CN117523973A - Display panel and display device - Google Patents

Abstract

The embodiment of the application provides a display panel and a display device. The display panel comprises an array substrate, a color film substrate arranged opposite to the array substrate, binding terminals and connecting metal wires. The edge of one side of the array substrate, which is close to the binding terminal, is provided with a chamfer structure, one end of the connecting metal wire at least covers part of the binding terminal, and the other end of the connecting metal wire is bent relative to the chamfer structure and is attached to one side surface of the array substrate. Through setting up chamfer structure in array substrate's edge to make the surface electric connection of connecting metal wire direct with binding the terminal, thereby guarantee the contact effect between this connecting metal wire and the binding terminal, simultaneously, effectually improved the effect of buckling of this connecting metal wire through chamfer structure, thereby effectually improved narrow frame display panel's quality and comprehensive properties.

Description

Display panels and display devices

Technical field

The present invention relates to the technical field of manufacturing display panels, and in particular, to a display panel and a display device.

Background technique

With the development of display panel preparation technology, people have put forward higher requirements for the display effect and comprehensive performance of display panels and display devices.

Currently, the market has increasingly narrow frame requirements for display panels. By reducing the frame of the non-display area of the display panel, the screen-to-body ratio of the display panel is increased, thereby improving its display effect. In the traditional panel structure, the binding structure of the display panel is usually changed to reduce the width of the panel's frame area, thereby achieving a narrow frame. For example, chip on flexible (COF) technology uses COF technology to realize the need for small-sized electronic products. The control chip IC is fixed on the flexible circuit board and uses side binding to reduce the binding area. Border width. However, in the above technical solution, since the width of the bonding area reserved in the existing display panel is generally narrow, the structural design of the bonding metal traces set on the side is unreasonable when connecting to the bonding terminals. The contact area between them is small, and since the bonding metal traces are arranged on the sides of the panel, their thicknesses are thin, and the contact area between the thinner bonding metal traces and the bonding terminals will be further reduced. As a result, the contact effect between the binding wiring and the binding terminals on the side is poor, and the conductivity is poor, which is not conducive to further improvement of the overall performance of the display panel.

To sum up, when setting up a narrow-frame display panel in the prior art, the structure of the bound metal traces in the frame area of the display panel and the contact effect between them are not ideal, which is not conducive to the overall performance of the narrow-frame display panel. Further improve.

Contents of the invention

Embodiments of the present invention provide a display panel and a display device to effectively improve the unsatisfactory structural design and contact effect between the bound metal traces in the frame area of the existing narrow-frame display panel, thereby reducing the quality and quality of the display panel. Overall performance issues.

In order to solve the above technical problems, a first aspect of the embodiment of the present invention provides a display panel, including:

Array substrate;

A color filter substrate is arranged in a box with the array substrate, and one end edge of the array substrate protrudes from the color filter substrate;

Binding terminals, at least part of the binding terminals are provided in the area where the array substrate protrudes from the color filter substrate; and,

Connecting metal wires, the connecting metal wires are electrically connected to the binding terminals;

Wherein, the edge of the side of the array substrate provided with the binding terminal is provided with a chamfer structure, and one end of the connecting metal wire covers part of the surface of the side of the binding terminal opposite to the color filter substrate, and the The other end of the connecting metal line is bent along the chamfer structure and extends to the side of the array substrate.

According to an embodiment of the present invention, the display panel includes a display area and a non-display area provided on one side of the display area;

Wherein, the array substrate further includes a protruding portion disposed in the non-display area, the binding terminal is disposed on a side surface of the protruding portion facing the color filter substrate, and the connecting metal line is connected to the The overlapping area of the binding terminals is at least one third of the area of the binding terminals.

According to an embodiment of the present invention, the display panel further includes a sealant, the sealant is disposed correspondingly between the color filter substrate and the array substrate, the sealant covers part of the binding terminal, and the sealant is The edge of the sealant away from the display area is flush with the edge of the color filter substrate.

According to an embodiment of the present invention, the length of the protrusion is set to 20um-35um.

According to an embodiment of the present invention, the connecting metal wire includes a first connection part, a second connection part and a third connection part;

Wherein, the first connecting part is attached to the surface of the binding terminal, the second connecting part is attached to the surface of the chamfered structure, and the third connecting part is attached to the first connecting part. The sides in the thickness direction of the substrate are in contact with each other.

According to an embodiment of the present invention, the thickness of the second connection part is greater than the film thickness of the third connection part.

According to an embodiment of the present invention, the first substrate includes a first bonding surface and a second bonding surface, and the first bonding surface and the second bonding surface are connected through the chamfer structure, and The first bonding surface faces the second substrate;

Wherein, the curvature between the chamfer structure and the first bonding surface is smaller than the curvature between the chamfer structure and the second bonding surface.

According to an embodiment of the present invention, a plurality of grooves are further provided on the surface of the chamfered structure. The extending direction of the grooves is the same as the bending direction of the connecting metal wires, and each of the connecting metal wires Correspondingly arranged in each of the grooves.

According to an embodiment of the present invention, the display panel further includes a flexible circuit board and a driver chip;

Wherein, the driver chip is disposed on a side of the flexible circuit board close to the first substrate, and one end of the flexible circuit board is electrically attached to the connecting metal line on the side of the first substrate. , the other end of the flexible circuit board is electrically connected to the driver chip.

According to a second aspect of the embodiment of the present invention, a display device is also provided. The display device includes the display panel provided in the embodiment of the present invention.

Beneficial effects of embodiments of the present invention: Compared with the existing technology, embodiments of the present application provide a display panel and a display device. The display panel includes a first substrate, a second substrate disposed opposite the first substrate, binding terminals and connecting metal wires. Wherein, a chamfered structure is provided on the edge of the first substrate close to the binding terminal. One end of the connecting metal wire at least covers part of the binding terminal, and the other end of the connecting metal wire is bent relative to the chamfered structure and attached to the chamfered structure. disposed on one side of the first substrate. In the embodiment of the present application, a chamfer structure is provided at the edge of the first substrate, and the connecting metal wire is directly electrically connected to the surface of the binding terminal, thereby ensuring the contact between the connecting metal wire and the binding terminal. At the same time, the chamfering structure effectively improves the bending effect of the connecting metal wire, and ensures the transfer stress and connection quality of the connecting metal wire, thereby effectively improving the quality and comprehensive performance of the narrow-frame display panel. .

Description of drawings

In order to explain the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are for application purposes only. For some embodiments, for those of ordinary skill in the art, other drawings can be obtained based on these drawings without exerting creative efforts.

Figure 1 is a schematic structural diagram of a display panel provided in the prior art;

Figure 2 is a schematic structural diagram of a display panel provided in an embodiment of the present application;

Figure 3 is a partial connection plan view of the binding terminal and the connecting metal wire in the non-display area provided in the embodiment of the present application;

4 to 8 are film layer structure diagrams corresponding to the preparation process of the display panel provided in the embodiment of the present application;

Figures 9 to 11 show the corresponding structures of the connecting metal lines provided in the embodiments of the present application during the coating process;

Figure 12 is a schematic diagram of the film structure of another display panel provided in an embodiment of the present application;

FIG. 13 is a schematic diagram of the film structure of another display panel provided in the embodiment of the present application.

Detailed ways

In the following detailed description, certain embodiments of the invention are shown and described, simply by way of illustration. As those skilled in the art would realize, the embodiments described herein may be modified in various ways, all without departing from the spirit or scope of the invention.

In the drawings, the thickness of layers, films, panels, regions, etc., may be exaggerated for clarity and for better understanding and ease of description. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present.

Additionally, unless expressly described to the contrary, the word "comprises" and variations thereof like "includes" or "contains" will be understood to imply the inclusion of discussed elements but not necessarily the exclusion of other elements. Further, in the specification, the word "on" refers to being placed above or below the object part, and does not necessarily mean being placed on the upper side of the object part based on the direction of gravity.

It will be understood that, although the terms "first," "second," etc. may be used herein to describe various components, these components should not be limited by these terms. These components are only used to distinguish one component from another.

As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It will also be understood that the terms "comprising" and/or "comprising" as used herein specify the presence of stated features or components, but do not exclude the presence or addition of one or more other features or components.

It will be understood that when a layer, region or component is referred to as being "formed on" another layer, region or component, it can be directly or indirectly formed on the other layer, region or component. For example, there can be intermediate layers, regions or components.

In the following examples, the x-axis, y-axis, and z-axis are not limited to the three axes of the Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

As shown in Figure 1, Figure 1 is a schematic structural diagram of a display panel provided in the prior art. In the prior art, after the array substrate 101' and the color filter substrate 102' are combined to form a box, one edge is usually cut to form the panel structure in Figure 1. When the display panel is bound, the binding terminals 103' provided on one side of the array substrate 101' and the connecting metal wires 104' provided on the side are used. Wherein, the connecting metal line 104' is usually provided on one side of the array substrate 101' and the color filter substrate 102', so that the side surface of the binding terminal 103' is in contact with the side surface of the connecting metal line 104 and is electrically connected. The height of the contact area between the two is only about 0.7um. The contact area is small and it is easy for poor connection to occur, which will lead to panel failure and is not conducive to further improvement of the overall performance of the panel.

Embodiments of the present application provide a display panel and a display device to effectively realize the narrow frame design of the display panel and at the same time effectively improve the electrical connection effect of the metal traces in the binding area.

As shown in Figure 2, Figure 2 is a schematic structural diagram of a display panel provided in an embodiment of the present application. In the embodiment of the present application, the display panel includes a first substrate, a second substrate, binding terminals 103 and connecting metal wires 104.

Specifically, in the embodiment of the present application, the array substrate 101 is used as the first substrate as an example, and the color filter substrate 102 as the second substrate is used as an example for description. Specifically, the array substrate 101 is arranged on one side of the color filter substrate 102, for example, the array substrate 101 and the color filter substrate 102 are arranged in a box.

Further, when setting up the display panel provided in the embodiment of the present application, the display panel may also include a display area 20, a non-display area 21, a frame glue 105, and a sealant 106.

Specifically, the non-display area 21 of the display panel is disposed on at least one side of the display area 20. As in the embodiment of the present application, the non-display area 21 can be disposed around the display area 20. In the embodiment of the present application, the non-display area 21 can be a frame area or a binding area of the display panel. By arranging other binding structures in the frame area or the binding area, such as arranging metal wiring in the frame area, The pixels in the display area are controlled through metal wiring, and the normal light-emitting display of the display panel is driven.

Furthermore, when disposing the sealant 105 and sealant 106 in the embodiment of the present application, the sealant 105 is disposed at a corresponding position between the array substrate 101 and the color filter substrate 102 . For example, the frame glue 105 is disposed on one side close to the edge of the color filter substrate 102. The frame glue 105 can seal and support the array substrate 101 and the color filter substrate 102, thereby ensuring that other films between the array substrate and the color filter substrate are protected. The cascading effect of layers.

Specifically, the sealant 105 and the sealant 106 are both disposed between the array substrate and the color filter substrate, and the sealant 106 is disposed on a side of the sealant 105 away from the display area 20 and adjacent to the sealant 105 . In the embodiment of the present application, the sealant covers part of the binding terminals, and the edge of the sealant 106 away from the display area can be flush with the edge of the color filter substrate 102, thereby ensuring the sealing effect of the display panel and preventing external Water vapor and other substances enter the display panel.

In the embodiment of the present application, when the array substrate 101 and the color filter substrate 102 are provided, the length of the array substrate 101 may be greater than the length of the color filter substrate 102 . Referring to FIG. 1 in detail, the length of the right side of the array substrate 101 protrudes beyond the edge of the color filter substrate, that is, the length of the right side of the array substrate is greater than the length of the color filter substrate 102 .

Further, the binding terminals 103 of the display panel are provided on the array substrate. Wherein, the binding terminal 103 is at least partially disposed in the non-display area 21 . In the following embodiments, the binding terminal 103 is provided on the surface of the array substrate 101 facing the color filter substrate 102 . And is electrically connected to the wiring in the array substrate 101 to realize the transmission of control signals.

In the embodiment of the present application, as shown in FIG. 2 for details, when the array substrate 101 is disposed, the array substrate 101 further includes a protruding portion 204 . The protruding part 204 is disposed in the non-display area 21 , and the protruding part 204 protrudes from the edge of the color filter substrate 102 . In this way, on the right side of the display panel, the length of the array substrate 101 is greater than the length of the color filter substrate 102 .

At the same time, the binding terminal 103 is correspondingly provided on the protrusion 204 , for example, the binding terminal 103 is provided on the surface of the array substrate 101 facing the color filter substrate 102 . In the embodiment of the present application, when the above-mentioned binding terminal 103 is provided, the edge of the binding terminal 103 close to the display area 20 can contact the sealant 106 , and at the same time, the edge of the binding terminal 103 away from the display area 20 The edge extends toward the edge of the array substrate 101 , thereby forming a binding terminal with a certain length on the array substrate 101 .

In the embodiment of the present application, when the above-mentioned protruding portion 204 is provided, the length of the protruding portion 204 is set to D1. Specifically, the length D1 of the protruding portion 204 can be set to 20um˜35um. Optionally, the length D1 of the protruding portion 204 is set to 28um, thereby effectively increasing the area of the binding terminal 103 and ensuring its contact effect.

Furthermore, in the embodiment of the present application, when the connecting metal wire 104 is provided, the connecting metal wire 104 is electrically connected to the binding terminal 103 . Specifically, the connecting metal line 104 is provided on one side close to the edge of the array substrate 101 . Since the non-display area is mainly a binding area of the display panel, binding of the display panel and transmission of control signals within the display area of the display panel are achieved through the binding terminal 103 and the connecting metal wire 104 . At the same time, in order to achieve a narrow frame effect, the connecting metal line 104 is attached to the side of the array substrate 101 to reduce the frame width of the display panel as much as possible, thereby ensuring the connection effect of the connecting metal line 104 while reducing the frame width. width.

Specifically, when the above-mentioned connecting metal wire 104 is provided, one end of the connecting metal wire 104 at least covers part of the binding terminal 103, and the other end of the connecting metal wire 104 extends to the second bonding surface 303 of the array substrate 101, It is closely attached to the second fitting surface 303 and continues to extend downward and be bound.

In the embodiment of the present application, in order to improve the contact effect, the projection of the connecting metal wire overlapping the binding terminal on the array substrate is located in the projection area of the binding terminal on the array substrate. Inside. Specifically, the area of the coverage area between the connecting metal wire 104 and the binding terminal 103 is at least one third of the total area of the binding terminal 103 . Preferably, the area covered by the connecting metal line 104 is half of the total surface area of the binding terminal 103. In this way, the contact effect between two different metal layers can be effectively increased and the performance of the panel can be effectively improved.

Further, in the embodiment of the present application, when the display panel is disposed, the display panel further includes a chamfer structure 333. Specifically, the chamfer structure 333 is provided on one side edge of the array substrate 101, for example, the chamfer structure 333 is provided on one side edge of the protruding portion 204 in the non-display area. And the chamfer structure 333 is provided between the upper surface of the array substrate 101 and the second bonding surface 303 of the array substrate 101 . The chamfered structure 333 achieves a gentle transition between the array substrate 101 and the second bonding surface 303, thereby improving the connection effect between different film layers.

In the embodiment of the present application, the second bonding surface 303 is mainly a side surface in the thickness direction of the array substrate 101 , and the second bonding surface 303 is mainly used to bind and bond the connecting metal wires 104 .

Specifically, when the above-mentioned connecting metal wire 104 is provided, the connecting metal wire 104 may also include a first connecting part 4011, a second connecting part 4012 and a third connecting part 4013. The first connection part 4011 is disposed on a side close to the display area 20 , the third connection part 4013 is disposed on a side away from the display area, and the first connection part 4011 and the third connection part 4013 pass through the second connection part 4012 are connected, and finally form the connecting metal line 104 provided in the embodiment of the present application.

As shown in FIG. 2 , the first connection portion 4011 is correspondingly disposed on the upper surface of the array substrate 101 and covers at least part of the binding terminal 103 . The second connecting portion 4012 is disposed correspondingly to the chamfered structure 333 and is attached to the surface of the chamfered structure 333. At the same time, the third connecting portion 4013 is disposed on the second bonding surface 303 of the array substrate 101, and Fits snugly. In the embodiment of the present application, by providing the above-mentioned chamfering structure, the chamfering structure can smoothly transition the connecting metal wire 104 in the bending area, thereby reducing the bending stress of the connecting metal wire 104. At the same time, the chamfering structure The curved surface can further reduce the width of the frame corresponding to this area, thereby achieving a narrow frame.

In the embodiment of the present application, since the connecting metal wire 104 is electrically connected to the binding terminal 103, the connecting metal wire 104 can transmit the control signal on the array substrate, and the binding terminal 103 and the connecting metal wire 104 There is a large coverage area, and at the same time, the connecting metal line 104 transitions gently at the chamfer structure, thereby effectively ensuring the contact effect between different metal lines in the frame area, and effectively reducing the risk of connecting metal lines. stress, improving the overall performance of the display panel.

Furthermore, when arranging the above different connection parts, in order to ensure the overall performance and quality of the panel, the film thickness of the second connection part 4012 can be greater than the film thickness of the third connection part 4013. At the same time, the third connection part The film thickness of the portion 4013 may be greater than the film thickness of the first connecting portion 4011 .

In the embodiment of the present application, when the above-mentioned chamfering structure 333 is provided, the chamfering structure 333 can be set as an arc transition surface or a circular transition surface, such as a fillet structure, or can be set as other structures according to the needs of different products and processes. . I won’t go into details here. In the following embodiments, the structures of the chamfer structure 333 on different bonding surfaces are described using arc-shaped transition surfaces as an example.

Specifically, the side of the array substrate 101 facing the color filter substrate is the first bonding surface, and the first bonding surface and the second bonding surface 303 are connected through the chamfer structure 333, wherein the chamfer structure 333 and The curvature between the first fitting surface is smaller than the curvature between the chamfer structure and the second fitting surface. Optionally, the curvature of the chamfer structure 333 can be set to 0.1um ^-1 ~ 0.4um ^-1 . Specifically, the curvature of the chamfer structure 333 at the first bonding surface is set to 0.1um ^-1 , and the curvature at the second bonding surface is set to 0.3um ^-1 , so that the bonding surfaces at two different positions are Different curvatures are set to effectively ensure the bonding effect of the connecting metal wire 104 and reduce the stress problems generated inside the wiring after bonding, thereby improving its quality.

Further, as shown in FIG. 3 , FIG. 3 is a partial connection plan view of the binding terminal 103 and the connecting metal wire 104 in the non-display area provided in the embodiment of the present application. Combined with the film layer structure in FIG. 2 , when arranging the above-mentioned binding terminals and connecting metal wires 104 , multiple binding terminals 103 can be arranged at intervals. For example, the binding terminals 103 are arranged at equal intervals on the surface of the array substrate.

At the same time, each connecting metal wire 104 is disposed above each binding terminal 103 correspondingly. In order to ensure its consistency, the connecting metal wire 104 can be arranged symmetrically with respect to the central axis of the binding terminal 103, thereby ensuring the consistency and stability of signal transmission.

See Figure 3 for details, and combined with the structure in Figure 2, when the above-mentioned chamfer structure 333 and the corresponding connecting metal line 104 are provided, a plurality of grooves 456 can also be provided on the surface of the chamfer structure 333, each groove 456 corresponds to each connecting metal wire 104, that is, the extending direction of the groove 456 is the same as the bending direction of the connecting metal wire 104. In this way, the connecting metal wire 104 can fit in the groove 456. The groove 456 is used to position the connecting metal wire 104 to ensure the reliability and overall performance of the display panel.

Further, as shown in FIG. 12 , FIG. 12 is a schematic diagram of the film structure of another display panel provided in an embodiment of the present application. Combined with the structure in Figures 2-3, in this embodiment of the present application, the display panel further includes a protective layer 888. When the protective layer 888 is provided, at least part of the protective layer 888 is correspondingly provided on the binding terminal 103 connecting the metal line 104 and the color filter substrate 102 . For example, the protective layer 888 covers part of the binding terminal 103 . As shown in Figure 12, one end of the protective layer 888 is in contact with the color filter substrate 102, and the other end of the protective layer 888 covers the connecting metal line 104. In this way, the protective layer 888 can connect part of the metal line 104 and part of the connecting metal line 104. The binding terminal 103 is protected. At the same time, since the protective layer 888 covers one end of the connecting metal wire 104, the connecting metal wire 104 can be better protected and prevented from being bound or bent during the binding or bending process. , quality problems such as warping occurred.

In the embodiment of the present application, the thickness of the protective layer 888 can be greater than the thickness of the sealant 106. In this way, the protective layer 888 can further seal the color filter substrate and the array substrate 101, thereby effectively preventing external water vapor and other impurities. Go inside the panel.

See Figure 13 for details. Figure 13 is a schematic diagram of the film structure of yet another display panel provided in an embodiment of the present application. In combination with other embodiments, when the above protective layer 888 is provided, one end of the protective layer 888 can also be attached to the side of the color filter substrate 102, and the other end of the protective layer 888 extends to the side connected to the metal line. For example, there is a certain gap between the other end of the protective layer 888 and the connecting metal line 104, or it directly covers the connecting metal line 104, which will not be described again.

In the embodiment of the present application, since the protective layer 888 is attached to the side of the color filter substrate 102 and is bent to the surface of the binding terminal 103, the protective layer 888 forms a folded corner structure, which can effectively to seal the panel, thereby improving its protective effect on the panel.

Furthermore, the surface of the binding terminal 103 away from the color filter substrate 102 is also provided with micro-protrusions 666 . The micro-protrusions 666 can be configured as an alternating convex-concave structure. Correspondingly, the connecting metal line 104 is provided with depressions or protrusions that match the protrusions or depressions. The two match each other, so that the micro-protrusions can be 666, effectively increasing the contact area between the connecting metal wire 104 and the binding terminal 103, thereby further improving the connection effect between the binding terminal and the connecting metal wire, and ensuring the reliability and comprehensive performance of the display panel.

Further, in this embodiment of the present application, the display panel also includes a flexible circuit board 401 and a driver chip 402. Specifically, one end of the flexible circuit board 401 is electrically connected to the third connection portion of the connecting metal wire 104, and the other end of the flexible circuit board 401 is electrically connected to the driver chip 402, thereby forming a side-bonded structure. , and realize the transmission of control signals through the flexible circuit board and the corresponding connecting metal wires.

In the embodiment of the present application, a method for preparing a display panel and a display device is also provided, as shown in Figures 4-8. Figures 4 to 8 show the film layer structure corresponding to the preparation process of the display panel provided in the embodiment of the present application. picture.

See Figure 4 for details. After the array substrate 101 and the color filter substrate 102 are paired into a box, they are offset and cut. Specifically, the color filter substrate 102 is cut in the non-display area. In the embodiment of the present application, the cutting position is outside the frame glue 105. After the cutting is completed, the excess color filter substrate is removed and a stepped structure is formed. At this time, the binding terminal 103 is exposed outside the frame glue 105, that is, in the non-display area.

See Figure 5 for details. After the offset cutting is completed, continue to install the sealant 106. At this time, the sealant 106 is disposed on a side of the frame glue 105 away from the display area, and the sealant 106 is in contact with the frame glue 105 and covers the binding terminals 103 in the corresponding area. In the embodiment of the present application, sealant 106 is provided to further improve the sealing effect and quality of the display panel.

See Figure 6 for details. After the installation of the sealant 106 is completed, the sealant 106 is further processed, such as cutting and shaping the sealant 106. Specifically, since the shape and structure of the sealant 106 are not ideal when the sealant 106 is applied, the excess sealant 106 can be cut and removed through a laser cutting process to ensure the structure of the sealant 106 , and effectively avoid the problem of mutual interference between the sealant 106 and other film layers. After the cutting is completed, the sealant 106 is flush with the side of the color filter substrate 102 .

As shown in FIG. 7 for details, in the embodiment of the present application, after the sealant 106 is processed, a chamfer structure 333 is provided at the side of the array substrate. First, the binding terminals 103 are processed to remove the excess binding terminals 103 at the chamfered structure 333. After the removal is completed, the array substrate is further processed. Specifically, the chamfer structure 333 can be set to a rounded corner R. Specifically, the setting parameters of the chamfer structure 333 can be set according to the parameters provided in the embodiments of this application. For example, the fillet radius of the chamfer structure 333 is set to 5um˜10um, or it can be set according to the requirements of different products. In this way, by setting the chamfer structure 333 and processing the binding terminal 103, a foundation is laid for the subsequent setting of other wirings.

See Figure 8 for details. After the chamfer structure 333 is processed, continue to set other film layers. Specifically, a pad printing process is used to prepare the connecting metal line 104 at the corresponding position of the non-display area.

In the embodiment of the present application, when preparing and forming the connecting metal line 104, a coating process can also be used to further improve the preparation efficiency and accuracy. Specifically, as shown in Figures 9-11, Figures 9 to 11 illustrate the corresponding structures of the connecting metal lines provided in the embodiments of the present application during the coating process. With reference to Figures 4 to 8, after the chamfering structure processing is completed, a protective film 666 is placed on the display panel. In the embodiment of the present application, the protective film 666 is disposed on the upper surface of the color filter substrate 102 and the upper surface of the binding terminal 103 to protect them and prevent unnecessary film layers from forming. other structures.

As shown in Figure 10 for details, after the protective film 666 is laid, a coating process is performed. The materials selected in the coating are mainly metal materials such as Cu, Al, TiAlTi, etc., to form metal tracks with a specified structure and shape and size. Wire. At this time, coating is performed on the chamfer structure 333 and the second bonding surface 303 and the first bonding surface 302 of the array substrate 101, and finally the connecting metal lines 104 in the embodiment of the present application are formed. In the embodiment of the present application, the coating process is used to directly deposit the connecting metal lines at the corresponding positions to form the required structure, thereby effectively improving the display panel preparation process, improving the preparation efficiency, and the quality and comprehensive performance of the film layer.

As shown in FIG. 11 for details, after the coating is completed, the protective film 666 is removed, and the binding terminals 103 and the connecting metal wires 104 are continued to be processed. Specifically, a laser process is used to process the binding terminals and the connecting metal wires 104, and different connecting terminals and corresponding binding structures are formed by laser. Finally, a one-to-one binding and connection structure between the binding terminal 103 and the connecting metal wire 104 provided in the embodiment of the present application is formed. In the embodiments of the present application, by using a coating process and combining it with a laser process to process different film layers, the preparation efficiency is effectively improved, and the preparation accuracy of the above process is higher, thereby effectively ensuring the separation between the film layers. Preparation accuracy and connection effect.

Further, the embodiments of the present application also provide a display device. The display device includes the display panel in the embodiments of the present application, and when preparing and forming the display panel in the embodiments of the present application, the preparation process provided above is used. , thereby effectively improving the preparation effect, improving the binding structure of the display panel, and improving the overall performance of the display device.

To sum up, the display panel and display device provided by the embodiments of the present invention have been introduced in detail. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for reference. In order to help understand the technical solutions and core ideas of the present invention; although the present invention is disclosed above in preferred embodiments, the above preferred embodiments are not used to limit the present invention. Those of ordinary skill in the art will not deviate from the spirit and spirit of the present invention. Various modifications and modifications can be made within the scope. Therefore, the protection scope of the present invention is based on the scope defined by the claims.

Claims (10)

1. A display panel, comprising:

an array substrate;

the color film substrate is arranged in a box-to-box manner with the array substrate, and one end edge of the array substrate protrudes out of the color film substrate;

the binding terminals are at least partially arranged in the area of the array substrate protruding out of the color film substrate; the method comprises the steps of,

the connecting metal wire is electrically connected with the binding terminal;

the edge of one side of the binding terminal of the array substrate is provided with a chamfer structure, one end of the connecting metal wire covers part of the surface of one side of the binding terminal opposite to the color film substrate, and the other end of the connecting metal wire is bent along the chamfer structure and extends to the side face of the array substrate.

2. The display panel of claim 1, wherein the connection metal line includes a first connection portion, a second connection portion, and a third connection portion;

the first connecting portion is attached to the surface of the binding terminal, the second connecting portion is attached to the surface of the chamfering structure, and the third connecting portion is attached to the side face of the thickness direction of the array substrate.

3. The display panel according to claim 2, wherein a thickness of the second connection portion is greater than a film thickness of the third connection portion.

4. The display panel of claim 1, wherein the array substrate comprises a first bonding surface and a second bonding surface, the first bonding surface and the second bonding surface are connected through the chamfer structure, and the first bonding surface faces the color film substrate;

wherein, the curvature between the chamfer structure and the first fitting surface is smaller than the curvature between the chamfer structure and the second fitting surface.

5. The display panel according to claim 1, wherein a plurality of grooves are further formed on the surface of the chamfer structure, the extending direction of the grooves is the same as the bending direction of the connecting metal wires, and each connecting metal wire is correspondingly arranged in each groove.

6. The display panel according to claim 1, further comprising a display region and a non-display region provided on one side of the display region;

the array substrate further comprises a protruding portion arranged in the non-display area, the binding terminal is arranged on one side surface of the protruding portion, which faces the color film substrate, and the projection of the connecting metal wire, which is lapped on the binding terminal, on the array substrate is located in the projection area of the binding terminal on the array substrate.

7. The display panel of claim 6, further comprising a sealant correspondingly disposed between the color film substrate and the array substrate, wherein the sealant covers a portion of the binding terminals, and wherein an edge of a side of the sealant away from the display area is flush with an edge of the color film substrate.

8. The display panel of claim 1, further comprising a protective layer;

at least part of the protection layer is correspondingly arranged on the binding terminal between the connecting metal wire and the color film substrate.

9. The display panel according to claim 8, wherein one end of the protective layer is attached to a side surface of the color film substrate, and the other end of the protective layer extends to one side of the connection metal line.

10. A display device comprising the display panel according to any one of claims 1-9.