2 (en) | Liquid crystal device and manufacturing method thereof | |
| US20070246836A1 (en) | Electric terminal device and method of connecting the same | |
| CN111601455A (en) | Flexible circuit board, display module, terminal, binding system and binding method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |