CN104576573A - Micro-channel heat exchanger for drop-shaped pin fins - Google Patents

Abstract

A droplet-shaped turbulent element micro-channel heat exchanger, the channel cooling medium inlet is connected to the channel inlet end, the channel outlet end is connected to the cooling medium outlet; the channel inlet end and the channel outlet end are cooling silicon-based channels ; Drop-shaped turbulence element is placed in the cooling silicon-based channel; the glass cover plate is bonded to the top of the structure and plays a role of heat insulation. The cooling silicon-based microchannel utilizes an etching process to process the microchannel of the drop-shaped turbulent element. The present invention can increase the heat exchange area by using a simple drop-shaped turbulence element structure without adding additional driving or control devices, and enhance the mixing of cold and hot fluids to achieve the purpose of enhancing heat exchange.

Description

A drop-shaped turbulent element micro-channel heat exchanger

technical field

The invention is used in the heat dissipation field of high-integration and high-power microelectronic components. Reasonable droplet-shaped turbulence elements are added to the channel of the micro-channel heat exchanger. Compared with the smooth channel heat exchanger, the heat exchanger has a higher Nusselt number. Nu means that the heat transfer performance is improved, which provides the possibility for effective heat dissipation of microelectronic components with high integration and high thermal power.

Background technique

With the rapid development of microelectromechanical systems (MEMS) and the rapid development of microelectronic components in the direction of small size, light weight and high integration, the heat dissipation problem is directly related to the reliability and stability of the system, and it is necessary to effectively integrate them The high heat flux generated during operation is taken away, and the reliability and stability of the system can be guaranteed. The application of traditional cooling technology can no longer meet the actual needs. Microchannel has the characteristics of large surface area ratio and large heat transfer coefficient, so the microchannel heat sink used for heat dissipation can effectively take away the high heat flux generated by the operation of microelectronic components and microelectromechanical systems. Microchannel heat sink has It has been proven to be one of the cooling methods with the best heat transfer performance and the most application potential. Although microchannel heat transfer has the advantages of high heat transfer coefficient, it still cannot meet the heat dissipation requirements of current highly integrated electronic components and micro-electromechanical systems. In-depth research on microchannel enhanced heat transfer is urgently needed. Although a lot of research has been done on microchannel heat transfer enhancement at home and abroad, there are still reports on microchannel heat sinks with drop-shaped turbulent elements inside the channel.

Contents of the invention

The present invention is based on commonly used multi-parallel micro-channel heat exchangers, adding droplet-shaped turbulence elements to each single channel to improve the heat exchange capacity of the heat exchanger to solve the problem of microelectronic components and micro-electromechanical systems (MEMS) High heat flux density heat dissipation problem. The present invention adds a droplet-shaped turbulence element to the conventional smooth microchannel, so that the contact area between the fluid and the solid, that is, the heat exchange area, increases. This structure makes the working medium flow in the channel to generate eddy currents, and the mixing of cold and hot fluids is enhanced. Thereby, the heat transfer amount is increased, that is, the purpose of strengthening the heat transfer is achieved.

The droplet-shaped turbulent element microchannel heat exchanger of the present invention is slightly improved on the basis of conventional microscale channels, and its main structure is as follows:

The heat exchanger is composed of seven parts, namely channel cooling medium inlet 1, cooling medium outlet 2, glass cover plate 3, channel inlet end 4, channel outlet end 5, cooling silicon-based channel 6, drop-shaped turbulence element 7.

The channel cooling medium inlet 1 is connected to the channel inlet 4, and the channel outlet 5 is connected to the cooling medium outlet 2; between the channel inlet 4 and the channel outlet 5 is a cooling silicon-based channel 6; the drop-shaped turbulence element 7 is placed in the cooling silicon-based channel 6; the glass cover plate 3 is bonded to the top of the structure and plays a thermal insulation role.

The cooling silicon-based microchannel 6 utilizes an etching process to process the microchannel of the drop-shaped spoiler 7 .

When working, the cooling medium with a lower temperature (about 20°C) enters the channel inlet 4 from the channel cooling medium inlet 1, and flows into the single cooling silicon-based channel 6 of the drop-shaped turbulence unit respectively. The droplet-shaped turbulence element 7, compared with the conventional microchannel heat exchanger, the heat exchange area of the heat exchanger is increased, the working fluid generates eddy currents in the flow channel, the mixing of cold and hot fluids is enhanced, and the heat exchange effect is enhanced. The working fluid with a higher temperature (related to channel size, thermal power density, etc.) finally reaches the cooling medium outlet 2 through the channel outlet 5, and then flows out of the system, that is, the high heat flux generated by electronic components and micro-electromechanical systems. The fluid flowing in the droplet-shaped spoiler microchannel is carried away to achieve the purpose of cooling. The present invention adds a reasonable droplet-shaped turbulence element structure in the channel. Compared with the smooth channel heat exchanger, the Nusselt number Nu, that is, the heat transfer performance of the heat exchanger is greatly improved, which is a high degree of integration and high thermal power. Efficient cooling of large microelectronic components and microelectromechanical systems provides the possibility.

The present invention can increase the heat exchange area by using a simple drop-shaped turbulence element structure without adding additional driving or control devices, and enhance the mixing of cold and hot fluids to achieve the purpose of enhancing heat exchange.

Description of drawings

Fig. 1 is a three-dimensional overall outline schematic diagram of the microchannel heat exchanger design of the drop-shaped turbulent element of the present invention.

Fig. 2 is a top view of a single channel of the droplet-shaped turbulent element micro-channel heat exchanger of the present invention.

Fig. 3 is a partially enlarged view of a droplet-shaped turbulent element in a single channel of the micro-channel heat exchanger of the present invention.

In the figure: 1. Channel cooling medium inlet; 2. Cooling medium outlet; 3. Glass cover plate; 4. Channel inlet end; 5. Channel outlet end; 6. Cooling silicon-based channel; 7. Droplet-shaped spoiler .

Detailed ways

The working process and effect of the inventive droplet-shaped turbulent element microchannel heat exchanger will be further described and verified below in conjunction with the structural drawings.

Fig. 1 is a schematic diagram of a three-dimensional general outline of a droplet-shaped turbulent element microchannel heat exchanger. The drop-shaped turbulence element micro-channel heat exchanger mainly includes channel cooling medium inlet 1, cooling medium outlet 2, glass cover plate 3, channel inlet end 4, channel outlet end 5, cooling silicon-based channel 6, water drop-shaped turbulence Stream element 7 constitutes. In order to verify that the invention has a better heat transfer effect than conventional channels, Table 1 lists the thermal resistance R, Nusselt number Nu, and heat transfer coefficient h of the heat exchanger for a given Reynolds number Re to characterize heat transfer. The parameters of the effect, and compared with the regular smooth channel. It can be seen from the table that the invention significantly improves the heat exchange performance of the heat exchanger.

Table 1 Comparison of heat transfer performance of drop-shaped turbulent element microchannel heat exchanger with conventional channel

Claims (3)

1. a water-drop-shaped flow-disturbing unit micro-channel heat exchanger, it is characterized in that: this heat exchanger is made up of seven parts, be passage cooling working medium entrance (1) respectively, cooling working medium outlet (2), glass cover-plate (3), channel entrance end (4), channel outlet (5), cool silica-based passage (6), water-drop-shaped flow-disturbing unit (7);

Passage cooling working medium entrance (1) is connected with channel entrance end (4), and channel outlet (5) exports (2) and is connected with cooling working medium; It is the silica-based passage of cooling (6) between channel entrance end (4), channel outlet (5); Water-drop-shaped flow-disturbing unit (7) is placed in the silica-based passage of cooling (6); Glass cover-plate (3) is bonded in the top of this structure.

2. a kind of water-drop-shaped flow-disturbing unit according to claim 1 micro-channel heat exchanger, is characterized in that: described cooling silicon substrate microchannel (6) utilizes lithography technique, processes the micro-channel of water-drop-shaped flow-disturbing unit (7).

3. a kind of water-drop-shaped flow-disturbing unit according to claim 1 micro-channel heat exchanger, it is characterized in that: during work, the lower cooling working medium of temperature is by passage cooling working medium entrance (1) admission passage entrance point (4), flow to the water-drop-shaped flow-disturbing unit's silica-based passage of single cooling (6) respectively, owing to there is water-drop-shaped flow-disturbing unit (7) in single passage, compare with conventional micro-channel heat exchanger, this heat exchanger heat exchange area increases, working medium creates eddy current in runner, cold fluid and hot fluid mixing strengthens, and heat transfer effect strengthens;

The working medium of higher temperature arrives cooling working medium outlet (2) eventually through channel outlet (5), and then outflow system, namely the high heat flux heat that electronic devices and components and microelectromechanical systems produce is taken away by the fluid flowed in water-drop-shaped flow-disturbing unit microchannel, reaches the object of cooling.