CN113211664A - TAIKO ring taking device and method - Google Patents
TAIKO ring taking device and method Download PDFInfo
- Publication number
- CN113211664A CN113211664A CN202110467417.9A CN202110467417A CN113211664A CN 113211664 A CN113211664 A CN 113211664A CN 202110467417 A CN202110467417 A CN 202110467417A CN 113211664 A CN113211664 A CN 113211664A
- Authority
- CN
- China
- Prior art keywords
- ring
- taiko
- wafer
- gasket
- taking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000012528 membrane Substances 0.000 claims abstract description 21
- 238000000926 separation method Methods 0.000 claims abstract description 9
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 15
- 238000000605 extraction Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 abstract description 5
- 238000005086 pumping Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 36
- 238000010586 diagram Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a TAIKO ring taking device and a ring taking method, comprising the following steps: the ring taking workbench is surrounded with a gasket at the periphery of the ring taking workbench; the inner and outer rings of the gasket are provided with vacuum holes penetrating through the upper and lower surfaces thereof; the arm is used for centering the wafer; and an arm for removing the intrauterine device. Placing the wafer on a ring taking workbench; centering the wafer by using an arm; after vacuum pumping is carried out on the lower surface of the gasket through a vacuum hole of the gasket, the gasket is lifted, the TAIKO ring and the membrane are preliminarily separated through the pin ring, and the vacuum is released after separation; the washer is lowered, and the TAIKO ring is gripped by the jaws and removed. According to the invention, when a ring removing process is carried out on a wafer thinned by Taiko after ring cutting, a pin ring is added, and the wafer is lifted by different distances to separate a TAIKO ring from a membrane when TAIKO ring taking is carried out; meanwhile, a vacuum hole is added on the inner side of the ring, so that the TAIKO ring is further separated from the membrane, and the vacuum suction time is controlled according to different products; the purpose of membrane ring separation is achieved, and the stability of ring taking is improved.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a TAIKO ring removing device and a ring removing method.
Background
The 12-inch wafer is usually thinned in a TAIKO mode, and the TAIKO thinning can provide supporting force for the wafer and reduce the warping of the wafer; ring cutting and ring removing are used as one of important steps in the TAIKO wafer process, and the main function is to keep the integrity of the edge of the wafer and facilitate cutting and packaging; there are generally two types of circular cutting methods: blade cutting and laser cutting; the ring is generally taken by inserting a blade and taking the ring by lifting upwards and dropping downwards.
When the ring is taken out from the thin sheet or the ultrathin sheet, the ring-taking action is liable to cause instability to the wafer, and the thin sheet or the ultrathin sheet is liable to crack.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a TAIKO ring removing apparatus and a ring removing method, which are used to solve the problem of reducing damage to a wafer caused by ring removal when performing ring removal on a thin sheet or an ultra-thin sheet in the prior art.
To achieve the above and other related objects, the present invention provides a TAIKO ring extraction device, comprising: the ring taking workbench is surrounded with a gasket at the periphery of the ring taking workbench; the inner ring and the outer ring of the gasket are provided with vacuum holes penetrating through the upper surface and the lower surface of the gasket; a pin loop on the washer; the wafer fixing device comprises an iron ring for fixing a wafer, and the wafer carried by the iron ring and a film; the iron ring is arranged on the membrane; an arm for centering the wafer; clamping jaw for taking out ring
Preferably, the ring-taking workbench is used for bearing a wafer.
Preferably, the ring-removing workbench is circular in cross section.
Preferably, the gasket is a circular ring type, and is provided with a row of the vacuum holes every 45 ℃ in a radial direction thereof, and each row is provided with 5 vacuum holes.
The invention also provides a ring removing method by using the TAIKO ring removing device, which at least comprises the following steps:
step one, providing the TAIKO ring taking device, and placing a wafer borne by an iron ring and a film on a ring taking workbench; centering the wafer by using the arm;
secondly, vacuumizing the gasket to ensure that the position of the wafer is fixed, and lifting the gasket; the Pin ring contacts a TAIKO ring on the outer ring of the wafer to separate the TAIKO ring membrane; releasing vacuum after separation;
and step three, descending the gasket, clamping the TAIKO ring by using a clamping jaw, and taking away the TAIKO ring.
Preferably, the arm in step one fixes the wafer position by centering the TAIKO ring.
Preferably, the duration of the vacuum in the second step is 2-3 s.
Preferably, the washer is driven to lift 3-5um by programming and using a motor in the second step.
Preferably, the gasket is 5-10 μm in step three.
Preferably, in the third step, after the clamping jaws enter the junction between the workbench and the film and rotate for 140 degrees, the TAIKO ring is clamped.
As described above, the method for increasing the stability of TAIKO ring extraction according to the present invention has the following beneficial effects: according to the invention, when a ring removing process is carried out on a wafer subjected to Taiko thinning after ring cutting, a motor is added to drive the pin ring, and the TAIKO ring is separated from a membrane by lifting different distances when the wafer is subjected to TAIKO ring taking according to the type and thickness of a product; meanwhile, a vacuum hole is added on the inner side of the ring, so that the TAIKO ring is further separated from the membrane, and the vacuum suction time is controlled according to different products; the purpose of membrane ring separation is achieved, and the stability of ring taking is improved.
Drawings
FIG. 1 is a schematic view of the TAIKO annuloplasty device of the present invention in alignment;
FIG. 2 is a schematic diagram showing the separation of the ring-removing platform from the membrane according to the present invention;
FIG. 3 is a schematic view of the gripping jaw clamp of the present invention;
FIG. 4 is a schematic view showing the positional relationship between the loop removing stage and the pin loop in the present invention;
FIG. 5 is a schematic view of the arm position of the TAIKO device of the present invention;
figure 6 shows a schematic view of the structure of the clamping jaw of the invention.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 to 4. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
The invention provides a TAIKO ring taking device, which at least comprises: the ring taking workbench is surrounded with a gasket at the periphery of the ring taking workbench; the inner ring and the outer ring of the gasket are provided with vacuum holes penetrating through the upper surface and the lower surface of the gasket; a pin loop on the washer; the wafer fixing device comprises an iron ring for fixing a wafer, and the wafer carried by the iron ring and a film; the iron ring is arranged on the membrane; an arm for centering the wafer; clamping jaw for taking out ring
As shown in fig. 1, fig. 2 and fig. 3, fig. 1 is a schematic structural diagram of the TAIKO ring extractor of the present invention. FIG. 2 is a schematic diagram showing the separation structure of the ring-removing worktable and the membrane in the invention. Fig. 3 is a schematic view showing a structure of a clamping jaw for taking a ring in the invention.
The TAIKO ring removing device comprises a ring removing workbench 01 and a gasket 02 surrounding the periphery of the ring removing workbench in the embodiment; the inner ring and the outer ring of the gasket 02 are provided with vacuum holes 06 penetrating through the upper surface and the lower surface of the gasket; a pin loop 002 on the washer; an iron ring (FRAM) for holding the wafer 05, the wafer 05 carried by the iron ring FRAM and the film; the iron ring is arranged on the membrane 04; an arm 001 for centering the wafer; a clamping jaw 07 for removing a ring. FIG. 5 is a schematic view of the arm position of the TAIKO device of the present invention; figure 6 shows a schematic view of the structure of the clamping jaw of the invention.
Further, the ring-removing worktable of the embodiment is used for bearing the wafer. As shown in fig. 2, the wafer 05 is placed on the ring-removing table 01.
Further, the cross section of the ring removing workbench of the embodiment is circular. As shown in FIG. 4, FIG. 4 is a schematic diagram showing the position relationship between the loop-taking stage and the pin loop in the present invention. Therefore, the cross section of the ring-removing workbench 01 of the embodiment is circular. Further, as shown in fig. 4, the gasket of this embodiment is a circular ring type, and has a row of the vacuum holes 06 every 45 ℃ in the radial direction, and each row has 5 vacuum holes.
The invention also provides a ring removing method using the TAIKO ring removing device, which at least comprises the following steps:
step one, providing the TAIKO ring taking device, and placing a wafer borne by an iron ring and a film on a ring taking workbench; centering the wafer by using the arm; the gasket vacuum state is not opened at this time.
Further, in the first step of this embodiment, the arm 03 is disposed at a position where the inner side of the gasket 02 is abutted to the wafer on the ring removing worktable.
Secondly, vacuumizing the gasket to ensure that the position of the wafer is fixed, and lifting the gasket; the Pin ring contacts a TAIKO ring on the outer ring of the wafer to separate the TAIKO ring membrane; after separation the vacuum was released. After the centering is completed, the table and the gasket are lifted by the vacuum from the lower surface of the gasket through the vacuum holes of the gasket to separate the TAKIO ring from the membrane, as shown in fig. 2; (ii) a
Further, the duration of the vacuum in the second step of this embodiment is 2 to 3 seconds.
Further, in the second step of this embodiment, the washer is driven to rise by programming and using the motor. That is, the gasket can be set in its lifting distance and speed by a program (recipe). The vacuum holes in the gasket allow the vacuum time to be set by recipe.
And step three, as shown in fig. 3, descending the gasket, clamping the TAKIO ring by using a clamping jaw, and taking away the TAIKO ring.
Further, the gasket is lowered by 5-10 μm in step three of this example.
Further, in the third step of this embodiment, the clamping jaw enters the junction between the workbench and the film and rotates 140 degrees, and then the arm is clamped.
The invention aims at 12-inch TAIKO wafers to carry out processes of sheet (more than 100 um) and ultrathin sheet (100um is already under) ring taking.
In conclusion, when the Wafer thinned by Taiko is subjected to a ring removing process after ring cutting, a pneumatic gasket with a pin ring is added, and the TAIKO ring is separated from a membrane by lifting different distances when the Wafer is subjected to TAIKO ring taking according to the product type and the thickness; meanwhile, a vacuum hole is added on the inner side of the ring, so that the TAIKO ring is further separated from the membrane, and the vacuum suction time is controlled according to different products; the purpose of membrane ring separation is achieved, and the stability of ring taking is improved. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A TAIKO ring extraction device, comprising at least:
the ring taking workbench is surrounded with a gasket at the periphery of the ring taking workbench; the inner ring and the outer ring of the gasket are provided with vacuum holes penetrating through the upper surface and the lower surface of the gasket; a pin loop on the washer; the wafer fixing device comprises an iron ring for fixing a wafer, and the wafer carried by the iron ring and a film; the iron ring is arranged on the membrane; an arm for centering the wafer; a clamping jaw for taking out the ring.
2. The TAIKO ring extraction device of claim 1, wherein: the ring taking workbench is used for bearing the wafer.
3. The TAIKO ring extraction device of claim 1, wherein: the cross section of the ring removing workbench is circular.
4. The TAIKO ring extraction device of claim 1, wherein: the gasket is annular, and is provided with a row of vacuum holes at a radial interval of 45 ℃ and 5 vacuum holes in each row.
5. The method of any of claims 1 to 4, comprising at least the following steps:
step one, providing the TAIKO ring taking device, and placing a wafer borne by an iron ring and a film on a ring taking workbench; centering the wafer by using the arm;
secondly, vacuumizing the gasket to ensure that the position of the wafer is fixed, and lifting the gasket; the Pin ring contacts a TAIKO ring on the outer ring of the wafer to separate the TAIKO ring membrane; releasing vacuum after separation;
and step three, descending the gasket, clamping the TAIKO ring by using a clamping jaw, and taking away the TAIKO ring.
6. The method of claim 5, wherein: the arm in step one centers the TAIKO ring to fix the wafer position.
7. The method of claim 5, wherein: and in the second step, the vacuum duration is 2-3 s.
8. The method of claim 5, wherein: in the second step, the washer is driven by a motor through programming to lift 3-5 um.
9. The method of claim 5, wherein: and in the third step, the gasket is lifted and lowered by 5-10 μm.
10. The method of claim 5, wherein: and in the third step, after a clamping jaw enters the junction of the workbench and the membrane and rotates for 140 degrees, the TAIKO ring is clamped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110467417.9A CN113211664A (en) | 2021-04-28 | 2021-04-28 | TAIKO ring taking device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110467417.9A CN113211664A (en) | 2021-04-28 | 2021-04-28 | TAIKO ring taking device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113211664A true CN113211664A (en) | 2021-08-06 |
Family
ID=77089705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110467417.9A Pending CN113211664A (en) | 2021-04-28 | 2021-04-28 | TAIKO ring taking device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113211664A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114121770A (en) * | 2021-11-15 | 2022-03-01 | 华虹半导体(无锡)有限公司 | TAIKO ring taking fixing device and fixing method |
| CN114260907A (en) * | 2022-03-03 | 2022-04-01 | 江苏京创先进电子科技有限公司 | Ring taking device, wafer processing equipment and ring taking method |
| CN115338993A (en) * | 2022-08-12 | 2022-11-15 | 华虹半导体(无锡)有限公司 | TAIKO ring taking device and method |
| CN117238832A (en) * | 2023-11-14 | 2023-12-15 | 江苏京创先进电子科技有限公司 | Method, system, equipment and mechanism for removing rings of Taihe wafer |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004055661A (en) * | 2002-07-17 | 2004-02-19 | Matsushita Electric Ind Co Ltd | Pickup device and attraction peeling tool for semiconductor chip |
| CN105428220A (en) * | 2015-12-22 | 2016-03-23 | 上海华虹宏力半导体制造有限公司 | Annular cutting process method of Taiko thinning process |
| CN108565244A (en) * | 2018-01-11 | 2018-09-21 | 上海华虹宏力半导体制造有限公司 | Reduction process takes off film method |
| CN208368534U (en) * | 2018-06-29 | 2019-01-11 | 安徽三安光电有限公司 | A kind of expansion film, test, integrated machine for sorting |
| CN110265314A (en) * | 2019-05-29 | 2019-09-20 | 上海晶毅电子科技有限公司 | A kind of TAIKO wafer thin slice test macro |
| CN211428127U (en) * | 2020-02-27 | 2020-09-04 | 上海世禹精密机械有限公司 | Air ejector pin type chip and membrane separation device |
-
2021
- 2021-04-28 CN CN202110467417.9A patent/CN113211664A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004055661A (en) * | 2002-07-17 | 2004-02-19 | Matsushita Electric Ind Co Ltd | Pickup device and attraction peeling tool for semiconductor chip |
| CN105428220A (en) * | 2015-12-22 | 2016-03-23 | 上海华虹宏力半导体制造有限公司 | Annular cutting process method of Taiko thinning process |
| CN108565244A (en) * | 2018-01-11 | 2018-09-21 | 上海华虹宏力半导体制造有限公司 | Reduction process takes off film method |
| CN208368534U (en) * | 2018-06-29 | 2019-01-11 | 安徽三安光电有限公司 | A kind of expansion film, test, integrated machine for sorting |
| CN110265314A (en) * | 2019-05-29 | 2019-09-20 | 上海晶毅电子科技有限公司 | A kind of TAIKO wafer thin slice test macro |
| CN211428127U (en) * | 2020-02-27 | 2020-09-04 | 上海世禹精密机械有限公司 | Air ejector pin type chip and membrane separation device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114121770A (en) * | 2021-11-15 | 2022-03-01 | 华虹半导体(无锡)有限公司 | TAIKO ring taking fixing device and fixing method |
| CN114260907A (en) * | 2022-03-03 | 2022-04-01 | 江苏京创先进电子科技有限公司 | Ring taking device, wafer processing equipment and ring taking method |
| CN114260907B (en) * | 2022-03-03 | 2022-06-17 | 江苏京创先进电子科技有限公司 | Ring taking device, wafer processing equipment and ring taking method |
| CN115338993A (en) * | 2022-08-12 | 2022-11-15 | 华虹半导体(无锡)有限公司 | TAIKO ring taking device and method |
| CN117238832A (en) * | 2023-11-14 | 2023-12-15 | 江苏京创先进电子科技有限公司 | Method, system, equipment and mechanism for removing rings of Taihe wafer |
| CN117238832B (en) * | 2023-11-14 | 2024-02-02 | 江苏京创先进电子科技有限公司 | Method, system, equipment and mechanism for removing rings of Taihe wafer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113211664A (en) | TAIKO ring taking device and method | |
| US7665204B2 (en) | Die detachment apparatus comprising pre-peeling structure | |
| TWI728144B (en) | Peeling method and peeling device | |
| CN212230400U (en) | Wafer carrier | |
| US8226796B2 (en) | Flanged collet for die pick-up tool | |
| CN111063652B (en) | Substrate clamping bearing table | |
| JP3608121B2 (en) | Mechanical desorption mechanism of substrate and desorption method using the mechanism | |
| JP2007142267A (en) | Method for extracting object to be processed, program storage medium, and placing mechanism | |
| JP5623213B2 (en) | Cutting device | |
| CN105448785B (en) | Semiconductor film-forming apparatus, wafer automatic positioning clamping structure and method for chucking | |
| CN112259494B (en) | Apparatus and method for removing a wafer from dicing tape attached to a wafer frame | |
| JP2010165706A (en) | Alignment device of wafer | |
| CN113990794A (en) | A wafer centering device | |
| JP2002064073A (en) | Apparatus for releasing semiconductor wafer and method of manufacturing the same | |
| JP2015164753A (en) | Processing device | |
| KR100592338B1 (en) | Electronic component pickup device, electronic component pickup method and electronic component pickup program | |
| TWI734549B (en) | Substrate transfer method and device | |
| CN221776972U (en) | A feeding mechanism and a photomask processing device | |
| CN205452244U (en) | Semiconductor film forming equipment, wafer automatic positioning clamping structure | |
| TWI806587B (en) | Peeling mechanism | |
| US20230253233A1 (en) | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device | |
| KR20090048202A (en) | Board Mounting Device and Board Mounting Method | |
| TWI447845B (en) | Chuck table and method for unloading wafer using the same | |
| CN213304081U (en) | Blue membrane peeling means | |
| CN222507609U (en) | Wafer bonding fixture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210806 |