CN113990849A - An electronic package and packaging method - Google Patents
An electronic package and packaging method Download PDFInfo
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- CN113990849A CN113990849A CN202111275849.6A CN202111275849A CN113990849A CN 113990849 A CN113990849 A CN 113990849A CN 202111275849 A CN202111275849 A CN 202111275849A CN 113990849 A CN113990849 A CN 113990849A
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- chip
- substrate
- electromagnetic shielding
- electronic package
- solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses an electronic packaging piece and a packaging method, comprising the following steps: the first chip and the second chip are arranged on the same side of the substrate; the ground wire is arranged inside the substrate; the electromagnetic shielding device is arranged on one side of the first chip; the plastic package material is hermetically connected with the substrate; the solder balls are arranged on the other side of the substrate. According to the invention, the first chip and the second chip are attached to the substrate with the embedded ground wire through the reflow soldering process, the electromagnetic shielding device is attached above the first chip through the tin scribing process, the electromagnetic shielding of the chip is realized, the MUF process is adopted for plastic package, and the solder balls are installed on one side of the substrate, so that the electronic package with the electromagnetic shielding function is obtained. Meanwhile, heat-conducting glue can be smeared on the top of the first chip, and plastic package is carried out by adopting MUF combined bare chip technology, so that the electronic package with the electromagnetic shielding function and the heat dissipation function is obtained. The invention can effectively avoid the mutual electromagnetic interference of the chips and solve the problem of complex process for realizing the electromagnetic shielding function at present.
Description
Technical Field
The invention belongs to the field of semiconductor packaging, and relates to an electronic packaging piece and a packaging method.
Background
With the increase of the number of chips in a system-in-package assembly, electromagnetic waves generated during the operation of the chips inevitably interfere with the normal operation of the chips. Therefore, electromagnetic shielding is indispensable in system-in-package. At present, a system-in-package (SIP) generally arranges a grounding wire device in the edge of a cutting channel and a substrate, for a chip which needs to be isolated independently, a groove is formed around the chip to remove a plastic sealing glue, then a conductive silver glue is filled in the groove, and after the chip is cut into single pieces, the chip is communicated with a ground wire and the silver glue through metal sputtering, so that the electromagnetic shielding requirements of related chips are met. However, the process is complicated and costly, and the yield is also affected by the cutting offset.
Disclosure of Invention
The invention aims to solve the problems in the prior art, and provides an electronic packaging part and a packaging method, which can avoid mutual electromagnetic interference among chips and solve the problem of complex process for realizing an electromagnetic shielding function.
In order to achieve the purpose, the invention adopts the following technical scheme to realize the purpose:
an electronic package, comprising: the device comprises a plastic packaging material, an electromagnetic shielding device, a first chip, a second chip, a substrate, a solder ball and a ground wire;
the first chip and the second chip are arranged on the same side of the substrate; the ground wire is arranged inside the substrate; the electromagnetic shielding device is arranged on one side of the first chip; the plastic package material is hermetically connected with the substrate; the solder balls are arranged on the other side of the substrate.
The invention is further improved in that:
the number of the solder balls is several.
The electromagnetic shielding device adopts a first electromagnetic shielding piece, one side of the first electromagnetic shielding piece is of a fence type structure, and the other side of the first electromagnetic shielding piece is cross-shaped; the first electromagnetic shielding part is in a grid shape.
The electromagnetic shielding device adopts a second electromagnetic shielding piece, and one side of the second electromagnetic shielding piece is of a fence type structure; the second electromagnetic shielding part is in a grid shape.
And heat-conducting glue is coated on one side of the first chip and filled between the first chip and the second electromagnetic shielding part.
A method of packaging, comprising:
mounting a first chip and a second chip on a substrate; the first electromagnetic shielding piece is attached above the first chip; and packaging the plastic packaging material and the substrate, wherein the solder balls are arranged on one side of the substrate, and the ground wire is arranged in the substrate. And packaging the plastic packaging material and the substrate by using an MUF (multi-aperture molding) process.
A method of packaging, comprising:
mounting a first chip and a second chip on a substrate; the second electromagnetic shielding piece is attached above the first chip; and packaging the plastic packaging material and the substrate, wherein the solder balls are arranged on one side of the substrate, the ground wire is arranged in the substrate, and the heat-conducting glue is filled between the first chip and the second electromagnetic shielding part. And packaging the plastic packaging material and the substrate by adopting an MUF combined bare chip process. Mounting a first chip on one side of a substrate by adopting a reflow soldering process; and attaching the electromagnetic shielding device on the first chip by adopting a tin-scribing process.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the first chip and the second chip are attached to the substrate with the embedded ground wire through the reflow soldering process, the electromagnetic shielding piece is attached above the first chip through the tin scribing process, the electromagnetic shielding of the chip is realized, the MUF process is adopted for plastic package, and the solder balls are installed on one side of the substrate, so that the electronic packaging piece with the electromagnetic shielding function is obtained. Meanwhile, heat-conducting glue can be smeared on the top of the first chip, and plastic package is carried out by adopting MUF combined bare chip technology, so that the electronic package with the electromagnetic shielding function and the heat dissipation function is obtained. The invention can effectively avoid the mutual electromagnetic interference of the chips and solve the problem of complex process for realizing the electromagnetic shielding function at present.
Drawings
In order to more clearly explain the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a diagram of an electronic package of the present invention;
fig. 2 is a cross-sectional view of an electromagnetic shield of the present invention;
fig. 3 is a top view of the electromagnetic shield of the present invention;
fig. 4 is a cross-sectional view of another electromagnetic shield of the present invention;
fig. 5 is a top view of another electromagnetic shield of the present invention;
FIG. 6 is a cross-sectional view of a substrate containing a ground line according to the present invention;
FIG. 7 is a view of the mounting of a chip and substrate of the present invention;
fig. 8 is an installation view of the electromagnetic shield;
FIG. 9 is a plastic package mounting diagram of the plastic package material;
FIG. 10 is a diagram of an electronic package assembly of the present invention;
FIG. 11 is another block diagram of the electronic package of the present invention;
fig. 12 is a block diagram of an electronic package that satisfies both heat dissipation and electromagnetic shielding;
FIG. 13 is a cross-sectional view of a substrate with a thermally conductive paste;
fig. 14 is another installation view of the electromagnetic shield;
FIG. 15 is another illustration of the plastic molding of the molding compound;
fig. 16 is a packaging diagram of the electronic package of the present invention.
Wherein: 1-plastic package material, 2-first electromagnetic shielding part, 3-first chip, 4-second chip, 5-substrate, 6-tin ball, 7-ground wire, 8-heat conducting glue and 9-second electromagnetic shielding part.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present invention, it should be noted that if the terms "upper", "lower", "horizontal", "inner", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship which is usually arranged when the product of the present invention is used, the description is merely for convenience and simplicity, and the indication or suggestion that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, cannot be understood as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
Furthermore, the term "horizontal", if present, does not mean that the component is required to be absolutely horizontal, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the embodiments of the present invention, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The invention is described in further detail below with reference to the accompanying drawings:
referring to fig. 1, fig. 1 discloses an electronic package comprising: the first chip 3 and the second chip 4 are mounted on the same side of the substrate 5; the ground line 7 is disposed inside the substrate 5; the electromagnetic shielding device is arranged on one side of the first chip 3; the plastic package material 1 is hermetically connected with the substrate 5; solder balls 6 are mounted on the other side of the substrate 5.
The electromagnetic shielding device is arranged on one side of the first chip 3, can shield electromagnetic interference between the first chip 3 and the second chip 4, and obtains a complete closed electronic packaging piece by sealing the plastic packaging material 1 and the substrate 5 and soldering the solder balls 6 on one side of the substrate 5.
The number of the solder balls 6 is several.
The electromagnetic shielding device adopts a first electromagnetic shielding part 2, one side of the first electromagnetic shielding part 2 is of a fence type structure, and the other side of the first electromagnetic shielding part is of a cross shape; the first electromagnetic shield 2 is formed in a mesh shape.
Referring to fig. 2 and 3, the bottom of the first electromagnetic shielding member is in a fence type structure, which facilitates welding and enables plastic package mold flow to easily flow through. The upper part of the first electromagnetic shielding part is in a grid shape, so that the plastic molding material can conveniently flow through the mold. The top of the first electromagnetic shielding part is cross-shaped, so that when the mounting is convenient, the suction nozzle grabs the electromagnetic shielding part, and the cross-shaped design is convenient for conducting mold flow.
The electromagnetic shielding device adopts a second electromagnetic shielding piece 9, and one side of the second electromagnetic shielding piece 9 is of a fence type structure; the second electromagnetic shield 9 is internally latticed.
Referring to fig. 4 and 5, the top of the second electromagnetic shielding member 9 is not grooved, which facilitates demolding during bare chip plastic packaging and printing a required seal during a back-end process.
The first chip 3 is coated with a heat conducting glue 8 on one side, and the heat conducting glue 8 is filled between the first chip 3 and the second electromagnetic shielding member 9. The heat conductive paste 8 can effectively conduct the heat of the first chip 3.
The electronic package disclosed by the invention can comprise a plurality of chips, and the first chip 3 and the second chip 4 are used for showing the shielding effect of the electronic package by comparison.
A method of packaging, comprising:
mounting the first chip 3 and the second chip 4 on the substrate 5; the first electromagnetic shield 2 is attached above the first chip 3; the molding compound 1 and the substrate 5 are packaged, the solder ball 6 is installed on one side of the substrate 5, and the ground wire 7 is installed inside the substrate 5.
A method of packaging, comprising:
mounting the first chip 3 and the second chip 4 on the substrate 5; the second electromagnetic shield 9 is attached above the first chip 3; the plastic package material 1 and the substrate 5 are packaged, the solder ball 6 is installed on one side of the substrate 5, the ground wire 7 is installed inside the substrate 5, and the heat conducting glue 8 is filled between the first chip 3 and the second electromagnetic shielding member 9.
The electronic package obtained by packaging the plastic package material 1 and the substrate 5 by the MUF combined bare chip process is thinner and thinner than the electronic package obtained by packaging the plastic package material 1 and the substrate 5 by the MUF process.
Mounting the first chip 3 on one side of the substrate 5 by using a reflow process; the electromagnetic shielding device is attached to the first chip 3 by a solder-scribing process.
Referring to fig. 6 and 7, the first chip 3 is mounted on the substrate 5 of the buried ground line 7 by a reflow process; referring to fig. 8, the first electromagnetic shield 2 is attached to one side of the first chip 3 by using a solder-scribing process to achieve electromagnetic shielding of the first chip 3; referring to fig. 9 and 10, the plastic package material 1 and the substrate 5 are plastic-packaged by MUF process, and the solder balls 6 are soldered on one side of the substrate 5, so as to obtain the electronic package with electromagnetic shielding function.
Referring to fig. 11 and 12, fig. 11 and 12 disclose a block diagram of another electronic package that satisfies heat dissipation and electromagnetic shielding.
Mounting the first chip 3 on the substrate 5 of the buried ground line 7 by a reflow process; referring to fig. 13 and 14, a thermal conductive adhesive 8 is applied on top of the first chip 3, and a second electromagnetic shield 9 is attached above the first chip 3 by using a tin-scribing process; referring to fig. 15 and 16, the plastic package material 1 and the substrate 5 are plastic-sealed by MUF combined with a bare chip process, the solder balls 6 are soldered on one side of the substrate 5, and the second electromagnetic shielding member 9 is in contact with air, so that the electronic package with electromagnetic shielding function and heat dissipation function is obtained.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An electronic package, comprising: the device comprises a plastic packaging material (1), an electromagnetic shielding device, a first chip (3), a second chip (4), a substrate (5), a solder ball (6) and a ground wire (7);
the first chip (3) and the second chip (4) are arranged on the same side of the substrate (5); the ground wire (7) is arranged inside the substrate (5); the electromagnetic shielding device is arranged on one side of the first chip (3); the plastic packaging material (1) is connected with the substrate (5) in a sealing way; the solder balls (6) are arranged on the other side of the substrate (5).
2. The electronic package according to claim 1, wherein the number of solder balls (6) is several.
3. The electronic package according to claim 1, characterized in that the electromagnetic shielding device is a first electromagnetic shielding member (2), and the first electromagnetic shielding member (2) has a fence-type structure on one side and a cross-shape on the other side; the first electromagnetic shielding part (2) is in a grid shape.
4. The electronic package according to claim 1, characterized in that the electromagnetic shielding device employs a second electromagnetic shielding member (9), and one side of the second electromagnetic shielding member (9) is in a fence type structure; the second electromagnetic shielding part (9) is in a grid shape.
5. The electronic package according to claim 4, wherein the first chip (3) is coated with a thermally conductive adhesive (8) on one side, and the thermally conductive adhesive (8) is filled between the first chip (3) and the second electromagnetic shielding member (9).
6. The packaging method according to claim 3, comprising:
mounting a first chip (3) and a second chip (4) on a substrate (5); the first electromagnetic shielding piece (2) is attached above the first chip (3); the plastic packaging material (1) and the substrate (5) are packaged, the solder balls (6) are installed on one side of the substrate (5), and the ground wires (7) are installed inside the substrate (5).
7. The packaging method according to claim 5, comprising:
mounting a first chip (3) and a second chip (4) on a substrate (5); the second electromagnetic shielding piece (9) is attached above the first chip (3); the plastic packaging material (1) and the substrate (5) are packaged, the solder balls (6) are installed on one side of the substrate (5), the ground wire (7) is installed inside the substrate (5), and the heat conducting glue (8) is filled between the first chip (3) and the second electromagnetic shielding piece (9).
8. The encapsulation method according to claim 7, characterized in that the molding compound (1) and the substrate (5) are encapsulated using a MUF bonded bare chip process.
9. Packaging method according to claim 6 or 7, characterized in that the first chip (3) is mounted on one side of the substrate (5) using a reflow process; the electromagnetic shielding device is attached to the first chip (3) by a tin-scribing process.
10. The encapsulation method according to claim 6, characterized in that the molding compound (1) and the substrate (5) are encapsulated using a MUF process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111275849.6A CN113990849A (en) | 2021-10-29 | 2021-10-29 | An electronic package and packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111275849.6A CN113990849A (en) | 2021-10-29 | 2021-10-29 | An electronic package and packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113990849A true CN113990849A (en) | 2022-01-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111275849.6A Pending CN113990849A (en) | 2021-10-29 | 2021-10-29 | An electronic package and packaging method |
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| Country | Link |
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| CN (1) | CN113990849A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102693963A (en) * | 2011-03-25 | 2012-09-26 | 富士通半导体股份有限公司 | semiconductor device and method of manufacturing the same |
| CN204720447U (en) * | 2015-06-19 | 2015-10-21 | 江苏长电科技股份有限公司 | A kind of electromagnetic shielding module package structure of groove substrate |
| US20160133579A1 (en) * | 2014-11-07 | 2016-05-12 | Shin-Etsu Chemical Co., Ltd. | Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatus |
-
2021
- 2021-10-29 CN CN202111275849.6A patent/CN113990849A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102693963A (en) * | 2011-03-25 | 2012-09-26 | 富士通半导体股份有限公司 | semiconductor device and method of manufacturing the same |
| US20160133579A1 (en) * | 2014-11-07 | 2016-05-12 | Shin-Etsu Chemical Co., Ltd. | Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatus |
| CN204720447U (en) * | 2015-06-19 | 2015-10-21 | 江苏长电科技股份有限公司 | A kind of electromagnetic shielding module package structure of groove substrate |
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