CN112408310A - A micro-channel radiator combined with a circular cavity and a water drop-shaped rib column - Google Patents
A micro-channel radiator combined with a circular cavity and a water drop-shaped rib column Download PDFInfo
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- CN112408310A CN112408310A CN202011223124.8A CN202011223124A CN112408310A CN 112408310 A CN112408310 A CN 112408310A CN 202011223124 A CN202011223124 A CN 202011223124A CN 112408310 A CN112408310 A CN 112408310A
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- Prior art keywords
- type rib
- radiator
- circular cavity
- working medium
- water drop
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention belongs to the field of heat dissipation of a micro-channel radiator, and particularly relates to a micro-channel radiator with a combination of a circular concave cavity and a water drop type rib column, which comprises a radiator substrate, wherein the radiator substrate comprises a solid wall surface, a flow channel, the water drop type rib column and the circular concave cavity; the heat of the electronic device is conducted to the radiator through the substrate, then the cooling working medium flows into the heat exchange micro-channel from the heat exchange working medium inlet, flows through the concave cavity and the water drop type rib columns, absorbs the heat conducted to the radiator, and finally flows out of the heat exchange micro-channel from the heat exchange working medium outlet, so that the heat of the electronic device is taken away in time, and the reliability and the service life of the electronic device are improved.
Description
Technical Field
The invention belongs to the field of heat dissipation of micro-channel radiators, and particularly relates to a micro-channel radiator with a combination of a circular concave cavity and a water-drop-shaped rib column.
Background
With the rapid development of microelectronic technology, electronic devices are developed toward miniaturization with high power, high performance and high temperature. Conventional forced air convective heat transfer approaches have reached their thermal limits and it is therefore a challenge to develop efficient methods of cooling high flux devices. The working limit temperature of the electronic device is generally between 86 and 100 ℃. The literature indicates that for every 1 ℃ higher temperature than the limiting temperature, the reliability of the chip is reduced by 6%, and the lifetime is significantly reduced. Therefore, if the high heat generated by the electronic components cannot be eliminated in time, the reliability and the service life of the chip are greatly threatened. Therefore, there is a need to develop and develop an effective cooling technology to meet the high heat demand generated by electronic components. Early studies by some researchers analyzed the effects of fluid flow and heat transfer in microchannels of simple construction. Because the heat flux density of the micro device is increased sharply, the micro-channel heat exchanger with a simple structure cannot meet the heat dissipation requirement, and the micro-channel heat exchangers with complex structures appear in succession. However, the complex microchannel structure and layout are limited by the computational method and the manufacturing process. With the emergence and rapid development of technologies such as MEMS, novel microchannels with complex structures begin to appear in succession, and turbulent element structures such as rib columns and circular concave cavities are arranged in the channels by changing the cross section form of the microchannels, the layout dimensions of the microchannels and the like, so that a plurality of macroscopic heat exchanger concepts are miniaturized.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, adapt to the practical requirements, provide the micro-channel radiator with the combination of the circular concave cavity and the water drop type rib column and improve the heat transfer performance of the micro-channel heat exchanger.
In order to realize the purpose of the invention, the invention adopts the technical scheme that:
the invention discloses a micro-channel radiator with a combination of a circular concave cavity and a water drop type rib column, which comprises a radiator substrate, wherein the radiator substrate comprises a solid wall surface, a flow channel, the water drop type rib column and the circular concave cavity, the flow channel penetrates through the inside of the radiator substrate, two penetrating sides of the radiator substrate are respectively provided with a working medium inlet and a working medium outlet, and the lower part of the radiator substrate is an electronic element binding surface.
The runner comprises the space of two sides solid wall face, the runner sets up a circular cavity at every section equidistant, the central point of circular cavity puts and is equipped with water droplet type rib post, water droplet type rib post is close to working medium entry end slick and sly, water droplet type rib post is close to working medium exit end acutely.
The circular concave cavities of the two adjacent flow passages are arranged in a staggered mode.
The shape of the water drop type rib column can adopt a symmetrical structure or a special-shaped structure; the water drop type rib columns adopt special-shaped structures, and hook tips between the adjacent special-shaped water drop type rib columns face opposite directions.
The invention has the beneficial effects that:
according to the invention, the heat transfer performance of the microchannel heat exchanger can be obviously improved by arranging the turbulence structures such as the circular concave cavity, the rib column and the like in the microchannel, the reliability of an electronic device is improved, and the service life of the electronic device is prolonged.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a sectional view of the internal structure of the present invention;
FIG. 3 is a perspective cross-sectional view of the internal structure of the present invention;
fig. 4 is a partially enlarged view of the internal structure of the present invention.
Fig. 5 is another sectional view of the water drop type rib according to the present invention.
In the figure: the heat radiator comprises a heat radiator base plate 1, a solid wall surface 2, a flow channel 3, a water drop type rib column 4, a circular concave cavity 5, a working medium inlet 6, a working medium outlet 7 and an electronic element binding surface 8.
Detailed Description
The invention is further illustrated with reference to the following figures and examples:
see fig. 1-5.
The invention discloses a micro-channel radiator with a combination of a circular concave cavity and a water drop type rib column, which comprises a radiator substrate 1, wherein the radiator substrate 1 comprises a solid wall surface 2, a flow channel 3, a water drop type rib column 4 and a circular concave cavity 5, the flow channel 3 penetrates through the inside of the radiator substrate 1, a working medium inlet 6 and a working medium outlet 7 are respectively arranged at two penetrating sides of the radiator substrate 1, an electronic element binding surface 8 is arranged at the lower part of the radiator substrate 1, and the heat transfer performance of a micro-channel heat exchanger can be obviously improved by arranging turbulence structures such as the circular concave cavity, the rib column and the like in a micro-channel.
The flow channel 3 is formed by a gap between two solid wall surfaces 2, circular concave cavities 5 are arranged at intervals on the flow channel 3, a water drop type rib column 4 is arranged at the center of each circular concave cavity 5, the end, close to a working medium inlet 6, of each water drop type rib column 4 is smooth, and the end, close to a working medium outlet 7, of each water drop type rib column 4 is sharp; the existence of the water drop type rib columns 4 in the center of the flow channel 3 periodically destroys the thermal boundary layer, so that the thermal boundary continuously appears in the re-development process; due to the existence of the water drop type rib columns 4, the flow is changed into two branches, the heat exchange area is increased, and the local thermal performance is obviously improved; the drop-shaped rib post 4 is a special design, and the streamline surface of the drop-shaped rib post provides a channel with low resistance for fluid flow, so that the pressure loss is reduced, and the friction factor is also reduced.
The round concave cavities 5 of the two adjacent flow channels 3 are arranged in a staggered mode, the round concave cavities 5 are arranged in a staggered mode, a plurality of flow channels can be added under the condition of the same size, a large amount of space is saved, a large amount of heat can be carried away, and the heat transfer performance of the micro-channel heat exchanger is improved.
The shape of the water drop type rib column 4 can be a symmetrical structure or a special-shaped structure; the water drop type rib columns 4 are of special-shaped structures, and hook tips between the adjacent special-shaped water drop type rib columns 4 face opposite directions.
The working principle is as follows:
the other side plane of the radiator base plate is attached to the radiating surface of the electronic device, the heat of the electronic device is conducted into the radiator through the base plate, then a cooling working medium flows into the heat exchange micro-channel from the heat exchange working medium inlet and flows through the circular concave cavity and the water drop type rib columns, the separation between the fluid and the cavity wall is caused due to the reduction of the flow pressure caused by the expansion of the circular concave cavity in the channel flow, the recirculation flow is generated at the cavity, so that the cold fluid and the hot wall in the cavity are mixed, the fluid is divided into two branches by the water drop type rib columns, the flow separation is promoted, the extended wake flow area is formed, the sufficient mixing of the fluid is caused, the heat exchange coefficient is obviously improved due to the sufficient mixing of the fluid, the heat conducted into the radiator is fully absorbed, and finally the heat exchange micro.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent modifications made by the present invention and the contents of the drawings or directly or indirectly applied to the related technical fields are included in the scope of the present invention.
Claims (4)
1. The utility model provides a microchannel radiator that circular cavity and water droplet type rib post combine, includes radiator base plate (1), its characterized in that: radiator base plate (1) includes solid wall (2), runner (3), water droplet type rib post (4) and circular cavity (5), inside runner (3) link up radiator base plate (1), the both sides that radiator base plate (1) link up are working medium entry (6) and working medium export (7) respectively, the lower part of radiator base plate (1) is electronic component binding face (8).
2. A circular cavity and drop rib combined microchannel heat sink as claimed in claim 1, wherein: the runner (3) comprises the space of two sides solid wall (2), runner (3) are every one section equidistant circular cavity (5) that sets up, the central point of circular cavity (5) puts and is equipped with water droplet type rib post (4), water droplet type rib post (4) are close to working medium entry (6) end rounding off, water droplet type rib post (4) are close to working medium export (7) end acutely.
3. A circular cavity and drop rib combined microchannel heat sink as claimed in claim 2, wherein: the positions of the circular concave cavities (5) of the two adjacent flow passages (3) are staggered.
4. A circular cavity and drop rib combined microchannel heat sink as claimed in claim 2, wherein: the shape of the water drop type rib column (4) can be a symmetrical structure or a special-shaped structure; the water drop type rib columns (4) are of special-shaped structures, and hook tips between the adjacent special-shaped water drop type rib columns (4) face oppositely.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011223124.8A CN112408310A (en) | 2020-11-05 | 2020-11-05 | A micro-channel radiator combined with a circular cavity and a water drop-shaped rib column |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011223124.8A CN112408310A (en) | 2020-11-05 | 2020-11-05 | A micro-channel radiator combined with a circular cavity and a water drop-shaped rib column |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112408310A true CN112408310A (en) | 2021-02-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011223124.8A Pending CN112408310A (en) | 2020-11-05 | 2020-11-05 | A micro-channel radiator combined with a circular cavity and a water drop-shaped rib column |
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| CN (1) | CN112408310A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888278A (en) * | 2021-03-29 | 2021-06-01 | 南昌大学 | Crisscross bellied microarray radiator of trapezoidal |
| CN115720439A (en) * | 2022-11-30 | 2023-02-28 | 山东大学 | A ribbed microchannel cooling device and method |
| EP4333049A1 (en) * | 2022-08-29 | 2024-03-06 | Ovh | Cooling block for cooling a heat-generating electronic component |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2166569A1 (en) * | 2008-09-22 | 2010-03-24 | ABB Schweiz AG | Cooling device for a power component |
| CN102878851A (en) * | 2012-09-11 | 2013-01-16 | 天津大学 | Micro-channel heat exchanger and foam metal fins thereof |
| CN104167399A (en) * | 2014-05-14 | 2014-11-26 | 北京工业大学 | Staggered complex micro-channel miniature heat exchanger |
| CN104465562A (en) * | 2014-12-24 | 2015-03-25 | 西安电子科技大学 | Chain type staggered micro-channel structure |
| CN104576573A (en) * | 2014-12-21 | 2015-04-29 | 北京工业大学 | Micro-channel heat exchanger for drop-shaped pin fins |
| CN110828404A (en) * | 2019-11-22 | 2020-02-21 | 华南理工大学 | A microchannel vapor chamber with a cavity structure |
| CN214829018U (en) * | 2020-11-05 | 2021-11-23 | 南昌大学 | A micro-channel radiator combined with a circular cavity and a water drop-shaped rib column |
-
2020
- 2020-11-05 CN CN202011223124.8A patent/CN112408310A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2166569A1 (en) * | 2008-09-22 | 2010-03-24 | ABB Schweiz AG | Cooling device for a power component |
| CN102878851A (en) * | 2012-09-11 | 2013-01-16 | 天津大学 | Micro-channel heat exchanger and foam metal fins thereof |
| CN104167399A (en) * | 2014-05-14 | 2014-11-26 | 北京工业大学 | Staggered complex micro-channel miniature heat exchanger |
| CN104576573A (en) * | 2014-12-21 | 2015-04-29 | 北京工业大学 | Micro-channel heat exchanger for drop-shaped pin fins |
| CN104465562A (en) * | 2014-12-24 | 2015-03-25 | 西安电子科技大学 | Chain type staggered micro-channel structure |
| CN110828404A (en) * | 2019-11-22 | 2020-02-21 | 华南理工大学 | A microchannel vapor chamber with a cavity structure |
| CN214829018U (en) * | 2020-11-05 | 2021-11-23 | 南昌大学 | A micro-channel radiator combined with a circular cavity and a water drop-shaped rib column |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888278A (en) * | 2021-03-29 | 2021-06-01 | 南昌大学 | Crisscross bellied microarray radiator of trapezoidal |
| EP4333049A1 (en) * | 2022-08-29 | 2024-03-06 | Ovh | Cooling block for cooling a heat-generating electronic component |
| CN115720439A (en) * | 2022-11-30 | 2023-02-28 | 山东大学 | A ribbed microchannel cooling device and method |
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