KR20190052327A - Display device - Google Patents

Abstract

This specification discloses a display device. The display device comprising: at least one pixel and its associated pixel circuit; At least two kinds of power supply wirings connected to the pixel circuits; And a dummy wiring disposed between two different types of power supply wirings among the power supply wirings.

Description

Display device {DISPLAY DEVICE}

This specification relates to a display device.

The image display device that realizes various information on the screen is a core technology of the information communication age and it is becoming thinner, lighter, more portable and higher performance. Accordingly, an organic light emitting display device for displaying an image by controlling the amount of light emitted from the organic light emitting device has attracted attention.

The organic light emitting device is advantageous in that it can be made thin as a self-luminous device using a thin light emitting layer between electrodes. A general organic light emitting display has a structure in which a pixel driving circuit and an organic light emitting element are formed on a substrate, and light emitted from the organic light emitting element passes through a substrate or a barrier layer to display an image.

Various display devices including an organic light emitting display device can prevent penetration and / or propagation of moisture in various ways because the performance such as long-term reliability may be deteriorated when moisture permeation occurs. In particular, various structures for preventing water penetration along the wiring of the outer part are studied / applied.

It is an object of the present invention to propose a structure for preventing moisture permeation through a wiring portion of a display device. The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

A display device is provided according to an embodiment of the present disclosure. The display device comprising: at least one pixel and its associated pixel circuit; At least two kinds of power supply wirings connected to the pixel circuits; And dummy wiring arranged between two different types of power supply lines among the power supply lines.

The dummy wiring can be provided so as to suppress the electric field due to the electric field generated between the two power supply wirings having the largest potential difference. For example, the dummy wiring may be disposed between two power supply wirings having the largest potential difference among the power supply wirings.

The power supply wiring includes a first power supply wiring, a second power supply wiring, and a third power supply wiring. The first power supply wiring, the second power supply wiring, and the third power supply wiring are respectively connected to a high level power supply (VDD) It can be a low-level power (VSS) wiring. Here, the dummy wiring may be disposed between the first power supply wiring and the second power supply wiring.

The dummy wiring may be disposed in an area where a distance between the first power supply wiring and the second power supply wiring is a predetermined distance or less.

The dummy wiring may be the same material as the source electrode or the drain electrode of the thin film transistor (TFT) included in the pixel circuit. At this time, the dummy wiring may have a multi-layered structure in which titanium (Ti), aluminum (Al), and titanium (Ti) are stacked in this order.

The dummy wiring may be the same material as the anode electrode or the cathode electrode of the organic light emitting diode included in the pixel circuit.

The dummy wiring may be in a floating state because no power is supplied.

The details of other embodiments are included in the detailed description and drawings.

Embodiments of the present invention can provide a display device with improved reliability degradation due to corrosion or electromigration of wiring. In addition, the embodiments of the present invention can provide a structure for preventing moisture permeation through the wiring portion outside the display device. The effects according to the embodiments of the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

Figure 1 illustrates an exemplary display device that may be included in an electronic device.
2A and 2B are cross-sectional views schematically showing a display region and a non-display region of a display device according to an embodiment of the present invention.
3 is an example for explaining the wiring arrangement of the display device.
4 is a view showing a display device according to an embodiment of the present invention.

Brief Description of the Drawings The advantages and features of the present disclosure, and how to accomplish them, will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. Like reference numerals refer to like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Where the terms "comprises", "having", "done", and the like are used in this specification, other portions may be added unless "only" is used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise. In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions. An element or layer is referred to as being another element or layer " on ", including both intervening layers or other elements directly on or in between. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, Quot; intervening " or that each component may be " connected, " " coupled, " or " connected " through other components.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

The sizes and thicknesses of the individual components shown in the figures are shown for convenience of explanation and the present invention is not necessarily limited to the size and thickness of the components shown. Various embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

Figure 1 illustrates an exemplary display device that may be included in an electronic device.

Referring to FIG. 1, the display device 100 includes at least one active area, and an array of pixels is formed in the display area. One or more inactive areas may be disposed around the display area. That is, the non-display area may be adjacent to one or more sides of the display area. In Fig. 1, the non-display area surrounds a display area of a rectangular shape. However, the shape of the display region and the shape / arrangement of the non-display region adjacent to the display region are not limited to the example shown in Fig. The display area and the non-display area may be in a form suitable for the design of the electronic device on which the display device 100 is mounted. Illustrative forms of the display area are pentagonal, hexagonal, circular, oval, and the like.

Each pixel in the display area can be associated with a pixel circuit. The pixel circuit may include at least one switching transistor and at least one driving transistor on a backplane. Each pixel circuit may be electrically connected to a gate line and a data line to communicate with one or more driving circuits such as a gate driver and a data driver located in the non-display area.

The driving circuit may be implemented with a thin film transistor (TFT) in the non-display region, as shown in FIG. This driving circuit may be referred to as a gate-in-panel (GIP). In addition, some components, such as a data driver IC, are mounted on a separate printed circuit board, and circuit films such as flexible printed circuit boards (FPCB), chip-on-film (COF), tape- (Pad / bump, pin, etc.) disposed in the non-display area. The non-display area may be bent together with the connection interface so that the printed circuit (COF, PCB, etc.) may be positioned behind the display device 100.

The display device 100 may include various additional elements for generating various signals or driving pixels in the display area. The additional element for driving the pixel may include an inverter circuit, a multiplexer, an electrostatic discharge circuit, and the like. The display device 100 may also include additional elements associated with functions other than pixel driving. For example, the display device 100 may include additional elements that provide a touch sensing function, a user authentication function (e.g., fingerprint recognition), a multi-level pressure sensing function, a tactile feedback function, and the like. The above-mentioned additional elements may be located in the non-display area and / or an external circuit connected to the connection interface.

One or more edges of the display device 100 may be bent away from the central portion 101. [ Since at least one portion of the display device 100 can be bent, the display device 100 can be defined as a substantially flat portion and a bended portion. That is, a part of the display device 100 (for example, the wiring part between the pad PAD and the display area) is bent at a predetermined angle, and this part can be referred to as a bent part. The bending portion includes a bended section that is actually bent at a predetermined bending radius. Although not always, the central portion of the display device 100 may be substantially flat and the corner portions may be curved portions.

When the non-display area is bent, the non-display area is not visible on the front surface of the display device, or is at least visible. A part of the non-display area seen from the front side of the display device may be covered with a bezel. The bezel may be formed of a unique structure, or a housing or other suitable element. A portion of the non-display area seen on the front side of the display device may be hidden under an opaque mask layer such as black ink (e.g., a polymer filled with carbon black). This opaque mask layer may be provided on the various layers (touch sensor layer, polarizing layer, cover layer, etc.) included in the display device 100.

The bending portion 102 can bend outward from the center portion with a bending angle? And a bending radius R with respect to the bending axis. The size of each bent portion need not be the same. Further, the bending angle? Around the bending axis and the radius of curvature R from the bending axis may be different for each bent portion.

2A and 2B are cross-sectional views schematically showing a display region and a non-display region of a display device according to an embodiment of the present invention.

The illustrated display area and non-display area can be applied to at least a part of the display area A / A and the non-display area A / A-2 described in Fig. Hereinafter, the display device will be described by taking an organic light emitting display as an example.

In the organic light emitting display, thin film transistors 112, 114, 116 and 118, organic light emitting devices 122, 124 and 126 and various functional layers are disposed on the base layer 111 in the display region . On the other hand, various driving circuits, electrodes, wires, functional structures, and the like may be positioned on the base layer 111 in the non-display area.

The base layer 111 supports various components of the OLED display 100. The base layer 111 may be formed of a transparent insulating material, for example, an insulating material such as glass, plastic, or the like. The substrate (array substrate) may also be referred to as a concept including an element and a functional layer formed thereon, for example, a switching TFT, a driving TFT, an organic light emitting element, a protective film and the like.

A buffer layer may be located on the base layer 111. The buffer layer is a functional layer for protecting a thin film transistor (TFT) from an impurity such as an alkali ion or the like flowing out from the base layer 111 or the lower layers. The buffer layer may be formed of silicon oxide (SiOx), silicon nitride (SiNx), or a multilayer thereof.

A thin film transistor is placed on the base layer 111 or the buffer layer. The thin film transistor may be a semiconductor layer 112, a gate insulating film 113, a gate electrode 114, an interlayer insulating film 115, and source and drain electrodes 116 and 118 sequentially arranged. The semiconductor layer 112 is located on the base layer 111 or the buffer layer. The semiconductor layer 112 may be made of polysilicon (p-Si), in which case a predetermined region may be doped with impurities. In addition, the semiconductor layer 112 may be made of amorphous silicon (a-Si), or may be made of various organic semiconductor materials such as pentacene. Further, the semiconductor layer 112 may be made of oxide. The gate insulating film 113 may be formed of an insulating inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx), or may be formed of an insulating organic material or the like. The gate electrode 114 may be formed of various conductive materials such as Mg, Al, Ni, Cr, Mo, W, Au, Or the like.

The interlayer insulating layer 115 may be formed of an insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx), or may be formed of an insulating organic material or the like. A contact hole through which the source and drain regions are exposed may be formed by selective removal of the interlayer insulating film 115 and the gate insulating film 113.

The source and drain electrodes 116 and 118 are formed on the interlayer insulating film 115 in the form of a single layer or a multi-layer as an electrode material.

The planarization layer 117 may be located on the thin film transistor. The planarization layer 117 protects the thin film transistor and flattenes the top of the thin film transistor. The planarization layer 117 may be formed in various shapes and may be formed of an organic insulation film such as BCB (benzocyclobutene) or acrylic, or an inorganic insulation film such as a silicon nitride film (SiNx) or a silicon oxide film (SiOx) It may be formed as a single layer, or it may be composed of a double layer or a multi layer.

The organic light emitting device may have a structure in which the first electrode 122, the organic light emitting layer 124, and the second electrode 126 are sequentially disposed. That is, the organic light emitting device includes a first electrode 122 formed on the planarization layer 117, an organic light emitting layer 124 disposed on the first electrode 122, and a second electrode (not shown) disposed on the organic light emitting layer 124 126).

The first electrode 122 is electrically connected to the drain electrode 118 of the driving thin film transistor through the contact hole. When the organic light emitting display 100 is a top emission type, the first electrode 122 may be made of an opaque conductive material having high reflectance. For example, the first electrode 122 may be formed of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr) .

The bank 120 is formed in the remaining region except for the light emitting region. Accordingly, the bank 120 has a bank hole for exposing the first electrode 122 corresponding to the light emitting region. The bank 120 may be made of an inorganic insulating material such as a silicon nitride film (SiNx), a silicon oxide film (SiOx), or an organic insulating material such as BCB, acrylic resin or imide resin.

The organic light emitting layer 124 is positioned on the first electrode 122 exposed by the bank 120. [ The organic light emitting layer 124 may include a light emitting layer, an electron injection layer, an electron transport layer, a hole transport layer, a hole injection layer, and the like. The organic light emitting layer may have a single light emitting layer structure that emits a single light or may include a plurality of light emitting layers to emit white light.

And the second electrode 126 is located on the organic light emitting layer 124. When the OLED display 100 is a top emission type, the second electrode 126 may be a transparent conductive layer such as indium tin oxide (ITO) or indium zinc oxide (IZO) Thereby emitting the light generated in the organic light emitting layer 124 to the upper portion of the second electrode 126.

The protective layer 128 and the encapsulation layer 130 are located on the second electrode 126. The protective layer 128 and the sealing layer 130 prevent oxygen and moisture penetration from the outside in order to prevent oxidation of the light emitting material and the electrode material. When the organic light emitting device is exposed to moisture or oxygen, a pixel shrinkage phenomenon in which the light emitting region is reduced or a dark spot in the light emitting region may occur. The passivation layer and / or the encapsulation layer may be composed of an inorganic film made of glass, metal, aluminum oxide (AlOx), or silicon (Si) material, or alternatively, It may be a laminated structure. The inorganic film serves to block penetration of moisture or oxygen, and the organic film serves to flatten the surface of the inorganic film. The reason why the encapsulation layer is formed of a plurality of thin film layers is to make the movement path of water or oxygen longer and more complicated than in the case of a single layer so as to make penetration of moisture / oxygen into the organic light emitting element difficult.

The OLED display 100 may further include a touch layer, a polarizing layer 160, a cover layer 170, and the like on the sealing layer 130. The touch panel / touch sensing electrode may be provided on the upper surface of the organic light emitting element (e.g., the upper surface of the sealing layer) for sensing the touch input of the user. If desired, a separate layer with touch sensing electrodes and / or other components associated with touch input sensing may be provided within the display device 100. The touch sensing electrode (e.g., the touch driving / sensing electrode) may be formed of a conductive material such as indium tin oxide, a carbon based material such as graphene, a carbon nanotube, a conductive polymer, or a hybrid material made of a mixture of various conductive / non- May be formed of a transparent conductive material. In addition, a metal mesh such as an aluminum mesh or a silver mesh may be used as the touch sensing electrode.

The display device 100 may include a polarization layer 160 to control display characteristics (e.g., external light reflection, color accuracy, brightness, etc.). The cover layer 170 may be used to protect the display device 100, and may be a cover glass, for example.

At least one support layer 180 may be provided at the bottom of the base layer 111 to increase the strength and / or rigidity at a particular portion of the display device 100. The support layer 180 is attached to the opposite surface (second surface) of the surface (first surface) on which the organic light emitting element is present on both surfaces of the base layer 111. The support layer 180 may be formed of a material selected from the group consisting of polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyethylene ether phthalate, polycarbonate, polyarylate, For example, a thin plastic film composed of a combination of polyether imide, polyether sulfonate, polyimide polyacrylate, and other suitable polymers. Other suitable materials that can be used to form the support layer 180 include thin films, dielectric foil, metal foil, polymer films including polymeric materials in combination with nanoparticles or microparticles, have.

In order to improve the bending and reliability of the display device 100 more easily, the configuration of the components in the bent portion 102 may be different from that in the flat central portion 101. Some of the components present in the central portion 101 are not disposed in the bending portion 102, or are provided in different thicknesses. For example, the support layer 180, the polarizing layer 160, the touch sensor layer, the color filter layer, and / or other components that interfere with the bending of the display device 100 may not be present in the curved portion 102 have. In addition, the organic light emitting devices may be provided in a different form from the flat portion 101 in consideration of the viewing angle characteristics of the curved portion 102.

The base layer 111 and the organic / inorganic functional layers 113, 115, 117 128, 130, and the like may be present although no pixel circuits are disposed in the non-display area I / A. In addition, the materials used in the constitution of the display area A / A may be arranged in the non-display area I / A for other purposes. For example, as shown in FIG. 2B, a metal 114 'used as a gate electrode of a display region TFT or a metal 118' used as a source / drain electrode may be used as a wiring, a non-display region I / As shown in FIG. Furthermore, the metal 122 'used as one electrode (for example, an anode) of the organic light emitting diode may be disposed in the non-display area I / A for the wiring and the electrode.

3 is an example for explaining the wiring arrangement of the display device.

3 is an enlarged view of a portion B in Fig. Only the pad region P of the display device, the wiring layers 118 'and 114' and the planarization layer 117 are shown simply in FIG. 3 and the planarization layer 117 and the wiring layer 118 ' , 114 'are omitted. The sealing layer 130 may cover the whole area except the pad area P, or may cover only a part of the area.

The wiring layer 118 'may be formed of the same metal (first metal layer) on the same layer as the source or drain electrode of the TFT in the display area. Although FIG. 3 shows the planarization layer 117 on the wiring layer 118 ', this is only an example, and other insulation layers may be placed over the wiring layer 118'. The wiring layer 118 'and the planarization layer 117 have the positional relationship shown in Fig. 2B.

In the wiring section design of Fig. 3, a planarizing layer 117 for eliminating steps due to the presence or absence of wiring is applied to some areas. That is, in some regions, the planarization layer 117 covers the upper portion of the wiring layer 118 ', so that the step corresponding to the presence or absence of the wiring layer disappears. Therefore, a crack due to a step difference can be prevented when the inorganic material layer such as an encapsulating layer is coated on the structure. On the other hand, there is no planarization layer 117 in a specific region, because water may propagate along the organic layer constituting the planarization layer 117, so that the planarization layer 117 is cut off to prevent moisture transmission. At this time, the second metal layer 114 'has a jumping structure with the first metal layer 118' in a specific region where there is no planarization layer, and functions as one wiring.

The second metal layer 114 'is provided in a layer different from the first metal layer 118'. The second metal layer 114 'is connected to the first metal layer 118' through a contact hole or directly connected thereto. Therefore, the driving voltage. An electrical signal or the like is applied to the connection interface (pad or the like) of the pad region P and is transmitted along the first metal layer 118 'and is transmitted along the second metal layer 114' in a specific region.

However, some weaknesses have been found in the wiring structure described above. One of them is an electrolytic corrosion phenomenon found between adjacent power supply lines to which a voltage having a large potential difference is applied. For example, a low-level driving power source (V _SS) / reset power source (V _INI) wiring (-) voltage (e.g. about -4.5V) to, high-level driving power source (V _DD), the (+) voltage (e.g., about + 4.5V), an electric field due to a large electric potential difference may be induced in the region (Y) where the V _DD to V _INI wirings are arranged close to each other. In addition, when such an election occurs, the breathing occurs through that point. The inventors of the present invention have recognized such a problem and have invented a structure for preventing electrical conduction of wiring metal and thereby preventing moisture permeation.

4 is a view showing a display device according to an embodiment of the present invention.

Fig. 4 is an enlarged view of a portion B in Fig. 1, showing an embodiment in which a wiring portion strengthening structure is applied. Only the pad region P of the display device, the wirings 114 'and 118', the organic layer 117 and the dummy wirings 140 are simply shown in FIG. 4 and the upper functional layer : Encapsulation layer) was omitted.

Although FIG. 4 shows the organic layer 117 on the wiring 118 'and the dummy wiring 140, this is merely an example, and other insulating layers may be used. The wiring 118 'and the organic material layer 117 have the positional relationship shown in FIG. 2B. Here, the wiring is a path through which power or various signals are transmitted to pixels in a display area, and is made of a conductive material such as a metal. Hereinafter, embodiments in which the wirings 118 and 114 " are power supply wirings are described. But the spirit of the present invention is not limited thereto. When the wirings 118 'and 114' are power wiring, the wiring shown in FIG. 4A may be a low-level power source V _SS , a reset power source V _INI or V _REF , and a high-level power source V _DD from the left . Meanwhile, the organic material layer 117 may be a planarization layer.

The display device of FIG. 4 includes a pixel circuit associated with one or more pixels; At least two kinds of power supply lines (118'-1, 118'-2, 118'-3) connected to the pixel circuits; And dummy wirings 140 disposed between two different types of power supply wirings among the power supply wirings. The pixel and pixel circuits are arranged in a display area and the power supply lines 118'-1, 118'-2 and 118'-3 and the dummy lines 140 are arranged in an inactive area . The non-display area may be disposed around the display area. That is, the non-display area may be adjacent to one or more sides of the display area.

The non-display region may include a first portion covered with the organic material layer 117 and a second portion not covered with the organic material layer. In the first portion, the organic layer 117 may cover the entire upper surface of the wirings 118'-1, 118'-2, 118'-3, or may cover only the edge portion of the wirings.

The display device may further include an encapsulation layer covering the upper portion of the display area and the non-display area to prevent penetration of moisture, oxygen, and the like. Thus, an encapsulation layer may be disposed on the power supply lines 118'-1, 118'-2, 118'-3 and the planarization layer 117. The encapsulant layer 130 may not completely cover the outer edge of the display device in one embodiment, in which case the encapsulant layer may cover only below a particular line E. At this time, the portion above the specific line E (the portion where the encapsulation layer is not covered) may be a bent portion.

The wirings 118'-1, 118'-2 and 118'-3 extend from the connection interface (pad, pin, etc.) of the pad region P in the display region direction. The power supply lines 118'-1, 118'-2, 118'-3 may be a metal formed on a single layer, and the two layers 118 'and 114' It may be. At this time, one of the metals 114 'may be the same material (gate metal) as the gate electrode of the thin film transistor (TFT) included in the pixel circuit. The other one of the metals 118 'may be the same material (source / drain metal) as the source electrode or the drain electrode of the thin film transistor (TFT) included in the pixel circuit. The other metal layer 118 'may be a metal layer having a multi-layer structure (so-called Ti / Al / Ti) stacked in the order of titanium (Ti), aluminum (Al) and titanium (Ti).

The power supply line may include a first power supply line 118'-1, a second power supply line 118'-2, and a third power supply line 118'-3. At this time, the first power supply wiring (118'-1) and the second power supply wiring (118'-2) and the third power supply wiring (118'-3) are each high-level power supply (V _DD) line, the reset power source (V _INI Or V _REF ) wiring and low-level power (V _SS ) wiring. The dummy wiring 140 may be disposed between the first power source wiring 118'-1 and the second power source wiring 118'-2.

The dummy wiring 140 is provided to prevent the power wiring 118 'from being damaged (electrified, etched, etc.). Specifically, the dummy wiring 140 is provided so as to suppress the electric field due to the electric field generated between the power supply wirings having a large potential difference. For example, the dummy wiring 140 includes two power supply lines having the largest potential difference among the power supply lines 118'-1, 118'-2 and 118'-3 (for example, 118'-1 and 118'- 2). The dummy wiring 140 arranged in this way blocks the electric field between the two power supply lines 118'-1 and 118'-2, and therefore, the electric field due to the electric field can be suppressed.

The dummy wiring 140 may be arranged only in an area where the distance between two wirings having a large potential difference (for example, the first power supply wiring 118'-1 and the second power supply wiring 118'-2) have. The strength of the electric field is inversely proportional to the distance, so that even if the difference in potential is large, the potential for electric field induction is low if the two wires are sufficiently spaced apart. Therefore, the arrangement region of the dummy wirings 140 can be determined in consideration of the potential difference and the distance between wirings. Although the dummy wiring 140 is illustrated as being connected to the metal 114 'of another layer in FIG. 4 and extended downwardly, the dummy wiring 140 is not connected to the other layer metal 114' . (That is, there may be no other layer metal connected to the dummy wiring). Furthermore, the dummy wiring 140 may be formed in the upper region of FIG. 4 (above the boundary where the organic layer 117 is cut off) (The lower side of the boundary where the organic material layer 117 is cut off).

The dummy wiring 140 may be disposed in the same layer or another layer as the power supply lines 118'-1, 118'-2, 118'-3. In the case where the power supply lines 118'-1, 118'-2 and 118'-3 are source / drain metals, as an example, the dummy wirings 140 may be thin film transistors The source electrode or the drain electrode. At this time, the dummy wiring 140 may have a multi-layer structure in which titanium (Ti), aluminum (Al), and titanium (Ti) are stacked in this order. Meanwhile, as another example, the dummy wiring 140 may be made of the same material as the anode electrode or the cathode electrode included in the pixel circuit. At this time, the dummy wiring 140 may be formed in the process of patterning the anode electrode or the cathode electrode.

The dummy wiring 140 may be a floating wiring in which power is not supplied. As another example, the dummy wiring 140 may be a wiring to which a specific voltage (for example, 0 V) is supplied.

While the embodiments of the present invention have been described in detail with reference to the accompanying drawings, it is to be understood that the present invention is not limited to these embodiments, and various modifications may be made without departing from the scope of the present invention. Therefore, the embodiments disclosed herein are for the purpose of describing rather than limiting the technical spirit of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other, partially or wholly, and may be technically variously interlocked and driven by one of ordinary skill in the art and that each embodiment may be implemented independently of one another, . The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

Claims (10)

At least one pixel and its associated pixel circuit;
At least two kinds of power supply wirings connected to the pixel circuits; And
And a dummy wiring disposed between two different types of power supply wirings among the power supply wirings. The method according to claim 1,
Wherein the dummy wiring is disposed between two power supply wirings having the largest potential difference among the power supply wirings. The method according to claim 1,
Wherein the dummy wiring is provided so as to suppress electromigration due to an electric field generated between two power supply wirings having the largest potential difference. The method according to claim 1,
The power supply wiring includes a first power supply wiring, a second power supply wiring, and a third power supply wiring,
Wherein the first power supply wiring, the second power supply wiring, and the third power supply wiring are each a high level power supply (VDD) wiring, an initialization power supply wiring, and a low level power supply (VSS) wiring. 5. The method of claim 4,
Wherein the dummy wiring is disposed between the first power supply wiring and the second power supply wiring. 6. The method of claim 5,
Wherein the dummy wiring is disposed in an area where an interval between the first power supply wiring and the second power supply wiring is equal to or less than a predetermined distance. The method according to claim 1,
Wherein the dummy wiring is the same material as the source electrode or the drain electrode of the thin film transistor (TFT) included in the pixel circuit. 8. The method of claim 7,
Wherein the dummy wiring has a multilayer structure in which titanium (Ti), aluminum (Al), and titanium (Ti) are stacked in this order. The method according to claim 1,
Wherein the dummy wiring is the same material as the anode electrode or the cathode electrode of the organic light emitting diode included in the pixel circuit. The method according to claim 1,
Wherein the dummy wiring is in a floating state because power is not supplied.

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