CN112475502A

CN112475502A - Solder ring positioning method

Info

Publication number: CN112475502A
Application number: CN201910865227.5A
Authority: CN
Inventors: 刘坤明; 张敬瑜; 吴信汉
Original assignee: Gaoer Technology Co ltd
Current assignee: Gaoer Technology Co ltd
Priority date: 2019-09-12
Filing date: 2019-09-12
Publication date: 2021-03-12

Abstract

The invention relates to a solder ring positioning method, which comprises providing a base with a groove and a raised wall surrounding the groove on the top. Then, a solder ring is placed on the raised wall, and a first limiting frame is placed on the solder ring and the base, wherein the first limiting frame is provided with a central opening penetrating through the first limiting frame and a plurality of notches communicated with the central opening, and the positions of the notches correspond to the positions of the solder ring so as to expose the solder ring. Then, a soldering iron head of a soldering iron sequentially extends into each notch, and spot welding is carried out on the solder ring so as to solder the solder ring on the convex wall. Finally, the first limiting frame is removed to achieve the purpose of positioning the solder ring.

Description

Solder ring positioning method

Technical Field

The present invention relates to a positioning method, and more particularly, to a solder ring positioning method.

Background

With the rapid progress of semiconductor industry and electronic technology, the technology for manufacturing infrared sensors has been advanced. The infrared sensor can be used not only in medicine for measuring body temperature, but also in science, commerce and military, such as laser detection, missile guidance, infrared spectrometer, remote controller, burglar alarm, thermal image reconnaissance and other uses. The infrared sensors can be classified into thermal (thermal) and photon (photon) types. Since the thermal infrared sensor is convenient to use, the thermal infrared sensor is widely used.

The structure of the existing thermal infrared sensor comprises a metal base, the metal base has a cavity, a thermoelectric cooler (TEC) is fixed in the cavity, an infrared sensing chip is fixed on the surface of the thermoelectric cooler, an getter is fixed in the cavity, a solder ring is arranged above the metal base, and a glass layer is fixed on the metal base by the solder ring. However, the solder ring is only used for connecting the glass layer and the metal base, so the solder ring has a very thin thickness and a very light weight, and is easy to displace and not easy to be fixed at the same position for connecting the glass layer no matter the solder ring is placed on the metal base by a machine or a human way.

Therefore, the present invention provides a solder ring positioning method to solve the above problems.

Disclosure of Invention

The main object of the present invention is to provide a method for positioning a solder ring, which comprises pressing the solder ring against the raised wall of the base by a limiting frame, extending a soldering tip into a notch of the limiting frame, spot-welding the solder ring to solder the solder ring on the raised wall, and positioning the solder ring on the base for soldering the optical transparent window.

To achieve the above object, the present invention provides a solder ring positioning method, which comprises the following steps: providing a base, wherein the top of the base is provided with a groove and a convex wall surrounding the groove; placing a solder ring on the raised wall; placing a first limiting frame on the solder ring and the base, wherein the first limiting frame is provided with a central opening penetrating through the first limiting frame and a plurality of notches communicated with the central opening, and the positions of the notches correspond to the positions of the solder ring so as to expose the solder ring; a soldering iron head of a soldering iron sequentially extends into each notch, and spot welding is carried out on the solder ring so as to weld the solder ring on the convex wall; and moving away from the first limit frame.

In an embodiment of the invention, the top of the base has an outer platform and an inner platform, the outer platform is located around the raised wall, the raised wall is located around the inner platform, the inner platform surrounds the groove, and the height of the raised wall is higher than the height of the inner platform and the outer platform.

In an embodiment of the invention, the outer platform has a plurality of first conductive pads, and the inner platform has a plurality of second conductive pads.

In an embodiment of the invention, the top surface of the first position-limiting frame has a plurality of inclined surfaces and a plane surrounding and connected to the inclined surfaces, and the notches and the inclined surfaces are alternately arranged.

In one embodiment of the present invention, the bevel is 30-60 degrees.

In one embodiment of the present invention, the solder ring has a thickness of 0.025 to 0.15 millimeters (mm).

In an embodiment of the invention, the first position-limiting frame is made of teflon or aluminum.

In an embodiment of the invention, after the step of providing the base and before the step of placing the solder ring on the raised wall, the following steps are performed: placing the base on a base; and placing an infrared sensing chip in the groove. After the step of placing the solder ring on the raised wall and before the step of placing the first limiting frame on the solder ring and the base, the following steps are carried out: placing a second limit frame on the solder ring, the infrared sensing chip, the base and the pedestal to position the infrared sensing chip; and moving away from the second limit frame.

In one embodiment of the present invention, the solder ring is used to solder an optical transparent window.

In one embodiment of the present invention, the base is a ceramic base.

In summary, the solder ring is pressed on the raised wall of the base by the limiting frame, and then the solder head is extended into the notch of the limiting frame to perform spot welding on the solder ring so as to weld the solder ring on the raised wall and further position the solder ring on the base.

So that the manner in which the above recited features of the present invention can be understood and appreciated, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings.

Drawings

Fig. 1 to 4 are schematic views of steps of a solder ring positioning method according to a first embodiment of the present invention.

Fig. 5 to 10 are schematic views showing steps of a solder ring positioning method according to a second embodiment of the present invention.

Description of reference numerals: 10, a base; 12 an outer platform; 14 raised walls; 16 an inner platform; 18 grooves; 20 a first conductive pad; 22 a second conductive pad; 24 a solder ring; 26 a first limit frame; 28 a central opening; 30 gaps; 32 inclined planes; 34 plane surface; 36 a base; 38 an infrared sensing chip; 40 second limit frame.

Detailed Description

Embodiments of the present invention will be further explained by means of the following figures in conjunction with related drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts. In the drawings, the shape and thickness may be exaggerated for simplicity and convenience. It is to be understood that elements not specifically shown in the drawings or described in the specification are of a type well known to those of ordinary skill in the art. Many variations and modifications may be made by one of ordinary skill in the art in light of the teachings of the present invention.

When an element is referred to as being "at … …," it can be broadly interpreted as referring to the fact that the element is directly at the other element or that the other element is present in both. Conversely, when an element is referred to as being directly on the other element, it is not intended that the other element be present between the two elements. As used herein, the words and/or any combination including one or more of the associated listed items.

Reference will now be made in detail to "one embodiment" or "an embodiment" of the present invention, which refers to a particular element, structure, or characteristic described in connection with at least one embodiment. Thus, the appearances of the phrase "one embodiment" or "an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Referring to fig. 1 to 4, a first embodiment of the solder ring positioning method of the present invention is described, first, as shown in fig. 1, a substrate 10, such as a ceramic substrate, is provided, the top of the substrate 10 has an outer land 12, a raised wall 14, an inner land 16 and a groove 18, the outer land 12 is located around the raised wall 14, the raised wall 14 is located around the inner land 16, the inner land 16 surrounds the groove 18, and the height of the raised wall 14 is higher than the height of the inner land 16 and the outer land 12. The outer platform 12 has a plurality of first conductive pads 20, and the inner platform 16 has a plurality of second conductive pads 22. Next, as shown in fig. 2, a solder ring 24 is placed on the raised wall 14. The solder ring 24 is light and thin, and has a thickness of 0.025 to 0.15 millimeters (mm), for example. Since there are no side walls around the raised wall 14 that can be positioned, the solder ring 24 is easily displaced over the raised wall 14. When the solder ring 24 is not moved, as shown in fig. 3, a first position-limiting frame 26 made of teflon or aluminum with no dust on the surface and no adhesion of fine dust (particle) is disposed on the solder ring 24 and the base 10, the first position-limiting frame 26 has a central opening 28 passing through the first position-limiting frame 26 and a plurality of notches 30 communicating with the central opening, and the positions of all the notches 30 correspond to the positions of the solder ring 24 to expose the solder ring 24. The top surface of the first position-limiting frame 26 has a plurality of inclined surfaces 32 and a plane 34 surrounding and connecting all the inclined surfaces 32, and all the notches 30 and all the inclined surfaces 32 are alternately arranged, wherein the inclined surfaces 32 are, for example, 30-60 degrees, and the height of the outer side of the inclined surface 32 is higher than the height of the inner side of the inclined surface 32. Then, a soldering iron tip is sequentially extended into each notch 30, and the solder ring 24 is spot-welded to solder the solder ring 24 on the raised wall 14. Since the first position-limiting frame 26 is made of a material that does not generate dust on the surface and is not easy to stick particles (particles), such as polytetrafluoroethylene or aluminum, particles can be prevented from being stuck during welding. In addition, the bevel 32 may help the tip extend into each notch 30 without being caught by the notch 30. Finally, as shown in FIG. 4, the first stop frame 26 is removed to position the solder ring 24 on the base 10.

Referring to fig. 5 to 10, a second embodiment of the solder ring positioning method of the present invention is described, first, as shown in fig. 5, a substrate 10 is disposed on a base 36, the substrate 10 is, for example, a ceramic substrate, the top of the substrate 10 has an outer platform 12, a raised portion 14, an inner platform 16 and a groove 18, the outer platform 12 is disposed around the raised portion 14, the raised portion 14 is disposed around the inner platform 16, the inner platform 16 surrounds the groove 18, and the raised portion 14 is higher than the inner platform 16 and the outer platform 12. The outer platform 12 has a plurality of first conductive pads 20, and the inner platform 16 has a plurality of second conductive pads 22. Next, as shown in FIG. 6, an infrared sensor chip 38 is placed in the recess 18. Then, as shown in fig. 7, a ring of solder 24 is placed on the raised wall 14. After the positioning, a second positioning frame 40 is disposed on the solder ring 24, the infrared sensor chip 38, the base 10 and the pedestal 36 to position the infrared sensor chip 38 in the groove 18. Then, as shown in fig. 8, the second position-restricting frame 40 is removed. After the solder ring 24 is removed, the solder ring 24 is easy to move on the raised wall 14 because the solder ring 24 is light and thin, for example, 0.025-0.15 mm (mm) thick, and there is no sidewall around the raised wall 14 that can be positioned. When the solder ring 24 is not moved, as shown in fig. 9, a first position-limiting frame 26 made of teflon or aluminum is placed on the solder ring 24, the base 10 and the base 36, the first position-limiting frame 26 has a central opening 28 passing through the first position-limiting frame and a plurality of notches 30 communicating with the central opening, and the positions of all the notches 30 correspond to the positions of the solder ring 24 to expose the solder ring 24. The top surface of the first position-limiting frame 26 has a plurality of inclined surfaces 32 and a plane 34 surrounding and connecting all the inclined surfaces 32, and all the notches 30 and all the inclined surfaces 32 are alternately arranged, wherein the inclined surfaces 32 are, for example, 30-60 degrees, and the height of the outer side of the inclined surface 32 is higher than the height of the inner side of the inclined surface 32. Then, a soldering iron tip is sequentially extended into each notch 30, and the solder ring 24 is spot-welded to solder the solder ring 24 on the raised wall 14. Since the first position-limiting frame 26 is made of a material that does not generate dust on the surface and is not easy to stick particles (particles), such as polytetrafluoroethylene or aluminum, particles can be prevented from being stuck during welding. In addition, the bevel 32 may help the tip extend into each notch 30 without being caught by the notch 30. Finally, as shown in fig. 10, the first position-limiting frame 26 is removed to position the solder ring 24 on the base 10, and the solder ring 24 is not used for electrical connection, but is used for soldering an optical window. When the base 10 is bonded to the optical transparent window through the solder ring 24, the base 10, the infrared sensing chip 38, the solder ring 24 and the optical transparent window form an infrared sensor.

The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. a solder ring positioning method, is characterized in that, comprises the following steps:

A base is provided, the top of the base has a groove and a bulge surrounding the groove;

placing a solder ring on the bump;

A first limit frame is placed on the solder ring and the base, the first limit frame has a central opening through itself and a plurality of gaps that communicate with it, and the positions of the plurality of gaps correspond to the position of the solder ring , to expose the solder ring;

A soldering iron tip of a soldering iron is inserted into each of the notches in sequence, and spot welding is performed on the solder ring to solder the solder ring on the bulge; and

Move away from the first bounding box.

2 . The solder ring positioning method as claimed in claim 1 , wherein the top of the base has an outer platform and an inner platform, the outer platform is located around the convex wall, and the convex wall is located on the inner platform. 3 . The inner platform surrounds the groove, and the height of the convex wall is higher than the height of the inner platform and the outer platform.

3 . The solder ring positioning method of claim 2 , wherein the outer platform is provided with a plurality of first conductive pads, and the inner platform is provided with a plurality of second conductive pads. 4 .

4 . The solder ring positioning method of claim 1 , wherein the top surface of the first limiting frame has a plurality of inclined surfaces and a plane surrounding and connecting the plurality of inclined surfaces, the plurality of notches and the plurality of inclined surfaces. 5 . Alternating bevel settings.

5 . The solder ring positioning method as claimed in claim 4 , wherein the slope is 30-60 degrees. 6 .

6 . The solder ring positioning method of claim 1 , wherein the thickness of the solder ring is 0.025-0.15 mm. 7 .

7 . The solder ring positioning method as claimed in claim 1 , wherein the material of the first limiting frame is polytetrafluoroethylene or aluminum. 8 .

8. The solder ring positioning method as claimed in claim 1, wherein the following steps are performed after the step of providing the base and before the step of placing the solder ring on the bump:

placing the base on a base; and

placing an infrared sensor chip in the groove, after the step of placing the solder ring on the bump, and before the step of placing the first limit frame on the solder ring and the base, Do the following steps:

placing a second limit frame on the solder ring, the infrared sensing chip, the base and the base to position the infrared sensing chip; and

Move away from the second limit frame.

9 . The solder ring positioning method of claim 8 , wherein the solder ring is used for soldering an optical see-through window. 10 .

10 . The solder ring positioning method of claim 1 , wherein the base is a ceramic base. 11 .