CN112773344B - Blood pressure measuring module - Google Patents
Blood pressure measuring module Download PDFInfo
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- CN112773344B CN112773344B CN202010140097.1A CN202010140097A CN112773344B CN 112773344 B CN112773344 B CN 112773344B CN 202010140097 A CN202010140097 A CN 202010140097A CN 112773344 B CN112773344 B CN 112773344B
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
- A61B5/021—Measuring pressure in heart or blood vessels
- A61B5/022—Measuring pressure in heart or blood vessels by applying pressure to close blood vessels, e.g. against the skin; Ophthalmodynamometers
- A61B5/02233—Occluders specially adapted therefor
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
- A61B5/021—Measuring pressure in heart or blood vessels
- A61B5/02141—Details of apparatus construction, e.g. pump units or housings therefor, cuff pressurising systems, arrangements of fluid conduits or circuits
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
- A61B5/021—Measuring pressure in heart or blood vessels
- A61B5/022—Measuring pressure in heart or blood vessels by applying pressure to close blood vessels, e.g. against the skin; Ophthalmodynamometers
- A61B5/0225—Measuring pressure in heart or blood vessels by applying pressure to close blood vessels, e.g. against the skin; Ophthalmodynamometers the pressure being controlled by electric signals, e.g. derived from Korotkoff sounds
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
- A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
- A61B5/6802—Sensor mounted on worn items
- A61B5/681—Wristwatch-type devices
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- Vascular Medicine (AREA)
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- Ophthalmology & Optometry (AREA)
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- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
- Reciprocating Pumps (AREA)
Abstract
一种血压量测模块,包含一基座、一阀门片、一顶盖、一微型泵、一驱动电路板及一压力传感器,阀门片设置于基座与顶盖之间,微型泵位于基座内,压力传感器设置于驱动电路板,顶盖的一进气通道与压力传感器连接一气囊,微型泵作动使气囊充气压迫使用者皮肤,压力传感器测量气囊内的压力变化,以检测使用者的血压。
A blood pressure measurement module, comprising a base, a valve piece, a top cover, a micropump, a driving circuit board and a pressure sensor, the valve piece is arranged between the base and the top cover, and the micropump is located on the base Inside, the pressure sensor is arranged on the driving circuit board, an air intake channel on the top cover is connected to an air bag with the pressure sensor, the micro pump is activated to inflate the air bag and press the user's skin, and the pressure sensor measures the pressure change in the air bag to detect the user's blood pressure.
Description
技术领域technical field
本案关于一种血压量测模块,尤指一种极薄型,用以与穿戴式电子装置或行动装置结合的血压量测模块。This case relates to a blood pressure measurement module, especially an extremely thin blood pressure measurement module for combining with wearable electronic devices or mobile devices.
背景技术Background technique
近年来对于个人身体保健的意识逐渐抬头,因此衍生出希望能够常态性的对自身的身体状况进行检测,但目前对于检测身体状况的仪器大多为固定式,几乎都要去固定的医疗服务站或是医院,即便有家庭用的检测仪器,但体积偏大,携带不易,于目前讲求快速的社会,已经难以符合使用者的需求。In recent years, the awareness of personal health care has gradually risen, so it is derived to hope to detect one's own physical condition on a regular basis. However, most of the instruments for detecting physical condition are fixed at present, and almost all of them go to fixed medical service stations or It is a hospital, even if there are testing instruments for home use, they are too bulky and difficult to carry. In the current society that emphasizes speed, it is difficult to meet the needs of users.
其中,最能反应身体状况的非血压莫属,每个人的身体中的血管就如同道路般遍布全身,血压就如同路况般,能够了解血液的输送状态,因此,身体若发生任何状况,血压最清楚。Among them, blood pressure is the one that can best reflect the physical condition. The blood vessels in each person's body are like roads all over the body. Blood pressure is like road conditions. It can understand the state of blood delivery. clear.
有鉴于此,如何提供一种能够随时且精确测量血压的装置,并且能够与穿戴式装置或是可携式电子装置结合,让使用者能够随时随地、迅速地确认血压状况,实乃目前需要解决的问题。In view of this, how to provide a device that can accurately measure blood pressure at any time, and can be combined with wearable devices or portable electronic devices, so that users can quickly confirm the blood pressure status anytime, anywhere, is a current need to solve The problem.
发明内容Contents of the invention
本案的主要目的是提供一种血压量测模块,用以与可携式电子装置或是穿戴式电子装置结合,方便使用者携带,能够不受时间、地点等限制即可完成血压量测。The main purpose of this case is to provide a blood pressure measurement module, which can be combined with portable electronic devices or wearable electronic devices, which is convenient for users to carry and can complete blood pressure measurement regardless of time and place restrictions.
本案的一广义实施态样为一种血压量测模块,包括:一基座,具有一阀门承载区、一容置槽区、一进气孔及一穿置孔,其中该阀门承载区及该容置槽区分别设在不同表面,以及该进气孔及该穿置孔连通该容置槽区,而该阀门承载区上设有一第一凹置腔,且该第一凹置腔内贯穿设置多个第一通孔及突伸设置一第一凸出结构,以及该容置槽区内凹设一集气腔室,连通该多个第一通孔;一阀门片,设置承载于该阀门承载区之上,并设有一阀孔,且对应到该第一凸出结构的位置;一顶盖,设有一进气通道及一排气孔,彼此隔开设置,且顶盖具有一组配表面,封盖该阀门片,以及在组配表面对应到该进气通道处凹置一进气腔室,与该进气通道连通,以及在组配表面对应到该排气孔处凹置一排气腔室,与该排气孔连通,且该进气腔室与该排气腔室之间设有一连通通道连通,以及在该排气腔内突出设置一第二凸出结构,且该排气孔位于该第二凸出结构的中心位置,促使该阀门片与该第二凸出结构常态抵顶形成一预力作用,且封闭该排气孔,又该进气通道与血压测量的一气囊连接;一微型泵,设置于该容置槽区内,而封盖该集气腔室;一驱动电路板,封盖该容置槽区上,提供该微型泵的驱动信号而控制该微型泵的驱动运作;以及一压力传感器,设置于该驱动电路板上电性连接,并对应穿置于该基座的该穿置孔,经过该顶盖与该气囊连接做气体压力检测;其中,该微型泵受该驱动电路板控制驱动运作,形成一气体传输,让该基座外部气体由该进气孔导入至该容置槽区内,并经过该微型泵持续导入该集气腔室集中,且气体得以推动该阀门片的该阀孔与该第一凸出结构脱离抵触,此时气体并能经过该阀孔而持续导入该顶盖的该进气通道中,聚集至该气囊中,使该气囊充气膨胀且压迫使用者的皮肤,通过该压力传感器检测使用者的血压。A broad implementation of this case is a blood pressure measurement module, including: a base with a valve bearing area, an accommodating groove area, an air inlet and a piercing hole, wherein the valve bearing area and the The accommodating groove areas are respectively arranged on different surfaces, and the air inlet hole and the piercing hole are connected to the accommodating groove areas, and a first recessed cavity is provided on the valve bearing area, and the first recessed cavity runs through A plurality of first through holes are provided and a first protruding structure is protrudingly provided, and a gas collection chamber is recessed in the accommodating groove area to communicate with the plurality of first through holes; a valve plate is arranged and carried on the On the valve bearing area, there is a valve hole corresponding to the position of the first protruding structure; a top cover is provided with an air inlet passage and an exhaust hole, which are separated from each other, and the top cover has a set of Matching surface, cover the valve plate, and recess an air intake chamber at the place where the assembly surface corresponds to the air intake passage, communicate with the air intake passage, and recess at the place where the assembly surface corresponds to the exhaust hole An exhaust chamber communicates with the exhaust hole, and a communication channel is provided between the intake chamber and the exhaust chamber to communicate, and a second protruding structure is protruded in the exhaust chamber, and The exhaust hole is located at the center of the second protruding structure, so that the valve plate and the second protruding structure are normally abutted to form a pre-force effect, and the exhaust hole is closed, and the air intake channel is connected with the blood pressure measurement An air bag connection; a micropump is arranged in the accommodation tank area, and covers the gas collection chamber; a drive circuit board, covers the accommodation tank area, and provides the driving signal of the micropump to control the driving operation of the micropump; and a pressure sensor, which is arranged on the driving circuit board to be electrically connected, and is corresponding to the piercing hole in the base, and is connected to the air bag through the top cover for gas pressure detection; Wherein, the micropump is controlled and driven by the driving circuit board to form a gas transmission, so that the external air of the base is introduced into the accommodating tank area through the air inlet hole, and is continuously introduced into the gas collection chamber through the micropump The chamber is concentrated, and the gas can push the valve hole of the valve plate out of contact with the first protruding structure, at this time, the gas can pass through the valve hole and continue to be introduced into the air intake channel of the top cover, and gather into the air bag In the process, the airbag is inflated and pressed against the user's skin, and the user's blood pressure is detected by the pressure sensor.
附图说明Description of drawings
图1为本案血压量测模块立体示意图。FIG. 1 is a three-dimensional schematic diagram of the blood pressure measurement module of this case.
图2A为本案血压量测模块分解示意图。FIG. 2A is an exploded schematic diagram of the blood pressure measurement module in this case.
图2B为本案血压量测模块其另一角度分解示意图。FIG. 2B is an exploded schematic view of the blood pressure measurement module of the present case at another angle.
图3为本案血压量测模块压力传感器设置于驱动电路板示意图。FIG. 3 is a schematic diagram of the pressure sensor of the blood pressure measurement module arranged on the driving circuit board in this case.
图4为本案血压量测模块阀门片设置于基座示意图。FIG. 4 is a schematic diagram of the valve piece of the blood pressure measurement module being arranged on the base in this case.
图5为本案血压量测模块连接气囊的示意图。FIG. 5 is a schematic diagram of the blood pressure measurement module connected to the airbag in this case.
图6A为本案气体检测模块的微型泵分解示意图。FIG. 6A is an exploded schematic view of the micropump of the gas detection module of the present case.
图6B为本案气体检测模块的微型泵另一角度的分解示意图。FIG. 6B is an exploded schematic diagram of another angle of the micropump of the gas detection module of the present invention.
图7A为本案气体检测模块的微型泵的剖面示意图。FIG. 7A is a schematic cross-sectional view of the micropump of the gas detection module of the present invention.
图7B为本案气体检测模块另一实施例的剖面示意图。7B is a schematic cross-sectional view of another embodiment of the gas detection module of the present invention.
图7C至图7E为微型泵的作动示意图。7C to 7E are schematic diagrams of the action of the micropump.
图8A为微机电泵的剖面示意图。FIG. 8A is a schematic cross-sectional view of a MEMS pump.
图8B为微机电泵的分解示意图。Fig. 8B is an exploded schematic view of the MEMS pump.
图9A至图9C为微机电泵的作动示意图。9A to 9C are schematic diagrams of the operation of the MEMS pump.
图10为本案血压量测模块俯视示意图。FIG. 10 is a schematic top view of the blood pressure measurement module of this case.
图11为图10的AA剖面线的剖面示意图。FIG. 11 is a schematic cross-sectional view along line AA of FIG. 10 .
图12为图10的BB剖面线的剖面示意图。FIG. 12 is a schematic cross-sectional view of the BB section line in FIG. 10 .
图13为图10的CC剖面线的剖面示意图。FIG. 13 is a schematic cross-sectional view taken along line CC in FIG. 10 .
图14A及图14B为本案血压量测模块的进气示意图。14A and 14B are schematic diagrams of air intake of the blood pressure measurement module of this case.
图15为血压量测模块的泄气示意图。FIG. 15 is a schematic diagram of deflation of the blood pressure measurement module.
图16为血压量测模块另一实施例示意图。Fig. 16 is a schematic diagram of another embodiment of the blood pressure measurement module.
图17A为血压量测模块另一实施例的顶盖示意图。FIG. 17A is a schematic diagram of the top cover of another embodiment of the blood pressure measurement module.
图17B为血压量测模块另一实施例的顶盖另一角度示意图。FIG. 17B is a schematic diagram of another angle of the top cover of another embodiment of the blood pressure measurement module.
图18为血压量测模块另一实施例的剖面示意图。FIG. 18 is a schematic cross-sectional view of another embodiment of the blood pressure measurement module.
图19为血压量测模块另一实施例的进气示意图。Fig. 19 is a schematic diagram of another embodiment of the air intake of the blood pressure measurement module.
图20为血压量测模块另一实施例的泄气示意图。FIG. 20 is a schematic diagram of another embodiment of the blood pressure measurement module.
图21为血压量测模块连接外部装置示意图。Fig. 21 is a schematic diagram of connecting the blood pressure measurement module to external devices.
附图标记说明Explanation of reference signs
1:基座1: base
11:阀门承载区11: Valve bearing area
11a:第一凹置腔11a: First recessed cavity
11b:第一通孔11b: first through hole
11c:第一凸出结构11c: First protrusion structure
11d:凸柱11d: Boss
11e:第二凹置腔11e: Second recessed cavity
11f:第二通孔11f: second through hole
12:容置槽区12: Storage tank area
12a:集气腔室12a: Gas collection chamber
13:进气孔13: Air intake hole
14:穿置孔14: piercing hole
15:第一表面15: First Surface
16:第二表面16: Second Surface
2:阀门片2: Valve sheet
21:阀孔21: valve hole
22:定位穿孔22: positioning perforation
3:顶盖3: Top cover
31:进气通道31: Intake channel
31a:进气腔室31a: Inlet chamber
32:排气孔32: exhaust hole
32a:排气腔室32a: Exhaust chamber
32b:第二凸出结构32b: Second protrusion structure
33:组配表面33: Assembly surface
34:连通通道34: Connected channel
35:定位孔35: positioning hole
36:共用通道36: shared channel
36a:连接端36a: Connection end
4:微型泵4: micro pump
41:进气板41: Air intake plate
411:通气孔411: Vent
412:汇流排槽412: busbar groove
413:汇流腔室413: confluence chamber
42:共振片42: Resonant plate
421:中空孔421: hollow hole
422:可动部422: Movable part
423:固定部423: fixed part
43:压电致动器43: Piezoelectric Actuator
431:悬浮板431: Hoverboard
432:外框432: Frame
433:支架433: bracket
434:压电元件434: Piezoelectric element
435:空隙435: Void
436:凸部436: Convex
44:第一绝缘片44: The first insulating sheet
45:导电片45: conductive sheet
46:第二绝缘片46: Second insulating sheet
47:腔室空间47: Chamber space
4a:微机电泵4a: MEMS pump
41a:第一基板41a: first substrate
411a:流入孔411a: Inflow hole
412a:基板第一表面412a: Substrate first surface
413a:基板第二表面413a: the second surface of the substrate
42a:第一氧化层42a: first oxide layer
421a:汇流通道421a: Confluence channel
422a:汇流腔室422a: Confluence chamber
43a:第二基板43a: Second substrate
431a:硅晶片层431a: Silicon wafer layer
4311a:致动部4311a: Actuator
4312a:外周部4312a: Peripheral part
4313a:连接部4313a: connection part
4314a:流体通道4314a: Fluid Channel
432a:第二氧化层432a: second oxide layer
4321a:振动腔室4321a: Vibration Chamber
433a:硅材层433a: Silicon layer
4331a:穿孔4331a: perforation
4332a:振动部4332a: Vibration Department
4333a:固定部4333a: fixed part
4334a:第三表面4334a: Third Surface
4335a:第四表面4335a: Fourth Surface
44a:压电组件44a: Piezoelectric component
441a:下电极层441a: lower electrode layer
442a:压电层442a: piezoelectric layer
443a:绝缘层443a: insulating layer
444a:上电极层444a: upper electrode layer
5:驱动电路板5: Driver circuit board
6:压力传感器6: Pressure sensor
7:微处理器7: Microprocessor
8:通讯器8: Communicator
9:外部装置9: External device
10:气囊10: Airbag
10a:气囊导管10a: Balloon catheter
具体实施方式Detailed ways
体现本案特征与优点的一些典型实施例将在后段的说明中详细叙述。应理解的是本案能够在不同的态样上具有各种的变化,其皆不脱离本案的范围,且其中的说明及图示在本质上当作说明之用,而非用以限制本案。Some typical embodiments embodying the features and advantages of the present application will be described in detail in the description in the following paragraphs. It should be understood that the present case can have various changes in different aspects without departing from the scope of the present case, and the descriptions and diagrams therein are used for illustration in nature rather than limiting the present case.
请参阅图1至图2B所示,本案提供一种血压量测模块,包含一基座1、一阀门片2、一顶盖3、一微型泵4、一驱动电路板5及一压力传感器6。其中基座1、阀门片2、顶盖3、微型泵4、驱动电路板5及压力传感器6以微小材料制出的模块结构,且该模块结构具有一长度、一宽度及一高度,其中模块结构的长度、宽度及高度介于1厘米(mm)至999厘米(mm)之间,或者介于1微米(μm)至999微米(μm)之间,或者介于1纳米(nm)至999纳米(nm)之间,但不以此为限。于本实施例中,模块结构的长度介于1微米至999微米、宽度介于1微米至999微米以及高度介于1微米至999微米所构成的体积,或者模块结构的长度介于1纳米至999纳米、宽度介于1纳米至999纳米以及高度介于1纳米至999纳米所构成的体积,但不以此为限。Please refer to Figures 1 to 2B, this case provides a blood pressure measurement module, including a base 1, a valve plate 2, a top cover 3, a micro pump 4, a driving circuit board 5 and a pressure sensor 6 . The base 1, the valve plate 2, the top cover 3, the micropump 4, the drive circuit board 5 and the pressure sensor 6 are modular structures made of tiny materials, and the modular structure has a length, a width and a height, wherein the module The length, width and height of the structures are between 1 centimeter (mm) and 999 centimeters (mm), or between 1 micrometer (μm) and 999 micrometers (μm), or between 1 nanometer (nm) and 999 Between nanometers (nm), but not limited thereto. In this embodiment, the length of the module structure is between 1 micron and 999 microns, the width is between 1 micron and 999 microns, and the volume formed by the height is between 1 micron and 999 microns, or the length of the module structure is between 1 nanometer and 999 microns. 999 nm, a width ranging from 1 nm to 999 nm, and a height ranging from 1 nm to 999 nm, but not limited thereto.
上述的基座1包含有一阀门承载区11、一容置槽区12、一进气孔13、一穿置孔14、一第一表面15及一第二表面16,第一表面15与第二表面16分别为相对的二表面,阀门承载区11位于第一表面15,容置槽区12位于第二表面16,进气孔13及穿置孔14分别自第一表面15贯穿至第二表面16且连通于容置槽区12,其中,第一阀门承载区11具有一第一凹置腔11a、多个第一通孔11b、一第一凸出结构11c及多个凸柱11d,第一凹置腔11a自阀门承载区11凹陷形成,于第一凹置腔11a中心突伸设置第一凸出结构11c,该多个第一通孔11b围绕第一凸出结构11c且贯穿至容置槽区12,凸柱11d则是分别邻设于阀门承载区11的角落,此外,容置槽区12凹设一集气腔室12a,集气腔室12a与该多个第一通孔11b相连通。The above-mentioned base 1 includes a valve bearing area 11, an accommodating groove area 12, an air inlet 13, a penetration hole 14, a first surface 15 and a second surface 16, the first surface 15 and the second surface The surfaces 16 are two opposite surfaces, the valve bearing area 11 is located on the first surface 15, the accommodating groove area 12 is located on the second surface 16, the air inlet 13 and the through hole 14 respectively penetrate from the first surface 15 to the second surface 16 and communicates with the accommodation groove area 12, wherein the first valve bearing area 11 has a first recessed cavity 11a, a plurality of first through holes 11b, a first protruding structure 11c and a plurality of protrusions 11d, the first A recessed cavity 11a is recessed from the valve bearing area 11, and a first protruding structure 11c protrudes from the center of the first recessed cavity 11a. The plurality of first through holes 11b surround the first protruding structure 11c and penetrate to the container. In the groove area 12, the protrusions 11d are respectively adjacent to the corners of the valve bearing area 11. In addition, the accommodating groove area 12 is recessed with a gas collection chamber 12a, and the gas collection chamber 12a is connected to the plurality of first through holes. 11b is connected.
此外,阀门承载区11更包含一第二凹置腔11e,第二凹置腔11e与第一凹置腔11a间隔设置,且第二凹置腔11e贯穿至少一第二通孔11f,使第二凹置腔11e通过第二通孔11f与集气腔室12a相连通,增加集气腔室12a与阀门承载区11的通道,以加速集气腔室12a内的气体至阀门承载区11的速度。In addition, the valve bearing area 11 further includes a second recessed cavity 11e, the second recessed cavity 11e is spaced apart from the first recessed cavity 11a, and the second recessed cavity 11e passes through at least one second through hole 11f, so that the second recessed cavity 11e The two recessed chambers 11e communicate with the gas-collecting chamber 12a through the second through hole 11f, increasing the passage between the gas-collecting chamber 12a and the valve bearing area 11, so as to accelerate the gas in the gas-collecting chamber 12a to the valve bearing area 11 speed.
请参阅图2A及图4,阀门片2设置于阀门承载区11,阀门片2具有一阀孔21及多个定位穿孔22,阀孔21与阀门承载区11的第一凸出结构11c垂直对应,该多个定位穿孔22则分别与该多个凸柱11d对应且套设于该多个凸柱11d。Please refer to Fig. 2A and Fig. 4, the valve plate 2 is arranged on the valve bearing area 11, the valve plate 2 has a valve hole 21 and a plurality of positioning perforations 22, the valve hole 21 is vertically corresponding to the first protruding structure 11c of the valve bearing area 11 , the plurality of positioning through holes 22 respectively correspond to the plurality of protrusions 11d and are sleeved on the plurality of protrusions 11d.
如图17A及图17B所示,顶盖3具有一进气通道31、一排气孔32、一组配表面33、一连通通道34及多个定位孔35,进气通道31与排气孔32间隔设置,组配表面33封盖于阀门片2,且组配表面33于进气通道31周缘凹置与进气通道31相连通的一进气腔室31a、于排气孔32周缘凹置与排气孔32相通的排气腔室32a、及进气腔室31a与排气腔室32a之间凹设连通通道34,使进气腔室31a与排气腔室32a连通。此外,于排气腔室32a及排气孔32边缘处突出设置一第二凸出结构32b;请参阅图12,阀门片2承载于阀门承载区11上,并夹置于基座1与顶盖3之间定位不偏移,此时,排气孔32位于第二凸出结构32b的中心位置,第二凸出结构32b将顶抵阀门片2并封闭排气孔32,于常态下形成一预力作用。As shown in Figure 17A and Figure 17B, the top cover 3 has an air intake channel 31, an exhaust hole 32, a set of matching surfaces 33, a communication channel 34 and a plurality of positioning holes 35, the air intake channel 31 and the exhaust hole 32 are arranged at intervals, and the assembly surface 33 is sealed on the valve plate 2, and an air intake chamber 31a communicated with the air intake passage 31 is recessed in the assembly surface 33 on the periphery of the air intake passage 31, and is recessed on the periphery of the exhaust hole 32. The exhaust chamber 32a communicated with the exhaust hole 32, and the communication channel 34 is recessed between the intake chamber 31a and the exhaust chamber 32a, so that the intake chamber 31a communicates with the exhaust chamber 32a. In addition, a second protruding structure 32b is protruded at the edge of the exhaust chamber 32a and the exhaust hole 32; please refer to FIG. The positioning between the covers 3 is not offset. At this time, the vent hole 32 is located at the center of the second protruding structure 32b, and the second protruding structure 32b will press against the valve plate 2 and close the vent hole 32, forming a normal state. A pre-force effect.
请参阅图2A、图2B及图11图11所示,该多个定位孔35分别位于组配表面33的四个角落并分别与阀门承载区11的该多个凸柱11d对应,并供该多个凸柱11d套置其中。Please refer to FIG. 2A, FIG. 2B and FIG. 11. As shown in FIG. 11, the plurality of positioning holes 35 are respectively located at the four corners of the assembly surface 33 and correspond to the plurality of protrusions 11d of the valve bearing area 11, and are used for the A plurality of protrusions 11d are nested therein.
请参阅图2B及图5,顶盖3亦包含有一共用通道36,共用通道36与进气通道31连通并构成一体,共用通道36的一端延伸至压力传感器6并且封盖压力传感器6(如图13所示),另一端则为连接端36a(如图10所示),用以气囊10连接,促使压力传感器6通过共用通道36连通气囊10做气体压力检测,以进一步做血压测量。2B and FIG. 5, the top cover 3 also includes a common channel 36, the common channel 36 communicates with the air inlet channel 31 and forms an integral body, and one end of the common channel 36 extends to the pressure sensor 6 and covers the pressure sensor 6 (as shown in FIG. 13), and the other end is the connection end 36a (as shown in Figure 10), which is used to connect the airbag 10, so that the pressure sensor 6 is connected to the airbag 10 through the common channel 36 for gas pressure detection, and further blood pressure measurement.
请继续参阅图2B,微型泵4设置于容置槽区12内,且封盖集气腔室12a,而驱动电路板5封盖容置槽区12上,驱动电路板5电性连接微型泵4,以提供微型泵4驱动信号以控制微型泵4的驱动及运作,此外,压力传感器6电性连接于驱动电路板5上,且对应穿置于基座1的穿置孔14,压力传感器6的一端穿伸经过顶盖3,且与该气囊10连接(如图5所示)。Please continue to refer to FIG. 2B, the micropump 4 is arranged in the storage tank area 12, and covers the gas collection chamber 12a, and the driving circuit board 5 covers the storage tank area 12, and the driving circuit board 5 is electrically connected to the micropump. 4, to provide the driving signal of the micropump 4 to control the driving and operation of the micropump 4. In addition, the pressure sensor 6 is electrically connected to the driving circuit board 5, and corresponds to the through hole 14 in the base 1. The pressure sensor One end of 6 passes through the top cover 3 and is connected with the airbag 10 (as shown in FIG. 5 ).
请参阅图6A及图6B,微型泵4包含有包括一进气板41、一共振片42、一压电致动器43、一第一绝缘片44、一导电片45及第二绝缘片46等结构,其中压电致动器43对应于共振片42而设置,并使进气板41、共振片42、压电致动器43、第一绝缘片44、导电片45及第二绝缘片46等依序堆叠设置。Please refer to Fig. 6A and Fig. 6B, micropump 4 comprises and comprises an air inlet plate 41, a resonant sheet 42, a piezoelectric actuator 43, a first insulating sheet 44, a conductive sheet 45 and a second insulating sheet 46 and other structures, wherein the piezoelectric actuator 43 is arranged corresponding to the resonant sheet 42, and the intake plate 41, the resonant sheet 42, the piezoelectric actuator 43, the first insulating sheet 44, the conductive sheet 45 and the second insulating sheet 46 and so on are stacked in sequence.
进气板41具有至少一通气孔411、至少一汇流排槽412及一汇流腔室413,于本实施例中,通气孔411的数量以4个为较佳,但不以此为限。通气孔411是贯穿进气板41,用以供气体顺应大气压力的作用而自通气孔411流入微型泵4内。进气板41上具有至少一汇流排槽412,其数量与位置与进气板41另一表面的通气孔411对应设置,本实施例的通气孔411其数量为4个,与其对应的汇流排槽412其数量亦为4个;汇流腔室413位于进气板41的中心处,前述的4个汇流排槽412的一端连通于对应的通气孔411,其另一端则连通于进气板41的中心处的汇流腔室413,借此可将自通气孔411进入汇流排槽412的气体引导并汇流集中至汇流腔室413。于本实施例中,进气板41具有一体成型的通气孔411、汇流排槽412及汇流腔室413。The air inlet plate 41 has at least one air hole 411 , at least one confluence row groove 412 and one confluence chamber 413 . In this embodiment, the number of air holes 411 is preferably four, but not limited thereto. The vent hole 411 runs through the intake plate 41 for gas to flow into the micropump 4 through the vent hole 411 in response to the atmospheric pressure. There is at least one busbar groove 412 on the air inlet plate 41, the number and position of which are set corresponding to the air holes 411 on the other surface of the air inlet plate 41. The number of air holes 411 in this embodiment is four, and the corresponding bus bar The number of grooves 412 is also four; the confluence chamber 413 is located at the center of the air intake plate 41, one end of the aforementioned four confluence row grooves 412 is connected to the corresponding air hole 411, and the other end is connected to the air intake plate 41 The confluence chamber 413 at the center of the gas flow chamber 413 , so that the gas entering the confluence row groove 412 from the vent hole 411 can be guided and concentrated into the confluence chamber 413 . In this embodiment, the air intake plate 41 has a vent hole 411 , a confluence row groove 412 and a confluence chamber 413 integrally formed.
于一些实施例中,进气板41的材质可为不锈钢材质所构成,但不以此为限。于另一些实施例中,汇流腔室413的深度与汇流排槽412的深度相同,但不以此为限。In some embodiments, the material of the intake plate 41 may be made of stainless steel, but not limited thereto. In some other embodiments, the depth of the bus chamber 413 is the same as that of the bus groove 412 , but not limited thereto.
共振片42是由一可挠性材质所构成,但不以此为限,且于共振片42上具有一中空孔421,是对应于进气板41的汇流腔室413而设置,供气体通过。于另一些实施例中,共振片42是可由一铜材质所构成,但不以此为限。The resonant plate 42 is made of a flexible material, but not limited thereto, and has a hollow hole 421 on the resonant plate 42, which is set corresponding to the confluence chamber 413 of the inlet plate 41, for gas to pass through . In some other embodiments, the resonant piece 42 may be made of a copper material, but not limited thereto.
压电致动器43是由一悬浮板431、一外框432、至少一支架433以及一压电元件434所共同组装而成;悬浮板431为一正方形型态,并可弯曲振动,外框432环绕悬浮板431设置,至少一支架433连接于悬浮板431与外框432之间,提供弹性支撑的效果,压电元件434亦为正方形型态,贴附于悬浮板431的一表面,用以施加电压产生形变以驱动悬浮板431弯曲振动,且压电元件434的边长小于或等于悬浮板431的边长;其中,悬浮板431、外框432及支架433之间具有多个空隙435,空隙435供气体通过;此外,压电致动器43更包含一凸部436,凸部436设置于悬浮板431的另一表面,并与压电元件434相对设置于悬浮板431的两表面。The piezoelectric actuator 43 is assembled together by a suspension plate 431, an outer frame 432, at least one bracket 433 and a piezoelectric element 434; the suspension plate 431 is a square shape, and can bend and vibrate, and the outer frame 432 is arranged around the suspension board 431, and at least one bracket 433 is connected between the suspension board 431 and the outer frame 432 to provide the effect of elastic support. Apply voltage to generate deformation to drive the suspension board 431 to bend and vibrate, and the side length of the piezoelectric element 434 is less than or equal to the side length of the suspension board 431; wherein, there are multiple gaps 435 between the suspension board 431, the outer frame 432 and the bracket 433 , the gap 435 for gas to pass through; in addition, the piezoelectric actuator 43 further includes a convex portion 436, the convex portion 436 is arranged on the other surface of the suspension plate 431, and is arranged on the two surfaces of the suspension plate 431 opposite to the piezoelectric element 434 .
如图7A所示,进气板41、共振片42、压电致动器43、第一绝缘片44、导电片45、第二绝缘片46依序推叠设置,压电致动器43的悬浮板431其厚度小于外框432的厚度,当共振片42堆叠于压电致动器43时,压电致动器43的悬浮板431、外框432与共振片42之间可形成一腔室空间47。As shown in Figure 7A, the intake plate 41, the resonant sheet 42, the piezoelectric actuator 43, the first insulating sheet 44, the conductive sheet 45, and the second insulating sheet 46 are stacked in sequence, and the piezoelectric actuator 43 The thickness of the suspension plate 431 is smaller than the thickness of the outer frame 432. When the resonant plate 42 is stacked on the piezoelectric actuator 43, a cavity can be formed between the suspension plate 431 of the piezoelectric actuator 43, the outer frame 432 and the resonant plate 42. Chamber space 47.
请再参阅图7B,图7B为微型泵4的另一实施例,其元件与前一实施例(图6A)相同,故不加以赘述,其差异在于,于未作动时,其压电致动器43的悬浮板431以冲压方式以远离共振片42的方向延伸,并未与外框432位于同一水平,其延伸距离可由支架433所调整,且支架433与悬浮板431之间呈现非平行,使得压电致动器43呈凸出状。Please refer to FIG. 7B again. FIG. 7B is another embodiment of the micropump 4. Its components are the same as those in the previous embodiment (FIG. 6A), so they will not be described in detail. The suspension plate 431 of the actuator 43 extends away from the resonant plate 42 by stamping, and is not at the same level as the outer frame 432. The extension distance can be adjusted by the bracket 433, and the bracket 433 and the suspension plate 431 are non-parallel. , so that the piezoelectric actuator 43 is convex.
为了了解上述微型泵4提供气体传输的输出作动方式,请继续参阅图7C至图7E所示,请先参阅图7C,压电致动器43的压电元件434被施加驱动电压后产生形变带动悬浮板431向上位移,此时腔室空间47的容积提升,于腔室空间47内形成了负压,便汲取汇流腔室413内的气体进入腔室空间47内,同时共振片42受到共振原理的影响被同步向上带动,连带增加了汇流腔室413的容积,且因汇流腔室413内的气体进入腔室空间47的关系,造成汇流腔室413内同样为负压状态,进而通过通气孔411及汇流排槽412来吸取气体进入汇流腔室413内。请再参阅图7D,压电元件434带动悬浮板431向下位移,压缩腔室空间47,同样的,共振片42被悬浮板431因共振而向下位移,同步推挤腔室空间47内的气体往下通过空隙435向上输送,将气体由微型泵4排出。最后请参阅图7E,当悬浮板431回复原位时,共振片42仍因惯性而向下位移,此时的共振片42将使压缩腔室空间47内的气体向空隙435移动,并且提升汇流腔室413内的容积,让气体能够持续地通过通气孔411、汇流排槽412来汇聚于汇流腔室413内,通过不断地重复上述图7C至图7E所示的微型泵提供气体传输作动步骤,使微型泵能够使气体连续自通气孔411进入进气板41及共振片42所构成流道产生压力梯度,再由空隙435向上输送,使气体高速流动,达到微型泵4传输气体的效果。In order to understand the output actuation mode of the above-mentioned micropump 4 to provide gas transmission, please continue to refer to FIG. 7C to FIG. 7E , please refer to FIG. 7C first, the piezoelectric element 434 of the piezoelectric actuator 43 is deformed after being applied with a driving voltage The suspension plate 431 is driven to move upwards. At this time, the volume of the chamber space 47 is increased, and a negative pressure is formed in the chamber space 47, and the gas in the confluence chamber 413 is drawn into the chamber space 47, and the resonant plate 42 is resonated at the same time. The effect of the principle is driven upward synchronously, which increases the volume of the confluence chamber 413, and because the gas in the confluence chamber 413 enters the chamber space 47, the confluence chamber 413 is also in a negative pressure state, and then through the The gas hole 411 and the confluence row groove 412 are used to absorb gas into the confluence chamber 413 . Please refer to Fig. 7D again, the piezoelectric element 434 drives the suspension plate 431 to move downward, compressing the chamber space 47, similarly, the resonant plate 42 is displaced downward by the suspension plate 431 due to resonance, and simultaneously pushes the liquid in the chamber space 47 The gas is transported upward through the gap 435 downwards, and the gas is discharged by the micropump 4 . Finally, please refer to FIG. 7E. When the suspension plate 431 returns to its original position, the resonant plate 42 is still displaced downward due to inertia. At this time, the resonant plate 42 will move the gas in the compressed chamber space 47 to the gap 435, and enhance the confluence. The volume in the chamber 413 allows the gas to be continuously collected in the confluence chamber 413 through the vent hole 411 and the confluence row groove 412, and the gas transmission action is provided by continuously repeating the above-mentioned micropump shown in FIG. 7C to FIG. 7E The first step is to enable the micropump to make the gas continuously enter the flow channel formed by the air intake plate 41 and the resonance plate 42 from the vent hole 411 to generate a pressure gradient, and then transport the gas upward through the gap 435 to make the gas flow at a high speed, so as to achieve the effect of the gas transmission by the micropump 4 .
本案的微型泵4的另一实施例可为一微机电泵4a,请参阅图8A及图8B,微机电泵4a包含有一第一基板41a、一第一氧化层42a、一第二基板43a以及一压电组件44a。本实施例的微机电泵4a是通过半导体制程中的磊晶、沉积、微影及蚀刻等制程一体成型制出,理应无法拆解,为了详述其内部结构,特以图8B所示的分解图详述的。Another embodiment of the micropump 4 of this case can be a microelectromechanical pump 4a, please refer to Figure 8A and Figure 8B, the microelectromechanical pump 4a includes a first substrate 41a, a first oxide layer 42a, a second substrate 43a and A piezoelectric element 44a. The microelectromechanical pump 4a of this embodiment is integrally formed through epitaxy, deposition, lithography, and etching processes in the semiconductor manufacturing process. It should not be disassembled. In order to describe its internal structure in detail, the decomposition shown in FIG. 8B is used. Figure detailed.
第一基板41a为一硅晶片(Si wafer),其厚度介于150至400微米(μm)之间,第一基板41a具有多个流入孔411a、一基板第一表面412a最后如一基板第二表面413a,于本实施例中,该多个流入孔411a的数量为4个,但不以此为限,且每个流入孔411a皆由基板第二表面413a贯穿至基板第一表面412a,而流入孔411a为了提升流入效果,将流入孔411a自第二表面413a至第一表面412a呈现渐缩的锥形。The first substrate 41a is a silicon wafer (Si wafer), and its thickness is between 150 to 400 microns (μm). The first substrate 41a has a plurality of inflow holes 411a, a substrate first surface 412a, and finally a substrate second surface. 413a, in this embodiment, the number of the plurality of inflow holes 411a is four, but not limited thereto, and each inflow hole 411a penetrates from the second surface 413a of the substrate to the first surface 412a of the substrate, and flows into In order to improve the inflow effect of the hole 411a, the inflow hole 411a presents a tapered shape from the second surface 413a to the first surface 412a.
第一氧化层42a为一二氧化硅(SiO2)薄膜,其厚度介于10至20微米(μm)之间,第一氧化层42a叠设于第一基板41a的基板第一表面412a上,第一氧化层42a具有多个汇流通道421a以及一汇流腔室422a,汇流通道421a与第一基板41a的流入孔411a其数量及位置相互对应。于本实施例中,汇流通道421a的数量同样为4个,4个汇流通道421a的一端分别连通至第一基板41a的4个流入孔411a,而4个汇流通道421a的另一端则连通于汇流腔室422a,让气体分别由流入孔411a进入之后,通过其对应相连的汇流通道421a后汇聚至汇流腔室422a内。The first oxide layer 42a is a silicon dioxide (SiO2) film with a thickness between 10 and 20 microns (μm). The first oxide layer 42a is stacked on the first surface 412a of the first substrate 41a. An oxide layer 42a has a plurality of confluence channels 421a and a confluence chamber 422a, and the number and positions of the confluence channels 421a and the inflow holes 411a of the first substrate 41a correspond to each other. In this embodiment, the number of confluence channels 421a is also four, and one ends of the four confluence channels 421a are respectively connected to the four inflow holes 411a of the first substrate 41a, while the other ends of the four confluence channels 421a are connected to the confluence channels 421a. The chamber 422a allows the gases to enter through the inflow holes 411a respectively, pass through the corresponding confluence channels 421a connected thereto, and then converge into the confluence chamber 422a.
第二基板43a为一绝缘层上覆硅的硅晶片(SOI wafer),包含有:一硅晶片层431a、一第二氧化层432a以及一硅材层433a;硅晶片层431a的厚度介于10至20微米(μm)之间,具有一致动部4311a、一外周部4312a、多个连接部4313a以及多个流体通道4314a,致动部4311a呈圆形;外周部4312a呈中空环状,环绕于致动部4311a的外围;该多个连接部4313a分别位于致动部4311a与外周部4312a之间,并且连接两者,提供弹性支撑的功能。该多个流体通道4314a环绕形成于致动部2311a的外围,且分别位于该多个连接部4313a之间The second substrate 43a is a silicon-on-insulator silicon wafer (SOI wafer), comprising: a silicon wafer layer 431a, a second oxide layer 432a and a silicon material layer 433a; the thickness of the silicon wafer layer 431a is between 10 Between 20 micrometers (μm), there is an actuating part 4311a, an outer peripheral part 4312a, a plurality of connecting parts 4313a and a plurality of fluid channels 4314a, the actuating part 4311a is circular; the outer peripheral part 4312a is a hollow ring, surrounding the The periphery of the actuating part 4311a; the plurality of connecting parts 4313a are respectively located between the actuating part 4311a and the outer peripheral part 4312a, and connect the two to provide the function of elastic support. The plurality of fluid passages 4314a are formed around the periphery of the actuating portion 2311a, and are respectively located between the plurality of connecting portions 4313a
第二氧化层432a为一氧化硅层其厚度介于0.5至2微米(μm)之间,形成于硅晶片层431a上,呈中空环状,并与硅晶片层431a定义一振动腔室4321a。硅材层433a呈圆形,位于第二氧化层432a且结合至第一氧化层42a,硅材层433a为二氧化硅(SiO2)薄膜,厚度介于2至5微米(μm)之间,具有一穿孔4331a、一振动部4332a、一固定部4333a、一第三表面4334a及一第四表面4335a。穿孔4331a形成于硅材层433a的中心,振动部4332a位于穿孔4331a的周边区域,且垂直对应于振动腔室4321a,固定部4333a则为硅材层433a的周缘区域,由固定部4333a固定于第二氧化层432a,第三表面4334a与第二氧化层432a接合,第四表面4335a与第一氧化层42a接合;压电组件44a叠设于硅晶片层431a的致动部4311a。The second oxide layer 432a is a silicon oxide layer with a thickness between 0.5 and 2 micrometers (μm), formed on the silicon wafer layer 431a in a hollow ring shape, and defines a vibration chamber 4321a with the silicon wafer layer 431a. The silicon material layer 433a is circular, located on the second oxide layer 432a and bonded to the first oxide layer 42a, the silicon material layer 433a is a silicon dioxide (SiO2) film with a thickness between 2 and 5 microns (μm), having A through hole 4331a, a vibration part 4332a, a fixed part 4333a, a third surface 4334a and a fourth surface 4335a. The through hole 4331a is formed in the center of the silicon material layer 433a, the vibration part 4332a is located in the peripheral area of the through hole 4331a, and is vertically corresponding to the vibration chamber 4321a, and the fixed part 4333a is the peripheral area of the silicon material layer 433a, and is fixed to the second part by the fixed part 4333a. The oxide layer 432a, the third surface 4334a is bonded to the second oxide layer 432a, and the fourth surface 4335a is bonded to the first oxide layer 42a; the piezoelectric element 44a is stacked on the actuation portion 4311a of the silicon wafer layer 431a.
压电组件44a呈圆形,包含有下电极层441a、压电层442a、绝缘层443a及上电极层444a,下电极层441a叠置于硅晶片层431a的致动部4311a,而压电层442a叠置于下电极层441a,两者通过其接触的区域做电性连接,此外,压电层442a的宽度小于下电极层441a的宽度,使得压电层442a无法完全遮蔽住下电极层441a,在于压电层442a的部分区域以及下电极层441a未被压电层442a所遮蔽的区域上叠置绝缘层443a,最后在于绝缘层443a以及未被绝缘层443a遮蔽的压电层442a的区域上叠置上电极层444a,让上电极层444a得以与压电层442a接触来电性连接,同时利用绝缘层443a阻隔于上电极层444a及下电极层441a之间,避免两者直接接触造成短路。The piezoelectric component 44a is circular and includes a lower electrode layer 441a, a piezoelectric layer 442a, an insulating layer 443a, and an upper electrode layer 444a. The lower electrode layer 441a is stacked on the actuator portion 4311a of the silicon wafer layer 431a, and the piezoelectric layer 442a is stacked on the lower electrode layer 441a, and the two are electrically connected through the contact area. In addition, the width of the piezoelectric layer 442a is smaller than that of the lower electrode layer 441a, so that the piezoelectric layer 442a cannot completely cover the lower electrode layer 441a. The insulating layer 443a is stacked on the partial area of the piezoelectric layer 442a and the area of the lower electrode layer 441a not covered by the piezoelectric layer 442a, and finally on the insulating layer 443a and the area of the piezoelectric layer 442a not covered by the insulating layer 443a Overlapping the upper electrode layer 444a, so that the upper electrode layer 444a can be in contact with the piezoelectric layer 442a for electrical connection, while using the insulating layer 443a to block between the upper electrode layer 444a and the lower electrode layer 441a to avoid direct contact between the two to cause a short circuit .
请参考图9A至图9C,图9A至图9C为微机电泵4a其作动示意图。请先参考图9A,当压电组件44a的下电极层441a及上电极层444a接收驱动电路板5所传递的驱动电压及驱动信号(未图示)后,将其传导至压电层442a,压电层442a接受驱动电压及驱动信号后,因逆压电效应的影响开始产生形变,会带动硅晶片层431a的致动部4311a开始位移,当压电组件44a带动致动部4311a向上位移拉开与第二氧化层432a之间的距离,此时,第二氧化层432a的振动腔室4321a的容积将提升,让振动腔室4321a内形成负压,用于将第一氧化层42a的汇流腔室422a内的气体通过穿孔4331a吸入其中。请继续参阅图9B,当致动部4311a受到压电组件44a的牵引向上位移时,硅材层433a的振动部4332a会因共振原理的影响向上位移,当振动部4332a向上位移时,会压缩振动腔室4321a的空间并且推动振动腔室4321a内的气体往硅晶片层431a的流体通道4314a移动,让气体能够通过流体通道4314a向上排出,在振动部4332a向上位移来压缩振动腔室4321a的同时,汇流腔室422a的容积因振动部4332a位移而提升,其内部形成负压,将吸取微机电泵4a外的气体由流入孔411a进入其中。最后如图9C所示,压电组件44a带动硅晶片层431a的致动部4311a向下位移时,将振动腔室4321a的气体往流体通道4314a推动,并将气体排出,而硅材层433a的振动部4332a亦受致动部4311a的带动向下位移,同步压缩汇流腔室422a的气体通过穿孔4331a向振动腔室4321a移动,后续再将压电组件44a带动致动部4311a向上位移时,其振动腔室4321a的容积会大幅提升,进而有较高的汲取力将气体吸入振动腔室4321a,再重复以上的动作,以至于通过压电组件44a持续带动致动部4311a上下位移且来连动振动部4332a上下位移,通过改变微机电泵4a的内部压力,使其不断地汲取及排出气体,借此以完成微机电泵4a的动作。Please refer to FIG. 9A to FIG. 9C . FIG. 9A to FIG. 9C are schematic diagrams of the operation of the MEMS pump 4 a. Please refer to FIG. 9A first. After the lower electrode layer 441a and the upper electrode layer 444a of the piezoelectric component 44a receive the driving voltage and driving signal (not shown) transmitted by the driving circuit board 5, they are conducted to the piezoelectric layer 442a, After the piezoelectric layer 442a receives the driving voltage and driving signal, it begins to deform due to the influence of the inverse piezoelectric effect, which will drive the actuator part 4311a of the silicon wafer layer 431a to start to displace. When the piezoelectric component 44a drives the actuator part 4311a to move upward At this time, the volume of the vibration chamber 4321a of the second oxide layer 432a will increase, so that a negative pressure will be formed in the vibration chamber 4321a, which is used for converging the flow of the first oxide layer 42a The gas in the chamber 422a is sucked into it through the perforation 4331a. Please continue to refer to FIG. 9B. When the actuator part 4311a is pulled upward by the piezoelectric component 44a and moves upward, the vibrating part 4332a of the silicon material layer 433a will move upward due to the influence of the resonance principle. When the vibrating part 4332a moves upward, it will compress the vibration The space of the chamber 4321a also pushes the gas in the vibration chamber 4321a to move to the fluid channel 4314a of the silicon wafer layer 431a, so that the gas can be discharged upward through the fluid channel 4314a. When the vibration part 4332a moves upward to compress the vibration chamber 4321a, The volume of the confluence chamber 422a is increased due to the displacement of the vibrating part 4332a, and a negative pressure is formed inside it, and the gas sucked from the microelectromechanical pump 4a enters it through the inflow hole 411a. Finally, as shown in FIG. 9C, when the piezoelectric component 44a drives the actuator part 4311a of the silicon wafer layer 431a to move downward, the gas in the vibration chamber 4321a is pushed toward the fluid channel 4314a, and the gas is discharged, while the silicon material layer 433a The vibrating part 4332a is also driven by the actuating part 4311a to move downward, and the gas compressed in the confluence chamber 422a moves to the vibrating chamber 4321a through the perforation 4331a, and when the piezoelectric component 44a drives the actuating part 4311a to move upward, its The volume of the vibration chamber 4321a will be greatly increased, and then there will be a higher suction force to suck the gas into the vibration chamber 4321a, and then repeat the above actions, so that the piezoelectric component 44a will continuously drive the actuating part 4311a to move up and down and move in unison The vibrating part 4332a moves up and down, and by changing the internal pressure of the microelectromechanical pump 4a, it continuously absorbs and discharges gas, thereby completing the action of the microelectromechanical pump 4a.
请参阅图14A所示,微型泵4开始作动,气体由微型泵4的通气孔411开始进入,并将气体持续导送至集气腔室12a,请参阅图14B,气体持续输送到集气腔室12a后,气体便由第一通孔11b进入第一凹置腔11a,同时通过第二通孔11f进入第二凹置腔11e,而进入第一凹置腔11a与第二凹置腔11e的气体会将阀门片2向上推动,并使其向顶盖3靠近,此时,阀门片2将顶抵于排气腔室32a的第二凸出结构32b,且同时封闭排气孔32,同时阀门片2脱离第一凹置腔11a的第一凸出结构11c,将第二凹置腔11e、第一凹置腔11a的气体得以通过阀孔21进入进气腔室31a,而气体进入进气腔室31a后,导入进气通道31,最后汇聚至气囊10(如图5所示)内。于本实施例中,气体进入进气通道31后,先通过共用通道36,再进入位于连接端36a的气囊10,开始对气囊10充气使其膨胀,使气囊10能够紧贴于测量者,再通过压力传感器6检测气囊10的压力变化,进行血压测量的动作。Please refer to Figure 14A, the micropump 4 starts to operate, the gas enters from the vent hole 411 of the micropump 4, and the gas is continuously delivered to the gas collection chamber 12a, please refer to Figure 14B, the gas is continuously delivered to the gas collection chamber After the chamber 12a, the gas enters the first recessed cavity 11a through the first through hole 11b, and enters the second recessed cavity 11e through the second through hole 11f at the same time, and enters the first recessed cavity 11a and the second recessed cavity The gas in 11e will push the valve plate 2 upwards and make it approach the top cover 3. At this time, the valve plate 2 will press against the second protruding structure 32b of the exhaust chamber 32a, and at the same time close the exhaust hole 32 At the same time, the valve plate 2 is separated from the first protruding structure 11c of the first recessed cavity 11a, so that the gas in the second recessed cavity 11e and the first recessed cavity 11a can enter the intake chamber 31a through the valve hole 21, and the gas After entering the air intake chamber 31a, it is introduced into the air intake channel 31 and finally converges into the airbag 10 (as shown in FIG. 5 ). In this embodiment, after the gas enters the air intake passage 31, it first passes through the common passage 36, and then enters the airbag 10 located at the connection end 36a, and starts to inflate the airbag 10 to make it expand, so that the airbag 10 can be close to the measurer, and then The pressure change of the airbag 10 is detected by the pressure sensor 6 to perform blood pressure measurement.
如图15所示,血压测量完毕后,微型泵4停止运作,故气囊10内的气压高于进气腔室31a的气压,气体开始自气囊10通过进气通道31导送至进气腔室31a,气体输送至进气腔室31a的同时,推动阀门片2向下移动,并使阀孔21被第一凸出结构11c封闭,气体将通过连通通道34,由进气腔室31a向排气腔室32a流动,此外,气体将阀门片2向下推动时,阀门片2脱离第二凸出结构32b,并被推移靠近掉入第二凹置腔11e内,将排气腔室32a与排气孔32连通,气体进入排气腔室32a后,得以由排气孔32排出,释放气囊10内的气体,俾完成该气囊10的快速泄压作业。As shown in Figure 15, after the blood pressure measurement is completed, the micropump 4 stops operating, so the air pressure in the airbag 10 is higher than the air pressure in the intake chamber 31a, and the gas starts to be guided from the airbag 10 to the intake chamber through the intake passage 31 31a, when the gas is transported to the intake chamber 31a, the valve plate 2 is pushed down, and the valve hole 21 is closed by the first protruding structure 11c, and the gas will pass through the communication channel 34, from the intake chamber 31a to the exhaust The gas chamber 32a flows, and in addition, when the gas pushes the valve plate 2 downward, the valve plate 2 breaks away from the second protruding structure 32b, and is pushed close to and falls into the second recessed cavity 11e, and the exhaust chamber 32a is connected to the second concave cavity 11e. The exhaust hole 32 is connected, and after the gas enters the exhaust chamber 32a, it can be discharged through the exhaust hole 32 to release the gas in the airbag 10, so as to complete the rapid pressure relief operation of the airbag 10.
请参阅图16,图16是本案血压量测模块的另一实施方式,本实施方式与前一实施方式大部分元件皆相同,因此不再赘述,差异在于顶盖3,本实施方式的顶盖3未设有共用通道36;接着请参阅图18,未设有共用通道36的情况下,本实施例的气囊10具有一气囊导管10a,气囊导管10a与气囊10相连通,并且在连接至顶盖3的进气通道31并且罩盖压力传感器6,微型泵4开始作动,气体并开始进入进气通道31(如图19所示),气体通过进气通道31后,经由气囊导管10a进入气囊10,使气囊10开始充气、膨胀,压迫使用者的皮肤,并通过压力传感器6由气囊导管10a确认气囊10内的气压变化,来检测使用者的血压,检测结束后,微型泵4停止运作,气体便会由气囊导管10a导回至进气通道31,最后由排气孔32排出(如图20所示),达到快速泄气、泄压的功效。Please refer to Fig. 16. Fig. 16 is another embodiment of the blood pressure measurement module of this case. Most of the components of this embodiment are the same as those of the previous embodiment, so no more details are given. The difference lies in the top cover 3, the top cover of this embodiment 3 No common channel 36 is provided; then please refer to FIG. 18 , when no common channel 36 is provided, the air bag 10 of this embodiment has an air bag duct 10a, and the air bag duct 10a communicates with the air bag 10 and is connected to the top The air intake channel 31 of the cover 3 and the cover pressure sensor 6, the micropump 4 starts to act, and the gas enters the air intake channel 31 (as shown in Figure 19). The airbag 10 starts to inflate and inflate the airbag 10, presses the user's skin, and confirms the air pressure change in the airbag 10 by the airbag catheter 10a through the pressure sensor 6 to detect the user's blood pressure. After the detection is completed, the micropump 4 stops operating , the gas will be guided back to the air intake passage 31 by the airbag catheter 10a, and finally discharged through the exhaust hole 32 (as shown in FIG. 20 ), so as to achieve the effect of rapid deflation and pressure relief.
最后请再参阅图1,本案的血压量测模块较佳的长度介于4mm至30mm之间,较佳的宽度介于2mm至16mm之间,较佳的高度介于1mm至8mm之间,使血压量测模块得以与可携式电子装置结合。此外,血压量测模块为了与智慧型手表结合,其较佳的长度可介于24mm至30mm之间、较佳的宽度可介于14mm至16mm之间,较佳的厚度可介于6mm至8mm之间。Finally, please refer to Figure 1. The preferred length of the blood pressure measurement module in this case is between 4mm and 30mm, the preferred width is between 2mm and 16mm, and the preferred height is between 1mm and 8mm, so that The blood pressure measurement module can be combined with the portable electronic device. In addition, in order to combine the blood pressure measurement module with a smart watch, the preferred length can be between 24mm and 30mm, the preferred width can be between 14mm and 16mm, and the preferred thickness can be between 6mm and 8mm between.
如图21所示,血压量测模块可更包含一微处理器7及一通讯器8,设置于该驱动电路板5上,该微处理器7用以接收该压力传感器6所量测信号予以运算转换成一信息数据,并将该信息数据经过该通讯器通讯传输至一外部装置9予以储存处理应用,其中该通讯传输为一有线传输及一无线传输的至少其中之一,外部装置是为一云端系统、一可携式装置、一电脑系统等至少其中之一。As shown in Figure 21, the blood pressure measurement module can further include a microprocessor 7 and a communicator 8, which are arranged on the drive circuit board 5, and the microprocessor 7 is used to receive the signal measured by the pressure sensor 6 for The calculation is converted into an information data, and the information data is transmitted to an external device 9 through the communicator for storage, processing and application, wherein the communication transmission is at least one of a wired transmission and a wireless transmission, and the external device is a At least one of a cloud system, a portable device, and a computer system.
综上所述,本案所提供的血压量测模块座经由基座、阀门片及顶盖的设置,能够达到对气囊快速排气与快速进气的效果,并且通过微型泵大幅缩小泵的体积,使血压量测模块能够设置于智慧型手表等穿戴式装置上,极具产业利用性及进步性。In summary, the blood pressure measurement module seat provided in this case can achieve the effect of rapid exhaust and rapid intake of the airbag through the setting of the base, valve plate and top cover, and the volume of the pump can be greatly reduced by the micro pump. The blood pressure measurement module can be set on wearable devices such as smart watches, which is very industrially applicable and progressive.
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