CN114167653A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
- Publication number
- CN114167653A CN114167653A CN202111484881.5A CN202111484881A CN114167653A CN 114167653 A CN114167653 A CN 114167653A CN 202111484881 A CN202111484881 A CN 202111484881A CN 114167653 A CN114167653 A CN 114167653A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- film
- alignment mark
- chip
- display panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133354—Arrangements for aligning or assembling substrates
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the application discloses display panel and display device, display panel includes: the panel comprises a panel body, a first binding area and a second binding area, wherein the first binding area is arranged at one side edge of the panel body; one end of the chip on film is connected with the first binding area of the display panel, the other end of the chip on film is overlapped and bound with the circuit board up and down, and the overlapping area of the chip on film and the circuit board is a second binding area; the first alignment mark is arranged on the surface of one side of the chip on film facing the circuit board or the surface of one side of the circuit board facing the chip on film; and the first through hole penetrates through the circuit board or the chip on film, and when the chip on film is bound with the circuit board, the first alignment mark is exposed in the first through hole.
Description
Technical Field
The application relates to the field of display, in particular to a display panel and a display device.
Background
The display panel is a display tool for displaying a certain electronic file on a screen through a specific transmission device and reflecting the electronic file to human eyes. Depending on the material used for fabrication, they can be classified into LCD (liquid crystal display), OLED (organic light emitting diode), Mini-LED (Mini light emitting diode), Micro-LED (Micro light emitting diode), and the like. The OLB (Outer Lead Bonding) engineering is a crucial step for connecting external signals and internal circuits of the panel, and plays a role in starting and stopping, so the OLB process result directly affects the quality of the product, and the yield of the product also ultimately affects the release preparation of the product.
The conventional COF (Chip on film) is bound with a PCBA (Printed Circuit Board Assembly), the OLB machine locates the position by identifying a cross mark on the panel and an Optical mark on the Circuit Board, and then detects the alignment connection condition of the PCBA and the COF by an Automatic Optical Inspection (AOI). However, the method often fails to detect the alignment failure between the PCBA and the COF, and the defects of the panel are not detected until the PCBI (liquid crystal display module) picture is inspected, which seriously affects the in-plant binding yield and increases the rework rate, and affects the in-plant productivity and product quality.
Disclosure of Invention
The embodiment of the application provides a display panel and a display device, which can solve the technical problem that a circuit board and a chip on film are not well bound in the prior art.
An embodiment of the present application provides a display panel, including: the panel comprises a panel body, a first binding area and a second binding area, wherein the first binding area is arranged at one side edge of the panel body; one end of the chip on film is connected with the first binding area of the display panel, the other end of the chip on film is overlapped and bound with the circuit board up and down, and the overlapping area of the chip on film and the circuit board is a second binding area; the first alignment mark is arranged on the surface of one side of the chip on film facing the circuit board or the surface of one side of the circuit board facing the chip on film; and the first through hole penetrates through the circuit board or the chip on film, and when the chip on film is bound with the circuit board, the first alignment mark is exposed in the first through hole.
Optionally, in some embodiments of the present application, the display panel further includes a second alignment mark disposed on a side surface of the circuit board away from the flip chip or a side surface of the flip chip away from the circuit board, and the second alignment mark surrounds an outer edge of the first through hole.
Optionally, in some embodiments of the present application, the first alignment mark is disposed at an edge of the chip on film or the circuit board.
Optionally, in some embodiments of the present application, a surface of each of the first alignment mark and the second alignment mark is coated with a layer of reflective material.
Optionally, in some embodiments of the present application, the first through hole coincides with a projection on the circuit board of the first alignment mark.
Optionally, in some embodiments of the present application, the projection shape is at least one of a circle, a rectangle, and a diamond.
Optionally, in some embodiments of the present application, a projection of the first alignment mark on the chip on film completely falls within a circle with a radius of 1 mm.
Optionally, in some embodiments of the present application, a projection of the second alignment mark on the circuit board completely falls within a circle with a radius of 0.5 mm.
Optionally, in some embodiments of the present application, the material of the first alignment mark and the second alignment mark is copper, silver, gold, or aluminum.
Correspondingly, the embodiment of the application also provides a display device which comprises the display panel.
The beneficial effects of the embodiment of the application lie in that, display panel and display device of the embodiment of the application set up first counterpoint mark and through-hole respectively on circuit board and flip chip film, the position of first counterpoint mark is observed to one side of keeping away from first counterpoint mark from the through-hole, when the outward flange of first counterpoint mark overlaps with the inward flange of through-hole, show that circuit board and flip chip film counterpoint are accomplished, set up the second counterpoint mark in the outward flange department of through-hole, so that better first counterpoint mark of observation, first counterpoint mark and second counterpoint mark are metallic material, be convenient for camera or people's eye discernment, the degree of difficulty has been reduced, counterpoint accuracy has been promoted, avoid circuit board and flip chip film to appear binding the problem of dislocation.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a partial schematic view of a display panel provided in an embodiment of the present application;
fig. 2 is a schematic plan view of a chip on film provided in the embodiment of the present application;
FIG. 3 is a schematic plan view of a circuit board provided by an embodiment of the present application;
fig. 4 is a cross-sectional view of a chip on film and a circuit board at a through hole according to an embodiment of the present application.
Description of reference numerals:
a panel body 10; a chip on film (20);
a circuit board 30; a first binding region 11;
a second binding region 21; a first alignment mark 40;
a through hole 22; second alignment marks 50.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
Examples
As shown in fig. 1, in the present embodiment, the display device of the invention includes a display panel, the display panel includes a panel body 10, a chip on film 20 and a circuit board 30, the edges of two ends of the chip on film 20 are respectively provided with a gold finger, one end of the gold finger is used for being bound with the first binding area 11 at the edge of the panel body 10, the other end of the gold finger is used for being bound with the circuit board 30, when being bound with the circuit board 30, the gold finger on the chip on film 20 needs to be bound with the gold finger on the circuit board 30 in a one-to-one correspondence manner, so that the chip on film 20 and the circuit board 30 need to be bound after being aligned, in the present embodiment, a first alignment mark 40 and a second alignment mark 50 (as shown in fig. 2) are respectively provided on the chip on film 20 and the circuit board 30, so as to achieve accurate positioning of the chip on film 20 and the circuit board 30.
As shown in fig. 2 and fig. 3, specifically, the bond between the flip chip film 20 and the circuit board 30 can be performed only by the upper and lower overlapping structures, in this embodiment, the overlapping area between the flip chip film 20 and the circuit board 30 is defined as a second bonding area 21, the first alignment mark 40 and the second alignment mark 50 are disposed in the second bonding area 21, wherein the first alignment mark 40 is disposed below the second alignment mark 50, in this embodiment, the circuit board 30 in the second bonding area 21 is bonded below the flip chip film 20, so the first alignment mark 40 is disposed on the circuit board 30, the second alignment mark 50 is disposed on the flip chip film 20, the first alignment mark 40 protrudes from a side surface of the circuit board 30 close to the flip chip film 20 and is disposed at an edge of the flip chip film 20 to avoid affecting the bonding of the metal terminals on the surface of the circuit board 30, the first alignment mark 40 is made of a metal material, and includes copper, At least one of silver, gold or aluminum, the projection pattern of the first alignment mark 40 on the circuit board 30 is one of a circle, a triangle, a rectangle or a diamond, and in the present embodiment, the projection pattern of the first alignment mark 40 on the circuit board 30 is a circle. The radius of the first alignment mark 40 is between 0.4 mm and 0.6mm, preferably 0.5mm, which is convenient for identification. In order to further improve the recognizable performance of the first alignment mark 40, in the embodiment, a layer of reflective material is coated on a surface of the first alignment mark 40 away from the circuit board 30, so as to facilitate a camera or a human eye to recognize the position of the first alignment mark 40.
As shown in fig. 4, the second alignment mark 50 is disposed on the flip chip film 20, wherein the through hole 22 is disposed on the flip chip film 20, when the flip chip film 20 and the circuit board 30 are bonded, the through hole 22 corresponds to the first alignment mark 40, when the first alignment mark 40 is completely exposed at the bottom of the through hole 22, it means that the alignment between the flip chip film 20 and the circuit board 30 is completed, in this embodiment, when the alignment between the flip chip film 20 and the circuit board 30 is completed, the projection of the through hole 22 on the circuit board 30 completely coincides with the projection of the first alignment mark 40 on the circuit board 30, when the camera or human eye views from one side of the flip chip film 20, it only needs to detect whether the area under the through hole 22 is completely covered by the first alignment mark 40, if other surfaces of the circuit board 30 can be observed from the through hole 22, it means that the alignment between the flip chip film 20 and the circuit board 30 is not completed, it needs to continuously adjust the relative positions of the two, until the alignment is completed. The second alignment mark 50 is an annular structure, is disposed on a side surface of the chip on film 20 away from the circuit board 30, and is designed around an edge of the through hole 22, the second alignment mark 50 and the first alignment mark 40 are made of the same material, an outer edge of the second alignment mark 50 is a circle with a radius of 0.8-1.2 mm, and the second alignment mark 50 is used to "protrude" the position of the through hole 22, so that a camera or a human eye can be conveniently positioned at the position of the through hole 22, thereby performing alignment of the through hole 22 and the first alignment mark 40. Similarly, in the present embodiment, the surface of the second alignment mark 50 away from the chip on film 20 is also coated with a layer of reflective material, so as to increase the contrast between the second alignment mark 50 and the circuit board 30 and improve the alignment accuracy when the chip on film 20 and the circuit board 30 are bonded.
It should be noted that, in the present embodiment, the flip-chip film 20 is bound above the circuit board 30 during the binding, in other preferred embodiments of the present invention, the circuit board 30 may also be bound above the flip-chip film 20, and at this time, the relative positions of the flip-chip film 20 and the circuit board 30 may be exchanged by flipping the whole display panel, so that the first alignment mark 40 may still be observed and positioned from the through hole 22 on the flip-chip film 20, and the positions of the first alignment mark 40 and the through hole 22 may also be exchanged, that is, the second alignment mark 50 and the through hole 22 are disposed on the circuit board 30, and the first alignment mark 40 is disposed on the flip-chip film 20.
The display panel and the display device of the embodiment have the advantages that the first alignment mark and the through hole are respectively arranged on the circuit board and the flip chip film, the position of the first alignment mark is observed from one side of the through hole far away from the first alignment mark, when the outer edge of the first alignment mark is overlapped with the inner edge of the through hole, alignment of the circuit board and the flip chip film is completed, the second alignment mark is arranged at the outer edge of the through hole, so that the first alignment mark can be better observed, the first alignment mark and the second alignment mark are made of metal materials, the identification by a camera or human eyes is facilitated, the identification difficulty is reduced, the alignment accuracy is improved, and the problem of binding dislocation of the circuit board and the flip chip film is avoided.
The display panel and the display device provided by the embodiments of the present application are described in detail above, and the principles and embodiments of the present application are described herein by applying specific examples, and the description of the embodiments is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A display panel, comprising:
the panel comprises a panel body, a first binding area and a second binding area, wherein the first binding area is arranged at one side edge of the panel body;
one end of the chip on film is connected with the first binding area of the display panel, the other end of the chip on film is overlapped and bound with the circuit board up and down, and the overlapping area of the chip on film and the circuit board is a second binding area;
the first alignment mark is positioned in the second binding area and is arranged on the surface of one side, facing the circuit board, of the chip on film or the surface of one side, facing the chip on film, of the circuit board;
and the first through hole is positioned in the second binding area and penetrates through the circuit board or the chip on film, and when the chip on film is bound with the circuit board, the first alignment mark is exposed in the first through hole.
2. The display panel according to claim 1, further comprising
The second alignment mark is arranged on the surface of one side of the circuit board far away from the chip on film or the surface of one side of the chip on film far away from the circuit board, and the second alignment mark surrounds the outer edge of the first through hole.
3. The display panel according to claim 1,
the first alignment mark is arranged at the edge of the chip on film or the circuit board.
4. The display panel according to claim 2,
the surfaces of the first alignment mark and the second alignment mark are coated with a layer of reflective material.
5. The display panel according to claim 1,
the first through hole is superposed with the projection of the first alignment mark on the circuit board.
6. The display panel according to claim 5,
the projection shape is at least one of a circle, a rectangle and a rhombus.
7. The display panel according to claim 1,
the projection of the first alignment mark on the chip on film completely falls into a circle with the radius of 1 mm.
8. The display panel according to claim 2,
the projection of the second alignment mark on the circuit board completely falls into a circle with the radius of 0.5 mm.
9. The display panel according to claim 2,
the first alignment mark and the second alignment mark are made of copper, silver, gold or aluminum.
10. A display device comprising the display panel according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111484881.5A CN114167653A (en) | 2021-12-07 | 2021-12-07 | Display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111484881.5A CN114167653A (en) | 2021-12-07 | 2021-12-07 | Display panel and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114167653A true CN114167653A (en) | 2022-03-11 |
Family
ID=80483848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111484881.5A Pending CN114167653A (en) | 2021-12-07 | 2021-12-07 | Display panel and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114167653A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114994991A (en) * | 2022-06-20 | 2022-09-02 | 苏州华星光电技术有限公司 | Chip-on-Film and Display Device |
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| CN114994991B (en) * | 2022-06-20 | 2023-08-22 | 苏州华星光电技术有限公司 | Chip-on-chip film and display device |
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