CN113262923A - Micropore atomization sheet and atomization device - Google Patents
Micropore atomization sheet and atomization device Download PDFInfo
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- CN113262923A CN113262923A CN202010092473.4A CN202010092473A CN113262923A CN 113262923 A CN113262923 A CN 113262923A CN 202010092473 A CN202010092473 A CN 202010092473A CN 113262923 A CN113262923 A CN 113262923A
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- 238000000889 atomisation Methods 0.000 title abstract description 44
- 239000000919 ceramic Substances 0.000 claims abstract description 137
- 239000002184 metal Substances 0.000 claims abstract description 89
- 239000012528 membrane Substances 0.000 claims abstract description 39
- 239000003292 glue Substances 0.000 claims description 63
- 239000007788 liquid Substances 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 239000011148 porous material Substances 0.000 description 8
- 238000005452 bending Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000004887 air purification Methods 0.000 description 1
- 238000000222 aromatherapy Methods 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
- B05B17/0638—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices
- B05B17/0646—Vibrating plates, i.e. plates being directly subjected to the vibrations, e.g. having a piezoelectric transducer attached thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
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Abstract
The invention relates to a micropore atomization sheet and an atomization device, wherein the micropore atomization sheet comprises a first piezoelectric ceramic and a metal membrane, the first piezoelectric ceramic comprises a main body part and an edge-covering part, and the main body part is surrounded by the edge-covering part; the height of the edge covering part is greater than that of the main body part, the part of the edge covering part, which is higher than the main body part, and the main body part enclose together to form an accommodating space, and a first hollow-out area is arranged on the main body part; the metal diaphragm is adhered to the main body part of the first piezoelectric ceramic and is positioned in the accommodating space of the first piezoelectric ceramic, a micropore area is arranged on the metal diaphragm, the position of the micropore area corresponds to the first hollow-out area, and more than one micropore is arranged in the micropore area. According to the micropore atomization sheet and the atomization device, the metal membrane is arranged in the containing space of the first piezoelectric ceramics, and the first piezoelectric ceramics are hard and are not easy to deform under stress, so that the metal membrane is not easy to be affected by external force, and the problem that the metal membrane and the piezoelectric ceramics are easy to degum is solved.
Description
Technical Field
The invention relates to the technical field of atomization devices, in particular to a micropore atomization sheet and an atomization device.
Background
The microporous atomizing sheet on the market generally comprises piezoelectric ceramics and a metal membrane, has the main function of breaking a solution into micro droplets by utilizing the high-frequency vibration of the piezoelectric ceramics to form atomized steam, and has wide application in various fields such as household humidification, aromatherapy beauty, surface spraying, air purification, medical appliances and the like. The size of the metal diaphragm in the existing micropore atomization sheet is generally larger than that of the piezoelectric ceramic, so that the piezoelectric ceramic is conveniently bonded on the metal diaphragm by using bonding glue. However, the micropore atomization sheet adopting the structure is easy to have the problem of degumming in the use process, namely the problem that the metal diaphragm and the piezoelectric ceramics are easy to separate when the outer edge of the metal diaphragm is under the action of external force.
Disclosure of Invention
In view of the above, it is necessary to provide a microporous atomizing sheet and an atomizing device, which are directed to the problem that the metal diaphragm and the piezoelectric ceramic of the conventional microporous atomizing sheet are easily separated.
The micropore atomization sheet comprises first piezoelectric ceramics and a metal membrane, wherein the first piezoelectric ceramics comprise a main body part and a wrapping part, and the wrapping part surrounds the main body part; the height of the edge wrapping part is greater than that of the main body part, the part of the edge wrapping part, which is higher than the main body part, and the main body part enclose together to form an accommodating space, and a first hollow-out area is arranged on the main body part; the metal diaphragm is adhered to the main body part of the first piezoelectric ceramic and is positioned in the accommodating space of the first piezoelectric ceramic, a micropore area is arranged on the metal diaphragm, the position of the micropore area corresponds to the first hollow area, and more than one micropore is arranged in the micropore area.
In one embodiment, the height difference between the edge wrapping part and the main body part is the depth of the accommodating space, and the depth of the accommodating space is greater than or equal to the thickness of the metal membrane.
In one embodiment, the shape of the microwells is conical, rectangular or cylindrical; when the shape of the micropore is conical, the aperture of the micropore close to one end of the first piezoelectric ceramic is smaller than that of the micropore far away from one end of the first piezoelectric ceramic.
In one embodiment, the micropore area of the metal membrane is recessed towards the first hollow-out area to form a groove portion, and the micropores are arranged in the groove portion.
In one embodiment, the groove portion has a spherical shape or a trapezoidal shape.
In one embodiment, at least one first glue overflow groove is arranged on one surface, which is stuck to the metal membrane, of the first piezoelectric ceramic.
In one embodiment, an edge of the first piezoceramic body portion corresponds to an edge of the metallic diaphragm; the edge of the first piezoelectric ceramic main body part and/or the position of the first piezoelectric ceramic close to the first hollow area are/is provided with the first glue overflow groove.
In one embodiment, the piezoelectric ceramic module further comprises a second piezoelectric ceramic, wherein one surface of the metal diaphragm is adhered to the main body part of the first piezoelectric ceramic, and the other surface of the metal diaphragm is adhered to the second piezoelectric ceramic.
In one embodiment, the second piezoelectric ceramic is located above the accommodating space; or at least one part of the second piezoelectric ceramics is accommodated in the accommodating space.
In one embodiment, the height difference between the edge covering part and the main body part is the depth of the accommodating space, and the sum of the thickness of the metal membrane and the thickness of the second piezoelectric ceramic is less than or equal to the depth of the accommodating space.
In one embodiment, at least one second glue overflow groove is arranged on one surface, which is stuck to the metal membrane, of the second piezoelectric ceramic.
In one embodiment, a second hollow-out area is arranged at a position of the second piezoelectric ceramic corresponding to the first hollow-out area.
In one embodiment, an edge of the second piezoelectric ceramic corresponds to an edge of the metal diaphragm; and the edge of the second piezoelectric ceramic and/or the position of the second piezoelectric ceramic, which is close to the second hollow area, is provided with the second glue overflow groove.
The invention also provides an atomization device which comprises the micropore atomization sheet.
The micropore atomization sheet and the atomization device have the beneficial effects that:
according to the micropore atomization sheet and the atomization device, the metal membrane is arranged in the accommodating space formed by the surrounding of the first piezoelectric ceramic wrapping part and the main body part, the first piezoelectric ceramic is hard and is not easy to deform under stress, so that the metal membrane is not easy to be affected by external force, and the problem that the metal membrane and the piezoelectric ceramic are easy to degum is solved.
Drawings
Fig. 1 is a schematic diagram of an exploded structure of a microporous atomization sheet according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of the overall structure of a microporous atomizing sheet according to an embodiment of the present invention.
Fig. 3 is a longitudinal sectional view of a microporous atomization plate according to an embodiment of the present invention, before a first piezoelectric ceramic and a metal membrane are attached to each other.
Fig. 4 is a longitudinal sectional view of a microporous atomization plate provided in an embodiment of the present invention, after a first piezoelectric ceramic and a metal membrane are attached to each other.
Fig. 5 is a schematic diagram of an exploded structure of a microporous atomization sheet according to another embodiment of the present invention.
Fig. 6 is a longitudinal sectional view of a microporous atomization plate provided in accordance with another embodiment of the present invention, after a first piezoelectric ceramic and a metal membrane are attached to each other.
Fig. 7 is a schematic diagram of an exploded structure of a microporous atomization sheet according to another embodiment of the present invention.
Fig. 8 is a longitudinal sectional view of a microporous atomization sheet according to another embodiment of the present invention, before a first piezoelectric ceramic and a metal membrane are attached to each other.
Fig. 9 is a longitudinal sectional view of a microporous atomization sheet in which a first piezoelectric ceramic and a metal membrane are attached according to yet another embodiment of the present invention.
Fig. 10 is a schematic structural diagram of an atomization device according to an embodiment of the present invention.
Reference numerals:
the device comprises an atomizing device 10, an atomized liquid container 20, a microporous atomizing sheet 30, a vibrator 40, a first piezoelectric ceramic 100, a main body part 110, a first hollow area 111, a wrapping part 120, a containing space 130 and a first glue overflow groove 140; a metal diaphragm 200, a micropore area 210, micropores 211, a groove part 220; a second piezoelectric ceramic 300, a second hollow area 310, and a second glue overflow groove 320.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "inner", "outer", "left", "right" and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
The invention provides a micropore atomization sheet and an atomization device, wherein the atomization device comprises a micropore atomization sheet. In one embodiment, the structure of the microporous atomizing sheet is as shown in fig. 1 and fig. 2, where fig. 1 is a schematic diagram of an explosion structure of the microporous atomizing sheet, fig. 2 is a schematic diagram of an overall structure of the assembled microporous atomizing sheet, as can be seen from fig. 1 and fig. 2, the microporous atomizing sheet includes a first piezoelectric ceramic 100 and a metal membrane 200, the first piezoelectric ceramic 100 is annularly disposed and includes a main body portion 110 and a rim portion 120, the main body portion 110 is located in a central region, the rim portion 120 is located in an edge region, the rim portion 120 surrounds the main body portion 110, a first hollow-out region 111 is disposed in a center of the main body portion 110, the metal membrane 200 is adhered to the main body portion 110 of the first piezoelectric ceramic 100 by an adhesive, a microporous region 210 is disposed on the metal membrane 200, the position of the microporous region 210 corresponds to the first hollow-out region 111, and the microporous region 210 is provided with one or more micropores 211. In a particular embodiment, the micropores 211 are arranged in a plurality of rows in a circular arrangement or array in the micropore area 210.
Fig. 3 shows a longitudinal sectional view before the first piezoelectric ceramic 100 and the metal diaphragm 200 are bonded, fig. 4 shows a longitudinal sectional view after the first piezoelectric ceramic 100 and the metal diaphragm 200 are bonded, and as can be seen from fig. 3 and 4, a height H1 of the edge-covering part 120 is greater than a height H2 of the main body part 110, a part of the edge-covering part 120 higher than the main body part 110 and the main body part 110 together enclose a containing space 130, and the metal diaphragm 200 is adhered to the main body part 110 of the first piezoelectric ceramic 100 and is located in the containing space 130 of the first piezoelectric ceramic 100. As shown in fig. 3 and 4, a difference Δ H1 between the height H1 of the brim part 120 and the height H2 of the main body part 110 is a depth of the accommodating space 130, and the depth of the accommodating space 130 is greater than the thickness H3 of the metal diaphragm 200. It is understood that in other embodiments, the depth of the accommodating space 130 may also be equal to the thickness H3 of the metal film 200, and the upper surface of the metal film 200 is flush with the upper surface of the edge-covering part 120. Note that the height H1 of the brim part 120 refers to the dimension of the brim part 120 in the thickness direction of the first piezoelectric ceramic 100, and the height H2 of the body part 110 refers to the dimension of the body part 110 in the thickness direction of the first piezoelectric ceramic 100.
After receiving the driving signal, the first piezoelectric ceramic 100 vibrates at a high speed with a predetermined frequency and drives the metal diaphragm 200 to perform a high-speed bending motion with the same frequency, and the bending motion can generate a large enough extrusion force on the atomized liquid in each micro-hole 211, so as to break the atomized liquid into fine particles, and throw the fine particles away from the surface of the metal diaphragm 200 to form atomized steam, and the direction of the extruded and discharged atomized steam is shown by an arrow in fig. 4. In addition, as shown in fig. 3 and 4, the micropore area 210 of the metal membrane 200 is recessed towards the first hollow-out area 111 to form a groove portion 220, and the micropores 211 are disposed in the groove portion 220, so that the atomized liquid can be more dispersed when being extruded and discharged. Additionally, in particular embodiments, the shape of the microwells 211 may be conical, rectangular, or cylindrical; in a preferred embodiment, the pores 211 are tapered, and the pore diameter of the end of the pore 211 close to the first piezoelectric ceramic 100 is smaller than the pore diameter of the end of the pore 211 far from the first piezoelectric ceramic 100, that is, the pore diameter of the pore 211 decreases in the direction in which the atomized liquid is extruded, so that when the atomized liquid is extruded and discharged through the tapered pores 211, the atomized liquid is further extruded, and when the atomized liquid is extruded and discharged, the liquid drops are broken up to be smaller, and the discharge speed is higher. In addition, the shape of the groove portion 220 of the metal diaphragm 200 is not limited in the present invention, and in the embodiment shown in fig. 3 and 4, the shape of the groove portion 220 is a spherical surface, but it is understood that in other embodiments, the shape of the groove portion 220 may be a trapezoidal shape or the like.
In addition, in an embodiment, as shown in fig. 1, 3 and 4, a first glue overflow groove 140 is disposed on a surface of the first piezoelectric ceramic 100, to which the metal diaphragm 200 is attached, the first glue overflow groove 140 is located at an edge of the main body 110 of the first piezoelectric ceramic 100, and the first glue overflow groove 140 is located corresponding to an edge of the metal diaphragm 200, so as to prevent the adhesive glue from overflowing to a surface of the metal diaphragm 200, which is far away from the first piezoelectric ceramic 100, and improve the yield of the assembled microporous atomization sheet. In addition, the first glue overflow groove 140 can accommodate more adhesive glue, so that the adhesive strength between the metal diaphragm 200 and the first piezoelectric ceramic 100 is further improved, and the possibility of degumming is reduced. The first glue overflow groove 140 is annular. In other embodiments, the first glue overflow groove 140 may also be discrete dots, which are distributed on substantially the same circumference. Alternatively, the first glue overflow slots 140 may be arc slots separated from each other, and these arc slots may be distributed on substantially the same circumference.
In addition, in one embodiment, as shown in fig. 3, the width of the hem part 120 is W1, the width W1 is greater than or equal to 0.3mm and less than or equal to 2mm, the width of the first glue overflow groove 140 is W2, the width W2 is greater than or equal to 0.5mm and less than or equal to 2mm, the height of the first glue overflow groove 140 is H7, and the height H7 is greater than or equal to 0.3mm and less than or equal to 1 mm. It should be noted that the height H7 of the first glue overflow groove 140 refers to the dimension of the first glue overflow groove 140 along the thickness direction of the first piezoelectric ceramic 100, the width W1 of the edge-covering part 120 refers to the dimension of the edge-covering part 120 along the radial direction of the first piezoelectric ceramic 100, and the width W2 of the first glue overflow groove 140 refers to the dimension of the first glue overflow groove 140 along the radial direction of the first piezoelectric ceramic 100. In addition, in the embodiment shown in fig. 3, the longitudinal cross-sectional shape of the first glue overflow groove 140 is a rectangle, and it is understood that in other embodiments, the longitudinal cross-sectional shape of the first glue overflow groove 140 may also be an inverted triangle, a semicircle, or the like, and the groove diameter of the end of the first glue overflow groove 140 close to the metal membrane 200 is larger than the groove diameter of the end far away from the metal membrane 200.
In another embodiment, as shown in fig. 5 and 6, the number of the first glue overflow grooves 140 is two, wherein one first glue overflow groove 140 is located at the edge of the main body 110 of the first piezoelectric ceramic 100 and corresponds to the edge of the metal diaphragm 200, so as to prevent the adhesive glue from overflowing to the surface of the metal diaphragm 200 away from the first piezoelectric ceramic 100; another first glue overflow groove 140 is located at a position of the first piezoelectric ceramic 100 close to the first hollow-out region 111 to prevent the adhesive glue from overflowing to the micro-hole region 210 of the metal membrane 200 to block the micro-holes 211. In the embodiment shown in fig. 5 and 6, two first glue overflow grooves 140 can accommodate more glue, and the two first glue overflow grooves 140 are spaced apart, so that the bonding strength between the metal diaphragm 200 and the first piezoelectric ceramic 100 can be further improved, and the edge or the micro-hole area 210 of the metal diaphragm 200 can be prevented from being separated from the first piezoelectric ceramic 100. It is understood that, in other embodiments, only one first glue overflow groove 140 may be disposed on the first piezoelectric ceramic 100, and the first glue overflow groove 140 is located at a position of the first piezoelectric ceramic 100 close to the first hollow-out area 111 to prevent the adhesive glue from overflowing to the micro-hole area 210 of the metal membrane 200 to block the micro-holes 211. In addition, it is understood that, in other embodiments, the number of the first glue overflow grooves 140 may also be more than two.
In another embodiment, as shown in fig. 7, 8 and 9, wherein fig. 7 is a schematic diagram of an explosion structure of the microporous atomization sheet, as seen from fig. 7, the microporous atomization sheet further includes a second piezoelectric ceramic 300, and the metal membrane 200 is located between the first piezoelectric ceramic 100 and the second piezoelectric ceramic 300, that is, one surface of the metal membrane 200 is adhered to the main body 110 of the first piezoelectric ceramic 100, and the other surface is adhered to the second piezoelectric ceramic 300. The first piezoelectric ceramic 100 and the second piezoelectric ceramic 300 vibrate in the same direction and are synchronized in frequency, thereby generating resonance, and increasing the atomization amount. A longitudinal sectional view before the first piezoelectric ceramic 100, the metal diaphragm 200, and the second piezoelectric ceramic 300 are bonded is shown in fig. 8, a longitudinal sectional view after the first piezoelectric ceramic 100, the metal diaphragm 200, and the second piezoelectric ceramic 300 are bonded is shown in fig. 9, and as can be seen from fig. 7 to 9, a second hollow area 310 is formed at a central portion of the second piezoelectric ceramic 300, a position of the second hollow area 310 corresponds to a position of the micropore area 210 of the metal diaphragm 200 and a position of the first hollow area 111 of the first piezoelectric ceramic 100, the micropore area 210 of the metal diaphragm 200 is recessed toward the first hollow area 111 of the first piezoelectric ceramic 100 to form a groove portion 220, and the micropore 211 is disposed in the groove portion 220.
In addition, as shown in fig. 8 and 9, the thickness of the second piezoelectric ceramic 300 is H4, the thickness of the edge-covering portion 120 of the first piezoelectric ceramic 100 is H5, the thickness of the main body portion 110 of the first piezoelectric ceramic 100 is H6, the thickness of the metal diaphragm 200 is H3, a difference Δ H2 between the height H5 of the edge-covering portion 120 and the height H6 of the main body portion 110 is the depth of the accommodating space 130, and the sum of the thickness H3 of the metal diaphragm 200 and the thickness H4 of the second piezoelectric ceramic 300 is smaller than the depth of the accommodating space 130, so that both the second piezoelectric ceramic 300 and the metal diaphragm 200 are accommodated in the accommodating space 130. It is understood that in other embodiments, the sum of the thickness H3 of the metal diaphragm 200 and the thickness H4 of the second piezoelectric ceramic 300 may be equal to the depth of the receiving space 130, and the upper surface of the second piezoelectric ceramic 300 is flush with the upper surface of the surrounding portion 120 of the first piezoelectric ceramic 100. Alternatively, in other embodiments, the sum of the thickness H3 of the metal diaphragm 200 and the thickness H4 of the second piezoelectric ceramic 300 is less than or equal to the depth of the accommodating space 130, the metal diaphragm 200 is completely accommodated in the accommodating space 130, and at least a portion of the second piezoelectric ceramic 300 is accommodated in the accommodating space 130. Still alternatively, in other embodiments, the thickness H3 of the metal membrane 200 is equal to the depth of the accommodating space 130, that is, the upper surface of the metal membrane 200 is flush with the upper surface of the edge-covering part 120, and at this time, the second piezoelectric ceramic 300 is located above the accommodating space 130. When the second piezoelectric ceramic 300 is located above the accommodating space 130, the radial size of the second piezoelectric ceramic 300 is not limited, and may be larger than the radial size of the accommodating space 130, or smaller than or equal to the radial size of the accommodating space 130.
In addition, as shown in fig. 8 and 9, an annular first glue overflow groove 140 is formed in a surface of the first piezoelectric ceramic 100, which is adhered to the metal diaphragm 200, and the first glue overflow groove 140 is located at a position of the first piezoelectric ceramic 100, which is close to the first hollow-out region 111, so as to prevent the adhesive glue from overflowing to the micro-hole region 210 of the metal diaphragm 200 and blocking the micro-holes 211; an annular second glue overflow groove 320 is formed in the surface, to which the second piezoelectric ceramic 300 is adhered, of the metal diaphragm 200, the second glue overflow groove 320 corresponds to the first glue overflow groove 140 and is located at a position, close to the second hollow area 310, of the second piezoelectric ceramic 300, so that the bonding glue is prevented from overflowing to the micropore area 210 of the metal diaphragm 200 and blocking the micropores 211. It is understood that, in another embodiment, the first glue overflow groove 140 may be located at an edge position of the main body 110 of the first piezoelectric ceramic 100, and the second glue overflow groove 320 is located at an edge position of the second piezoelectric ceramic 300 corresponding to the position of the first glue overflow groove 140. Or, in other embodiments, the positions of the second glue overflow groove 320 and the first glue overflow groove 140 may not correspond to each other, that is, the first glue overflow groove 140 may be located at a position of the first piezoelectric ceramic 100 close to the first hollow-out area 111, and the second glue overflow groove 320 is located at an edge position of the second piezoelectric ceramic 300; alternatively, the first glue overflow groove 140 may be located at an edge of the main body 110 of the first piezoelectric ceramic 100, and the second glue overflow groove 320 is located at a position of the second piezoelectric ceramic 300 close to the second hollow area 310.
In addition, it is understood that, in other embodiments, two first glue overflow grooves 140 may be disposed on the first piezoelectric ceramic 100, one first glue overflow groove 140 is located at an edge of the main body portion 110 of the first piezoelectric ceramic 100, and the other first glue overflow groove 140 is located at a position of the first piezoelectric ceramic 100 close to the first hollow-out area 111. Two second glue overflow grooves 320 may also be disposed on the second piezoelectric ceramic 300, one second glue overflow groove 320 is located at the edge of the second piezoelectric ceramic 300, and the other second glue overflow groove 320 is located at a position of the second piezoelectric ceramic 300 close to the second hollow area 310. In this way, the metal diaphragm 200 can be more effectively prevented from being detached from the first piezoelectric ceramic 100 or the second piezoelectric ceramic 300.
In one embodiment, the atomizing device 10 is configured as shown in fig. 10, and includes an atomizing liquid container 20, a microporous atomizing sheet 30, and a vibrator 40, wherein both the atomizing liquid container 20 and the vibrator 40 are connected to the microporous atomizing sheet 30, and the atomizing liquid container 20 stores the atomizing liquid therein. When the atomization device 10 works, the atomized liquid is guided into the micropore atomization plate 30, and the vibrator 40 drives the micropore atomization plate 30 to vibrate at high frequency, so that the atomized liquid in the micropore atomization plate 30 is broken into atomized vapor.
According to the micropore atomization sheet and the atomization device, the metal membrane 200 is arranged in the containing space 130 formed by the surrounding part 120 of the first piezoelectric ceramic 100 and the main body part 110, the first piezoelectric ceramic 100 is hard in material and is not easy to deform under stress, so that the metal membrane 200 is not easy to be affected by external force, and the problem that the metal membrane 200 and the piezoelectric ceramic are easy to degum is solved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (13)
1. A microporous atomizing sheet, comprising:
the first piezoelectric ceramic comprises a main body part and a wrapping part, wherein the wrapping part surrounds the main body part; the height of the edge wrapping part is greater than that of the main body part, the part of the edge wrapping part, which is higher than the main body part, and the main body part enclose together to form an accommodating space, and a first hollow-out area is arranged on the main body part; and
the metal diaphragm is pasted on the main body part of the first piezoelectric ceramics and is positioned in the accommodating space of the first piezoelectric ceramics, a micropore area is arranged on the metal diaphragm, the position of the micropore area corresponds to the first hollow area, and more than one micropore is arranged in the micropore area.
2. The microporous atomizing sheet of claim 1, wherein the height difference between the edge covering portion and the main body portion is a depth of the accommodating space, and the depth of the accommodating space is greater than or equal to the thickness of the metal membrane.
3. The microporous atomizing sheet of claim 1, wherein the micropores are tapered, rectangular, or cylindrical in shape; when the shape of the micropore is conical, the aperture of the micropore close to one end of the first piezoelectric ceramic is smaller than that of the micropore far away from one end of the first piezoelectric ceramic.
4. The microporous atomizing sheet of claim 1, wherein the micropore area of the metal membrane is recessed toward the first hollow area to form a recessed portion, and the micropores are disposed in the recessed portion.
5. A microporous atomizing sheet according to claim 4, wherein said recessed portions are spherical or trapezoidal.
6. The microporous atomizing sheet of claim 1, wherein at least one first glue overflow groove is formed on the surface of the first piezoelectric ceramic, which is adhered to the metal membrane.
7. The microporous atomizing sheet of claim 6, wherein the edge of the first piezoceramic body portion corresponds to the edge of the metal diaphragm; the edge of the first piezoelectric ceramic main body part and/or the position of the first piezoelectric ceramic close to the first hollow area are/is provided with the first glue overflow groove.
8. The microporous atomizing sheet of claim 1, further comprising a second piezoelectric ceramic, wherein one surface of the metal diaphragm is bonded to the body portion of the first piezoelectric ceramic, and the other surface is bonded to the second piezoelectric ceramic.
9. The microporous atomizing sheet of claim 8, wherein the second piezoelectric ceramic is located above the receiving space; or at least one part of the second piezoelectric ceramics is accommodated in the accommodating space.
10. The microporous atomizing sheet of claim 9, wherein the difference in height between the edge-wrapping portion and the main body portion is the depth of the accommodating space, and the sum of the thickness of the metal membrane and the thickness of the second piezoelectric ceramic is less than or equal to the depth of the accommodating space.
11. The microporous atomizing sheet of claim 8, wherein at least one second glue overflow groove is formed on the surface of the second piezoelectric ceramic adhered to the metal membrane.
12. The microporous atomizing sheet according to claim 11, wherein a second hollow-out region is disposed in the second piezoelectric ceramic at a position corresponding to the first hollow-out region; the edge of the second piezoelectric ceramic corresponds to the edge of the metal diaphragm; and the edge of the second piezoelectric ceramic and/or the position of the second piezoelectric ceramic, which is close to the second hollow area, is provided with the second glue overflow groove.
13. An atomizing device comprising the microporous atomizing sheet of any one of claims 1 to 12.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113714022A (en) * | 2021-09-26 | 2021-11-30 | 佛山市科日压电器件有限公司 | Laminated atomizing sheet and atomizing equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113714022A (en) * | 2021-09-26 | 2021-11-30 | 佛山市科日压电器件有限公司 | Laminated atomizing sheet and atomizing equipment |
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| CN117884297B (en) * | 2024-03-15 | 2024-06-04 | 桐乡清锋科技有限公司 | Composite piezoelectric ceramic microporous atomizing sheet |
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| CN113262923B (en) | 2023-11-28 |
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