CN114094019A - A method for improving the adsorption density of self-assembled monomolecular carrier transport layers - Google Patents
A method for improving the adsorption density of self-assembled monomolecular carrier transport layers Download PDFInfo
- Publication number
- CN114094019A CN114094019A CN202111279464.7A CN202111279464A CN114094019A CN 114094019 A CN114094019 A CN 114094019A CN 202111279464 A CN202111279464 A CN 202111279464A CN 114094019 A CN114094019 A CN 114094019A
- Authority
- CN
- China
- Prior art keywords
- substrate
- transport layer
- self
- hole transport
- nio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 82
- 230000005525 hole transport Effects 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 32
- 238000001179 sorption measurement Methods 0.000 claims abstract description 30
- 238000004873 anchoring Methods 0.000 claims abstract description 19
- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 17
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 238000000151 deposition Methods 0.000 claims abstract description 11
- 230000008021 deposition Effects 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 88
- 239000000463 material Substances 0.000 claims description 41
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 24
- 239000010408 film Substances 0.000 claims description 23
- 239000013545 self-assembled monolayer Substances 0.000 claims description 19
- 238000002360 preparation method Methods 0.000 claims description 17
- 150000004706 metal oxides Chemical class 0.000 claims description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 11
- 239000001301 oxygen Substances 0.000 claims description 11
- 239000002243 precursor Substances 0.000 claims description 11
- 230000005684 electric field Effects 0.000 claims description 10
- 229910052760 oxygen Inorganic materials 0.000 claims description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- 238000002207 thermal evaporation Methods 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052786 argon Inorganic materials 0.000 claims description 8
- 229910044991 metal oxide Inorganic materials 0.000 claims description 8
- 238000004528 spin coating Methods 0.000 claims description 8
- 238000001704 evaporation Methods 0.000 claims description 7
- 230000008020 evaporation Effects 0.000 claims description 7
- 239000002094 self assembled monolayer Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 5
- 238000005406 washing Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 125000005647 linker group Chemical group 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 229910052755 nonmetal Inorganic materials 0.000 claims description 4
- 238000000137 annealing Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 2
- AWXGSYPUMWKTBR-UHFFFAOYSA-N 4-carbazol-9-yl-n,n-bis(4-carbazol-9-ylphenyl)aniline Chemical compound C12=CC=CC=C2C2=CC=CC=C2N1C1=CC=C(N(C=2C=CC(=CC=2)N2C3=CC=CC=C3C3=CC=CC=C32)C=2C=CC(=CC=2)N2C3=CC=CC=C3C3=CC=CC=C32)C=C1 AWXGSYPUMWKTBR-UHFFFAOYSA-N 0.000 claims 1
- 101000837344 Homo sapiens T-cell leukemia translocation-altered gene protein Proteins 0.000 claims 1
- 102100028692 T-cell leukemia translocation-altered gene protein Human genes 0.000 claims 1
- YERGTYJYQCLVDM-UHFFFAOYSA-N iridium(3+);2-(4-methylphenyl)pyridine Chemical compound [Ir+3].C1=CC(C)=CC=C1C1=CC=CC=N1.C1=CC(C)=CC=C1C1=CC=CC=N1.C1=CC(C)=CC=C1C1=CC=CC=N1 YERGTYJYQCLVDM-UHFFFAOYSA-N 0.000 claims 1
- 125000000524 functional group Chemical group 0.000 abstract description 6
- 239000005416 organic matter Substances 0.000 abstract description 6
- 230000001105 regulatory effect Effects 0.000 abstract description 6
- 230000001276 controlling effect Effects 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 23
- 238000000682 scanning probe acoustic microscopy Methods 0.000 description 9
- 230000009471 action Effects 0.000 description 8
- 230000007547 defect Effects 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- XIOYECJFQJFYLM-UHFFFAOYSA-N 2-(3,6-dimethoxycarbazol-9-yl)ethylphosphonic acid Chemical compound COC=1C=CC=2N(C3=CC=C(C=C3C=2C=1)OC)CCP(O)(O)=O XIOYECJFQJFYLM-UHFFFAOYSA-N 0.000 description 4
- 229910005855 NiOx Inorganic materials 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 230000007935 neutral effect Effects 0.000 description 4
- 238000001338 self-assembly Methods 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 238000013082 photovoltaic technology Methods 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- KIMPAVBWSFLENS-UHFFFAOYSA-N 2-carbazol-9-ylethylphosphonic acid Chemical compound C1=CC=CC=2C3=CC=CC=C3N(C1=2)CCP(O)(O)=O KIMPAVBWSFLENS-UHFFFAOYSA-N 0.000 description 1
- XDXWNHPWWKGTKO-UHFFFAOYSA-N 207739-72-8 Chemical compound C1=CC(OC)=CC=C1N(C=1C=C2C3(C4=CC(=CC=C4C2=CC=1)N(C=1C=CC(OC)=CC=1)C=1C=CC(OC)=CC=1)C1=CC(=CC=C1C1=CC=C(C=C13)N(C=1C=CC(OC)=CC=1)C=1C=CC(OC)=CC=1)N(C=1C=CC(OC)=CC=1)C=1C=CC(OC)=CC=1)C1=CC=C(OC)C=C1 XDXWNHPWWKGTKO-UHFFFAOYSA-N 0.000 description 1
- -1 Br-2PACz Chemical compound 0.000 description 1
- ZNLXWYZMMYDGCE-UHFFFAOYSA-N CC=1C=CC=2N(C3=CC=C(C=C3C=2C=1)C)CCCCP(O)(O)=O Chemical compound CC=1C=CC=2N(C3=CC=C(C=C3C=2C=1)C)CCCCP(O)(O)=O ZNLXWYZMMYDGCE-UHFFFAOYSA-N 0.000 description 1
- 229920001167 Poly(triaryl amine) Polymers 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N SnO2 Inorganic materials O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- MCEWYIDBDVPMES-UHFFFAOYSA-N [60]pcbm Chemical compound C123C(C4=C5C6=C7C8=C9C%10=C%11C%12=C%13C%14=C%15C%16=C%17C%18=C(C=%19C=%20C%18=C%18C%16=C%13C%13=C%11C9=C9C7=C(C=%20C9=C%13%18)C(C7=%19)=C96)C6=C%11C%17=C%15C%13=C%15C%14=C%12C%12=C%10C%10=C85)=C9C7=C6C2=C%11C%13=C2C%15=C%12C%10=C4C23C1(CCCC(=O)OC)C1=CC=CC=C1 MCEWYIDBDVPMES-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000002052 molecular layer Substances 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/10—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising heterojunctions between organic semiconductors and inorganic semiconductors
- H10K30/15—Sensitised wide-bandgap semiconductor devices, e.g. dye-sensitised TiO2
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0605—Carbon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0694—Halides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/083—Oxides of refractory metals or yttrium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/085—Oxides of iron group metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
- H10K50/15—Hole transporting layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention relates to a method for improving the adsorption density of a self-assembled monomolecular carrier transport layer, which comprises the following steps: preparing NiO on clean substrate by utilizing magnetron sputtering coating equipment at normal temperaturexA hole transport layer; regulating and controlling the binding sites on the substrate, selecting the organic matter containing anchoring groups and NiO on the surface of the substrate due to the hydroxyl contained on the surface of the substratexThe substrate of the hole transport layer reacts. The invention has the beneficial effects that: selecting organic matter containing anchoring group and NiO as surfacexReacting the substrate of the hole transport layer, selecting proper (molecular weight, symmetry, polarity and the like) organic matters containing anchoring groups by regulating and controlling the binding sites of the substrate, and preparing the required performances of high adsorption density, strong polarity and the like by regulating the content, deposition mode, growth direction and the like of the anchoring groups; the addition of a layer containing-OR functional groups prevents direct contact of the transparent conductive oxide substrate with the active layer; is favorable for improving the adsorption density of the organic matters containing the anchoring groups.
Description
Technical Field
The invention belongs to the field of photovoltaics, and particularly relates to a method for improving the adsorption density of a self-assembled monomolecular carrier transport layer.
Background
In recent decades, photovoltaic technologies such as organic light emitting diodes, photodetectors, dye-sensitized solar cells, quantum dot solar cells, organic solar cells, and perovskite solar cells have been rapidly developed. Among them, organic-inorganic hybrid perovskite solar cells are receiving wide attention due to the advantages of high light absorption coefficient, long diffusion length, high carrier mobility, low exciton binding energy, adjustable band gap and the like, and the photoelectric conversion efficiency of a single perovskite solar cell is improved from 3.8% to 25.5% in nearly ten years. However, with the further improvement of the quality of perovskite crystals, efficient, stable and cheap carrier transport materials are of great importance for the further development of perovskite solar cells. The photoelectric conversion efficiency of the organic solar cell is close to the predicted limit value of 20%, and in order to further improve the efficiency and stability of the organic solar cell, the carrier transport material is also important to research.
Currently, several commonly used carrier transport materials are described below:
(1) perovskite solar cell: common hole transport materials include PEDOT PSS, PTAA, NiOX,CuOXCuSCN, poly-TPD and SAMs, etc.; common electron transport materials include PCBM, C60/BCP,TiO2,SnO2And SAMs, and the like.
(2) Organic solar cell: the material is usually PEDOT, PSS, which is used as a hole transport material; commonly used electron transport materials include PNDIT-F3N, PFN-Br, PDINO, ZnO, SAMs and the like.
Wherein SAMs refers to self-assembled monolayer materials consisting essentially of a head anchoring group (including-Si (OR))3,-P(OH)3-COOH, etc.), a central linking group and a tail functional group. SAMs has the advantages of simple preparation (spin coating, soaking, spraying, etc.), small parasitic absorption, low material consumption, conformal substrate, adjustable substrate energy level, and passivation of functional groupsThe advantages of the layer are widely noted. Since Albrecht et al 2018, SAM V1036 is applied to perovskite solar cells as a hole transport material for the first time, and various SAMs such as MeO-2PACz, 2PACz, Me-4PACz, Br-2PACz, TPA, EADR04 and the like are widely applied to perovskite solar cells and organic solar cells. SAMs are mostly used as SnO, although in other photovoltaic fields2And interface modification of ITO and the like (for example, 5-MePIFA, 5-DPIFA, FPA and the like are commonly used as modifiers in organic light emitting diodes), but can simultaneously function as a transport layer and an interface modifier as long as appropriate SAMs materials are selected.
For photovoltaic cells, the photoactive layer, the transport layer, and the electrodes are not critical to the performance of the device. With the rapid development of photovoltaic technology, the existing transport layer materials generally have the following problems, which greatly limit the further development of photovoltaic technology:
(1) conventional organic transport layer materials are expensive, have poor stability, and require complex doping processes.
(2) Conventional inorganic transport materials have interface defects and poor electrical conductivity.
(3) SAMs transport materials are adsorbed in a single layer and easily tunneled or formed into pores.
Therefore, developing a new transport layer material is a direct method to solve the above problems, but is not the fastest method to solve the above problems because the development of a new material takes a long time.
Aiming at the problem of poor conductivity of the traditional inorganic material, the problem is usually solved by adopting a doping mode at present. With NiOXTransport Material for example, Defect from Nickel oxide equation 2NiNi x+1/2O2(g)→2NiNi ·+Oo x+VNiThe conduction mechanism is known as follows: two in-situ Ni under oxygen atmosphere2+Will generate two Ni3+And a nickel vacancy, Ni2+And Ni3+There is charge transfer between them to make them conductive. Therefore, NiO is improvedXBesides doping, the conductivity of the material can be improved to a certain extent by changing the growth conditions.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a method for improving the adsorption density of a self-assembled monomolecular carrier transport layer.
The method for improving the adsorption density of the self-assembled monomolecular carrier transport layer comprises the following steps:
step 2, regulating and controlling the binding sites on the substrate treated in the step 1, wherein the surface of the substrate contains hydroxyl, and organic matters containing anchoring groups and NiO on the surface are selectedxThe substrate of the hole transport layer reacts.
Preferably, the step ofThe substrate 1 includes metal oxide substrate, metal substrate, non-metal oxide substrate, and substrate containing-Si (OR)3、-P(OR)3、-COOR、-SO3A substrate for an R, -COR, -SH, OR-OR group and a substrate without a linking group.
Preferably, in step 2:
when the substrate is a metal oxide substrate, the anchoring group comprises-Si (OR)3、-P(OR)3、-COOR、-SO3R and-COR;
when the substrate is a metal substrate, the anchoring group comprises-Si (OR)3、-P(OR)3、-COOR、-SO3R, -COR, -SH and-NH3;
When the substrate is a non-metal oxide, the anchoring group comprises-Si (OR)3、-P(OR)3、-COOR、-SO3R and-COR;
the substrate is a film containing-Si (OR)3,-P(OR)3、-COOR、-SO3When the substrate for the R, -COR, -SH OR-OR group is present, the anchor group comprises-Si (OR)3、-P(OR)3、-COOR、-SO3R and-COR;
when the substrate is a substrate without connecting groups, firstly, ultraviolet ozone treatment is carried out to introduce dangling bonds, and then, groups are introduced on the dangling bonds, wherein the introduced groups comprise-Si (OR)3,-P(OR)3、-COOR、-SO3R and-COR.
Preferably, the NiO prepared in step 1xThe thickness of the hole transport layer is 1-10 nm; the electric field power during sputtering in step 1 was 80W, and the pressure during deposition was 0.4 Pa.
Preferably, the working pressure set value of the magnetron sputtering coating equipment in the step 1 is 4 multiplied by 10-4Pa。
Preferably, when the working pressure of the magnetron sputtering coating equipment in the step 1 is less than 4 multiplied by 10-4At Pa, adjusting O2/(Ar+O2) The ratio of (A) to (B) is 5 to 25 percent.
The method for improving the adsorption density of the self-assembled monomolecular carrier transport layer is applied to the preparation of the solar cell and comprises the following steps:
step 2, after stirring the precursor solution of the hole transport layer at room temperature for a set time, dripping the precursor solution of the hole transport layer in NiOxThe surface of the substrate of the hole transport layer rotates at a set rotating speed for a set time length to form NiOxA substrate for a hole transport layer;
step 3, the surface is fully distributed with the NiO of the hole transport layer precursor solutionxAfter stopping the substrate of the hole transport layer, putting the substrate on a heating table for annealing; after cooling, washing the material by using a solution of the self-assembled monomolecular layer material at a set rotating speed to obtain a self-assembled monomolecular carrier transmission layer, and removing the unadsorbed material self-assembled monomolecular layer material;
step 4, preparing a perovskite thin film on the surface of the self-assembly monomolecular carrier transmission layer;
step 5, preparing a hole transport layer C on the surface of the perovskite thin film in the step 4 by adopting a thermal evaporation method60a/BCP and Ag electrode.
Preferably, the degree of vacuum in the vapor deposition in step 5 is less than 8 × 10-6Pa, evaporation rate of
The method for improving the adsorption density of the self-assembled monomolecular carrier transport layer is applied to the preparation of the organic light-emitting diode, and specifically comprises the following steps:
step 2, preparing Ir (mppy) by spin coating method3TCTA film, preparing LiF and MoO in turn by thermal evaporation method3And an Al electrode to obtain the organic light emitting diode.
The invention has the beneficial effects that:
mainly researches magnetron sputtering NiOXAt different O2/(Ar+O2) In the atmosphere, Ni2+And Ni3+The NiO with better performance is prepared by the content change and the regulation and control of the power, the temperature and the deposition pressure during the magnetron sputteringXThe material provides a modification layer to improve the adsorption density of the monomolecular layer. In addition, the invention combines the defect problem of the traditional inorganic material and the adsorption density problem of the self-assembled monolayer, and experiments show that the adsorption mode and the adsorption density of the SAM can be changed by selecting different oxide substrates, and the SAM can adjust the substrate energy level and passivate the active layer.
The invention selects organic matter containing anchoring group and NiO on the surfacexReacting the substrate of the hole transport layer, selecting proper (molecular weight, symmetry, polarity and the like) organic matters containing anchoring groups by regulating and controlling the binding sites of the substrate, and preparing the required performances of high adsorption density, strong polarity and the like by regulating the content, deposition mode, growth direction and the like of the anchoring groups;
the addition of the layer containing the-OR functional group in the invention can prevent the Transparent Conductive Oxide (TCO) substrate from directly contacting with the active layer; the adsorption density of the organic matter containing the anchoring group is improved; the increase of the adsorption density of the organic matter containing the anchoring group can improve the passivation capability of the interface; and the organic matter with proper functional groups is selected, so that the energy level alignment of the carrier transport layer and the active layer can be adjusted.
Drawings
FIG. 1 shows ITO/HTL/C60A semi-logarithmic current density-voltage plot for the/BCP/Ag hole-electron structure;
FIG. 2 is a graph of half-log current density versus voltage for ITO/HTL/PVK/spiro-OMeTAD/Ag with hole-only structures;
FIG. 3 is MeO-2PACz and NiOXUltraviolet electron spectrum curve diagram of the secondary cut-off edge of the/MeO-2 PAC after differential processing.
Detailed Description
The present invention will be further described with reference to the following examples. The following examples are set forth merely to aid in the understanding of the invention. It should be noted that, for a person skilled in the art, several modifications can be made to the invention without departing from the principle of the invention, and these modifications and modifications also fall within the protection scope of the claims of the present invention.
Example one
The embodiment of the application provides an application of a method for improving the adsorption density of a self-assembled monomolecular carrier transport layer in the preparation of a perovskite solar cell, which comprises the following steps:
preparation of NiO on clean Transparent Conductive Oxide (TCO) substrate using magnetron sputtering coating equipmentXA hole transport layer. When the working pressure is less than 4 x 10-4At Pa, adjusting O2/(Ar+O2) The ratio of (A) to (B) is 0-50%. The mechanism of magnetron sputtering is that electrons collide with argon atoms in the process of flying to a substrate under the action of an electric field so as to ionize the argon atoms to generate Ar+And new electrons. Ar (Ar)+Bombarding the surface of the cathode target under the action of an electric field, and depositing the generated neutral target atoms or molecules on a substrate to form a film. The higher the argon content, the faster the growth rate of the film. The increase of the oxygen content accelerates the rightward progress of the defect equation to generate high-valence nickel and nickel vacancies, and causes the change of the properties such as carrier concentration, mobility, transmittance and the like. When the film is deposited, the sputtering power is set to be 80W, the deposition pressure is 0.4Pa, and NiO with better performance is prepared at normal temperatureXA film material.
In NiOXAnd preparing a self-assembly monomolecular layer material MeO-2PACz on the surface. The interface is different from the bulk phase, and because the surface has a dangling bond with strong activity, the-OH and adsorbed water molecules generally exist on the interface of the metal oxide. MeO-2PACz was dissolved in an anhydrous ethanol solution to prepare a hole transport layer precursor solution having a concentration of 2 mmol/l. After stirring at room temperature for 15min, the above liquid was dropped on NiOXSurface ofThe upper rotation is 30s, and the rotation speed is 4000 rpm. After the run was stopped, it was annealed for 10min on a heating stage at a temperature of 100 ℃. After cooling, the non-adsorbed material was removed by dynamic rinsing twice with anhydrous ethanol at 4000 rpm. ITO glass substrate and ITO glass substrate/NiO before and after spin coating of MeO-2PACzXThe atomic contents of the main elements in the film are shown in table 1 below:
TABLE 1 ITO glass substrate and ITO glass substrate/NiO before and after spin coating with MeO-2PACzXAtomic content table of main element in thin film
In the above table, N/A indicates that the element is not present in the sample, and the unit of each parameter is% indicates the atomic concentration percentage. From the above table, it can be seen that the addition of the layer containing an-OR functional group is advantageous for increasing the adsorption density of the organic substance containing an anchor group.
Perovskite thin films were prepared by spin coating: dissolving perovskite powder in a solvent with a DMF/DMSO ratio of 4:1, and stirring for 2h for use; dropwise adding the filtered perovskite precursor solution into ITO/NiO covered by MeO-2PACzXThe surface of the film is rotated for 35s at 3500 rmp; dripping 330 μ l chlorobenzene continuously 25s before the program is finished, and annealing for 20min on a heating table at 100 deg.C; and finishing the preparation of the perovskite solar cell.
Preparing the hole transport layer C by thermal evaporation60BCP, and Ag electrode: 24nm C60 and 6nm BCP were prepared in sequence by thermal evaporation at a rate of 0.1A/s to 3A/s. 100nm Ag electrode is prepared by thermal evaporation method, and the evaporation rate is 0.1-5A DEG/s. Vacuum degree during vapor deposition is lower than 8 x 10-6Pa, evaporation rate of
Example two
The second embodiment of the present application provides an application of the method for improving the adsorption density of the self-assembled monomolecular carrier transport layer in the preparation of an organic solar cell:
preparation of NiO on clean Transparent Conductive Oxide (TCO) substrate using magnetron sputtering coating equipmentXA hole transport layer. When the working pressure is less than 4 x 10-4At Pa, adjusting O2/(Ar+O2) The ratio of (A) to (B) is 0-50%. The mechanism of magnetron sputtering is that electrons collide with argon atoms in the process of flying to a substrate under the action of an electric field so as to ionize the argon atoms to generate Ar+And new electrons. Ar (Ar)+Bombarding the surface of the cathode target under the action of an electric field, and depositing the generated neutral target atoms or molecules on a substrate to form a film. The higher the argon content, the faster the growth rate of the film. The increase of the oxygen content accelerates the rightward progress of the defect equation to generate high-valence nickel and nickel vacancies, and causes the change of the properties such as carrier concentration, mobility, transmittance and the like. When the film is deposited, the sputtering power is set to be 80W, the deposition pressure is 0.4Pa, and NiO with better performance is prepared at normal temperatureXA film material.
In NiOXPreparing self-assembly monomolecular layer material Br-2PACz on the surface. The interface is different from the bulk phase, and because the surface has a dangling bond with strong activity, the-OH and adsorbed water molecules generally exist on the interface of the metal oxide. Br-2PACz was dissolved in an anhydrous ethanol solution to prepare a hole transport layer precursor solution having a concentration of 0.3 mg/mL. After stirring at room temperature for 1h, the above liquid was dropped on NiOXThe surface was spun for 30s at 3000 rpm. After the run was stopped, it was annealed for 5min on a heating stage at a temperature of 50 ℃. After cooling, the unadsorbed material was removed by dynamic washing twice with 0.3mg/mL Br-2PACz solution at 4000 rpm.
And finishing the preparation of the organic solar cell. PEDOT PSS film, PM6 BTP-eC9 PC was prepared in this order by spin-coating71BM film and PFN-Br film, and Ag electrode is prepared through thermal evaporation process. Vacuum degree during vapor deposition is lower than 8 x 10-6Pa, evaporation rate of
EXAMPLE III
The third embodiment of the present application provides an application of the method for improving the adsorption density of the self-assembled monomolecular carrier transport layer in the preparation of an organic light emitting diode:
preparation of NiO on clean Transparent Conductive Oxide (TCO) substrate using magnetron sputtering coating equipmentXA hole transport layer. When the working pressure is less than 4 x 10-4At Pa, adjusting O2/(Ar+O2) The ratio of (A) to (B) is 0-50%. The mechanism of magnetron sputtering is that electrons collide with argon atoms in the process of flying to a substrate under the action of an electric field so as to ionize the argon atoms to generate Ar+And new electrons. Ar (Ar)+Bombarding the surface of the cathode target under the action of an electric field, and depositing the generated neutral target atoms or molecules on a substrate to form a film. The higher the argon content, the faster the growth rate of the film. The increase of the oxygen content accelerates the rightward progress of the defect equation to generate high-valence nickel and nickel vacancies, and causes the change of the properties such as carrier concentration, mobility, transmittance and the like. When the film is deposited, the sputtering power is set to be 80W, the deposition pressure is 0.4Pa, and NiO with better performance is prepared at normal temperatureXA film material.
In NiOXSurface preparation of self-assembled monolayer Material F5BnPA. The interface is different from the bulk phase, and because the surface has a dangling bond with strong activity, the-OH and adsorbed water molecules generally exist on the interface of the metal oxide. The substrate was immersed in F at a concentration of 1mmol/l5BnPA in toluene. Soaking at 50 deg.C for 8 hr. The non-adsorbed material was then removed by dynamic washing twice with absolute ethanol at 4000 rpm.
And finishing the preparation of the organic light emitting diode. Preparation of Ir (mppy) by spin coating3TCTA film, sequentially preparing LiF and MoO by thermal evaporation3And an Al electrode. Vacuum degree during vapor deposition is lower than 8 x 10-6Pa, evaporation rate of
Experiments prove that:
as shown in FIG. 1, the addition of a layer containing-OR functionality may prevent direct contact of the TCO with the active layer;
as shown in fig. 2, the increase in adsorption density of the organic substance containing an anchor group can improve the interfacial passivation ability.
As shown in fig. 3, the selection of organic materials with appropriate functional groups is beneficial to adjusting the energy level alignment of the carrier transport layer and the active layer.
By the gain of the effect, the performance of the finally prepared device is obviously improved.
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111279464.7A CN114094019A (en) | 2021-10-28 | 2021-10-28 | A method for improving the adsorption density of self-assembled monomolecular carrier transport layers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111279464.7A CN114094019A (en) | 2021-10-28 | 2021-10-28 | A method for improving the adsorption density of self-assembled monomolecular carrier transport layers |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114094019A true CN114094019A (en) | 2022-02-25 |
Family
ID=80298490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111279464.7A Pending CN114094019A (en) | 2021-10-28 | 2021-10-28 | A method for improving the adsorption density of self-assembled monomolecular carrier transport layers |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114094019A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115360246A (en) * | 2022-08-26 | 2022-11-18 | 河北大学 | Passivation coating and passivation method for side of crystalline silicon battery |
CN116314439A (en) * | 2022-12-30 | 2023-06-23 | 南开大学 | NiO in solar cell x Hole transport layer and preparation method and application thereof |
US20230345745A1 (en) * | 2022-04-21 | 2023-10-26 | Alliance For Sustainable Energy, Llc | Formulations for the manufacture of perovskite devices |
CN118555845A (en) * | 2024-06-13 | 2024-08-27 | 天合光能股份有限公司 | A solar cell |
WO2024250497A1 (en) * | 2023-06-06 | 2024-12-12 | Tcl科技集团股份有限公司 | Photoelectric device and manufacturing method therefor, and display apparatus |
-
2021
- 2021-10-28 CN CN202111279464.7A patent/CN114094019A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230345745A1 (en) * | 2022-04-21 | 2023-10-26 | Alliance For Sustainable Energy, Llc | Formulations for the manufacture of perovskite devices |
US12161002B2 (en) * | 2022-04-21 | 2024-12-03 | Alliance For Sustainable Energy, Llc | Formulations for the manufacture of perovskite devices |
CN115360246A (en) * | 2022-08-26 | 2022-11-18 | 河北大学 | Passivation coating and passivation method for side of crystalline silicon battery |
CN116314439A (en) * | 2022-12-30 | 2023-06-23 | 南开大学 | NiO in solar cell x Hole transport layer and preparation method and application thereof |
WO2024250497A1 (en) * | 2023-06-06 | 2024-12-12 | Tcl科技集团股份有限公司 | Photoelectric device and manufacturing method therefor, and display apparatus |
CN118555845A (en) * | 2024-06-13 | 2024-08-27 | 天合光能股份有限公司 | A solar cell |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN114094019A (en) | A method for improving the adsorption density of self-assembled monomolecular carrier transport layers | |
CN104795499B (en) | Perovskite-based solar cell of organic inorganic hybridization and preparation method thereof | |
CN109728166B (en) | Methylamine lead iodide perovskite solar cells with organic light-emitting small molecule interface modification layer | |
CN108922972B (en) | Perovskite thin film, perovskite solar cell and preparation method thereof | |
CN108878661B (en) | Preparation method of carbon quantum dot modified perovskite solar cell | |
CN110518122A (en) | Using two-dimensional material as the perovskite solar battery and preparation method of electron transfer layer | |
CN108091766B (en) | A kind of preparation method of perovskite battery with n-type doped electron transport layer and TiO2 layer | |
CN105609641A (en) | Perovskite solar cell and preparation method thereof | |
CN107369766A (en) | A kind of perovskite solar cell of high-test metal Oxide Electron transport layer and preparation method thereof | |
CN107331775B (en) | A kind of perovskite solar cell and preparation method thereof of high quality electron transfer layer | |
CN107240643A (en) | Bromo element doping methylamine lead iodine perovskite solar cell and preparation method thereof | |
CN114284439B (en) | A method for preparing CsPbI3 perovskite film and high-efficiency solar cell under high humidity environment and its application | |
CN106848062A (en) | Copper-cladding Aluminum Bar perovskite thin film, in-situ preparation method and without hole transmission layer solar cell device | |
CN108321299A (en) | Low-dimensional lead-free perovskite thin film and preparation method of lead-free perovskite solar cell | |
CN115568237A (en) | A kind of perovskite solar cell and preparation method thereof | |
Makenali et al. | Efficiency improvement of perovskite solar cells by charge transport balancing using length tunable ZnO nanorods and optimized perovskite morphology | |
CN117062452A (en) | Surface-treated nickel oxide hole transport layer, perovskite solar cell and preparation method | |
CN111192964A (en) | A kind of perovskite quantum dot solar cell and preparation method thereof | |
CN116847670A (en) | Perovskite solar cell of passivation composite hole transport layer | |
CN113903862A (en) | SnO modified based on phenylboronic acid derivatives2Preparation method of perovskite solar cell | |
CN113481485A (en) | Tin oxide film and preparation method thereof, and solar cell and preparation method thereof | |
CN105870342A (en) | Interface processing method for preparing high-performance perovskite film | |
Xie et al. | Highly air-stable and efficient CH3NH3PbI3 solar cells enhanced by ZnO-embedded PCBM electron transport layers | |
CN111223993B (en) | Semitransparent perovskite solar cell with high open-circuit voltage | |
Sun et al. | Realizing efficiency improvement of polymer solar cells by using multi-functional cascade electron transport layers |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |