CN112687245A - Optical module, forming method thereof and display device - Google Patents
Optical module, forming method thereof and display device Download PDFInfo
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- CN112687245A CN112687245A CN201910993317.2A CN201910993317A CN112687245A CN 112687245 A CN112687245 A CN 112687245A CN 201910993317 A CN201910993317 A CN 201910993317A CN 112687245 A CN112687245 A CN 112687245A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 135
- 238000000034 method Methods 0.000 title claims abstract description 39
- 239000002344 surface layer Substances 0.000 claims abstract description 43
- 239000012788 optical film Substances 0.000 claims abstract description 41
- 239000000853 adhesive Substances 0.000 claims description 39
- 230000001070 adhesive effect Effects 0.000 claims description 39
- 239000010410 layer Substances 0.000 claims description 16
- 238000004806 packaging method and process Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 16
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 238000005538 encapsulation Methods 0.000 claims description 12
- 239000010408 film Substances 0.000 claims description 11
- 239000000084 colloidal system Substances 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 7
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 3
- 229910052740 iodine Inorganic materials 0.000 claims description 3
- 239000011630 iodine Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000007547 defect Effects 0.000 abstract description 6
- 238000007789 sealing Methods 0.000 abstract description 5
- 239000003292 glue Substances 0.000 description 20
- 238000010586 diagram Methods 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 5
- 239000004372 Polyvinyl alcohol Substances 0.000 description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 description 4
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
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Abstract
The disclosure relates to an optical module, an optical module forming method and a display device. According to this optical module of this disclosed embodiment, optical module sets up in the screen bottom, optical module includes: an optical sensor disposed on the printed circuit board; and the optical film is directly attached to the optical sensor. The optical film is directly attached to the surface layer of the optical sensor, so that the distance between the optical film and the optical sensor is close enough, the sealing performance is good, the defects of air entering, light leakage and the like are avoided, the performance of detecting external environment light is improved, and the power consumption is reduced. In addition, the formed optical module has small size, simple process and low process difficulty, realizes the minimization of the height of the device and reduces the production and manufacturing cost.
Description
Technical Field
The present disclosure relates to an optical module, an optical module forming method, and a display device including the optical module.
Background
In recent years, mobile phone products gradually move toward full-screen, and the display area gradually occupies the whole screen area, which results in poor placement area of the optical sensor. The optical sensor is mainly used for collecting the external environment brightness or color temperature of the mobile phone product. Then, brightness or color temperature of the mobile phone screen is adjusted, so that power consumption is reduced, and user experience is improved.
In the related art, the optical sensor is directly placed at the bottom of the Organic Light Emitting Diode (OLED) screen, but such a design results in poor performance of the screen.
Disclosure of Invention
To overcome the problems in the related art, embodiments of the present disclosure provide an optical module, a method for forming the optical module, and a display device including the optical module.
According to an aspect of the embodiments of the present disclosure, there is provided an optical module disposed at a bottom of a screen, the optical module including: the optical sensor is arranged on the printed circuit board; an optical film bonded to the optical sensor.
In an alternative embodiment, the optical film includes a polarizer film layer.
In an alternative embodiment, the polarizer is an iodine-based polarizer or a grating polarizer.
In an alternative embodiment, the optical module further comprises an adhesive glue layer for directly attaching the optical film to the optical sensor.
In alternative embodiments, the adhesive glue layer is formed from any one of a pressure sensitive adhesive, an optical glue, a thermosetting glue, an ultraviolet light curing glue, and a die attach film.
In an alternative embodiment, the optical sensor comprises: a substrate; and the photosensitive element and the digital-to-analog conversion circuit unit are packaged on the substrate through a transparent packaging surface layer.
In an alternative embodiment, the transparent encapsulation surface layer is any one of an epoxy transparent encapsulation surface layer, a glass encapsulation surface layer and a silicon-based semiconductor surface layer.
According to another aspect of the embodiments of the present disclosure, there is provided a display device including: the optical module of any of the preceding embodiments.
According to yet another aspect of the embodiments of the present disclosure, there is provided an optical module forming method, the optical module including an optical sensor, the method including: disposing the optical sensor on a flexible printed circuit board; and adhering an optical film to the optical sensor.
In an alternative embodiment, in the above optical module forming method, the optical sensor includes: a substrate; and the photosensitive element and the digital-to-analog conversion circuit unit are packaged on the substrate through a transparent packaging surface layer.
In an alternative embodiment, the transparent package surface layer is any one of an epoxy transparent package surface layer, a glass package surface layer and a silicon-based sensor surface layer.
In an alternative embodiment, the optical film is directly attached by using an adhesive colloid, wherein the adhesive colloid is any one of a pressure-sensitive adhesive, an optical adhesive, a thermosetting adhesive, an ultraviolet-curable adhesive and a die-attaching film.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:
the optical film is directly attached to the surface layer of the optical sensor, so that the performance of detecting external environment light is improved, the distance between the optical film and the optical sensor is close enough, the sealing performance is good, the defects of air entering, light leakage and the like are avoided, and the power consumption is reduced. In addition, the formed optical module is small in size, simple in process and low in process difficulty, the height of a device is minimized, and the production and manufacturing cost is reduced.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The above and other objects, features and advantages of the embodiments of the present disclosure will become more apparent from the following detailed description with reference to the accompanying drawings. Several embodiments of the present disclosure are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which:
FIG. 1 is a schematic diagram illustrating the construction of an optical module in accordance with an exemplary embodiment;
FIG. 2 is a schematic diagram of one configuration of an optical sensor shown in accordance with an exemplary embodiment;
FIG. 3 is another schematic structural diagram of an optical sensor shown in accordance with an exemplary embodiment;
FIG. 4 is a flow chart illustrating a method of forming an optical module according to an exemplary embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
Fig. 1 shows a schematic structural diagram of an optical module according to an exemplary embodiment. The optical module can be placed at the bottom of the screen. For example, the screen may be an OLED screen or other display screen.
As shown in fig. 1, in an exemplary embodiment, the optical module 100 may include: an optical film 101; an optical sensor 102; a printed circuit board 103. Among them, the printed circuit board 103 may be a flexible printed circuit board.
As can be seen from the schematic structural diagram shown in fig. 1, the optical sensor 102 is disposed on the printed circuit board 103, and the optical film 101 is attached to the optical sensor 102. Wherein the optical film 101 can be directly attached to the optical sensor 102.
This optical module 100 is through directly laminating optical film on optical sensor surface layer for distance between optical film and the optical sensor is close enough, the leakproofness is good, has avoided defects such as air admission and light leak, thereby has improved the performance that detects external environment light, has reduced the consumption. And the size of the formed optical module is small, the height of the device is minimized, and the production and manufacturing cost is reduced.
In alternative embodiments, the optical film 101 shown in FIG. 1 may include a polarizer film. Since the optical film 101 includes a polarizer film layer, the material used for the polarizer film layer may generate a physical and chemical reaction at a high temperature (e.g., 85 ℃), thereby causing the optical performance to be deteriorated. Therefore, if other methods such as direct coating are adopted, the optical film cannot be formed on the surface layer of the silicon-based sensor.
In order to avoid such a problem, the optical module 100 is formed by directly bonding the optical film 101 to the optical sensor 102 according to the embodiment of the present disclosure. The optical module 100 thus formed not only has good optical performance, but also prevents the polarizer from losing optical performance through a high temperature process.
In an alternative embodiment, the polarizer may be an iodine-based polarizer or a grating polarizer.
In addition, in the embodiment shown in fig. 1, the optical module 100 may further include: an adhesive glue layer 104. The optical film 101 can be directly bonded to the optical sensor 102 through the adhesive layer 104. For example, the adhesive glue layer 104 may be formed using an optical glue, so that the adhesive glue layer has a high optical transmittance.
Illustratively, the adhesive glue layer may also be formed of any one of a pressure sensitive adhesive PSA, polyvinyl alcohol PVA, or other optical glue. For example, the Adhesive gel layer may also be formed using Optically Clear Adhesive (OCA), thermosetting Adhesive, ultraviolet light curing (UV) Adhesive, Die Attach Film (DAF), or the like. By forming the adhesive colloid by using these materials, the optical performance of the adhesive colloid layer is good and the optical transmittance is high.
In summary, the adhesive glue layer 104 shown in fig. 1 is formed by using PSA glue or other optical glue, and the optical film 101 is directly attached to the optical sensor 102 by means of the adhesive glue layer 104, so that not only is the problem that the silicon-based sensor cannot directly implement the polarizer solved, but also the optical performance of the polarizer is prevented from being deteriorated due to a high-temperature process. So that the optical module 100 formed in this manner has good optical performance. Fig. 2 shows a schematic structural diagram of an optical sensor according to an exemplary embodiment.
As shown in fig. 2, the optical sensor 200 may include: a transparent packaging surface layer 201, a photosensitive element and digital-to-analog conversion circuit unit 202 and a substrate 203. The photosensitive element and the digital-to-analog conversion circuit unit 202 are located on the substrate 203, and the transparent packaging surface layer 201 packages the photosensitive element and the digital-to-analog conversion circuit unit 202 on the substrate 203.
In the case of the embodiment shown in FIG. 2, the optical film 101 shown in FIG. 1 is directly attached to the transparent encapsulant surface layer 202. For example, the transparent packaging surface layer 201 shown in fig. 2 can be made of a transparent packaging material such as glass, and thus has high optical transmittance and good optical performance, thereby improving the performance of detecting external ambient light.
Fig. 3 shows another schematic structural diagram of an optical sensor according to an exemplary embodiment.
As shown in fig. 3, the optical sensor 300 may include: an Epoxy resin (Epoxy) transparent packaging surface layer 301, a photosensitive element and digital-to-analog conversion circuit unit 302 and a substrate 303.
Similarly to the optical sensor shown in fig. 2, in fig. 3, the photosensor and the digital-to-analog conversion circuit unit 302 are located on a substrate 303, and an epoxy transparent encapsulation surface layer 301 encapsulates the photosensor and the digital-to-analog conversion circuit unit 302 on the substrate 303. In the case of the embodiment shown in fig. 3, the optical film 101 shown in fig. 1 is directly attached to the epoxy transparent encapsulation surface layer 301. The epoxy resin transparent packaging surface layer 301 has high light transmittance and good optical performance, and further improves the performance of detecting external environment light.
In the exemplary embodiments of the present disclosure, by directly attaching an optical film on an epoxy resin surface layer of an optical package (e.g., Quad Flat No-lead package (QFN), a Ball Grid Array (BGA)), the performance of detecting external ambient light is improved, the height minimization of a device is achieved, and the manufacturing cost is reduced.
In an alternative embodiment, the optical module may be directly bonded to the optical film by using an adhesive.
Illustratively, the adhesive gel may be any of a pressure sensitive adhesive PSA, a polyvinyl alcohol PVA, or other optical glue. For example, Optically Clear Adhesive (OCA), thermosetting Adhesive, Ultraviolet (UV) curable Adhesive, Die Attach Film (DAF) optical Adhesive, and the like may also be used.
According to the embodiment of the disclosure, the optical film is attached to the transparent packaging surface layer of the optical sensor by adopting PSA glue or other optical glue, so that the problem that the polarizer cannot be directly realized on the silicon-based packaging surface layer or the silicon-based sensor is solved, and the optical performance failure caused by the high-temperature process of the polarizer is avoided. Moreover, the optical module formed in such a manner has good optical performance and high optical transmittance, thereby improving the performance of detecting external ambient light.
In another embodiment of the present disclosure, a display device including the optical module in any one of the above embodiments is provided. Through the mode that adopts the laminating, increase the optics module PSA glued membrane or adopt the optical film of other optics bonding colloids, directly laminate at the transparent encapsulation surface layer of optical sensor to place the optics module that forms like this in OLED screen bottom for example, realized this display device's minimum size design, reduced the technology degree of difficulty. FIG. 4 illustrates a flow chart of a method of forming an optical module according to an exemplary embodiment.
As shown in fig. 4, the optical module forming method 400 includes the following steps S401 and S402:
in step S401, the optical sensor is disposed on a printed circuit board;
in step S402, an optical film is directly bonded to the optical sensor.
According to the optical module forming method disclosed by the embodiment of the disclosure, the process is simple, the process difficulty is low, the optical film is directly attached to the optical sensor, so that the distance between the optical film and the optical sensor is close enough, the sealing performance is good, the defects of air entering, light leakage and the like are avoided, the performance of detecting external environment light is improved, the height minimization of a device is realized, and the production cost is reduced.
In an alternative embodiment, in the method of optical module forming method 400 shown in FIG. 1, the optical sensor includes: the substrate, the photosensitive element and the digital-to-analog conversion circuit unit are packaged on the substrate through a transparent packaging surface layer. In this case, the method further includes: and directly attaching the optical film to the transparent packaging surface layer.
In an alternative embodiment, in the method of optical module forming method 400 shown in FIG. 4, the transparent encapsulation surface layer may be any one of an epoxy transparent encapsulation surface layer and a glass encapsulation surface layer.
In an alternative embodiment, in the optical module forming method 400 shown in fig. 4, the optical film may be directly attached by using an adhesive glue, wherein the adhesive glue is any one of a pressure sensitive adhesive and an optical adhesive.
The optical module forming method has the characteristics of simple process and low process difficulty, the optical film is directly attached to the surface layer of the optical sensor, so that the distance between the optical film and the optical sensor is close enough, the sealing performance is good, the defects of air entering, light leakage and the like are avoided, the performance of detecting external ambient light is improved, the height of a device is minimized, and the production cost is reduced.
In summary, the embodiment of the present disclosure directly attaches the optical film to the surface layer of the optical sensor, so that the distance between the optical film and the optical sensor is close enough, the sealing performance is good, and the defects of air entry, light leakage and the like are avoided, thereby improving the performance of detecting the external ambient light and reducing the power consumption. In addition, the size of the formed optical module is small, the process is simple, the process difficulty is low, the minimization of the height of a device is realized, and the production cost is reduced.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (12)
1. An optical module, characterized in that, optical module sets up in the screen bottom, and this optical module includes:
an optical sensor disposed on the printed circuit board; and
and the optical film is attached to the optical sensor.
2. The optical module of claim 1,
the optical film comprises a polarizer film layer.
3. The optical module of claim 2,
the polaroid is an iodine polaroid or a grating polaroid.
4. The optical module of any of claims 1-3,
also comprises an adhesive colloid layer which is arranged on the outer surface of the shell,
the adhesive colloid is used for directly adhering the optical film to the optical sensor.
5. The optical module of claim 4,
the adhesive colloid layer is formed by any one of pressure-sensitive adhesive, optical adhesive, thermosetting adhesive, ultraviolet light curing adhesive and crystal grain attachment film.
6. The optical module of claim 1, wherein the optical sensor comprises:
a substrate; and
a light sensitive element and a digital-to-analog conversion circuit unit,
the photosensitive element and the digital-to-analog conversion circuit unit are packaged on the substrate through a transparent packaging surface layer.
7. The optical module of claim 6,
the transparent packaging surface layer is any one of an epoxy resin transparent packaging surface layer, a glass packaging surface layer and a silicon-based semiconductor surface layer.
8. A display device comprising an optical module, wherein the optical module is according to any one of claims 1-7.
9. A method of forming an optical module including an optical sensor, the method comprising:
disposing the optical sensor on a flexible printed circuit board;
and attaching an optical film to the optical sensor.
10. The method of claim 9, wherein the optical sensor comprises: a substrate; and the photosensitive element and the digital-to-analog conversion circuit unit are packaged on the substrate through a transparent packaging surface layer.
11. The method of claim 10, wherein the transparent encapsulation surface layer is any one of an epoxy transparent encapsulation surface layer, a glass encapsulation surface layer, and a silicon-based sensor surface layer.
12. The method of forming an optical module according to any one of claims 9 to 11,
and directly attaching the optical film by using an adhesive colloid, wherein the adhesive colloid is any one of pressure-sensitive adhesive, optical adhesive, thermosetting adhesive, ultraviolet-curing adhesive and grain attachment film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910993317.2A CN112687245A (en) | 2019-10-18 | 2019-10-18 | Optical module, forming method thereof and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910993317.2A CN112687245A (en) | 2019-10-18 | 2019-10-18 | Optical module, forming method thereof and display device |
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| Publication Number | Publication Date |
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| CN112687245A true CN112687245A (en) | 2021-04-20 |
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| CN201910993317.2A Pending CN112687245A (en) | 2019-10-18 | 2019-10-18 | Optical module, forming method thereof and display device |
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Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102053287A (en) * | 2010-10-29 | 2011-05-11 | 明基材料有限公司 | Film material with hardening layer and forming method thereof as well as forming method of optical film |
| JP2013029356A (en) * | 2011-07-27 | 2013-02-07 | Canon Inc | Radiation detection element |
| CN104317102A (en) * | 2011-11-10 | 2015-01-28 | 常州丰盛光电科技股份有限公司 | Light guide module for backlight module and manufacturing device thereof |
| CN204390200U (en) * | 2014-12-23 | 2015-06-10 | 斯迪克新型材料（江苏）有限公司 | High strength touch-control display module |
| CN204390199U (en) * | 2014-12-23 | 2015-06-10 | 斯迪克新型材料（江苏）有限公司 | For the touch screen of smart electronics |
| US20150369734A1 (en) * | 2014-06-18 | 2015-12-24 | Capella Microsystems (Taiwan), Inc. | Optical module |
| CN105683993A (en) * | 2013-09-27 | 2016-06-15 | 硅显示技术有限公司 | Optical thin film transistor-type fingerprint sensor |
| KR20160074401A (en) * | 2014-12-18 | 2016-06-28 | 닛토덴코 가부시키가이샤 | Method for producing optical display panel and system for producing optical display panel |
| CN107886926A (en) * | 2017-11-22 | 2018-04-06 | 广东欧珀移动通信有限公司 | Display screen and electronic equipment |
| CN108469300A (en) * | 2018-03-14 | 2018-08-31 | 业成科技（成都）有限公司 | Environment photographic hole encapsulating structure and its manufacturing method |
| CN109328358A (en) * | 2018-09-17 | 2019-02-12 | 深圳市汇顶科技股份有限公司 | Shield lower Systems for optical inspection, electronic equipment and its object proximity detection method |
| CN109445171A (en) * | 2018-12-29 | 2019-03-08 | 厦门天马微电子有限公司 | A kind of manufacturing method of display module, display device and display device |
| US20190165024A1 (en) * | 2014-11-14 | 2019-05-30 | Viavi Solutions Inc. | Use of dark mirror coating to suppress stray light in an optical sensor assembly |
| CN209328045U (en) * | 2019-01-22 | 2019-08-30 | 上海思立微电子科技有限公司 | For shielding the recognizer component of lower optical finger print |
-
2019
- 2019-10-18 CN CN201910993317.2A patent/CN112687245A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102053287A (en) * | 2010-10-29 | 2011-05-11 | 明基材料有限公司 | Film material with hardening layer and forming method thereof as well as forming method of optical film |
| JP2013029356A (en) * | 2011-07-27 | 2013-02-07 | Canon Inc | Radiation detection element |
| CN104317102A (en) * | 2011-11-10 | 2015-01-28 | 常州丰盛光电科技股份有限公司 | Light guide module for backlight module and manufacturing device thereof |
| CN105683993A (en) * | 2013-09-27 | 2016-06-15 | 硅显示技术有限公司 | Optical thin film transistor-type fingerprint sensor |
| US20150369734A1 (en) * | 2014-06-18 | 2015-12-24 | Capella Microsystems (Taiwan), Inc. | Optical module |
| US20190165024A1 (en) * | 2014-11-14 | 2019-05-30 | Viavi Solutions Inc. | Use of dark mirror coating to suppress stray light in an optical sensor assembly |
| KR20160074401A (en) * | 2014-12-18 | 2016-06-28 | 닛토덴코 가부시키가이샤 | Method for producing optical display panel and system for producing optical display panel |
| CN204390200U (en) * | 2014-12-23 | 2015-06-10 | 斯迪克新型材料（江苏）有限公司 | High strength touch-control display module |
| CN204390199U (en) * | 2014-12-23 | 2015-06-10 | 斯迪克新型材料（江苏）有限公司 | For the touch screen of smart electronics |
| CN107886926A (en) * | 2017-11-22 | 2018-04-06 | 广东欧珀移动通信有限公司 | Display screen and electronic equipment |
| CN108469300A (en) * | 2018-03-14 | 2018-08-31 | 业成科技（成都）有限公司 | Environment photographic hole encapsulating structure and its manufacturing method |
| CN109328358A (en) * | 2018-09-17 | 2019-02-12 | 深圳市汇顶科技股份有限公司 | Shield lower Systems for optical inspection, electronic equipment and its object proximity detection method |
| CN109445171A (en) * | 2018-12-29 | 2019-03-08 | 厦门天马微电子有限公司 | A kind of manufacturing method of display module, display device and display device |
| CN209328045U (en) * | 2019-01-22 | 2019-08-30 | 上海思立微电子科技有限公司 | For shielding the recognizer component of lower optical finger print |
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