CN222507609U - Wafer bonding fixture - Google Patents

Abstract

The utility model discloses a wafer bonding clamp, which belongs to the technical field of semiconductor devices and comprises a clamp base body, a plurality of clamping jaws, a plurality of gaskets, a plurality of clamping gaskets and a plurality of clamping jaws, wherein the clamp base body is used for placing two wafers, the clamping jaws are arranged on the clamp base body, the clamping jaws are distributed at equal intervals along the circumferential direction of the edges of the wafers, the two wafers are positioned between the clamp base body and the clamping jaws, the gaskets are arranged on the clamp base body and correspond to the clamping jaws one by one, the gaskets are positioned between the clamp base body and the clamping jaws, the gaskets and the clamping jaws are arranged opposite to each other in the axial direction of the wafers, and the gaskets are positioned between the two wafers. The utility model can improve the uniformity of the stress of the wafer, reduce the interference of non-overlapping force in the axial direction of the wafer and reduce the occurrence of edge breakage of the wafer.

Description

Wafer bonding fixture

Technical Field

The utility model relates to the technical field of semiconductor devices, in particular to a wafer bonding clamp.

Background

A wafer refers to a substrate (also called a substrate) on which semiconductor transistors or integrated circuits are fabricated, and is called a wafer because it is a crystalline material and has a circular shape. Before the two wafers are temporarily bonded, wafer alignment is needed to be completed, a clamp is used for loading the two wafers after alignment is completed and used for fixing and maintaining the relative positions of the two wafers, and then the wafers are transferred to a bonding cavity for bonding.

The wafer clamp which is commonly used in the industry comprises a clamping mechanism and an isolating mechanism, wherein the clamping mechanism is used for clamping and positioning a wafer, the isolating mechanism is used for isolating two wafers, the clamping mechanism applies downward acting force to the edge of the wafer, the isolating mechanism applies upward acting force to the edge of the wafer positioned on the upper layer, the upward acting force and the downward acting force do not correspond to each other in the axial direction of the wafer, the edge of the wafer is easy to collapse, the whole wafer is cracked, and loss is caused to a subsequent packaging plant.

For this purpose, a wafer bonding jig is proposed.

Disclosure of utility model

The present utility model is directed to a wafer bonding jig, which aims to solve or improve at least one of the above technical problems.

In order to achieve the above purpose, the utility model provides a wafer bonding clamp, comprising:

The clamp base body is used for placing two wafers;

The clamping jaws are arranged on the clamp base body, the clamping jaws are distributed at equal intervals along the circumferential direction of the edge of the wafer, and the two wafers are positioned between the clamp base body and the clamping jaws;

The plurality of gaskets are arranged on the clamp base body, the plurality of gaskets and the plurality of clamping jaws are arranged in one-to-one correspondence, the gaskets are positioned between the clamp base body and the clamping jaws, the gaskets and the clamping jaws are arranged in the axial direction of the wafer in a right opposite mode, and the gaskets are positioned between the two wafers.

Preferably, a plurality of first driving components are arranged on the clamp base body, the first driving components are in one-to-one correspondence with the clamping jaws and are connected with the clamping jaws, the first driving components can drive the clamping jaws to lift along the axial direction of the wafer, and meanwhile, the clamping jaws can be driven to stretch along the radial direction of the wafer.

Preferably, a plurality of second driving components are arranged on the clamp base body, the second driving components are in one-to-one correspondence with the gaskets and are connected with the gaskets, and the second driving components drive the gaskets to stretch out and draw back along the radial direction of the wafer.

Preferably, three clamping jaws are arranged, and an included angle formed by two adjacent clamping jaws and the circle center of the wafer is 120 degrees.

The utility model has the following technical effects that two wafers are clamped between the clamp base body and the clamping jaw, meanwhile, the gasket is positioned between the two wafers for isolation, and the gasket and the clamping jaw are arranged opposite to each other in the axial direction of the wafers, so that the stress point of downward acting force and the stress point of upward acting force applied to the wafers are overlapped in the axial direction of the wafers, the uniformity of acting force is ensured in the process of static clamping and dynamic stripping of the gasket, the interference of non-overlapping force in the axial direction of the wafers is reduced, and the edge breakage problem of the wafer is reduced.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic diagram of the positional relationship between two wafers and the clamping jaw and the spacer prior to bonding in accordance with the present utility model.

In the figure, 1, clamping jaw, 2, gasket, 3, fixture base body, 4, first wafer to be bonded, and 5, second wafer to be bonded.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In order that the above-recited objects, features and advantages of the present utility model will become more readily apparent, a more particular description of the utility model will be rendered by reference to the appended drawings and appended detailed description.

Referring to fig. 1-2, the present utility model provides a wafer bonding jig, comprising:

a jig base 3 for placing two wafers;

The clamp substrate 3 is a hollow frame plate, the material of the clamp substrate comprises but not limited to stainless steel, and the two surfaces of the clamp substrate 3 have the requirements of flatness and parallelism, and are subjected to surface treatment, acid washing and electrolytic polishing;

The clamping jaws 1 are arranged on the clamp base body 3, the clamping jaws 1 are distributed at equal intervals along the circumferential direction of the wafer edge, and two wafers are positioned between the clamp base body 3 and the clamping jaws 1;

The gaskets 2 are arranged on the clamp base body 3, the gaskets 2 are arranged in one-to-one correspondence with the clamping jaws 1, the gaskets 2 are positioned between the clamp base body 3 and the clamping jaws 1, the gaskets 2 and the clamping jaws 1 are arranged opposite to each other in the axial direction of the wafers, and the gaskets 2 are positioned between the two wafers;

The material and thickness of the gasket 2 are adjusted according to different processes, and the material comprises, but is not limited to, stainless steel, copper, PEEK plastic and the like;

The two wafers are clamped between the clamp base body 3 and the clamping jaw 1, the gasket 2 is positioned between the two wafers to be isolated, and the gasket 2 and the clamping jaw 1 are arranged opposite to each other in the axial direction of the wafers, so that the stress point of downward acting force and the stress point of upward acting force applied to the wafers are overlapped in the axial direction of the wafers, the uniformity of the action of force is ensured in the static clamping and dynamic stripping process of the gasket, the interference of the action in the non-overlapping direction is reduced, and the edge breakage problem of the wafers is reduced.

According to a further optimization scheme, a plurality of first driving assemblies are arranged on the clamp base body 3, the plurality of first driving assemblies are arranged in one-to-one correspondence with the plurality of clamping jaws 1 and are connected with each other, the first driving assemblies can drive the clamping jaws 1 to lift along the axial direction of a wafer, and meanwhile, the clamping jaws 1 can be driven to stretch along the radial direction of the wafer;

The clamping jaw 1 moves synchronously, and the lifting and the stretching on each clamping jaw 1 are separated, when the clamping jaw 1 retracts, the clamping jaw 1 firstly rises to leave the surface of the wafer and then retracts;

In a further optimization scheme, a plurality of second driving assemblies are arranged on the clamp base body 3, the second driving assemblies are arranged in one-to-one correspondence with the gaskets 2 and are connected with each other, and the second driving assemblies drive the gaskets 2 to stretch out and draw back along the radial direction of the wafer;

The specific structure of the second driving assembly is not limited in this embodiment, and the plurality of gaskets 2 can synchronously move as long as the gaskets 2 can be driven to stretch along the radial direction of the wafer.

In a further optimization scheme, three clamping jaws 1 are arranged, the included angle formed by two adjacent clamping jaws 1 and the circle center of the wafer is 120 degrees, and similarly, three gaskets 2 are arranged, and the included angle formed by two adjacent gaskets 2 and the circle center of the wafer is 120 degrees;

The wafer can be subjected to various forces such as gravity, mechanical stress and the like in the processing process, the equidistant distribution is beneficial to supporting the wafer more uniformly and reducing deformation or damage caused by uneven stress, the included angle is set to be 120 degrees, so that three stress points are in an equilateral triangle supporting layout, the stability of the whole system is improved, the 120-degree distributed clamps provide symmetrical support, the method is very important for maintaining the circularity of the wafer and reducing deviation in the processing process, and meanwhile, the operation path of a robot or an automatic mechanical arm can be simplified and the efficiency is improved.

The gasket 2 is positioned between two wafers before the bonding process of the two wafers, plays a role in vacuum stripping between the two wafers, retracts the gasket 2 before the bonding is prepared after vacuumizing, is taken out from between the two wafers, is tightly pressed by the clamping jaw 1, enables the two wafers to be attached, and then performs a subsequent bonding process and other auxiliary processes, ensures the synchronization of actions in the static vacuumizing and dynamic stripping processes, ensures the uniformity of static force and dynamic force distribution in the static clamping and dynamic clamping processes of the clamping jaw 1, and reduces the interference of non-radial actions, and meanwhile, the relative positions of the gasket 2 and the clamping jaw 1 in the same group are overlapped in the vertical direction of the wafers, so that the interference of the actions in the non-overlapping direction is reduced while the uniformity of the action of the force is ensured in the static clamping and the dynamic stripping processes of the gasket 2.

In an alternative embodiment, the use of the 12 inch wafer bonding fixture in the bonding apparatus mainly comprises the following detailed interaction process of placing, feeding, bonding, feeding, taking materials and each module:

s1, a clamp is taken from an alignment machine by a manual or mechanical arm and placed on a wafer carrying table of a bonding machine;

S2, feeding a Y-axis cylinder of the wafer bearing table to a manipulator picking and placing position;

S3, the X axis of the manipulator advances, the Z axis rises, the clamp is taken out, and then the clamp rises to the highest position;

S4, opening a door valve of the vacuum chamber, feeding the X-axis of the manipulator to a designated position, descending the Z-axis, separating the clamp from the manipulator, and blanking the clamp on a pressing head;

S5, vacuumizing the vacuum chamber;

s6, the upper pressure head descends, and simultaneously the stripping mechanism of the clamp is stretched back by the mechanical device of the upper pressure head, and two wafers are attached;

s7, heating and pressurizing to finish the bonding process and other auxiliary processes.

In the description of the present utility model, it should be understood that the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.

The above embodiments are only illustrative of the preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model, and various modifications and improvements made by those skilled in the art to the technical solutions of the present utility model should fall within the protection scope defined by the claims of the present utility model without departing from the design spirit of the present utility model.

Claims (4)

1. A wafer bonding fixture, comprising: A fixture base (3) for placing two wafers; A plurality of clamping jaws (1) are arranged on the clamp base (3), the plurality of clamping jaws (1) are distributed at equal intervals along the circumference of the edge of the wafer, and the two wafers are located between the clamp base (3) and the plurality of clamping jaws (1); A plurality of gaskets (2) are arranged on the clamp base (3), the plurality of gaskets (2) are arranged in one-to-one correspondence with the plurality of clamps (1), the gasket (2) is located between the clamp base (3) and the clamps (1), the gasket (2) and the clamps (1) are arranged opposite to each other in the axial direction of the wafer, and the gasket (2) is located between the two wafers. 2. The wafer bonding fixture according to claim 1 is characterized in that: a plurality of first drive components are arranged on the fixture base (3), and the plurality of first drive components are arranged and connected with the plurality of clamps (1) in a one-to-one correspondence, and the first drive components can drive the clamps (1) to rise and fall along the axial direction of the wafer, and can also drive the clamps (1) to extend and retract along the radial direction of the wafer. 3. The wafer bonding fixture according to claim 1 is characterized in that: a plurality of second drive components are arranged on the fixture base (3), and the plurality of second drive components are arranged and connected to the plurality of gaskets (2) in a one-to-one correspondence, and the second drive components drive the gaskets (2) to extend and retract radially along the wafer. 4. The wafer bonding fixture according to claim 1 is characterized in that: three clamping jaws (1) are provided, and the angle formed by two adjacent clamping jaws (1) and the center of the wafer is 120°.