CN113946077B - A display panel and display device - Google Patents

Abstract

Embodiments of the present application provide a display panel and a display device. The display panel includes a display area and a non-display area surrounding the display area, the display panel includes: an array substrate, the array substrate includes a plurality of first pins located in the non-display area, the plurality of first pins are arranged in a first direction, and the array The side of the substrate close to the display surface of the display panel has a first cut angle, and the cut surface of the first cut angle exposes a plurality of first pins; a plurality of silver paste wirings, one silver paste wiring and one first pin are electrically connected. At least part of the line segment of the silver paste wiring is located on the side of the array substrate close to the display surface; the plurality of first pins are respectively electrically connected to the data driving chip through the silver paste wiring. In the present application, the binding end on the array substrate can be drawn out to the back of the array substrate or to the end surface of the opposite substrate arranged opposite to the array substrate, so that the length of the first pin and the width of the lower frame can be reduced. Improve the screen ratio while ensuring the reliability of the binding connection.

Description

A display panel and display device

technical field

The invention belongs to the field of display technology, and more particularly relates to a display panel and a display device.

Background technique

At present, display technology is very mature and is widely used in terminal products such as mobile phones, computers, TVs, and smart wearables. These terminal products have also become indispensable tools in people's work and life. With the development of display technology and the improvement of user needs, high screen ratio, high color gamut, high frame rate, low power consumption, flexible and foldable, etc. have become the main selling points of major manufacturers. Among them, the proportion of the display screen has become a very important specification parameter of the terminal product. Therefore, narrowing the frame to increase the screen ratio is a technical problem that needs to be solved urgently.

SUMMARY OF THE INVENTION

In view of this, the present application provides a display panel and a display device, which solve the technical problem of narrowing the frame and increasing the screen ratio.

An embodiment of the present application provides a display panel, the display panel includes a display area and a non-display area surrounding the display area, the display panel includes: an array substrate, the array substrate includes a plurality of first pins located in the non-display area, a plurality of first pins The pins are arranged in the first direction, the side of the array substrate close to the display surface of the display panel has a first cut angle, and the cut surface of the first cut angle exposes a plurality of first pins; The paste wiring is electrically connected to a first pin, and at least part of the line segment of the silver paste wiring is located on the side of the array substrate close to the display surface; for the data driving chip, a plurality of first pins are respectively driven with the data through the silver paste wiring Chips are electrically connected.

Specifically, a plurality of silver paste traces are covered on the cut surface of the first cut angle, and extend along the surface of the array substrate to the side of the array substrate away from the display surface in the thickness direction of the array substrate.

Further, the side of the array substrate facing away from the display surface has a second cut angle, and the second cut angle and the first cut angle are located at the same end of the array substrate; the array substrate includes a first end face, and the first cut angle and the second cut angle pass through. The first end faces are connected.

In some optional embodiments, the width of the first cut corner in the second direction is d1, the width of the second cut corner in the second direction is d2, d1>d2, the second direction is perpendicular to the first direction, And the second direction is parallel to the plane where the array substrate is located.

In one embodiment, the side of the array substrate facing away from the display surface includes a horizontal sub-section adjacent to the second cut corner, the silver paste wiring includes a first sub-line segment, and the first sub-line segment is in contact with the horizontal sub-section; The display panel also has a flexible packaging substrate, the data driving chip is fixed on the flexible packaging substrate, and the flexible packaging substrate is bound and connected to the plurality of first sub-line segments.

In another embodiment, the side of the array substrate facing away from the display surface includes a horizontal sub-section adjacent to the second cut corner, the silver paste wiring includes a first sub-line segment, and the first sub-line segment is in contact with the horizontal sub-section ; wherein, the data driving chip is bound and connected with a plurality of first sub-line segments.

In another embodiment, a side of the array substrate away from the display surface includes a horizontal subsection adjacent to the second cut corner, the horizontal subsection includes a plurality of second pins, the second pins and the first pins One-to-one correspondence; one end of the silver paste wiring is connected to the first pin, and the other end of the silver paste wiring is connected to the second pin.

In another embodiment, the display panel further includes a flexible packaging substrate, the data driving chip is fixed on the flexible packaging substrate, and the flexible packaging substrate is bound and connected to the plurality of second pins.

In another embodiment, the array substrate includes a first sub-substrate and a second sub-substrate that are oppositely arranged, the first sub-substrate and the second sub-substrate are bonded by a first adhesive layer, and the first adhesive layer is located in the non-display area; Wherein, the first sub-substrate includes a first chamfer and a plurality of first pins, and the second sub-substrate includes a second chamfer and a plurality of second pins.

In another embodiment, the display panel further includes an opposite substrate, the opposite substrate and the array substrate are arranged oppositely; one end of the array substrate with the first cut angle extends out of the opposite substrate to form a step, and the array substrate extends out of the opposite substrate The bottom surface of the step forms a step bottom surface, and the end face of the opposite substrate forms a step slope surface; wherein, the first pin is exposed on the step bottom surface; the silver paste traces are covered on the step bottom surface and extend to the step slope surface; the display panel also includes a flexible package. The substrate, the data driving chip is fixed on the flexible packaging substrate; wherein, the flexible packaging substrate is bound and connected with the silver paste wiring on the slope of the step and the silver paste wiring on the bottom surface of the step.

Embodiments of the present application also provide a method for manufacturing a display panel, which is used to manufacture the display panel provided in the above-mentioned embodiments. The manufacturing method includes: manufacturing an array substrate, the array substrate including a plurality of first pins located in a non-display area, a plurality of The first pins are arranged in the first direction; one end of the array substrate is ground to form a first cut angle, the cut surface of the first cut angle exposes a plurality of first pins, and the first cut angle is located near the display panel of the array substrate on the display surface side; silver paste is coated and cured to form a plurality of silver paste traces, one silver paste trace is electrically connected to a first pin, and at least part of the line segment of the silver paste trace is located on the array substrate near the display surface One side; the data driving chip is bound, and the plurality of first pins are respectively electrically connected to the data driving chip through the silver paste wiring.

Specifically, coating and curing the silver paste to form a plurality of silver paste traces includes: coating the silver paste on the cut surface of the first cut corner, and continuously coating the silver paste along the thickness direction of the array substrate until the coating is applied. to the side of the array substrate facing away from the display surface.

In an embodiment, before applying the silver paste and curing to form a plurality of silver paste traces, the method further includes: grinding a side of the array substrate away from the display surface to form a second cut corner and a horizontal subsection, wherein the first The second cut corner and the first cut corner are located at the same end of the array substrate, the horizontal subsection is adjacent to the second cut corner, the array substrate further includes a first end surface, and the first cut corner and the second cut corner are connected by the first end surface.

In another embodiment, the silver paste is coated and cured to form a plurality of silver paste traces, further comprising: a cut surface along the first chamfer, a first end face, a cut surface of the second chamfer, and a horizontal subsection The surface of the silver paste is continuously coated with silver paste, and after curing, a plurality of silver paste wiring lines are formed, and the silver paste wiring lines include a first sub-line segment, and the first sub-line segment is in contact with the horizontal sub-section.

In another embodiment, before grinding one end of the array substrate to form the first cut angle, the method further includes: fabricating a plurality of second pins on the side of the array substrate away from the display surface, the second pins and the first One pin is located at the same end, and the second pin is in one-to-one correspondence with the first pin; one end of the array substrate is ground to form a second chamfer and a horizontal subsection, and the horizontal subsection includes a plurality of second pins The feet are coated with silver paste and cured to form a plurality of silver paste wirings, which also includes: one end of the silver paste wiring is connected to the first pin, and the other end of the silver paste wiring is connected to the second pin.

In another embodiment, fabricating an array substrate, the array substrate including a plurality of first pins located in the non-display area, includes: fabricating a first sub-substrate, the first sub-substrate including a plurality of first pins; Grinding one end of the array substrate to form the first cut angle includes: grinding one end of the first sub-substrate to form the first cut angle; fabricating a plurality of second pins on the side of the array substrate away from the display surface, including: providing a second A sub-substrate, making a plurality of second pins on the second sub-substrate; grinding one end of the array substrate to form a second chamfer and a horizontal subsection, including: grinding one end of the second sub-substrate to form a second chamfer and a horizontal sub-substrate; the manufacturing method further includes: aligning and bonding the ground first sub-substrate and the ground second sub-substrate through the first adhesive layer.

In another embodiment, before grinding one end of the array substrate to form the first cut angle, the method further includes: providing an opposite substrate, and aligning the opposite substrate and the array substrate, wherein one end of the array substrate extends The opposite substrate forms a step, the part of the array substrate extending out of the opposite substrate forms a step bottom surface, the end face of the opposite substrate forms a step slope surface, and the step bottom surface exposes the first pin; silver paste is applied and cured to form a plurality of silver paste strips. The wire includes: coating silver paste on the bottom surface of the step and the slope surface of the step and solidifying to form a plurality of silver paste wirings, the silver paste wiring is electrically connected to the first pin and extending to the step slope; binding data drive The chip includes: providing a flexible packaging substrate on which a data driving chip is fixed; binding and connecting the flexible packaging substrate with the silver paste wiring on the slope of the step and the silver paste wiring on the bottom surface of the step.

Embodiments of the present application further provide a display device, including the display panel provided by any embodiment of the present application.

The display panel and the display device provided by the present application have the following beneficial effects: in the embodiment of the present application, the first pin is electrically connected to the silver paste wiring made by the coating process, and the first pin is driven by data through the silver paste wiring The chips are electrically connected, and the first pins on the array substrate are not used to bind the data driving chip, nor are they used to bind the flexible packaging substrate on which the data driving chip is fixed. After grinding the array substrate to form a first cut angle, the first lead is exposed on the cut surface of the first cut angle, and the length of the first lead can ensure the electrical connection between the first lead and the signal line in the wiring area. The connection and the electrical connection between the first pin and the silver paste wiring are sufficient. The connection method between the first pin and the silver paste wire has lower requirements on the length of the first pin compared to the binding connection method. The present application can reduce the length of the first pin, thereby reducing the width of the lower frame and increasing the screen ratio. In addition, by arranging the silver paste wiring to be electrically connected to the first pin, the binding end can be drawn out to the back side of the array substrate or to the end face of the opposite substrate opposite to the array substrate, so that the In the case of the width of the lower border, increase the effective length of the binding end to ensure the reliability of the binding connection.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are some embodiments of the present invention, and for those skilled in the art, other drawings can also be obtained from these drawings without any creative effort.

FIG. 1 is a schematic diagram of a display panel in the related art;

FIG. 2 is a partial top view schematic diagram of a display panel provided by an embodiment of the present application;

Fig. 3 is a schematic cross-sectional view at the position of tangent line B-B' in Fig. 2;

Fig. 4 is another schematic cross-sectional view at the position of tangent line B-B' in Fig. 2;

Fig. 5 is a schematic cross-sectional view at the position of tangent line A-A' in Fig. 2;

6 is a flowchart of a method for manufacturing a display panel provided in the embodiment of FIG. 2;

7 is a schematic cross-sectional view of a display panel provided by an embodiment of the present application;

FIG. 8 is another flowchart of a method for manufacturing a display panel provided by an embodiment of the present application;

FIG. 9 is another schematic diagram of a display panel provided by an embodiment of the present application;

10 is another schematic diagram of a display panel provided by an embodiment of the present application;

FIG. 11 is another schematic diagram of a display panel provided by an embodiment of the present application;

FIG. 12 is another schematic diagram of a display panel provided by an embodiment of the present application;

13 is another flowchart of a method for manufacturing a display panel provided by an embodiment of the present application;

FIG. 14 is another schematic diagram of a display panel provided by an embodiment of the present application;

FIG. 15 is another flowchart of a method for fabricating a display panel provided by an embodiment of the present application;

FIG. 16 is another schematic diagram of a display panel provided by an embodiment of the present application;

FIG. 17 is another flowchart of a method for fabricating a display panel provided by an embodiment of the present application;

FIG. 18 is a schematic diagram of a display device according to an embodiment of the present application.

Detailed ways

In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present invention.

The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used in the embodiments of the present invention and the appended claims, the singular forms "a," "the," and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise.

FIG. 1 is a schematic diagram of a display panel in the related art. FIG. 1 shows a display area 1 and a non-display area 2. The non-display area 2 includes a wiring area 21 and a pin area 22, wherein the wiring area 21 is provided with A plurality of signal lines 211 and a plurality of binding pins 221 are arranged in the pin area 22 . The binding pins 221 are used for binding connection with the data driving chip, or binding connection with the flexible package substrate on which the data driving chip is fixed. In the lower frame area of the display panel, the wiring area 21 and the pin area 22 are essential structures that affect the narrowing of the lower frame. In a scheme of narrowing the lower frame, the display panel is made of a flexible substrate, and multiple signal lines and multiple binding pins in the non-display area are fabricated on the flexible substrate. Using the good flexibility of the flexible substrate, Bend part of the line that binds the pins and signal lines to the back of the display panel to reduce the width of the lower border. However, this solution requires high technical thresholds and limited product yields, resulting in high product costs and high product quality risks, making it difficult to achieve large-scale promotion and application.

Based on the problems existing in the related art, the embodiments of the present application provide a display panel, a manufacturing method thereof, and a display device, and the lower frame structure of the display panel is designed. Wherein, the end of the array substrate provided with the first pin is ground to form a first cut angle, and the first pin is exposed on the cut surface of the first cut angle, and then silver paste wiring is formed by coating silver paste , the silver paste wiring is electrically connected to the first pin correspondingly. The data driving chip is designed to be electrically connected with the first pin through the silver paste wiring, so that the data driving chip can provide a display driving signal for the display panel. In the embodiment of the present application, the data driving chip may be bound and connected with the silver paste wiring; or the flexible packaging substrate on which the data driving chip is fixed is bound and connected with the silver paste wiring; Two pins, the second pin is used to bind the data driving chip or the flexible packaging substrate. That is to say, in the embodiment of the present application, the first pin is not directly used for binding connection, so the length of the first pin can be reduced, so that the width of the lower frame can be reduced, and the screen ratio can be increased. In one embodiment, after the silver paste traces are correspondingly connected to the first pins, the silver paste traces are arranged in the thickness direction of the array substrate, extending along the surface of the array substrate to the back of the array substrate, and then on the back of the array substrate. Binding the data driver chip or the flexible packaging substrate on the back side can increase the effective length of the binding on the back of the array substrate accordingly to ensure the reliability of the binding. In addition, the design of the first corner can ensure that the silver paste wiring and the The bonding reliability of the array substrate is to avoid that the silver paste traces cannot be effectively bonded in the case of right angles. In another embodiment, the length of the silver paste wiring is increased by using the end face of the opposite substrate disposed opposite to the array substrate, and the flexible packaging substrate with the data driver chip fixed thereon is bound and connected to the silver paste wiring, which can increase the length of the silver paste wiring. The effective length of the binding to ensure the reliability of the binding. At the same time, one end of the array substrate is ground to form a first chamfer, which can avoid defects caused by right-angle bending when the bound flexible package substrate is bent to the back of the array substrate. The above is the central idea of the present application, and the present application will be described below with specific embodiments.

An embodiment of the present application provides a display panel, the display panel includes a display area and a non-display area surrounding the display area. The embodiments of the present application do not limit the type of the display panel, and the display panel may be any display panel in the prior art, such as a liquid crystal display panel, an organic light-emitting display panel, and the like.

2 is a partial top view of a display panel provided by an embodiment of the application, FIG. 3 is a schematic cross-sectional view at the position of the tangent line B-B' in FIG. 2 , FIG. 4 is a schematic cross-sectional view of the position of the tangent line B-B' in FIG. 2 , and FIG. 5 It is a schematic cross-sectional view at the position of the tangent line A-A' in FIG. 2 . FIG. 6 is a flowchart of a method for manufacturing the display panel provided in the embodiment of FIG. 2 .

The partial schematic diagram shown in FIG. 2 shows a display area 1 and a non-display area 2 of the display panel. The display panel includes an array substrate 11, and the array substrate 11 includes a substrate and circuit structures such as a pixel driving circuit, a scanning driving circuit, and the like located on the substrate. FIG. 2 also illustrates the structure layer 12 located on the array substrate 11 . Wherein, in the liquid crystal display panel, the structural layer 12 at least includes a liquid crystal molecular layer and a color filter substrate. In the organic light emitting display panel, the structure layer 12 includes at least a light emitting device layer and an encapsulation layer. In one embodiment, the display panel is a liquid crystal display panel. As shown in FIG. 3 , the display panel includes an array substrate 11 , a liquid crystal molecular layer 14 and a color filter substrate 13 . The array substrate 11 and the color filter substrate 13 are located in the non-display area through 2. The frame sealing glue 41 is attached. Optionally, a touch module 61 is further arranged on the color filter substrate 13 , the touch module 61 is used to realize the touch function of the display panel, and a protective layer 62 is also arranged on the touch module 61 . The structural layer inside the display panel can be protected. The figure also illustrates the substrate 1101 in the array substrate 11, wherein the substrate 1101 is a rigid substrate. Circuit structures such as a pixel driving circuit and a scanning driving circuit are fabricated on the substrate 1101, which are not shown. In another embodiment, the touch function is integrated in the array substrate. The array substrate includes a common electrode and a pixel electrode. During display, after voltages are respectively applied to the common electrode and the pixel electrode, the generated electric field can control the deflection of liquid crystal molecules, thereby realizing display. For example, the common electrodes in the array substrate are divided into a plurality of electrode blocks with a block structure. In the display stage, the electrode block can be used as a common electrode, and cooperate with the pixel electrode to form an electric field for driving the deflection of liquid crystal molecules. In the touch stage, the electrode blocks can be reused as touch electrodes.

In another embodiment, the display panel is an organic light-emitting display panel. As shown in FIG. 4 , the display panel includes an array substrate 11 , a light-emitting device layer 71 and an encapsulation layer 72 , and the light-emitting device layer 71 includes a plurality of light-emitting devices 711 . The middle light-emitting device 711 is only for simplified illustration, and the light-emitting device 711 includes an anode, a light-emitting layer and a cathode that are stacked in sequence. The light emitting device layer 71 also includes a pixel definition layer (not labeled) for spacing adjacent light emitting devices. The encapsulation layer 72 is used to encapsulate and protect the light-emitting device 711 to ensure the service life of the light-emitting device 711 . The encapsulation layer 72 is bonded and fixed to the array substrate 11 through the frame sealant 42 . Optionally, a touch module 73 is further arranged on the packaging layer 72, the touch module 73 is used to realize the touch function of the display panel, and a protective layer 74 is also arranged on the touch module 73, which can Protects the structural layers inside the display panel. The figure also illustrates the substrate 1101 in the array substrate 11, wherein the substrate 1101 is a rigid substrate. Circuit structures such as a pixel driving circuit and a scanning driving circuit are fabricated on the substrate 1101, which are not marked.

The film layer structure of the display panel in FIG. 3 and FIG. 4 is only schematically shown. When the technical solution of the present application is applied, the film structure of the display panel is not designed to be changed. The structure of the binding end of the array substrate in the display panel is mainly designed to reduce the lower frame, increase the screen ratio, and at the same time ensure the reliability of the binding connection.

The array substrate 11 includes a plurality of first pins 23 located in the non-display area 2 , and the plurality of first pins 23 are arranged in the first direction x. With reference to the illustration in FIG. 5 , the array substrate 11 includes a first cut corner 31 , the first cut corner 31 is located on the side of the array substrate 11 close to the display surface of the display panel, and the cut surface 311 of the first cut corner 31 exposes a plurality of first cut corners 31 . pin 23. The side of the display surface of the display panel is the side of the display screen of the display panel. When used in a liquid crystal display panel, the array substrate has a first cut angle on the side close to the color filter substrate; when used in an organic light emitting display panel, the array substrate has a first cut angle at the side close to the light emitting device layer. In the embodiment of the present application, the substrate of the array substrate is a rigid substrate, and the rigid substrate has a certain thickness and a certain rigidity, which can be applied in the embodiment of the present application to realize the structure fabrication of the cut corner, which can be used in the cut corner. Silver paste is coated on the cut surface to form silver paste traces, so as to ensure the reliability of bonding with the array substrate when the silver paste traces extend to the back side of the array substrate.

A plurality of silver paste traces 24, one silver paste trace 24 is electrically connected to a first pin 23, and at least part of the line segment of the silver paste trace 24 is located on the side of the array substrate 11 close to the display surface, that is, the silver paste traces. At least part of the line segment of the line 24 is located on the same side of the array substrate 11 as the first cut corner 31 . The plurality of first pins 23 are respectively electrically connected to the data driving chip 25 (not shown in FIG. 2 ) through the silver paste wires 24 . Wherein, the silver paste traces 24 may be covered on the first pins 23 and electrically connected to the first pins 23 , or the silver paste traces 24 may be in contact with the first pins 23 on the cut surface 311 of the first cut corner 31 . electrical connection. FIG. 2 also shows a wiring area 21 located in the non-display area 2, wherein a plurality of signal lines 211 are arranged in the wiring area 21, and the signal lines 211 are directly or indirectly electrically connected to the data lines or scan lines in the display panel. Connect to provide a signal for the display of the display panel.

A specific embodiment of the present application is shown in FIG. 5 . The silver paste traces 24 are covered on the cut surface 311 of the first cut corner 31 , and are in the thickness direction z of the array substrate 11 along the array substrate 11 . The surface of the array substrate 11 extends to the side of the array substrate 11 away from the display surface. The data driving chip 25 is bound on the side of the array substrate 11 away from the display surface, that is, the data driving chip 25 is bound on the backside of the array substrate 11 . In the embodiments of the present application, the side of the array substrate close to the display surface is defined as the front side of the array substrate, and the side of the array substrate away from the display surface is the back side of the array substrate. In the following embodiments, reference can be made to this description.

The display panel provided in the embodiment of FIG. 2 can be manufactured by the following manufacturing method. As shown in Figure 6, the manufacturing method includes:

Step S101 : fabricating an array substrate, the array substrate includes a plurality of first pins located in the non-display area, and the plurality of first pins are arranged in a first direction.

Step S102 : grinding one end of the array substrate to form a first cut angle, the cut surface of the first cut angle exposes a plurality of first pins, and the first cut angle is located on the side of the array substrate close to the display surface of the display panel. The array substrate is an array substrate. After the fabrication process of the array substrate is completed, and before one end of the array substrate is ground, the display panel further includes a process of fabricating other structural layers on the array substrate. For example, in liquid crystal display panels, after the array substrate is fabricated, the array substrate and the color filter substrate need to be bonded together, and then liquid crystal molecules are filled in the space formed between the array substrate and the color filter substrate to form a liquid crystal layer. One end of the array substrate is polished after the process of forming the liquid crystal layer. For example, in an organic light-emitting display panel, after the array substrate is fabricated, at least a light-emitting device layer and an encapsulation layer are fabricated on the array substrate in sequence, and then one end of the array substrate is ground.

Step S103 : coating silver paste and curing to form a plurality of silver paste traces, one silver paste trace is electrically connected to a first pin, and at least part of the line segments of the silver paste traces are located on the side of the array substrate close to the display surface. In this step, a coating process is used to make the silver paste wiring to be electrically connected to the first pin, the process is simple, and this connection method has lower requirements on the length of the first pin.

Specifically, coating and curing the silver paste to form a plurality of silver paste traces includes: coating the silver paste on the cut surface of the first cut corner, and continuously coating the silver paste along the thickness direction of the array substrate until the The side of the array substrate facing away from the display surface. Using this silver paste coating method, the silver paste traces in the embodiment of FIG. 5 can be fabricated. After curing, the silver paste traces are covered on the cut surface of the first cutting corner, and are in the thickness direction of the array substrate. and extending along the surface of the array substrate to the side of the array substrate away from the display surface.

Step S104 : binding the data driving chip, and the plurality of first pins are electrically connected to the data driving chip through silver paste wirings respectively. After the silver paste wiring process, the data driving chip is bound, so that the data driving chip is electrically connected to the first pin through the silver paste wiring.

In the related art, the pins (refer to the pins 221 in FIG. 1 ) provided on the side of the array substrate close to the display surface are usually used to bind the data driving chip or the flexible packaging substrate. In order to ensure the reliability of the binding connection, Then the pins need to meet a certain length. In the embodiment of the present application, the array substrate has the first cut corner, and the first pin is exposed on the cut surface of the first cut corner. At least part of the line segment of the silver paste wiring and the first cut corner are located on the same side of the array substrate, and the silver paste wiring is electrically connected to the first pin correspondingly. The first pin is electrically connected to the data driving chip through the silver paste wiring, and the first pin on the array substrate is not used for binding the data driving chip, nor is it used for binding the flexible packaging substrate to which the data driving chip is fixed. That is, in the embodiment of the present application, the first pin is not used for binding connection. Instead, the first pin is set to be electrically connected to the silver paste wiring made by the coating process. Compared with the binding connection method, this connection method has lower requirements on the length of the first pin. After grinding the array substrate to form a first cut angle, the first lead is exposed on the cut surface of the first cut angle, and the length of the first lead can ensure the electrical connection between the first lead and the signal line in the wiring area. The connection and the electrical connection between the first pin and the silver paste wiring are sufficient, which can reduce the length of the first pin, thereby reducing the width of the lower frame and increasing the screen ratio.

As shown in the embodiment of FIG. 5 , the silver paste traces are electrically connected to the first pins, and the silver paste traces are arranged to extend to the back of the array substrate along the thickness direction of the array substrate, which is equivalent to using the silver paste traces to bind the The terminal leads to the back of the array substrate. The data driving chip can be bound on the back of the array substrate, or the flexible packaging substrate on which the data driving chip is fixed can be bound, so as to realize the electrical connection between the data driving chip and the first pin. After the binding end is arranged on the back of the array substrate, the effective length of the binding end can be correspondingly increased, thereby ensuring the reliability of the binding connection. In addition, the design of the first cut angle on the array substrate can ensure the reliability of the bonding of the silver paste traces to the array substrate when extending to the back side of the array substrate, avoiding that the silver paste traces cannot be effectively bonded in the case of right angles. Reduce the technological difficulty of silver paste routing.

Further, as shown in FIG. 5 , the side of the array substrate 11 away from the display surface has a second chamfer 32 , and the second chamfer 32 and the first chamfer 31 are located at the same end of the array substrate 11 ; the array substrate 11 includes The first end face 33 , the first cut corner 31 and the second cut corner 32 are connected by the first end face 33 . The silver paste traces 24 are covered on the cut surface 311 of the first cutting corner 31, and then extend from the cutting surface 311 to the first end surface 33, and then extend from the first end surface 33 to the cutting surface 321 of the second cutting corner 32, Then, the cut surface 321 from the second cut corner 32 extends to the back surface of the array substrate 11 . The angle between the cut surface 311 and the first end surface 33 , the angle between the first end surface 33 and the cut surface 321 , and the angle between the cut surface 321 and the back surface of the array substrate 11 are all non-right angles, which can This further ensures the bonding reliability of the silver paste traces when they extend to the backside of the array substrate.

In an embodiment, FIG. 7 is a schematic cross-sectional view of a display panel provided by an embodiment of the present application. As shown in FIG. 7 , the display panel further includes a color filter substrate 13 disposed opposite to the array substrate 11 . A liquid crystal layer 14 is disposed between 13 and the array substrate 11 , and the color filter substrate 13 and the array substrate 11 are bonded by a frame sealant 41 . The width of the first cut corner (not marked) in the second direction y is d1, and the width of the second cut corner (not marked) in the second direction y is d2, where d1>d2, the second direction y and the first One direction x is vertical, and the second direction y is parallel to the plane where the array substrate 11 is located. By setting the grinding width on the back side of the array substrate 11 to be smaller than the grinding width on the front side, the bonding reliability of the silver paste traces when extending to the back side of the array substrate can be ensured, and the non-display area on the back side of the array substrate can be ensured The portion cut off by grinding has a certain width (width L in FIG. 7 ). In the embodiment of the present application, the portion adjacent to the second cut corner on the back of the array substrate 11 is defined as the horizontal subsection 34. As indicated in FIG. 7, the width of the portion of the horizontal subsection 34 located in the non-display area 2 is L .

In the embodiment of FIG. 7, the display panel is a liquid crystal display panel. When the liquid crystal display panel is assembled into a display device, a backlight module needs to be arranged on the back side of the array substrate 11, the backlight module provides a light source for the display panel, and the backlight module and the display panel also need to be fixed by adhesive tape. In the embodiment of the present application, after the backside of the array substrate is ground to form the second chamfer, it can also ensure that the portion of the backside of the array substrate located in the non-display area that has not been ground and cut off has a certain width, so as to ensure that the backside of the array substrate is provided on the backside of the array substrate. The binding end has sufficient length to ensure binding reliability. At the same time, it can also ensure that the adhesive tape between the backlight module and the display panel has a certain width, so as to ensure the bonding reliability between the backlight module and the display panel.

Continuing to refer to FIG. 7 , the included angle between the plane where the first end surface 33 is located and the cut surface 311 of the first cut angle 31 is α1, and the angle between the plane where the first end surface 33 is located and the cut surface 321 of the second cut angle 32 is α1. The included angle is α2; among them, α1>α2. In the thickness z direction of the array substrate 11, the depth of the first chamfer 31 is h1, and the depth of the second chamfer 32 is h2, where h1>h2. Through the cooperation of the angle and the depth, the flatness of the silver paste traces extending on the cut surface of the first cut corner, the first end face, and the cut surface of the second cut angle is further ensured, so as to ensure that the silver paste traces and Array substrate surface bonding reliability. At the same time, it is also beneficial to realize that the grinding width of the back side of the array substrate is smaller than that of the front side.

Further, an embodiment of the present application also provides a method for fabricating a display panel, which can be used to fabricate a display panel with an array substrate having a first cut angle and a second cut angle at the same time. FIG. 8 is another flowchart of a method for fabricating a display panel according to an embodiment of the present application. As shown in Figure 8, the manufacturing method includes:

Step S201 : fabricating an array substrate, the array substrate includes a plurality of first pins located in the non-display area, and the plurality of first pins are arranged in a first direction.

Step S202 : grinding one end of the array substrate to form a first cut angle, the cut surface of the first cut angle exposes a plurality of first pins, and the first cut angle is located on the side of the array substrate close to the display surface of the display panel.

Step S203: Grinding the array substrate to form a second cut corner and a horizontal section, wherein the second cut corner and the first cut corner are located at the same end of the array substrate, the horizontal section is adjacent to the second cut corner, and the array substrate is also A first end face is included, and the first cut corner and the second cut corner are connected through the first end face.

Step S204: Continuously apply silver paste along the cut surface of the first cut corner, the first end face, the cut surface of the second cut angle, and the surface of the horizontal subsection, and form a plurality of silver paste traces after curing. Wherein, the silver paste wiring includes a first sub-line segment, and the first sub-line segment is in contact with the horizontal subsection.

Step S205: Bind the data driving chip, and the plurality of first pins are respectively electrically connected to the data driving chip through silver paste wires.

The order of grinding to form the first chamfer and grinding to form the second chamfer is not limited in this embodiment. The difference between this embodiment and the manufacturing method provided in the embodiment of FIG. 6 is that before the silver paste is applied and cured to form a plurality of silver paste traces, the step of grinding the array substrate to form the second chamfer and horizontal subsection is added. Correspondingly, after the silver paste is applied and cured to form a plurality of silver paste traces, the silver paste traces can be covered on the cut surface of the first cut corner, and can be realized along the thickness direction of the array substrate along the width of the array substrate. The surface extends to the side of the array substrate facing away from the display surface, which ensures the bonding reliability of the silver paste wiring and the surface of the array substrate.

In the embodiment of the present application, the binding terminal is led to the back of the array substrate through the arrangement of the silver paste wiring, and the back of the array substrate is structurally designed to realize the electrical connection between the data driving chip and the first pin, thereby reducing the size of the array substrate. The length of the first pin on the front side of the array substrate reduces the width of the lower frame and increases the screen ratio. The structure of the back surface of the array substrate will be exemplified in specific embodiments below.

In an embodiment, FIG. 9 is another schematic diagram of a display panel provided by an embodiment of the present application. As shown in FIG. 9 , the side of the array substrate 11 away from the display surface includes a horizontal sub-section 34 adjacent to the second cut corner 32 ; the silver paste wiring 24 includes a first sub-line segment 241 , the first sub-line segment 241 is connected to the horizontal segment 34 . The sub-sections 34 are in contact with each other; the display panel further includes a flexible packaging substrate 15, the data driving chip 25 is fixed on the flexible packaging substrate 15, and the flexible packaging substrate 15 is bound and connected with a plurality of first sub-line segments 241. In the schematic cross-sectional view of FIG. 9 Only one first sub-line segment 241 is shown. Optionally, the flexible packaging substrate 15 is electrically connected to the first sub-line segment 241 through anisotropic conductive adhesive. The display panel provided by this embodiment can be manufactured by using the manufacturing method provided in the embodiment of FIG. 8 above. Silver paste is coated on the surface of the horizontal sub-section 34, and the first sub-line segment 241 is formed after the silver paste is cured. Wherein, the process of binding the data driving chip in step S205 includes: providing a flexible packaging substrate on which the data driving chip is fixed, and binding and connecting the flexible packaging substrate with a plurality of first sub-line segments, so as to realize the wiring of the data driving chip through the silver paste is electrically connected to the first pin. In addition, the flexible packaging substrate is flexible and can be bent on the back of the array substrate. When applied to a liquid crystal display panel, the flexible packaging substrate can be bent and arranged in the non-display area, so as to avoid the flexible packaging substrate or the flexible packaging substrate when assembled into a display device. The data driving chip blocks the light emitted by the backlight module toward the display panel.

Continuing to refer to FIG. 9 , the display panel further includes a printed circuit board 16 , and the printed circuit board 16 is bound and connected to the flexible packaging substrate 15 , so as to realize electrical connection between the printed circuit board 16 and the data driving chip 25 . When assembled into the display device, the printed circuit board 16 is connected to the system board of the display device.

In another embodiment, FIG. 10 is another schematic diagram of the display panel provided by the embodiment of the present application. As shown in FIG. 10 , the display panel further includes a flexible circuit board 17 , and the flexible circuit board 17 is bound and connected to the flexible packaging substrate 15 , so as to realize electrical connection between the flexible circuit board 17 and the data driving chip 25 . When assembled into the display device, the flexible circuit board 17 is connected to the system board of the display device. The state of the flexible circuit board 17 in FIG. 10 is only to illustrate that the flexible circuit board 17 has a certain degree of flexibility, and is not limited to the state of the flexible circuit board 17 in an actual product.

In another embodiment, FIG. 11 is another schematic diagram of the display panel provided by the embodiment of the present application. As shown in FIG. 11 , the side of the array substrate 11 away from the display surface includes a horizontal sub-section 34 adjacent to the second cut corner 32 , the silver paste wiring 24 includes a first sub-line segment 241 , and the first sub-line segment 241 is connected to the horizontal segment 34 . The sub-sections 34 are in contact; wherein, the data driving chip 25 is bound and connected to the plurality of first sub-line segments 241 . The display panel provided by this embodiment can be manufactured by using the manufacturing method provided in the embodiment of FIG. 8 above. Silver paste is coated on the surface of the horizontal sub-section 34, and the first sub-line segment 241 is formed after the silver paste is cured. The process of binding the data driving chip includes: binding and connecting the data driving chip 25 with a plurality of first sub-line segments 241 , so that the data driving chip 25 is electrically connected to the first pin 23 through the silver paste wiring 24 .

Optionally, as shown in FIG. 11 , the pins (not marked) on one side of the data driving chip 25 are bound and connected to a plurality of first sub-line segments 241 , while the pins (not marked) on the other side of the data driving chip 25 Not marked) is bonded and connected to the flexible circuit board 17 . FIG. 11 shows that the flexible circuit board 17 is bound to the side of the data driving chip 25 close to the display area.

In another embodiment, FIG. 12 is another schematic diagram of the display panel provided by the embodiment of the present application. FIG. 13 is another flowchart of a method for fabricating a display panel provided by an embodiment of the present application.

As shown in FIG. 12 , the side of the array substrate 11 away from the display surface includes a horizontal subsection 34 adjacent to the second cut corner 32 , and the horizontal subsection 34 includes a plurality of second pins 26 , and the second pins 26 are connected to The first pins 23 are in one-to-one correspondence; one end of the silver paste wiring 24 is connected to the first pin 23 , and the other end of the silver paste wiring 24 is connected to the second pin 26 . The display panel further includes a flexible packaging substrate 15 , the data driving chip 25 is fixed on the flexible packaging substrate 15 , and the flexible packaging substrate 15 is bound and connected to the plurality of second pins 26 . The flexible packaging substrate 15 is then bound and connected to the printed circuit board, or is bound and connected to the flexible circuit board. 12 shows that the cut surface of the second cut corner 32 does not expose the second pins 26 , and the silver paste traces 24 extend to the surface of the horizontal subsection 34 to be in contact with the second pins 26 . In another embodiment, the cut surface of the second chamfer 32 exposes the second lead 26 , which is not shown in the drawings herein.

The display panel provided in the embodiment of FIG. 12 can be fabricated by the following method. As shown in Figure 13:

Step S301 : fabricating an array substrate, the array substrate includes a plurality of first pins located in the non-display area, and the plurality of first pins are arranged in a first direction.

Step S302 : forming a plurality of second pins on the side of the array substrate away from the display surface, the second pins and the first pins are located at the same end, and the second pins and the first pins are in one-to-one correspondence. Specifically, an etching process is used to fabricate a plurality of second pins on the backside of the array substrate.

Step S303 : grinding one end of the array substrate to form a first cut angle, the cut surface of the first cut angle exposes a plurality of first pins, and the first cut angle is located on the side of the array substrate close to the display surface of the display panel.

Step S304: Grinding one end of the array substrate to form a second cut corner and a horizontal section, the second cut corner and the first cut corner are located at the same end of the array substrate, the horizontal section is adjacent to the second cut corner, and the horizontal section A plurality of second pins are included.

Step S305: Coat the silver paste on the cut surface of the first cut angle, and continuously coat the silver paste along the thickness direction of the array substrate until it is applied to the side of the array substrate away from the display surface, and the silver paste is cured to form multiple layers. A silver paste wiring, wherein one end of the silver paste wiring is connected to the first pin, and the other end of the silver paste wiring is connected to the second pin.

Step S306 : providing a flexible package substrate on which the data driving chip is fixed, and bindingly connecting the flexible packaging substrate with a plurality of second pins, so that the data driving chip is electrically connected to the first pins through silver paste wiring.

After the conventional process of the display panel, the second leads are formed on the backside of the array substrate. For example, in a liquid crystal display panel, an array substrate is first fabricated, and a plurality of first pins are formed on the array substrate; then the array substrate and the color filter substrate are aligned and bonded; then liquid crystal molecules are filled between the array substrate and the color filter substrate; Then, a second pin is fabricated on the side of the array substrate away from the color filter substrate. For example, in an organic light-emitting display panel, an array substrate is first fabricated, and a plurality of first pins are formed on the array substrate; then at least a light-emitting device layer and an encapsulation layer are fabricated on the array substrate in sequence, and then a light-emitting device layer and a packaging layer are fabricated on the array substrate away from the light-emitting device. Make a second pin on one side of the layer. The second pins are fabricated on the back of the array substrate, and the electrical connection between the first pins on the front and the second pins on the back is realized by coating silver paste for wiring. By arranging alignment marks on both the front side of the array substrate and the back side of the array substrate, double alignment is achieved, the precision of the silver paste wiring is ensured, and the performance reliability of the display panel is ensured.

In another embodiment, a side of the array substrate away from the display surface includes a horizontal subsection adjacent to the second cut corner, the horizontal subsection includes a plurality of second pins, the second pins and the first pins One-to-one correspondence; one end of the silver paste wiring is connected to the first pin, and the other end of the silver paste wiring is connected to the second pin. The difference from the embodiment in FIG. 12 is that the data driving chip is directly bound on the back side of the array substrate, the plurality of pins on one side of the data driving chip are bound and connected with the plurality of second pins, and the other The plurality of pins on the side are bound and connected to the flexible circuit board, wherein the flexible circuit board is bound on the side of the data driving chip close to the display area. For the position of the flexible circuit board, reference may be made to the illustration in FIG. 11 above.

In another embodiment, FIG. 14 is another schematic diagram of the display panel provided by the embodiment of the present application. FIG. 15 is another flowchart of a method for fabricating a display panel provided by an embodiment of the present application.

As shown in FIG. 14 , the array substrate 11 includes a first sub-substrate 111 and a second sub-substrate 112 disposed opposite to each other, the first sub-substrate 111 and the second sub-substrate 112 are bonded by a first adhesive layer 42 , and the first adhesive layer 42 It is located in the non-display area; wherein, the first sub-substrate 111 includes a first cut corner 31 and a first lead 23 , and the second sub-substrate 112 includes a second cut corner 32 and a second lead 26 . FIG. 14 also illustrates the flexible packaging substrate 15 , the data driving chip 25 is fixed on the flexible packaging substrate 15 , and the flexible packaging substrate 15 is bound and connected to the plurality of second pins 26 . Further, the flexible packaging substrate 15 is bound and connected to the printed circuit board, or is bound and connected to the flexible circuit board. The first sub-substrate 111 is provided with a pixel driving circuit, and the second sub-substrate 112 may be a glass substrate, that is, the first sub-substrate 111 further includes circuit structures such as pixel driving circuits.

The display panel provided in the embodiment of FIG. 14 can be fabricated by the following method. As shown in Figure 15:

Step S401 : fabricating a first sub-substrate, where the first sub-substrate includes a plurality of first pins located in the non-display area.

Step S402 : grinding one end of the first sub-substrate to form a first cut angle, and the cut surface of the first cut angle exposes the first pins.

Step S403: Provide a second sub-substrate, and fabricate a plurality of second pins on the second sub-substrate.

Step S404 : grinding one end of the second sub-substrate to form a second chamfer and a horizontal subsection, wherein the second pin is located in the horizontal subsection.

Step S405 : aligning and bonding the ground first sub-substrate and the ground second sub-substrate through the first adhesive layer. Wherein, the first cut corner and the second cut corner are located at the same end.

Step S406: Coat the silver paste on the cut surface of the first chamfer, and continuously coat the silver paste along the thickness direction of the first sub-substrate and the second sub-substrate until it is applied to the second sub-substrate facing away from the display surface One side of the silver paste is solidified to form a plurality of silver paste wirings, wherein one end of the silver paste wiring is connected to the first pin, and the other end of the silver paste wiring is connected to the second pin.

Step S407 : providing a flexible packaging substrate on which the data driving chip is fixed, and bindingly connecting the flexible packaging substrate to a plurality of second pins, so that the data driving chip is electrically connected to the first pins through the silver paste wiring.

Taking a liquid crystal display panel as an example, when manufacturing a first sub-substrate, the first sub-substrate is an array substrate, and a plurality of first pins are formed on the first sub-substrate; then the first sub-substrate and the color filter substrate are formed. Positioning and bonding; then pouring liquid crystal molecules between the first sub-substrate and the color filter substrate; then grinding the first sub-substrate to form a first cut angle. A second sub-substrate is provided, the second sub-substrate can be a glass substrate, and a plurality of second pins are fabricated on the second sub-substrate by an etching process; and then the second sub-substrate is ground to form a second cut angle and corresponding horizontal division. After the first sub-substrate and the second sub-substrate are both subjected to a grinding process, the first sub-substrate and the second sub-substrate are aligned and bonded to form an array substrate. Then, the process of coating the silver paste wiring and binding the data driver chip is made.

In this embodiment, after the second pins are separately fabricated on the second sub-substrate, the second sub-substrate and the first sub-substrate are laminated to form an array substrate, which avoids the need to directly mount the back of the array substrate (the first sub-substrate). Using an etching process to fabricate the second pins on the side results in the risk of scratches on the lines on the front side of the display panel during the process. At the same time, there is no need to develop new process lines, which can reduce the investment of equipment cost.

In another embodiment, FIG. 16 is another schematic diagram of the display panel provided by the embodiment of the present application. FIG. 17 is another flowchart of a method for fabricating a display panel provided by an embodiment of the present application.

As shown in FIG. 16 , the display panel further includes an opposite substrate 18, and the opposite substrate 18 and the array substrate 11 are disposed opposite to each other; the end of the array substrate 11 with the first cut angle 31 extends out of the opposite substrate 18 to form a step 50, and the array substrate The part of 11 extending out of the opposite substrate 18 forms a stepped bottom surface, and the end face of the opposite substrate 18 forms a stepped slope surface; wherein, the stepped bottom surface exposes the first pin 23; the silver paste wiring 24 covers the stepped bottom surface and extends to Step slope; the display panel also includes a flexible packaging substrate 15, and the data driving chip 25 is fixed on the flexible packaging substrate 15; wherein, the flexible packaging substrate 15 and the silver paste wiring 24 on the step slope and on the bottom surface of the step The silver paste trace 24 is bound to connect. As illustrated in the figure, the opposing substrate 18 and the array substrate 11 are bonded by the second adhesive layer 43 . When applied to a liquid crystal display panel, the array substrate 11 is an array substrate, and the opposite substrate 18 is a color filter substrate. In addition, the flexible package substrate may be further bound to a flexible circuit board or a printed circuit board.

The display panel provided in the embodiment of FIG. 16 can be fabricated by the following method. As shown in Figure 17,

Step S501 : fabricating an array substrate, the array substrate includes a plurality of first pins located in the non-display area, and the plurality of first pins are arranged in a first direction.

Step S502 : providing an opposite substrate, and aligning the opposite substrate and the array substrate, wherein one end of the array substrate extends out of the opposite substrate to form a step, and the part of the array substrate extending from the opposite substrate forms a step bottom surface, and the opposite substrate The end surface of the step forms a step slope, and the bottom surface of the step exposes the first pin.

Step S503 : grinding one end of the array substrate to form a first cut angle, the cut surface of the first cut angle exposes a plurality of first pins, and the first cut angle is located on the side of the array substrate close to the display surface of the display panel.

Step S504 : Coating silver paste on the bottom surface of the step and the slope surface of the step and curing to form a plurality of silver paste wirings, the silver paste wirings are electrically connected to the first pins and extend to the step slope.

Step S505 : providing a flexible packaging substrate on which the data driving chip is fixed; binding and connecting the flexible packaging substrate with the silver paste wiring on the slope of the step and the silver paste wiring on the bottom surface of the step.

Compared with the related art, in this embodiment, after the opposing substrate is arranged to extend to the position where the first pins of the array substrate are located, at one end of the display panel, the opposing substrate and the array substrate have a certain dislocation to form a step, at least in the step. If the silver paste is coated on the bottom surface and the step slope to form the silver paste wiring, the overall length of the silver paste wiring is longer. Then, the flexible packaging substrate and the silver paste wiring are set to be bonded and connected, which can ensure a sufficiently large bonding contact area and ensure the reliability of the bonding connection. Moreover, the silver paste traces and the flexible packaging substrate have a large enough contact area, which can also reduce the contact resistance. When the data driving chip provides voltage signals to various functional signal lines in the display panel to drive the display, it can improve the The charging rate of the functional signal line. In this embodiment, the first pins on the array substrate are not used for directly binding the flexible packaging substrate, which can shorten the length of the first pins, which is beneficial to the narrowing of the lower frame. At the same time, after the first cut angle is formed by grinding, the flexible package substrate can be bent to the back of the display panel along the first cut angle, thereby avoiding the risk of wire breakage caused by right-angle bending of the flexible package substrate.

Based on the same inventive concept, an embodiment of the present application also provides a display device. FIG. 18 is a schematic diagram of the display device provided by the embodiment of the present application. As shown in FIG. 18 , the display device includes the display panel 100 provided by any embodiment of the present application. The specific structure of the display panel 100 has been described in detail in the above-mentioned embodiments, and will not be repeated here. Of course, the display device shown in FIG. 18 is only a schematic illustration, and the display device can be any electronic device with a display function, such as a mobile phone, a tablet computer, a notebook computer, an electronic paper book, a TV, a smart watch, and the like.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the present invention. within the scope of protection.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it is still The technical solutions recorded in the foregoing embodiments may be modified, or some or all of the technical features thereof may be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention .

Claims (8)

1. A display panel, characterized in that the display panel comprises a display area and a non-display area surrounding the display area, the display panel comprising: an array substrate, the array substrate includes a plurality of first pins located in the non-display area, a plurality of the first pins are arranged in a first direction, and the display surface of the array substrate is close to the display panel One side has a first cut angle, and the cut surface of the first cut angle exposes a plurality of the first pins; a plurality of silver paste traces, one of the silver paste traces is electrically connected to one of the first pins, and at least part of the line segments of the silver paste traces are located on the side of the array substrate close to the display surface; a data driving chip, wherein a plurality of the first pins are respectively electrically connected to the data driving chip through the silver paste wiring; wherein, A plurality of the silver paste traces are covered on the cut surface of the first cut angle, and extend along the surface of the array substrate in the thickness direction of the array substrate to the side of the array substrate away from the One side of the display surface, the side of the array substrate facing away from the display surface has a second cut angle, the second cut angle and the first cut angle are located at the same end of the array substrate, the array substrate comprising a first end face, and the first cut corner and the second cut corner are connected through the first end face; Alternatively, the display panel further includes an opposite substrate, the opposite substrate and the array substrate are disposed opposite to each other, and the end of the array substrate with the first cut angle extends out of the opposite substrate to form a step, so The part of the array substrate extending out of the opposite substrate forms a stepped bottom surface, the end surface of the opposite substrate forms a stepped slope surface, the stepped bottom surface exposes the first pins, and the silver paste traces are covered on the on the bottom surface of the step and extending to the step slope, the display panel further includes a flexible packaging substrate, the data driving chip is fixed on the flexible packaging substrate, and the flexible packaging substrate is connected to the step slope. The above silver paste wiring and the silver paste wiring on the bottom surface of the step are bound and connected. 2. The display panel according to claim 1, wherein, The width of the first chamfer in the second direction is d1, and the width of the second chamfer in the second direction is d2, where d1>d2, the second direction is the same as the first chamfer. The direction is vertical, and the second direction is parallel to the plane where the array substrate is located. 3. The display panel according to claim 1, wherein, The side of the array substrate facing away from the display surface includes a horizontal subsection adjacent to the second cut corner, the silver paste wiring includes a first sub-line segment, and the first sub-line segment is connected to the horizontal sub-segment. branch contact; The display panel also has a flexible packaging substrate, the data driving chip is fixed on the flexible packaging substrate, and the flexible packaging substrate is bound and connected to the plurality of first sub-line segments. 4. The display panel according to claim 1, wherein, A side of the array substrate away from the display surface includes a horizontal sub-section adjacent to the second cut corner, the silver paste wiring includes a first sub-line segment, and the first sub-line segment is connected to the horizontal sub-segment. Divisions are in contact; of which, The data driving chip is bound and connected to a plurality of the first sub-line segments. 5. The display panel according to claim 1, wherein, The side of the array substrate away from the display surface includes a horizontal subsection adjacent to the second cut corner, the horizontal subsection includes a plurality of second pins, and the second pins are connected to the The first pins are in one-to-one correspondence; One end of the silver paste wiring is connected to the first pin, and the other end of the silver paste wiring is connected to the second pin. 6. The display panel according to claim 5, wherein, The display panel further includes a flexible packaging substrate, the data driving chip is fixed on the flexible packaging substrate, and the flexible packaging substrate is bound and connected to the plurality of second pins. 7. The display panel according to claim 5, wherein, The array substrate includes a first sub-substrate and a second sub-substrate that are oppositely arranged, the first sub-substrate and the second sub-substrate are bonded by a first adhesive layer, and the first adhesive layer is located on the non-display area; of which, The first sub-substrate includes the first chamfer and a plurality of the first pins, and the second sub-substrate includes the second chamfer and a plurality of the second pins. 8. A display device, comprising the display panel according to any one of claims 1 to 7.

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