CN112240649A - Thermoelectric refrigeration assembly - Google Patents
Thermoelectric refrigeration assembly Download PDFInfo
- Publication number
- CN112240649A CN112240649A CN202011076636.6A CN202011076636A CN112240649A CN 112240649 A CN112240649 A CN 112240649A CN 202011076636 A CN202011076636 A CN 202011076636A CN 112240649 A CN112240649 A CN 112240649A
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- China
- Prior art keywords
- thermoelectric
- ceramic plate
- conducting
- particles
- cooling module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005057 refrigeration Methods 0.000 title description 17
- 239000000919 ceramic Substances 0.000 claims abstract description 40
- 239000002245 particle Substances 0.000 claims abstract description 24
- 238000001816 cooling Methods 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229910016338 Bi—Sn Inorganic materials 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 description 6
- 239000003507 refrigerant Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a thermoelectric refrigerating assembly, which comprises six ceramic plates, wherein thermoelectric particles are arranged on the six ceramic plates, a connecting lead is arranged between the two thermoelectric particles, a mesh cover is arranged on the connecting lead, connecting blocks are arranged on two sides of the thermoelectric particles, telescopic rods are arranged on the connecting blocks, a placing groove matched with the thermoelectric particles is arranged on each ceramic plate, an electric push rod is arranged between the two ceramic plates, and the output end of the electric push rod is fixed with the ceramic plates through a contact block.
Description
Technical Field
The invention relates to the technical field of refrigeration components, in particular to a thermoelectric refrigeration component.
Background
The refrigeration component is widely applied to the aspects of medical treatment, beauty treatment instruments, experimental instruments, special test instruments, daily life and the like, the traditional refrigeration component performs compression cycle refrigeration on refrigerant through a compressor, the refrigeration efficiency is low, the refrigerant needs to be replaced all the time, and the refrigeration cost is high.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a thermoelectric refrigeration assembly, which solves the problems that the traditional refrigeration assembly performs compression cycle refrigeration on a refrigerant through a compressor, the refrigeration efficiency is low, the refrigerant needs to be always replaced, and the refrigeration cost is high.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a thermoelectric cooling assembly comprises six ceramic plates, thermoelectric particles are arranged on the six ceramic plates, a connecting lead is arranged between the two thermoelectric particles, and a mesh enclosure is arranged on the connecting lead;
the thermoelectric particle both sides all are provided with the connecting block, and are provided with the telescopic link on the connecting block.
Further, a placing groove matched with the thermoelectric particles is formed in the ceramic plate.
Furthermore, be fixed with the conducting strip on the ceramic plate to pass through the fixed total conducting block of conducting block on the conducting strip, be provided with first conducting strip on the conducting block, and slide on the first conducting strip and have the second conducting strip, and first conducting strip and second conducting strip all are provided with the fixed orifices.
Further, two be provided with electric putter between the ceramic plate, and electric putter's output is fixed with the ceramic plate through contact block.
Further, the ceramic plate is an industrial grade 96% high-quality alumina ceramic plate.
Further, the thermoelectric particles are composed of bismuth telluride grains.
Furthermore, the connecting lead is made of a 4N-grade copper conducting material.
Further, the connection lead is soldered to the thermoelectric particle by a Bi-Sn solder.
Further, the net cover is made of a copper material.
(III) advantageous effects
The invention provides a thermoelectric cooling component. The method has the following beneficial effects:
this thermoelectric refrigeration subassembly, through adjusting the distance between two ceramic plates, thermoelectric granule between the ceramic plate comprises bismuth telluride crystalline grain, adopts two power supply structures, and bottom ceramic plate docks and leads to a set of power supply, through the regulation to bottom ceramic plate to the electric current, top layer ceramic plate surface temperature can obtain lower temperature, and can carry out high accuracy control to the temperature, and the refrigeration process does not need any refrigerant, does not have rotary part, and the noiselessness does not have the vibration, improves the availability factor greatly.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of a portion of the invention at A in FIG. 1;
fig. 3 is a partial enlarged view of the invention at B in fig. 1.
In the figure, 1 ceramic plate, 2 thermoelectric particles, 3 connecting wires, 4 mesh covers, 5 connecting blocks, 6 telescopic rods, 7 placing grooves, 8 electric push rods, 9 heat-conducting fins, 10 heat-conducting blocks, 11 heat-conducting blocks, 12 first heat-conducting fins, 13 second heat-conducting fins and 14 fixing holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, an embodiment of the present invention provides a technical solution: a thermoelectric cooling assembly comprises six ceramic plates 1, thermoelectric particles 2 are arranged on the six ceramic plates 1, a connecting wire 3 is arranged between the two thermoelectric particles 2, a mesh enclosure 4 is arranged on the connecting wire 3, connecting blocks 5 are arranged on two sides of each thermoelectric particle 2, and telescopic rods 6 are arranged on the connecting blocks 5;
as shown in fig. 3, a heat conducting plate 9 is fixed on a ceramic plate 1 according to the present invention, and a common conducting block 11 is fixed on the heat conducting plate 9 through a heat conducting block 10 to improve heat conduction, a first conducting plate 12 is provided on the conducting block 11, a second conducting plate 13 is slid on the first conducting plate 12, and fixing holes 14 are provided on both the first conducting plate 12 and the second conducting plate 13 to improve heat conversion.
As shown in fig. 2, a placing groove 7 matched with thermoelectric particles 2 is arranged on a ceramic plate 1, an electric push rod 8 is arranged between the two ceramic plates 1, the output end of the electric push rod 8 is fixed with the ceramic plates 1 through a contact block, the distance between the two ceramic plates 1 is adjusted, the thermoelectric particles 2 between the ceramic plates 1 are composed of bismuth telluride grains, a double-power-supply structure is adopted, a group of power supplies are connected to the bottom ceramic plate 1, and the surface temperature of the top ceramic plate can obtain lower temperature through adjusting the current of the bottom ceramic plate 1;
the ceramic plate 1 is an industrial-grade 96% high-quality alumina ceramic plate, the thermoelectric particles 2 are composed of bismuth telluride grains, heat transfer is generated after direct current is conducted through two different bismuth telluride materials, the cooling effect is achieved, the connecting lead 3 is a 4N-grade copper conducting material, the connecting lead 3 is welded to the thermoelectric particles 2 through Bi-Sn solder, and the mesh cover 4 is made of a copper material.
According to the invention, the electric push rod 8 is arranged between the two ceramic plates 1, so that the distance between the two ceramic plates 1 is changed, the mesh cover 4 arranged on the connecting lead 3 is unfolded, meanwhile, the second conducting piece 13 slides on the first conducting piece 12, and the first conducting piece 12 and the second conducting piece 13 are both provided with the fixing holes 14, so that the heat conversion is improved, and the refrigeration efficiency is greatly improved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A thermoelectric cooling assembly comprising six ceramic plates (1), characterized in that: the six ceramic plates (1) are respectively provided with thermoelectric particles (2), a connecting wire (3) is arranged between the two thermoelectric particles (2), and the connecting wire (3) is provided with a mesh enclosure (4);
connecting blocks (5) are arranged on two sides of the thermoelectric particles (2), and telescopic rods (6) are arranged on the connecting blocks (5).
2. The thermoelectric cooling module as claimed in claim 1, wherein: the ceramic plate (1) is provided with a placing groove (7) matched with the thermoelectric particles (2).
3. The thermoelectric cooling module as claimed in claim 1, wherein: the ceramic plate is characterized in that heat conducting fins (9) are fixed on the ceramic plate (1), common conducting blocks (11) are fixed on the heat conducting fins (9) through heat conducting blocks (10), first conducting fins (12) are arranged on the conducting blocks (11), second conducting fins (13) slide on the first conducting fins (12), and fixing holes (14) are formed in the first conducting fins (12) and the second conducting fins (13).
4. The thermoelectric cooling module as claimed in claim 1, wherein: two be provided with electric putter (8) between ceramic plate (1), and the output of electric putter (8) is fixed through contact block and ceramic plate (1).
5. The thermoelectric cooling module as claimed in claim 1, wherein: the ceramic plate (1) is an industrial grade 96% high-quality alumina ceramic plate.
6. The thermoelectric cooling module as claimed in claim 1, wherein: the thermoelectric particles (2) are composed of bismuth telluride grains.
7. The thermoelectric cooling module as claimed in claim 1, wherein: the connecting lead (3) is a 4N-grade copper conducting material.
8. The thermoelectric cooling module as claimed in claim 1, wherein: the connecting lead (3) is soldered to the thermoelectric particles (2) by means of a Bi-Sn solder.
9. The thermoelectric cooling module as claimed in claim 1, wherein: the net cover (4) is made of copper.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202011076636.6A CN112240649A (en) | 2020-10-10 | 2020-10-10 | Thermoelectric refrigeration assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011076636.6A CN112240649A (en) | 2020-10-10 | 2020-10-10 | Thermoelectric refrigeration assembly |
Publications (1)
Publication Number | Publication Date |
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CN112240649A true CN112240649A (en) | 2021-01-19 |
Family
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CN202011076636.6A Pending CN112240649A (en) | 2020-10-10 | 2020-10-10 | Thermoelectric refrigeration assembly |
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Citations (16)
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CN1855364A (en) * | 2005-04-28 | 2006-11-01 | 台湾积体电路制造股份有限公司 | Thermoelectric Wafer Chuck |
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Application publication date: 20210119 |