CN113218961B - A substrate defect detection device and method - Google Patents

Abstract

The invention relates to a substrate defect detection device and method. The substrate defect detection device includes a support frame, an illumination and photographing module, a substrate module and a control system; the support frame includes a hemispherical shell, a base and a connecting section, and the hemispherical shell passes through the connecting section It is installed on the base; the connecting section is provided with a film feeding window, and the hemispherical shell is uniformly provided with a plurality of mounting holes, and the axis of each mounting hole is set to pass through the center of the hemispherical shell; the film bearing module is installed on the base for The substrate to be inspected is stably carried; the lighting and photographing module can realize the illumination and photographing of the substrate to be inspected on the substrate module; the control system is used for signal acquisition, data processing and linkage control of the illumination and photographing module and the substrate module. Based on the basic principle of scattering imaging, the present invention adopts omni-directional multi-field illumination and shooting to detect substrate defects, realizes omni-directional multi-field lighting and shooting, and makes up for the deficiencies of scattering imaging methods in accurate detection of substrate defects.

Description

A substrate defect detection device and method

technical field

The invention relates to the technical field of chip defect detection, in particular to a substrate defect detection device and method.

Background technique

After decades of development, the substrate defect detection technology based on scattering imaging method has developed a number of technical routes:

(1) Oblique incidence (Oblique Incidence) scattering imaging. The oblique incidence scattering imaging method is to obliquely incident the illumination beam from the periphery of the imaging objective lens on the surface of the substrate, and the scattered light is collected by the detector through the imaging objective lens to detect defects. KLA of the United States (US Patent: 8605275), Hitachi of Japan (US Patent: 9933370), and Zhongke Feice (Chinese Patent: 201810954898.4) have all studied a series of defect detection systems and methods based on this principle.

(2) Dark field (Dark Field) microscopic imaging, the illumination beam of dark field microscopic imaging enters from the inner outer ring through hole of the imaging objective lens, and then irradiates evenly on the surface of the substrate through reflection, and the scattered light returns from the middle of the objective lens to the detector. American Kelei (KLA) (US Patent: 19726615) and University of Shanghai for Science and Technology (Chinese Patent: 201611167202) have carried out research on defect detection systems and methods based on the principle of dark-field microscopic imaging.

(3) Combination mode imaging. Combination mode imaging is mainly to combine different illumination methods and different signal acquisition methods. On the one hand, uniform illumination is used to improve the integrity of defect information; Field imaging for defect identification. In order to take into account the detection efficiency and the integrity of defect information as much as possible, the researchers proposed a scattering imaging method with multiple combination modes: 1) Normal incidence and oblique incidence illumination, scattering imaging (US Patent: 6590645); 2) Normal incidence and oblique incidence Incident illumination, coaxial brightfield imaging and diffuse imaging (US Patent: 9053390). 3) Oblique incident illumination, reflection brightfield imaging and scattering imaging (US patent: 20160150191). 4) Normal incidence and oblique incidence illumination, coaxial bright field imaging, reflection bright field imaging and scattering imaging (US patent: 10551320).

The scattering imaging method is the most sensitive to defect information, but in order to balance the detection efficiency and the integrity of defect information, only the combined imaging mode can be selected for substrate defect detection, even at the expense of the advantages of scattering imaging. The intensity of scattered energy is directly related to the scattering angle. Traditional single-field lighting and shooting can only collect local information of energy field defects, but cannot completely obtain defect information, and thus cannot accurately identify the size and type of defects. Field lighting and shooting methods will effectively solve related problems.

Contents of the invention

The technical problem to be solved in the present invention is to propose a substrate defect detection device and method. The present invention is based on the basic principle of scattering imaging, and adopts omnidirectional multi-field lighting and shooting methods to detect substrate defects and realize all-round multi-field detection. Field illumination and shooting make up for the deficiency of the scattering imaging method in the accurate detection of substrate defects.

The technical solution of the present invention is: a substrate defect detection device, including a support frame, an illumination and photographing module, a substrate module and a control system;

The support frame includes a hemispherical shell, a base and a connecting section, the hemispherical shell is set on the base through the connecting section; the connecting section is provided with a sheet feeding window, and the hemispherical shell is evenly provided with a plurality of installation holes , the axis of each mounting hole is set to pass through the center of the hemispherical shell;

The carrier module is installed on the base for stably bearing the substrate to be detected;

The lighting and shooting module includes at least one central lighting and shooting module located in the central area of the hemispherical shell and at least one peripheral lighting and shooting module located on the periphery of the central area of the hemispherical shell, and a plurality of the lighting and shooting modules are respectively installed on On the plurality of installation holes of the hemispherical shell, the lighting and shooting module can realize lighting and shooting of the substrate to be detected on the receiving module;

The control system is used for signal acquisition, data processing and linkage control of the lighting and photographing module and the film receiving module.

Further, the illumination and photographing module includes a detector, an illumination light source, a spectroscopic lens tube, a locking ring, a lens tube lens and an imaging objective lens, and the illumination and photographing module is installed on the mounting hole through the locking ring, so The detector, the illumination light source and the lens tube lens are installed on the spectroscope tube, and the imaging objective lens is connected with the lens tube lens.

Further, the imaging objective lens is an infinity objective lens; the lens tube lens is matched with the detector, the illumination light source and the imaging objective lens.

Further, the substrate module includes a translation platform and a suction cup, the translation platform is arranged on the base, and the suction cup is arranged on the translation platform and is used for absorbing the substrate to be detected.

Further, the translation platform is a six-axis translation platform; the control system is used for signal acquisition, data processing and linkage control of the detector, the illumination source and the axial translation platform.

Further, the control system of the substrate defect detection device is used to cooperatively control the lighting and photographing module and the substrate module, so as to realize the analysis and processing of the scattering characteristics of the substrate to be detected on the substrate module, the omni-directional signal acquisition processing, and the defect identification processing or splicing detection processing.

Further, in the process of analyzing the scattering characteristics, the at least one peripheral lighting and shooting module is controlled to turn on the lighting function sequentially, and the at least one central lighting and shooting module is controlled to turn on the shooting function and collect images, which are used to analyze different lighting conditions. Scattered energy intensity information of defects on the substrate to be detected.

Further, during the omnidirectional signal acquisition and processing process, the at least one central lighting and shooting module is controlled to turn on the lighting function, and the at least one peripheral lighting and shooting module is controlled to turn on the shooting function at the same time, so as to analyze the defects on the substrate to be detected. Angular scattered energy intensity information.

Further, in the process of defect identification, the illumination function and the photographing function of multiple illumination and photographing modules are switched based on the detection requirements, the collected images are analyzed and the particles, pits, scratches and defects on the upper surface of the substrate to be detected are analyzed. and/or water stain defects are identified.

Further, during the splicing detection process, the control system is used to cooperatively control the substrate module and the multiple illumination and shooting modules, so as to realize the defect splicing detection of the entire substrate to be detected.

The beneficial effects of the present invention are:

1. The device arranges multi-channel lighting and shooting modules based on a spherical surface, realizes all-round multi-field lighting and shooting, and makes up for the shortcomings of the scattering imaging method in the accurate detection of substrate defects.

2. Lighting and shooting modules with the same or different performance indicators can be configured at different positions on the hemispherical shell of the device. During work, the lighting or shooting functions of any lighting and shooting module can be turned on or off, so as to realize lighting and shooting in any combination.

3. Based on the device, the scattered energy intensity information of defects under different lighting conditions can be analyzed, and then the scattering characteristics of defects can be obtained. Based on the device, the scattered energy intensity information of each dimension of the defect can be analyzed, and the defect characteristics can be collaboratively analyzed based on the multi-dimensional scattered energy intensity information. Based on this device, the images collected by various channels can be comprehensively analyzed, and then the defects such as particles, pits, scratches, water stains and other defects on the substrate surface can be efficiently and accurately identified.

4. Based on the device, the control system can coordinately control the receiving module and the lighting and shooting module, thereby realizing efficient splicing detection of the entire substrate defect.

Description of drawings

FIG. 1 is a schematic diagram of the overall structure of a substrate defect detection device of the present invention;

Fig. 2 is a schematic diagram of a support frame structure of a substrate defect detection device of the present invention;

Fig. 3 is a structural schematic diagram of an illumination and photographing module of a substrate defect detection device of the present invention;

FIG. 4 is a schematic structural diagram of a substrate module of a substrate defect detection device of the present invention.

Reference signs:

1-support frame, 1-1-hemispherical shell, 1-2-base, 2-illumination and shooting module, 2-1-detector, 2-2-illumination source, 2-3-beam splitter tube, 2-4 -locking ring, 2-5-tube lens, 2-6-imaging objective lens, 2-7-defect feature, 3-support module, 3-1-six-axis translation stage, 3-2-suction cup, 3- 3-substrate to be tested, 4-control system.

Detailed ways

In order to make the purpose, technical solution and advantages of the device of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.

Regardless of the Rayleigh scattering theory or the Mie scattering theory, the intensity of scattered energy is directly related to the scattering angle. Using traditional single-field lighting and shooting, only local information of defects in the energy field can be collected, and complete defect information cannot be obtained. The size and type of defect cannot be accurately identified. During single-field lighting, the scattering angles of defects at different spherical positions are different, and the intensity of scattered energy obtained at different spherical positions will also be different. Therefore, single-field lighting and shooting cannot obtain complete information about defects. The omnidirectional multi-field lighting and shooting method of the present invention will effectively solve related problems. The device is based on a spherical arrangement of multiple lighting and shooting modules, which realizes all-round multi-field lighting and shooting, and makes up for the shortcomings of the scattering imaging method in the accurate detection of substrate defects.

Referring to Figures 1-4, the device includes a support frame 1 for integrating the lighting and shooting module and the film receiving module; the lighting and shooting module 2 for realizing omnidirectional multi-field lighting and shooting; and the substrate installation and position adjustment and a control system 4 for signal acquisition, data processing and linkage control of detectors, illumination sources and translation stages. The lighting and shooting module 2 is installed on the mounting hole of the hemispherical shell 1-1 of the support frame 1 through the locking ring 2-4, and the receiving module 3 is installed on the base 1-2 of the support frame 1 through the six-axis displacement table 3-1 superior.

1-2, the support frame 1 of the device includes a hemispherical shell 1-1 and a base 1-2, and the hemispherical shell 1-1 is installed on the base 1-2 through a connecting section. The connecting section is integrally or detachably arranged on the edge of the hemispherical shell 1-1, and the connecting section is provided with a film delivery window, which can be a rectangular window, and a sliding door is provided outside the window, which can effectively prevent light leakage after closing the door. The inner wall of the hemispherical shell 1-1 is dyed black, which can effectively absorb the light source and avoid stray light. The hemispherical shell 1-1 is uniformly provided with a plurality of mounting holes for mounting the lighting and photographing modules 2; the axis of each mounting hole passes through the center of the sphere. In this embodiment, the same number of mounting holes are set on different latitude planes, and the angles between adjacent mounting holes on the same latitude plane are equal. For example, in this embodiment, the angle between adjacent lighting and camera modules on the same latitude plane is 60°. Although the greater the number of installation holes on the same latitude plane, the more comprehensive the defect information obtained by omni-directional multi-field lighting and shooting, but those skilled in the art need to conduct light field analysis according to the detection requirements to determine the number of installation holes and the number of installation holes at the same latitude. The size of the included angle between adjacent mounting holes on the surface, and at the same time, spatial interference between adjacent lighting and the camera module 2 should be avoided.

1 and 3, the illumination and photographing module 2 of the device includes a detector 2-1, an illumination light source 2-2, a beam splitter tube 2-3, a locking ring 2-4, a lens tube lens 2-5, an imaging The objective lens 2-6, wherein the detector 2-1, the illumination source 2-2 and the lens tube lens 2-5 are installed on the spectroscopic lens tube 2-3, and the imaging objective lens 2-6 is connected with the lens tube lens 2-5. The lighting and photographing module 2 is installed on the hemispherical shell 1-1 and the installation hole of the support frame 1 through the locking ring 2-4. The components of the entire lighting and shooting module 2 need to be selected according to the lighting wavelength, detection field of view, resolution and installation layout; the detector 2-1 should meet the requirements of imaging field of view, resolution, sensitivity and signal-to-noise ratio; the lighting The light source 2-2 should meet the requirements of illumination area, collimation, uniformity and light intensity; the imaging objective lens 2-6 must be an infinity objective lens, which can be customized or standard objective lens; -1. The illuminating light source 2-2 matches the imaging objective lens 2-6. The lighting and photographing module 2 includes at least one central lighting and photographing module 2 located in the central area of the hemispherical shell 1-1 and at least one peripheral illuminating and photographing module 2 located at the periphery of the central area of the hemispherical shell 1-1. The illuminating and photographing module 2 can realize Illumination and shooting of the substrate 3-3 to be detected on the substrate module 3;

With reference to Fig. 4, the chip bearing module 3 of this device comprises six-axis displacement table 3-1, suction cup 3-2 and substrate 3-3 to be tested, wherein suction cup 3-2 is installed on the six-axis displacement table 3-1, to be The detection substrate 3-3 is adsorbed on the suction cup 3-2. The six-axis translation stage 3-1 should meet the stroke and accuracy requirements of step detection, attitude adjustment, detection focus and substrate thickness compatibility, etc. The suction cup 3-2 should be compatible with different specifications and sizes of substrates to be detected 3-3 Install.

The device is based on a spherical arrangement of multiple lighting and shooting modules 2, which realizes omnidirectional multi-field lighting and shooting, and makes up for the shortcomings of the scattering imaging method in the accurate detection of substrate defects. Based on the detection method of the substrate defect detection device, the control system 4 receives user instructions and sends control signals to the lighting and shooting modules 2 located on different latitude layers, so that when the central lighting and the shooting module 2 are illuminated, the peripheral lighting and the shooting module 2 are connected. Signal collection; or when the central lighting and the shooting module 2 illuminate, the central lighting and the shooting module 2 perform signal collection, thereby realizing different forms of lighting and shooting modes. Of course, those skilled in the art can set and select lighting and photographing modules 2 with different performance indicators to be arranged at different positions according to the needs of use.

The following are some typical working modes and functions:

(a) Scattering characteristic analysis: the control system 4 receives user instructions, and controls the central lighting and shooting module 2 directly above the substrate to only turn on the shooting function, and the lighting and shooting modules 2 at other positions turn on the lighting functions in turn. The lighting and photographing module 2 directly above collects the scattering intensity information obtained from different lighting angles. The control system 4 obtains the characteristics of defects under surrounding lighting conditions after processing the signal data sent back by the lighting and shooting module 2 directly above;

(b) Omni-directional signal collection: the control system 4 receives user instructions, controls the central lighting and shooting module 2 directly above the substrate to turn on the lighting function, and the lighting and shooting modules 2 at other positions turn on the shooting function at the same time. The illumination and photographing module 2 of different azimuth angles collects the scattering intensity information obtained from the illumination directly above that is scattered by the defect. The control system 4 processes the signal data returned by the illumination and the camera module 2 at different azimuth angles, and obtains the characteristics of the defects under the illumination directly above and the scattering conditions at different azimuth angles after processing, and then can conduct collaborative analysis based on multi-dimensional scattering energy intensity information defect characteristics;

(c) Defect identification: the control system 4 receives user instructions, and those skilled in the art can switch the lighting and shooting functions of all lighting and shooting modules 2 according to the detection strategy as needed, enable the lighting and shooting modules 2 with the shooting function, and collect defect scatter The energy obtained from the lighting and shooting module 2 with the lighting function enabled, and the collected signal is transmitted back to the control system 4, and through the comprehensive analysis of the control system 4, the particles and pits on the substrate surface with different scattering intensity information , scratches, water stains and other defects for efficient and accurate identification.

(d) Splicing detection: the control system 4 cooperates to control the substrate module 3 and the lighting and photographing module 2 to realize defect splicing detection of the entire substrate. When detecting a substrate with a large area, the control system 4 realizes the movement of the detection area of the substrate by controlling the six-axis translation stage 3-1, and the six-axis translation stage 3-1 moves the area to be detected of the substrate to the hemispherical shell 1 -1 ball center, select any mode in the above (a)-(c) to detect as required, and the control system 4 stores the collected signal and the processed result to complete the detection of a region to be detected; then recirculate The previous detection step is carried out until the detection of the substrate is completed; after the detection is completed, the control system 4 splices the stored detection images, integrates the detection results, and obtains the detection results of the entire large-area substrate.

Using the above-mentioned device of the present invention to perform multi-mode detection, compared with the traditional technology, it can more conveniently analyze the scattering energy intensity information of defects under different lighting conditions, and then analyze the scattering characteristics of defects. It can effectively increase the intensity of defect scattering energy, so as to detect defects more accurately. It can analyze the scattered energy intensity information of each dimension of the defect, so as to obtain more accurate defect profile information and more effectively distinguish different types of defects.

The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person familiar with the technology within the technical scope disclosed in the present invention can understand that any transformation or replacement conceivable is covered by the scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.

Claims (10)

1. A substrate defect detection device, characterized in that it includes a support frame (1), an illumination and photographing module (2), a substrate module (3) and a control system (4); The support frame (1) includes a hemispherical shell (1-1), a base (1-2) and a connecting section, and the hemispherical shell (1-1) is arranged on the base (1-2) through the connecting section; The connecting section is provided with a sheet-feeding window, and the hemispherical shell (1-1) is evenly provided with a plurality of mounting holes, and the axis of each mounting hole is set to pass through the hemispherical shell (1-1). Center of the ball; The support module (3) is installed on the base (1-2), and is used to stably carry the substrate to be detected (3-3); The lighting and shooting module (2) includes at least one central lighting and shooting module (2) located in the central area of the hemispherical shell (1-1) and at least one peripheral lighting located on the periphery of the central area of the hemispherical shell (1-1) and the photographing module (2), a plurality of the lighting and photographing modules (2) are respectively installed on the plurality of mounting holes of the hemispherical shell (1-1), and the lighting and photographing modules (2) can realizing the illumination and photographing of the substrate to be detected (3-3) on the substrate module (3); The control system (4) receives user instructions, and switches the lighting and shooting functions of all lighting and shooting modules (2) according to the detection strategy as needed, and the control system (4) can control the lighting and shooting modules (2) on different latitude layers Switch between the lighting function and the camera function, so that when the central lighting and the shooting module (2) illuminate, the peripheral lighting and the shooting module (2) perform signal collection; or when the peripheral lighting and the shooting module (2) illuminate, the central lighting and the shooting module (2) Carry out signal acquisition, and then realize different forms of lighting and shooting modes. 2. The substrate defect detection device according to claim 1, characterized in that: the illumination and photographing module (2) includes a detector (2-1), an illumination light source (2-2), a beam splitter tube (2 -3), locking ring (2-4), lens tube lens (2-5) and imaging objective lens (2-6), the illumination and shooting module (2) is installed on the locking ring (2-4) On the installation hole, the detector (2-1), the illumination light source (2-2) and the lens tube lens (2-5) are installed on the spectroscope tube (2-3), The imaging objective lens (2-6) is connected with the lens barrel lens (2-5). 3. The substrate defect detection device according to claim 2, characterized in that: the imaging objective lens (2-6) is an infinity objective lens; the barrel lens (2-5) and the detector (2 -1), the illumination light source (2-2) is matched with the imaging objective lens (2-6). 4. The substrate defect detection device according to claim 3, characterized in that: the substrate module (3) includes a displacement stage (3-1) and a suction cup (3-2), and the displacement stage is arranged on the On the base (1-2), the suction cup (3-2) is arranged on the displacement table (3-1) and is used to absorb the substrate (3-3) to be detected. 5. The substrate defect detection device according to claim 4, characterized in that: the translation stage (3-1) is a six-axis translation stage; the control system (4) is used for the detector (2- 1) Signal acquisition, data processing and linkage control of the illumination light source (2-2) and the six-axis translation stage (3-1). 6. The detection method based on the substrate defect detection device according to any one of claims 1 to 5, characterized in that: using the control system (4) of the substrate defect detection device to cooperatively control the lighting and photographing modules (2) and the carrier module (3), to realize the analysis and processing of scattering characteristics, all-round signal acquisition processing, defect identification processing or splicing detection processing of the substrate to be detected (3-3) on the carrier module (3). 7. The detection method of the substrate defect detection device according to claim 6, characterized in that: during the scattering characteristic analysis process, the at least one peripheral lighting and shooting module (2) is controlled to turn on the lighting function sequentially, and the said At least one central lighting and shooting module (2) turns on the shooting function and collects images, and the images are used to analyze the scattered energy intensity information of defects on the substrate (3-3) to be detected under different lighting conditions. 8. The detection method of the substrate defect detection device according to claim 6, characterized in that: during the omni-directional signal acquisition process, control the at least one central lighting and shooting module (2) to turn on the lighting function, control the At least one peripheral lighting and the shooting module (2) simultaneously start the shooting function, and are used for analyzing the scattered energy intensity information of defects on the substrate (3-3) to be detected. 9. The detection method of the substrate defect detection device according to claim 6, characterized in that: during the defect recognition process, the lighting function and the shooting function of a plurality of the lighting and shooting modules (2) are switched based on the detection requirements, The collected images are analyzed and defects of particles, pits, scratches and/or water stains on the upper surface of the substrate to be inspected (3-3) are identified. 10. The detection method of the substrate defect detection device according to claim 6, characterized in that: during the splicing detection process, the control system (4) is used to cooperatively control the wafer carrier module (3) and multiple The lighting and photographing module (2) realizes defect splicing detection of the entire substrate to be detected (3-3).