CN112118338A - Electronic device - Google Patents

Abstract

The application discloses an electronic device, which belongs to the technical field of electronic products. The electronic device includes a housing, a first surface of the housing is provided with an accommodating hole, and a second surface is provided with an insertion hole that can be communicated with the accommodating hole; a packaging board is arranged inside the housing; an elastic support structure is arranged on the housing The inside of the camera module is connected to the packaging board; the camera module includes a first state and a second state. In the first state, the camera module is separated from the housing, and the packaging board is exposed to the support force of the elastic support structure. the accommodating hole; in the second state, the camera of the camera module is exposed in the accommodating hole, and the packaging board is hidden into the casing by the pressing force of the camera module. The solution of the present application does not increase the thickness of the whole machine, and is easy to assemble and disassemble, does not affect the appearance of the whole machine, and can solve the existing problem that the performance of the camera and the appearance of the whole machine cannot be balanced.

Description

Electronic equipment

technical field

The present application belongs to the technical field of electronic products, and specifically relates to an electronic device.

Background technique

In recent years, the development of smart phones has brought more and more convenience and experience to users' daily life, and has become a necessities of life. At the same time, users have more and more diverse functional requirements for smart phones. The arrival of 5G has made the Internet of Everything possible, and technologies such as autonomous driving require cameras with more powerful functions, clearer photos, and wider shooting ranges, all of which require larger and more comprehensive cameras.

Because the size of the mobile terminal is limited, there are two main ways to set the camera on the mobile terminal at present:

The first is to protrude the camera part, and the other parts of the whole machine still maintain the original thickness. The second is to accept the thickness of the camera by default and make the whole machine thicker.

In the process of realizing this application, the inventor found that there are at least the following problems in the prior art:

The first way to partially protrude the camera makes the whole machine uneven. On the one hand, it is easy to slip off when placed, which greatly increases the risk of breaking the whole machine. On the other hand, the risk of the camera position being scratched is greater; In the method, if the height of the camera is satisfied, the ultimate appearance of the whole machine will be sacrificed, and the mobile terminal will be relatively heavy and inconvenient for customers to use; and if the mobile terminal is made light and thin, the pixels of the camera cannot be satisfied, and the photo effect will be poor. does not meet the needs of users.

Therefore, the existing technology mainly has the problem of not being able to balance the performance of the camera and the appearance of the whole machine.

SUMMARY OF THE INVENTION

The purpose of the embodiments of the present application is to provide an electronic device that can solve the main problem in the prior art that the performance of the camera and the appearance of the whole machine cannot be balanced.

In order to solve the above technical problems, this application is implemented as follows:

In a first aspect, an embodiment of the present application provides an electronic device, including:

a housing, a first surface of the housing is provided with an accommodating hole, and a second surface is provided with an insertion hole that can communicate with the accommodating hole;

an encapsulation board, arranged inside the casing;

an elastic support structure, arranged inside the casing, and connected with the packaging board;

The camera module includes a first state and a second state. In the first state, the camera module is separated from the housing, and the packaging board is exposed to the outside through the support force of the elastic support structure. the receiving hole; in the second state, the camera of the camera module is exposed in the receiving hole, and the packaging board is hidden into the casing by the pressing force of the camera module.

In the embodiment of the present application, the electronic device includes a casing, a packaging board, an elastic support structure, and a camera module, wherein a first surface of the casing is provided with an accommodating hole, and a second surface is provided with a socket that can communicate with the accommodating hole A hole is provided; an encapsulation plate is arranged inside the casing; an elastic support structure is arranged inside the casing and is connected with the encapsulation plate. ; The camera module includes a first state and a second state. In the first state, the camera module is separated from the housing, and the package board is exposed to the outside through the support force of the elastic support structure. In the second state, the camera of the camera module is exposed in the accommodating hole, and the packaging board is hidden to the accommodating hole by the pressing force of the camera module. In the casing, the photographing function of the camera is realized. The solution of the present application does not need to increase the thickness of the whole machine, and is easy to assemble and disassemble, does not affect the appearance of the whole machine, and can solve the existing problem that the performance of the camera and the appearance of the whole machine cannot be balanced.

Description of drawings

FIG. 1 shows one of the schematic structural diagrams of an electronic device according to an embodiment of the present invention;

FIG. 2 shows the second schematic structural diagram of an electronic device according to an embodiment of the present invention;

FIG. 3 shows a third schematic structural diagram of an electronic device according to an embodiment of the present invention;

FIG. 4 shows a fourth schematic structural diagram of an electronic device according to an embodiment of the present invention;

FIG. 5 shows the fifth schematic diagram of the structure of the electronic device according to the embodiment of the present invention;

FIG. 6 shows a sixth schematic structural diagram of an electronic device according to an embodiment of the present invention.

FIG. 7 shows one of the schematic structural diagrams of the camera module according to the embodiment of the present invention;

FIG. 8 shows the second schematic structural diagram of the camera module according to the embodiment of the present invention;

FIG. 9 shows the third schematic structural diagram of the camera module according to the embodiment of the present invention;

Description of reference numbers:

100-shell; 101-accommodating hole; 102-insertion hole; 200-camera module; 201-camera; 202-groove; 300-package board; 400-elastic support structure; 500-mainboard; 501-shrapnel; 502- bump structure; 600- motherboard upper cover.

Detailed ways

Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be more thoroughly understood, and will fully convey the scope of the present invention to those skilled in the art.

Referring to FIG. 1 to FIG. 9 , an embodiment of the present invention provides an electronic device, including:

The housing 100, the first surface of the housing 100 is provided with an accommodating hole 101, and the second surface is provided with an insertion hole 102 that can communicate with the accommodating hole 101;

The packaging board 300 is disposed inside the casing 100;

The elastic support structure 400 is disposed inside the casing 100 and connected to the packaging board 300;

The camera module 200 includes a first state and a second state. In the first state, the camera module 200 is separated from the housing 100 , and the packaging board 300 is supported by the elastic support structure 400 The force is exposed in the accommodating hole; in the second state, the camera module 200 is moved into the interior of the housing 100 and clamped and fixed, the camera 201 of the camera module 200 is exposed in the accommodating hole, and The packaging board 300 is hidden into the casing 100 by the pressing force of the camera module 200 .

When the camera module 200 needs to be used, as shown in FIG. 1 , the direction indicated by the dotted arrow is the moving direction of the camera module 200 during installation. The second state in which the camera module 200 is moved into the interior of the casing 100 and clamped and fixed, and the camera 201 of the camera module 200 is exposed through the accommodating hole. At this time, the packaging board 300 compresses the elastic supporting structure 400 and is placed inside the casing 100 . As shown in FIG. 3 , after the camera module 200 is installed, the package board 300 and the elastic support structure 400 are shown in the inside view of the installation state after the casing 100 is hidden in the casing 100 . As shown in FIG. 4 , it shows a schematic diagram of the electronic device after the camera module 200 is installed.

After the camera module 200 is used, the camera module 200 is taken out to separate the camera module 200 from the housing 100. After the camera module 200 is separated from the housing 100, the pressing force of the camera module 200 on the packaging board 300 disappears. , under the elastic force of the elastic support structure 400 , the package board 300 is bounced up, and at least a part of the package board 300 is exposed through the accommodating hole 101 . As shown in FIG. 5 , after the camera module 200 is separated from the casing 100 , it is a schematic diagram of an interior view of the packaging board 300 and the elastic support structure 400 after the casing 100 is hidden in the electronic device. As shown in FIG. 6 , it shows a schematic diagram of the connection state between the packaging board 300 and the electronic device after the camera module 200 is separated from the housing 100 .

In the above-mentioned embodiment, the camera module 200 has a detachable structure design, which is simple and convenient to disassemble, and does not need to increase the thickness of the whole electronic device; at the same time, after the camera module 200 is taken out, by setting the packaging board 300 and the elastic support structure 400, By resetting the packaging board 300 to the accommodating hole 101 , the effect of not affecting the overall appearance of the electronic device can be achieved, and the existing problem of not being able to balance the camera performance and the overall appearance can be solved.

The elastic support structure 400 includes a spring, and the deformation direction of the spring is the same as the movement direction of the camera module. When the camera module 200 is installed, the packaging board 300 is moved into the casing 100 to hide under the action of the pressing force generated by the movement of the camera module 200; when the camera is removed, the When the pressing force disappears, at least part of the packaging board 300 is exposed through the accommodating hole 101 , so as to ensure a complete and beautiful appearance of the whole machine.

Specifically, the color of the packaging board 300 is the same as the color of the casing 100, so that a better use experience can be given to the user.

Specifically, the first surface of the casing 100 is the side facing away from the display screen.

As shown in FIG. 2, in one embodiment, the electronic device further includes a mainboard 500, wherein the mainboard 500 is provided with a first electrical connector, and the first electrical connector is connected with a first engaging structure; The camera module 200 includes a second electrical connector, and the second electrical connector is provided with a second engagement structure; wherein, the camera module 200 is in the second state, the first engagement The structure is cooperatively connected with the second engaging structure, and the first electrical connection piece and the second electrical connection piece are electrically connected.

Among them, various components on the main board 500 , such as a control chip, can control the shooting operation of the camera module 200 .

In this embodiment, when the camera module 200 is in the second state of being installed on the electronic device, the first engaging structure on the first electrical connecting member and the second engaging structure on the second electrical connecting member are cooperatively connected. , to realize the electrical connection between the camera module 200 and the electronic device and the fixed connection of the electronic device to the camera module 200 . In this way, on the one hand, it can be ensured that the camera module 200 is electrically connected to the electronic device, so that the electronic device can be used to control the camera module 200 to perform a shooting operation; on the other hand, the connection stability between the camera module 200 and the electronic device can be ensured at the same time. , to ensure the stability of the camera module 200 during use.

Specifically, as shown in FIG. 2 , the first electrical connector includes: an elastic sheet 501 , one end of the elastic sheet 501 is electrically connected to the main board 500 , and a bump is provided at one end of the elastic sheet 501 away from the main board 500 Structure 502, the bump structure 502 is formed as the first engaging structure; the second electrical connecting member is provided with a groove 202, and the groove 202 is formed as the second engaging structure.

In this embodiment, when the camera module 200 is in the second state of being installed on the electronic device, a bump structure 502 is correspondingly snapped into a groove 202, so as to realize the electrical connection between the camera module 200 and the electronic device and realize the electrical connection between the camera module 200 and the electronic device. Snap-fit.

In one embodiment, the bump structures 502 and the grooves 202 are plural, and the bump structures 502 and the grooves 202 are disposed in a one-to-one correspondence.

As shown in FIG. 7 , it is a schematic diagram of the side of the camera module 200 close to the camera 201 . As shown in FIG. 8 , it shows a schematic diagram of the side of the camera module 200 away from the camera 201 , and as shown in FIG. 9 , the output is a schematic cross-sectional view of the camera module 200 .

8 and 9 , the groove 202 is disposed at the bottom of the camera module 200 away from the camera 201, and the groove 202 is electrically connected to the substrate in the camera module 200. The The substrate is electrically connected with the camera chip.

In this way, when the grooves 202 of the bump structures 502 are correspondingly clamped, the electrical connection between the camera module 200 and the electronic device can be realized.

Specifically, the bottom of the camera module 200 is provided with the substrate with wiring, the internal wiring is connected to the gold wire point and the groove 202, and the camera chip and the substrate are connected by gold wires, and other components of the camera module 200, For example, brackets and lenses, etc., are assembled through glue bonding, and a module packaging shell is also provided outside the camera module 200 to protect various components in the camera module 200 .

As shown in FIG. 2 , in another embodiment, the above-mentioned electronic device further includes a mainboard upper cover 600 . The mainboard upper cover 600 is disposed on the side of the mainboard 500 close to the accommodating hole 101 . One end is electrically connected to the main board 500 , the end of the elastic sheet 501 away from the main board 500 is electrically connected to the main board upper cover 600 , and the main board upper cover 600 away from the elastic sheet 501 is connected to the bump structure. 502 Electrical connection.

The upper cover 600 of the mainboard is provided with a contact at a position corresponding to the back of the mounting bump structure 502 , and the contact is electrically connected to the mainboard 500 through the elastic sheet 501 .

In this embodiment, the mainboard upper cover 600 is used to isolate and protect the mainboard 500 , so as to avoid damage to the mainboard 500 during the process of disassembling the camera module 200 .

In one embodiment, the cross-sectional shape of the camera module 200 is the same as the shape of the insertion hole 102 .

Specifically, as shown in FIGS. 2 and 9 , the cross-sectional shape of the camera module 200 and the insertion hole 102 are both “T”-shaped structures, so that the camera module 200 can be prevented from coming out of the accommodating hole 101 .

Further, a silicone ring is provided around the camera module 200, and the camera module 200 is sealedly connected to the accommodating hole and the insertion hole through the silicone ring. In this way, when the camera module 200 is in the second state of being installed on the electronic device, it can play the role of sealing and waterproofing.

It can be understood that the camera module 200 can also be other integrated modules, and a combination of different modules can be set to be connected through software, which can achieve the effect of more flexible use.

The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same and similar parts between the various embodiments may be referred to each other.

Although preferred embodiments of the embodiments of the present invention have been described, additional changes and modifications to these embodiments may be made by those skilled in the art once the basic inventive concepts are known. Therefore, the appended claims are intended to be construed to include the preferred embodiment as well as all changes and modifications that fall within the scope of the embodiments of the present invention.

Finally, it should also be noted that in this document, relational terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply these entities or there is any such actual relationship or sequence between operations. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass non-exclusive inclusion such that a process, method, article or terminal device that includes a list of elements includes not only those elements, but also a non-exclusive list of elements. other elements, or also include elements inherent to such a process, method, article or terminal equipment. Without further limitation, an element defined by the phrase "comprises a..." does not preclude the presence of additional identical elements in the process, method, article, or terminal device that includes the element.

The above are the preferred embodiments of the present invention, and it should be pointed out that for those skilled in the art, several improvements and modifications can be made without departing from the principles of the present invention, and these improvements and modifications are also included in the present invention. within the scope of protection of the invention.

Claims (10)

1. an electronic device, is characterized in that, comprises: a housing, a first surface of the housing is provided with an accommodating hole, and a second surface is provided with an insertion hole that can communicate with the accommodating hole; an encapsulation board, arranged inside the casing; an elastic support structure, arranged inside the casing, and connected with the packaging board; The camera module includes a first state and a second state. In the first state, the camera module is separated from the housing, and the packaging board is exposed to the outside through the support force of the elastic support structure. the receiving hole; in the second state, the camera of the camera module is exposed in the receiving hole, and the packaging board is hidden into the casing by the pressing force of the camera module. 2 . The electronic device according to claim 1 , wherein the electronic device further comprises a main board, the main board is provided with a first electrical connector, and the first electrical connector is connected with a first engaging piece. 3 . structure; The camera module includes a second electrical connector, and the second electrical connector is provided with a second engaging structure; Wherein, when the camera module is in the second state, the first engaging structure and the second engaging structure are cooperatively connected, and there is an electrical connection between the first electrical connector and the second electrical connector. connect. 3 . The electronic device according to claim 2 , wherein the first electrical connector comprises: an elastic piece, one end of the elastic piece is electrically connected to the main board, and an end of the elastic piece away from the main board is provided with a a bump structure, the bump structure is formed as the first engaging structure; The second electrical connector is provided with a groove, and the groove is formed as the second engaging structure. 4 . The electronic device according to claim 3 , wherein there are a plurality of the bump structures and the grooves respectively, and the bump structures and the grooves are provided in a one-to-one correspondence. 5 . 5 . The electronic device according to claim 3 , further comprising a main board upper cover, the main board upper cover is disposed on the side of the main board close to the receiving hole, and one end of the elastic sheet is connected to the main board. 6 . The end of the elastic sheet away from the main board is electrically connected with the upper cover of the main board, and the side of the upper cover of the main board away from the elastic sheet is electrically connected with the bump structure. 6 . The electronic device according to claim 3 , wherein the groove is disposed at the bottom of the camera module away from the camera, and the groove is electrically connected to the substrate in the camera module, so 6 . The substrate is electrically connected to the camera chip. 7 . The electronic device according to claim 1 , wherein the elastic support structure comprises a spring, and the deformation direction of the spring is the same as the movement direction of the camera module. 8 . 8 . The electronic device according to claim 1 , wherein the first surface of the casing is the side facing away from the display screen. 9 . 9 . The electronic device according to claim 1 , wherein the cross-sectional shape of the camera module is the same as the shape of the insertion hole. 10 . 10 . The electronic device according to claim 1 , wherein a silicone ring is provided around the camera module, and the camera module is sealedly connected to the accommodating hole and the insertion hole through the silicone ring. 11 .

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