CN116960101A - High-flow water chiller with bond alloy wires - Google Patents
High-flow water chiller with bond alloy wires Download PDFInfo
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- CN116960101A CN116960101A CN202310925513.2A CN202310925513A CN116960101A CN 116960101 A CN116960101 A CN 116960101A CN 202310925513 A CN202310925513 A CN 202310925513A CN 116960101 A CN116960101 A CN 116960101A
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 117
- 239000000956 alloy Substances 0.000 title claims abstract description 19
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 19
- 238000001816 cooling Methods 0.000 claims abstract description 29
- 238000002156 mixing Methods 0.000 claims abstract description 21
- 238000005057 refrigeration Methods 0.000 claims abstract description 19
- 239000007921 spray Substances 0.000 claims abstract description 10
- 238000010992 reflux Methods 0.000 claims description 17
- 238000003860 storage Methods 0.000 claims description 17
- 238000009826 distribution Methods 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 9
- 238000005265 energy consumption Methods 0.000 abstract description 9
- 230000033228 biological regulation Effects 0.000 abstract description 7
- 238000011161 development Methods 0.000 abstract description 4
- 230000001105 regulatory effect Effects 0.000 abstract description 4
- 230000006872 improvement Effects 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 3
- 239000010970 precious metal Substances 0.000 abstract description 2
- 239000003507 refrigerant Substances 0.000 description 15
- 238000009423 ventilation Methods 0.000 description 6
- 239000000498 cooling water Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 239000000306 component Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/43—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a high-flow water chiller for a bonding alloy wire, which belongs to the technical field of precious metal processing and comprises a cabinet body, wherein a cooling port is fixedly penetrated through the inner wall of the cabinet body, and a plurality of mixing spray heads are penetrated and installed on one side of the cooling port. The system has the advantages of rapid cooling, accurate temperature control, low energy consumption, production quality improvement, emergency adjustment capability, sustainable development and the like. The whole and refrigeration assembly are highly integrated, the temperature control is carried out through circulating air flow, the energy consumption is reduced more, meanwhile, the water temperature can be regulated in the first adapter in an economic state, the effect of emergency and rapid temperature regulation is achieved, meanwhile, the air pump is adopted to pump out cold air, different amounts of air are pumped out according to the temperature, the temperature can be further regulated and controlled emergently under the mixing of the cold air and the cold water, and the mode achieves the overall low-energy operation and simultaneously gives consideration to the high-performance, rapid and accurate regulation and control of the temperature.
Description
Technical Field
The invention belongs to the technical field of precious metal processing, and particularly relates to a high-flow water chiller for a bonding alloy wire.
Background
Gold alloy wires, also known as ball bond wires or wire bond wires, are used as connection wires in integrated circuits. The gold content is more than or equal to 99.99 percent, and the total sum of trace additive elements is less than 0.01 percent. There are three types of gamma type, C type and FA type, the latter two being used for high speed bonding. The microelements are beryllium, copper, silver and the like, and have the functions of refining grains, improving recrystallization temperature and strengthening gold. Vacuum smelting in high frequency furnace, remelting and directional crystallizing, homogenizing, and cold processing to obtain final product. Or manufactured by a liquid extrusion process. Bond wires are important materials for the microelectronics industry as the connection lines between chips and lead frames.
Based on the production characteristics of bond alloy wire, need to carry out quick cooling to its surface temperature, and surface temperature needs comparatively accurate control, traditional direct adoption cold water submergence's mode is difficult to regulate and control water temperature fast, but can the spray mode of quick regulation and control, and rivers height refrigeration power demand is great for the production consumption is difficult to effective control.
The present invention has been made in view of this.
Disclosure of Invention
In order to solve the technical problems, the invention adopts the basic conception of the technical scheme that:
the high-flow water chiller with the bonding alloy wires comprises a cabinet body, wherein the inner wall of the cabinet body is fixedly penetrated by a cooling port, one side of the cooling port is fixedly penetrated by a plurality of mixing spray heads, and the surfaces of the mixing spray heads are respectively communicated with a split manifold and an air inlet manifold;
the refrigerator also comprises a refrigeration assembly;
the refrigerating assembly controls the temperature of the heat exchange row, one end of the heat exchange row is communicated with a water pump, and a water inlet of the water pump is communicated with a water inlet storage tank;
the water outlet of the heat exchange row is communicated with a water supply pipe through a first adapter, and the other end of the water supply pipe is communicated with the bottom end of the split manifold;
an air pump is arranged on one side of the space where the heat exchange row belongs, and an air outlet of the air pump is communicated with an air inlet manifold.
As a further aspect of the invention: the water tank is arranged below the heat exchange row, a water inlet of the heat exchange row is communicated with a water inlet connecting pipe, a water outlet of the heat exchange row is communicated with a water outlet connecting pipe, a three-way pipe is arranged at a water outlet of the water pump, the water inlet connecting pipe is communicated with one end of the three-way pipe through a second adapter, and the other end of the three-way pipe is communicated with a first adapter.
As a further aspect of the invention: the refrigerating assembly comprises a compressor, a condenser and an evaporator, wherein the compressor, the condenser and the evaporator are installed on the inner wall of the cabinet body, an outlet of the compressor is communicated with the condenser through a high-pressure pipe, the condenser is communicated with the evaporator through a throttle pipe, and the evaporator is communicated with an inlet of the compressor through a low-pressure pipe.
As a further aspect of the invention: the inner wall of the cooling port is rotatably provided with a plurality of rollers for conducting the bond alloy wires, and the mixing nozzle is positioned between the two rollers on the same horizontal plane.
As a further aspect of the invention: the evaporator is arranged at one side of the heat exchange row horizontally, the evaporator and the heat exchange row are arranged in the same belonging space, the two sides of the space of the evaporator and the heat exchange row are communicated with the air hoods, and one sides, far away from the two air hoods, are mutually communicated through the circulation channel.
As a further aspect of the invention: the cooling port is corresponding to the axial position of the mixing nozzle and is provided with a reflux groove, the inner wall of the reflux groove is communicated with a reflux pipe, and one end of the reflux pipe is communicated with the water storage tank.
As a further aspect of the invention: one end of the water supply pipe is communicated with the first adapter, a one-way valve is arranged on the surface of the water supply pipe, and electromagnetic valves are arranged at two ends of the three-way pipe, which are positioned at the first adapter and the second adapter.
As a further aspect of the invention: a circulating fan is arranged on one side of the evaporator, and a cooling fan is arranged on the inner wall of the condenser.
As a further aspect of the invention: the surface of the cabinet body is provided with a controller in a penetrating way.
As a further aspect of the invention: one side of the second adapter is communicated with a reverse flow pipe, and the reverse flow pipe is communicated with the water storage groove.
The beneficial effects are that:
the system has the advantages of rapid cooling, accurate temperature control, low energy consumption, production quality improvement, emergency adjustment capability, sustainable development and the like. These advantages enable the system to operate under efficient, reliable and environmentally friendly conditions and meet the requirements of the bond wire production process. The whole and refrigeration assembly are highly integrated, the temperature control is carried out through circulating air flow, the energy consumption is reduced more, meanwhile, the water temperature can be regulated in the first adapter in an economic state, the effect of emergency and rapid temperature regulation is achieved, meanwhile, the air pump is adopted to pump out cold air, different amounts of air are pumped out according to the temperature, the temperature can be further regulated and controlled emergently under the mixing of the cold air and the cold water, and the mode achieves the overall low-energy operation and simultaneously gives consideration to the high-performance, rapid and accurate regulation and control of the temperature.
The following describes the embodiments of the present invention in further detail with reference to the accompanying drawings.
Drawings
In the drawings:
FIG. 1 is a schematic view of a three-dimensional structure of the present invention;
FIG. 2 is a schematic view of a three-dimensional cross-sectional structure of the present invention;
FIG. 3 is a schematic cross-sectional view of another perspective view of the present invention;
FIG. 4 is a schematic view of a three-dimensional cross-sectional structure of a fan housing according to the present invention;
FIG. 5 is a schematic view of a heat exchanger in a three-dimensional structure;
fig. 6 is a schematic view showing a three-dimensional structure of a cooling port according to the present invention.
In the figure: 1. a cabinet body; 2. a cooling port; 3. a roller; 4. a compressor; 5. a condenser; 6. an evaporator; 7. a heat exchange row; 8. a fan housing; 9. a circulation path; 10. a throttle tube; 11. a high pressure pipe; 12. a low pressure tube; 13. a three-way pipe; 14. a water supply pipe; 15. a split manifold; 16. an air pump; 17. an intake manifold; 18. a mixing nozzle; 19. a reflux groove; 20. a return pipe; 21. a water storage tank; 22. a water pump; 23. a controller; 24. a circulation fan; 25. a heat radiation fan; 26. a reverse flow tube; 27. a water outlet connecting pipe; 28. and a water inlet connecting pipe.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and the following embodiments are used to illustrate the present invention.
Example 1
Referring to fig. 1 to 6, the present invention provides a technical solution: the high-flow water chiller with the bonding alloy wires comprises a cabinet body 1, wherein a cooling port 2 is fixedly penetrated through the inner wall of the cabinet body 1, a plurality of mixing spray heads 18 are fixedly penetrated through one side of the cooling port 2, and the surfaces of the mixing spray heads 18 are respectively communicated with a split manifold 15 and an air inlet manifold 17;
the refrigerator also comprises a refrigeration assembly;
the refrigeration assembly controls the temperature of the heat exchange row 7, one end of the heat exchange row 7 is communicated with a water pump 22, and a water inlet of the water pump 22 is communicated with a water inlet storage tank 21;
the water outlet of the heat exchange row 7 is communicated with a water supply pipe 14 through a first adapter, and the other end of the water supply pipe 14 is communicated with the bottom end of a split manifold 15;
an air pump 16 is arranged on one side of the space of the heat exchange row 7, and an air outlet of the air pump 16 is communicated with an air inlet manifold 17.
Specifically, as shown in fig. 5: the water storage tank 21 is arranged below the heat exchange row 7, a water inlet of the heat exchange row 7 is communicated with a water inlet connecting pipe, a water outlet of the heat exchange row 7 is communicated with a water outlet connecting pipe 27, a three-way pipe 13 is arranged at a water outlet of the water pump 22, the water inlet connecting pipe is communicated with one end of the three-way pipe 13 through a second adapter, and the other end of the three-way pipe 13 is communicated with a first adapter.
Specifically, as shown in fig. 3 and 4: the refrigerating assembly comprises a compressor 4, a condenser 5 and an evaporator 6 which are arranged on the inner wall of the cabinet body 1, wherein an outlet of the compressor 4 is communicated with the condenser 5 through a high-pressure pipe 11, the condenser 5 is communicated with the evaporator 6 through a throttle pipe 10, and the evaporator 6 is communicated with an inlet of the compressor 4 through a low-pressure pipe 12.
The compressor 4 is one of the core components of the refrigeration system and is responsible for compressing the refrigerant into a high pressure gas. By compression, both the temperature and pressure of the refrigerant are increased, providing the energy required for the subsequent condensation and evaporation processes. The condenser 5 is a component for heat dissipation in the refrigeration system. The high temperature and high pressure refrigerant passes through the condenser 5, releasing heat and cooling down during contact with the surrounding environment. The condenser 5 generally accelerates the heat dissipation by a radiator fan 25 or other cooling medium such as water. The evaporator 6 is a component for absorbing heat in the refrigeration system. After the high-pressure refrigerant enters the evaporator 6, the refrigerant is converted from a liquid state to a gas state by the decompression effect, and the heat of the surrounding environment is absorbed. The evaporator 6 is typically used in combination with a circulation fan or other circulation medium such as water to effect cooling of the air or liquid. A throttle valve is a valve for controlling the flow and pressure of a refrigerant. It is located between the high pressure side and the low pressure side, and reduces the pressure and temperature of the refrigerant by reducing the flow cross section. The throttle valve serves to limit the flow and control the state of the refrigerant so that it can enter the evaporator 6 for the heat absorption process. The refrigeration components are matched with each other, and the refrigerant absorbs and releases heat under different pressure and temperature conditions through the circulation and phase change processes, so that the environment or objects are cooled and the temperature is controlled. Together they form a closed-loop refrigeration cycle system providing refrigeration for a variety of applications.
Specifically, as shown in fig. 2: the inner wall of the cooling port 2 is rotatably provided with a plurality of rollers 3 for conduction of bond alloy wires, and the mixing nozzle 18 is positioned between the two rollers 3 on the same horizontal plane.
By providing the roller 3, a good guiding effect on the bond wire can be maintained, so that it can be stably moved to the corresponding position of the mixing nozzle 18.
Specifically, as shown in fig. 4: the evaporator 6 is arranged horizontally on one side of the heat exchange row 7, the evaporator 6 and the heat exchange row 7 are positioned in the same belonging space, the two sides of the belonging space of the evaporator 6 and the heat exchange row 7 are communicated with the air hoods 8, and one sides, far away from the two air hoods 8, are mutually communicated through the circulation channel 9.
The hood 8 is designed to have a specific shape and direction so as to guide the flow of the wind current. They can direct air to specific areas or devices, ensuring ventilation and even distribution. In the refrigeration system, the hood 8 may ensure that cool air flows to the target area of the evaporator 6 or the heat exchanger to achieve an effective cooling effect. The hood 8 may be used to protect equipment or personnel from direct wind flow. For example, in a ventilation system, the hood 8 may avoid blowing directly against a person to provide a comfortable ventilation environment. Also, in the refrigeration system, the hood 8 may prevent the cold air from directly contacting sensitive elements or equipment, thereby protecting it from damage. The design of the hood 8 may help to achieve an even distribution of air. By adjusting the air outlet of the fan cover 8, the guide plate and other parts, the distribution and the direction of the air quantity can be controlled so as to meet specific air flow requirements. This is important when uniform cooling or ventilation of the space is required. The use of the hood 8 may increase the efficiency of the system. By directing the airflow and controlling the air distribution, the hood 8 helps to reduce energy waste and unnecessary air loss, thereby improving the efficiency of the refrigeration or ventilation system. The fan housing 8 plays roles of guiding air flow, protecting and isolating, uniformly distributing air quantity, improving system efficiency and the like in a refrigeration system or a ventilation system. They are important components designed to optimize air flow and provide a comfortable environment.
Specifically, as shown in fig. 6: the cooling port 2 is provided with a reflux groove 19 corresponding to the axial position of the mixing nozzle 18, the inner wall of the reflux groove 19 is communicated with a reflux pipe 20, and one end of the reflux pipe 20 is communicated with a water storage tank 21.
The reflux tank 19 is used for collecting and storing water body, water body is prevented from splashing in the cooling port 2, the reflux tank 19 corresponds to the position of the mixing nozzle 18, and sprayed water directly collides in the reflux tank 19 in a large amount, so that the effect of effectively recycling and placing the scattered water body is achieved, and the reflux tank 19 collects the water body which is heated up so as to be reused.
Specifically, as shown in fig. 2 and 4: one end of the water supply pipe 14 is communicated with the first adapter, a one-way valve is arranged on the surface of the water supply pipe 14, and electromagnetic valves are arranged at two ends of the three-way pipe 13, which are positioned at the first adapter and the second adapter.
Through adopting the check valve, can effectively prevent that the water in the delivery pipe 14 from appearing the circumstances of countercurrent, the solenoid valve can be convenient for in time accurate control three-way pipe 13 and the break-make communication state of first adapter and second adapter simultaneously.
Specifically, as shown in fig. 3 and 4: a circulation fan 24 is installed at one side of the evaporator 6, and a heat radiation fan 25 is installed at the inner wall of the condenser 5.
Through adopting circulation fan 24, can keep the gas flow, control gas flow rate, and then regulate and control the temperature, the heat of condenser 5 can be discharged to the heat dissipation seal simultaneously, prevents to appear hot piling up.
Specifically, as shown in fig. 1: the surface of the cabinet body 1 is provided with a controller 23 in a penetrating way.
The whole is automatically controlled by a controller 23.
Specifically, as shown in fig. 4: one side of the second adapter is connected with a reverse flow pipe 26, and the reverse flow pipe 26 is connected with a water storage tank.
The backflow pipe 26 can provide a channel through which water can flow back to the water storage tank 21 under the action of gravity when the system is not running, so that the stability of the whole equipment is ensured.
The working principle of the invention is as follows:
when in use, the compressor 4 compresses the refrigerant and then transmits the compressed refrigerant into the condenser 5 through the high-pressure pipe 11, at the moment, the heat dissipation fan 25 dissipates the heat of the condenser 5, when the refrigerant in a high-pressure state enters the throttle pipe 10, the pressure of the refrigerant is reduced based on the action of the throttle valve on the surface of the throttle pipe 10, the refrigerant is converted from a liquid state into a gas state and enters the evaporator 6, at the moment, the circulating fan flows the gas in the space through the action of the two hoods 8 into the circulating channel 9, the cold air flow of the evaporator 6 uniformly cools and controls the temperature of the heat exchange exhaust 7 in the circulating air flow, the water body in the water storage tank is pumped out to the three-way pipe 13 by adjusting the air flow rate and the power of the compressor 4, at the same time, the three-way pipe 13 and the electromagnetic valve of the first converter are closed, the water body enters the water inlet connecting pipe 28 through the second adapter, the water body enters the heat exchange row 7 in the water inlet connecting pipe 28, the water body is discharged through the water outlet connecting pipe 27 after temperature regulation, the water outlet connecting pipe 27 transmits low-temperature water body into the first adapter, at the moment, if the temperature is too low, the electromagnetic valve of the three-way pipe 13 positioned in the first adapter is opened, the water storage tank 21 is added into the water collecting body for rapid reduction regulation, proper water flow enters the distribution manifold 15 through the water supply pipe 14, and respectively enters the plurality of mixing spray heads 18 through the distribution manifold 15 for spraying, meanwhile, the air pump 16 can be selectively started, the air pump 16 quantitatively extracts air according to the air temperature in the space, the air pump 17 is injected into the plurality of mixing spray heads 18, and cooling water is dispersed under high-pressure air, so that the water-air mixture is sprayed into the cooling port 2 until the temperature is reduced, the water flow is collected and flows back into the water storage tank under the action of the backflow groove 19, and in combination, the three-way pipe 13 can also draw the water flow of the water storage tank into the second adapter, and the water flow is returned to the water storage tank through the backflow pipe 26.
The system can quickly reduce the surface temperature of the bond alloy wire by high-efficiency refrigerant compression and circulating air flow and a cooling water spraying mode, and improves the production efficiency and the product quality. By adjusting the speed of the circulating air flow, the power of the compressor 4 and the flow and the temperature of the cooling water, the system can realize the accurate control of the surface temperature of the bond alloy wire, meet the temperature requirement in the production process and ensure the quality and the stability of the product. Compared with the traditional immersed cooling method, the system realizes rapid cooling by utilizing a spraying and circulating mode through evaporation and spraying effects, and reduces energy consumption and water consumption. In addition, by adjusting the flow of circulating air flow and cooling water, the energy utilization efficiency can be further optimized, and the energy consumption of the system can be reduced. Through quick and accurate control bond alloy wire surface temperature, the damage that this system can avoid overheated to arouse and defective products produce, improves production quality and uniformity. The adjusting device and the control mode in the system enable the system to respond to temperature change quickly and carry out emergency adjustment. For example, by opening or closing the electromagnetic valve and activating the air pump 16, the flow rate and temperature of the cooling water can be quickly adjusted, and emergency adjustment of the temperature can be achieved. By optimizing energy consumption and resource utilization, and reducing water consumption, the system meets the requirements of sustainable development, and reduces the influence on the environment.
In summary, the system has the advantages of rapid cooling, accurate temperature control, low energy consumption, production quality improvement, emergency adjustment capability, sustainable development and the like. These advantages enable the system to operate under efficient, reliable and environmentally friendly conditions and meet the requirements of the bond wire production process.
In conclusion, the working principle is that the whole and refrigeration assembly are highly integrated, the temperature control is carried out through circulating air flow, the energy consumption is further reduced, meanwhile, the water temperature adjustment can be carried out in the first adapter in an economic state, the effect of urgently and rapidly adjusting the temperature is achieved, meanwhile, the air pump (16) is adopted to pump out cold air, different amounts of air are pumped out according to the temperature, the temperature can be further urgently adjusted and controlled under the mixing of the cold air and the cold water, and the mode achieves the overall low-energy operation and simultaneously gives attention to the high-performance rapid and accurate adjustment and control of the temperature.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and their equivalents.
Claims (10)
1. The high-flow water chiller with the bonding alloy wires comprises a cabinet body (1) and is characterized in that a cooling port (2) is fixedly penetrated through the inner wall of the cabinet body (1), a plurality of mixing spray heads (18) are installed on one side of the cooling port (2) in a penetrating manner, and a distribution manifold (15) and an air inlet manifold (17) are respectively communicated with the surfaces of the mixing spray heads (18);
the refrigerator also comprises a refrigeration assembly;
the refrigerating assembly controls the temperature of the heat exchange row (7), one end of the heat exchange row (7) is communicated with a water pump (22), and a water inlet of the water pump (22) is communicated with a water inlet storage tank (21);
the water outlet of the heat exchange row (7) is communicated with a water supply pipe (14) through a first adapter, and the other end of the water supply pipe (14) is communicated with the bottom end of a split manifold (15);
an air pump (16) is arranged on one side of the space where the heat exchange row (7) belongs, and an air outlet of the air pump (16) is communicated with an air inlet manifold (17).
2. The high-flow water chiller with the key alloy wires according to claim 1, wherein the water storage tank (21) is arranged below the heat exchange row (7), a water inlet of the heat exchange row (7) is communicated with a water inlet connecting pipe, a water outlet of the heat exchange row (7) is communicated with a water outlet connecting pipe (27), a three-way pipe (13) is arranged at a water outlet of the water pump (22), the water inlet connecting pipe is communicated with one end of the three-way pipe (13) through a second adapter, and the other end of the three-way pipe (13) is communicated with a first adapter.
3. The high-flow water chiller according to claim 1 wherein the refrigeration assembly comprises a compressor (4), a condenser (5) and an evaporator (6) mounted on the inner wall of the cabinet (1), wherein the outlet of the compressor (4) is communicated with the condenser (5) through a high-pressure pipe (11), the condenser (5) is communicated with the evaporator (6) through a throttle pipe (10), and the evaporator (6) is communicated with the inlet of the compressor (4) through a low-pressure pipe (12).
4. The high-flow water chiller for bonding alloy wires according to claim 2 wherein the inner wall of the cooling port (2) is rotatably provided with a plurality of rollers (3) for bonding alloy wire conduction, and the mixing nozzle (18) is located between two rollers (3) on the same horizontal plane.
5. A high flow rate water chiller for a bond wire according to claim 3 wherein the evaporator (6) is horizontally disposed on one side of the heat exchange row (7), the evaporator (6) and the heat exchange row (7) are disposed in the same space, the two sides of the space where the evaporator (6) and the heat exchange row (7) belong are both communicated with the air hoods (8), and the sides of the two air hoods (8) which are far away from each other are mutually communicated through the circulation channel (9).
6. The high-flow water chiller with the bonding alloy wires according to claim 4, wherein a reflux groove (19) is formed in the cooling port (2) at the axial position corresponding to the mixing nozzle (18), a reflux pipe (20) is communicated with the inner wall of the reflux groove (19), and one end of the reflux pipe (20) is communicated with a water storage tank (21).
7. The high-flow water chiller with the key alloy wires according to claim 2, wherein one end of the water supply pipe (14) is communicated with the first adapter, a one-way valve is arranged on the surface of the water supply pipe (14), and electromagnetic valves are arranged at two ends of the three-way pipe (13) located at the first adapter and the second adapter.
8. A high flow rate cold water machine of a bonding alloy wire according to claim 3, characterized in that a circulating fan (24) is installed at one side of the evaporator (6), and a heat radiation fan (25) is installed at the inner wall of the condenser (5).
9. The high-flow water chiller of a bond wire according to claim 1 wherein the surface of the cabinet (1) is provided with a controller (23) through.
10. The high flow rate water chiller of claim 7 wherein a return flow tube (26) is connected to one side of the second adapter and the return flow tube (26) is connected to the reservoir.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310925513.2A CN116960101B (en) | 2023-07-26 | 2023-07-26 | High-flow water chiller with bond alloy wires |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310925513.2A CN116960101B (en) | 2023-07-26 | 2023-07-26 | High-flow water chiller with bond alloy wires |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116960101A true CN116960101A (en) | 2023-10-27 |
| CN116960101B CN116960101B (en) | 2024-07-23 |
Family
ID=88450901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310925513.2A Active CN116960101B (en) | 2023-07-26 | 2023-07-26 | High-flow water chiller with bond alloy wires |
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| CN116960101B (en) | 2024-07-23 |
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