CN107567225B - Middle frame manufacturing method, middle frame, electronic equipment and middle frame base body - Google Patents

Abstract

The embodiment of the present application discloses a middle frame manufacturing method, a middle frame, an electronic device and a middle frame substrate, wherein the middle frame manufacturing method includes the following steps: providing a middle frame substrate, the middle frame substrate includes a side frame, a first substrate and at least one nut, the side frame and the first substrate are connected to form a gap between the side frame and the first substrate, the nut is located at the gap position, the nut is integrally connected with one or both of the side frame and the first substrate to form at least one connecting portion; injection molding is performed at the gap position to form a second substrate, the second substrate is connected to the periphery of the nut; milling the connecting portion to disconnect the nut from the side frame and the first substrate. As a result, the second substrate and the periphery of the nut in the embodiment of the present application are fixedly connected by injection molding, so that the fixed connection strength of the second substrate and the nut is large, and the fixed connection strength of the second substrate and the nut is increased.

Description

Middle frame manufacturing method, middle frame, electronic device and middle frame base

technical field

The present application relates to the technical field of electronic equipment, and in particular, to a method for manufacturing a middle frame, a middle frame, an electronic device, and a middle frame base.

Background technique

With the development of network technology and the improvement of the degree of intelligence of electronic devices, users can realize more and more functions through electronic devices, such as calling, chatting, and playing games.

Among them, components such as printed circuit boards and side frames of electronic equipment are generally installed on the middle frame of the electronic equipment through screws, and correspondingly, nuts and screws are provided on the middle frame to realize screw connection. In the prior art, the method of arranging the nut on the middle frame is mainly to heat-fuse the nut to the middle frame by means of hot-melting, and realize the fixed connection through the periphery of the nut and the middle frame. However, when the thickness of the position where the nut is arranged in the middle frame is relatively thin, the strength of the fixed connection with the peripheral edge of the nut is not enough, and the nut is easily detached from the middle frame when being stressed.

SUMMARY OF THE INVENTION

The embodiments of the present application provide a method for manufacturing a middle frame, a middle frame and an electronic device, which can increase the strength of the fixed connection between the nut and the middle frame.

In a first aspect, an embodiment of the present application provides a method for making a middle frame, comprising the following steps:

A middle frame base is provided. The middle frame base includes a first base plate, a side frame and at least one nut. The side frame, the first base plate and the at least one nut are integrally formed. The side frame and the side frame are connected to the first base plate. And a gap is formed between the side frame and the first substrate, the nut is located at the gap position, and the nut is integrally connected with one or both of the side frame and the first substrate to form at least one connection;

Injection molding at the notch position to form a second base plate, and the second base plate is connected to the periphery of the nut;

The connecting portion is milled so that the nut is disconnected from the side frame and the second substrate.

In a second aspect, an embodiment of the present application further provides a middle frame, and the middle frame is manufactured by using the above-mentioned method for manufacturing a middle frame.

In a third aspect, an embodiment of the present application further provides a middle frame, including at least one nut, a side frame, a first substrate and a second substrate, the side frame and the first substrate are integrally formed, and the side frame and the The first substrate forms a gap, the second substrate is filled in the gap position, the second substrate is fixedly connected to the side frame and the first substrate respectively, and the nut is arranged at the gap position, The nut is disposed in the second base plate, and the nut includes a first half-connection part and a second half-connection part located inside the second base plate.

In a fourth aspect, an embodiment of the present application further provides an electronic device, including a middle frame, where the middle frame is the middle frame described above.

In a fifth aspect, an embodiment of the present application further provides a middle frame base body, comprising a first substrate, a side frame and at least one nut, the side frame is connected to the first substrate, and the side frame and the first substrate are connected to each other. A gap is formed between a substrate, the nut is located at the gap position, and the nut is integrally connected with one or both of the side frame and the first substrate to form at least one connecting portion.

In the method for manufacturing a middle frame provided by the embodiment of the present application, firstly, a middle frame base body is provided, and the first base plate, the side frame and at least one nut of the middle frame base body are connected to each other; The peripheral edge of the nut is wrapped, and the peripheral edge of the nut is fixedly connected to the second substrate; finally, the connecting portion is milled to disconnect the nut from the side frame, that is, the second substrate. Therefore, in the embodiment of the present application, the second base plate and the periphery of the nut are fixedly connected by injection molding, so that the fixed connection strength of the second base plate and the nut is high, and the fixed connection strength of the second base plate and the nut is increased.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained from these drawings without creative effort.

FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

FIG. 2 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.

FIG. 3 is a schematic structural diagram of a middle frame base body provided by an embodiment of the present application.

FIG. 4 is a schematic structural diagram of a part of a middle frame provided by an embodiment of the present application.

FIG. 5 is a schematic structural diagram of another part of the middle frame provided by the embodiment of the present application.

FIG. 6 is a schematic diagram of disassembling a nut, a first substrate, and a side frame according to an embodiment of the present application.

FIG. 7 is a schematic structural diagram of a nut provided in an embodiment of the present application.

FIG. 8 is a schematic flowchart of a method for manufacturing a middle frame according to an embodiment of the present application.

FIG. 9 is a schematic process diagram of a method for fabricating a middle frame provided by an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc., or The positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as a limitation on this application. In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as "first", "second" may expressly or implicitly include one or more of said features. In the description of the present application, "plurality" means two or more, unless otherwise expressly and specifically defined.

In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relation. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

In this application, unless otherwise expressly specified and defined, a first feature "on" or "under" a second feature may include direct contact between the first and second features, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the application. Furthermore, this application may repeat reference numerals and/or reference letters in different instances for the purpose of simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, this application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

Embodiments of the present application provide a method for manufacturing a middle frame, a middle frame, an electronic device, and a middle frame base. The detailed descriptions will be given below.

In this embodiment, description will be made from the perspective of a middle frame, which may be specifically arranged in an electronic device, such as a mobile phone, a tablet computer, a PDA (Personal Digital Assistant, PDA), and the like.

Please refer to 1. FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. The electronic device 1 includes a casing 10 , a display screen 20 , a printed circuit board 30 , a battery 40 , and a side frame 124 .

The casing 10 may include a cover plate 11 , a middle frame 12 and a rear cover 13 . The cover plate 11 , the middle frame 12 and the rear cover 13 are combined with each other to form the casing 10 . The closed space formed by the frame 12 and the back cover 13 is used to accommodate the display screen 20 , the printed circuit board 30 , the battery 40 and other devices. In some embodiments, the cover 11 is covered on the middle frame 12 , the rear cover 13 is covered on the middle frame 12 , the cover 11 and the rear cover 13 are located on the opposite sides of the middle frame 12 , the cover 11 and the rear cover 13 Relatively arranged, the closed space of the housing 10 is located between the cover plate 11 and the rear cover 13 .

In some embodiments, the housing 10 may be a metal housing. It should be noted that the material of the housing 10 in the embodiment of the present application is not limited to this, and other methods may also be used. For example, the housing 10 may include a plastic part and a metal part. For another example, the casing 10 may be a plastic casing. For another example, the casing 10 may be a casing structure in which metal and plastic cooperate with each other. The cover plate 11 may be a transparent glass cover plate. In some embodiments, the cover plate 11 may be a glass cover plate made of a material such as sapphire.

It should be noted that the structure of the housing in the embodiment of the present application is not limited to this. For example, the rear cover and the middle frame are integrally formed to form a middle frame 12 structure. Specifically, the housing 10 includes a cover plate 11 and a middle frame 12, and the cover plate 11 and the middle frame 12 are fixed to each other to form a closed space for accommodating the display screen 20, the printed circuit board 30, the battery 40, the side frame 124, etc. device.

Wherein, the printed circuit board 30 is installed in the casing 10, the printed circuit board 30 can be the main board of the electronic device 1, and the printed circuit board 30 can be integrated with a side frame 124, a motor, a microphone, a camera, and a light sensor , receiver and processor and other functional components.

In some embodiments, the printed circuit board 30 is fixed within the housing 10 . Specifically, the printed circuit board 30 can be screwed to the middle frame 12 by screws, or can be snap-fitted to the middle frame 12 by means of snaps. It should be noted that, the specific way of fixing the printed circuit board 30 to the middle frame 12 in the embodiment of the present application is not limited to this, and other ways, such as a way of co-fixing by a buckle and a screw, is also possible.

The battery 40 is installed in the casing 10 , and the battery 40 is electrically connected to the printed circuit board 30 to provide power to the electronic device 1 . The case 10 may serve as a battery cover for the battery 40 . The casing 10 covers the battery 40 to protect the battery 40 , specifically, the back cover covers the battery 40 to protect the battery 40 and reduce damage to the battery 40 due to collision, drop, etc. of the electronic device 1 .

The display screen 20 is installed in the casing 10 , and at the same time, the display screen 20 is electrically connected to the printed circuit board 30 to form the display surface of the electronic device 1 . The display screen 20 includes a display area 111 and a non-display area 112 . The display area 111 may be used to display the screen of the electronic device 1 or for the user to perform touch manipulation or the like. The top area of the non-display area 112 is provided with openings for sound and light transmission, and the bottom of the non-display area 112 can be provided with functional components such as fingerprint modules and touch buttons. The cover plate 11 is mounted on the display screen 20 to cover the display screen 20 to form the same display area and non-display area as the display screen 20 . For details, please refer to the display area and non-display area of the display screen 20 .

It should be noted that the structure of the display screen 20 is not limited to this. For example, the display screen may be a full screen or a heterosexual screen. Specifically, please refer to FIG. 2 , which is another schematic structural diagram of the electronic device provided by the embodiment of the present application. The difference between the electronic device in FIG. 2 and the electronic device in FIG. 1 is that the non-display area is directly formed on the display screen 20, for example, the non-display area of the display screen 20 is set as a transparent structure, so that the light signal can pass through, or By directly opening structures such as openings or gaps for light transmission in the non-display area of the display screen 20, the front camera and photoelectric sensor can be arranged in the non-display area, so that the front camera can take pictures and detect by the photoelectric sensor.

The following description will be made from the perspective of the midframe base.

Please refer to FIG. 3 , which is a schematic structural diagram of a middle frame base body provided by an embodiment of the present application. The middle frame base 200 includes a first substrate 121 , a side frame 124 and at least one nut 123 . The side frame 124 is connected to the first substrate 121 , and a gap 125 is formed between the side frame 124 and the first substrate 121 . The nut 123 is located at the position of the notch 125 . The nut 123 is connected to the first substrate 121 through a first connecting portion 126 , and the nut 123 is connected to the side frame 124 through a second connecting portion 127 . It should be noted that the connection methods of the nut 123 to the side frame 124 and the first substrate 121 in the embodiment of the present application are not limited to this. For another example, the nut 123 is only connected to the first substrate 121, but not fixedly connected to the side frame 124.

In some embodiments, the middle frame base 200 may be integrally formed, for example, by injection molding of a metal material, and the middle frame base 200 may be formed by injection molding of a magnesium alloy material. It should be noted that, the method of forming the frame base 200 in the embodiment of the present application is not limited to the method of injection molding, for example, the method of milling is performed on a metal plate to form. For another example, the first substrate 121 , the side frame 124 and the nut 123 are welded together by welding.

Described below from the perspective of the middle frame.

Please refer to FIG. 4 and FIG. 5 , FIG. 4 is a schematic structural diagram of a part of a middle frame provided by an embodiment of the present application, and FIG. 5 is a schematic structural schematic diagram of another part of the middle frame provided by an embodiment of the present application. In some embodiments, the middle frame 12 includes a first base plate 121 , a second base plate 122 , a side frame 124 and at least one nut 123 .

The first substrate 121 may be made of a metal material, such as a magnesium alloy material. It should be noted that, the first substrate 121 in the embodiment of the present application may also be made of other metal materials.

Wherein, the side frame 124 is made of a metal material, such as a magnesium alloy material. It should be noted that, the side frame 124 in this embodiment of the present application may also be made of other materials. In some embodiments, the side frame 124 can be used as an antenna radiator for transmitting and receiving signals.

Wherein, the number of nut 123 may be one or multiple. The nut 123 can be made of a metal material, specifically, a magnesium alloy material. It should be noted that the nut 123 can also be made of other metal materials.

Wherein, the second substrate 122 can be made of plastic material. It should be noted that the material of the second substrate 122 in the embodiment of the present application is not limited to plastic, and other non-metallic materials may also be used. In some embodiments, the second substrate 122 may be formed on the first substrate 121 by plastic injection molding, and the first substrate 121 and the second substrate 122 are fixedly connected.

In some embodiments, the side frame 124 is connected to the first substrate 121, and a gap 125 is formed between the side frame 124 and the first substrate 121. The nut 123 is located at the position of the notch 125 ; specifically, the nut 123 is close to the end of the side frame 124 . The nut 123 may be connected to the side frame 124 and the first substrate 121 . Specifically, the first substrate 121 , the side frame 124 and the nut 123 may be integrally formed. For example, it is formed by injection molding of metal materials, and more specifically, it can be formed by injection molding of magnesium alloy materials. It should be noted that, in the embodiment of the present application, the integral molding of the first substrate 121 , the side frame 124 and the nut 123 is not limited to injection molding, for example, milling is performed on a metal plate. For another example, the first substrate 121 , the side frame 124 and the nut 123 are welded together by welding.

It should be noted that the connection methods of the nut 123 to the side frame 124 and the first substrate 121 in the embodiment of the present application are not limited to this. For example, the nut 123 and the side frame 124 are only integrally connected, but not fixedly connected to the first substrate 121. . For another example, only the nut 123 is integrally connected with the first substrate 121, and is not fixedly connected with the side frame 124.

It can be understood that in this embodiment, the nut 123 and the side frame 124 are integrally connected. Since the side frame 124, the nut 123 and the first substrate 121 are all made of magnesium alloy materials, the integral connection of the nut 123 and the side frame 124 will affect the side frame. Block 124 acts as an antenna radiator. For this reason, in order to improve the performance of the side frame 124 as an antenna radiator in the embodiment of the present application, the embodiment of the present application may disconnect the part where the nut 123 is connected to the first substrate 121 or/and the side frame 124 . Specifically, please refer to FIG. 6 , which is a schematic diagram of disassembling the nut, the first substrate, and the side frame according to an embodiment of the present application. In the embodiment of the present application, the second connecting portion 127 may be milled, and the nut 123 and the side frame 124 may be disconnected, so that a part of the second connecting portion 127 and the nut 123 are integrally connected. And in the embodiment of the present application, the first connecting portion 126 may be milled to disconnect the nut 123 from the first substrate 121 , so that a part of the first connecting portion 126 and the nut 123 are integrally connected.

In some embodiments, please refer to FIG. 7 , which is a schematic structural diagram of a nut provided in an embodiment of the present application. The nut 123 includes a first half connecting portion 1231 , a second half connecting portion 1232 , a base 1233 , a body 1234 , a plurality of connecting blocks 1235 , a first end 1236 and a second segment 1237 .

The first half connecting portion 1231 is formed by milling the first connecting portion 126 . In some embodiments, the surface of the first half-connecting portion 1231 is arc-shaped, and the arc-shaped surface of the first half-connecting portion 1231 is formed concavely from two sides thereof to the middle thereof. The second half connecting portion 1232 is formed by milling the second connecting portion 127 . In some embodiments, the length of the second half-connection portion 1232 is greater than the length of the first half-connection portion 1231 .

The first end 1236 and the second end 1237 are disposed opposite to each other. The body 1234 is located at the first end 1236 . The first end 1236 is provided with a chamfer. The base 1233 is located at the second end 1237 . In some embodiments, the largest diameter of the body 1234 is smaller than the largest diameter of the base 1233 .

Wherein, the connecting block 1235 is located on the periphery of the main body 1234 . In this embodiment of the present application, the number of connection blocks 1235 may be one, or there may be multiple ones, such as two, and they are evenly arranged. It should be noted that, the number of the connection blocks 1235 in this embodiment of the present application is not limited to this, for example, three, which are evenly distributed.

In some embodiments, the second substrate 122 may be filled to the position of the notch 125 , so that an integral plate-like structure is formed between the second substrate 122 and the first substrate 121 . Specifically, the second substrate 122 can be formed by plastic injection molding, a part of the second substrate 122 is filled to the position of the notch 125, the second substrate 122 wraps the periphery of the nut 123, the second substrate 122 and the side frame 124 are fixedly connected, and The second substrate 122 is fixedly connected to the first substrate 121 .

In this embodiment of the present application, the side frame 124 , the nut 123 and the first substrate 121 can be directly injection-molded to form the second substrate 122 , and finally the first connecting portion 126 and the second connecting portion 127 can be disconnected by milling. , so that the base 1233 , the connecting block 1235 , the first half-connecting portion 1231 and the second half-connecting portion 1232 are embedded in the second substrate 122 and fixedly connected to the second substrate 122 . In this embodiment of the present application, since the base 1233 , the connection block 1235 , and the first half-connection portion 1231 and the second half-connection portion 1232 are all located inside the second base plate 122 , the connection strength between the nut 123 and the second base plate 122 can be increased, so that the The fixed connection strength of the nut 123 and the second substrate 122 is increased. That is, the connection strength between the nut 123 and the middle frame 12 is increased.

In order to better describe the structure of the middle frame of the embodiments of the present application, the following description will be made from the direction of the method of manufacturing the middle frame.

Please refer to FIG. 8 and FIG. 9 , FIG. 8 is a schematic flowchart of a method for manufacturing a middle frame provided by an embodiment of the present application, and FIG. 9 is a schematic flowchart of a manufacturing method for a middle frame provided by an embodiment of the present application. The manufacturing method of the middle frame includes the following steps:

In step S101, a middle frame base 200 is provided. The middle frame base 200 includes a side frame 124, a first substrate 121 and at least one nut 123. The side frame 124 is connected to the first substrate 121, and the side frame 124 is connected to the first substrate 121. A gap 125 is formed therebetween, and the nut 123 is located at the position of the gap 125 . The nut 123 is connected to one or both of the side frame 124 and the first substrate 121 to form at least one connecting portion. It should be noted that, for the connection method of the nut 123 to the first substrate 121 and the side frame 124 in the embodiment of the present application, reference may be made to the above content, and details are not repeated here.

In step S102 , injection molding is performed at the position of the notch 125 to form the second base plate 122 , and the second base plate 122 is connected to the periphery of the nut 123 . Specifically, plastic injection is performed at the position of the notch 125 , and the second substrate 122 wraps the periphery of the nut 123 . For details, please refer to the above content, which will not be repeated here.

In step S103 , the connecting portion is milled so that the nut 123 is disconnected from the side frame 124 and the first substrate 121 . Specifically, the first connecting portion 126 and the second connecting portion 127 are milled so that the nut 123 is disconnected from the side frame 124 and the first substrate 121 , so that the first half connecting portion 1231 of the first connecting portion 126 is located on the periphery of the nut 123 , And the second half-connecting portion 1232 of the second connecting portion 127 is located at the periphery of the nut 123 . The first half connecting portion 1231 and the second half connecting portion 1232 can refer to the above content for details.

In some embodiments, during the milling process, a body 1234 and a base 1233 are formed on the periphery of the nut 123, the base 1233 and the body 1234 are integrally formed, and the base 1233 and the body 1234 can refer to the above content, and will not be repeated here.

In some embodiments, during the milling process, one or two or more evenly distributed connection blocks 1235 are formed on the periphery of the body 1234, and the connection blocks 1235 are fixedly connected to the second substrate 122. For details, please refer to the above content, here No longer.

As can be seen from the above, in the embodiment of the present application, the nut 123 made of metal material is respectively disconnected from the side frame 124 and the first substrate 121 of metal material, so that the nut 123 is insulated from the side frame 124 and the first substrate 121 respectively, and the side frame is used as an antenna. When installing a radiator, avoid the nut 123 from affecting the antenna radiator or the antenna clearance area. In the actual production process, the thickness of the second substrate 122 at the position of the nut 123 is relatively thin. If a nut is thermally fused into the second substrate 122 by hot-melting or other methods, it is easy to loosen or be easily pulled out, and the hot-melt nut cannot be Sufficient pulling force and torque are provided, but the fixing strength is not enough. In the embodiment of the present application, the nut 123 and its peripheral structure are embedded into the second substrate 122, which can increase the contact area between the nut 123 and the second substrate 122, thereby increasing the connection strength between the nut 123 and the second substrate 122, so that the nut 123 and the second substrate 122 are connected. The fixed connection strength of the two substrates 122 is increased. That is, the connection strength between the nut 123 and the middle frame 12 is increased. Therefore, in the embodiment of the present application, the components on the periphery of the nut 123 are embedded into the second substrate 122, even if the second substrate 122 is thin, it is not easy to loosen or be pulled out.

It should be noted that the above middle frame 12 is provided in the electronic device 1, which is only an example of the embodiment of the application, the middle frame 12 is not limited to the electronic device 1, and the structure of the middle frame 12 is not limited to this. .

Those skilled in the art can understand that the structure of the electronic device 1 shown in FIG. 1 and FIG. 2 does not constitute a limitation on the electronic device 1 . The electronic device 1 may comprise more or fewer components than shown, or combine certain components, or a different arrangement of components. The electronic device 1 may further include a processor, a memory, a Bluetooth module, etc., which will not be repeated here.

The manufacturing method of the middle frame, the middle frame, the electronic equipment and the middle frame base provided in the embodiments of the present application have been described above in detail, and the principles and implementations of the present application are described with specific examples in this paper, and the descriptions of the above embodiments are only Used to help understand this application. At the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific embodiments and application scope. To sum up, the content of this specification should not be construed as a limitation to the present application.

Claims (17)

1. a kind of center production method, which comprises the following steps:

A center matrix is provided, the center matrix includes first substrate, side frame and an at least nut, the side frame and described The connection of one substrate, and a notch is formed between the side frame and the first substrate, the nut is located at the gap position, institute Nut and one or two of the side frame, first substrate integrally connected are stated, at least one interconnecting piece is formed；

It is molded in the gap position, forms the second substrate, the second substrate is connect with the nut periphery；

Interconnecting piece described in milling, so that the nut and the side frame, first substrate disconnect.

2. center production method according to claim 1, which is characterized in that the nut includes the first end being oppositely arranged And second end, the step of interconnecting piece described in the milling, include:

Milling is carried out from the first end of the nut, so that the first end of the nut forms an ontology and the nut Second end forms a pedestal, and the maximum gauge of the ontology is less than the maximum gauge of the pedestal.

3. center production method according to claim 2, which is characterized in that milling is carried out from the first end of the nut, The ontology periphery is also made to be formed with one or more link blocks, the link block is fixedly connected with the second substrate.

4. center production method according to claim 1, which is characterized in that the interconnecting piece includes first connecting portion and Two interconnecting pieces, the first connecting portion and the first substrate integrally connected, the second connecting portion and the side frame integrally connect It connects, the step of interconnecting piece described in the milling includes:

First connector described in milling forms the first half with the nut integrally connected so that first connector disconnects Interconnecting piece；

Second connector described in milling forms the second half with the nut integrally connected so that second connector disconnects Interconnecting piece.

5. center production method according to claim 4, which is characterized in that the length in second half-connection portion is greater than institute State the length in the first half-connection portion.

6. center production method according to claim 4, which is characterized in that the surface in first half-connection portion is arc Shape, from its two sides, portion is recessed the curved surfaces in first half-connection portion thereto.

7. center production method according to any one of claim 1 to 6, which is characterized in that one center base of the offer The step of body includes: to form the center matrix by injection molding manner, by the first substrate, side frame and an at least nut one It is body formed.

8. center production method according to any one of claim 1 to 6, which is characterized in that one center base of the offer The step of body includes: that the center matrix is formed by way of milling, by the first substrate, side frame and an at least nut Integrally connected.

9. a kind of center, which is characterized in that the center uses the center production method system such as any one of claims 1 to 8 At.

10. a kind of center characterized by comprising at least a nut, side frame, first substrate and the second substrate, the side frame and The first substrate connection, the side frame and the first substrate form a notch, and the second substrate is filled in the notch Position, the second substrate are fixedly connected with the side frame, the first substrate respectively, and the nut is set to the notch position It sets, the nut is set in the second substrate, and the nut includes the first half-connection inside the second substrate Portion and the second half-connection portion, first half-connection portion and second half-connection portion by with the first substrate and the side Frame disconnects being formed.

11. center according to claim 10, which is characterized in that the length in second half-connection portion is greater than described first The length in half-connection portion.

12. center according to claim 11, which is characterized in that the surface in first half-connection portion is arc, described From its two sides, portion is recessed the curved surfaces in the first half-connection portion thereto.

13. center according to claim 10, which is characterized in that the nut includes the first end being oppositely arranged and second End, the nut include the pedestal positioned at an ontology of the first end and positioned at the second end, and the ontology is most Major diameter is less than the maximum gauge of the pedestal.

14. center according to claim 13, which is characterized in that the nut further includes being set to the ontology periphery One or more link blocks, the link block are fixedly connected with the second substrate.

15. a kind of electronic equipment, which is characterized in that including center, the center is as claim 9 to 14 is described in any item Center.

16. a kind of center matrix, which is characterized in that including first substrate, side frame and an at least nut, the side frame and described The connection of one substrate, and a notch is formed between the side frame and the first substrate, the nut is located at the gap position, institute Nut and one or two of the side frame, first substrate integrally connected are stated, at least one interconnecting piece, the interconnecting piece are formed It is formed by being disconnected at least one of the first substrate and the side frame.

17. center matrix according to claim 16, which is characterized in that the interconnecting piece includes first connecting portion and second Interconnecting piece, the first connecting portion and the first substrate integrally connected, the second connecting portion and the side frame integrally connected.