CN113113346B - Bearing device and semiconductor cleaning equipment - Google Patents
Bearing device and semiconductor cleaning equipment Download PDFInfo
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- CN113113346B CN113113346B CN202110340243.XA CN202110340243A CN113113346B CN 113113346 B CN113113346 B CN 113113346B CN 202110340243 A CN202110340243 A CN 202110340243A CN 113113346 B CN113113346 B CN 113113346B
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- wafer
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- shaft section
- carrying
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- 238000004140 cleaning Methods 0.000 title claims abstract description 129
- 239000004065 semiconductor Substances 0.000 title claims abstract description 30
- 235000012431 wafers Nutrition 0.000 claims description 198
- 230000008093 supporting effect Effects 0.000 claims description 70
- 230000005540 biological transmission Effects 0.000 claims description 40
- 230000007797 corrosion Effects 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 abstract description 43
- 239000002245 particle Substances 0.000 abstract description 25
- 230000000694 effects Effects 0.000 abstract description 21
- 238000006243 chemical reaction Methods 0.000 abstract description 9
- 230000002776 aggregation Effects 0.000 abstract description 6
- 238000004220 aggregation Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 24
- 239000000126 substance Substances 0.000 description 12
- 230000036632 reaction speed Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 229910021642 ultra pure water Inorganic materials 0.000 description 4
- 239000012498 ultrapure water Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 239000008237 rinsing water Substances 0.000 description 3
- 239000012050 conventional carrier Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a bearing device and semiconductor cleaning equipment, wherein the bearing device is used for the semiconductor cleaning equipment and comprises a bearing structure and a driving component, the bearing structure is provided with a bearing groove for placing a wafer, the bearing device is arranged in a cleaning cavity of the semiconductor cleaning equipment, and the driving component can provide driving force for being in contact with the wafer borne on the bearing structure so as to drive the wafer to move in the bearing structure relative to the bearing groove. The carrying device and the semiconductor cleaning equipment provided by the invention can improve the fluidity of the cleaning liquid so as to improve the particle removing effect, avoid the occurrence of particle aggregation, and accelerate the reaction of the cleaning liquid and the wafer, thereby improving the cleaning effect.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a bearing device and semiconductor cleaning equipment.
Background
The wet cleaning process generally includes placing a carrier carrying a wafer in a cleaning tank containing a cleaning liquid, cleaning the surface of the wafer by chemical or physical reaction between the cleaning liquid and defects on the surface film or surface of the wafer, transferring the carrier carrying the wafer into a rinsing tank containing ultrapure water, and rinsing particles remained on the surface of the wafer and in the liquid film by a large amount of ultrapure water to achieve efficient cleaning of the surface of the wafer. The wet cleaning process plays a role in the whole semiconductor process, almost covers more than thirty percent of the whole semiconductor process, and is therefore important in the whole semiconductor process.
However, in the prior art, the contact position of the wafer with the carrying device is fixed in the cleaning process, so that the cleaning liquid is blocked when flowing to the contact position of the wafer with the carrying device, resulting in poor fluidity of the cleaning liquid, so that particles on the wafer are not easy to be removed, and particles removed from the wafer are also easy to be accumulated at the contact position of the wafer with the carrying device, resulting in poor cleaning effect.
Disclosure of Invention
The invention aims at solving at least one of the technical problems in the prior art, and provides a bearing device and a semiconductor cleaning device, which can improve the mobility of cleaning liquid so as to improve the effect of removing particles, avoid the occurrence of particle aggregation, and accelerate the reaction of the cleaning liquid and a wafer so as to improve the cleaning effect.
In order to achieve the object of the invention, a carrier device is provided for a semiconductor cleaning apparatus, the carrier device comprises a carrier structure, the carrier structure is provided with a carrier groove for placing a wafer, the carrier device is used for being arranged in a cleaning cavity of the semiconductor cleaning apparatus, the carrier device further comprises a driving component, and the driving component can provide driving force for contacting with the wafer carried on the carrier structure so as to drive the wafer to move on the carrier structure relative to the carrier groove.
Preferably, the drive assembly comprises a rotary drive member and a rotary shaft for contacting the wafer carried on the carrier structure;
The rotary driving component is connected with the rotary shaft and is used for providing rotary driving force for the rotary shaft so as to drive the wafer contacted with the rotary shaft to move relative to the bearing structure by driving the rotary shaft to rotate.
Preferably, the rotating shaft comprises a first shaft section and a second shaft section, the first shaft section is used for contacting with the wafer, one end of the second shaft section is connected with the first shaft section, and the axle center of the second shaft section and the axle center of the first shaft section are eccentrically arranged; the rotary driving part is connected with the other end of the second shaft section, so that the wafer is contacted with or separated from the bearing structure through the first shaft section while the contact position of the wafer and the bearing structure is changed.
Preferably, the rotary driving part comprises a rotary driving source and a transmission part, wherein the transmission part is connected with the other end of the second shaft section; the rotary driving source is connected with the transmission part and is used for providing rotary driving force for the transmission part so as to drive the second shaft section to rotate by driving the transmission part to rotate.
Preferably, the transmission part comprises a main transmission part and a plurality of sub transmission parts, the sub transmission parts and the rotating shafts are arranged in one-to-one correspondence, and the second shaft section is connected with the sub transmission parts; the main transmission piece is connected with the rotary driving source and drives the plurality of sub-transmission pieces to synchronously rotate.
Preferably, the main driving member includes a main gear, each of the sub driving members includes a sub gear, and each of the sub gears is spaced apart from each other around the main gear and is engaged with the main gear.
Preferably, the main driving part, the sub driving parts and the rotating shaft are all made of corrosion resistant materials.
Preferably, the carrying structure comprises at least two mutually connected supporting bodies, the supporting bodies are mutually spaced and arranged in parallel, a plurality of carrying grooves are formed in the supporting bodies along the length direction, and the carrying grooves on the same plane on the supporting bodies are mutually matched to jointly support the wafer;
the rotating shafts are arranged between two adjacent supporting bodies and are parallel to the supporting bodies.
Preferably, the bearing structure comprises four supporting bodies, the four supporting bodies are divided into two supporting groups, and each supporting group comprises two supporting bodies;
The number of the rotating shafts is two, and the two rotating shafts are respectively positioned between the two supporting main bodies in the two supporting groups.
The invention also provides semiconductor cleaning equipment which comprises a cleaning chamber and a bearing device capable of being placed in the cleaning chamber, wherein the bearing device is used for bearing wafers.
The invention has the following beneficial effects:
According to the carrying device provided by the invention, the driving component is used for contacting with the wafer when the wafer is carried on the carrying structure, so that the wafer is driven to move relative to the carrying groove on the carrying structure, the contact position between the wafer and the carrying groove of the carrying structure is not fixed in the cleaning process, but the wafer is carried on the carrying structure in the cleaning process in a way of moving relative to the carrying groove of the carrying structure, the contact position between the wafer and the carrying groove is changed, and therefore, the obstruction of the contact position of the wafer and the carrying groove on the flow of cleaning liquid is weakened, the mobility of the cleaning liquid at the contact position of the wafer and the carrying groove is improved, the effect of removing particles at the contact position of the wafer and the carrying groove is improved, the situation that particles removed from the wafer are gathered at the contact position of the wafer and the carrying groove is avoided, and the chemical or physical reaction speed between the cleaning liquid and the wafer is improved due to the fact that the mobility of the cleaning liquid relative to the wafer is improved, and the cleaning effect is further improved.
According to the semiconductor cleaning equipment provided by the invention, the wafer is carried in the cleaning chamber by the carrying device provided by the invention, so that the mobility of the cleaning liquid can be improved, the particle removing effect is improved, the particle aggregation is avoided, the reaction between the cleaning liquid and the wafer is accelerated, and the cleaning effect is improved.
Drawings
FIG. 1 is a schematic view of a carrying device and a semiconductor cleaning apparatus according to an embodiment of the present invention when a wafer is contacted with a supporting body;
FIG. 2 is a schematic diagram of a carrier device and a semiconductor cleaning apparatus according to an embodiment of the present invention when a wafer is separated from a supporting body;
Fig. 3 is a schematic top view of a carrying device and a semiconductor cleaning apparatus according to an embodiment of the present invention, corresponding to fig. 1 and fig. 2;
FIG. 4 is a schematic side view of a carrying device according to an embodiment of the present invention;
Fig. 5 is a schematic structural diagram of a carrying device and a semiconductor cleaning apparatus according to an embodiment of the present invention;
FIG. 6 is a schematic view of a prior art carrying device;
Reference numerals illustrate:
10-wafer; 11-a support body; 12-rotating shaft; 121-a first shaft section; 122-a second shaft section; 13-a rotary drive source; 14-a transmission component; 141-a main driving member; 142-sub-transmission; 15-cleaning the chamber; 151-a first cleaning tank; 152-a second cleaning tank; 16-connecting the body; 17-a circulation line; 18-a filter element; 19-a heating element; 21-a circulation pump; 22-support columns.
Detailed Description
In order to enable those skilled in the art to better understand the technical solutions of the present invention, the following describes the carrying device and the semiconductor cleaning apparatus provided by the present invention in detail with reference to the accompanying drawings.
In order to facilitate explanation of the differences between the carrying device provided in the embodiment of the present invention and the carrying device in the prior art, a carrying device for carrying a wafer 10 in the prior art will be first described. As shown in fig. 6, a conventional carrier for carrying a wafer 10 has four interconnected support columns 22, where the four support columns 22 are spaced apart from each other and arranged in parallel, and the support columns 22 are provided with a plurality of carrying grooves along a length direction, and each carrying groove on the same plane on each support column 22 is matched with each other to support the wafer 10 together. During the wet cleaning process, one side edge of the bottom of the wafer 10 is received in two bearing grooves on the same plane on two support columns 22 on the side of the four support columns 22, and the other side edge is received in two bearing grooves on the same plane on the other two support columns 22 on the side of the four support columns 22, so that the wafer 10 is mutually supported by the four bearing grooves on the same plane on the four support columns 22, and the wafer 10 can stand on the four support columns 22 stably. The inventor of the present application has found that in the course of the study, a conventional carrier for carrying a wafer 10 as shown in fig. 6 is used to carry the wafer 10, and in the wet cleaning process, the wafer 10 is fixedly placed on four support columns 22, so that the contact position between the wafer 10 and each carrying groove is fixed during the wet cleaning process, and the cleaning liquid is blocked when flowing to the contact position of the wafer 10 and each carrying groove, so that particles at the contact position of the wafer 10 and each carrying groove are not easy to remove, and particles removed from the wafer 10 are also easy to gather at the contact position of the wafer 10 and each carrying groove, thereby affecting the cleaning effect.
As shown in fig. 1-4, the present embodiment provides a carrier device for a semiconductor cleaning apparatus, where the carrier device includes a carrier structure having a carrier groove for placing a wafer 10, and a driving component, and the carrier device is disposed in a cleaning chamber 15 of the semiconductor cleaning apparatus, and the driving component is capable of providing a driving force for contacting the wafer 10 carried on the carrier structure, i.e., when the wafer 10 is carried on the carrier structure, the driving component is capable of contacting the wafer 10 to drive the wafer 10 to move on the carrier structure relative to the carrier groove.
According to the carrying device provided by the embodiment, the driving component is used for contacting the wafer 10 when the wafer 10 is carried on the carrying structure, so that the wafer 10 is driven to move relative to the carrying groove on the carrying structure, the wafer 10 is not fixedly carried on the carrying structure in the cleaning process, the contact position between the wafer 10 and the carrying groove of the carrying structure is not fixedly changed any more, the wafer 10 is carried on the carrying structure in the cleaning process in the movement manner relative to the carrying groove of the carrying structure, the contact position between the wafer 10 and the carrying groove is changed, and therefore the obstruction of the contact position between the wafer 10 and the carrying groove on the flow of cleaning liquid is reduced, the mobility of the cleaning liquid at the contact position between the wafer 10 and the carrying groove is improved, the particle removing effect at the contact position between the wafer 10 and the carrying groove is improved, the particle aggregation at the contact position between the wafer 10 and the carrying groove is avoided, and the cleaning liquid and the cleaning effect of the wafer 10 is improved, and the chemical reaction speed and the cleaning effect of the cleaning liquid and the cleaning liquid are improved.
In a preferred embodiment of the invention, the drive assembly may comprise a rotary drive member and a rotary shaft 12, the rotary shaft 12 being adapted to contact a wafer 10 carried on a carrier structure; the rotation driving part is connected to the rotation shaft 12, and is configured to provide a rotation driving force to the rotation shaft 12, so as to drive the rotation shaft 12 to rotate, thereby driving the wafer contacted with the rotation shaft 12 to move relative to the carrier structure.
When the wafer 10 is carried on the carrying structure, the rotation shaft 12 is in contact with the wafer 10, the rotation driving component is connected with the rotation shaft 12, and can provide a rotation driving force for the rotation shaft 12 to drive the rotation shaft 12 to rotate, and since the rotation shaft 12 is in contact with the wafer 10, the rotation shaft 12 can drive the wafer 10 in contact with the rotation shaft to move when rotating, and the carrying structure is stationary at the moment, so that the rotation shaft 12 can drive the wafer 10 in contact with the rotation shaft to move relative to the carrying structure when rotating, namely, the rotation driving component can drive the rotation shaft 12 to rotate by providing a rotation driving force for the rotation shaft 12, and the wafer 10 in contact with the rotation shaft 12 is driven to move relative to the carrying structure.
In this way, the wafer 10 can be carried on the carrying structure relative to the carrying groove of the carrying structure in the cleaning process, so that the contact position between the wafer 10 and the carrying groove can be changed in the cleaning process, the obstruction of the contact position between the wafer 10 and the carrying groove to the flow of the cleaning liquid is weakened, the mobility of the cleaning liquid at the contact position between the wafer 10 and the carrying groove is improved, the effect of removing particles at the contact position between the wafer 10 and the carrying groove is improved, the situation that particles removed from the wafer 10 are gathered at the contact position between the wafer 10 and the carrying groove is avoided, and the relative rotation speed between the cleaning liquid and the wafer 10 is increased in the cleaning process, so that the mobility of the cleaning liquid relative to the wafer 10 is improved, the chemical or physical reaction speed between the cleaning liquid and the wafer 10 is improved, the reaction of the cleaning liquid and the wafer 10 is accelerated, and the cleaning effect is improved.
As shown in fig. 1 to 3, in a preferred embodiment of the present invention, the carrying structure may include four supporting bodies 11 connected to each other, the four supporting bodies 11 are divided into two supporting groups, each supporting group includes two supporting bodies 11, the four supporting bodies 11 are spaced apart from each other and arranged in parallel, each supporting body 11 is provided with a plurality of carrying grooves along a length direction, and the carrying grooves on the same plane on each supporting body 11 cooperate with each other to support the wafer 10; the number of the rotation shafts 12 may be two, and the two rotation shafts 12 are respectively located between the two support bodies 11 in the two support groups and disposed in parallel with the support bodies 11.
As shown in fig. 1 to 3, alternatively, two sets of support groups may be respectively located at two sides of the bottom of the wafer 10, each support body 11 is provided with a plurality of bearing grooves along the length direction, each support body 11 is divided into a plurality of planes along the length direction, and each bearing groove located on the same plane is mutually matched to jointly support the wafer 10, so that four support bodies 11 can simultaneously bear a plurality of wafers 10, the intervals between two support bodies 11 in the two sets of support groups are the same, the interval between the two sets of support groups may be greater than the interval between two support bodies 11 in each support group, and two rotating shafts 12 are respectively located between two support bodies 11 in the two sets of support groups. In the cleaning process, each carrying groove on the same plane on the four supporting bodies 11 limits the edge of the same wafer 10, so that the wafer 10 can stand on the four supporting bodies 11 stably, the carrying grooves on the same plane on the supporting bodies 11 are matched and contacted with each other to support the wafer 10, the wafer 10 is carried on a carrying structure, two rotating shafts 12 are also contacted with the edge of the wafer 10, a certain supporting effect is achieved on the wafer 10, a rotary driving part can be connected with the two rotating shafts 12 to drive the two rotating shafts 12 to rotate simultaneously, the wafer 10 contacted with the two rotating shafts 12 is driven to move, and the position points of the wafer 10 contacted with the carrying grooves on the four supporting bodies 11 are changed relative to the four supporting bodies 11 and the carrying grooves on the supporting bodies 11.
Through setting up a plurality of carrier grooves in the length direction of supporting body 11, can make the bearing structure bear a plurality of wafers 10 simultaneously, a plurality of wafers 10 can be along the length direction interval distribution of supporting body 11, contact with wafer 10 through rotation axis 12, and drive wafer 10 rotation, and make rotation axis 12 and supporting body 11 parallel arrangement, can make drive assembly simultaneously contact with a plurality of wafers 10, and drive a plurality of wafers 10 simultaneous movement simultaneously, in order to improve bearing device's bearing capacity, and drive wafer 10 for the efficiency of carrier groove motion of bearing structure.
However, in the embodiment of the present invention, the number of the supporting bodies 11 included in the supporting structure is not limited to this, and the number of the rotating shafts 12 is not limited to this, for example, the supporting structure may include two supporting bodies 11, two supporting bodies 11 are spaced apart from each other and arranged in parallel, each supporting body 11 is provided with a plurality of supporting grooves along a length direction, and each supporting groove on the same plane on each supporting body 11 is matched with each other to support the wafer 10 together, that is, two supporting grooves on the same plane on the two supporting bodies 11 are respectively contacted with different positions of the wafer 10, so that the wafer 10 is supported by the two supporting grooves on the same plane on the two supporting bodies 11, and at this time, the number of the rotating shafts 12 may be one, and the rotating shafts 12 may be located between the two supporting bodies 11 and arranged in parallel to the two supporting bodies 11, and when the wafer 10 is supported on the two supporting bodies 11, each supporting groove on the same plane on each supporting body 11 is mutually matched with each supporting body 11, that is capable of supporting the wafer 10 together, that is contacted with the two supporting bodies 11, and the rotating driving member is connected with the rotating shaft 12 to rotate so as to drive the rotating shafts 12 to rotate relative to the two supporting bodies 11 to the supporting grooves on the rotating shafts 11.
Thus, in a preferred embodiment of the present invention, the carrying structure may include at least two supporting bodies 11 connected to each other, where each supporting body 11 is spaced apart from each other and arranged in parallel, and the supporting bodies 11 are provided with a plurality of carrying grooves along a length direction, and each carrying groove on the same plane on each supporting body 11 is matched with each other to support the wafer 10 together; the rotation shaft 12 is disposed between two adjacent support bodies 11 and is disposed in parallel with the support bodies 11.
As shown in fig. 1 to 4, in a preferred embodiment of the present invention, the carrying structure may further include a connection body 16, and the connection body 16 is connected with all the support bodies 11 such that all the support bodies 11 are connected with each other through the connection body 16.
As shown in fig. 3 to 4, alternatively, the carrying structure may include two connection bodies 16, and the two connection bodies 16 are respectively located at both ends of all the support bodies 11 and connected to both ends of all the support bodies 11, i.e., one connection body 16 of the two connection bodies 16 is connected to one end of all the support bodies 11, and the other connection body 16 of the two connection bodies 16 is connected to the other end of all the support bodies 11.
As shown in fig. 1 to 4, in a preferred embodiment of the present invention, the rotation shaft 12 may include a first shaft section 121 and a second shaft section 122, the first shaft section 121 is used for contacting the wafer 10, one end of the second shaft section 122 is connected to the first shaft section 121, and the axis of the second shaft section 122 is eccentric to the axis of the first shaft section 121; the rotation driving part may be connected to the other end of the second shaft section 122 to contact or separate the wafer 10 with or from the carrier structure through the first shaft section 121 while changing the contact position of the wafer 10 with the carrier structure.
By connecting the two ends of the second shaft section 122 with the first shaft section 121 and the rotation driving member, respectively, so that the rotation driving member is not directly connected with the first shaft section 121, but is connected with the first shaft section 121 through the second shaft section 122, when the rotation driving member provides the rotation driving force, the rotation driving force is provided to the second shaft section 122 first, and the rotation driving member drives the first shaft section 121 connected with the second shaft section 122 to rotate through driving the second shaft section 122, because the axle center of the second shaft section 122 and the axle center of the first shaft section 121 are eccentrically arranged, that is, the axle center of the second shaft section 122 and the axle center of the first shaft section 121 are not on the same straight line, the first shaft section 121 rotates eccentrically, so that the wafer 10 contacted with the first shaft section 121 moves eccentrically when driven by the first shaft section 121, thereby not only changing the contact position between the wafer 10 and the carrying groove of the carrying structure, but also enabling the wafer 10 to contact or separate from the groove bottom of the carrying groove, that is capable of enabling the wafer 10 to contact or separate from the carrying structure.
The following description will be given by taking an example in which the number of the rotation shafts 12 is two, and the two rotation shafts 12 are respectively located between the two support bodies 11 in the two support groups and are disposed in parallel with the support bodies 11. When the second shaft sections 122 of the two rotating shafts 12 are driven to rotate in the same direction and always at the same height by the rotation driving part, the first shaft sections 121 of the two rotating shafts 12 are also rotated in the same direction and always at the same height as the rotation direction of the second shaft sections 122 by the driving of the second shaft sections 122, that is, the first shaft sections 121 of the two rotating shafts 12 are also rotated in the same direction and always at the same height, at this time, the wafer 10 contacting the first shaft sections 121 of the two rotating shafts 12 is rotated in the opposite direction to the rotation direction of the first shaft sections 121, and since the axes of the second shaft sections 122 and the axes of the first shaft sections 121 are not in the same straight line, the first shaft sections 121 are eccentrically rotated when rotated, so that the wafer 10 contacting the first shaft sections 121 are eccentrically rotated when driven by the first shaft sections, and thus the wafer 10 can also rotate not only relative to the carrying structure, but also can be separated from the carrying structure, and the wafer 10 can also be contacted with the carrying structure, and the vibration can also be separated from the carrying structure. For example, when the wafer 10 is driven by the first shaft section 121 to rotate relative to the carrier structure and is also driven by the first shaft section 121 to rise relative to the carrier structure, the wafer is separated from the bottom of the carrier groove, i.e., separated from the carrier structure, and when the wafer 10 is driven by the first shaft section 121 to rotate relative to the carrier groove of the carrier structure and is also driven by the first shaft section 121 to descend relative to the carrier structure, the wafer is contacted with the bottom of the carrier groove, i.e., contacted with the carrier structure. However, the manner in which the carrier device drives the wafer 10 to move is not limited to this.
For example, when the rotation driving part drives the second shaft sections 122 of the two rotation shafts 12 to rotate in opposite directions and always at the same height, the first shaft sections 121 of the two rotation shafts 12 are also rotated in the same direction and always at the same height as the rotation direction of the second shaft sections 122 by the driving of the second shaft sections 122, that is, the first shaft sections 121 of the two rotation shafts 12 are also rotated in opposite directions and always at the same height, at this time, the wafer 10 in contact with the first shaft sections 121 of the two rotation shafts 12 is not rotated, and since the axial center of the second shaft sections 122 is not disposed on the same straight line as the axial center of the first shaft sections 121, that is, the axial center of the second shaft sections 122 is not on the same straight line as the axial center of the first shaft sections 121, so that the first shaft sections 121 are eccentrically rotated when rotated, which enables the wafer 10 in contact with the first shaft sections 121 to vibrate up and down with respect to the carrier structure, that is, in this case, the wafer 10 vibrates up and down only with respect to the carrier structure, and does not rotate with respect to the carrier structure.
For another example, when the rotation driving part drives the second shaft sections 122 of the two rotation shafts 12 to rotate in the same direction and at different heights, the first shaft sections 121 of the two rotation shafts 12 are also rotated in the same direction and at different heights as the second shaft sections 122 are driven by the second shaft sections 122, that is, the first shaft sections 121 of the two rotation shafts 12 are also rotated in the same direction and at different heights, at this time, the wafer 10 contacting the first shaft sections 121 of the two rotation shafts 12 is rotated in the opposite direction to the rotation direction of the first shaft sections 121, and since the axes of the second shaft sections 122 and the axes of the first shaft sections 121 are not in the same straight line, the first shaft sections 121 are eccentrically rotated when rotating, and since the two first shaft sections 121 are at different heights, both sides of the wafer 10 contacting the first shaft sections 121 are also at different heights, the wafer 10 can not rotate in the opposite direction to the bearing structure, and can also contact the wafer 10 in the horizontal direction and also be separated from the bearing structure, or the bearing groove can also be horizontally separated from the bearing structure.
For another example, when the rotation driving part drives the second shaft sections 122 of the two rotation shafts 12 to rotate in opposite directions and at different heights, the first shaft sections 121 of the two rotation shafts 12 are also rotated in the same direction as the rotation direction of the second shaft sections 122 and at different heights by the driving of the second shaft sections 122, that is, the first shaft sections 121 of the two rotation shafts 12 are also rotated in opposite directions and at different heights, at this time, the wafer 10 contacting the first shaft sections 121 of the two rotation shafts 12 is not rotated, and since the axis of the second shaft sections 122 is eccentrically disposed with the axis of the first shaft sections 121, that is, the axis of the second shaft sections 122 is not on the same straight line with the axis of the first shaft sections 121, the first shaft sections 121 are eccentrically rotated while rotating, and since the two first shaft sections 121 are at different heights, both sides of the wafer 10 contacting the first shaft sections 121 are also at different heights, so that the wafer 10 can vibrate up and down with respect to the carrying structure and in the horizontal direction.
By means of the first shaft section 121 and the second shaft section 122 which are eccentrically arranged, the wafer 10 contacted with the first shaft section 121 can vibrate up and down relative to the bearing structure while rotating relative to the bearing structure, so that in the cleaning process, the contact position of the wafer 10 and the bearing groove of the bearing structure is changed, and meanwhile, the wafer 10 is contacted with or separated from the groove bottom of the bearing groove of the bearing structure, namely, in the cleaning process, the wafer 10 can rotate relative to the bearing groove of the bearing structure, the wafer 10 can vibrate up and down relative to the bearing groove of the bearing structure, and as the wafer 10 can be separated from the groove bottom of the bearing groove in the cleaning process, a contact point between the wafer 10 and the groove bottom of the bearing groove does not exist in the cleaning process, so that the obstruction of the flow of cleaning liquid at the contact position of the wafer 10 and the bearing groove is further reduced, the effect of removing particles at the contact position of the wafer 10 and the bearing groove is further improved, the wafer 10 is prevented from being removed from the wafer 10, the contact position of the wafer 10 and the bearing groove is also prevented from being removed from being contacted with the wafer 10, the cleaning liquid is further reduced, the physical reaction speed between the wafer and the wafer 10 and the cleaning process is further improved, and the physical reaction speed between the wafer and the wafer is further improved, and the cleaning effect is further is improved, and the relative to the cleaning speed is improved.
In practical use, the distance between the axis of the second shaft section 122 and the axis of the first shaft section 121 may be adjusted, that is, the eccentric distance between the second shaft section 122 and the first shaft section 121 may be adjusted, so that when the first shaft section 121 drives the wafer 10 to vibrate up and down relative to the carrying structure, and the wafer 10 contacts or separates from the bottom of the carrying groove, the vibration amplitude of the first shaft section 121 driving the wafer 10 is smaller than the depth of the carrying groove, so that the first shaft section 121 drives the wafer 10 to rise to a height smaller than the depth of the carrying groove, thereby avoiding the detachment of the wafer 10 from the carrying groove, avoiding the occurrence of damage to the wafer 10 caused by the failure of the wafer 10 standing on the carrying structure, and further improving the use stability of the carrying device.
As shown in fig. 1-3, in a preferred embodiment of the present invention, the rotation driving part may include a rotation driving source 13 and a transmission part 14, wherein the transmission part 14 may be connected with the other end of the second shaft section 122; the rotation driving source 13 may be connected to the transmission member 14 for providing a rotation driving force to the transmission member 14 to rotate the second shaft section 122 by driving the transmission member 14 to rotate.
By connecting the transmission member 14 with the second shaft section 122 and the rotation driving source 13, respectively, the rotation driving source 13 is connected with the second shaft section 122 through the transmission member 14, so that the rotation driving source 13 provides rotation driving force to the transmission member 14 when providing rotation driving force, and drives the transmission member 14 to rotate so as to drive the second shaft section 122 connected with the transmission member 14 to rotate, thereby driving the first shaft section 121 connected with the second shaft section 122 to rotate.
As shown in fig. 1 to 4, in a preferred embodiment of the present invention, the transmission part 14 may include a main transmission part 141 and a plurality of sub transmission parts 142, the sub transmission parts 142 are disposed in one-to-one correspondence with the rotation shaft 12, and the second shaft section 122 is connected with the sub transmission parts 142; the main transmission member 141 is connected to the rotation driving source 13, and drives the plurality of sub-transmission members 142 to rotate synchronously.
The main driving member 141 is connected with each sub driving member 142 and the rotation driving source 13, so that the rotation driving source 13 is not directly connected with each sub driving member 142, but is connected with each sub driving member 142 through the main driving member 141, so that the rotation driving source 13 firstly provides rotation driving force for the main driving member 141 when providing rotation driving force, and drives each sub driving member 142 connected with the main driving member 141 to rotate through driving the main driving member 141, thereby driving the second shaft sections 122 connected with each sub driving member 142 in a one-to-one correspondence manner to rotate, so that the rotation driving source 13 can drive the plurality of sub driving members 142 to rotate simultaneously, and further can drive the plurality of second shaft sections 122 to rotate simultaneously.
As shown in fig. 1 to 3, the driving assembly includes two rotating shafts 12, wherein the second shaft sections 122 of the two rotating shafts 12 are eccentrically connected with the first shaft sections 121, that is, the second shaft section 122 of one rotating shaft 12 of the two rotating shafts 12 is eccentrically connected with the first shaft section 121 of the rotating shaft 12, the second shaft section 122 of the other rotating shaft 12 of the two rotating shafts 12 is eccentrically connected with the first shaft section 121 of the rotating shaft 12, and the rotating driving component drives the two second shaft sections 122 to rotate clockwise so as to drive the two first shaft sections 121 respectively connected with the two second shaft sections 122 to rotate clockwise, thereby driving the wafer 10 contacting with the two first shaft sections 121 to rotate counterclockwise.
By eccentrically connecting the second shaft section 122 of one of the two rotation shafts 12 with the first shaft section 121 of the rotation shaft 12, and eccentrically connecting the second shaft section 122 of the other of the two rotation shafts 12 with the first shaft section 121 of the rotation shaft 12, when the rotation driving means rotates the two rotation shafts 12, the wafer 10 in contact with the first shaft section 121 of the two rotation shafts 12 can be vibrated on each support body 11 by the first shaft section 121 of the two rotation shafts 12 to bring the wafer 10 into contact with or separate from each support body 11. As shown in fig. 1, the rotation driving part drives the two rotation shafts 12 to rotate so that the wafer 10 is in contact with each supporting body 11, and after the rotation driving part drives the two rotation shafts 12 to rotate clockwise or counterclockwise, as shown in fig. 2, since the first shaft sections 121 and the second shaft sections 122 of the two rotation shafts 12 are eccentrically connected, the first shaft sections 121 of the two rotation shafts 12 move the wafer 10 in contact therewith upwards so that the wafer 10 is separated from each supporting body 11. Meanwhile, when the rotation driving part drives the two rotation shafts 12 to rotate clockwise, the wafer 10 contacting the first shaft sections 121 of the two rotation shafts 12 rotates counterclockwise, and when the rotation driving part drives the two rotation shafts 12 to rotate counterclockwise, the wafer 10 contacting the first shaft sections 121 of the two rotation shafts 12 rotates clockwise.
As shown in fig. 1-3, in a preferred embodiment of the present invention, the main driving member 141 may include a main gear, and each of the sub-driving members 142 may include sub-gears, each of which is spaced around and engaged with the main gear.
As shown in fig. 1-3, for example, the transmission component 14 includes two sub-transmission members 142, where the two sub-transmission members 142 are sub-gears, and the two sub-gears are located at intervals and around the main gear, and are located at two sides of the main gear, respectively, and the two sub-gears are engaged with the main gear through both of the sub-gears so as to be driven to rotate by the main gear.
Alternatively, the rotary drive source 13 may include a rotary motor.
In a preferred embodiment of the present invention, the main driving member 141, the sub driving members 142 and the rotation shaft 12 may be made of a corrosion-resistant material, so that corrosion by the cleaning liquid is prevented, thereby improving the durability of the carrying device.
As shown in fig. 5, as another technical solution, an embodiment of the present invention further provides a semiconductor cleaning apparatus, which includes a cleaning chamber 15 and a carrying device capable of being placed in the cleaning chamber 15, where the carrying device is used for carrying a wafer 10.
The semiconductor cleaning device provided in this embodiment carries the wafer 10 in the cleaning chamber 15 by using the carrying device provided in this embodiment of the present invention, so as to improve the mobility of the cleaning liquid, thereby improving the effect of removing particles, avoiding the occurrence of particle aggregation, and accelerating the reaction between the cleaning liquid and the wafer 10, thereby improving the cleaning effect.
Alternatively, the wafer 10 may be the wafer 10, and the carrier carrying the wafer 10 may be placed at the bottom of the cleaning chamber 15 when placed in the cleaning chamber 15.
Alternatively, the cleaning liquid may be a chemical liquid.
In a preferred embodiment of the present invention, the cleaning chamber 15 may include a first cleaning tank 151 and a second cleaning tank 152, the first cleaning tank 151 being used for placing a carrying device and containing chemical liquid, the second cleaning tank 152 and the first cleaning tank 151 may be communicated through a circulation line 17, and the circulation line 17 may be provided with a filtering part 18, a heating part 19 and a circulation pump 21. In the process of cleaning the wafer 10, the carrying device carrying the wafer 10 is placed in the first cleaning tank 151, and the surface defects, corrosion and the like of the wafer 10 are cleaned by chemical or physical reaction between the chemical liquid in the first cleaning tank 151 and the surface film or defects of the wafer 10. In the cleaning process, the chemical liquid can flow the corroded particles into the second cleaning tank 152 through the overflow port at the bottom of the first cleaning tank 151, so that the consumption of the chemical liquid is reduced, the chemical liquid with the corroded particles flowing into the second cleaning tank 152 can flow back to the first cleaning tank 151 through the circulation pipeline 17 by means of the pumping force of the circulation pump 21, the filtration of the filtering component 18 and the heating of the heating component 19, and the recycling of the chemical liquid is realized.
In a preferred embodiment of the present invention, the semiconductor cleaning apparatus may further include a rinsing water tank (not shown) containing ultra-pure water, the wafer 10 cleaned by the cleaning tank may be placed in the rinsing water tank, the rinsing water tank is used for rinsing the wafer 10 cleaned by the first cleaning tank 151 with water, and a large amount of ultra-pure water is used for rinsing the surface of the wafer 10 and the particles remained in the liquid film, thereby achieving efficient cleaning of the surface of the wafer 10.
In summary, the carrying device and the semiconductor cleaning apparatus provided by the embodiments of the present invention can improve the fluidity of the cleaning liquid to improve the effect of removing particles, avoid the occurrence of particle aggregation, and accelerate the reaction between the cleaning liquid and the wafer 10, thereby improving the cleaning effect.
It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present invention, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the invention, and are also considered to be within the scope of the invention.
Claims (8)
1. A carrier for a semiconductor cleaning apparatus, the carrier comprising a carrier structure having a carrier slot for receiving a wafer, the carrier being adapted to be disposed within a cleaning chamber of the semiconductor cleaning apparatus, the carrier further comprising a drive assembly adapted to provide a drive force for contacting the wafer carried on the carrier structure to drive the wafer on the carrier structure relative to the carrier slot;
the drive assembly includes a rotary drive member and a rotary shaft for contacting the wafer carried on the carrier structure;
the rotary driving component is connected with the rotary shaft and is used for providing rotary driving force for the rotary shaft so as to drive the wafer contacted with the rotary shaft to move relative to the bearing structure by driving the rotary shaft to rotate;
The rotating shaft comprises a first shaft section and a second shaft section, the first shaft section is used for being in contact with the wafer, one end of the second shaft section is connected with the first shaft section, and the axis of the second shaft section and the axis of the first shaft section are eccentrically arranged; the rotary driving part is connected with the other end of the second shaft section so as to enable the contact position of the wafer and the bearing structure to be changed, and simultaneously enable the wafer to be contacted with or separated from the bearing structure through the first shaft section;
the number of the rotating shafts is two, and the two rotating shafts are respectively arranged on two sides of the central axis of the wafer.
2. The carrier according to claim 1, wherein the rotary drive member comprises a rotary drive source and a transmission member, wherein the transmission member is connected with the other end of the second shaft section; the rotary driving source is connected with the transmission part and is used for providing rotary driving force for the transmission part so as to drive the second shaft section to rotate by driving the transmission part to rotate.
3. The bearing device according to claim 2, wherein the transmission part comprises a main transmission part and a plurality of sub transmission parts, the sub transmission parts and the rotating shaft are arranged in a one-to-one correspondence, and the second shaft section is connected with the sub transmission parts; the main transmission piece is connected with the rotary driving source and drives the plurality of sub-transmission pieces to synchronously rotate.
4. A carrier as claimed in claim 3, in which the main drive member comprises a main gear and each of the sub-drive members comprises a sub-gear, each of the sub-gears being spaced around the main gear and each of the sub-gears being in engagement with the main gear.
5. A bearing device according to claim 3, wherein the main driving member, the sub driving members and the rotation shaft are all made of corrosion resistant material.
6. The carrier of claim 1, wherein the carrier structure comprises at least two mutually connected supporting bodies, the supporting bodies are mutually spaced and arranged in parallel, the supporting bodies are provided with a plurality of carrying grooves along the length direction, and the carrying grooves on the supporting bodies on the same plane are mutually matched to jointly support the wafer;
the rotating shafts are arranged between two adjacent supporting bodies and are parallel to the supporting bodies.
7. The carrying device of claim 6, wherein the carrying structure comprises four of the support bodies divided into two support groups, each of the support groups comprising two of the support bodies;
the two rotating shafts are respectively positioned between the two supporting main bodies in the two supporting groups.
8. Semiconductor cleaning apparatus comprising a cleaning chamber and a carrier device capable of being placed in the cleaning chamber, characterized in that the carrier device is a carrier device according to any one of claims 1-7 for carrying wafers.
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| CN202110340243.XA CN113113346B (en) | 2021-03-30 | 2021-03-30 | Bearing device and semiconductor cleaning equipment |
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| CN202110340243.XA CN113113346B (en) | 2021-03-30 | 2021-03-30 | Bearing device and semiconductor cleaning equipment |
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| CN113113346B true CN113113346B (en) | 2024-06-21 |
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| CN113822009B (en) * | 2021-09-18 | 2024-10-11 | 武汉精立电子技术有限公司 | Automatic generation method, device and system for grain arrangement scheme |
| CN115815198A (en) * | 2022-11-30 | 2023-03-21 | 西安奕斯伟材料科技有限公司 | Cleaning device |
| CN116564866B (en) * | 2023-07-10 | 2023-09-05 | 盛奕半导体科技(无锡)有限公司 | Semiconductor wet etching cleaning device |
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|---|---|---|---|---|
| US5816274A (en) * | 1997-04-10 | 1998-10-06 | Memc Electronic Materials, Inc. | Apparartus for cleaning semiconductor wafers |
| KR19990033479A (en) * | 1997-10-24 | 1999-05-15 | 김광교 | Wafer Cleaning Equipment |
| US6767840B1 (en) * | 1997-02-21 | 2004-07-27 | Canon Kabushiki Kaisha | Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100687296B1 (en) * | 2005-12-27 | 2007-02-27 | 한국기계연구원 | Rotating Wafer Carrier and Ultrasonic Cleaning Device Having the Same |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6767840B1 (en) * | 1997-02-21 | 2004-07-27 | Canon Kabushiki Kaisha | Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method |
| US5816274A (en) * | 1997-04-10 | 1998-10-06 | Memc Electronic Materials, Inc. | Apparartus for cleaning semiconductor wafers |
| KR19990033479A (en) * | 1997-10-24 | 1999-05-15 | 김광교 | Wafer Cleaning Equipment |
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