CN112230741A - Computer CPU cooling device - Google Patents
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- CN112230741A CN112230741A CN202011394338.1A CN202011394338A CN112230741A CN 112230741 A CN112230741 A CN 112230741A CN 202011394338 A CN202011394338 A CN 202011394338A CN 112230741 A CN112230741 A CN 112230741A
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- 238000001816 cooling Methods 0.000 title claims abstract description 114
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 315
- 238000005057 refrigeration Methods 0.000 claims abstract description 34
- 239000003570 air Substances 0.000 claims description 66
- 238000001704 evaporation Methods 0.000 claims description 26
- 239000003507 refrigerant Substances 0.000 claims description 25
- 230000008020 evaporation Effects 0.000 claims description 19
- 239000012080 ambient air Substances 0.000 claims description 12
- 238000009833 condensation Methods 0.000 claims description 12
- 230000005494 condensation Effects 0.000 claims description 12
- 238000009434 installation Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 42
- 238000000034 method Methods 0.000 description 10
- 230000001965 increasing effect Effects 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000013528 artificial neural network Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
本发明提供一种电脑CPU冷却装置，由箱体、微型直流制冷压缩机、冷凝器、风扇、节流元件、水箱蒸发器、微型泵、旁通阀、水冷却器、风道、回水接头、出水接头、水冷板、紧固件等组成，其中水箱蒸发器为水箱和蒸发器一体式结构，水冷板通过紧固件与待冷却的CPU表面贴合并与CPU一起固定在电脑机箱中的电脑主板上。空气由所述箱体的进风口流入所述箱体的内部后，依次流经冷凝器、水冷却器，再经由风扇、箱体上的出风口而流出到所述箱体之外。当CPU的热负荷较高或要求CPU温度较低时，所述装置以冷凝散热模式工作，制取温度低于环境温度的低温冷水以对CPU进行降温；当CPU的热负荷较小时，所述装置可切换到水‑空气散热模式，从而节约能耗。
The invention provides a computer CPU cooling device, which consists of a box body, a miniature DC refrigeration compressor, a condenser, a fan, a throttling element, a water tank evaporator, a miniature pump, a bypass valve, a water cooler, an air duct, and a return water joint. , water outlet connector, water cooling plate, fasteners, etc., in which the water tank evaporator is an integrated structure of the water tank and the evaporator, and the water cooling plate is attached to the surface of the CPU to be cooled through fasteners and is fixed together with the CPU in the computer case of the computer on the motherboard. After the air flows into the inside of the box from the air inlet of the box, it flows through the condenser and the water cooler in sequence, and then flows out of the box through the fan and the air outlet on the box. When the heat load of the CPU is high or the temperature of the CPU is required to be low, the device works in a condensing heat dissipation mode to produce low-temperature cold water with a temperature lower than the ambient temperature to cool the CPU; when the heat load of the CPU is small, the The unit can be switched to water-air cooling mode, saving energy.
Description
Technical Field
The invention relates to a heat dissipation technology and a refrigeration technology.
Background
The CPU of the desktop computer usually adopts a heat dissipation method of a heat dissipation fin or a heat pipe radiator, and the heat of the CPU is firstly transferred to the heat dissipation fin or the heat pipe radiator, and then is dissipated to the air by forced convection of a fan. Although the heat dissipation method can satisfy the use of the computer under normal conditions, the phenomena of overlarge heat productivity and overhigh temperature often occur when the CPU is used in an over-frequency mode, and the CPU is damaged and cannot be used in a serious condition.
In order to enable the CPU to be used in the overclocking process, a water cooling heat dissipation mode is commonly adopted among vast overclocking fans, particularly game enthusiasts at present. Such a water-cooling heat dissipation method generally includes a water-cooling plate, a water pump, a heat dissipation row with a fan (water-air heat sink), a water tank, and the like. The water cooling plate is tightly attached to the surface of the CPU, the heat dissipation row is installed outside the computer case, and the water tank is usually installed at the CD-ROM position of the computer case, namely the installation position which is reserved on the computer case and is used for installing the CD-ROM. The water pump sucks water from the water tank evaporator and sends the water to the cold plate; the water absorbs the heat of the CPU in the cold plate, so that the temperature of the CPU is reduced; the temperature of the water after absorbing the heat of the CPU is increased and flows to the heat dissipation row, the water dissipates the heat to the air in the heat dissipation row, and the temperature is reduced; and finally the water flow returns to the water tank evaporator. It can be seen that although the heat dissipation capacity of the water-cooling heat dissipation method is superior to that of the conventional heat dissipation fin and heat pipe heat sink, the water-cooling heat dissipation method is still a passive heat dissipation method in nature, because the heat transfer requires a temperature difference, the water-cooling heat dissipation method can only reduce the temperature of the CPU to be higher than the ambient air temperature, and a large temperature gradient exists between the surface of the CPU and the ambient temperature, and when the ambient air temperature rises, the surface temperature of the CPU also rises. When the working temperature of the CPU is required to be lower and the working temperature of the CPU is required to be lower than the ambient temperature, the heat dissipation mode can not be used.
Still another cooling method for computer CPU is a method of direct evaporation of refrigerant. The method directly sticks the evaporator of the refrigeration system on the surface of the CPU, and the CPU is directly cooled by the evaporation of the refrigerant in the evaporator. This has the advantage that the temperature can be lower than the ambient air temperature, since the refrigerant evaporates directly in the evaporator. However, when the thermal load of the chip is small, the evaporation temperature is easily too low, and condensed water is easily generated on the surface of the evaporator and the chip, thereby easily causing short circuit between the chip and the main board. The cooling method using direct evaporation of refrigerant also does not easily achieve precise control of the CPU temperature, especially when the instantaneous thermal load of the CPU fluctuates greatly.
In summary, there are various drawbacks to the conventional cooling method for a desktop CPU, and improvements are needed.
Disclosure of Invention
The invention provides a novel computer CPU cooling device aiming at various problems in the existing computer water-cooling heat dissipation technology.
The computer CPU cooling device adopts a miniature vapor compression refrigeration cycle to prepare cold water with the temperature lower than the ambient air temperature, and utilizes the cold water to indirectly cool the CPU; meanwhile, the computer CPU cooling device can still cool the CPU by adopting a conventional mode of radiating heat to air under the conditions of lower CPU load and smaller heat productivity so as to maintain lower energy consumption. The invention is realized by the following technical approaches:
the invention relates to a computer CPU cooling device, which comprises a box body, a micro direct current refrigeration compressor, a condenser, a fan, a throttling element, a water tank evaporator, a micro pump, a bypass valve, a water cooler, an air duct, a water return joint, a water outlet joint, a water cooling plate, a fastening piece and the like. The miniature direct-current refrigeration compressor, the throttling element, the water tank evaporator, the miniature pump, the bypass valve and the air channel are arranged in the box body, the condenser, the water cooler and the fan are arranged in the air channel, the water return connector and the water outlet connector are arranged on the box body, and the water cooling plate and the fastening piece are arranged in the computer case needing cooling.
The box body is provided with an air inlet, an air outlet and a water adding window. The air duct is installed in the box body, and one end of the air duct is connected with the air outlet. The condenser, the water cooler and the fan are arranged in the air duct, windward surfaces of the condenser and the water cooler are parallel to each other, and the normal directions of the windward surfaces of the condenser and the water cooler are consistent with the axial direction of the fan or the air duct.
The water tank evaporator is of a water tank and evaporator integrated structure and comprises an evaporation coil, a water tank shell, a water tank water filling port, a water tank water return port, a water tank water outlet and a water tank cover, wherein the water tank cover covers the water tank water filling port and can be opened. The installation position of the water tank evaporator in the box body enables the water tank water filling port to be just positioned at the water filling window on the box body, and the water tank cover can be taken down from the water tank water filling port through the water filling window.
The miniature direct-current refrigeration compressor is provided with a compressor air suction port and a compressor air exhaust port, the condenser is provided with a condenser inlet and a condenser outlet, the throttling element is provided with a throttling inlet and a throttling outlet, and an evaporation coil of the water tank evaporator is provided with an evaporation inlet and an evaporation outlet. The air exhaust port of the compressor, the inlet of the condenser, the outlet of the condenser, the throttle inlet, the throttle outlet, the evaporation inlet of the evaporator, the evaporation outlet of the evaporator and the air suction port of the compressor are sequentially connected to form a closed refrigeration loop, and a refrigerant is filled in the refrigeration loop.
The micro-pump has a pump inlet and a pump outlet, and the water cooler has a cooling inlet and a cooling outlet. The bypass valve is connected in parallel at two ends of the water cooler, namely one end of the bypass valve is connected with a cooling inlet of the water cooler, and the other end of the bypass valve is connected with a cooling outlet of the water cooler. The pump inlet of the micropump is connected with the water tank water outlet of the water tank evaporator, the pump outlet of the micropump is connected with the cooling inlet of the water cooler and one end of the bypass valve, the cooling outlet of the water cooler is connected with the other end of the bypass valve and the water outlet connector arranged on the box body, and the water tank return water port of the water tank evaporator is connected with the water return connector arranged on the box body.
The fan is a direct current fan, preferably an axial direct current fan. After flowing into the box body from the air inlet of the box body, the air flows through the condenser and the water cooler in sequence and then flows out of the box body through the fan and the air outlet on the box body.
The water cooling plate is a heat exchanger only with one fluid participating in heat exchange, and is provided with a hollow structure, a first connector of the water cooling plate, a second connector of the water cooling plate and a smooth outer surface, and fins capable of enhancing the heat exchange of the fluid are arranged in the hollow structure and on the inner surface corresponding to the smooth outer surface. The smooth outer surface of the water cooling plate is attached to the surface of a CPU to be cooled on the computer mainboard, and the water cooling plate and the CPU are clamped on the computer mainboard by the fastening piece, so that the smooth outer surface of the water cooling plate is ensured to be in close contact with the surface of the CPU, the thermal contact resistance is reduced, and the thermal conductivity is increased.
The first interface of the water cooling plate is connected with a water outlet joint on the box body through a pipeline, and the second interface of the water cooling plate is connected with a water return joint on the box body through a pipeline.
When the water tank evaporator is used, a proper amount of water is filled in the water tank evaporator, and then the micropump and the fan are respectively started to operate. The computer CPU cooling device can work in two modes according to whether the micro direct current refrigeration compressor operates or not: a water-air heat dissipation mode and a condensation heat dissipation mode. The two operating modes can be freely switched.
When the heating value of the CPU is smaller or the allowable surface temperature of the CPU is higher, the computer CPU cooling device works in a water-air heat dissipation mode. In this mode, the bypass valve is off, the micro pump and fan are running, and the micro dc refrigeration compressor is not running. The micro pump sucks water with higher temperature from the water tank evaporator and pumps the water into the water cooler. In water coolers, the heat of the higher temperature water is dissipated to the air in a convective manner. The water with lower temperature after heat dissipation enters the water cooling plate to take away the heat of the CPU attached to the surface of the water cooling plate, so that the CPU is cooled.
When the heating value of the CPU is larger or the surface temperature of the CPU is required to be lower than the ambient air temperature, the computer CPU cooling device works in a condensation heat dissipation mode. In this mode, the bypass valve is in a conducting state, the water cooler is bypassed, and the micro pump, the fan and the micro DC refrigeration compressor are all operated. The refrigerant evaporates and refrigerates in the coil of the water tank evaporator, changing the water in the water tank evaporator into low-temperature cold water with the temperature lower than the ambient temperature. The micro pump sucks low-temperature cold water from the water tank evaporator and directly pumps the cold water into the water cooling plate so as to take away the heat of the CPU attached to the surface of the water cooling plate. In the condensation heat dissipation mode, the temperature of the CPU may be cooled below the ambient air temperature.
The CPU cooling device of the invention adopts the vapor compression refrigeration cycle taking the micro direct current refrigeration compressor as the core to prepare cold water, and then uses a cold water chamber to cool the cold plate, so that the CPU can be cooled to a lower temperature. Meanwhile, when the CPU has a small heat value, the CPU can still adopt a conventional water-air heat dissipation mode without starting a compressor for refrigeration, thereby greatly reducing the energy consumption. Because the water tank and the evaporator integrated structure are adopted in the device, the device has the advantages of compact structure, large water storage volume and convenient water adding and exhausting operation, and can utilize the characteristic of large specific heat of a large-capacity water body to buffer the water channel, so that the temperature fluctuation and the pressure fluctuation in the water channel are very small, and the accurate temperature control is realized more easily.
Drawings
FIG. 1 is a schematic flow chart diagram of an embodiment of a computer CPU cooling apparatus according to the present invention.
FIG. 2 is a schematic flow chart of an alternative embodiment of the cooling apparatus for a computer CPU according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1, according to an embodiment of the present invention, the cooling apparatus for a computer CPU comprises a casing 1, a micro dc refrigeration compressor 2, a condenser 3, a fan 4, a throttling element 5, a water tank evaporator 6, a micro pump 7, a bypass valve 8, a water cooler 9, an air duct 10, a water return joint 11, a water outlet joint 12, a water cooling plate 13, a fastening member 14, and the like.
The box body 1 is provided with an air inlet 1a, an air outlet 1b and a water adding window 1 c. The micro direct-current refrigeration compressor 2, the throttling element 5, the water tank evaporator 6, the micro pump 7 and the bypass valve 8 are arranged in the box body 1.
The air duct 10 is installed in the box body 1, and one end of the air duct 10 is connected with the air outlet 1 b. The condenser 3, the water cooler 9 and the fan 4 are arranged in the air duct 10, windward surfaces of the condenser 3 and the water cooler 9 are parallel to each other, and normal directions of the windward surfaces of the condenser 3 and the water cooler 9 are consistent with axial directions of the fan 4 and the air duct 10. The water return joint 11 and the water outlet joint 12 are arranged on the box body 1.
The water tank evaporator 6 is of a water tank and evaporator integrated structure and comprises an evaporation coil 6a, a water tank shell 6b, a water tank water filling port 6c, a water tank water return port 6d, a water tank water outlet 6e and a water tank cover 6f, wherein the water tank water filling port 6c is located on the tank body 1 at a water filling window 1c, and the water tank cover 6f is installed at the water tank water filling port 6 c.
A computer motherboard 21 is mounted in the computer case 20, and a CPU 22 requiring cooling is mounted on the computer motherboard 21. The water-cooling plate 13 is fixed to the surface of the CPU 22 to be cooled by fasteners 14.
The micro direct-current refrigeration compressor 2 is provided with a compressor suction port 2a and a compressor discharge port 2b, the condenser 3 is provided with a condenser inlet 3a and a condenser outlet 3b, the throttling element 5 is provided with a throttling inlet 5a and a throttling outlet 5b, and the evaporation coil 6a of the water tank evaporator 6 is provided with an evaporation inlet 6a-1 and an evaporation outlet 6 a-2; the compressor air outlet 2b, the condenser inlet 3a, the condenser outlet 3b, the throttle inlet 5a, the throttle outlet 5b, the evaporation inlet 6a-1, the evaporation outlet 6a-2 and the compressor air suction port 2a are sequentially connected to form a closed refrigeration loop, and a refrigerant is filled in the refrigeration loop.
The micro pump 7 has a pump inlet 7a and a pump outlet 7 b. The water cooler 9 has a cooling inlet 9a and a cooling outlet 9 b. The bypass valve 8 is connected in parallel at two ends of the water cooler 9, namely, one end of the bypass valve 8 is connected with a cooling inlet 9a of the water cooler 9, and the other end of the bypass valve 8 is connected with a cooling outlet 9b of the water cooler 9. The water tank heat pump is characterized in that a pump inlet 7a of the micro pump 7 is connected with a water tank water outlet 6e of the water tank evaporator 6, a pump outlet 7b of the micro pump 7 is connected with a cooling inlet 9a of the water cooler 9 and one end of the bypass valve 8, the other ends of the cooling outlet 9b of the water cooler 9 and the bypass valve 8 are connected with a water outlet joint 12 arranged on the tank body 1, and a water tank water return port 6d of the water tank evaporator 6 is connected with a water return joint 11 arranged on the tank body 1.
The fan 4 is a direct current fan, preferably an axial direct current fan. After flowing into the box 1 from the air inlet 1a of the box 1, the air flows through the condenser 3 and the water cooler 9 in sequence, and then flows out of the box 1 through the fan 4 and the air outlet 1b of the box 1.
The water cooling plate 13 is a heat exchanger in which only one fluid participates in heat exchange, and has a hollow structure, and has a water cooling plate first interface 13a, a water cooling plate second interface 13b and a smooth outer surface 13c, and fins 13f for enhancing the heat exchange of the fluid are arranged in the hollow structure and on the inner surface corresponding to the smooth outer surface 13 c. The smooth outer surface 13c of the water cooling plate 13 is attached to the surface of the CPU 22 on the computer mainboard 21, and the fastening piece 14 clamps the water cooling plate 13 and the CPU 22 on the mainboard 21 so as to ensure that the smooth outer surface 13c of the water cooling plate 13 is tightly contacted with the surface of the CPU 22, thereby reducing contact thermal resistance and increasing thermal conductivity. Normally, a heat conductive silicone grease is also filled between the smooth outer surface 13c of the water-cooled plate 13 and the surface where the CPU 22 contacts, to further reduce the contact thermal resistance.
The first interface 13a of the water cooling plate is connected with the water outlet joint 12 on the box body 1 through a pipeline, and the second interface 13b of the water cooling plate is connected with the water return joint 11 on the box body 1 through a pipeline.
When the water tank evaporator is used, a proper amount of water is added into the water tank evaporator 6 through the water tank water adding port 6c, and then the micro pump 7 and the fan 4 are respectively started to operate. The computer CPU cooling device can work in two modes according to whether the micro direct current refrigeration compressor 2 runs or not: a water-air heat dissipation mode and a condensation heat dissipation mode. These are described below.
Water-air heat radiation mode
When the heat generation of the CPU 22 is small or the allowable CPU surface temperature is high, the computer CPU cooling device works in a water-air heat dissipation mode. In this mode, the bypass valve 8 is in the blocking state, the micro-pump 7 and the fan 4 are running, but the micro-dc refrigeration compressor 2 is not running.
In the water-air heat dissipation mode, water with a high temperature stored in the water tank evaporator 6 enters the micro pump 7 through the water tank water outlet 6e and the pump inlet 7a, and after the water is pressurized in the micro pump 7, the water flows through the pump outlet 7b and the cooling inlet 9a in sequence and enters the water cooler 9. In the water cooler 9, the heat of the water is taken away by the air forced to flow by the fan 4, and the temperature is lowered. The cooled water with lower temperature flows out of the water cooler 9 through the cooling outlet 9b and then sequentially enters the water cooling plate 13 through the water outlet joint 12 and the first interface 13a of the water cooling plate. In the water-cooled plate 13, water flows over the surface of the fins 13f, thereby taking away the heat dissipated by the CPU 22 (the heat dissipated by the CPU 22 is first transferred to the fins 13f inside the water-cooled plate 13 by heat conduction, and the fins 13f then transfer the heat to the water flowing through the fins 13f by convection). The temperature of the water absorbing the heat of the CPU 22 increases, and the water with the increased temperature flows out of the water cooling plate 13 through the second port 13b of the water cooling plate, and then returns to the tank evaporator 6 through the tank water return port 6d to be mixed with the water in the tank evaporator 6, thereby forming a closed water circuit. The water mixed in the water tank evaporator 6 is continuously sucked by the micro pump 7 and pumped into the water cooler 9 to be cooled again, so that the computer CPU can be continuously cooled. In the water-air heat dissipation mode, the CPU 22 is cooled, but since the temperature of the water flowing out of the water cooler 9 is always higher than the ambient air temperature, the CPU 22 cannot be cooled to be lower than the ambient air temperature.
(II) condensation heat dissipation mode
When the heat generation of the CPU 22 is large or the surface temperature of the CPU is required to be lower than the ambient air temperature, the computer CPU cooling device works in a condensation heat dissipation mode. In this mode, the bypass valve 8 is in a conducting state, and the micro pump 7, the fan 4, and the micro dc refrigerant compressor 2 are all operated.
When the micro dc refrigeration compressor 2 is operated, refrigerant gas introduced into the compressor through the compressor suction port 2a is compressed into high-temperature and high-pressure gas, discharged from the compressor discharge port 2b, and introduced into the condenser 3. In the condenser 3, the refrigerant gas of high temperature and high pressure releases heat to the air flow forced to flow by the fan 4, and the refrigerant is condensed and turns into liquid of high temperature and high pressure. When the high-temperature and high-pressure refrigerant liquid passes through the throttling element 5, the pressure is reduced, and part of the refrigerant liquid flashes out to become a low-pressure gas-liquid mixture. A low-pressure refrigerant mixture enters the tank evaporator 6 through the evaporation inlet 6a, and in the tank evaporator 6, the low-pressure refrigerant mixture absorbs the heat of the water in the tank evaporator 6 to lower the temperature of the water in the tank evaporator to obtain cold water at a low temperature, and the refrigerant mixture absorbing the heat of the water is entirely evaporated to become a completely gaseous refrigerant. The gaseous refrigerant is sucked into the compressor from the suction port 2a of the micro direct current refrigeration compressor, is compressed again, and circulates in such a way.
In the condensation heat dissipation mode, the micro pump 7 sucks in low-temperature cold water from the tank outlet 6e of the tank evaporator 6, and the cold water is pressurized in the micro pump 7 and flows into the water cooling plate 13 through the bypass valve 8, the water outlet joint 12 and the first water cooling plate interface 13 a. Since the bypass valve 8 is in the conducting state and the bypass valve 8 and the water cooler 9 are in parallel, the internal flow resistance of the water cooler 9 is much greater than the flow resistance of the bypass valve 8, so that the cold water will mainly flow through the bypass valve 8, while the water in the water cooler 9 hardly flows. In the water-cooled plate 13, the cold water flows over the surface of the fins 13f, thereby taking away the heat dissipated by the CPU 22 (the heat dissipated by the CPU 22 is first transferred to the fins 13f inside the water-cooled plate 13 by heat conduction, and the fins 13f then transfer the heat to the cold water flowing through the fins 13f by convection). The temperature of the water absorbing the heat of the CPU 22 is increased, and the water with the increased temperature flows out of the water cooling plate 13 through the second interface 13b of the water cooling plate, returns to the water tank evaporator 6 through the water return joint 11 and the water tank water return port 6d, is mixed with the cold water in the water tank evaporator 6, and is cooled again, so that the CPU 22 can be continuously cooled.
In the condensation heat dissipation mode, the heat dissipated by the CPU 22 is firstly transferred to the fins 13f of the cold plate 13 in a heat conduction manner, the fins 13f transfer the heat to the water in a convection manner, then the water transfers the heat to the refrigerant in the tank evaporator 6 in a manner of evaporating the refrigerant and absorbing the heat, and finally the refrigerant finally dissipates the heat to the ambient air in the condenser 3 in a manner of condensation heat dissipation, thereby cooling the CPU. Since the temperature of the refrigerant when it evaporates can be lower than the ambient temperature, cold water at a temperature lower than the ambient temperature can be obtained, and the CPU can be cooled to a temperature lower than the ambient air temperature.
As shown in fig. 2, the bypass valve 8 may also be replaced by a three-way valve 15 according to an alternative embodiment of the invention. The three-way valve 15 has a first port 15a, a second port 15b, and a third port 15 c. The first port 15a is connected to the pump outlet 7b of the micro pump 7, the second port 15b is connected to the cooling inlet 9a of the water cooler 9, and the third port 15c is connected to the cooling outlet 9b of the water cooler 9 and the water outlet 12. When the computer CPU cooling device works in a water-air heat dissipation mode, the first valve port 15a and the second valve port 15b of the three-way valve 15 are communicated, the third valve port 15c is closed, and at the moment, all water from the micro pump 7 flows through the water cooler 9; when the computer CPU cooling device is operating in the condensation heat dissipation mode, the first valve port 15a and the third valve port 15c of the three-way valve 15 are connected, and the second valve port 15b is disconnected, so that the water from the micro pump 7 cannot flow through the water cooler 9, and is directly bypassed to the water outlet 12. The working principle of this alternative embodiment is similar to the previous embodiment and will not be described here again.
In all the above embodiments, the air duct 10 is an air flow path that ensures that the air entering the cabinet 1 can all flow through the condenser 3 and the water cooler 9 to avoid short-circuiting of the air flow inside the cabinet 1. The technical solution of the present invention does not limit the shape of the air duct 10. According to an alternative embodiment of the present invention, when one end of the air duct 10 is connected to the air inlet 1a of the box 1 and the other end is communicated with the inside of the box 1, and the condenser 3 and the water cooler 9 are still disposed in the air duct 10, the technical solution of the present invention can still work normally.
The computer CPU cooling device of the invention adopts the micro vapor compression refrigeration cycle which takes the micro direct current compressor as the core as the cold source, has the advantages of large refrigerating capacity, high refrigerating efficiency and compact equipment, solves the defects that the CPU can not be cooled below the environmental temperature and the heat dissipation capacity is limited by the conventional water cooling heat dissipation mode, and can also adopt the conventional heat dissipation mode without starting the compressor for refrigeration when the heat productivity of the CPU is not large, thereby greatly reducing the energy consumption. In addition, the computer CPU cooling device has the advantages of large water tank capacity, convenient water adding, lower cost and compact structure because the evaporator coil and the water tank are in an integrated structure. Compared with the cooling method that the refrigerant is directly evaporated on the surface of the CPU, the technical scheme of the invention adopts the cold water for indirect cooling and adopts the water tank with large capacity as the buffer, so that the temperature fluctuation is smaller, the higher temperature control precision can be realized, the water temperature can be accurately controlled above the dew point temperature, and the condensation phenomenon on the cold plate and the surface of the CPU can be avoided.
The technical proposal of the invention is not limited to the cooling of the computer CPU, and can also be used for cooling other chips with larger heat productivity, such as a GPU (graphic processing unit), a DSP (digital signal processor), an NPU (embedded neural network processor), an IGBT and the like.
In the above, any reference to "connection" of a refrigeration circuit or water circuit means connection through a hollow pipe. In this document, the terms inner, outer, middle, upper and lower are used to define the components in the drawings and the positions of the components relative to each other, and are only used for the sake of clarity and convenience in technical solution. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims.
The above description is only exemplary of the invention and should not be taken as limiting the invention, as any modification, equivalent replacement, or improvement made within the spirit and principle of the invention should be included in the protection scope of the invention.
Claims (5)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114153297A (en) * | 2021-12-08 | 2022-03-08 | 金肯职业技术学院 | Computer energy-saving circulating heat dissipation equipment |
| CN116960101A (en) * | 2023-07-26 | 2023-10-27 | 浙江佳博科技股份有限公司 | High-flow water chiller with bond alloy wires |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005036349A1 (en) * | 2004-09-01 | 2006-03-02 | Behr Gmbh & Co. Kg | Air conditioning system for motor vehicle, has two condensors to cool cooling medium from respective, serially connected compressors, which recycle medium in refrigerant cycle during engine`s normal operation and off-condition, respectively |
| TW201101011A (en) * | 2009-06-19 | 2011-01-01 | Univ Nat Taipei Technology | Heat-dissipative device for multi-task heat-dissipative module using the heat-dissipative device |
| CN206163651U (en) * | 2016-11-08 | 2017-05-10 | 福州丹诺西诚电子科技有限公司 | Battery heat managing system of electric motor car |
| CN110874125A (en) * | 2018-09-04 | 2020-03-10 | 深圳市蓝衣科技实验室 | Active cooling system for microcomputer |
| CN210537213U (en) * | 2019-08-27 | 2020-05-15 | 深圳巴斯巴科技发展有限公司 | Air-cooled liquid cooling equipment |
| CN111295555A (en) * | 2017-11-01 | 2020-06-16 | 株式会社电装 | Equipment cooling device |
| CN213690434U (en) * | 2020-12-03 | 2021-07-13 | 武汉麦丘科技有限公司 | Computer CPU cooling device |
-
2020
- 2020-12-03 CN CN202011394338.1A patent/CN112230741A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005036349A1 (en) * | 2004-09-01 | 2006-03-02 | Behr Gmbh & Co. Kg | Air conditioning system for motor vehicle, has two condensors to cool cooling medium from respective, serially connected compressors, which recycle medium in refrigerant cycle during engine`s normal operation and off-condition, respectively |
| TW201101011A (en) * | 2009-06-19 | 2011-01-01 | Univ Nat Taipei Technology | Heat-dissipative device for multi-task heat-dissipative module using the heat-dissipative device |
| CN206163651U (en) * | 2016-11-08 | 2017-05-10 | 福州丹诺西诚电子科技有限公司 | Battery heat managing system of electric motor car |
| CN111295555A (en) * | 2017-11-01 | 2020-06-16 | 株式会社电装 | Equipment cooling device |
| CN110874125A (en) * | 2018-09-04 | 2020-03-10 | 深圳市蓝衣科技实验室 | Active cooling system for microcomputer |
| CN210537213U (en) * | 2019-08-27 | 2020-05-15 | 深圳巴斯巴科技发展有限公司 | Air-cooled liquid cooling equipment |
| CN213690434U (en) * | 2020-12-03 | 2021-07-13 | 武汉麦丘科技有限公司 | Computer CPU cooling device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114153297A (en) * | 2021-12-08 | 2022-03-08 | 金肯职业技术学院 | Computer energy-saving circulating heat dissipation equipment |
| CN114153297B (en) * | 2021-12-08 | 2024-08-27 | 金肯职业技术学院 | Energy-saving circulating heat dissipation equipment for computer |
| CN116960101A (en) * | 2023-07-26 | 2023-10-27 | 浙江佳博科技股份有限公司 | High-flow water chiller with bond alloy wires |
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