CN113782543B - Pixel array substrate - Google Patents
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- CN113782543B CN113782543B CN202110766361.7A CN202110766361A CN113782543B CN 113782543 B CN113782543 B CN 113782543B CN 202110766361 A CN202110766361 A CN 202110766361A CN 113782543 B CN113782543 B CN 113782543B
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- 239000000758 substrate Substances 0.000 title claims abstract description 71
- 239000010409 thin film Substances 0.000 claims abstract description 46
- 239000004065 semiconductor Substances 0.000 claims description 24
- 239000010410 layer Substances 0.000 description 74
- 239000000463 material Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000011229 interlayer Substances 0.000 description 8
- 239000007769 metal material Substances 0.000 description 5
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- -1 region Substances 0.000 description 3
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- RQIPKMUHKBASFK-UHFFFAOYSA-N [O-2].[Zn+2].[Ge+2].[In+3] Chemical compound [O-2].[Zn+2].[Ge+2].[In+3] RQIPKMUHKBASFK-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000001808 coupling effect Effects 0.000 description 2
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- OFIYHXOOOISSDN-UHFFFAOYSA-N tellanylidenegallium Chemical compound [Te]=[Ga] OFIYHXOOOISSDN-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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Abstract
一种像素阵列基板包括多条数据线、多条栅极线、多个像素结构及多条转接线。每一像素结构包括一薄膜晶体管、一像素电极及一桥接元件。多个像素结构排成多个像素列。每一数据线具有相对的第一侧与第二侧。一像素列的一像素结构的薄膜晶体管的源极与下一像素列的一像素结构的薄膜晶体管的源极电性连接至同一数据线。像素列的像素结构的薄膜晶体管的漏极与下一像素列的像素结构的薄膜晶体管的漏极位于同一数据线的第一侧。像素列的像素结构的像素电极与下一像素列的像素结构的像素电极分别位于同一数据线的第二侧及第一侧。像素列的像素结构的桥接元件跨越同一数据线及一转接线。
A pixel array substrate includes a plurality of data lines, a plurality of gate lines, a plurality of pixel structures and a plurality of transfer lines. Each pixel structure includes a thin film transistor, a pixel electrode and a bridge element. A plurality of pixel structures are arranged into a plurality of pixel columns. Each data line has opposite first and second sides. The source of the thin film transistor of a pixel structure in a pixel row is electrically connected to the same data line as the source of the thin film transistor of a pixel structure in a next pixel row. The drains of the thin film transistors in the pixel structure of the pixel column and the drains of the thin film transistors in the pixel structure of the next pixel column are located on the first side of the same data line. The pixel electrode of the pixel structure of the pixel column and the pixel electrode of the pixel structure of the next pixel column are respectively located on the second side and the first side of the same data line. The bridging elements of the pixel structure of the pixel row straddle the same data line and a transfer line.
Description
技术领域technical field
本发明涉及一种像素阵列基板。The invention relates to a pixel array substrate.
背景技术Background technique
随着显示科技的发达,人们对显示装置的需求,不再满足于高分辨率、高对比、广视角等光学特性,人们还期待显示装置具有优雅的外观。举例而言,人们期待显示装置的边框窄,甚至无边框。With the development of display technology, people's demand for display devices is no longer satisfied with optical properties such as high resolution, high contrast, and wide viewing angle. People also expect the display device to have an elegant appearance. For example, people expect display devices to have narrow bezels, or even no bezels.
一般而言,显示装置包括设置于显示区的像素阵列、设置于显示区的下方的数据驱动电路以及设置于显示区的左侧、右侧或左右两侧的栅极驱动电路。为减少显示装置的边框的左右两侧的宽度,可将栅极驱动电路与数据驱动电路均设置于显示区的下侧。当栅极驱动电路设置于显示区的下侧时,在水平方向上延伸的栅极线须通过在垂直方向上延伸的转接线方能电性连接至栅极驱动电路设置。然而,当转接线设置于主动区时,转接线势必会与数据线相邻;转接线与数据线之间的耦合效应,会使数据线上的数据信号偏移,进而造成斜向纹的问题。Generally speaking, a display device includes a pixel array disposed in the display area, a data driving circuit disposed below the display area, and a gate driving circuit disposed on the left, right or left and right sides of the display area. In order to reduce the width of the left and right sides of the frame of the display device, both the gate driving circuit and the data driving circuit can be arranged on the lower side of the display area. When the gate driving circuit is disposed on the lower side of the display area, the gate lines extending in the horizontal direction must pass through the transfer lines extending in the vertical direction to be electrically connected to the gate driving circuit. However, when the transfer wire is set in the active area, the transfer wire will inevitably be adjacent to the data line; the coupling effect between the transfer wire and the data line will cause the data signal on the data line to shift, thereby causing the problem of diagonal stripes .
发明内容Contents of the invention
本发明提供一种像素阵列基板,性能佳且开口率高。The invention provides a pixel array substrate with good performance and high aperture ratio.
本发明的像素阵列基板,包括基底、多条数据线、多条栅极线、多个像素结构及多条转接线。多条数据线设置于基底上且在第一方向上排列。多条栅极线设置于基底上且在第二方向上排列,其中第一方向与第二方向交错。多个像素结构设置于基底上,其中每一像素结构包括一薄膜晶体管、一像素电极及一桥接元件,薄膜晶体管的一源极及一栅极分别电性连接至对应的一数据线及对应的一栅极线,像素电极设置于薄膜晶体管的漏极外,且桥接元件电性连接薄膜晶体管的漏极与像素电极。多条转接线设置于基底上,在第一方向上排列,且电性连接至多条栅极线。多个像素结构排成多个像素列。每一像素列的多个像素结构在第一方向上排列,且多个像素列在第二方向上排列。每一数据线具有相对的第一侧与第二侧。一像素列的一像素结构的薄膜晶体管的源极与下一像素列的一像素结构的薄膜晶体管的源极电性连接至同一数据线。像素列的像素结构的薄膜晶体管的漏极与下一像素列的像素结构的薄膜晶体管的漏极位于同一数据线的第一侧。像素列的像素结构的像素电极与下一像素列的像素结构的像素电极分别位于同一数据线的第二侧及第一侧。像素列的像素结构的桥接元件跨越同一数据线及一转接线。The pixel array substrate of the present invention includes a substrate, a plurality of data lines, a plurality of gate lines, a plurality of pixel structures and a plurality of transfer lines. A plurality of data lines are arranged on the base and arranged in a first direction. A plurality of gate lines are disposed on the base and arranged in a second direction, wherein the first direction and the second direction are interlaced. A plurality of pixel structures are disposed on the substrate, wherein each pixel structure includes a thin film transistor, a pixel electrode and a bridge element, and a source electrode and a gate electrode of the thin film transistor are respectively electrically connected to a corresponding data line and a corresponding A gate line, the pixel electrode is arranged outside the drain of the thin film transistor, and the bridging element is electrically connected to the drain of the thin film transistor and the pixel electrode. A plurality of transfer lines are disposed on the base, arranged in a first direction, and electrically connected to a plurality of gate lines. A plurality of pixel structures are arranged into a plurality of pixel columns. A plurality of pixel structures of each pixel row are arranged in a first direction, and a plurality of pixel rows are arranged in a second direction. Each data line has opposite first and second sides. The source of the thin film transistor of a pixel structure in a pixel row is electrically connected to the same data line as the source of the thin film transistor of a pixel structure in a next pixel row. The drains of the thin film transistors in the pixel structure of the pixel column and the drains of the thin film transistors in the pixel structure of the next pixel column are located on the first side of the same data line. The pixel electrode of the pixel structure of the pixel column and the pixel electrode of the pixel structure of the next pixel column are respectively located on the second side and the first side of the same data line. The bridging elements of the pixel structure of the pixel row straddle the same data line and a transfer line.
在本发明的一实施例中,上述的像素阵列基板还包括第一绝缘层、共用电极层及第二绝缘层。第一绝缘层设置于多个像素结构的多个薄膜晶体管上。共用电极层设置于第一绝缘层上。第二绝缘层设置于共用电极层上。像素列的像素结构的桥接元件设置于第二绝缘层上,且共用电极层设置于像素列的像素结构的桥接元件与转接线之间。In an embodiment of the present invention, the above-mentioned pixel array substrate further includes a first insulating layer, a common electrode layer and a second insulating layer. The first insulating layer is disposed on the multiple thin film transistors of the multiple pixel structures. The common electrode layer is disposed on the first insulating layer. The second insulating layer is disposed on the common electrode layer. The bridge element of the pixel structure of the pixel row is disposed on the second insulating layer, and the common electrode layer is disposed between the bridge element of the pixel structure of the pixel row and the transfer line.
在本发明的一实施例中,上述的像素列的像素结构的像素电极设置于第二绝缘层上,且共用电极层设置于像素列的像素结构的像素电极与转接线之间。In an embodiment of the present invention, the above-mentioned pixel electrodes of the pixel structures of the pixel columns are disposed on the second insulating layer, and the common electrode layer is disposed between the pixel electrodes of the pixel structures of the pixel columns and the transfer lines.
在本发明的一实施例中,上述的像素列的像素结构的桥接元件与同一数据线交错,下一像素列的像素结构的桥接元件设置于同一数据线外且不重叠于同一数据线。In an embodiment of the present invention, the bridge elements of the pixel structure of the above pixel row are interleaved with the same data line, and the bridge elements of the pixel structure of the next pixel row are arranged outside the same data line and do not overlap the same data line.
在本发明的一实施例中,上述的多个像素结构的多个像素电极排成多个像素电极行,每一像素电极行的多个像素电极在第二方向上排列,且多个像素电极行在第一方向上排列;多个像素电极行包括分别用以显示红色及蓝色的第一像素电极行及第二像素电极行;在像素阵列基板的俯视图中,转接线设置于第一像素电极行与第二像素电极行之间。In an embodiment of the present invention, the plurality of pixel electrodes of the above-mentioned plurality of pixel structures are arranged into a plurality of pixel electrode rows, and the plurality of pixel electrodes in each pixel electrode row are arranged in the second direction, and the plurality of pixel electrodes The rows are arranged in the first direction; a plurality of pixel electrode rows include a first pixel electrode row and a second pixel electrode row for displaying red and blue respectively; Between the electrode row and the second pixel electrode row.
在本发明的一实施例中,上述的多个像素结构的多个像素电极排成多个像素电极行,每一像素电极行的多个像素电极在第二方向上排列,且多个像素电极行在第一方向上排列;多个像素电极行包括分别用以显示蓝色及绿色的第二电极像素行及第三电极像素行;在像素阵列基板的俯视图中,转接线设置于第二电极像素行与第三像素电极行之间。In an embodiment of the present invention, the plurality of pixel electrodes of the above-mentioned plurality of pixel structures are arranged into a plurality of pixel electrode rows, and the plurality of pixel electrodes in each pixel electrode row are arranged in the second direction, and the plurality of pixel electrodes The rows are arranged in the first direction; the multiple pixel electrode rows include the second electrode pixel row and the third electrode pixel row for displaying blue and green respectively; in the top view of the pixel array substrate, the transfer line is arranged on the second electrode between the pixel row and the third pixel electrode row.
在本发明的一实施例中,上述的多个像素结构排成多个像素电极行,每一像素电极行的多个像素电极在第二方向上排列,且多个像素电极行在第一方向上排列;多个像素电极行包括分别用以显示红色及绿色的第一像素电极行及第三像素电极行;在像素阵列基板的俯视图中,转接线设置于第一像素电极行与第三像素电极行之间。In an embodiment of the present invention, the plurality of pixel structures described above are arranged in a plurality of pixel electrode rows, the plurality of pixel electrodes in each pixel electrode row are arranged in the second direction, and the plurality of pixel electrode rows are arranged in the first direction. Arranged upwards; multiple pixel electrode rows include the first pixel electrode row and the third pixel electrode row for displaying red and green respectively; in the top view of the pixel array substrate, the transfer lines are arranged between the first pixel electrode row and the third pixel between the electrode rows.
在本发明的一实施例中,上述的薄膜晶体管还包括半导体图案,半导体图案的不同两区分别电性连接至源极及漏极,且半导体图案设置于栅极与基底之间。In an embodiment of the present invention, the above thin film transistor further includes a semiconductor pattern, two different regions of the semiconductor pattern are electrically connected to the source and the drain, and the semiconductor pattern is disposed between the gate and the substrate.
在本发明的一实施例中,上述的薄膜晶体管还包括半导体图案,半导体图案的不同两区分别电性连接至源极及漏极,且栅极设置于半导体图案与基底之间。In an embodiment of the present invention, the above thin film transistor further includes a semiconductor pattern, two different regions of the semiconductor pattern are electrically connected to the source and the drain, and the gate is disposed between the semiconductor pattern and the substrate.
附图说明Description of drawings
图1为本发明一实施例的像素阵列基板100的俯视示意图。FIG. 1 is a schematic top view of a
图2为本发明一实施例的像素阵列基板100的剖面示意图。FIG. 2 is a schematic cross-sectional view of a
图3为本发明一实施例的像素阵列基板100的剖面示意图。FIG. 3 is a schematic cross-sectional view of a
图4为本发明一实施例的像素阵列基板100A的俯视示意图。FIG. 4 is a schematic top view of a
图5为本发明一实施例的像素阵列基板100B的俯视示意图。FIG. 5 is a schematic top view of a
图6为本发明一实施例的像素阵列基板100B的剖面示意图。FIG. 6 is a schematic cross-sectional view of a
图7为本发明一实施例的像素阵列基板100B的剖面示意图。FIG. 7 is a schematic cross-sectional view of a
附图标记说明:Explanation of reference signs:
100、100A、100B:像素阵列基板100, 100A, 100B: pixel array substrate
110:基底110: base
120:缓冲层120: buffer layer
130:闸绝缘层130: gate insulation layer
132、134、142、144:接触窗132, 134, 142, 144: contact window
140:层间介电层140: interlayer dielectric layer
150:第一绝缘层150: first insulating layer
160:共用电极层160: common electrode layer
170:第二绝缘层170: second insulating layer
182:像素电极182: pixel electrode
182a:狭缝182a: Slit
184:桥接元件184: Bridge element
190:第三绝缘层190: third insulating layer
C:像素电极行C: pixel electrode row
Cr:第一像素电极行Cr: the first pixel electrode row
Cb:第二像素电极行Cb: second pixel electrode row
Cg:第三像素电极行Cg: the third pixel electrode row
DL:数据线DL: data line
GL:栅极线GL: gate line
gl:转接线gl: adapter cable
PX:像素结构PX: pixel structure
PXA:第一型像素结构PXA: the first type of pixel structure
PXB:第二型像素结构PXB: the second type of pixel structure
R、Rn、Rn+1:像素列R, Rn, Rn+1: pixel columns
SM:遮光图案SM: Shading pattern
T:薄膜晶体管T: thin film transistor
Ta:源极Ta: source
Tb:漏极Tb: Drain
Tc:栅极Tc: gate
Td:半导体图案Td: semiconductor pattern
x:第一方向x: the first direction
y:第二方向y: the second direction
I-I’、II-II’、III-III’、IV-IV’:剖线I-I', II-II', III-III', IV-IV': broken line
具体实施方式Detailed ways
现将详细地参考本发明的示范性实施例,示范性实施例的实例说明于附图中。只要有可能,相同元件符号在附图和描述中用来表示相同或相似部分。Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and description to refer to the same or like parts.
应当理解,当诸如层、膜、区域或基板的元件被称为在另一元件“上”或“连接到”另一元件时,其可以直接在另一元件上或与另一元件连接,或者中间元件可以也存在。相反,当元件被称为“直接在另一元件上”或“直接连接到”另一元件时,不存在中间元件。如本文所使用的,“连接”可以指物理及/或电性连接。再者,“电性连接”或“耦合”可以是二元件间存在其它元件。It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may mean that other elements exist between two elements.
除非另有定义,本文使用的所有术语(包括技术和科学术语)具有与本发明所属领域的普通技术人员通常理解的相同的含义。将进一步理解的是,诸如在通常使用的字典中定义的那些术语应当被解释为具有与它们在相关技术和本发明的上下文中的含义一致的含义,并且将不被解释为理想化的或过度正式的意义,除非本文中明确地这样定义。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant art and the present invention, and will not be interpreted as idealized or excessive formal meaning, unless expressly so defined herein.
图1为本发明一实施例的像素阵列基板100的俯视示意图。FIG. 1 is a schematic top view of a
图2为本发明一实施例的像素阵列基板100的剖面示意图。图2对应图1的剖线I-I’。FIG. 2 is a schematic cross-sectional view of a
图3为本发明一实施例的像素阵列基板100的剖面示意图。图2对应图1的剖线II-II’。FIG. 3 is a schematic cross-sectional view of a
请参照图1、图2及图3,像素阵列基板100包括基底110。在本实施例中,基底110的材质例如是玻璃。然而,本发明不限于此,根据其它实施例,基底110的材质也可以是石英、有机聚合物、或是不透光/反射材料(例如:晶圆、陶瓷等)、或是其它可适用的材料。Referring to FIG. 1 , FIG. 2 and FIG. 3 , the
请参照图1及图3,像素阵列基板100还包括多条数据线DL和多条栅极线GL,设置于基底110上。请参照图1,多条数据线DL在第一方向x上排列,多条栅极线GL第二方向y上排列,其中第一方向x与第二方向y交错。举例而言,在本实施例中,第一方向x与第二方向y可垂直,但本发明不以此为限。Referring to FIG. 1 and FIG. 3 , the
请参照图1、图2及图3,另外,数据线DL与栅极线GL属于不同的膜层。举例而言,在本实施例中,栅极线GL可选择性地属于第一金属层,数据线DL可选择性地属于第二金属层,但本发明不以此为限。Please refer to FIG. 1 , FIG. 2 and FIG. 3 , in addition, the data lines DL and the gate lines GL belong to different film layers. For example, in this embodiment, the gate line GL can selectively belong to the first metal layer, and the data line DL can selectively belong to the second metal layer, but the invention is not limited thereto.
基于导电性的考量,在本实施例中,数据线DL与栅极线GL是使用金属材料。然而,本发明不限于此,根据其他实施例,数据线DL与栅极线GL也可以使用其他导电材料,例如:合金、金属材料的氮化物、金属材料的氧化物、金属材料的氮氧化物、或是金属材料与其它导电材料的堆叠层。Based on the consideration of conductivity, in this embodiment, the data lines DL and the gate lines GL are made of metal materials. However, the present invention is not limited thereto. According to other embodiments, the data lines DL and the gate lines GL may also use other conductive materials, such as alloys, nitrides of metal materials, oxides of metal materials, and oxynitrides of metal materials. , or stacked layers of metal materials and other conductive materials.
请参照图1,像素阵列基板100还包括多个像素结构PX,设置于基底110上。多个像素结构PX可排成多个像素列R。每一像素列R的多个像素结构PX在第一方向x上排列,且多个像素列R在第二方向y上排列。Please refer to FIG. 1 , the
请参照图1,每一像素结构PX包括一薄膜晶体管T、一像素电极182及一桥接元件184。请参照图1及图2,薄膜晶体管T包括源极Ta、漏极Tb、栅极Tc、半导体图案Td和闸绝缘层130,闸绝缘层130设置于栅极Tc与半导体图案Td之间,半导体图案Td的不同两区分别电性连接至源极Ta及漏极Tb,源极Ta及栅极Tc分别电性连接至对应的一条数据线DL及对应的一条栅极线GL。请参照图2,在本实施例中,薄膜晶体管T还可选择性地包括层间介电层140,其中层间介电层140设置于闸绝缘层130上且覆盖栅极Tc,源极Ta与漏极Tb可通过层间介电层140的多个接触窗142及闸绝缘层130的多个接触窗132电性连接至半导体图案Td的不同两区。请参照图1,像素电极182设置于薄膜晶体管T的漏极Tb外,而桥接元件184电性连接薄膜晶体管T的漏极Tb与像素电极182。Please refer to FIG. 1 , each pixel structure PX includes a thin film transistor T, a
请参照图2,在本实施例中,薄膜晶体管T的半导体图案Td可选择性地设置于栅极Tc与基底110之间。换言之,本实施例的薄膜晶体管T可为顶部栅极型薄膜晶体管(top gateTFT),但本发明不以此为限。Referring to FIG. 2 , in this embodiment, the semiconductor pattern Td of the thin film transistor T can be selectively disposed between the gate Tc and the
在本实施例中,栅极Tc可选择性地属于第一金属层,源极Ta和漏极Tb可选择性地属于第二金属层,但本发明不以此为限。在本实施例中,半导体图案Td的材料例如是低温多晶硅(LTPS)。然而,本发明不限于此,在其它实施例中,半导体图案Td的材料也可以是非晶硅、微晶硅、单晶硅、有机半导体材料、氧化物半导体材料(例如:铟锌氧化物、铟镓锌氧化物、或是其它合适的材料、或上述的组合)、或其它合适的材料。In this embodiment, the gate Tc may selectively belong to the first metal layer, and the source Ta and the drain Tb may selectively belong to the second metal layer, but the invention is not limited thereto. In this embodiment, the material of the semiconductor pattern Td is, for example, low temperature polysilicon (LTPS). However, the present invention is not limited thereto. In other embodiments, the material of the semiconductor pattern Td can also be amorphous silicon, microcrystalline silicon, single crystal silicon, organic semiconductor materials, oxide semiconductor materials (for example: indium zinc oxide, indium gallium zinc oxide, or other suitable materials, or a combination of the above), or other suitable materials.
请参照图1及图2,在本实施例中,像素阵列基板100还可选择性地包括遮光图案SM及缓冲层120,遮光图案SM设置于基底110上,缓冲层120覆盖遮光图案SM,薄膜晶体管T的半导体图案Td可选择性地设置于缓冲层120上且与遮光图案SM重叠,但本发明不以此为限。Please refer to FIG. 1 and FIG. 2. In this embodiment, the
请参照图2,在本实施例中,像素阵列基板100还包括第一绝缘层150、共用电极层160及第二绝缘层170。请参照图1及图2,第一绝缘层150设置于多个像素结构PX的多个薄膜晶体管T上,共用电极层160设置于第一绝缘层150上,第二绝缘层170设置于共用电极层160上,每一像素结构PX的像素电极182可设置于第二绝缘层170上且具有多个狭缝182a,且多个狭缝182a重叠于共用电极层160。Referring to FIG. 2 , in this embodiment, the
举例而言,在本实施例中,共用电极层160可属于第一透明导电层,其包括金属氧化物,例如:铟锡氧化物、铟锌氧化物、铝锡氧化物、铝锌氧化物、铟锗锌氧化物、其它合适的氧化物、或者是上述至少二者的堆叠层,但本发明不以此为限;像素电极182可属于第二透明导电层,其包括金属氧化物,例如:铟锡氧化物、铟锌氧化物、铝锡氧化物、铝锌氧化物、铟锗锌氧化物、其它合适的氧化物、或者是上述至少二者的堆叠层,但本发明不以此为限。此外,在本实施例中,桥接元件184与像素电极182可属于同一膜层且直接连接,但本发明不以此为限。For example, in this embodiment, the
请参照图1及图3,像素阵列基板100还包括多条转接线gl,设置于基底110上。请参照图1,多条转接线gl在第一方向x上排列且电性连接至在第二方向y上排列的多条栅极线GL。Referring to FIG. 1 and FIG. 3 , the
请参照图1、图2及图3,举例而言,在本实施例中,多条栅极线GL可选择性地属于第一金属层,多条转接线gl可选择性地属于第二金属层,第一金属层与第二金属层之间设有层间介电层140,层间介电层140具有多个接触窗144(标示于图1),多条转接线gl可通过层间介电层140的多个接触窗144电性连接至多条栅极线GL,但本发明不以此为限。Please refer to FIG. 1, FIG. 2 and FIG. 3. For example, in this embodiment, multiple gate lines GL can selectively belong to the first metal layer, and multiple transfer lines gl can selectively belong to the second metal layer. layer, an
请参照图1,每一数据线DL具有相对的第一侧(例如:右侧)及第二侧(例如:左侧),一像素列Rn的一像素结构PX的薄膜晶体管T的源极Ta与下一像素列Rn+1的一像素结构PX的薄膜晶体管T的源极Ta电性连接至同一数据线DL,像素列Rn的像素结构PX的薄膜晶体管T的漏极Tb与下一像素列Rn的像素结构PX的薄膜晶体管T的漏极Tb位于同一数据线DL的第一侧(例如:右侧),像素列Rn的像素结构PX的像素电极182与下一像素列Rn+1的像素结构PX的像素电极182分别位于同一数据线DL的第二侧(例如:左侧)及第一侧(例如:右侧),且像素列Rn的像素结构PX的桥接元件184跨越所述同一数据线DL及一转接线gl。简言之,在本实施例中,电性连接至同一数据线DL的多个像素结构PX的多个像素电极182大致上呈之字形(zigzag)排列。因此,可提高像素阵列基板100的开口率。Please refer to FIG. 1, each data line DL has an opposite first side (for example: right side) and a second side (for example: left side), the source Ta of the thin film transistor T of a pixel structure PX of a pixel row Rn The source Ta of the thin film transistor T of a pixel structure PX of the next pixel row Rn+1 is electrically connected to the same data line DL, and the drain Tb of the thin film transistor T of the pixel structure PX of the pixel row Rn is connected to the next pixel row The drain Tb of the thin film transistor T of the pixel structure PX of Rn is located on the first side (for example: the right side) of the same data line DL, and the
请参照图1及图3,在本实施例中,像素列Rn的像素结构PX的桥接元件184设置于第二绝缘层170上,且共用电极层160设置于像素列Rn的像素结构PX的桥接元件184与转接线gl之间。共用电极层160可做为一屏蔽层使用,减少转接线gl与桥接元件184之间的耦合效应,避免转接线gl的栅极驱动信号过度影响与桥接元件184电性连接的像素电极182的电位。因此,像素阵列基板100不但具有高开口率更能兼顾斜向纹的问题改善。1 and 3, in this embodiment, the
在本实施例中,像素列Rn的像素结构PX的像素电极182设置于第二绝缘层170上,且共用电极层160设置于像素列Rn的像素结构PX的像素电极182与转接线gl之间。换言之,共用电极层160可以是像素电极182与转接线gl之间的屏蔽层,以降低转接线gl的栅极驱动信号对像素电极182的电位的影响。In this embodiment, the
请参照图1,在本实施例中,像素列Rn的像素结构PX的桥接元件184与数据线DL交错,下一像素列Rn+1的像素结构PX的桥接元件184设置于数据线DL外且不重叠于数据线DL。换言之,在本实施例中,多个像素结构PX可分为多个第一型像素结构PXA及多个第二型像素结构PXB,其中每一第一型像素结构PXA的桥接元件184跨越数据线DL,每一第二型像素结构PXB的桥接元件184未跨越数据线DL。举例而言,在本实施例中,奇数个像素列R(例如:Rn)的像素结构PX可为第一型像素结构PXA,且偶数个像素列R(例如:Rn+1)的像素结构PX可为第二型像素结构PXB。换言之,第一型像素结构PXA与第二型像素结构PXB在第二方向y上交替排列。Referring to FIG. 1, in this embodiment, the
请参照图1,在本实施例中,多个像素结构PX的多个像素电极182排成多个像素电极行C,每一像素电极行C的多个像素电极182在第二方向y上排列,且多个像素电极行C在第一方向x上排列,且多个像素电极行C包括分别用以显示红色、蓝色及绿色的第一像素电极行Cr、第二像素电极行Cb及第三像素电极行Cg。在本实施例中,于像素阵列基板100的俯视图中,转接线gl可选择性地设置在分别用以显示红色及蓝色的第一像素电极行Cr与第二像素电极行Cb之间,但本发明不以此为限。Please refer to FIG. 1 , in this embodiment, a plurality of
在此必须说明的是,下述实施例沿用前述实施例的元件标号与部分内容,其中采用相同的标号来表示相同或近似的元件,并且省略了相同技术内容的说明。关于省略部分的说明可参考前述实施例,下述实施例不再重述。It must be noted here that the following embodiments use the component numbers and part of the content of the previous embodiments, wherein the same numbers are used to denote the same or similar components, and descriptions of the same technical content are omitted. For the description of omitted parts, reference may be made to the aforementioned embodiments, and the following embodiments will not be repeated.
图4为本发明一实施例的像素阵列基板100A的俯视示意图。FIG. 4 is a schematic top view of a
图4的像素阵列基板100A与图1的像素阵列基板100类似,两者的差异在于:两者的转接线gl的设置位置不尽相同。The
请参照图4,具体而言,在本实施例中,于像素阵列基板100A的俯视图中,多条转接线gl除了设置于用以显示红色及蓝色的第一像素电极行Cr与第二像素电极行Cb之间之外,更设置于用以显示蓝色及绿色的第二电极像素行Cb与第三像素电极行Cg之间以及用以显示红色及绿色的第一像素电极行Cr与第三像素电极行Cg之间。Please refer to FIG. 4. Specifically, in this embodiment, in the top view of the
图5为本发明一实施例的像素阵列基板100B的俯视示意图。FIG. 5 is a schematic top view of a
图6为本发明一实施例的像素阵列基板100B的剖面示意图。图6对应图5的剖线III-III’。FIG. 6 is a schematic cross-sectional view of a
图7为本发明一实施例的像素阵列基板100B的剖面示意图。图7对应图5的剖线IV-IV’。FIG. 7 is a schematic cross-sectional view of a
图5、图6及图7的像素阵列基板100B与图1、图2及图3的像素阵列基板100类似,两者的差异在于:两者的薄膜晶体管T不同。The
请参照图5、图6及图7,具体而言,在本实施例中,薄膜晶体管T的栅极Tc设置于薄膜晶体管T的半导体图案Td与基底110之间。换言之,本实施例的薄膜晶体管T可为底部栅极型薄膜晶体管(bottom gate TFT)。此外,在本实施例中,薄膜晶体管T的半导体图案Td的材料例如是非晶硅(Amorphous silicon)。Please refer to FIG. 5 , FIG. 6 and FIG. 7 , specifically, in this embodiment, the gate Tc of the thin film transistor T is disposed between the semiconductor pattern Td of the thin film transistor T and the
另外,在本实施例中,像素阵列基板100B可不包括像素阵列基板100的遮光图案SM、缓冲层120及层间介电层140。在本实施例中,像素阵列基板100B包括第三绝缘层190(绘于图6及图7),设置于转接线gl及数据线DL所属的第二金属层与第一绝缘层150之间。此外,在本实施例中,像素阵列基板100B的转接线gl是通过闸绝缘层130的接触窗134(绘于图5及图7)电性连接至栅极线GL。In addition, in this embodiment, the
像素阵列基板100B具有与前述的像素阵列基板100类似的技术效果及优点,于此便不再重述。The
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106206619A (en) * | 2016-08-31 | 2016-12-07 | 厦门天马微电子有限公司 | Array base palte and driving method thereof and display device |
CN108922893A (en) * | 2018-04-24 | 2018-11-30 | 友达光电股份有限公司 | pixel array substrate |
US10481454B1 (en) * | 2018-07-05 | 2019-11-19 | Century Technology (Shenzhen) Corporation Limited | Thin film transistor array substrate and display panel |
KR20200049397A (en) * | 2018-10-31 | 2020-05-08 | 엘지디스플레이 주식회사 | Liquid crystal display device |
CN111403420A (en) * | 2019-02-27 | 2020-07-10 | 友达光电股份有限公司 | Pixel array substrate and driving method thereof |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106206619A (en) * | 2016-08-31 | 2016-12-07 | 厦门天马微电子有限公司 | Array base palte and driving method thereof and display device |
CN108922893A (en) * | 2018-04-24 | 2018-11-30 | 友达光电股份有限公司 | pixel array substrate |
US10481454B1 (en) * | 2018-07-05 | 2019-11-19 | Century Technology (Shenzhen) Corporation Limited | Thin film transistor array substrate and display panel |
KR20200049397A (en) * | 2018-10-31 | 2020-05-08 | 엘지디스플레이 주식회사 | Liquid crystal display device |
CN111403420A (en) * | 2019-02-27 | 2020-07-10 | 友达光电股份有限公司 | Pixel array substrate and driving method thereof |
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