CN113839208B - Mobile device - Google Patents
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- CN113839208B CN113839208B CN202111018904.3A CN202111018904A CN113839208B CN 113839208 B CN113839208 B CN 113839208B CN 202111018904 A CN202111018904 A CN 202111018904A CN 113839208 B CN113839208 B CN 113839208B
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 99
- 239000002184 metal Substances 0.000 claims abstract description 97
- 229910052755 nonmetal Inorganic materials 0.000 claims description 47
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- 238000010147 laser engraving Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract description 19
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000004891 communication Methods 0.000 description 12
- 230000008878 coupling Effects 0.000 description 8
- 238000010168 coupling process Methods 0.000 description 8
- 238000005859 coupling reaction Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 238000010295 mobile communication Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/10—Resonant antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/20—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements characterised by the operating wavebands
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
- H01Q5/342—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
- H01Q5/35—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using two or more simultaneously fed points
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
- H01Q5/342—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
- H01Q5/357—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using a single feed point
- H01Q5/364—Creating multiple current paths
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/005—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with variable reactance for tuning the antenna
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3827—Portable transceivers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
- H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Telephone Set Structure (AREA)
- Support Of Aerials (AREA)
Abstract
Description
本申请是中国发明专利申请(申请号:201710951672.4,申请日:2017年10月13日,发明名称:移动装置及其制造方法)的分案申请。This application is a divisional application of the Chinese invention patent application (application number: 201710951672.4, application date: October 13, 2017, invention name: mobile device and manufacturing method thereof).
技术领域Technical Field
本发明涉及一种移动装置,特别是涉及一种移动装置及其天线结构。The present invention relates to a mobile device, and in particular to a mobile device and an antenna structure thereof.
背景技术Background Art
随着移动通讯技术的发达,移动装置在近年日益普遍,常见的例如:手提式电脑、移动电话、多媒体播放器以及其他混合功能的携带型电子装置。为了满足人们的需求,移动装置通常具有无线通讯的功能。有些涵盖长距离的无线通讯范围,例如:移动电话使用2G、3G、LTE(Long Term Evolution)系统及其所使用700MHz、850MHz、900MHz、1800MHz、1900MHz、2100MHz、2300MHz以及2500MHz的频带进行通讯,而有些则涵盖短距离的无线通讯范围,例如:Wi-Fi、Bluetooth系统使用2.4GHz和5GHz的频带进行通讯。With the development of mobile communication technology, mobile devices have become increasingly popular in recent years, such as laptops, mobile phones, multimedia players and other hybrid portable electronic devices. In order to meet people's needs, mobile devices usually have wireless communication functions. Some cover long-distance wireless communication ranges, such as mobile phones using 2G, 3G, LTE (Long Term Evolution) systems and the 700MHz, 850MHz, 900MHz, 1800MHz, 1900MHz, 2100MHz, 2300MHz and 2500MHz frequency bands used for communication, while some cover short-distance wireless communication ranges, such as Wi-Fi, Bluetooth systems use 2.4GHz and 5GHz frequency bands for communication.
为了追求造型美观,现今设计者常会在移动装置中加入金属元件的要素。然而,新增的金属元件却容易对于移动装置中用以提供无线通讯的天线产生负面影响,进而降低移动装置的整体通讯品质。因此,有必要提出一种全新的移动装置和天线结构,以克服传统技术所面临的问题。In order to pursue aesthetics, designers nowadays often add metal elements to mobile devices. However, the newly added metal elements are likely to have a negative impact on the antenna used to provide wireless communication in the mobile device, thereby reducing the overall communication quality of the mobile device. Therefore, it is necessary to propose a new mobile device and antenna structure to overcome the problems faced by traditional technologies.
发明内容Summary of the invention
在优选实施例中,本发明提供一种移动装置,包括:一第一电路板,包括一系统接地面;一金属边框,包括一第一部分,其中该第一部分耦接至该系统接地面,而一净空区间形成于该第一部分和该系统接地面之间;一延伸辐射部,其中该第一部分和该延伸辐射部都耦接至一馈入点,而该第一部分和该延伸辐射部共同形成一天线结构;一电子零组件;一第二电路板,耦接至该电子零组件,其中该电子零组件和该第二电路板都邻近于该第一部分;以及一射频模块,耦接至该馈入点,以激发该天线结构。In a preferred embodiment, the present invention provides a mobile device, comprising: a first circuit board, comprising a system ground plane; a metal frame, comprising a first part, wherein the first part is coupled to the system ground plane, and a clearance interval is formed between the first part and the system ground plane; an extended radiating portion, wherein the first part and the extended radiating portion are both coupled to a feeding point, and the first part and the extended radiating portion together form an antenna structure; an electronic component; a second circuit board, coupled to the electronic component, wherein the electronic component and the second circuit board are both adjacent to the first part; and a radio frequency module, coupled to the feeding point to excite the antenna structure.
在一些实施例中,该第一部分具有一第一端和一第二端,该第一部分的该第一端耦接至该系统接地面上的一第一短路点,而该第一部分的该第二端耦接至该系统接地面上的一第二短路点。In some embodiments, the first portion has a first end and a second end, the first end of the first portion is coupled to a first short-circuit point on the system ground plane, and the second end of the first portion is coupled to a second short-circuit point on the system ground plane.
在一些实施例中,该净空区间介于该第一短路点和该第二短路点之间。In some embodiments, the clearance interval is between the first short-circuit point and the second short-circuit point.
在一些实施例中,该金属边框还包括一第二部分,而该延伸辐射部由该第二部分所形成。In some embodiments, the metal frame further includes a second portion, and the extended radiation portion is formed by the second portion.
在一些实施例中,该第一部分呈现一直条形。In some embodiments, the first portion is in the shape of a straight strip.
在一些实施例中,该延伸辐射部呈现一L字形。In some embodiments, the extended radiation portion is in an L-shape.
在一些实施例中,该延伸辐射部的一垂直投影与该第二电路板至少部分地重叠。In some embodiments, a vertical projection of the extended radiating portion at least partially overlaps with the second circuit board.
在一些实施例中,该延伸辐射部的一垂直投影与该净空区间至少部分地重叠。In some embodiments, a vertical projection of the extended radiating portion at least partially overlaps with the clearance interval.
在一些实施例中,该净空区间呈现一狭长矩形。In some embodiments, the clearance area is in the form of a long and narrow rectangle.
在一些实施例中,该移动装置,还包括:一馈入连接件,耦接于该射频模块和该馈入点之间。In some embodiments, the mobile device further includes: a feeding connector coupled between the RF module and the feeding point.
在一些实施例中,该第二电路板还耦接至该系统接地面。In some embodiments, the second circuit board is also coupled to the system ground plane.
在一些实施例中,该天线结构涵盖介于2400MHz至2500MHz之间的一低频频带,以及介于5150MHz至5875MHz之间的一高频频带。In some embodiments, the antenna structure covers a low frequency band between 2400 MHz and 2500 MHz, and a high frequency band between 5150 MHz and 5875 MHz.
在一些实施例中,该低频频带由该第一部分所激发产生,而该高频频带由该延伸辐射部所激发产生。In some embodiments, the low frequency band is excited by the first portion, and the high frequency band is excited by the extended radiating portion.
在一些实施例中,该第一部分的长度等于该低频频带的0.5倍波长。In some embodiments, the length of the first portion is equal to 0.5 wavelengths of the low frequency band.
在一些实施例中,该延伸辐射部的长度等于该高频频带的0.25倍波长。In some embodiments, the length of the extended radiating portion is equal to 0.25 times the wavelength of the high frequency band.
在一些实施例中,该电子零组件包括一电源键或/和一音量键。In some embodiments, the electronic component includes a power button and/or a volume button.
在一些实施例中,该电源键和该音量键都设置于该第一部分的外侧。In some embodiments, the power button and the volume button are both disposed on the outer side of the first portion.
在一些实施例中,该电子零组件包括一或多个感测元件。In some embodiments, the electronic component includes one or more sensing elements.
在一些实施例中,该等感测元件设置于该第一部分的内侧。In some embodiments, the sensing elements are disposed inside the first portion.
在一些实施例中,该第一电路板为一系统电路板,而该第二电路板为一软性印刷电路板。In some embodiments, the first circuit board is a system circuit board, and the second circuit board is a flexible printed circuit board.
在优选实施例中,本发明提供一种移动装置的制造方法,包括下列步骤:提供一第一电路板,一金属边框、一延伸辐射部、一电子零组件、一第二电路板,以及一射频模块,其中该第一电路板包括一系统接地面,该金属边框包括一第一部分,而该电子零组件和该第二电路板都邻近于该第一部分;将该第一部分耦接至该系统接地面;将一净空区间形成于该第一部分和该系统接地面之间;将该第一部分和该延伸辐射部都耦接至一馈入点,使得该第一部分和该延伸辐射部共同形成一天线结构;将该第二电路板耦接至该电子零组件;以及将该射频模块耦接至该馈入点,以激发该天线结构。In a preferred embodiment, the present invention provides a method for manufacturing a mobile device, comprising the following steps: providing a first circuit board, a metal frame, an extended radiating portion, an electronic component, a second circuit board, and a radio frequency module, wherein the first circuit board includes a system ground plane, the metal frame includes a first portion, and the electronic component and the second circuit board are both adjacent to the first portion; coupling the first portion to the system ground plane; forming a clearance interval between the first portion and the system ground plane; coupling the first portion and the extended radiating portion to a feeding point so that the first portion and the extended radiating portion together form an antenna structure; coupling the second circuit board to the electronic component; and coupling the radio frequency module to the feeding point to excite the antenna structure.
在另一优选实施例中,本发明提供一种移动装置,包括:一第一电路板,包括一系统接地面;一金属边框,至少包括一第一部分,其中该第一部分电性耦接至该系统接地面及一馈入点,而一净空区间形成于该第一部分和该系统接地面之间,其中该第一部分和该馈入点共同形成一天线结构;一电子零组件;一第二电路板,电性耦接至该电子零组件,其中该电子零组件和该软性印刷电路板都邻近于该第一部分;以及一射频模块,电性耦接至该馈入点,以激发该天线结构。In another preferred embodiment, the present invention provides a mobile device, comprising: a first circuit board, including a system ground plane; a metal frame, including at least a first portion, wherein the first portion is electrically coupled to the system ground plane and a feeding point, and a clearance interval is formed between the first portion and the system ground plane, wherein the first portion and the feeding point together form an antenna structure; an electronic component; a second circuit board, electrically coupled to the electronic component, wherein the electronic component and the flexible printed circuit board are both adjacent to the first portion; and a radio frequency module, electrically coupled to the feeding point to excite the antenna structure.
在另一优选实施例中,本发明提供一种移动装置的制造方法,包括下列步骤:提供一系统电路板,一金属边框、一延伸辐射部、一电子零组件、一软性印刷电路板,以及一射频模块,其中该系统电路板包括一系统接地面,该金属边框包括一第一部分,而该电子零组件和该软性印刷电路板都邻近于该第一部分;将该第一部分电性耦接至该系统接地面;将一净空区间形成于该第一部分和该系统接地面之间;将该软性印刷电路板耦接至该电子零组件;以及将该第一部分和该延伸辐射部都电性耦接至一馈入点,将该射频模块耦接至该馈入点,使得该第一部分和该延伸辐射部可操作于多个频带。In another preferred embodiment, the present invention provides a method for manufacturing a mobile device, comprising the following steps: providing a system circuit board, a metal frame, an extended radiating portion, an electronic component, a flexible printed circuit board, and a radio frequency module, wherein the system circuit board includes a system ground plane, the metal frame includes a first portion, and the electronic component and the flexible printed circuit board are both adjacent to the first portion; electrically coupling the first portion to the system ground plane; forming a clearance interval between the first portion and the system ground plane; coupling the flexible printed circuit board to the electronic component; and electrically coupling the first portion and the extended radiating portion to a feeding point, coupling the radio frequency module to the feeding point, so that the first portion and the extended radiating portion can operate in multiple frequency bands.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1A为本发明一实施例所述的移动装置的背视图;FIG1A is a rear view of a mobile device according to an embodiment of the present invention;
图1B为本发明一实施例所述的移动装置的侧视图;FIG1B is a side view of a mobile device according to an embodiment of the present invention;
图2为本发明一实施例所述的移动装置的天线结构的背视图;FIG2 is a back view of an antenna structure of a mobile device according to an embodiment of the present invention;
图3为本发明一实施例所述的移动装置的天线结构的电压驻波比图;FIG3 is a voltage standing wave ratio diagram of an antenna structure of a mobile device according to an embodiment of the present invention;
图4A为本发明一实施例所述的移动装置的背视图;FIG4A is a rear view of a mobile device according to an embodiment of the present invention;
图4B为本发明一实施例所述的移动装置的侧视图;FIG4B is a side view of a mobile device according to an embodiment of the present invention;
图5为本发明一实施例所述的移动装置的立体图;FIG5 is a perspective view of a mobile device according to an embodiment of the present invention;
图6为本发明一实施例所述的移动装置的立体图;FIG6 is a perspective view of a mobile device according to an embodiment of the present invention;
图7为本发明一实施例所述的移动装置的立体图;FIG7 is a perspective view of a mobile device according to an embodiment of the present invention;
图8为本发明一实施例所述的移动装置的立体图;FIG8 is a perspective view of a mobile device according to an embodiment of the present invention;
图9为本发明一实施例所述的移动装置的制造方法的流程图。FIG. 9 is a flow chart of a method for manufacturing a mobile device according to an embodiment of the present invention.
符号说明Explanation of symbols
100、400、500、600、700、800~移动装置;100, 400, 500, 600, 700, 800 ~ mobile device;
110~系统电路板;110~system circuit board;
112~系统接地面;112~system ground plane;
120~金属边框;120~Metal frame;
126~金属边框的断口;126~Fractured edge of metal frame;
130~金属边框的第一部分;130~the first part of the metal frame;
131~金属边框的第一部分的第一端;131-a first end of a first portion of a metal frame;
132~金属边框的第一部分的第二端;132-a second end of the first portion of the metal frame;
140~金属边框的第二部分;140~the second part of the metal frame;
150~延伸辐射部;150~Extended radiation part;
151~延伸辐射部的第一端;151-a first end of the extended radiation portion;
152~延伸辐射部的第二端;152-a second end of the extended radiation portion;
160、460~电子零组件;160, 460~Electronic components;
161~电源键;161~Power button;
162~音量键;162~Volume key;
170~软性印刷电路板;170~Flexible printed circuit board;
171~软性印刷电路板接头;171~Flexible printed circuit board connector;
172、173~裸铜区;172, 173 ~ bare copper area;
180~净空区间;180~Clearance interval;
185~显示器;185~Display;
190~馈入连接件;190~feed connector;
192~射频信号线;192~RF signal line;
199~射频模块;199~RF module;
461~感测元件;461~sensing element;
501~第一位置;501~first position;
502~第二位置;502 ~ second position;
510~主镜头;510~main lens;
520~非金属背盖;520~Non-metal back cover;
525~分界线;525~dividing line;
620、720、820~背盖;620, 720, 820 ~ back cover;
621、721、821~背盖的金属部分;621, 721, 821 ~ Metal part of the back cover;
622、722、723、822、823、824~背盖的非金属部分;622, 722, 723, 822, 823, 824~Non-metallic part of the back cover;
D1~第一间距;D1~first spacing;
D2~第二间距;D2~second spacing;
FB1~低频频带;FB1~low frequency band;
FB2~高频频带;FB2~high frequency band;
FP~馈入点;FP~feed point;
GP1~第一短路点;GP1~first short circuit point;
GP2~第二短路点;GP2~second short-circuit point;
W3~宽度。W3~width.
具体实施方式DETAILED DESCRIPTION
为让本发明的目的、特征和优点能更明显易懂,下文特举出本发明的具体实施例,并配合所附的附图,作详细说明如下。In order to make the purpose, features and advantages of the present invention more clearly understood, specific embodiments of the present invention are given below with reference to the accompanying drawings for detailed description as follows.
在说明书及权利要求当中使用了某些词汇来指称特定的元件。本领域技术人员应可理解,硬件制造商可能会用不同的名词来称呼同一个元件。本说明书及权利要求并不以名称的差异来作为区分元件的方式,而是以元件在功能上的差异来作为区分的准则。在通篇说明书及权利要求当中所提及的「包含」及「包括」一词为开放式的用语,故应解释成「包含但不仅限定于」。「大致」一词则是指在可接受的误差范围内,本领域技术人员能够在一定误差范围内解决所述技术问题,达到所述基本的技术效果。此外,「耦接」一词在本说明书中包含任何直接及间接的电连接手段。因此,若文中描述一第一装置耦接至一第二装置,则代表该第一装置可直接电连接至该第二装置,或经由其它装置或连接手段而间接地电连接至该第二装置。Certain words are used in the specification and claims to refer to specific components. It should be understood by those skilled in the art that hardware manufacturers may use different terms to refer to the same component. This specification and claims do not use differences in names as a way to distinguish components, but use differences in the functions of components as the criteria for distinction. The words "include" and "comprise" mentioned throughout the specification and claims are open-ended terms and should be interpreted as "include but not limited to". The word "substantially" means that within an acceptable error range, those skilled in the art can solve the technical problem and achieve the basic technical effect within a certain error range. In addition, the word "coupled" in this specification includes any direct and indirect electrical connection means. Therefore, if the text describes a first device coupled to a second device, it means that the first device can be directly electrically connected to the second device, or indirectly electrically connected to the second device via other devices or connection means.
图1A是显示根据本发明一实施例所述的移动装置100的背视图。图1B是显示根据本发明一实施例所述的移动装置100的侧视图。图2是显示根据本发明一实施例所述的移动装置100的天线结构的背视图(天线结构以外的元件暂时隐藏)。请一并参考图1A、图1B、图2。移动装置100可以是一智能型手机(Smart Phone)、一平板电脑(Tablet Computer),或是一笔记型电脑(Notebook Computer)。在图1A、图1B的实施例中,移动装置100至少包括:一系统电路板(System Circuit Board)110(或称为「第一电路板」)、一金属边框(MetalFrame)120、一延伸辐射部(Extension Radiation Element)150、一电子零组件(Electronic Component)160、一软性印刷电路板(Flexible Printed Circuit Board,FPC)170(或称为「第二电路板」),以及一射频模块(Radio Frequency Module)199。必须理解的是,虽然未显示于图1A、图1B中,移动装置100还可包括其他元件,例如:一处理器、一扬声器、一触控模块、一供电模块,以及一外壳。FIG. 1A is a back view of a mobile device 100 according to an embodiment of the present invention. FIG. 1B is a side view of a mobile device 100 according to an embodiment of the present invention. FIG. 2 is a back view of an antenna structure of a mobile device 100 according to an embodiment of the present invention (elements other than the antenna structure are temporarily hidden). Please refer to FIG. 1A, FIG. 1B, and FIG. 2 together. The mobile device 100 may be a smart phone, a tablet computer, or a notebook computer. In the embodiments of FIG. 1A and FIG. 1B, the mobile device 100 at least includes: a system circuit board 110 (or referred to as a "first circuit board"), a metal frame 120, an extension radiation element 150, an electronic component 160, a flexible printed circuit board (FPC) 170 (or referred to as a "second circuit board"), and a radio frequency module 199. It should be understood that, although not shown in FIG. 1A and FIG. 1B , the mobile device 100 may further include other components, such as a processor, a speaker, a touch module, a power supply module, and a housing.
系统电路板110包括一系统接地面(System Ground Plane)112,其由金属材质制成。系统接地面112可用于提供一接地电位(Ground Voltage)。系统电路板110和系统接地面112的形状和尺寸于本发明中并不特别作限制,其可根据不同需求进行调整。金属边框120可为移动装置100的一外观元件(Appearance Element)。金属边框120至少包括一第一部分130,其中第一部分130可以大致呈现一直条形。详细而言,第一部分130具有一第一端131和一第二端132,其中第一部分130的第一端131耦接至系统接地面112上的一第一短路点(Shorting Point)GP1,而第一部分130的第二端132耦接至系统接地面112上的一第二短路点GP2。一净空区间(Clearance Region)180形成于金属边框120的第一部分130和系统接地面112之间。在另一些实施例中,若移动装置100还包括一显示器185,则净空区间180定义为介于金属边框120的第一部分130和显示器185之间。净空区间180可以大致呈现一狭长矩形,并可介于第一短路点GP1和第二短路点GP2之间。净空区间180的长度等于或略小于第一部分130的长度。金属边框120的第一部分130耦接至一馈入点(Feeding Point)FP,其中馈入点FP介于第一部分130的第一端131和第二端132之间。比起第二短路点GP2,馈入点FP更靠近第一短路点GP1。The system circuit board 110 includes a system ground plane 112, which is made of metal material. The system ground plane 112 can be used to provide a ground voltage. The shape and size of the system circuit board 110 and the system ground plane 112 are not particularly limited in the present invention, and can be adjusted according to different needs. The metal frame 120 can be an appearance element of the mobile device 100. The metal frame 120 includes at least a first portion 130, wherein the first portion 130 can be roughly in the shape of a straight strip. In detail, the first portion 130 has a first end 131 and a second end 132, wherein the first end 131 of the first portion 130 is coupled to a first shorting point GP1 on the system ground plane 112, and the second end 132 of the first portion 130 is coupled to a second shorting point GP2 on the system ground plane 112. A clearance region 180 is formed between the first portion 130 of the metal frame 120 and the system ground plane 112. In other embodiments, if the mobile device 100 also includes a display 185, the clearance region 180 is defined as between the first portion 130 of the metal frame 120 and the display 185. The clearance region 180 may be roughly in the form of a long and narrow rectangle and may be between the first short-circuit point GP1 and the second short-circuit point GP2. The length of the clearance region 180 is equal to or slightly less than the length of the first portion 130. The first portion 130 of the metal frame 120 is coupled to a feeding point FP, wherein the feeding point FP is between the first end 131 and the second end 132 of the first portion 130. The feeding point FP is closer to the first short-circuit point GP1 than the second short-circuit point GP2.
延伸辐射部150由金属材质制成。在一些实施例中,金属边框120还包括一第二部分140,其中延伸辐射部150由第二部分140所形成。亦即,延伸辐射部150和金属边框120两者可为一体成形的结构。在另一些实施例中,金属边框120不包括第二部分140,而延伸辐射部150可印刷于另一软性印刷电路板上,或可通过激光雕刻技术(Laser DirectStructuring,LDS)形成于一塑胶支撑元件上。延伸辐射部150可以呈现一L字形。在另一些实施例中,延伸辐射部150也可具有不同形状,以因应不同频率的需求。详细而言,延伸辐射部150具有一第一端151和一第二端152,其中延伸辐射部150的第一端151耦接至馈入点FP,而延伸辐射部150的第二端152为朝远离第一接地点GP1的方向作延伸的一开路端(OpenEnd)。延伸辐射部150可以部分地平行于金属边框120的第一部分130,且部分地垂直于金属边框120的第一部分130。延伸辐射部150的一垂直投影(Vertical Projection)可与净空区间180至少部分地重叠。另外,延伸辐射部150的垂直投影也可与系统接地面112至少部分地重叠。金属边框130的第一部分130和延伸辐射部150共同形成一天线结构。在另一些实施例中,移动装置100的金属边框130仅包括第一部分130,不包括第二部分140(亦即,天线结构可改为不包括延伸辐射部150),但也可发挥与原本天线结构(同时包括第一部分130和第二部分140或延伸辐射部150)相似的功效。射频模块199可设置于系统电路板110上。射频模块199可耦接至馈入点FP,以激发前述的天线结构。在一些实施例中,移动装置100还包括一馈入连接件(Feeding Connection Element)190和一射频信号线192,其中馈入点FP经由馈入连接件190和射频信号线192耦接至射频模块199。例如,馈入连接件190可为一立体连接结构,像是以一顶针(Pogo Pin)、一金属弹片(Metal Spring),或是一金属螺丝(MetalScrew)来实施之。金属边框120的第一部分130和第二部分140都可设置移动装置100的一侧边(Side)处,而金属边框120的其余部分可选择性地分布于移动装置100的一顶部处、一底部处,或(且)另一侧边处,使得整个金属边框120可以大致呈现一环圈形,而系统电路板110可设置于金属边框120的中空内部。The extended radiation portion 150 is made of metal material. In some embodiments, the metal frame 120 further includes a second portion 140, wherein the extended radiation portion 150 is formed by the second portion 140. That is, the extended radiation portion 150 and the metal frame 120 can be an integrally formed structure. In other embodiments, the metal frame 120 does not include the second portion 140, and the extended radiation portion 150 can be printed on another flexible printed circuit board, or can be formed on a plastic support element by laser engraving technology (Laser Direct Structuring, LDS). The extended radiation portion 150 can be L-shaped. In other embodiments, the extended radiation portion 150 can also have different shapes to meet the needs of different frequencies. In detail, the extended radiation portion 150 has a first end 151 and a second end 152, wherein the first end 151 of the extended radiation portion 150 is coupled to the feed point FP, and the second end 152 of the extended radiation portion 150 is an open end (OpenEnd) extending in a direction away from the first ground point GP1. The extended radiating portion 150 may be partially parallel to the first portion 130 of the metal frame 120 and partially perpendicular to the first portion 130 of the metal frame 120. A vertical projection of the extended radiating portion 150 may at least partially overlap with the clearance interval 180. In addition, the vertical projection of the extended radiating portion 150 may also at least partially overlap with the system ground plane 112. The first portion 130 of the metal frame 130 and the extended radiating portion 150 together form an antenna structure. In other embodiments, the metal frame 130 of the mobile device 100 includes only the first portion 130 and does not include the second portion 140 (that is, the antenna structure may be changed to not include the extended radiating portion 150), but it may also play a similar function to the original antenna structure (including both the first portion 130 and the second portion 140 or the extended radiating portion 150). The RF module 199 may be disposed on the system circuit board 110. The RF module 199 may be coupled to the feed point FP to excite the aforementioned antenna structure. In some embodiments, the mobile device 100 further includes a feeding connection element 190 and a radio frequency signal line 192, wherein the feeding point FP is coupled to the radio frequency module 199 via the feeding connection element 190 and the radio frequency signal line 192. For example, the feeding connection element 190 may be a three-dimensional connection structure, such as a pogo pin, a metal spring, or a metal screw. The first portion 130 and the second portion 140 of the metal frame 120 may be disposed at one side of the mobile device 100, and the remaining portion of the metal frame 120 may be selectively distributed at a top, a bottom, or (and) another side of the mobile device 100, so that the entire metal frame 120 may be roughly in a ring shape, and the system circuit board 110 may be disposed in the hollow interior of the metal frame 120.
在图1A、图1B的实施例中,电子零组件160至少可包括一电源键(Power Button)161或(且)一音量键(Volume Button)162,但是本发明并不仅限于此。在其他实施例中,电子零组件160也可包括更少或更多个具有不同功能的实体按键或(且)插槽。软性印刷电路板170耦接至电子零组件160的电源键161和音量键162,其中电子零组件160和软性印刷电路板170都邻近于金属边框120的第一部分130。例如,电源键161和音量键162可都至少部分地设置于金属边框120的第一部分130的外侧(抑或,电源键161和音量键162可部分地延伸至金属边框120的第一部分130的内侧),而软性印刷电路板170可设置于金属边框120的第一部分130的内侧。虽然未显示于图1A、图1B中,但金属边框120的第一部分130上可具有一或多个开孔(Opening),使得电子零组件160可经由前述开孔来耦接至软性印刷电路板170。软性印刷电路板170还可用于承载一些走线(Trace)和控制元件的电路布局(CircuitLayout)。In the embodiment of FIG. 1A and FIG. 1B, the electronic component 160 may include at least a power button 161 or (and) a volume button 162, but the present invention is not limited thereto. In other embodiments, the electronic component 160 may also include fewer or more physical buttons or (and) slots with different functions. The flexible printed circuit board 170 is coupled to the power button 161 and the volume button 162 of the electronic component 160, wherein the electronic component 160 and the flexible printed circuit board 170 are both adjacent to the first part 130 of the metal frame 120. For example, the power button 161 and the volume button 162 may be at least partially disposed on the outside of the first part 130 of the metal frame 120 (or, the power button 161 and the volume button 162 may partially extend to the inside of the first part 130 of the metal frame 120), and the flexible printed circuit board 170 may be disposed on the inside of the first part 130 of the metal frame 120. Although not shown in FIG. 1A and FIG. 1B , the first portion 130 of the metal frame 120 may have one or more openings, so that the electronic component 160 can be coupled to the flexible printed circuit board 170 through the aforementioned openings. The flexible printed circuit board 170 can also be used to carry some traces and circuit layouts of control components.
延伸辐射部150的一垂直投影与软性印刷电路板170至少部分地重叠。例如,延伸辐射部150的垂直投影可完全位于软性印刷电路板170的内部。在一些实施例中,软性印刷电路板170还耦接至系统接地面112。例如,软性印刷电路板170还可包括一软性印刷电路板接头(FPC Connector)171和二个裸铜区(Bare Copper Region)172、173,其中软性印刷电路板接头171和裸铜区172、173可穿透系统电路板110并耦接至系统接地面112。详细而言,裸铜区172可邻近于第一接地点GP1,或与第一接地点GP1重合;而裸铜区173可邻近于第二接地点GP2,或与第二接地点GP2重合。在此设计下,电子零组件160和软性印刷电路板170将能与前述的天线结构互相整合,并可视为天线结构的一延伸部分,因此,电子零组件160和软性印刷电路板170的存在不会对天线结构的辐射特性造成太大干扰。A vertical projection of the extended radiating portion 150 at least partially overlaps with the flexible printed circuit board 170. For example, the vertical projection of the extended radiating portion 150 may be completely located inside the flexible printed circuit board 170. In some embodiments, the flexible printed circuit board 170 is also coupled to the system ground plane 112. For example, the flexible printed circuit board 170 may also include a flexible printed circuit board connector (FPC Connector) 171 and two bare copper regions (Bare Copper Regions) 172 and 173, wherein the flexible printed circuit board connector 171 and the bare copper regions 172 and 173 may penetrate the system circuit board 110 and be coupled to the system ground plane 112. In detail, the bare copper region 172 may be adjacent to the first ground point GP1, or overlap with the first ground point GP1; and the bare copper region 173 may be adjacent to the second ground point GP2, or overlap with the second ground point GP2. In this design, the electronic component 160 and the flexible printed circuit board 170 can be integrated with the aforementioned antenna structure and can be regarded as an extension of the antenna structure. Therefore, the existence of the electronic component 160 and the flexible printed circuit board 170 will not cause much interference to the radiation characteristics of the antenna structure.
在另一些实施例中,软性印刷电路板170中的一金属层(或一导电材质层)可呈现一C字型或一L字形,可沿着净空区间180的外缘作延伸,其垂直投影则可与净空区间180至少部分地重叠。In other embodiments, a metal layer (or a conductive material layer) in the flexible printed circuit board 170 may be in a C-shape or an L-shape and may extend along the outer edge of the clearance area 180 , and its vertical projection may at least partially overlap with the clearance area 180 .
在一些实施例中,移动装置100还包括一或多个其他天线元件(未显示)。其他天线元件可由金属边框120的其余部分所形成,并可位于移动装置100的一顶部处或一底部处。其他天线元件还可具有一或多个断口。其他天线元件可作为移动装置100的主要天线(MainAntenna)。另一方面,因为净空区间180较小,前述的天线结构可作为移动装置100的辅助天线(Auxiliary Antenna),以提升移动装置100的天线分集增益(Antenna DiversityGain)。例如,第一短路点GP1可介于天线结构和其他天线元件之间,以增强其他天线元件与天线结构之间的隔离度(Isolation)。In some embodiments, the mobile device 100 also includes one or more other antenna elements (not shown). The other antenna elements may be formed by the remaining portion of the metal frame 120 and may be located at a top or a bottom of the mobile device 100. The other antenna elements may also have one or more breaks. The other antenna elements may serve as the main antenna (Main Antenna) of the mobile device 100. On the other hand, because the clearance interval 180 is small, the aforementioned antenna structure may serve as an auxiliary antenna (Auxiliary Antenna) of the mobile device 100 to enhance the antenna diversity gain (Antenna Diversity Gain) of the mobile device 100. For example, the first short-circuit point GP1 may be between the antenna structure and the other antenna elements to enhance the isolation (Isolation) between the other antenna elements and the antenna structure.
图3是显示根据本发明一实施例所述的移动装置100的天线结构的电压驻波比(Voltage Standing Wave Ratio,VSWR)图,其中横轴代表操作频率(MHz),而纵轴代表电压驻波比。根据图3的测量结果,移动装置100的天线结构可涵盖介于2400MHz至2500MHz之间的一低频频带FB1,以及介于5150MHz至5875MHz之间的一高频频带FB2。。因此,移动装置100至少可支持WLAN(Wireless Local Area Networks)2.4GHz/5GHz(或Wi-Fi)的双频带操作。以上频率范围也可根据不同需要进行调整。FIG. 3 is a diagram showing a voltage standing wave ratio (VSWR) of an antenna structure of a mobile device 100 according to an embodiment of the present invention, wherein the horizontal axis represents the operating frequency (MHz) and the vertical axis represents the voltage standing wave ratio. According to the measurement results of FIG. 3 , the antenna structure of the mobile device 100 can cover a low frequency band FB1 between 2400MHz and 2500MHz, and a high frequency band FB2 between 5150MHz and 5875MHz. Therefore, the mobile device 100 can at least support dual-band operation of WLAN (Wireless Local Area Networks) 2.4GHz/5GHz (or Wi-Fi). The above frequency range can also be adjusted according to different needs.
移动装置100的天线原理和元件尺寸可如下列所述。低频频带FB1可由金属边框120的第一部分130所激发产生,而高频频带FB2可由延伸辐射部150(或金属边框120的第二部分140)所激发产生。第一部分130的长度(亦即,由第一端131至第二端132的长度,或是由第一短路点GP1至第二短路点GP2的长度)可以大致等于低频频带FB1的0.5倍波长(λ/2)。延伸辐射部150的长度(亦即,由第一端151至第二端152的长度,或是由馈入点FP至第二端152的长度)可以大致等于高频频带FB2的0.25倍波长(λ/4)。馈入点FP和第一部分130的第一端131(或第一短路点GP1)之间具有一第一间距D1,而馈入点FP和第一部分130的第二端132(或第二短路点GP2)之间具有一第二间距D2,其中第二间距D2和第一间距D1的比值(D2/D1)可约介于4至5之间。例如,第一间距D1可约为8.5mm,而第二间距D2可约为35.5mm,但不仅限于此。净空区间180的宽度W3(亦即,金属边框120的第一部分130和系统接地面112或显示器185的最小间距,其中系统接地面112与金属边框120的间距可以大于或等于显示器185与金属边框120的间距)可用于调整前述天线结构的阻抗匹配(Impedance Matching)及频宽(Bandwidth)。若净空区间180的宽度W3变大,则天线结构的低频频带FB1的频宽将会增加;反之,若净空区间180的宽度W3变小,则天线结构的低频频带FB1的频宽将会减少。例如,宽度W3可约为1.5mm,但不仅限于此。另外,通过改变馈入点FP的位置,更可微调低频频带FB1的阻抗匹配。以上尺寸范围是根据多次实验结果得出,其可最佳化移动装置100的天线结构的操作性能。根据实际测量结果,移动装置100的天线结构于低频频带FB1和高频频带FB2内的辐射效率(Radiation Efficiency)都在13.6%以上,此已可满足一般移动通讯装置的应用需求。The antenna principle and element size of the mobile device 100 can be described as follows. The low frequency band FB1 can be excited by the first portion 130 of the metal frame 120, and the high frequency band FB2 can be excited by the extended radiating portion 150 (or the second portion 140 of the metal frame 120). The length of the first portion 130 (i.e., the length from the first end 131 to the second end 132, or the length from the first short-circuit point GP1 to the second short-circuit point GP2) can be approximately equal to 0.5 times the wavelength (λ/2) of the low frequency band FB1. The length of the extended radiating portion 150 (i.e., the length from the first end 151 to the second end 152, or the length from the feed point FP to the second end 152) can be approximately equal to 0.25 times the wavelength (λ/4) of the high frequency band FB2. There is a first distance D1 between the feed point FP and the first end 131 (or the first short-circuit point GP1) of the first portion 130, and there is a second distance D2 between the feed point FP and the second end 132 (or the second short-circuit point GP2) of the first portion 130, wherein the ratio (D2/D1) of the second distance D2 to the first distance D1 may be approximately between 4 and 5. For example, the first distance D1 may be approximately 8.5 mm, and the second distance D2 may be approximately 35.5 mm, but is not limited thereto. The width W3 of the clearance interval 180 (i.e., the minimum distance between the first portion 130 of the metal frame 120 and the system ground plane 112 or the display 185, wherein the distance between the system ground plane 112 and the metal frame 120 may be greater than or equal to the distance between the display 185 and the metal frame 120) may be used to adjust the impedance matching and bandwidth of the aforementioned antenna structure. If the width W3 of the clearance interval 180 becomes larger, the bandwidth of the low-frequency band FB1 of the antenna structure will increase; conversely, if the width W3 of the clearance interval 180 becomes smaller, the bandwidth of the low-frequency band FB1 of the antenna structure will decrease. For example, the width W3 may be approximately 1.5 mm, but is not limited thereto. In addition, by changing the position of the feed point FP, the impedance matching of the low-frequency band FB1 can be fine-tuned. The above size range is obtained based on multiple experimental results, which can optimize the operating performance of the antenna structure of the mobile device 100. According to actual measurement results, the radiation efficiency (Radiation Efficiency) of the antenna structure of the mobile device 100 in the low-frequency band FB1 and the high-frequency band FB2 is above 13.6%, which can meet the application requirements of general mobile communication devices.
在本发明的移动装置100中,由于金属边框120可作为天线结构的一主要辐射体(Main Radiator),故能有效避免金属边框120对天线结构的通讯品质产生负面影响。再者,天线结构可与电子零组件160(例如:侧边按键或(且)插槽)和软性印刷电路板170互相整合,并搭配狭小的净空区间180,从而可微缩整体的天线尺寸(传统移动装置的侧边通常因净空区间不足,难以设置任何天线结构)。另外,至少在金属边框120的第一部分130上没有任何断口(Cut Point),此种设计能大幅提升移动装置100的强固性(Robustness)并兼顾产品美观。本发明可支持如Wi-Fi、多输入多输出(Multi-Input and Multi-Output,MIMO)等通讯技术,故其很适合应用于各种小尺寸、宽频带的移动通讯装置当中。In the mobile device 100 of the present invention, since the metal frame 120 can be used as a main radiator of the antenna structure, the metal frame 120 can effectively avoid the negative impact on the communication quality of the antenna structure. Furthermore, the antenna structure can be integrated with the electronic components 160 (for example: side buttons or (and) slots) and the flexible printed circuit board 170, and with a narrow clearance area 180, the overall antenna size can be miniaturized (the side of the traditional mobile device is usually difficult to set any antenna structure due to insufficient clearance). In addition, at least there is no cut point on the first part 130 of the metal frame 120. This design can greatly improve the robustness of the mobile device 100 and take into account the product's aesthetics. The present invention can support communication technologies such as Wi-Fi, Multi-Input and Multi-Output (MIMO), etc., so it is very suitable for use in various small-sized, broadband mobile communication devices.
图4A是显示根据本发明一实施例所述的移动装置400的背视图。图4B是显示根据本发明一实施例所述的移动装置400的侧视图。图4A、图4B和图1A、图1B相似,两者的差异在于,移动装置400的一电子零组件460包括一或多个感测元件(Sensing Element)461,其中感测元件461和软性印刷电路板170都设置于金属边框120的第一部分130的内侧,而感测元件461和软性印刷电路板170互相耦接。此时,至少在金属边框120的第一部分130上可不必因感测元件461的配置而设计任何开孔。感测元件461可为一压力侦测器(PressureSensor),以感测一使用者对金属边框120的第一部分130的按压状态。相似地,前述的天线结构也可与电子零组件460和软性印刷电路板170互相整合,并搭配狭小的净空区间180,从而可微缩整体的天线尺寸。图4A、图4B的移动装置400和天线结构的其余特征都与图1A、图1B、图2的移动装置100和天线结构类似,故此二实施例均可达成相似的操作效果。FIG. 4A is a back view of a mobile device 400 according to an embodiment of the present invention. FIG. 4B is a side view of a mobile device 400 according to an embodiment of the present invention. FIG. 4A and FIG. 4B are similar to FIG. 1A and FIG. 1B, and the difference between the two is that an electronic component 460 of the mobile device 400 includes one or more sensing elements (Sensing Element) 461, wherein the sensing element 461 and the flexible printed circuit board 170 are both disposed on the inner side of the first portion 130 of the metal frame 120, and the sensing element 461 and the flexible printed circuit board 170 are coupled to each other. At this time, at least on the first portion 130 of the metal frame 120, it is not necessary to design any openings due to the configuration of the sensing element 461. The sensing element 461 can be a pressure detector (PressureSensor) to sense a user's pressing state on the first portion 130 of the metal frame 120. Similarly, the aforementioned antenna structure can also be integrated with the electronic component 460 and the flexible printed circuit board 170, and with the narrow clearance space 180, so as to reduce the overall antenna size. The remaining features of the mobile device 400 and the antenna structure of FIG. 4A and FIG. 4B are similar to the mobile device 100 and the antenna structure of FIG. 1A, FIG. 1B, and FIG. 2, so both embodiments can achieve similar operating effects.
以下实施例将介绍本发明的各种其他组态(Configuration)。必须理解的是,这些附图和叙述仅为举例,并非用于限制本发明。The following embodiments will introduce various other configurations of the present invention. It must be understood that these drawings and descriptions are only for example and are not intended to limit the present invention.
图5是显示根据本发明一实施例所述的移动装置500的立体图。在图5的实施例中,移动装置500还包括一主镜头(Main Camera)510和一非金属背盖(Non-metal Back Cover)520。主镜头510内嵌于非金属背盖520中。如前所述,金属边框120的第一部分130可形成天线结构(可位于一第一位置501或一第二位置502处),而此天线结构可与电子零组件160(例如:前述的侧边按键161、162或感测元件461)和软性印刷电路板互相整合。非金属背盖520和金属边框120之间的一分界线(Boundary)525位于移动装置500的一背面处。在其他实施例中,非金属背盖520也可由移动装置500的背面延伸至侧边,使得非金属背盖520和金属边框120之间的分界线525位于移动装置500的侧边处。金属边框120的其余部分(除了第一部分130和第二部分140以外)还可具有一或多个断口126,以调整其他天线元件的阻抗匹配及共振频率。FIG. 5 is a perspective view of a mobile device 500 according to an embodiment of the present invention. In the embodiment of FIG. 5 , the mobile device 500 further includes a main camera 510 and a non-metal back cover 520. The main camera 510 is embedded in the non-metal back cover 520. As described above, the first portion 130 of the metal frame 120 can form an antenna structure (which can be located at a first position 501 or a second position 502), and the antenna structure can be integrated with the electronic component 160 (for example, the side buttons 161, 162 or the sensing element 461 mentioned above) and the flexible printed circuit board. A boundary 525 between the non-metal back cover 520 and the metal frame 120 is located at a back side of the mobile device 500. In other embodiments, the non-metal back cover 520 may also extend from the back side of the mobile device 500 to the side, so that the boundary 525 between the non-metal back cover 520 and the metal frame 120 is located at the side of the mobile device 500. The remaining portion of the metal frame 120 (except the first portion 130 and the second portion 140) may also have one or more cutouts 126 to adjust the impedance matching and resonant frequency of other antenna elements.
图6是显示根据本发明一实施例所述的移动装置600的立体图。在图6的实施例中,移动装置600还包括一背盖(Back Cover)620。如前所述,金属边框120的第一部分130可形成天线结构(可位于第一位置501或第二位置502处),而此天线结构可与电子零组件160(例如:前述的侧边按键161、162或感测元件461)和软性印刷电路板互相整合。背盖620包括一金属部分621和一非金属部分622,其中金属部分621大致呈现一矩形,而非金属部分622大致呈现一环圈形,使得金属部分621由非金属部分622所完全包围。背盖620的非金属部分622可避免其金属部分621直接接触金属边框120的第一部分130,从而可维持天线结构的良好通讯品质。FIG. 6 is a perspective view of a mobile device 600 according to an embodiment of the present invention. In the embodiment of FIG. 6 , the mobile device 600 further includes a back cover 620. As described above, the first portion 130 of the metal frame 120 can form an antenna structure (which can be located at the first position 501 or the second position 502), and the antenna structure can be integrated with the electronic component 160 (for example, the side buttons 161, 162 or the sensing element 461) and the flexible printed circuit board. The back cover 620 includes a metal portion 621 and a non-metal portion 622, wherein the metal portion 621 is substantially rectangular, and the non-metal portion 622 is substantially ring-shaped, so that the metal portion 621 is completely surrounded by the non-metal portion 622. The non-metal portion 622 of the back cover 620 can prevent the metal portion 621 from directly contacting the first portion 130 of the metal frame 120, thereby maintaining the good communication quality of the antenna structure.
图7是显示根据本发明一实施例所述的移动装置700的立体图。在图7的实施例中,移动装置700还包括一背盖720。如前所述,金属边框120的第一部分130可形成天线结构(可位于第一位置501或第二位置502处),而此天线结构可与电子零组件160(例如:前述的侧边按键161、162或感测元件461)和软性印刷电路板互相整合。背盖720包括一金属部分721、一第一非金属部分722,以及一第二非金属部分723,其中金属部分721介于第一非金属部分722和第二非金属部分723之间,并将第一非金属部分722和第二非金属部分723完全分离。背盖720的第一非金属部分722可避免其金属部分721直接接触金属边框120的第一部分130,从而可维持天线结构的良好通讯品质。在一些实施例中,移动装置700采用一喷涂制作工艺(Spray and Coat Process)以降低金属部分721与第一非金属部分722、第二非金属部分723之间的视觉差异,从而可美化移动装置700的外观一致性。FIG. 7 is a perspective view of a mobile device 700 according to an embodiment of the present invention. In the embodiment of FIG. 7 , the mobile device 700 further includes a back cover 720. As described above, the first portion 130 of the metal frame 120 can form an antenna structure (which can be located at the first position 501 or the second position 502), and the antenna structure can be integrated with the electronic component 160 (for example, the side buttons 161, 162 or the sensing element 461) and the flexible printed circuit board. The back cover 720 includes a metal portion 721, a first non-metal portion 722, and a second non-metal portion 723, wherein the metal portion 721 is between the first non-metal portion 722 and the second non-metal portion 723, and completely separates the first non-metal portion 722 and the second non-metal portion 723. The first non-metal portion 722 of the back cover 720 can prevent its metal portion 721 from directly contacting the first portion 130 of the metal frame 120, thereby maintaining the good communication quality of the antenna structure. In some embodiments, the mobile device 700 uses a spray and coating process to reduce the visual difference between the metal portion 721 and the first non-metal portion 722 and the second non-metal portion 723 , thereby improving the appearance consistency of the mobile device 700 .
图8是显示根据本发明一实施例所述的移动装置800的立体图。在图8的实施例中,移动装置800还包括一背盖820。如前所述,金属边框120的第一部分130可形成天线结构(可位于第一位置501或第二位置502处),而此天线结构可与电子零组件160(例如:前述的侧边按键161、162或感测元件461)和软性印刷电路板互相整合。背盖820包括一金属部分821、一第一非金属部分822、一第二非金属部分823,以及一第三非金属部分824,其中金属部分821介于第一非金属部分822、第二非金属部分823,以及第三非金属部分824之间。详细而言,金属部分821可以将第一非金属部分822、第二非金属部分823,以及第三非金属部分824完全分离。与图7的实施例相比,背盖820的第一非金属部分822、第二非金属部分823,以及第三非金属部分824具有不同形状。例如,第一非金属部分822可以大致呈现一U字形,第二非金属部分823可以大致呈现一矩形,而第三非金属部分824可以大致呈现一细长直条形。背盖820的第一非金属部分822可避免其金属部分821直接接触金属边框120的第一部分130,从而可维持天线结构的良好通讯品质。在一些实施例中,移动装置800还采用一喷涂制作工艺以降低金属部分821与第一非金属部分822、第二非金属部分823、第三非金属部分824之间的视觉差异,从而可美化移动装置800的外观一致性。必须注意的是,前述的背盖、金属边框可为同一机构件(两者为一体成形),或也可为分开制造的二独立元件。FIG8 is a perspective view showing a mobile device 800 according to an embodiment of the present invention. In the embodiment of FIG8 , the mobile device 800 further includes a back cover 820. As described above, the first portion 130 of the metal frame 120 can form an antenna structure (which can be located at the first position 501 or the second position 502), and the antenna structure can be integrated with the electronic component 160 (e.g., the side buttons 161, 162 or the sensing element 461) and the flexible printed circuit board. The back cover 820 includes a metal portion 821, a first non-metal portion 822, a second non-metal portion 823, and a third non-metal portion 824, wherein the metal portion 821 is between the first non-metal portion 822, the second non-metal portion 823, and the third non-metal portion 824. In detail, the metal portion 821 can completely separate the first non-metal portion 822, the second non-metal portion 823, and the third non-metal portion 824. Compared with the embodiment of FIG. 7 , the first non-metallic portion 822, the second non-metallic portion 823, and the third non-metallic portion 824 of the back cover 820 have different shapes. For example, the first non-metallic portion 822 may be roughly U-shaped, the second non-metallic portion 823 may be roughly rectangular, and the third non-metallic portion 824 may be roughly elongated and straight. The first non-metallic portion 822 of the back cover 820 can prevent its metal portion 821 from directly contacting the first portion 130 of the metal frame 120, thereby maintaining the good communication quality of the antenna structure. In some embodiments, the mobile device 800 also uses a spraying process to reduce the visual difference between the metal portion 821 and the first non-metallic portion 822, the second non-metallic portion 823, and the third non-metallic portion 824, thereby beautifying the appearance consistency of the mobile device 800. It should be noted that the aforementioned back cover and metal frame may be the same mechanism (both are integrally formed), or may be two independent components manufactured separately.
图9是显示根据本发明一实施例所述的移动装置的制造方法的流程图。此种制造方法至少包括下列步骤。在步骤S910,提供一第一电路板,一金属边框、一延伸辐射部、一电子零组件、一第二电路板,以及一射频模块,其中第一电路板包括一系统接地面,金属边框包括一第一部分,而电子零组件和第二电路板都邻近于第一部分。在步骤S920,将第一部分耦接至系统接地面。在步骤S930,将一净空区间形成于第一部分和系统接地面之间。在步骤S940,将第一部分和延伸辐射部都耦接至一馈入点,使得第一部分和延伸辐射部共同形成一天线结构。在步骤S950,将第二电路板耦接至电子零组件。在步骤S960,将射频模块耦接至馈入点,以激发天线结构。必须了解的是,以上步骤无需依次序执行,而图1A~图8的任何一或多个装置特征都可套用至图9的移动装置的制造方法当中。FIG9 is a flow chart showing a method for manufacturing a mobile device according to an embodiment of the present invention. Such a method for manufacturing includes at least the following steps. In step S910, a first circuit board, a metal frame, an extended radiating portion, an electronic component, a second circuit board, and a radio frequency module are provided, wherein the first circuit board includes a system ground plane, the metal frame includes a first portion, and the electronic component and the second circuit board are both adjacent to the first portion. In step S920, the first portion is coupled to the system ground plane. In step S930, a clearance interval is formed between the first portion and the system ground plane. In step S940, the first portion and the extended radiating portion are both coupled to a feed point, so that the first portion and the extended radiating portion together form an antenna structure. In step S950, the second circuit board is coupled to the electronic component. In step S960, the radio frequency module is coupled to the feed point to excite the antenna structure. It must be understood that the above steps do not need to be performed in sequence, and any one or more device features of FIG1A to FIG8 can be applied to the method for manufacturing the mobile device of FIG9.
值得注意的是,以上所述的元件尺寸、元件形状,以及频率范围都非为本发明的限制条件。天线设计者可以根据不同需要调整这些设定值。本发明的移动装置及制造方法并不仅限于图1A~图9所图示的状态。本发明可以仅包括图1A~图9的任何一或多个实施例的任何一或多项特征。换言之,并非所有图示的特征均须同时实施于本发明的移动装置及制造方法当中。It is worth noting that the above-mentioned component size, component shape, and frequency range are not limiting conditions of the present invention. Antenna designers can adjust these settings according to different needs. The mobile device and manufacturing method of the present invention are not limited to the states illustrated in Figures 1A to 9. The present invention may only include any one or more features of any one or more embodiments of Figures 1A to 9. In other words, not all of the illustrated features must be implemented simultaneously in the mobile device and manufacturing method of the present invention.
在本说明书以及权利要求中的序数,例如「第一」、「第二」、「第三」等等,彼此之间并没有顺序上的先后关系,其仅用于标示区分两个具有相同名字的不同元件。In the present specification and claims, ordinal numbers, such as "first", "second", "third", etc., have no sequential relationship with each other, and are only used to distinguish two different components with the same name.
虽然结合以上优选实施例公开了本发明,然而其并非用以限定本发明的范围,任何熟悉此项技术者,在不脱离本发明的精神和范围内,可做些许的更动与润饰,因此本发明的保护范围应当以附上的权利要求所界定的为准。Although the present invention is disclosed in conjunction with the above preferred embodiments, it is not intended to limit the scope of the present invention. Anyone familiar with this technology may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the definition of the attached claims.
Claims (20)
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US15/723,336 US10727569B2 (en) | 2016-12-21 | 2017-10-03 | Mobile device and manufacturing method thereof |
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