CN111883472A - Method for manufacturing and repairing micro light-emitting diode display - Google Patents

Abstract

The present invention provides a repairing method for a miniature light-emitting diode display, comprising the following steps: S1: a retractable suction head adsorbs a plurality of miniature light-emitting diodes and places each miniature light-emitting diode between adjacent miniature light-emitting diodes on a driving substrate position; S2: Change the temperature of the retractable tip to make the retractable tip elastically deform. When there is a micro-LED on the position where the micro-LED is placed on the driving substrate, the micro-LED on the driving substrate will move the retractable tip. The corresponding micro-LEDs on the retractable tip are blocked so that they cannot be moved; when the micro-LEDs are missing from the positions where the micro-LEDs are placed on the driving substrate, the corresponding micro-LEDs on the retractable tip move to the position where the micro-LEDs are missing. The present invention performs detection without encapsulation, is easy to repair, does not require detection of missing points of micro light emitting diodes, saves time and cost, improves repairing efficiency, and can repair all missing points at the same time.

Description

Manufacturing method and repairing method of miniature light-emitting diode display

technical field

The present invention relates to the technical field of miniature light-emitting diodes, and in particular, to a manufacturing method and a repairing method of a miniature light-emitting diode display.

Background technique

Micro LED displays have low power consumption, high brightness, ultra-high resolution and color saturation, fast response speed, and ultra-power saving (the power consumption of Micro LED displays is 10% of that of liquid crystal displays, which is an organic electro- 50% of the power consumption of light-emitting displays), long life, high efficiency, adaptability to various sizes and seamless splicing, etc., so it has become the most potential next-generation new display technology.

Making a Micro LED display requires transferring millions of micron-sized LEDs to the backplane. At present, it is inevitable that there will be missing LEDs after the technology transfer. If it is not repaired, it will cause poor display. How to repair the missing points is urgent problem solved.

In the prior art, the backplane is firstly inspected, and the missing points are found and then repaired one by one, or a power-on test is performed to find the missing points, and then repaired one by one. The prior art has the problem of low efficiency.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a manufacturing method and a repairing method of a miniature light emitting diode display that saves time and cost, and improves the repairing efficiency.

The present invention provides a method for repairing a miniature light-emitting diode display, comprising the following steps:

S1: the retractable suction head adsorbs a plurality of miniature light-emitting diodes and places each miniature light-emitting diode in a position between adjacent miniature light-emitting diodes on the driving substrate;

S2: Change the temperature of the retractable tip to make the retractable tip elastically deform. When there is a micro-LED on the position where the micro-LED is placed on the driving substrate, the micro-LED on the driving substrate will put the corresponding micro-LED on the retractable tip. The micro LEDs are blocked so that they cannot be moved; when the micro LEDs are missing from the position where the micro LEDs are placed on the drive substrate, the corresponding micro LEDs on the retractable tip move to the position where the micro LEDs are missing;

S3: energize both ends of the miniature light-emitting diode, and light the miniature light-emitting diode so that the miniature light-emitting diode is fixed on the driving substrate;

S4: Remove the retractable tip.

Further, the manufacturing method of the retractable suction head in step S1 is:

forming an array of metal contacts on a retractable substrate;

A conductive adhesive layer is formed on the metal contact portion, and the micro light-emitting diode is adsorbed by the conductive adhesive layer.

Further, the stretchable substrate is a substrate formed of a memory alloy, and the memory alloy is one of Cu/Zn/Ga alloy, In and Ti alloy, and Au/Cu/Zn alloy.

Further, the stretchable substrate is a substrate formed by an elastic film.

Further, the conductive adhesive layer is fixed on the metal contact portion by means of dispensing.

Further, the driving substrate includes a driving backplane with grooves arranged in an array, a lower electrode located in the groove, a photosensitive conductive layer located in the groove and on the lower electrode, and a driving backplane located in the adjacent grooves. Between the low surface energy layers, in step S1, a plurality of miniature light-emitting diodes adsorbed by the retractable suction head are placed on the low surface energy layer of the driving substrate.

The present invention also provides a method for manufacturing a miniature light-emitting diode display, comprising the following steps:

S1: The grooves for array setting are formed on the drive backplane;

S2: the lower electrode is formed in the groove of the driving backplane;

S3: a low surface energy layer is formed on the driving backplane and between adjacent grooves;

S4: forming a photosensitive conductive layer on the lower electrode;

S5: The micro light emitting diodes are transferred to the photosensitive conductive layer on the driving backplane and the micro light emitting diodes are cured.

Further, in step S4, the upper surface of the photosensitive conductive layer is not higher than the upper surface of the low surface energy layer.

Further, in step S4, when cured under light, the photosensitive conductive layer is a layered structure including a photosensitive layer and a metal ball or nano-silver material doped in the photosensitive layer.

Further, the material of the photosensitive conductive layer may be a material obtained by mixing an acrylate-based prepolymer, an active monomer and a photoinitiator.

The present invention performs detection without encapsulation, is easy to repair, does not require detection of missing points of micro light emitting diodes, saves time and cost, improves repairing efficiency, and can repair all missing points at the same time.

Description of drawings

FIG. 1 and FIG. 2 are schematic structural diagrams of one of the steps of the first embodiment of the repairing method of the micro LED display according to the present invention;

FIG. 3 is a schematic structural diagram of step 2 of the first embodiment of the repairing method for the micro LED display of the present invention;

FIG. 4 is a schematic structural diagram of step 3 of the first embodiment of the repairing method for the miniature light-emitting diode display of the present invention;

FIG. 5 is a schematic structural diagram of one of the steps of the second embodiment of the repairing method for the miniature light-emitting diode display of the present invention;

FIG. 6 is a schematic structural diagram of step 2 of the second embodiment of the repairing method for the miniature light-emitting diode display according to the present invention;

FIG. 7 is a schematic structural diagram of step 3 of the second embodiment of the repairing method for the miniature light-emitting diode display of the present invention;

FIG. 8 is a schematic structural diagram of step 4 of the second embodiment of the repairing method for the miniature light-emitting diode display of the present invention;

FIG. 9 is a schematic structural diagram of step 5 of the second embodiment of the repairing method for the miniature light-emitting diode display of the present invention;

10 is a schematic structural diagram of one of the steps of the manufacturing method of the retractable suction head of the present invention;

FIG. 11 is a schematic structural diagram of the second step of the manufacturing method of the retractable suction head of the present invention.

Detailed ways

Below in conjunction with the accompanying drawings and specific embodiments, the present invention will be further clarified. It should be understood that these embodiments are only used to illustrate the present invention and not to limit the scope of the present invention. Modifications of equivalent forms all fall within the scope defined by the appended claims of this application.

In order to keep the drawings concise, the drawings only schematically show the parts related to the present invention, and they do not represent its actual structure as a product. In addition, in order to make the drawings concise and easy to understand, in some drawings, only one of the components having the same structure or function is schematically shown, or only one of them is marked. As used herein, "one" not only means "only one", but also "more than one".

A method for repairing a miniature light-emitting diode display of the present invention comprises the following steps:

S1: As shown in FIG. 1 and FIG. 2 , the retractable suction head 200 adsorbs a plurality of micro light emitting diodes 1 and places each micro light emitting diode 1 at a position between adjacent micro light emitting diodes 1 on the driving substrate 100;

The retractable suction head 200 includes a retractable base 201, a metal contact portion 202 located on the retractable base 201 and arranged in an array, and a conductive adhesive layer 203 located on the metal contact portion 202. The micro light-emitting diode 1 is composed of a conductive adhesive layer. 203 adsorption.

The conductive adhesive layer 203 is fixed on the metal contact portion 202 by means of dispensing. The material of the metal contact portion 202 is gold, silver or copper. It is one of Cu/Zn/Ga alloy, In and Ti alloy, and Au/Cu/Zn alloy.

S2: As shown in FIG. 3 , changing the temperature of the retractable suction head 200 makes the retractable suction head 200 elastically deform. The micro LED 1 blocks the corresponding micro LED on the retractable tip 200 so that it cannot move; when the micro LED is missing from the position where the micro LED 1 is placed on the driving substrate 100, the corresponding micro LED on the retractable tip 200 The LED is moved to the position where the micro LED is missing;

Wherein, the moving distance of the micro light-emitting diode 1 is determined according to the controlled temperature. As shown in FIG. 1 , the driving substrate 100 has a position A that lacks micro light-emitting diodes. The displacement of the retractable substrate 201 can be changed after heating. The temperature of the retractable substrate 201 is controlled so that the metal contact portion 202, the conductive adhesive layer 203 and the The corresponding miniature light-emitting diodes 1 are moved to the position A together.

When the micro LEDs of the retractable tip 200 move to a position where there is no shortage of micro LEDs, the micro LEDs of the retractable tip 200 are blocked by the micro LEDs of the driving substrate 100 and cannot move, because the retractable base The 201 is flexible and can fill in the missing positions with tiny LEDs for quick repairs.

S3: As shown in FIG. 4 , energize both ends of the miniature light-emitting diode to light up the miniature light-emitting diode 1 so that the miniature light-emitting diode 1 is fixed on the driving backplane 100;

S4: The retractable tip 200 is removed.

Repairing the missing micro light emitting diode 1 on the driving substrate 100 is completed through the above steps, and there is no need to detect the defective position of the micro light emitting diode in advance.

In step S3, "energizing both ends of the micro-LEDs" means that all the micro-LEDs on the driving backplane 100 are energized.

The driving substrate 100 includes a driving backplane 10 having grooves 11 arranged in an array, lower electrodes 20 located in the grooves 11 , a photosensitive conductive layer 40 located in the grooves 11 and on the lower electrodes 20 , and on the driving backplane 10 And the upper surface of the photosensitive conductive layer 40 of the low surface energy layer 30 located between the adjacent grooves 11 is not higher than the upper surface of the low surface energy layer 30 .

The distance between adjacent grooves 11 is not less than the maximum width of each micro-LED. The material of the low surface energy layer 30 is one or more combinations of polytetrafluoroethylene, fluorinated ethylene propylene copolymer and perfluoroalkylate.

In step S1, the plurality of micro light emitting diodes 1 adsorbed by the retractable suction head 200 are placed on the low surface energy layer 30 of the driving substrate 100.

The present invention also provides a method for manufacturing a miniature light-emitting diode display, comprising the following steps:

S1: As shown in FIG. 5 , a groove 11 arranged in an array is formed on the driving backplane 10;

Among them, the grooves 11 arranged in an array in the form of the driving backplane 10 are formed by wet etching technology.

S2: As shown in FIG. 6, the lower electrode 20 is formed in the groove 11 of the driving backplane 10;

S3: As shown in FIG. 7 , a low surface energy layer 30 is formed on the driving backplane 10 and between adjacent grooves 11;

Wherein, the patterned low surface energy layer 30 is fabricated by means of exposure, development and the like.

S4: As shown in FIG. 8 , a photosensitive conductive layer 40 is formed on the lower electrode 20, and the upper surface of the photosensitive conductive layer 40 is not higher than the upper surface of the low surface energy layer 30;

Wherein, a photosensitive conductive layer 40 is made above the lower electrode 20, and cured when exposed to light, the photosensitive conductive layer 40 is a layered structure including a photosensitive layer and metal balls or nano-silver materials doped in the photosensitive layer, and the photosensitive conductive layer 40 is formed. The material of the layer 40 can be a mixture of acrylate prepolymer, active monomer and photoinitiator, and the photoinitiator is a visible light initiator. That is to say, in the case of illumination, the photosensitive conductive layer 40 can make the miniature light-emitting diodes fixed on the photosensitive conductive layer 40.

S5: As shown in FIG. 9 , the micro LEDs 50 are transferred to the photosensitive conductive layer 40 on the driving backplane 10 and the micro LEDs 50 are cured.

The above steps form a miniature light emitting diode display.

The present invention also provides a method for manufacturing a retractable suction head, comprising the following steps:

S1: As shown in FIG. 10 , metal contact portions 202 arranged in an array are formed on the retractable substrate 201;

S2 : As shown in FIG. 11 , a conductive adhesive layer 203 is formed on the metal contact portion 202 .

The micro light-emitting diode 1 is adsorbed by the conductive adhesive layer 203 .

The present invention performs detection without encapsulation, is easy to repair, does not require detection of missing points of micro light emitting diodes, saves time and cost, improves repairing efficiency, and can repair all missing points at the same time.

The preferred embodiments of the present invention are described in detail above, but the present invention is not limited to the specific details of the above-mentioned embodiments. Within the scope of the technical concept of the present invention, various equivalent transformations (such as quantity, shape, etc.) can be performed on the technical solutions of the present invention. , position, etc.), these equivalent transformations all belong to the protection scope of the present invention.

Claims (10)

1. A method for repairing a micro light-emitting diode display is characterized by comprising the following steps:

s1: the retractable suction head adsorbs a plurality of micro light-emitting diodes and places each micro light-emitting diode at a position between adjacent micro light-emitting diodes on the driving substrate;

s2: the temperature of the telescopic sucker is changed to enable the telescopic sucker to generate elastic deformation, and when the micro light-emitting diode exists at the position of the driving substrate where the micro light-emitting diode is placed, the micro light-emitting diode on the driving substrate blocks the corresponding micro light-emitting diode on the telescopic sucker so that the micro light-emitting diode cannot move; when the position of the driving substrate, where the micro light-emitting diode is placed, is short of the micro light-emitting diode, the corresponding micro light-emitting diode on the telescopic sucker moves to the position where the micro light-emitting diode is short of the driving substrate;

s3: electrifying two ends of the micro light-emitting diode, and lightening the micro light-emitting diode to fix the micro light-emitting diode on the driving substrate;

s4: the retractable suction head is removed.

2. The method for repairing a micro light emitting diode display of claim 1, wherein the method for manufacturing the retractable suction head in step S1 comprises:

forming metal contact parts arranged in an array on a telescopic substrate;

and forming a conductive bonding layer on the metal contact part, wherein the micro light-emitting diode is adsorbed by the conductive bonding layer.

3. The method of claim 2, wherein the stretchable substrate is a substrate made of a memory alloy, and the memory alloy is one of Cu/Zn/Ga alloy, In and Ti alloy, and Au/Cu/Zn alloy.

4. The method of repairing a micro light-emitting diode display device according to claim 2, wherein the stretchable substrate is a substrate formed of an elastic film.

5. The method of repairing a micro led display of claim 2, wherein the conductive adhesive layer is fixed on the metal contact portion by dispensing.

6. The method for repairing a micro led display according to claim 1, wherein the driving substrate comprises a driving back plate having a plurality of grooves arranged in an array, a lower electrode located in the grooves, a photosensitive conductive layer located in the grooves and on the lower electrode, and a low surface energy layer located on the driving back plate and between adjacent grooves, and in step S1, the plurality of micro leds attracted by the retractable attraction head are placed on the low surface energy layer of the driving substrate.

7. A manufacturing method of a micro light-emitting diode display is characterized by comprising the following steps:

s1: forming grooves arranged in an array on the driving back plate;

s2: forming a lower electrode in the groove of the driving back plate;

s3: forming a low surface energy layer on the driving back plate and between adjacent grooves;

s4: forming a photosensitive conductive layer on the lower electrode;

s5: and transferring the micro light-emitting diodes onto the photosensitive conductive layer on the driving back plate and curing the micro light-emitting diodes.

8. The method for manufacturing a micro light-emitting diode display according to claim 7, wherein in step S4, the upper surface of the photosensitive conductive layer is not higher than the upper surface of the low surface energy layer.

9. The method for manufacturing a micro light-emitting diode display according to claim 7, wherein in step S4, the photosensitive conductive layer is a layered structure formed by a photosensitive layer and metal balls or nano silver materials doped in the photosensitive layer when cured by light.

10. The method of claim 7, wherein the photosensitive conductive layer is a mixture of an acrylate prepolymer, a reactive monomer, and a photoinitiator.

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