CN214542200U - Be used for SOC chip heat radiation structure - Google Patents
Be used for SOC chip heat radiation structure Download PDFInfo
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- CN214542200U CN214542200U CN202121065641.7U CN202121065641U CN214542200U CN 214542200 U CN214542200 U CN 214542200U CN 202121065641 U CN202121065641 U CN 202121065641U CN 214542200 U CN214542200 U CN 214542200U
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- working cavity
- heat dissipation
- soc chip
- mounting
- heat
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Abstract
The utility model discloses a be used for SOC chip heat radiation structure, including lower work cavity, the last fixed surface of lower work cavity is connected with the transmission pipeline, the last fixed surface of transmission pipeline is connected with the work cavity, the inside of lower work cavity is provided with the radiating liquid, the inside fixedly connected with heat radiation fins of lower work cavity, the lower fixed surface of lower work cavity is connected with the heat transfer piece, the lower surface of lower work cavity just is located the outside fixedly connected with connection piece of heat transfer piece, the last fixed surface of going up the work cavity is connected with the erection column. The utility model discloses in, set up down work cavity, last work cavity, transmission pipeline, radiating liquid, heat radiation fins, radiator fan, dust screen, beaded finish, mounting panel, erection column, mounting nut, heat transfer piece, fin, through mutually supporting of radiator fan and radiating liquid, reached that the radiating efficiency is higher, convenient to use's purpose.
Description
Technical Field
The utility model relates to a heat radiation structure technical field especially relates to a be used for SOC chip heat radiation structure.
Background
The SOC chip is a chip of an integrated circuit, can effectively reduce the development cost of electronic/information system products, shorten the development period, and improve the competitiveness of products, and is the most important product development mode to be adopted in the future industry. An integrated circuit is a miniature electronic device or component, and the components and wiring of transistor, resistor, capacitor and inductor required in a circuit are interconnected together by a certain process, and then are made into a small piece or several small pieces of semiconductor wafers or medium substrates, and then are packaged in a package to form a miniature structure with the required circuit function.
Because there are many electrical elements in the chip inside, the during operation produces more heat, if the heat is not in time dispersed, can lead to the processing speed of chip to become slow, when serious, the condition of spontaneous combustion appears even, among the prior art, the heat dissipation is mostly just dispelled the heat through radiator fan, radiating effect is not ideal enough, and it is not convenient enough to use.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the shortcoming that exists among the prior art, and the utility model provides a be used for SOC chip heat radiation structure who proposes.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a heat dissipation structure for an SOC chip comprises a lower working cavity, wherein a transmission pipeline is fixedly connected to the upper surface of the lower working cavity, an upper working cavity is fixedly connected to the upper surface of the transmission pipeline, heat dissipation liquid is arranged inside the lower working cavity, heat dissipation fins are fixedly connected inside the lower working cavity, a heat transfer sheet is fixedly connected to the lower surface of the lower working cavity, and a connecting sheet is fixedly connected to the lower surface of the lower working cavity and positioned on the outer side of the heat transfer sheet;
the upper fixed surface of going up the work cavity is connected with the erection column, the upper portion of erection column is provided with the mounting panel, the middle part of mounting panel is provided with radiator fan, radiator fan's upper fixed surface is connected with the beaded finish, the upper surface of beaded finish is provided with the dust screen, the upper portion of erection column is provided with mounting nut, go up the inside fixed connection fin of work cavity.
As a further description of the above technical solution:
the number of the connecting pieces is four, and the connecting pieces are not in contact with the heat transfer pieces.
As a further description of the above technical solution:
the lower working cavity is annular, and the radiating fins are located below the upper working cavity.
As a further description of the above technical solution:
the number of the transfer pipelines is four, and the transfer pipelines are positioned at the outer sides of the radiating fins.
As a further description of the above technical solution:
the upper working cavity is communicated with the lower working cavity through a transfer pipeline.
As a further description of the above technical solution:
the number of the mounting columns is four, and the cooling fins are located on the inner sides of the mounting columns.
As a further description of the above technical solution:
the air inlet of the cooling fan is positioned above the cooling fins, and the mounting nut is in threaded connection with the mounting column.
As a further description of the above technical solution:
the reinforcing ring is located the inboard of mounting nut, mounting nut is located the top of mounting panel.
The utility model discloses following beneficial effect has:
1. compared with the prior art, this a be used for SOC chip heat radiation structure has set up down work cavity, go up work cavity, transfer pipe, radiating fluid, radiator fin, radiator fan, dust screen, the inside radiating fluid of lower work cavity meets the heat and becomes gaseous, in getting into work cavity through transfer pipe, under radiator fan's heat dissipation, the radiating fluid becomes liquid entering work cavity down again, the efficiency of heat absorption is improved, the radiating fluid can be recycled, it is more convenient to use, radiator fin and radiating fluid mutually support, double heat dissipation, radiating efficiency is better.
2. Compared with the prior art, this a be used for SOC chip heat radiation structure has set up beaded finish, mounting panel, erection column, mounting nut, heat transfer piece, fin, and the design of erection column, mounting nut and mounting panel is conveniently maintained radiator fan, when radiator fan damages, also conveniently changes, easy operation, fin, heat transfer piece improve the efficiency of heat dissipation and transmission, further guarantee radiating respond well.
Drawings
Fig. 1 is a schematic view of a top view structure of a heat dissipation structure for an SOC chip according to the present invention;
fig. 2 is a schematic view of a bottom view structure of a heat dissipation structure for an SOC chip according to the present invention;
fig. 3 is a right side view of the heat dissipation structure for the SOC chip according to the present invention;
fig. 4 is an internal schematic view of a heat dissipation structure for an SOC chip according to the present invention;
fig. 5 is a schematic diagram of a partial explosion of a heat dissipation structure for an SOC chip according to the present invention.
Illustration of the drawings:
1. a lower working chamber; 2. a transfer conduit; 3. an upper working chamber; 4. mounting a column; 5. mounting a plate; 6. a dust screen; 7. mounting a nut; 8. a heat radiation fan; 9. a reinforcement ring; 10. connecting sheets; 11. a heat transfer sheet; 12. a heat sink; 13. heat dissipation fins; 14. and (4) a heat dissipation liquid.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-5, the present invention provides an embodiment: a heat dissipation structure for SOC chips comprises a lower working cavity 1, wherein the lower working cavity 1 is annular, the upper surface of the lower working cavity 1 is fixedly connected with four transfer pipelines 2, the number of the transfer pipelines 2 is four, and the transfer pipelines are positioned on the outer sides of heat dissipation fins 13 to improve the transfer efficiency, the upper surface of the transfer pipeline 2 is fixedly connected with an upper working cavity 3, the upper working cavity 3 is communicated with the lower working cavity 1 through the transfer pipelines 2, heat dissipation liquid 14 is arranged in the lower working cavity 1 and used for transferring heat, the heat dissipation fins 13 are fixedly connected in the lower working cavity 1 and play a role in heat dissipation, the heat dissipation fins 13 are positioned below the upper working cavity 3, the lower surface of the lower working cavity 1 is fixedly connected with heat transfer sheets 11, connecting sheets 10 are fixedly connected on the lower surface of the lower working cavity 1 and on the outer sides of the heat transfer sheets 11, and the number of the connecting sheets 10 is four, the heat conducting sheet 11 is not contacted, so that the connection between the connecting sheet 10 and the chip is ensured to be firm, and heat can not be transferred to other places to influence the heat dissipation efficiency;
the upper surface of the upper working cavity 3 is fixedly connected with mounting columns 4, the number of the mounting columns 4 is four, the stable and firm installation is ensured, the mounting plate 5 is arranged at the upper part of the mounting column 4 and used for fixing a radiating fan 8, the radiating fan 8 is arranged at the middle part of the mounting plate 5, an air inlet of the radiating fan 8 is positioned above a radiating fin 12, the upper surface of the radiating fan 8 is fixedly connected with a reinforcing ring 9 which improves the shock resistance of a dustproof net 6 and prolongs the service life, the reinforcing ring 9 is positioned at the inner side of a mounting nut 7, the upper surface of the reinforcing ring 9 is provided with the dustproof net 6, the upper part of the mounting column 4 is provided with a mounting nut 7, the mounting nut 7 is positioned above the mounting plate 5, the mounting nut 7 is in threaded connection with the mounting column 4, the radiating fin 12 is fixedly connected with the inner part of the upper working cavity 3, and the radiating fin 12 is positioned at the inner side of the mounting column 4, the design of erection column 4, mounting nut 7 and mounting panel 5 conveniently maintains radiator fan 8, when radiator fan 8 damages, also conveniently changes easy operation, and fin 12, heat transfer piece 11 improve the radiating efficiency of heat dissipation and transmission, and it is good to further guarantee radiating effect.
The working principle is as follows: lower working cavity 1 is connected with the chip through connecting piece 10, heat transfer fin 11 contacts with the chip surface under the connected state, the heat that the chip produced, on the heat transfer fin 11 transmission enters lower working cavity 1, on the one hand, the heat is distributed away by heat radiation fins 13, on the other hand, the heat is absorbed by coolant 14, when the heat is more, coolant 14 becomes gaseous state by liquid state, in the transmission entering upper working cavity 3 through transfer pipe 2, absorb through fin 12 again, under radiator fan 8's effect, take away the temperature of fin 12, coolant's coolant 14 turns into liquid state by gaseous state, get into lower working cavity 1, then the circulation is reciprocal, radiating efficiency is higher, it is more convenient to use.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (8)
1. The utility model provides a be used for SOC chip heat radiation structure, includes work cavity (1) down, its characterized in that: the upper surface of the lower working cavity (1) is fixedly connected with a transfer pipeline (2), the upper surface of the transfer pipeline (2) is fixedly connected with an upper working cavity (3), heat dissipation liquid (14) is arranged inside the lower working cavity (1), heat dissipation fins (13) are fixedly connected inside the lower working cavity (1), the lower surface of the lower working cavity (1) is fixedly connected with a heat transfer sheet (11), and a connecting sheet (10) is fixedly connected to the lower surface of the lower working cavity (1) and positioned outside the heat transfer sheet (11);
go up last fixed surface of work cavity (3) and be connected with erection column (4), the upper portion of erection column (4) is provided with mounting panel (5), the middle part of mounting panel (5) is provided with radiator fan (8), the last fixed surface of radiator fan (8) is connected with beaded finish (9), the upper surface of beaded finish (9) is provided with dust screen (6), the upper portion of erection column (4) is provided with mounting nut (7), go up inside fixed connection fin (12) of work cavity (3).
2. The heat dissipation structure for SOC chip of claim 1, wherein: the number of the connecting pieces (10) is four, and the connecting pieces are not in contact with the heat transfer pieces (11).
3. The heat dissipation structure for SOC chip of claim 1, wherein: the lower working cavity (1) is annular, and the radiating fins (13) are positioned below the upper working cavity (3).
4. The heat dissipation structure for SOC chip of claim 1, wherein: the number of the transfer pipelines (2) is four, and the transfer pipelines are positioned on the outer side of the radiating fins (13).
5. The heat dissipation structure for SOC chip of claim 1, wherein: the upper working cavity (3) is communicated with the lower working cavity (1) through a transfer pipeline (2).
6. The heat dissipation structure for SOC chip of claim 1, wherein: the number of the mounting columns (4) is four, and the radiating fins (12) are located on the inner sides of the mounting columns (4).
7. The heat dissipation structure for SOC chip of claim 1, wherein: the air inlet of the radiating fan (8) is positioned above the radiating fins (12), and the mounting nut (7) is in threaded connection with the mounting column (4).
8. The heat dissipation structure for SOC chip of claim 1, wherein: the reinforcing ring (9) is located on the inner side of the mounting nut (7), and the mounting nut (7) is located above the mounting plate (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121065641.7U CN214542200U (en) | 2021-05-18 | 2021-05-18 | Be used for SOC chip heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121065641.7U CN214542200U (en) | 2021-05-18 | 2021-05-18 | Be used for SOC chip heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214542200U true CN214542200U (en) | 2021-10-29 |
Family
ID=78283846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121065641.7U Active CN214542200U (en) | 2021-05-18 | 2021-05-18 | Be used for SOC chip heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214542200U (en) |
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2021
- 2021-05-18 CN CN202121065641.7U patent/CN214542200U/en active Active
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