CN111857270A - Device beneficial to heat dissipation of computer - Google Patents
Device beneficial to heat dissipation of computer Download PDFInfo
- Publication number
- CN111857270A CN111857270A CN202010703920.5A CN202010703920A CN111857270A CN 111857270 A CN111857270 A CN 111857270A CN 202010703920 A CN202010703920 A CN 202010703920A CN 111857270 A CN111857270 A CN 111857270A
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- heat dissipation
- heat
- computer
- heat absorption
- absorption head
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a device beneficial to heat dissipation of a computer, which comprises a heat absorption head, wherein an opening is formed in the top end of the heat absorption head, a top cover is sealed at the opening, an upper independent installation cavity and a lower independent installation cavity are arranged inside the heat absorption head, a circulating pump and an integrated circuit board are fixedly installed in the upper installation cavity, the circulating pump and the integrated circuit board are electrically connected through a conducting wire, a pair of pipe orifices are fixedly connected to one side of the heat absorption head and are respectively a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are both communicated with the lower installation cavity inside the heat absorption head, a sealing plate is connected to the bottom of the heat absorption head, and a heat absorption plate is fixedly installed. This kind of do benefit to radiating device of computer uses through the cooperation of the internal air discharge fan of box and the exhaust box that admits air, has effectively improved the flow speed of gas in the computer, and then the effectual deposition of avoiding the dust at quick-witted incasement has reduced the damage rate of machine, does benefit to the long-time high-efficient operation of computer.
Description
Technical Field
The invention relates to the technical field of computer equipment, in particular to a device beneficial to heat dissipation of a computer.
Background
Integrated circuits are heavily used in computer components. It is well known that high temperatures are a rival of integrated circuits. The high temperature can not only cause the unstable operation of the system and shorten the service life, but also possibly burn some parts. The heat that causes the high temperature does not come from outside the computer, but inside the computer, or inside the integrated circuit. The radiator is used for absorbing the heat and then radiating the heat into the case or out of the case, so that the temperature of the computer components is ensured to be normal. Most heat sinks absorb heat by contacting the surfaces of heat-generating components, and then transfer the heat to a remote location by various methods, such as air in a chassis, and then the chassis transfers the hot air to the outside of the chassis, thereby dissipating heat from the computer. The types of radiators are very many, and CPUs, display cards, mainboard chip sets, hard disks, cases, power supplies and even optical drives and memories all need radiators, and the different radiators cannot be used in a mixed manner, wherein the radiator of the CPU is the most frequently contacted. Depending on the way heat is taken away from the heat sink, the heat sink can be divided into active and passive heat dissipation. The former is commonly an air-cooled heat sink, while the latter is commonly a heat sink. The further subdivision heat dissipation mode can be divided into air cooling, heat pipes, liquid cooling, semiconductor refrigeration, compressor refrigeration and the like.
The radiator can cause dust accumulation in the case in the using process, and the problem of short circuit and burnout is easily caused by the fact that all parts in the case are not contacted with each other due to long-term uncleaning. Therefore, we improve this and propose a device for facilitating heat dissipation of a computer.
Disclosure of Invention
In order to solve the technical problems, the invention provides the following technical scheme:
the invention relates to a device beneficial to heat dissipation of a computer, which comprises a heat absorption head, wherein the top end of the heat absorption head is provided with an opening, a top cover is sealed at the opening, an upper independent installation chamber and a lower independent installation chamber are arranged in the heat absorption head, a circulating pump and an integrated circuit board are fixedly arranged in the upper mounting cavity, the circulating pump and the integrated circuit board are electrically connected through a lead, one side of the heat absorption head is fixedly connected with a pair of pipe orifices, and is respectively a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are both communicated with the lower mounting cavity inside the heat absorption head, the bottom of the heat absorption head is connected with a sealing plate, the sealing plate is fixedly provided with a heat absorbing plate, the heat absorbing plate is fixedly provided with a partition plate, the partition plate can be hermetically connected with the top end of a lower mounting cavity in the heat absorbing head, and the lower mounting cavity is divided into a water inlet cavity and a water discharge cavity through the partition plate;
The heat dissipation box, one side fixedly connected with air inlet box of heat dissipation box to keeping away from one side fixedly connected with exhaust box of air inlet box, the inside fixed mounting of exhaust box has the mount, just the fixed mounting of center department of mount has the motor, the motor both ends are connected with the pivot respectively, just the pivot other end is connected with first exhaust fan and second exhaust fan respectively.
As a preferred technical scheme of the invention, a pair of connecting ports are arranged at the upper end and the lower end of one side of the heat dissipation box body, connecting rubber pipes are connected to the connecting ports, and the other ends of the connecting rubber pipes are respectively communicated with the liquid inlet and the liquid outlet.
As a preferred technical scheme of the invention, the inside of the heat dissipation box body is fixedly provided with the heat dissipation pipe, two ends of the heat dissipation pipe are respectively communicated with the connecting ports, a plurality of groups of heat dissipation plates are vertically and fixedly arranged in the heat dissipation box body, and the intervals between the heat dissipation plates are equal.
As a preferable technical solution of the present invention, the heat dissipation pipes are folded and distributed in an S-shape inside the heat dissipation box body, and the heat dissipation pipes are fixed to penetrate between the heat dissipation plates.
As a preferred technical solution of the present invention, a group of heat dissipation fins is respectively and fixedly installed inside the heat absorbing plate close to the water inlet chamber and the water outlet chamber, and the heat dissipation fins and the heat absorbing plate are of an integrated structure.
As a preferable technical scheme of the invention, the liquid inlet and the liquid outlet are respectively communicated with the water inlet cavity and the water discharge cavity, and one ends of the water inlet cavity and the water discharge cavity, which are far away from the connection part of the liquid inlet and the liquid outlet, are communicated with each other.
As a preferred technical scheme of the invention, the output end of the circulating pump is connected with a connecting pipe, and the connecting pipe is communicated with the liquid inlet.
As a preferable technical scheme of the invention, the exhaust box body is in a circular truncated cone-shaped structure, and the first exhaust fan is fixedly arranged at one end of the opening of the exhaust box body, which has a larger diameter.
In a preferred embodiment of the present invention, the first exhaust fan has a larger blade diameter than the second exhaust fan, and the number of blades of the first exhaust fan is smaller than the number of blades of the second exhaust fan.
As a preferred technical scheme, the sealing plate and the heat absorbing plate are of an integrated structure, and mounting through holes are formed in the corners of the sealing plate respectively.
The invention has the beneficial effects that: this kind of do benefit to radiating device of computer, the circulation flow of heat radiation fin cooperation coolant liquid on heat absorbing head bottom absorber plate and the absorber plate has been realized the heat absorbing head can last effectually absorb heat to the computer, use through the cooperation of heat dissipation box and exhaust box, the rapid cooling to cooling tube internal cooling liquid has been realized, and then be convenient for guarantee the continuous stable working effect that the heat absorbing head has, and simultaneously, use through the cooperation of the internal air discharge fan of box and the exhaust box of admitting air, the flow velocity of gas in the computer has effectively been improved, and then the effectual deposition of dust at quick-witted incasement of having avoided, the damage rate of machine has been reduced, do benefit to the long-time high-efficient operation of computer.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of the overall structure of a device for facilitating heat dissipation of a computer according to the present invention;
FIG. 2 is a schematic view of a heat sink packaging structure of the apparatus for facilitating heat dissipation of a computer according to the present invention;
FIG. 3 is a schematic top view of a heat sink of the apparatus for dissipating heat from a computer according to the present invention;
FIG. 4 is a schematic diagram of the internal structure of a heat dissipation case of the device for dissipating heat from a computer according to the present invention;
FIG. 5 is a schematic diagram of the internal structure of the exhaust box of the apparatus for dissipating heat from a computer according to the present invention.
In the figure: 1. a heat absorption head; 2. a sealing plate; 3. a heat dissipation box body; 4. an air inlet box body; 5. an exhaust box body; 6. a liquid inlet; 7. a liquid discharge port; 8. a top cover; 9. a circulation pump; 10. an integrated circuit board; 11. a heat absorbing plate; 12. heat dissipation fins; 13. a partition plate; 14. a connecting pipe; 15. a radiating pipe; 16. a heat dissipation plate; 17. a connecting port; 18. a fixed mount; 19. a motor; 20. a rotating shaft; 21. a first exhaust fan; 22. a second exhaust fan; 23. and connecting the rubber tube.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Example (b): as shown in fig. 1-5, the device for facilitating heat dissipation of a computer of the present invention comprises a heat absorption head 1, wherein an opening is formed at the top end of the heat absorption head 1, a top cover 8 is sealed at the opening, an upper independent installation chamber and a lower independent installation chamber are arranged inside the heat absorption head 1, a circulation pump 10 and an integrated circuit board 9 are fixedly installed in the upper installation chamber, the circulation pump 10 and the integrated circuit board 9 are electrically connected through a wire, a pair of pipe orifices are fixedly connected to one side of the heat absorption head 1 and respectively serve as a liquid inlet 6 and a liquid outlet 7, the liquid inlet 6 and the liquid outlet 7 are both communicated with the lower installation chamber inside the heat absorption head 1, a sealing plate 2 is connected to the bottom of the heat absorption head 1, a heat absorption plate 11 is fixedly installed on the sealing plate 2, a partition plate 13 is fixedly installed on the heat absorption plate 11, and the partition plate 13 can be hermetically connected with the top, the lower mounting chamber is divided into a water inlet chamber and a water outlet chamber by a partition plate 13;
The radiator box 3, one side fixedly connected with air inlet box 4 of radiator box 3 to keeping away from one side fixedly connected with exhaust box 5 of air inlet box 4, the inside fixed mounting of exhaust box 5 has mount 18, just fixed mounting is located at the center of mount 18 has motor 19, motor 19 both ends are connected with pivot 20 respectively, just the 20 other ends of pivot are connected with first exhaust fan 21 and second exhaust fan 22 respectively.
The upper end and the lower end of one side of the heat dissipation box body 3 are provided with a pair of connectors 17, the connectors 17 are connected with connecting rubber pipes 23, and the other ends of the connecting rubber pipes 23 are communicated with the liquid inlet 6 and the liquid outlet 7 respectively.
Wherein, the inside fixed mounting of heat dissipation box 3 has cooling tube 15, 15 both ends of cooling tube communicate with connector 17 each other respectively, vertical fixed mounting multiunit heating panel 16 in the heat dissipation box 3, the interval equals between the heating panel 16, through heating panel 16, can effectively increase heat radiating area, and then is convenient for improve the radiating efficiency of cooling tube 15.
The radiating pipes 15 are folded and distributed in an S-shape inside the radiating box 3, and the radiating pipes 15 are fixed and penetrate between the radiating plates 16.
The heat absorbing plate 11 is fixedly provided with a group of heat radiating fins 12 in the inner parts close to the water inlet cavity and the water outlet cavity respectively, the heat radiating fins 12 and the heat absorbing plate 11 are of an integrated structure, and the heat absorbing efficiency and the heat transfer efficiency of the heat absorbing plate 11 can be effectively improved through the heat radiating fins 12, so that the computer can be rapidly absorbed by heat conveniently.
Wherein, inlet 6 and leakage fluid dram 7 communicate with water inlet cavity and drainage cavity chamber respectively each other, and water inlet cavity chamber and drainage cavity chamber are keeping away from inlet 6 and the one end intercommunication of leakage fluid dram 7 junction.
Wherein, the output end of the circulating pump 9 is connected with a connecting pipe 14, and the connecting pipe 14 is communicated with the liquid inlet 6.
Wherein, exhaust box 5 is round platform column structure, and first exhaust fan 21 fixed mounting is in the great one end of 5 open-ended diameters of exhaust box, through the structural design of round platform form, is convenient for improve gaseous flow velocity in the computer, and then the effectual deposition of dust in quick-witted incasement of having avoided has reduced the damage rate of machine, does benefit to the long-time high-efficient operation of computer.
Wherein, the blade diameter of first exhaust fan 21 is greater than second exhaust fan 22 blade diameter, just the blade number of first exhaust fan 21 is less than second exhaust fan 22's blade number, through second exhaust fan 22, is convenient for realize carrying out pressurization acceleration processing to first exhaust fan 21 exhaust gas, and then is convenient for improve the velocity of flow of gas in the computer.
Wherein, the sealing plate 2 and the absorber plate 11 formula structure as an organic whole, just the corner of sealing plate 2 is equallyd divide and is seted up the installation through-hole respectively.
The working principle is as follows: firstly, the heat absorption head 1 is correctly and fixedly installed at a position of a computer needing cooling, an electrical element in the device is externally connected with a control switch and a power supply, and then the computer is cooled by starting the device through the control switch. When using, through the circulation flow of heat absorption head 1 bottom absorber plate 11 and heat sink plate 11 on heat radiation fins 12 cooperation coolant liquid, realized that heat absorption head 1 can last effectually absorb heat to the computer, use through the cooperation of heat dissipation box 3 with exhaust box 5, realized the rapid cooling to cooling tube 15 internal cooling liquid, and then be convenient for guarantee the continuous stable working effect that heat absorption head 1 has, and simultaneously, through the cooperation of box 4 and the interior exhaust fan of exhaust box 5 of admitting air, the flow velocity of gas in the computer has effectively been improved, and then the effectual deposition of dust in quick-witted incasement of having avoided, the damage rate of machine has been reduced, do benefit to the long-time high-efficient operation of computer.
Finally, it should be noted that: in the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A device for facilitating heat dissipation from a computer, comprising:
The heat absorption device comprises a heat absorption head (1), wherein an opening is formed in the top end of the heat absorption head (1), a top cover (8) is sealed at the opening, an upper independent installation cavity and a lower independent installation cavity are arranged in the heat absorption head (1), a circulating pump (10) and an integrated circuit board (9) are fixedly installed in the upper installation cavity, the circulating pump (10) and the integrated circuit board (9) are electrically connected through a wire, one side of the heat absorption head (1) is fixedly connected with a pair of pipe orifices which are respectively a liquid inlet (6) and a liquid outlet (7), the liquid inlet (6) and the liquid outlet (7) are both communicated with the lower installation cavity in the heat absorption head (1), a sealing plate (2) is connected to the bottom of the heat absorption head (1), a heat absorption plate (11) is fixedly installed on the sealing plate (2), a partition plate (13) is fixedly installed on the heat absorption plate (11), and the partition plate (13) can be hermetically connected with the top end of the lower installation, the lower mounting chamber is divided into a water inlet chamber and a water discharge chamber by a partition plate (13);
the heat dissipation box (3), one side fixedly connected with of heat dissipation box (3) box (4) that admits air to keeping away from one side fixedly connected with exhaust box (5) of admitting air box (4), the inside fixed mounting of exhaust box (5) has mount (18), just fixed mounting is located at the center of mount (18) has motor (19), motor (19) both ends are connected with pivot (20) respectively, just pivot (20) other end is connected with first exhaust fan (21) and second exhaust fan (22) respectively.
2. The device for facilitating the heat dissipation of the computer according to claim 1, wherein a pair of connectors (17) are arranged at the upper and lower ends of one side of the heat dissipation box body (3), the connectors (17) are connected with connecting rubber pipes (23), and the other ends of the connecting rubber pipes (23) are respectively communicated with the liquid inlet (6) and the liquid outlet (7).
3. The device for facilitating heat dissipation of computers of claim 2, wherein the heat dissipation pipe (15) is fixedly installed inside the heat dissipation box body (3), two ends of the heat dissipation pipe (15) are respectively communicated with the connection ports (17), a plurality of groups of heat dissipation plates (16) are vertically and fixedly installed inside the heat dissipation box body (3), and the intervals between the heat dissipation plates (16) are equal.
4. The device for facilitating the heat dissipation of computers of claim 3, wherein the heat dissipation pipe (15) is distributed in an S-shaped folded manner inside the heat dissipation box body (3), and the heat dissipation pipe (15) is fixed and penetrated between the heat dissipation plates (16).
5. The device for facilitating the heat dissipation of the computer as claimed in claim 1, wherein the heat absorbing plate (11) is fixedly provided with a set of heat dissipating fins (12) near the interior of the water inlet chamber and the water outlet chamber, respectively, and the heat dissipating fins (12) and the heat absorbing plate (11) are of an integral structure.
6. The device for facilitating the heat dissipation of the computer is characterized in that the liquid inlet (6) and the liquid outlet (7) are respectively communicated with the water inlet cavity and the water outlet cavity, and the water inlet cavity is communicated with the water outlet cavity at one end far away from the joint of the liquid inlet (6) and the liquid outlet (7).
7. The device for facilitating the heat dissipation of the computer is characterized in that the output end of the circulating pump (9) is connected with a connecting pipe (14), and the connecting pipe (14) is communicated with the liquid inlet (6).
8. The device for facilitating the heat dissipation of the computer of claim 1, wherein the exhaust box body (5) is a truncated cone-shaped structure, and the first exhaust fan (21) is fixedly installed at the end with the larger diameter of the opening of the exhaust box body (5).
9. The apparatus for facilitating heat dissipation of a computer according to claim 1, wherein the first exhaust fan (21) has a larger blade diameter than the second exhaust fan (22), and the number of blades of the first exhaust fan (21) is smaller than the number of blades of the second exhaust fan (22).
10. The device for facilitating the heat dissipation of the computer of claim 1, wherein the sealing plate (2) and the heat absorbing plate (11) are of an integral structure, and the corners of the sealing plate (2) are respectively provided with a mounting through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010703920.5A CN111857270A (en) | 2020-07-21 | 2020-07-21 | Device beneficial to heat dissipation of computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010703920.5A CN111857270A (en) | 2020-07-21 | 2020-07-21 | Device beneficial to heat dissipation of computer |
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| Publication Number | Publication Date |
|---|---|
| CN111857270A true CN111857270A (en) | 2020-10-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010703920.5A Pending CN111857270A (en) | 2020-07-21 | 2020-07-21 | Device beneficial to heat dissipation of computer |
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| Country | Link |
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| CN (1) | CN111857270A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113210359A (en) * | 2021-05-17 | 2021-08-06 | 圣同激光设备(上海)有限公司 | Knapsack formula laser belt cleaning device |
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| CN1797276A (en) * | 2004-12-24 | 2006-07-05 | 富准精密工业(深圳)有限公司 | Liquid cooling type heat sink |
| CN203204538U (en) * | 2013-05-01 | 2013-09-18 | 于春荣 | Computer case cooling device |
| CN205318312U (en) * | 2015-12-22 | 2016-06-15 | 深圳市研派科技有限公司 | Integral type water -cooling forced air cooling hybrid radiator |
| CN105700652A (en) * | 2016-03-16 | 2016-06-22 | 深圳市超频三科技股份有限公司 | Cooler |
| CN206441096U (en) * | 2016-11-22 | 2017-08-25 | 谢艺明 | A kind of radiator of computer with integrated |
| CN107357397A (en) * | 2017-09-06 | 2017-11-17 | 无锡尚智诚科技有限公司 | A kind of novel C PU radiators |
| CN207281691U (en) * | 2017-09-18 | 2018-04-27 | 深圳市高昱电子科技有限公司 | Air-cooled water cooling integrated device |
| CN210270777U (en) * | 2019-07-31 | 2020-04-07 | 石家庄邮电职业技术学院(中国邮政集团公司培训中心) | Cooling system for computer and computer |
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2020
- 2020-07-21 CN CN202010703920.5A patent/CN111857270A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1797276A (en) * | 2004-12-24 | 2006-07-05 | 富准精密工业(深圳)有限公司 | Liquid cooling type heat sink |
| CN203204538U (en) * | 2013-05-01 | 2013-09-18 | 于春荣 | Computer case cooling device |
| CN205318312U (en) * | 2015-12-22 | 2016-06-15 | 深圳市研派科技有限公司 | Integral type water -cooling forced air cooling hybrid radiator |
| CN105700652A (en) * | 2016-03-16 | 2016-06-22 | 深圳市超频三科技股份有限公司 | Cooler |
| CN206441096U (en) * | 2016-11-22 | 2017-08-25 | 谢艺明 | A kind of radiator of computer with integrated |
| CN107357397A (en) * | 2017-09-06 | 2017-11-17 | 无锡尚智诚科技有限公司 | A kind of novel C PU radiators |
| CN207281691U (en) * | 2017-09-18 | 2018-04-27 | 深圳市高昱电子科技有限公司 | Air-cooled water cooling integrated device |
| CN210270777U (en) * | 2019-07-31 | 2020-04-07 | 石家庄邮电职业技术学院(中国邮政集团公司培训中心) | Cooling system for computer and computer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113210359A (en) * | 2021-05-17 | 2021-08-06 | 圣同激光设备(上海)有限公司 | Knapsack formula laser belt cleaning device |
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Application publication date: 20201030 |
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