CN112164715B - Display panel and display device - Google Patents
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- CN112164715B CN112164715B CN202011178543.4A CN202011178543A CN112164715B CN 112164715 B CN112164715 B CN 112164715B CN 202011178543 A CN202011178543 A CN 202011178543A CN 112164715 B CN112164715 B CN 112164715B
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 22
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- 239000010410 layer Substances 0.000 claims description 284
- 230000000903 blocking effect Effects 0.000 claims description 29
- 239000011241 protective layer Substances 0.000 claims description 21
- 238000005538 encapsulation Methods 0.000 abstract description 21
- 230000000694 effects Effects 0.000 abstract description 20
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- 239000010409 thin film Substances 0.000 description 8
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- 239000012044 organic layer Substances 0.000 description 6
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- 229920001230 polyarylate Polymers 0.000 description 2
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a display panel and a display device, comprising: a substrate base; the array layer comprises a source-drain metal layer, and the source-drain metal layer comprises a wiring part positioned in the non-display area; a planarization layer, which is positioned on one side of the array layer far away from the substrate base plate; the display function layer comprises a pixel definition layer, a light-emitting device positioned in a display area and a connecting wire positioned in a non-display area, wherein the light-emitting device comprises an anode, a cathode arranged opposite to the anode, and an organic light-emitting layer formed between the anode and the cathode, the connecting wire and the anode are arranged in the same layer, and the materials of the connecting wire and the anode are the same; the packaging layer comprises at least one inorganic layer, and the at least one inorganic layer is positioned on one side of the packaging layer close to the substrate; the connecting wire is electrically connected with the wiring part and comprises a plurality of first hollowed-out parts; the pixel definition layer at least covers the edge of the hollowed-out part. The invention improves the encapsulation effect of the display panel.
Description
The application provides a divisional application with the name of a display panel and a display device, which is applied for the application of 2018, 11, 28 and 201811434028.0.
Technical Field
The present invention relates to the field of display technologies, and more particularly, to a display panel and a display device.
Background
With the development of display technology, consumers have increasingly demanded video and audio products, and for display manufacturers, the production of high resolution and high image quality displays is a development direction, while Organic LIGHT EMITTING (OLED) has been widely used in displays due to its self-luminescence, high brightness, wide viewing angle, rapid response, and the capability of producing RGB full-color components, and the application of OLED display panels has now entered a practical stage, and the development of full-color OLED display panels will be widely used in light and thin displays such as mobile products, notebook computers, monitors, wall-mounted televisions, etc., and the competitiveness of OLED products will be improved.
How to design an OLED display panel with excellent performance, and to continuously improve the use experience of users is an important technical problem to be solved in the industry.
Disclosure of Invention
In view of this, the present invention provides a display panel having a display area and a non-display area surrounding the display area, comprising: a substrate base; the array layer is positioned at one side of the substrate base plate, the array layer comprises a source drain metal layer, and the source drain metal layer comprises a wiring part positioned in the non-display area; a planarization layer, which is positioned on one side of the array layer far away from the substrate base plate; the display function layer is positioned on one side of the planarization layer, which is far away from the substrate base plate, and comprises a pixel definition layer, a light-emitting device positioned in a display area and a connecting wire positioned in a non-display area, wherein the light-emitting device comprises an anode, a cathode arranged opposite to the anode, and an organic light-emitting layer formed between the anode and the cathode, the connecting wire and the anode are arranged on the same layer, and the materials of the two are the same; the packaging layer is positioned on one side of the display functional layer, which is far away from the substrate, and comprises at least one inorganic layer, and the at least one inorganic layer is positioned on one side of the packaging layer, which is close to the substrate; the connecting wire is electrically connected with the wiring part and comprises a plurality of first hollowed-out parts; the pixel definition layer at least covers the edge of the hollowed-out part.
The invention also provides a display device comprising the display panel.
Compared with the prior art, the display panel and the display device provided by the invention have the advantages that at least the following effects are realized:
The connecting wire comprises a plurality of first hollowed-out parts, so that the contact area between the connecting wire and the inorganic layer is effectively reduced, the inorganic layer is contacted with other film layers through the first hollowed-out parts, the situation that the film layers are easy to peel between the connecting wire and the inorganic layer is effectively improved, the packaging effect of the display panel is improved, and the service life of the display panel is prolonged; the pixel definition layer at least covers the edge of the hollowed-out part, so that the condition that the connecting line is crushed caused by downward pressing of the mask plate is effectively reduced, and meanwhile, the film attaching force between the pixel definition layer and the connecting line and the film attaching force between the pixel definition layer and the inorganic layer are larger than the film attaching force between the connecting line and the inorganic layer, the condition that the connecting line and the inorganic layer are easy to peel off is further improved, and the packaging effect of the display panel is improved.
Of course, it is not necessary for any one product embodying the invention to achieve all of the technical effects described above at the same time.
Other features of the present invention and its advantages will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of the display panel of FIG. 1 along A-A';
FIG. 3 is a schematic view of a partial cross-sectional structure of a non-display area of another display panel according to an embodiment of the present invention;
FIG. 4 is a schematic view of a partial cross-sectional structure of a non-display area of a display panel according to another embodiment of the present invention;
FIG. 5 is a schematic view showing a partial cross-sectional structure of a non-display area of a display panel according to another embodiment of the present invention;
FIG. 6 is a schematic view showing a partial cross-sectional structure of a non-display area of a display panel according to another embodiment of the present invention;
FIG. 7 is a schematic view showing a partial cross-sectional structure of a non-display area of a display panel according to another embodiment of the present invention;
FIG. 8 is a schematic view showing a partial cross-sectional structure of a non-display area of a display panel according to another embodiment of the present invention;
FIG. 9 is a schematic view showing a partial cross-sectional structure of a non-display area of a display panel according to another embodiment of the present invention;
fig. 10 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.
The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
The OLED display panel in the prior art generally includes a substrate, an organic light emitting element located on one side of the substrate, a thin film encapsulation layer, and some other film layer located on the thin film encapsulation layer. The thin film encapsulation layer generally comprises stacked inorganic layers and organic layers, the organic light-emitting element generally comprises an anode, a cathode and an organic light-emitting layer, a connecting wire which is made of the same material as the anode is arranged in a non-display area of the OLED display panel, the thin film encapsulation layer covers the connecting wire, and peeling phenomenon is easy to occur between the connecting wire and the inorganic layers in the thin film encapsulation layer, so that the performance of the display panel is affected.
In order to solve the technical problems, the invention provides a display panel and a display device. Specific embodiments of the display panel and the display device provided by the present invention will be described in detail below.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention, fig. 2 is a schematic structural diagram of a cross section of the display panel along A-A' in fig. 1, and referring to fig. 1 and 2, the embodiment provides a display panel having a display area AA and a non-display area NA surrounding the display area AA, including:
a substrate base 10;
the array layer 20, the array layer 20 locates at one side of the substrate base plate 10, the array layer 20 includes the source drain electrode metal layer 21, the source drain electrode metal layer 21 includes the wire department 211 located in non-display area NA;
note that, the trace portion 211 does not belong to the source-drain metal layer 21, and the trace portion 211 is only designed to be the same layer as the source-drain metal layer 21.
A planarization layer 30, wherein the planarization layer 30 is located at a side of the array layer 20 away from the substrate 10;
A display function layer 40, the display function layer 40 being located at a side of the planarization layer 30 away from the substrate 10, the display function layer 40 including a pixel definition layer 41, a light emitting device 42 located in the display area AA, and a connection line 43 located in the non-display area NA, the light emitting device 42 including an anode 421, a cathode 422 disposed opposite to the anode 421, and an organic light emitting layer 423 formed between the anode 421 and the cathode 422, the connection line 43 and the anode 421 being disposed in the same layer and being the same material as each other;
The packaging layer 50, the packaging layer 50 is located at one side of the display function layer 40 far away from the substrate 10, the packaging layer 50 comprises at least one inorganic layer 51, and the at least one inorganic layer 51 is located at one side of the packaging layer 50 near the substrate 10;
the connecting wire 43 is electrically connected with the wiring portion 211, and the connecting wire 43 comprises a plurality of first hollowed-out portions 431;
the pixel defining layer 41 covers at least the edge of the hollow 431.
Specifically, with continued reference to fig. 1 and 2, the display panel of the present embodiment includes a display area AA and a non-display area NA, and the non-display area NA is disposed around the display area AA: the array layer 20 comprises a plurality of thin film transistors 22 positioned in a display area AA, the thin film transistors 22 comprise a grid electrode 221, an active layer 222, a source electrode 223 and a drain electrode 224, a buffer layer 23 can be arranged between the grid electrode 221 and the substrate 10, a grid insulating layer 24 can be arranged between the active layer 222 and the grid electrode 221, an interlayer insulating layer 25 can be arranged between the active layer 222 and the source electrode 223 and between the active layer 224, a passivation layer 26 can be arranged on the side, away from the grid electrode 221, of the source electrode 223 and the drain electrode 224, and a planarization layer 30 can be arranged on the side, away from the source electrode 223 and the drain electrode 224, of the passivation layer 26, wherein the planarization layer 30 can be an organic layer such as acrylic, polyimide (PI) or benzocyclobutene (BCB).
The display panel of the present embodiment further includes a display functional layer 40, where the display functional layer 40 is located on a side of the array layer 20 away from the substrate 10, and the display functional layer 40 includes a pixel defining layer 41, a light emitting device 42 located in the display area AA, and a connection line 43 located in the non-display area NA; the light emitting device 42 is formed on the thin film transistor 22, and the light emitting device 42 includes at least an anode 421, a cathode 422 disposed opposite to the anode 421, and an organic light emitting layer 423 formed between the anode 421 and the cathode 422, the anode 421 being electrically connected to the drain electrode 224 through a contact hole in order to form the light emitting device 42. The connection line 43 and the anode 421 are provided in the same layer and are made of the same material. The pixel defining layer 41 is positioned on the planarization layer 30 to cover the edge of the anode electrode 421. The pixel defining layer 41 may be formed of an organic material such as Polyimide (PI), polyamide, benzocyclobutene (BCB), acryl resin, or phenol resin. The organic light emitting layer 423 may be formed by a vapor deposition process, and the organic light emitting layer 423 includes an organic emission layer and may further include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. The side of the organic light emitting layer 423 remote from the anode 421 is provided with a cathode 422, and the anode 421 and the cathode 422 are insulated from each other by the organic light emitting layer 423. If a voltage is applied between the anode 421 and the cathode 422, the organic light emitting layer 423 emits visible light, thereby realizing an image that can be recognized by a user.
The display panel of the present embodiment further includes an encapsulation layer 50, where the encapsulation layer 50 is located on a side of the display function layer 40 away from the substrate 10, and the encapsulation layer 50 includes at least one inorganic layer 51, where the at least one inorganic layer 51 is located on a side of the encapsulation layer 50 close to the substrate 10. The encapsulation layer is illustratively a three-layer or five-layer structure of an inorganic layer, an organic layer, and an inorganic layer. The inorganic layer adopts the coating film, and the organic layer generally adopts the mode of inkjet printing to form, and the organic layer has less elastic modulus, alleviates the effect of buckling stress, and the inorganic layer mainly plays the effect of separation water oxygen.
In the non-display area NA, the connection line 43 is electrically connected to the wiring portion 211, and the connection line 43 and the anode 421 are arranged in the same layer, so that at least one inorganic layer 51 in the encapsulation layer 50 covers the connection line 43 and is in contact with the connection line 43. The materials of the connection line 43 and the anode 421 are the same, and due to the characteristics of the materials, the film adhesion between the connection line 43 and the inorganic layer 51 is poor, so that in the contact area between the connection line 43 and the inorganic layer 51 in the non-display area NA, the film peeling phenomenon is easy to occur between the connection line 43 and the inorganic layer 51, thereby influencing the encapsulation effect of the display panel. The connecting wire 43 comprises a plurality of first hollowed-out parts 431, so that the contact area between the connecting wire 43 and the inorganic layer 51 is effectively reduced, the inorganic layer 51 is contacted with other film layers through the first hollowed-out parts 431, the situation that the film layers are easily stripped between the connecting wire 43 and the inorganic layer 51 is effectively improved, the packaging effect of the display panel is improved, and the service life of the display panel is prolonged.
In the manufacturing process of the display panel, a relevant film layer is formed by utilizing the evaporation of a mask plate, the mask plate has a downward pressing action in the evaporation process, when the edge of the mask plate is contacted with the connecting wire 43, the connecting wire 43 is easy to be crushed, particularly the edge of the hollowed-out part 431 in the connecting wire 43 is easy to be crushed, and the edge of the hollowed-out part 431 in the connecting wire 43 is easy to be peeled off from the inorganic layer 51. The pixel definition layer 41 at least covers the edge of the hollowed-out portion 431, so that the situation that the connecting wire 43 is crushed caused by downward pressing of the mask plate is effectively reduced, meanwhile, the film attaching force between the pixel definition layer 41 and the connecting wire 43 and the inorganic layer 51 is larger than that between the connecting wire 43 and the inorganic layer 51, the situation that the film layer is easily stripped between the connecting wire 43 and the inorganic layer 51 is further improved, and the packaging effect of the display panel is improved.
It should be noted that, in fig. 2, the pixel defining layer 41 is exemplarily shown to cover the edge of the hollowed-out portion 431, and in other embodiments of the present invention, the pixel defining layer 41 may completely cover the connection line 43, which is not limited in this embodiment.
With continued reference to fig. 1 and 2, optionally, the substrate base 10 is a flexible base.
The base substrate 10 may be formed of any suitable insulating material having flexibility, and for example, may be formed of a polymer material such as Polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PAR), or glass Fiber Reinforced Plastic (FRP). The base substrate 10 may be transparent, translucent or opaque.
Specifically, when the display panel is a flexible display panel, the substrate 10 is a flexible substrate. In the flexible display panel, in the area where the connecting wire 43 and the inorganic layer 51 in the non-display area NA are in contact, the phenomenon that the film layer is peeled off between the connecting wire 43 and the inorganic layer 51 is more serious, and the connecting wire 43 comprises a plurality of first hollowed-out parts 431, so that the situation that the film layer is peeled off between the connecting wire 43 and the inorganic layer 51 in the non-display area NA is effectively improved, the packaging effect in the flexible display panel is effectively improved, and the service life of the flexible display panel is prolonged.
Fig. 3 is a schematic view showing a partial cross-sectional structure of a non-display area of another display panel according to an embodiment of the present invention, and referring to fig. 3, optionally, the display panel further includes a first blocking portion 61, a second blocking portion 62, and an organic structure 63 located in the non-display area NA;
the material of the organic structure 63 is the same as that of the pixel defining layer 41, and both are provided in the same layer;
the first blocking portion 61 is located between the second blocking portion 62 and the display area AA;
The organic structure 63 is located between the first barrier 61 and the display area AA, the cathode 422 extends to the non-display area NA, and it covers the organic structure 63;
The connection line 43 is also electrically connected to the cathode 422;
The connection line 43 and the trace portion 211 are both located between the second blocking portion 62 and the organic structure 63.
Specifically, the display panel further includes a first blocking portion 61 and a second blocking portion 62 located in the non-display area NA, the first blocking portion 61 is located between the second blocking portion 62 and the display area AA, the first blocking portion 61 is used as a blocking layer of the organic layer in the encapsulation layer 50, and the second blocking portion 62 prevents crack growth of the inorganic layer in the encapsulation layer 50 in the display panel cutting process, so that the encapsulation effect of the encapsulation layer 50 is effectively improved. The display panel further comprises a package cover (not shown in fig. 3) on a side of the second blocking portion 62 remote from the substrate 10, the second blocking portion 62 supporting the package cover.
The display panel further includes an organic structure 63 disposed in the non-display area NA, the organic structure 63 is made of the same material as the pixel defining layer 41 and disposed in the same layer, the organic structure 63 is disposed between the first blocking portion 61 and the display area AA, the cathode 422 extends to the non-display area NA and covers the organic structure 63, the connection line 43 is electrically connected to the cathode 422, the wiring portion 211 transmits an electrical signal to the cathode 422 through the connection line 43, and then a voltage is applied to the anode 421, so that the organic light emitting layer 423 emits visible light, thereby realizing an image recognizable by a user.
The connection line 43 and the trace portion 211 are both located between the second blocking portion 62 and the organic structure 63.
With continued reference to fig. 1 and 2, optionally, the trace portion 211 is electrically connected to a low potential voltage terminal of the display panel.
The trace portion 211 is electrically connected to the low potential voltage terminal of the display panel, so that the trace portion 211 transmits a low voltage signal to the cathode 422 through the connection line 43.
With continued reference to fig. 3, the display panel may optionally further include a bank 64 located in the non-display area NA, the bank 64 covering an edge of the trace 211 remote from the display area AA, the bank 64 and the planarization layer 41 being of the same material;
the second blocking portion 62 is located at a side of the bank 64 remote from the substrate base plate 10, and one end of the connection line 43 is located between the second blocking portion 62 and the bank 64.
Specifically, the dam 64 covers the edge of the wiring portion 211 far away from the display area AA, one end of the connecting wire 43 far away from the display area AA is located between the second blocking portion 62 and the dam 64, one end of the connecting wire 43 far away from the display area AA is not in contact with the inorganic layer 51, one end of the connecting wire 43 far away from the display area AA is not required to be covered by the pixel definition layer 41, the problem that a film layer is peeled off between the edge of the connecting wire 43 far away from the display area AA and the inorganic layer 51 is effectively solved, and the packaging effect of the display panel is effectively improved.
With continued reference to fig. 1 and 2, optionally, the connection line 43 is located between the first barrier 61 and the organic structure 63.
Specifically, the wiring portion 211 is located between the second blocking portion 62 and the organic structure 63, the connecting wire 43 is located between the first blocking portion 61 and the organic structure 63, the contact area between the connecting wire 43 and the inorganic layer 51 is further reduced, the situation that the film layer is easily stripped between the connecting wire 43 and the inorganic layer 51 is further improved, the packaging effect of the display panel is improved, and the service life of the display panel is prolonged.
It should be noted that, to solve the problem that the film peeling occurs between the edge of the connection line 43 away from the display area AA and the inorganic layer 51, the pixel defining layer 41 may cover the edge of the connection line 43 away from the display area AA.
With continued reference to fig. 1 and 2, optionally, the connection line 43 includes at least a contact portion 432 covering the trace portion 211, where the length of the contact portion 432 is D in the direction in which the organic structure 63 points toward the first blocking portion 61; wherein,
10um≤D≤200um。
Specifically, the connection line 43 includes a contact portion 432 covering the trace portion 211, and the connection line 43 and the trace portion 211 are electrically connected through the contact portion 432. In the direction that the organic structure 63 points to the first blocking portion 61, the length of the contact portion 432 is not less than 10um and not more than 200um, so that good electrical connection between the connection wire 43 and the wiring portion 211 can be ensured; if the length of the contact portion 432 is smaller than 10um, the area of the contact portion 432 is smaller, which affects the electrical connection performance between the connection wire 43 and the trace portion 211; if the length of the contact portion 432 is greater than 200um, the area of the contact portion 432 is large, and the inorganic layer 51 in the encapsulation layer 50 covers the contact portion 432, so that the contact area between the connection line 43 and the inorganic layer 51 in the encapsulation layer 50 is large, and the film peeling phenomenon is likely to occur between the connection line 43 and the inorganic layer 51 in the area where the connection line 43 and the inorganic layer 51 are in contact in the non-display area NA.
With continued reference to fig. 1 and 2, optionally, the connection line 43 further includes a non-contact portion 433 overlying a portion of the planarization layer 30.
With continued reference to fig. 1 and fig. 2, optionally, the first hollowed-out portion 431 is at least located at the non-contact portion 433, and the first hollowed-out portion 431 located at the non-contact portion 433 exposes the planarization layer 30, and in the first hollowed-out portion 431, the pixel defining layer 41 and the planarization layer 30 are in contact.
Specifically, the connection line 43 includes a plurality of first hollowed-out portions 431, the first hollowed-out portions 431 are located at the non-contact portions 433, the first hollowed-out portions 431 located at the non-contact portions 433 expose the planarization layer 30, the inorganic layer 51 of the encapsulation layer 50 contacts with the planarization layer 30 in the first hollowed-out portions 433 located at the non-contact portions 433, and the film adhesion force between the inorganic layer 51 and the planarization layer 30 is far greater than that between the connection line 43 and the inorganic layer 51, so that the situation that the film layer is easily peeled off between the connection line 43 and the inorganic layer 51 is further improved, the encapsulation effect of the display panel is improved, and the service life of the display panel is prolonged. In the first hollowed-out portion 431 located in the non-contact portion 433, the pixel defining layer 41 and the planarization layer 30 are in contact, and the film adhesion force between the inorganic layer 51 and the pixel defining layer 41 and the film adhesion force between the pixel defining layer 41 and the planarization layer 30 are far greater than the film adhesion force between the connecting line 43 and the inorganic layer 51, so that the situation that the film layer is easily peeled off between the connecting line 43 and the inorganic layer 51 is further improved.
Fig. 4 is a schematic view showing a partial cross-sectional structure of a non-display area of a display panel according to an embodiment of the present invention, and referring to fig. 4, the display panel optionally further includes a first protective layer 71 located in the non-display area NA, where the first protective layer 71 and the planarization layer 30 are made of the same material;
the first hollow portion 431 is located at the contact portion 432, the first hollow portion 431 located at the contact portion 432 exposes the wiring portion 211, the first protection layer 71 is located in the first hollow portion 431 of the contact portion 432, and the pixel defining layer 41 and one side of the first protection layer 71 away from the substrate 10 are contacted.
Specifically, the first hollow portion 431 is located at the contact portion 432, which may be that the first hollow portion 431 is located only at the contact portion 432, or that the first hollow portion 431 is located at the contact portion 432 in addition to the non-contact portion 433, which is not limited to a specific position of the first hollow portion 431 at the connection line 43 in this embodiment.
With continued reference to fig. 4, the first hollowed-out portion 431 located at the contact portion 432 exposes the wiring portion 211, and by disposing the first protective layer 71 in the first hollowed-out portion 431 located at the contact portion 432, the pixel defining layer 41 and the side of the first protective layer 71 away from the substrate base 10 are contacted, and the materials of the first protective layer 71 and the planarization layer 30 are the same, since the film adhesion between the inorganic layer 51 and the pixel defining layer 41, the film adhesion between the pixel defining layer 41 and the first protective layer 71, and the film adhesion between the first protective layer 71 and the wiring portion 211 are better, the situation that the film peeling easily occurs between the contact portion 432 and the inorganic layer 51 is effectively improved, and the situation that the film peeling easily occurs between the connection line 43 and the inorganic layer 51 is further improved.
Fig. 5 is a schematic view of a partial cross-sectional structure of a non-display area of a display panel according to another embodiment of the invention, referring to fig. 5, optionally, the contact portion 432 includes a plurality of banks 434 extending along a direction perpendicular to the substrate 10, the banks 434 are located at edges of the first hollowed-out portions 431 in the contact portion 432, the banks 434 surround the first hollowed-out portions 431, and the first protection layer 71 is located in the banks 434.
Specifically, with continued reference to fig. 5, since the length of the connecting line 43 in the direction perpendicular to the substrate 10 is smaller, the first protective layer 71 is not easily disposed in the first hollowed-out portion 431 located in the contact portion 432, by disposing the bank 434, the bank 434 is located at the edge of the first hollowed-out portion 431 of the contact portion 432, and the bank 434 surrounds the first hollowed-out portion 431, the first protective layer 71 may be disposed in the bank 434, thereby facilitating the disposition of the first protective layer 71 in the first hollowed-out portion 431 located in the contact portion 432.
Fig. 6 is a schematic view showing a partial cross-sectional structure of a non-display area of a display panel according to another embodiment of the present invention, and referring to fig. 6, the display panel optionally further includes a first passivation layer 261 located at the non-display area NA;
The first hollowed-out portion 431 exposes the wiring portion 211, the first passivation layer 261 is located in the first hollowed-out portion 431, and the pixel defining layer 41 is in contact with the first passivation layer 261.
With continued reference to fig. 6, the connection line 43 includes a contact portion 432 covered on the trace portion 211, where the first hollow portion 431 of the contact portion 432 is located at the contact portion 432, so that the first hollow portion 431 of the contact portion 432 exposes the trace portion 211, the first passivation layer 261 is located in the first hollow portion 431, the pixel defining layer 41 is in contact with the first passivation layer 261, and due to the film adhesion between the inorganic layer 51 and the pixel defining layer 41, the film adhesion between the pixel defining layer 41 and the first passivation layer 261, and the film adhesion between the first passivation layer 261 and the trace portion 211 are better, and further the film peeling between the connection line 43 and the inorganic layer 51 is easy to occur, so that external water and oxygen are effectively blocked, the packaging effect of a non-display area in the display panel is effectively improved, and the service life of the display panel is prolonged.
Fig. 7 is a schematic view of a partial cross-sectional structure of a non-display area of a display panel according to another embodiment of the invention, referring to fig. 7, optionally, the trace portion 211 includes a plurality of second hollowed portions 212, the second hollowed portions 212 penetrate the trace portion 211 along a direction perpendicular to the substrate 10, and a vertical projection of the second hollowed portions 212 on the substrate 10 is located in a vertical projection of the first hollowed portions 431 on the substrate 10.
Specifically, with continued reference to fig. 7, the connection line 43 includes a contact portion 432 covering the trace portion 211, the first hollow portion 431 is located at the contact portion 432, the second hollow portion 212 is located at the trace portion 211, and a vertical projection of the second hollow portion 212 on the substrate 10 is located in a vertical projection of the first hollow portion 431 on the substrate 10, and the interlayer insulating layer 25 in the array layer 20 is exposed through the first hollow portion 431 and the second hollow portion 212 corresponding thereto. It should be noted that, in other embodiments of the present invention, other inorganic film layers in the array layer 20 are exposed through the first hollowed-out portion 431 and the second hollowed-out portion 212 corresponding thereto, which is not limited in the present invention.
With continued reference to fig. 7, the display panel may further include a second protective layer 72 located in the non-display area NA, the second protective layer 72 and the planarization layer 30 are made of the same material, the second protective layer 72 is located in the first hollowed-out portion 431 and the second hollowed-out portion 212, and the pixel defining layer 41 is in contact with the second protective layer 72.
Specifically, the first hollow portion 431 of the contact portion 432 and the second hollow portion 212 corresponding to the first hollow portion 431 expose the interlayer insulating layer 25 in the array layer 20, the second protective layer 72 is disposed in the first hollow portion 431 and the second hollow portion 212 of the contact portion 432, the pixel defining layer 41 and the second protective layer 72 are contacted with one side of the substrate 10 far away from the substrate, and the materials of the second protective layer 72 and the planarization layer 30 are the same, and the film adhesion between the inorganic layer 51 and the pixel defining layer 41, the film adhesion between the pixel defining layer 41 and the second protective layer 72 and the film adhesion between the second protective layer 72 and the interlayer insulating layer 25 are better, so that the situation that the film layer is easily peeled between the connecting line 43 and the inorganic layer 51 is effectively improved, the external water oxygen is effectively blocked, the packaging effect of the non-display area in the display panel is effectively improved, and the service life of the display panel is prolonged.
Fig. 8 is a schematic view showing a partial cross-sectional structure of a non-display area of a display panel according to another embodiment of the present invention, and referring to fig. 8, the display panel optionally further includes a second passivation layer 262 located in the non-display area NA;
The second passivation layer 262 is located in the first hollow portion 431 and the second hollow portion 212 of the contact portion 432, and the vertical projection of the second passivation layer 262 and the first hollow portion 431 of the contact portion 432 on the substrate 10 is the same, and the pixel defining layer 41 and the second passivation layer 262 are in contact.
Specifically, with continued reference to fig. 8, the first hollow portion 431 in the contact portion 432 and the second hollow portion 212 corresponding thereto expose the interlayer insulating layer 25 in the array layer 20, and the second passivation layer 262 is disposed in the first hollow portion 431 and the second hollow portion 212 in the contact portion 432, and the vertical projection of the second passivation layer 262 and the first hollow portion 431 in the contact portion 432 on the substrate 10 is the same, that is, the second passivation layer 262 covers the first hollow portion 431 and the second hollow portion 212 corresponding thereto in the contact portion 432, the second passivation layer 262 is in contact with the interlayer insulating layer 25, and the second passivation layer 262 is also in contact with the pixel defining layer 41, because the film adhesion between the inorganic layer 51 and the pixel defining layer 41, the film adhesion between the pixel defining layer 41 and the second passivation layer 262 and the interlayer insulating layer 25 are better, so that the situation that the film layer is easily peeled off between the connecting line 43 and the inorganic layer 51 is effectively improved; and the inorganic layer 51, the second passivation layer 262 and the interlayer insulating layer 25 are contacted, so that external water and oxygen are further blocked, the packaging effect of a non-display area in the display panel is effectively improved, and the service life of the display panel is prolonged.
Fig. 9 is a schematic view showing a partial cross-sectional structure of a non-display area of a display panel according to another embodiment of the present invention, and referring to fig. 9, the display panel optionally further includes a third passivation layer 263 located in the non-display area NA;
the third passivation layer 263 is located at a side of the trace portion 211 away from the substrate 10, and the third passivation layer 263 is located at a side of the connection line 43 away from the display area AA.
Specifically, with continued reference to fig. 9, a third passivation layer 263 is disposed on a side of the trace portion 211 away from the substrate 10, and the third passivation layer 263 protects a portion of the trace portion 211 that is not covered with the connection line 43.
In some alternative embodiments, please refer to fig. 10, fig. 10 is a schematic structural diagram of a display device 1000 according to an embodiment of the present invention, where the display device 1000 according to the present embodiment includes an organic light emitting display panel 100 according to the above embodiment of the present invention. The embodiment of fig. 10 is only an example of a mobile phone, and the display device 1000 is described, but it is understood that the display device 1000 provided in the embodiment of the present invention may be other display devices 1000 with display functions, such as a computer, a television, and a vehicle-mounted display device, which is not particularly limited in the present invention. The display device 1000 provided in the embodiment of the present invention has the beneficial effects of the organic light emitting display panel 100 provided in the embodiment of the present invention, and the detailed description of the organic light emitting display panel 100 in the above embodiments may be referred to in detail, and the detailed description of the embodiment is omitted herein.
As can be seen from the above embodiments, the display panel and the display device provided by the present invention at least achieve the following beneficial effects:
The connecting wire comprises a plurality of first hollowed-out parts, so that the contact area between the connecting wire and the inorganic layer is effectively reduced, the inorganic layer is contacted with other film layers through the first hollowed-out parts, the situation that the film layers are easy to peel between the connecting wire and the inorganic layer is effectively improved, the packaging effect of the display panel is improved, and the service life of the display panel is prolonged; the pixel definition layer at least covers the edge of the hollowed-out part, so that the condition that the connecting line is crushed caused by downward pressing of the mask plate is effectively reduced, and meanwhile, the film attaching force between the pixel definition layer and the connecting line and the film attaching force between the pixel definition layer and the inorganic layer are larger than the film attaching force between the connecting line and the inorganic layer, the condition that the connecting line and the inorganic layer are easy to peel off is further improved, and the packaging effect of the display panel is improved.
While certain specific embodiments of the invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. A display panel comprising a display area and a non-display area, comprising:
a substrate base;
The wiring part is positioned in the non-display area;
the connecting line is positioned in the non-display area;
The packaging layer comprises at least one inorganic layer, at least one inorganic layer is positioned on one side of the packaging layer close to the substrate base plate, and at least one inorganic layer covers the connecting wires;
the connecting wire is electrically connected with the wiring part and comprises a plurality of first hollowed-out parts; wherein,
The connecting wire at least comprises a contact part covered on the wiring part, the contact part comprises a plurality of dykes, and the dykes are positioned at the edge of the first hollowed-out part;
The display panel further comprises a first protection layer positioned in the non-display area, and the first protection layer is positioned in the first hollowed-out part of the contact part;
The display panel further comprises a pixel definition layer and a planarization layer, wherein the pixel definition layer is positioned on one side of the substrate, and the pixel definition layer is positioned on one side of the planarization layer away from the substrate; the pixel definition layer at least covers the edge of the first hollowed-out part, and the pixel definition layer is contacted with one side of the first protection layer far away from the substrate base plate;
The first protective layer is the same material as the planarization layer.
2. The display panel of claim 1, wherein the display panel comprises,
The dyke surrounds the first hollowed-out part, and the first protective layer is positioned in the dyke.
3. The display panel of claim 1, wherein the display panel comprises,
The display panel comprises a light emitting device, the light emitting device comprises an anode and a cathode, and the connecting wire and the anode are arranged on the same layer.
4. The display panel of claim 1, wherein the display panel comprises,
The display panel comprises a light emitting device, the light emitting device comprises a cathode and an anode which are oppositely arranged, the cathode extends to the non-display area, the connecting wire is electrically connected with the cathode, and the wiring part transmits an electric signal to the cathode through the connecting wire.
5. The display panel of claim 1, wherein the display panel comprises,
The display panel comprises an array layer, the array layer is positioned on one side of the substrate base plate, the array layer comprises a source drain electrode metal layer, and the wiring part and the source drain electrode metal layer are arranged on the same layer.
6. The display panel of claim 1, wherein the display panel comprises,
The dykes overlap the wiring portions in a direction perpendicular to a plane of the substrate.
7. The display panel of claim 1, wherein the display panel comprises,
The dykes and the dykes extend along a first direction, and the first direction intersects with a plane where the substrate base plate is located.
8. The display panel of claim 1, wherein the display panel comprises,
The display panel further comprises a dam positioned in the non-display area, and the dam covers the edge of the wiring part far away from the display area;
The display panel further comprises a first blocking part and a second blocking part which are positioned in the non-display area, the first blocking part is positioned between the second blocking part and the display area, the second blocking part is positioned on one side of the dam away from the substrate, which is away from the display area, and one end of the connecting line away from the display area is positioned between the second blocking part and the dam.
9. The display panel of claim 1, wherein the display panel comprises,
The wiring part comprises a plurality of second hollowed parts, the second hollowed parts penetrate through the wiring part along the direction perpendicular to the substrate, and the second hollowed parts comprise second protection layers.
10. A display device comprising a display panel according to any one of claims 1-9.
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| CN202011178543.4A CN112164715B (en) | 2018-11-28 | 2018-11-28 | Display panel and display device |
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Also Published As
| Publication number | Publication date |
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| CN112216735B (en) | 2024-10-15 |
| CN112164715A (en) | 2021-01-01 |
| CN112216735A (en) | 2021-01-12 |
| CN109545831B (en) | 2020-11-20 |
| CN112133738B (en) | 2024-07-19 |
| CN109545831A (en) | 2019-03-29 |
| CN112133738A (en) | 2020-12-25 |
| CN112133737B (en) | 2024-07-16 |
| CN112133737A (en) | 2020-12-25 |
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